JP2012108407A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2012108407A5 JP2012108407A5 JP2010258642A JP2010258642A JP2012108407A5 JP 2012108407 A5 JP2012108407 A5 JP 2012108407A5 JP 2010258642 A JP2010258642 A JP 2010258642A JP 2010258642 A JP2010258642 A JP 2010258642A JP 2012108407 A5 JP2012108407 A5 JP 2012108407A5
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- conductive film
- region
- forming
- electro
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Description
本発明は、上述の課題の少なくとも一部を解決するためになされたものであり、以下の形態または適用例として実現することが可能である。
本発明の一態様の電気光学装置は、ソース領域と、ドレイン領域と、チャネル領域と、前記ソース領域及び/または前記ドレイン領域と前記チャネル領域との間に配置された接合領域と、を含む半導体層と、前記半導体層を覆う第1絶縁膜と、前記第1絶縁膜を介して前記チャネル領域に対向する第1導電膜によるゲート電極と、前記ゲート電極を覆う第2絶縁膜を覆うように配置され、前記半導体層に電気的に接続された第2導電膜によるデータ線と、前記第2導電膜から前記半導体層へ向かう方向から見て、前記接合領域に沿うように前記第2絶縁膜に配置された開口と、前記開口の内部に、前記第1導電膜と前記第2導電膜とが配置されたことを特徴とする。
本発明の別の一態様の電気光学装置は、ソース領域と、ドレイン領域と、チャネル領域と、前記ソース領域及び/または前記ドレイン領域と前記チャネル領域との間に配置された接合領域と、を含む半導体層と、前記半導体層を覆う第1絶縁膜と、前記第1絶縁膜を介して前記チャネル領域に対向する第1導電膜によるゲート電極と、前記ゲート電極を覆う第2絶縁膜を覆うように配置され、前記半導体層に電気的に接続された第2導電膜と、前記第2導電膜から前記半導体層へ向かう方向から見て、前記接合領域に沿うように前記第2絶縁膜に配置された開口と、前記開口の内部に、前記第1導電膜と前記第2導電膜とが配置されたことを特徴とする。
本発明の一態様の電気光学装置の製造方法は、ソース領域と、ドレイン領域と、チャネル領域と、前記ソース領域及び/または前記ドレイン領域と前記チャネル領域との間に配置された接合領域と、を含む半導体層を形成する工程と、前記半導体層を覆う第1絶縁膜を形成する工程と、前記接合領域に沿うように前記第1絶縁膜に開口を形成する工程と、前記第1絶縁膜を介して前記チャネル領域に対向する第1導電膜によるゲート電極を形成する工程と、前記ゲート電極を覆う第2絶縁膜を形成する工程と、前記第1絶縁膜の開口に重なるように前記第2絶縁膜に開口を形成する工程と、前記ゲート電極を覆うように配置され、前記半導体層に電気的に接続された第2導電膜によるデータ線を形成する工程と、を含むことを特徴とする。
本発明の別の一態様の電気光学装置は、ソース領域と、ドレイン領域と、チャネル領域と、前記ソース領域及び/または前記ドレイン領域と前記チャネル領域との間に配置された接合領域と、を含む半導体層を形成する工程と、前記半導体層を覆う第1絶縁膜を形成する工程と、前記接合領域に沿うように前記第1絶縁膜に開口を形成する工程と、前記第1絶縁膜を介して前記チャネル領域に対向する第1導電膜によるゲート電極を形成する工程と、前記ゲート電極を覆う第2絶縁膜を形成する工程と、前記第1絶縁膜の開口に重なるように前記第2絶縁膜に開口を形成する工程と、前記ゲート電極を覆うように配置され、前記半導体層に電気的に接続された第2導電膜を形成する工程と、を含むことを特徴とする。
SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.
An electro-optical device according to one embodiment of the present invention includes a source region, a drain region, a channel region, and a junction region disposed between the source region and / or the drain region and the channel region. A layer, a first insulating film covering the semiconductor layer, a gate electrode made of a first conductive film facing the channel region via the first insulating film, and a second insulating film covering the gate electrode A second conductive film disposed along the junction region as viewed from a direction from the second conductive film toward the semiconductor layer, and a data line formed by a second conductive film electrically connected to the semiconductor layer; And the first conductive film and the second conductive film are disposed inside the opening.
An electro-optical device according to another embodiment of the present invention includes a source region, a drain region, a channel region, and a junction region disposed between the source region and / or the drain region and the channel region. A semiconductor layer including the first insulating film covering the semiconductor layer; a gate electrode formed of a first conductive film facing the channel region through the first insulating film; and a second insulating film covering the gate electrode. A second conductive film electrically connected to the semiconductor layer and the second insulating film along the junction region when viewed from the second conductive film toward the semiconductor layer. The opening is disposed, and the first conductive film and the second conductive film are disposed in the opening.
A method for manufacturing an electro-optical device according to one embodiment of the present invention includes a source region, a drain region, a channel region, and a junction region disposed between the source region and / or the drain region and the channel region, Forming a semiconductor layer containing the semiconductor layer; forming a first insulating film covering the semiconductor layer; forming an opening in the first insulating film along the junction region; and the first insulating film Forming a gate electrode made of a first conductive film opposite to the channel region through the gate, forming a second insulating film covering the gate electrode, and overlapping the opening of the first insulating film. A step of forming an opening in the insulating film; and a step of forming a data line by a second conductive film disposed so as to cover the gate electrode and electrically connected to the semiconductor layer. To do .
An electro-optical device according to another embodiment of the present invention includes a source region, a drain region, a channel region, and a junction region disposed between the source region and / or the drain region and the channel region. A step of forming a semiconductor layer, a step of forming a first insulating film covering the semiconductor layer, a step of forming an opening in the first insulating film along the junction region, and the first insulating film. A step of forming a gate electrode made of a first conductive film facing the channel region, a step of forming a second insulating film covering the gate electrode, and the second insulating film so as to overlap the opening of the first insulating film. A step of forming an opening in the insulating film; and a step of forming a second conductive film disposed so as to cover the gate electrode and electrically connected to the semiconductor layer.
Claims (15)
前記半導体層を覆う第1絶縁膜と、
前記第1絶縁膜を介して前記チャネル領域に対向する第1導電膜によるゲート電極と、
前記ゲート電極を覆う第2絶縁膜を覆うように配置され、前記半導体層に電気的に接続された第2導電膜によるデータ線と、
前記第2導電膜から前記半導体層へ向かう方向から見て、前記接合領域に沿うように前記第2絶縁膜に配置された開口と、
前記開口の内部に、前記第1導電膜と前記第2導電膜とが配置されたことを特徴とする電気光学装置。 A source region, a drain region, a channel region, a semiconductor layer including a junction region disposed between the source region and / or the drain region and the channel region,
A first insulating film covering the semiconductor layer;
A gate electrode made of a first conductive film facing the channel region through the first insulating film ;
A data line formed of a second conductive film disposed to cover the second insulating film covering the gate electrode and electrically connected to the semiconductor layer;
An opening disposed in the second insulating film along the junction region as seen from the direction from the second conductive film toward the semiconductor layer ;
An electro-optical device, wherein the first conductive film and the second conductive film are disposed inside the opening .
前記半導体層を覆う第1絶縁膜と、
前記第1絶縁膜を介して前記チャネル領域に対向する第1導電膜によるゲート電極と、
前記ゲート電極を覆う第2絶縁膜を覆うように配置され、前記半導体層に電気的に接続された第2導電膜と、
前記第2導電膜から前記半導体層へ向かう方向から見て、前記接合領域に沿うように前記第2絶縁膜に配置された開口と、
前記開口の内部に、前記第1導電膜と前記第2導電膜とが配置されたことを特徴とする電気光学装置。 A source region, a drain region, a channel region, a semiconductor layer including a junction region disposed between the source region and / or the drain region and the channel region,
A first insulating film covering the semiconductor layer;
A gate electrode made of a first conductive film facing the channel region through the first insulating film ;
A second conductive film disposed to cover the second insulating film covering the gate electrode and electrically connected to the semiconductor layer;
An opening disposed in the second insulating film along the junction region as seen from the direction from the second conductive film toward the semiconductor layer ;
An electro-optical device, wherein the first conductive film and the second conductive film are disposed inside the opening .
前記半導体層を覆う第1絶縁膜を形成する工程と、
前記接合領域に沿うように前記第1絶縁膜に開口を形成する工程と、
前記第1絶縁膜を介して前記チャネル領域に対向する第1導電膜によるゲート電極を形成する工程と、
前記ゲート電極を覆う第2絶縁膜を形成する工程と、
前記第1絶縁膜の開口に重なるように前記第2絶縁膜に開口を形成する工程と、
前記ゲート電極を覆うように配置され、前記半導体層に電気的に接続された第2導電膜によるデータ線を形成する工程と、
を含むことを特徴とする電気光学装置の製造方法。 A source region, a drain region, and forming a channel region, the semiconductor layer comprising a junction region disposed between the source region and / or the drain region and the channel region,
Forming a first insulating film covering the semiconductor layer;
Forming an opening in the first insulating film along the bonding region;
Forming a gate electrode made of a first conductive film facing the channel region through the first insulating film ;
Forming a second insulating film covering the gate electrode ;
Forming an opening in the second insulating film so as to overlap the opening of the first insulating film;
Forming a data line by a second conductive film disposed so as to cover the gate electrode and electrically connected to the semiconductor layer;
A method for manufacturing an electro-optical device.
前記半導体層を覆う第1絶縁膜を形成する工程と、
前記接合領域に沿うように前記第1絶縁膜に開口を形成する工程と、
前記第1絶縁膜を介して前記チャネル領域に対向する第1導電膜によるゲート電極を形成する工程と、
前記ゲート電極を覆う第2絶縁膜を形成する工程と、
前記第1絶縁膜の開口に重なるように前記第2絶縁膜に開口を形成する工程と、
前記ゲート電極を覆うように配置され、前記半導体層に電気的に接続された第2導電膜を形成する工程と、
を含むことを特徴とする電気光学装置の製造方法。 A source region, a drain region, and forming a channel region, the semiconductor layer comprising a junction region disposed between the source region and / or the drain region and the channel region,
Forming a first insulating film covering the semiconductor layer;
Forming an opening in the first insulating film along the bonding region;
Forming a gate electrode made of a first conductive film facing the channel region through the first insulating film ;
Forming a second insulating film covering the gate electrode ;
Forming an opening in the second insulating film so as to overlap the opening of the first insulating film;
Forming a second conductive film disposed to cover the gate electrode and electrically connected to the semiconductor layer;
A method for manufacturing an electro-optical device.
前記第2導電膜を融点近傍まで加熱する工程を含むことを特徴とする請求項10乃至12のいずれかに記載の電気光学装置の製造方法。 The second conductive film is aluminum;
The method of manufacturing an electro-optical device according to claim 10 , further comprising a step of heating the second conductive film to near a melting point.
前記ドレイン領域と重なる位置に前記第1絶縁膜及び前記第2絶縁膜ならびに前記第4絶縁膜を貫通する貫通孔を形成する工程と、
前記第3絶縁膜を覆って第3導電膜を形成する工程と、
前記第3導電膜をパターニングして前記ドレイン領域と画素電極とを電気的に接続させる導通部を形成する工程と、
をさらに含むことを特徴とする請求項10乃至13のいずれかに記載の電気光学装置の製造方法。 And as factories of forming a fourth insulating film covering the front Stories second insulating film,
Forming a through hole penetrating through the first insulating film and said second insulating film and said fourth insulating film to a position overlapping the drain region,
Forming a third conductive film to cover the front Symbol third insulating film,
Patterning the third conductive film to form a conductive portion that electrically connects the drain region and the pixel electrode;
The method of manufacturing an electro-optical device according to claim 10 , further comprising :
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010258642A JP5609583B2 (en) | 2010-11-19 | 2010-11-19 | Electro-optical device, method of manufacturing electro-optical device, and electronic apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010258642A JP5609583B2 (en) | 2010-11-19 | 2010-11-19 | Electro-optical device, method of manufacturing electro-optical device, and electronic apparatus |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2012108407A JP2012108407A (en) | 2012-06-07 |
JP2012108407A5 true JP2012108407A5 (en) | 2013-11-14 |
JP5609583B2 JP5609583B2 (en) | 2014-10-22 |
Family
ID=46494063
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010258642A Expired - Fee Related JP5609583B2 (en) | 2010-11-19 | 2010-11-19 | Electro-optical device, method of manufacturing electro-optical device, and electronic apparatus |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5609583B2 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6044358B2 (en) * | 2013-01-18 | 2016-12-14 | セイコーエプソン株式会社 | Electro-optical device substrate, electro-optical device, and electronic apparatus |
WO2017086116A1 (en) * | 2015-11-18 | 2017-05-26 | ソニー株式会社 | Semiconductor device and projection-type display device |
WO2018074060A1 (en) * | 2016-10-18 | 2018-04-26 | ソニーセミコンダクタソリューションズ株式会社 | Liquid crystal display device and projection display device |
DE112019004314T5 (en) * | 2018-08-31 | 2021-05-27 | Sony Semiconductor Solutions Corporation | LIGHT EMITTING UNIT AND DISPLAY DEVICE |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3551778B2 (en) * | 1998-09-07 | 2004-08-11 | セイコーエプソン株式会社 | Electro-optical device, substrate for electro-optical device, method of manufacturing electro-optical device, and electronic apparatus |
JP3332083B2 (en) * | 1999-04-16 | 2002-10-07 | 日本電気株式会社 | Liquid crystal display |
JP3356429B2 (en) * | 2000-04-11 | 2002-12-16 | 日本電気株式会社 | Liquid crystal display device and liquid crystal projector device |
JP3743291B2 (en) * | 2001-01-23 | 2006-02-08 | セイコーエプソン株式会社 | Electro-optical device and projector |
JP4349406B2 (en) * | 2006-08-24 | 2009-10-21 | セイコーエプソン株式会社 | Electro-optical device substrate, electro-optical device, and electronic apparatus |
JP2010072219A (en) * | 2008-09-17 | 2010-04-02 | Seiko Epson Corp | Substrate for electro-optical device and electro-optical device, and electronic equipment |
-
2010
- 2010-11-19 JP JP2010258642A patent/JP5609583B2/en not_active Expired - Fee Related
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2018014335A5 (en) | ||
JP2013179295A5 (en) | ||
JP2010263195A5 (en) | ||
JP2013042121A5 (en) | ||
JP2013038402A5 (en) | ||
JP2012256063A5 (en) | Display device | |
JP2015069854A5 (en) | ||
JP2013190804A5 (en) | ||
JP2012248829A5 (en) | Method for manufacturing semiconductor device | |
JP2010251735A5 (en) | Semiconductor device | |
JP2011077512A5 (en) | Method of manufacturing light emitting device | |
JP2010283338A5 (en) | ||
JP2014199406A5 (en) | ||
JP2011071503A5 (en) | Semiconductor device | |
JP2014063179A5 (en) | ||
JP2013168639A5 (en) | ||
JP2012068627A5 (en) | Method for manufacturing semiconductor device | |
JP2017175129A5 (en) | Semiconductor device | |
JP2011181917A5 (en) | ||
JP2012033836A5 (en) | ||
JP2012083762A5 (en) | ||
JP2012049514A5 (en) | ||
JP2011211187A5 (en) | Semiconductor device | |
JP2015064534A5 (en) | Display element and manufacturing method thereof | |
JP2010258423A5 (en) | Semiconductor device |