JP2012103537A - Photosensitive resin composition and photosensitive element using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in resolution, lamination temperature tolerance, soldering resistance, adhesiveness with copper and coating film properties, and to provide a photosensitive element using the composition.SOLUTION: The photosensitive resin composition contains the following components: (a) a resin having an ethylenically unsaturated group and a carboxyl group; (b) a photopolymerizable monomer having an ethylenically unsaturated group and a tricyclodecane structure; (c) a photopolymerization initiator; (d) an epoxy resin; (e) a guanamine derivative expressed by general formula (1); (f) melamine; and (g) dicyandiamide. The composition contains melamine as the component (f) by 0.1 part by mass or more and less than 10 parts by mass with respect to total 100 parts by mass of components (a) and (b).

Description

  The present invention relates to a photosensitive resin composition mainly used for a solder resist for a printed wiring board, a semiconductor package substrate, and a flexible wiring board, and a photosensitive element using the same.

  In recent years, with the reduction in size and weight of digital devices, miniaturization and higher density of circuits formed on a printed wiring board, a semiconductor package substrate, and a flexible wiring board are progressing. With the miniaturization of circuits, solder resists for protecting circuits are also required to have developability, high resolution, insulation reliability, solder heat resistance, gold plating resistance, and the like.

  As the wiring pitch is narrowed, solder resist embedding between circuits has become a very important item. If this embedding property is insufficient, bubbles may enter between the circuits, leading to a decrease in various reliability such as insulation reliability and thermal shock reliability. Furthermore, the pitch between the connection terminals is also narrowed, and with the thinning of the solder resist, the surface smoothness of the solder resist is required for ensuring connection reliability. In order to satisfy this surface smoothness and to embed the solder resist between fine wiring and through-hole portions without bubbles, it is necessary to add a temperature at which the resin component sufficiently flows during the lamination to the solder resist. Accordingly, it is preferable that the laminating temperature is high. However, if the laminating temperature is too high, a development residue is generated, which may cause problems such as poor plating deposition.

  Among the characteristics required for photosensitive solder resist, various reports have been made on methods for improving plating resistance, and the chelating effect and hydrogen bonding effect are mainly used to improve the adhesion between the coating film and copper foil. . In particular, there are many reports using dicyandiamide as an adhesion improver (see, for example, Patent Document 1). However, since dicyandiamide is highly soluble in water, there is a concern about contamination of the plating bath. Moreover, when it adds excessively, a development residue may generate | occur | produce and there exists a restriction | limiting in addition amount.

  In many cases, melamine is used as an adhesion improver. Since melamine is hardly soluble in many solvents, it is used by kneading into a resin with a three-roll mill or the like. Commercially available melamine aggregates and has a large particle size, and it is difficult to reduce the size with a three-roll mill. Therefore, it cannot cope with thinning of fine wiring and solder resist. Furthermore, melamine is characterized by being soluble in hot water. Therefore, if the addition amount is excessive or the unreacted residue remains in the photosensitive layer due to insufficient crosslinking reaction, there is a concern about the contamination of the plating bath. On the other hand, if the amount added is excessive, light may be diffusely reflected in the photosensitive layer and the resolution may be lowered.

International Publication No. 07/043240 Pamphlet

  In the present invention, even when dicyandiamide and melamine having excellent adhesiveness are used, those drawbacks are eliminated, and resolution and laminating temperature tolerance are excellent, and plating resistance, adhesion to copper, and coating properties are excellent. It is an object of the present invention to provide a photosensitive resin composition and a photosensitive element using the same.

  The present invention relates to [1] (a) component: a resin having an ethylenically unsaturated group and a carboxyl group, and (b) component: a photopolymerizable monomer having an ethylenically unsaturated group and a tricyclodecane structure; ) Component: photopolymerization initiator, (d) component: epoxy resin, (e) component: guanamine derivative represented by the following general formula (1), (f) component: melamine, and (g) component: Dicyandiamide, a photosensitive resin composition containing 0.1 part by mass or more of the melamine as the component (f) when the total of the component (A) and the component (B) is 100 parts by mass. The present invention relates to a photosensitive resin composition containing less than 10 parts by mass.

（上記一般式（１）中、Ｒは、ＮＨ_２以外の置換基であって、炭素数１〜１２の置換基、あるいは酸素原子や窒素原子を一つ以上含んでも良い。）
また、本発明は、［２］ 前記（ｆ）成分のメラミンの最大粒径が、１０μｍ以下である上記［１］記載の感光性樹脂組成物に関する。
また、本発明は、［３］ 前記（ｂ）成分が、ジメチロールトリシクロデカンジアクリレート、ジメチロールトリシクロデカンジメタクリレート、トリシクロデカンジオールジアクリレート及びトリシクロデカンジオールジメタクリレートからなる群から選択される１種以上である上記［１］又は［２］に記載の感光性樹脂組成物に関する。
また、本発明は、［４］ 前記（ｂ）成分が、下記一般式（２）又は一般式（３）で示される部分構造を有する上記［１］又は［２］に記載の感光性樹脂組成物に関する。

(In the general formula (1), R is a substituent other than NH ₂ and may contain one or more substituents having 1 to 12 carbon atoms, oxygen atoms or nitrogen atoms.)
The present invention also relates to [2] the photosensitive resin composition according to the above [1], wherein the maximum particle size of the melamine as the component (f) is 10 μm or less.
The present invention provides [3] wherein the component (b) is selected from the group consisting of dimethylol tricyclodecane diacrylate, dimethylol tricyclodecane dimethacrylate, tricyclodecanediol diacrylate, and tricyclodecanediol dimethacrylate. It is related with the photosensitive resin composition as described in said [1] or [2] which is 1 or more types.
The present invention also provides: [4] The photosensitive resin composition according to the above [1] or [2], wherein the component (b) has a partial structure represented by the following general formula (2) or general formula (3): Related to things.

［一般式（２）又は一般式（３）中、Ｒ^１、Ｒ^２は、直接結合、アルキレン、又はアリーレン基を示す。］
また、本発明は、［５］ 前記一般式（２）又は一般式（３）で示される部分構造を有する化合物が、トリシクロデカン構造を含むジオール化合物と、ジイソシアネート化合物と、分子中に少なくとも１個以上のエチレン性不飽和基と１個のヒドロキシル基を有する化合物と、を反応させて得られるウレタン化合物である上記［４］記載の感光性樹脂組成物に関する。
また、本発明は、［６］ 前記ジイソシアネート化合物が、環構造を有するジイソシアネートである上記［４］又は［５］記載の感光性樹脂組成物に関する。
また、本発明は、［７］ 前記分子中に少なくとも１個以上のエチレン性不飽和基と１個のヒドロキシル基を有する化合物が、エチレン性不飽和基を分子中に３個有する化合物である上記［５］又は［６］記載の感光性樹脂組成物に関する。
また、本発明は、［８］ 前記エチレン性不飽和基を分子中に３個有する化合物が、下記一般式（４）で示される上記［７］記載の感光性樹脂組成物に関する。

[In General Formula (2) or General Formula (3), R ¹ and R ² represent a direct bond, an alkylene, or an arylene group. ]
In the present invention, [5] the compound having the partial structure represented by the general formula (2) or the general formula (3) is a diol compound containing a tricyclodecane structure, a diisocyanate compound, and at least 1 in the molecule. It is related with the photosensitive resin composition of said [4] description which is a urethane compound obtained by making the compound which has 1 or more ethylenically unsaturated group and one hydroxyl group react.
The present invention also relates to [6] the photosensitive resin composition according to the above [4] or [5], wherein the diisocyanate compound is a diisocyanate having a ring structure.
Further, the present invention provides [7] The above, wherein the compound having at least one ethylenically unsaturated group and one hydroxyl group in the molecule is a compound having three ethylenically unsaturated groups in the molecule. It relates to the photosensitive resin composition according to [5] or [6].
The present invention also relates to [8] the photosensitive resin composition according to the above [7], wherein the compound having three ethylenically unsaturated groups in the molecule is represented by the following general formula (4).

［一般式（４）中、複数のＲ^３又はＲ^４は同一でも異なっていてもよく、それぞれＲ^３は炭素数１から１０のアルキレン基又はアリーレン基を示し、Ｒ^４は水素原子、炭素数１から１０のアルキル基、又はアリール基を示し、ｌ、ｍ、ｎはそれぞれ１〜１０の整数を示す。］
また、本発明は、［９］ 支持体と、該支持体上に形成された上記［１］〜［８］のいずれかに記載の感光性樹脂組成物からなる感光性樹脂組成物層と、を備える感光性エレメントに関する。

[In General Formula (4), a plurality of R ³ or R ⁴ may be the same or different, each R ³ represents an alkylene group or an arylene group having 1 to 10 carbon atoms, and R ⁴ represents a hydrogen atom or a carbon number. 1 to 10 represents an alkyl group or an aryl group, and l, m and n each represents an integer of 1 to 10. ]
The present invention also provides [9] a support, and a photosensitive resin composition layer comprising the photosensitive resin composition according to any one of the above [1] to [8] formed on the support, A photosensitive element comprising:

  The photosensitive resin composition of the present invention using the components (a) to (g) and the photosensitive element using the same are particularly improved in resolution and combination with the components (e), (f) and (g). The developability is good, adhesion to a metal such as copper is improved, plating resistance, for example, electroless nickel gold plating resistance is improved, and the above-described problems can be achieved.

  Hereinafter, preferred embodiments of the present invention will be described in detail. In this specification, (meth) acrylic acid means acrylic acid and methacrylic acid corresponding thereto, (meth) acrylate means acrylate and corresponding methacrylate, and (meth) acryloyl means acryloyl and it. Means the corresponding methacryloyl.

  The photosensitive resin composition of the present invention comprises (a) a resin having an ethylenically unsaturated group and a carboxyl group as a component, and (b) a photopolymerizable monomer having an ethylenically unsaturated group and a tricyclodecane structure as a component. (C) component as a photopolymerization initiator, (d) component as an epoxy resin, (e) component as a guanamine derivative represented by the following general formula (1), (f) component as melamine, g) A photosensitive resin composition containing dicyandiamide as a component, wherein the content of melamine in component (f) is 0 when the total of component (A) and component (B) is 100 parts by mass. .1 to 10 parts by mass of a photosensitive resin composition.

  The main feature of the present invention is that in the combination of (e), (f), and (g), the resolution and developability are good, the adhesion to a metal such as copper is improved, and the plating resistance, for example, It is to improve the electroless nickel gold plating resistance and achieve the above-mentioned problems. Each of these components will be described.

<(A) component>
Although there is no restriction | limiting in particular as resin which has the ethylenically unsaturated group and carboxyl group which are (a) component of this invention, For example, it is saturated in the esterification thing of an epoxy compound (a1) and unsaturated monocarboxylic acid (a2). Alternatively, an addition reaction product obtained by adding an unsaturated polybasic acid anhydride (a3) or the like can be used. These can be obtained by the following two-step reaction. In the first reaction (hereinafter referred to as “first reaction” for convenience), the epoxy compound (a1) and the unsaturated monocarboxylic acid (a2) react. In the next reaction (hereinafter referred to as “second reaction” for the sake of convenience), the hydroxyl group produced in the first reaction and the hydroxyl group originally present in the epoxy compound (a1) and the saturated or unsaturated polybasic anhydride The product (a3) reacts.

  Although there is no restriction | limiting in particular as said epoxy compound (a1), For example, a bisphenol type epoxy compound, a novolak type epoxy compound, a biphenyl type epoxy compound, a polyfunctional epoxy compound, etc. are mentioned.

  As the bisphenol type epoxy compound, those obtained by reacting bisphenol A type, bisphenol F type and epichlorohydrin are suitable. GY-260, GY-255, XB-2615 manufactured by Ciba-Geigy Corporation, Epicoat manufactured by Japan Epoxy Resin Co. Epoxy compounds such as 828, 1007, and bisphenol A type, bisphenol F type, hydrogenated bisphenol A type, amino group-containing, alicyclic, or polybutadiene-modified are preferably used.

  As the novolak type epoxy compound, those obtained by reacting novolaks obtained by reacting phenol, cresol, halogenated phenol and alkylphenols with formaldehyde in the presence of an acidic catalyst and epichlorohydrin are suitable. YDCN-701, 704, YDPN-638, 602, DEN-431,439 manufactured by Dow Chemical Co., EPN-1299 manufactured by Ciba Geigy Co., Ltd., N-730, 770, 865, 665, 673 manufactured by Dainippon Ink & Chemicals, Inc. , VH-4150, 4240, Nippon Kayaku Co., Ltd. EOCN-120, BREN and the like.

  Moreover, as an epoxy compound of another structure, for example, salicylaldehyde-phenol or cresol type epoxy compound (Nippon Kayaku Co., Ltd. EPPN502H, FAE2500, etc.), Dainippon Ink & Chemicals, Inc. Epicron 840, 860, 3050, DER-330, 337, 361 manufactured by Dow Chemical Company, Celoxide 2021, manufactured by Daicel Chemical Industries, Ltd., TETRAD-X, C manufactured by Mitsubishi Gas Chemical Company, Inc., EPB-13, 27 manufactured by Nippon Soda Co., Ltd. may be used. it can. These may be used alone or in combination of two or more, and a mixture or a block copolymer may be used.

  Examples of the unsaturated monocarboxylic acid (a2) include (meth) acrylic acid, crotonic acid, cinnamic acid, and saturated or unsaturated polybasic acid anhydrides and (meth) acrylates having one hydroxyl group in one molecule. Or the reaction material of the half-ester compound of a saturated or unsaturated dibasic acid and an unsaturated monoglycidyl compound is mentioned. Examples of the reactant include phthalic acid, tetrahydrophthalic acid, hexahydrophthalic acid, maleic acid, succinic acid, hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, and tris (hydroxyethyl) isocyanurate. Examples thereof include reactants obtained by reacting di (meth) acrylate, glycidyl (meth) acrylate and the like in an equimolar ratio by a conventional method. These unsaturated monocarboxylic acids can be used alone or in combination. Among these, acrylic acid is preferable.

  Examples of the saturated or unsaturated polybasic acid anhydride include succinic anhydride, maleic anhydride, tetrahydrophthalic anhydride, phthalic anhydride, methyltetrahydrophthalic anhydride, ethyltetrahydrophthalic anhydride, hexahydrophthalic anhydride, methylhexa Hydrophthalic anhydride, ethylhexahydrophthalic anhydride, itaconic anhydride, trimellitic anhydride and the like can be mentioned.

  In the first reaction, an unsaturated monocarboxylic acid (a2) and a polybasic acid anhydride such as trimellitic anhydride, pyromellitic anhydride, benzophenonetetracarboxylic anhydride, biphenyltetracarboxylic anhydride, etc., if necessary Can be used in combination.

  In the second reaction, when the hydroxyl group formed in the first reaction and the hydroxyl group originally present in the epoxy compound (a1) undergo a half-ester reaction with the acid anhydride group of the saturated or unsaturated polybasic acid anhydride (a3). Inferred. Here, 0.1 to 1.0 equivalent of polybasic acid anhydride (a3) can be reacted with 1 equivalent of hydroxyl group in the resin obtained by the first reaction. By adjusting the amount of the polybasic acid anhydride (a3) within this range, the acid value of the component (a) can be adjusted.

  Examples of the resins described above include CCR-1218H, CCR-1159H, CCR-1222H, PCR-1050, TCR-1335H, ZAR-1035, ZAR-2001H, ZFR-1185, and ZCR-1569H (above, manufactured by Nippon Kayaku Co., Ltd.) , Trade names) etc. are commercially available.

  Moreover, as resin (photosensitive prepolymer) which has the ethylenically unsaturated group and carboxyl group which are (a) components used by this invention, the epoxy acrylate which has two or more hydroxyl groups and ethylenically unsaturated groups in a molecule | numerator It is preferable to use a polyurethane compound obtained by reacting a compound, a diisocyanate compound, and a diol compound having a carboxyl group.

  As described above, the polyurethane compound includes an epoxy acrylate compound having two or more hydroxyl groups and an ethylenically unsaturated group (hereinafter referred to as “raw material epoxy acrylate”), a diisocyanate compound (hereinafter referred to as “raw material diisocyanate”), and a carboxyl. It is a compound obtained using a diol compound having a group (hereinafter referred to as “raw diol”) as a raw material component. First, these raw material components will be described.

  Examples of the raw material epoxy acrylate include bisphenol A type epoxy compounds, bisphenol F type epoxy compounds, novolac type epoxy compounds, and compounds obtained by reacting (meth) acrylic acid with epoxy compounds having a fluorene skeleton.

  As the raw material diisocyanate, any compound having two isocyanato groups can be used without particular limitation. For example, phenylene diisocyanate, tolylene diisocyanate, xylylene diisocyanate, tetramethyl xylylene diisocyanate, diphenylmethane diisocyanate, naphthalene diisocyanate, tolden diisocyanate, hexamethylene diisocyanate, dicyclohexylmethane diisocyanate, isophorone diisocyanate, arylene sulfone ether diisocyanate, allyl cyanide diisocyanate, N-acyl diisocyanate, trimethylhexamethylene diisocyanate, 1,3-bis (isocyanatemethyl) cyclohexane, norbornane-diisocyanate methyl and the like can be mentioned. These may be used alone or in combination of two or more.

  The raw material diol is a compound having two hydroxyl groups such as an alcoholic hydroxyl group and / or a phenolic hydroxyl group in the molecule and a carboxyl group. The hydroxyl group preferably has an alcoholic hydroxyl group from the viewpoint of improving the developability of the photosensitive resin composition with an alkaline aqueous solution. Examples of such diol compounds include dimethylolpropionic acid and dimethylolbutanoic acid.

  Next, an example of a process for producing a polyurethane compound using the above-described raw material components will be described.

  In the production process of the polyurethane compound, first, the raw material epoxy acrylate and the raw material diol are reacted with the raw material diisocyanate. In such a reaction, a so-called urethanization reaction occurs mainly between the hydroxyl group in the raw material epoxy acrylate and the isocyanate group in the raw material diisocyanate, and between the hydroxyl group in the raw material diol and the isocyanate group in the raw material diisocyanate. By this reaction, for example, a polyurethane compound in which a structural unit derived from a raw material epoxy acrylate and a structural unit derived from a raw material diol are polymerized alternately or in a block manner via a structural unit derived from a raw material diisocyanate is generated.

  An example of such a polyurethane compound is a compound represented by the following general formula (5).

Here, in the general formula (5), R ⁵ is an epoxy acrylate residue, R ⁶ is a diisocyanate residue, R ⁷ is an alkyl group having 1 to 5 carbon atoms, and R ⁸ is a hydrogen atom or a methyl group. In addition, a residue means the structure of the part remove | excluding the functional group used for the coupling | bonding from the raw material component. In addition, a plurality of groups in the formula may be the same or different. The terminal hydroxyl group of the polyurethane compound may be treated with a saturated or unsaturated polybasic acid anhydride.

  In the production process of the polyurethane compound described above, a diol compound different from these may be further added in addition to the raw material epoxy acrylate, the raw material diol and the raw material diisocyanate. Thereby, it becomes possible to change the main chain structure of the obtained polyurethane compound, and the characteristics such as the acid value described later can be adjusted to a desired range. Moreover, in each process mentioned above, you may use a catalyst etc. suitably.

  Moreover, you may make the polyurethane compound mentioned above and raw material epoxy react further. In this reaction, a so-called epoxycarboxylation reaction occurs mainly between the carboxyl group derived from the diol compound in the polyurethane compound and the epoxy group of the raw material epoxy. Thus, the compound obtained is equipped with the principal chain formed from the polyurethane compound mentioned above, and the side chain containing the ethylenically unsaturated group originating in raw material epoxy acrylate or raw material epoxy, for example.

As the polyurethane compound of the present embodiment, among the compounds represented by the general formula (5), a hard segment portion of a raw material epoxy acrylate that is one of the main skeletons of polyurethane, that is, R ⁵ is preferably a bisphenol A type structure. . Such polyurethane compounds are commercially available as UXE-3011, UXE-3012, UXE-3024 (manufactured by Nippon Kayaku Co., Ltd.) and the like. These may be used alone or in combination of two or more.

  Moreover, since the photosensitive resin composition containing this polyurethane compound can form the toughness and the cured film excellent in elongation, it can improve the crack resistance after hardening and HAST tolerance.

  The resin having a carboxyl group as the component (a) exemplified above has an acid value of preferably 20 to 180 mgKOH / g, more preferably 30 to 150 mgKOH / g, and 40 to 120 mgKOH / g. It is particularly preferred that Thereby, the developability with the alkaline aqueous solution of the photosensitive resin composition becomes good, and an excellent resolution can be obtained.

Here, the acid value can be measured by the following method. After precisely weighing about 1 g of the measurement resin solution, 30 g of acetone is added to the resin solution, and the resin solution is uniformly dissolved. Next, an appropriate amount of phenolphthalein as an indicator is added to the solution, and titration is performed using a 0.1N aqueous KOH solution. And an acid value is computed by following Formula.
A = 10 × Vf × 56.1 / (Wp × I)
In the formula, A represents the acid value (mgKOH / g), Vf represents the titration amount (mL) of KOH, Wp represents the measurement resin solution mass (g), and I represents the nonvolatile content of the measurement resin solution. A ratio (mass%) is shown.

  The weight average molecular weight of the resin having a carboxyl group as component (a) is preferably 3000 to 30000, more preferably 5000 to 20000, and more preferably 7000 to 15000 from the viewpoint of coating properties. Is particularly preferred.

  In addition, a weight average molecular weight (Mw) can be calculated | required from the standard polystyrene conversion value by a gel permeation chromatography (GPC).

  The component (b) used in the present invention is a photopolymerizable monomer having in the molecule at least one ethylenically unsaturated group and a tricyclodecane structure.

  The component (b) is preferably at least one selected from the group consisting of dimethylol tricyclodecane diacrylate, dimethylol tricyclodecane dimethacrylate, tricyclodecanediol diacrylate, and tricyclodecanediol dimethacrylate. . These are commercially available as NK ester DCP and NK ester A-DCP (both manufactured by Shin-Nakamura Chemical Co., Ltd.).

  Furthermore, when using what has a urethane bond as said (b) component, it is preferable to use (b) component which has the partial structure shown by the following general formula (2) or general formula (3).

［一般式（２）又は一般式（３）中、Ｒ^１、Ｒ^２は、直接結合、アルキレン、又はアリーレン基を示す。］
上記アルキレン基としては、炭素数２〜２０のアルキレン基であることが好ましく、炭素数２〜１０のアルキレン基であることがより好ましく、炭素数２〜６のアルキレン基であることがさらに好ましい。
炭素数２〜６のアルキレン基としては、エチレン基、プロピレン基、イソプロピレン基、ブチレン基、ペンチレン基、へキシレン基等が挙げられるが、解像度、耐めっき性の点からエチレン基又はイソプロピレン基であることが好ましく、エチレン基であることが特に好ましい。
上記アリーレン基としては、炭素数は６〜１４のアリーレン基であることが好ましく、炭素数６〜１０のアリーレン基であることがより好ましい。このようなアリーレン基としては、フェニレン、ナフチレン等が挙げられる。

[In General Formula (2) or General Formula (3), R ¹ and R ² represent a direct bond, an alkylene, or an arylene group. ]
The alkylene group is preferably an alkylene group having 2 to 20 carbon atoms, more preferably an alkylene group having 2 to 10 carbon atoms, and further preferably an alkylene group having 2 to 6 carbon atoms.
Examples of the alkylene group having 2 to 6 carbon atoms include an ethylene group, a propylene group, an isopropylene group, a butylene group, a pentylene group, and a hexylene group. From the viewpoint of resolution and plating resistance, an ethylene group or an isopropylene group. It is preferred that it is ethylene group.
The arylene group is preferably an arylene group having 6 to 14 carbon atoms, and more preferably an arylene group having 6 to 10 carbon atoms. Examples of such an arylene group include phenylene and naphthylene.

  When the compound having the partial structure represented by the general formula (2) or the general formula (3) is used as the component (b), (b1) a diol compound containing a tricyclodecane structure, and (b2) diisocyanate A urethane compound obtained by reacting a compound with (b3) a compound having at least one ethylenically unsaturated group and one hydroxyl group in the molecule is preferable.

  Although there is no restriction | limiting in particular as said (b2) diisocyanate compound, The compound which has a ring structure is preferable. Among these, those having a rigid structure such as isophorone diisocyanate are more preferable from the viewpoint of crack resistance (heat resistance).

  In addition, the compound (b3) having at least one ethylenically unsaturated group and one hydroxyl group in the molecule has two ethylenically unsaturated groups from the viewpoint of crosslinking density. Those having three are particularly preferred.

  Among these, the diisocyanate is isophorone diisocyanate, and in addition, a compound having at least one ethylenically unsaturated group and one hydroxyl group in the molecule is represented by the general formula (3). Is more preferable. Examples of such a compound include UX-5002D-M20 (manufactured by Nippon Kayaku Co., Ltd.). These can be used alone or in combination of two or more.

(C) Component: Photopolymerization initiator The (c) photopolymerization initiator used in the present invention is not particularly limited as long as it matches the light wavelength of the exposure machine to be used, and a known one can be used. it can. Specifically, for example, benzophenone, N, N′-tetraalkyl-4,4′-diaminobenzophenone, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1, 2-methyl- 1- [4- (methylthio) phenyl] -2-morpholino-propanone-1,4,4′-bis (dimethylamino) benzophenone (Michler ketone), 4,4′-bis (diethylamino) benzophenone, 4-methoxy-4 Aromatic ketones such as' -dimethylaminobenzophenone, quinones such as alkylanthraquinone and phenanthrenequinone, benzoin compounds such as benzoin and alkylbenzoin, benzoin ether compounds such as benzoin alkyl ether and benzoin phenyl ether, benzyl such as benzyldimethyl ketal Derivative 2- (o-chlorophenyl) -4,5-diphenylimidazole dimer, 2- (o-chlorophenyl) -4,5-di (m-methoxyphenyl) imidazole dimer, 2- (o-fluorophenyl) -4,5-diphenylimidazole dimer, 2- (o-methoxyphenyl) -4,5-diphenylimidazole dimer, 2,4-di (p-methoxyphenyl) -5-phenylimidazole dimer, 2,4,5-triarylimidazole dimer such as 2- (2,4-dimethoxyphenyl) -4,5-diphenylimidazole dimer, N-phenylglycine, N-phenylglycine derivative, 9-phenylacridine Oxime derivatives such as 1,2-octanedione, 1- [4- (phenylthio)-, 2- (o-benzoyloxime)] Stealls, coumarin compounds such as 7-diethylamino-4-methylcoumarin, thioxanthone compounds such as 2,4-diethylthioxanthone, acylphosphine oxide compounds such as 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide, etc. These may be used alone or in combination of two or more.

  From the viewpoint of making the resist shape better, it is preferable to use a phosphine oxide photopolymerization initiator. Examples of such compounds include monoacylphosphine oxides such as 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide, and bisacylphosphine oxides include bis (2,4,4). 6-trimethylbenzoyl) -phenylphosphine oxide, bis (2,6-dimethoxybenzoyl) -2,4,4-trimethyl-pentylphosphine oxide. These are commercially available as DAROCURE-TPO and IRGACURE-819 (both manufactured by Ciba Japan Co., Ltd., trade names).

Moreover, it is preferable to contain further the compound which has an acridine ring and the compound which has oxime ester for the purpose of a sensitivity improvement, and these can also be used together. Examples of the compound having an acridine ring include 9-phenylacridine, 9-aminoacridine, 9-pentylaminoacridine, 1,2-bis (9-acridinyl) ethane, and 1,3-bis (9-acridinyl) propane. 1,4-bis (9-acridinyl) butane, 1,5-bis (9-acridinyl) pentane, 1,6-bis (9-acridinyl) hexane, 1,7-bis (9-acridinyl) heptane, , 8-bis (9-acridinyl) octane, 1,9-bis (9-acridinyl) nonane, 1,10-bis (9-acridinyl) decane, 1,11-bis (9-acridinyl) undecane, 1,12 -Bis (9-acridinyl) alkanes such as bis (9-acridinyl) dodecane, 9-phenylacridine, 9-pyridylacridyl 9-pyrazinylacridine, 9-monopentylaminoacridine, 1,3-bis (9-acridinyl) -2-oxapropane, 1,3-bis (9-acridinyl) -2-thiapropane, 1,5- Examples include bis (9-acridinyl) -3-thiapentane, and among these, 1,7-bis (9-acridinyl) heptane is more preferable. 1,7-bis (9-acridinyl) heptane is commercially available as N-1717 (manufactured by ADEKA Corporation, trade name).
Examples of the compound having the oxime ester include (2- (acetyloxyiminomethyl) thioxanthen-9-one), (1,2-octanedione, 1- [4- (phenylthio)-, 2- (o -Benzoyloxime)], ethanone, 1- [9-ethyl-6- (2-methylbenzoyl) -9H-carbazol-3-yl]-, 1- (o-acetyloxime)). Examples of commercially available products include IRGACURE-OXE01 and IRGACURE-OXE02 (both manufactured by Ciba Specialty Chemicals).

  The epoxy resin as the component (d) that can be used in the photosensitive resin composition of the present invention is not particularly limited. For example, bisphenol A type epoxy resins such as bisphenol A diglycidyl ether, bisphenol F diglycidyl ether, etc. Bisphenol F type epoxy resin, bisphenol S type epoxy resin such as bisphenol S diglycidyl ether, biphenol type epoxy resin such as biphenol diglycidyl ether, bixylenol type epoxy resin such as bixylenol diglycidyl ether, hydrogenated bisphenol A glycidyl ether And hydrogenated bisphenol A type epoxy resins, and dibasic acid-modified diglycidyl ether type epoxy resins. These can be used alone or in combination of two or more.

  Among these, from the viewpoint of stability, an epoxy resin represented by the following general formula (6) is preferable.

［一般式（６）中、Ｒ_９〜Ｒ_１６は、それぞれ独立に、水素原子、アルキル基およびフェニル基の中から選択される１種を示し、これらは互いに同一であっても異なっていてもよい。］

[In General Formula (6), R _{9 to} R ₁₆ each independently represent one selected from a hydrogen atom, an alkyl group, and a phenyl group, and these may be the same or different from each other. Good. ]

In the general formula (6), from the viewpoint of excellent storage stability, two or more of R _{9 to} R ₁₆ are preferably hydrogen atoms, more preferably four or more are hydrogen atoms. More preferably, at least one is a hydrogen atom, and particularly preferably all are hydrogen atoms.

In the present invention, the component (e) is a guanamine derivative represented by the general formula (1), in which R is a substituent other than NH ₂ , and a substituent having 1 to 12 carbon atoms or an oxygen atom Or one or more nitrogen atoms. Specifically, NHR ¹ group {wherein R ¹ is a hydrogen atom, an alkyl group having 1 to 20 carbon atoms (the alkyl group is a halogen atom, a trifluoromethyl group, a hydroxyl group, an alkoxy group having a carbon number, carbon number) 1-6 haloalkoxy groups, aryloxy groups, C2-C7 alkoxycarbonyl groups, C2-C7 acyloxy groups, amino groups, C1-C8 monoalkylamino groups, C2-C12 A dialkylamino group or a phenyl group (the phenyl group may be optionally substituted with a halogen atom, an alkyl group having 1 to 6 carbon atoms, a hydroxyl group, or an alkoxy group having 1 to 6 carbon atoms). Or an alkenyl group having 2 to 20 carbon atoms (the alkenyl group is a halogen atom, a trifluoromethyl group, a hydroxyl group, an alkoxy group having 1 to 6 carbon atoms, or a haloalkoxy group having 1 to 6 carbon atoms). Aryloxy group, alkoxycarbonyl group having 2 to 7 carbon atoms, acyloxy group having 2 to 7 carbon atoms, amino group, monoalkylamino group having 1 to 8 carbon atoms, dialkylamino group having 2 to 12 carbon atoms, phenyl group ( The phenyl group may be optionally substituted with a halogen atom, an alkyl group having 1 to 6 carbon atoms, a hydroxyl group, or an alkoxy group having 1 to 6 carbon atoms)), NR ² R ³ group {R ² and R ³ are each independently an alkyl group having 1 to 20 carbon atoms (the alkyl group is a halogen atom, a trifluoromethyl group, a hydroxyl group, an alkoxy group having 1 to 6 carbon atoms, a carbon number 1-6 haloalkoxy groups, aryloxy groups, C2-C7 alkoxycarbonyl groups, C2-C7 acyloxy groups, amino groups, C1-C8 monoalkylamino groups, carbon A dialkylamino group having 2 to 12 carbon atoms, a phenyl group (the phenyl group may be optionally substituted with a halogen atom, an alkyl group having 1 to 6 carbon atoms, a hydroxyl group, or an alkoxy group having 1 to 6 carbon atoms) Optionally substituted), an alkenyl group having 2 to 20 carbon atoms (the alkenyl group is a halogen atom, a trifluoromethyl group, a hydroxyl group, an alkoxy group having 1 to 6 carbon atoms, or a haloalkoxy group having 1 to 6 carbon atoms) , Aryloxy group, alkoxycarbonyl group having 2 to 7 carbon atoms, acyloxy group having 2 to 7 carbon atoms, amino group, monoalkylamino group having 1 to 8 carbon atoms, dialkylamino group having 2 to 12 carbon atoms, phenyl group (The phenyl group may be optionally substituted with a halogen atom, an alkyl group having 1 to 6 carbon atoms, a hydroxyl group, or an alkoxy group having 1 to 6 carbon atoms) Represents, or ^{R 2} and ^{R 3} together, an alkylene chain is substituted by one or two alkyl groups of 1 to 8 carbon atoms optionally _{- (CH 2) 2-5 -,} - CH 2 CH ₂ — (C _1-8 alkyl) N—CH ₂ CH ₂ — or —CH ₂ CH ₂ —O—CH ₂ CH ₂ — may be formed}, C 1-20 alkyl group {the alkyl The group is a halogen atom, a hydroxyl group, an alkoxy group having 1 to 6 carbon atoms, a carboxyl group, an alkoxycarbonyl group having 2 to 7 carbon atoms, an acyloxy group having 2 to 10 carbon atoms, an amino group, or a monoalkylamino having 1 to 8 carbon atoms. Group, dialkylamino group having 2 to 12 carbon atoms, aryl group (the aryl group may be optionally substituted with a halogen atom, an alkyl group having 1 to 6 carbon atoms, a hydroxyl group, or an alkoxy group having 1 to 6 carbon atoms) Is optionally replaced with The alkenyl group is a halogen atom, a hydroxyl group, an alkoxy group having 1 to 6 carbon atoms, a carboxyl group, an alkoxycarbonyl group having 2 to 7 carbon atoms, or 2 to 10 carbon atoms. Acyloxy group, amino group, monoalkylamino group having 1 to 8 carbon atoms, dialkylamino group having 2 to 12 carbon atoms, aryl group (the aryl group is a halogen atom, alkyl group having 1 to 6 carbon atoms, hydroxyl group, carbon Optionally substituted with an alkoxy group of 1 to 6), a phenyl group {the phenyl group is an alkyl group of 1 to 6 carbon atoms, a halogen atom, a hydroxyl group, or a carbon number 1-6 alkoxy group, aryloxy group, C2-C10 acyloxy group, carboxyl group, C2-C7 alkoxycarbonyl group, C2-C10 acyl An amino group, a monoalkylamino group having 1 to 8 carbon atoms, a dialkylamino group having 2 to 12 carbon atoms, an aryl group (the aryl group is a halogen atom, an alkyl group having 1 to 6 carbon atoms, a hydroxyl group, 1 to 1 carbon atoms) Optionally substituted with an alkoxy group of 6), optionally substituted with a halogen atom, an alkoxy group of 1 to 10 carbon atoms {the alkoxy group is a halogen atom, a hydroxyl group, 1 to 1 carbon atoms. 6 alkoxy groups, aryloxy groups, carboxyl groups, C2-C7 alkoxycarbonyl groups, C2-C10 acyloxy groups, amino groups, C1-C8 monoalkylamino groups, C2-C12 A dialkylamino group, an aryl group (the aryl group may be optionally substituted with a halogen atom, an alkyl group having 1 to 6 carbon atoms, a hydroxyl group, or an alkoxy group having 1 to 6 carbon atoms) ) May be optionally substituted}, or an alkylthio group having 1 to 10 carbon atoms (the alkylthio group is a halogen atom, a hydroxyl group, an alkoxy group having 1 to 6 carbon atoms, an aryloxy group, a carboxyl group, or 2 carbon atoms) ˜7 alkoxycarbonyl group, C 2-10 acyloxy group, amino group, C 1-8 monoalkylamino group, C 2-12 dialkylamino group, aryl group (the aryl group is a halogen atom, It may be optionally substituted with an alkyl group having 1 to 6 carbon atoms, a hydroxyl group, or an alkoxy group having 1 to 6 carbon atoms).
Specifically, acetoguanamine, benzoguanamine, manufactured by Shikoku Kasei Kogyo Co., Ltd .; 2MZ-A, 2E4MZ-A, C11Z-A, 2MA-OK and the like can be mentioned. In particular, benzoguanamine is desirable from the viewpoint of solubility in a solvent.

  In the present invention, the component (f) is melamine. Specifically, Nissan Chemical Industries, Ltd .; differential melamine and the like can be used. Since the maximum particle size is large as it is, there is a possibility that the resolution is lowered or the large particles block between the wirings to cause a reduction in HAST resistance. Therefore, it is necessary to disperse in the resin. As a dispersion method, a known method can be used. In particular, the maximum particle size of melamine is preferably 10 μm or less and more preferably 8 μm or less from the viewpoints of resolution and HAST resistance.

The component (g) used in the present invention is dicyandiamide.
In addition to the above-described components (a) to (g), the photosensitive resin composition may further include other components according to desired characteristics.

  Examples of the other component include a photopolymerizable monomer having at least one ethylenically unsaturated group in the molecule, which is different from the component (b). Depending on the required properties, these photopolymerizable monomers can be appropriately selected and used in addition to the component (b).

  Specific examples of such compounds include bisphenol A (meth) acrylate compounds, compounds obtained by reacting polyhydric alcohols with α, β-unsaturated carboxylic acids, and glycidyl group-containing compounds with α, β- Examples thereof include a compound obtained by reacting an unsaturated carboxylic acid, a urethane monomer such as a (meth) acrylate compound having a urethane bond in the molecule, or a urethane oligomer. Besides these, nonylphenoxy polyoxyethylene acrylate, γ-chloro-β-hydroxypropyl-β ′-(meth) acryloyloxyethyl-o-phthalate, β-hydroxyalkyl-β ′-(meth) acryloyloxy Examples thereof include phthalic acid compounds such as alkyl-o-phthalate, (meth) acrylic acid alkyl ester, and EO-modified nonylphenyl (meth) acrylate.

  In order to improve the alkali developability, it is preferable to use a bisphenol A-based (meth) acrylate compound in combination with the component (b). Examples of bisphenol A-based (meth) acrylate compounds include 2,2-bis (4-((meth) acryloxypolyethoxy) phenyl) propane and 2,2-bis (4-((meth) acryloxypolypropoxy). ) Phenyl) propane, 2,2-bis (4-((meth) acryloxypolybutoxy) phenyl) propane, 2,2-bis (4-((meth) acryloxypolyethoxypolypropoxy) phenyl) propane, etc. Is mentioned. One or more of these can be used in combination.

  In order to improve the sensitivity and resolution, among the above, 2,2-bis (4-((meth) acryloxypolyethoxy) phenyl) propane is preferably used in combination with the component (b).

  In order to improve the balance of adhesion, resolution and electric corrosion resistance, it is preferable to use a compound obtained by reacting an α, β-unsaturated carboxylic acid with a polyhydric alcohol in combination with the component (b). .

  Examples of the compound obtained by reacting a polyhydric alcohol with an α, β-unsaturated carboxylic acid include, for example, polyethylene glycol di (meth) acrylate having 2 to 14 ethylene groups and 2 to 14 propylene groups. Polypropylene glycol di (meth) acrylate, polyethylene polypropylene glycol di (meth) acrylate having 2 to 14 ethylene groups and 2 to 14 propylene groups, trimethylolpropane di (meth) acrylate, tri Methylolpropane tri (meth) acrylate, EO-modified trimethylolpropane tri (meth) acrylate, PO-modified trimethylolpropane tri (meth) acrylate, EO / PO-modified trimethylolpropane tri (meth) acrylate, tetramethylolmethanetri (meth) A Chlorate, tetramethylolmethane tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, EO-modified glyceryl tri (meth) acrylate, PO-modified glyceryl tri (meth) acrylate, EO Examples thereof include PO-modified glyceryl tri (meth) acrylate.

“EO” refers to “ethylene oxide”, and “PO” refers to “propylene oxide”. Further, “EO modified” means having a block structure of ethylene oxide units (—CH ₂ —CH ₂ —O—), and “PO modified” means propylene oxide units (—CH ₂ —CH ₂ —CH _2). -O-) or isopropylene oxide units _{(-CH 2 -CH (CH 3)} -O -, - CH (CH 3) means having a block structure of -CH 2 -O-).

  Examples of the compound obtained by reacting the glycidyl group-containing compound with an α, β-unsaturated carboxylic acid include trimethylolpropane triglycidyl ether tri (meth) acrylate and 2,2-bis (4- (meta ) Acryloxy-2-hydroxy-propyloxy) phenyl and the like. Examples of the α, β-unsaturated carboxylic acid for obtaining the above compound include (meth) acrylic acid.

  Examples of urethane monomers or urethane oligomers such as (meth) acrylate compounds having a urethane bond in the molecule include (meth) acrylic monomers having an OH group at the β-position, isophorone diisocyanate, and 2,6-toluene. Addition reaction products with diisocyanate compounds such as diisocyanate, 2,4-toluene diisocyanate and 1,6-hexamethylene diisocyanate, tris ((meth) acryloxytetraethylene glycol isocyanate) hexamethylene isocyanurate, EO-modified urethane di (meta ) Acrylate, and EO or PO-modified urethane di (meth) acrylate.

  Furthermore, when (meth) acrylic acid alkyl ester is used in combination with component (b), for example, (meth) acrylic acid methyl ester, (meth) acrylic acid ethyl ester, (meth) acrylic acid butyl ester, ( And (meth) acrylic acid 2-ethylhexyl ester and 2-hydroxyethyl (meth) acrylate.

  In the present invention, it is preferable to use (h) an inorganic filler as needed for the purpose of improving properties such as adhesion and hardness. For example, inorganic fillers such as barium sulfate, barium titanate, powdered silicon oxide, amorphous silica, talc, clay, calcined kaolin, magnesium carbonate, calcium carbonate, aluminum oxide, aluminum hydroxide, and mica powder can be used. The amount used is preferably 0 to 70% by mass.

  It is effective to further add (i) an elastomer which is not completely compatible with the acrylic polymer, if necessary, to the photosensitive resin composition of the present invention. By including an elastomer in the photosensitive resin composition, it is possible to improve the adhesion to the conductor layer, and further improve the heat resistance, flexibility and toughness of the photosensitive resin composition after curing. It becomes possible to make it. Examples of the elastomer include styrene elastomers, olefin elastomers, urethane elastomers, polyester elastomers, polyamide elastomers, acrylic elastomers, and silicone elastomers. Examples of the styrene elastomer include styrene-butadiene-styrene block copolymer, styrene-isoprene-styrene block copolymer, styrene-ethylene-butylene-styrene block copolymer, and styrene-ethylene-propylene-styrene block copolymer. As the styrene component in the styrene elastomer, styrene derivatives such as α-methylstyrene, 3-methylstyrene, 4-propylstyrene, 4-cyclohexylstyrene and the like can be used in addition to styrene. Styrenic elastomers are commercially available from Tufprene, Solprene T, Asaprene T, Tuftec (made by Asahi Kasei Co., Ltd.), Elastomer AR (made by Aron Kasei Co., Ltd.), Clayton G, Califlex (above, Shell Japan Co., Ltd.) Company), JSR-TR, TSR-SIS, Dynalon (above, manufactured by JSR Corporation), Denka STR (manufactured by Denki Kagaku Kogyo Co., Ltd.), Quintac (manufactured by Zeon Corporation), TPE-SB series (Sumitomo Chemical) Co., Ltd.), Lavalon (Mitsubishi Chemical Co., Ltd.), Septon, Hibler (above, Kuraray Co., Ltd.), Sumiflex (Sumitomo Bakelite Co., Ltd.), Reostoma, Actimer (above, Riken Vinyl Industry Co., Ltd.) Etc. are available. Examples of olefinic elastomers include homopolymers or copolymers of 2 to 20 carbon atoms such as ethylene, propylene, 1-butene, 1-hexene and 4-methyl-pentene; ethylene-propylene copolymers (EPR) Ethylene-propylene-diene copolymer (EPDM); dicyclopentadiene, 1,4-hexadiene, cyclooctanediene, methylene norbornene, ethylidene norbornene, butadiene, isoprene, and the like, and α-olefin A copolymer of methacrylic acid and a butadiene-acrylonitrile copolymer; an ethylene-α-olefin copolymer rubber; an ethylene-α-olefin-nonconjugated diene copolymer rubber; a propylene-α- Olefin copolymer rubber, butene-α-olefin Polymer rubber and the like. Olefin-based elastomers are commercially available as milastoma (manufactured by Mitsui Petrochemical Co., Ltd.), EXACT (manufactured by Exxon Chemical Co., Ltd.), ENGAGE (manufactured by Dow Chemical Co., Ltd.), DYNABON HSBR which is a hydrogenated styrene-butadiene copolymer, butadiene -The NBR series which is an acrylonitrile copolymer, the XER series which is a both-end carboxyl group-modified butadiene-acrylonitrile copolymer having a crosslinking point (above, manufactured by JSR Corporation), and the like are available. The urethane elastomer is composed of a hard segment composed of a short-chain diol and diisocyanate and a soft segment composed of a long-chain diol and diisocyanate. As long chain diols, polypropylene glycol, polytetramethylene oxide, poly (1,4-butylene adipate), poly (ethylene-1,4-butylene adipate), polycaprolactone, poly (1,6-hexylene carbonate), Examples thereof include poly (1,6-hexylene-neopentylene adipate), and the number average molecular weight of the long-chain diol is preferably 500 to 10,000.

  Examples of the short chain diol include ethylene glycol, propylene glycol, 1,4-butanediol, bisphenol A and the like, and the number average molecular weight of the short chain diol is preferably 48 to 500. The urethane-based elastomer is commercially available as PANDEX T-2185, T-2983N (manufactured by DIC Corporation) and the like. The polyester-based elastomer is an elastomer obtained by polycondensation of a dicarboxylic acid or a derivative thereof and a diol compound or a derivative thereof. Dicarboxylic acids include terephthalic acid, isophthalic acid, naphthalenedicarboxylic acid and aromatic dicarboxylic acids in which these aromatic rings are substituted with methyl, ethyl, phenyl, etc .; carbon such as adipic acid, sebacic acid, dodecanedicarboxylic acid, etc. Examples thereof include aliphatic dicarboxylic acids of 2 to 20; alicyclic dicarboxylic acids such as cyclohexanedicarboxylic acid, and one or more of these compounds can be used.

  Examples of the diol compound include aliphatic or alicyclic compounds such as ethylene glycol, 1,3-propanediol, 1,4-butanediol, 1,6-hexanediol, 1,10-decanediol, and 1,4-cyclohexanediol. Diol; bisphenol A, bis- (4-hydroxyphenyl) -methane, bis- (4-hydroxy-3-methylphenyl) -propane, resorcin, etc. can be exemplified, and one or more of these compounds should be used Can do.

  Further, a multi-block copolymer having an aromatic polyester (for example, polybutylene terephthalate) as a hard segment component and an aliphatic polyester (for example, polytetramethylene glycol) as a soft segment component can be used. The polyester-based elastomer is commercially available as Hytrel (DuPont Toray Industries, Inc.), Perprene (Toyobo Co., Ltd.), Espel (Hitachi Chemical Industries, Ltd.), and the like. Polyamide elastomers are elastomers composed of a hard segment made of polyamide and a soft segment made of polyether or polyester, and are roughly divided into two types: polyether block amide type and polyether ester block amide type. The

  Examples of the polyamide include polyamide 6, polyamide 11, and polyamide 12, and examples of the polyether include polyoxyethylene, polyoxypropylene, and polytetramethylene glycol. Commercially, the polyamide-based elastomer is UBE polyamide elastomer (manufactured by Ube Industries), Daiamide (manufactured by Daicel Huls Co., Ltd.), PEBAX (manufactured by Toray Industries, Inc.), Grilon ELY (manufactured by MMS Japan Co., Ltd.), It is available as Novamid (Mitsubishi Chemical Co., Ltd.), Glais (DIC Corporation), etc. Acrylic elastomers are acrylic esters such as ethyl acrylate, butyl acrylate, methoxyethyl acrylate, and ethoxyethyl acrylate, and monomers having an epoxy group such as glycidyl methacrylate and allyl glycidyl ether, and / or vinyl such as acrylonitrile and ethylene. It is an elastomer obtained by copolymerizing with a monomer.

  Examples of the acrylic elastomer include acrylonitrile-butyl acrylate copolymer, acrylonitrile-butyl acrylate-ethyl acrylate copolymer, acrylonitrile-butyl acrylate-glycidyl methacrylate copolymer, and the like. The silicone elastomer is an elastomer mainly composed of organopolysiloxane, and examples thereof include polydimethylsiloxane, polymethylphenylsiloxane, and polydiphenylsiloxane silicone elastomers. An elastomer obtained by modifying an organopolysiloxane with a vinyl group or an alkoxy group may be used. Silicone elastomers are commercially available as KE series (manufactured by Shin-Etsu Chemical Co., Ltd.), SE series, CY series, SH series (above, manufactured by Toray Dow Corning Silicone Co., Ltd.) and the like. In addition to the above-described elastomers, rubber-modified epoxy resins, epoxy resins obtained by kneading the above-described elastomer particles, and the like can be used. The rubber-modified epoxy resin is obtained by modifying at least part of the epoxy group of the epoxy resin with a both-end carboxyxyl group-modified butadiene-acrylonitrile copolymer, a terminal amino-modified silicone rubber or the like. Furthermore, as an elastomer, the both-ends carboxyl group-modified butadiene-acrylonitrile copolymer and Espel (Espel 1108, Espel 1612, Espel 1620, manufactured by Hitachi Chemical Co., Ltd.) which is a polyester elastomer can also be used.

  Moreover, in this invention, it is desirable to use (j) dilution solvent as needed. Examples of the diluent include aliphatic alcohols such as methanol, ethanol, n-propanol, i-propanol, n-butanol, n-pentanol and hexanol, hydrocarbons such as benzyl alcohol and cyclohexane, diacetone alcohol, Aliphatic ketones such as 3-methoxy-1-butanol, acetone, methyl ethyl ketone, methyl propyl ketone, diethyl ketone, methyl isobutyl ketone, methyl pentyl ketone, methyl hexyl ketone, ethyl butyl ketone, dibutyl ketone, ethylene glycol, diethylene glycol, tri Ethylene glycol, tetraethylene glycol, propylene glycol, ethylene glycol monoacetate, ethylene glycol diacetate, propylene glycol monoacetate, pro Ethylene glycol alkyl ethers such as lenglycol diacetate, propylene glycol monoethyl ether, methyl cellosolve, ethyl cellosolve, butyl cellosolve, phenyl cellosolve, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, ethylene glycol dibutyl ether, methyl cellosolve acetate, ethyl cellosolve acetate And its acetate, diethylene glycol monoalkyl ether and its acetate diethylene glycol dialkyl ether, triethylene glycol alkyl ether, propylene glycol alkyl ether and its acetate, dipropylene glycol alkyl ether, and toluene, petroleum ether, petroleum naphtha, Hydrogenated petroleum naphtha Or petroleum solvents such as solvent naphtha, ethyl formate, propyl formate, butyl formate, amyl formate, methyl acetate, ethyl acetate, propyl acetate, butyl acetate, methyl propionate, ethyl propionate, methyl butyrate, ethyl butyrate, etc. Acid esters, amines, amides such as N, N-dimethylformamide, N, N-dimethylacetamide, N-methyl-2-pyrrolidone, dimethyl sulfoxide, dioxane, tetrahydrofuran, cyclohexanone, γ-butyrolactone, 3- Solvents such as hydroxy-2-butanone, 4-hydroxy-2-pentanone and 6-hydroxy-2-hexanone can be used alone or in combination of two or more.

  If necessary, use colorants such as phthalocyanine blue, phthalocyanine green, iodine green, disazo yellow, malachite green, crystal violet, titanium oxide, carbon black, naphthalene black, azo organic pigments, dyes, etc. it can. Furthermore, polymerization inhibitors such as hydroquinone, hydroquinone monomethyl ether, tert-butylcatechol, pyrogallol and phenothiazine, thixotropic agents such as benton, montmorillonite, aerosil and amide wax, antifoaming agents such as silicone, fluorine and polymer Leveling agents can be used.

  Content of each component in the photosensitive resin composition is 30 to 80 parts by mass of component (a) and 20 to 70 parts by mass of component (b) with respect to 100 parts by mass in total of components (a) and (b). It is preferable to become a part. Furthermore, it is more preferable that component (a) is blended in an amount of 40 to 75 parts by mass and component (b) in an amount of 25 to 60 parts by mass. Moreover, it is preferable that the component (c) is blended in an amount of 0.1 to 30 parts by mass, preferably 0.1 to 20 parts by mass, and more preferably 0.1 to 10 parts by mass. The component (d) is preferably 3 to 50 parts by mass, and more preferably 5 to 40 parts by mass. Component (e) is preferably 0.1 to 10 parts by mass, and more preferably 0.1 to 5 parts by mass. Component (f) is preferably from 0.1 to 10 parts by weight, more preferably from 0.1 to 3 parts by weight, from the viewpoint of the temperature likelihood of the laminate. Component (g) is preferably from 0.1 to 10 parts by mass, and more preferably from 0.1 to 6 parts by mass, from the viewpoints of resolution and plating bath contamination.

  When the diluent used in the present invention is applied to a support and used as a photosensitive film, 30 to 80% of the total mass is contained in the varnish before coating. Then, after making into a film, in order to volatilize in the drying process at the time of film preparation, it will be 3 mass% or less.

Next, the photosensitive element of the present invention will be described.
The photosensitive element of this invention is equipped with a support body and the photosensitive resin composition layer which consists of the photosensitive resin composition of this invention formed on this support body. On the photosensitive resin composition layer, you may further provide the protective film which coat | covers this photosensitive resin composition layer.

  The photosensitive resin composition layer is prepared by dissolving the photosensitive resin composition of the present invention in the above diluent or mixed diluent to obtain a solution having a solid content of about 30 to 80% by mass, and then applying the solution onto a support. Is preferably formed. Although the thickness of the photosensitive resin composition layer varies depending on the use, it is preferably 5 to 200 μm, more preferably 15 to 60 μm in thickness after drying after removing the diluent by heating and / or hot air blowing. preferable. If this thickness is less than 5 μm, it tends to be difficult to apply industrially, and if it exceeds 200 μm, the above-mentioned effects produced by the present invention tend to be reduced, and in particular, physical properties and resolution tend to decrease.

  Examples of the support provided in the photosensitive element include a polymer film having heat resistance and solvent resistance such as polyethylene terephthalate, polypropylene, polyethylene, and polyester.

  The thickness of the support is preferably 5 to 100 μm, and more preferably 10 to 30 μm. If the thickness is less than 5 μm, the support tends to be broken when the support is peeled off before development, and if it exceeds 100 μm, the resolution and flexibility tend to decrease. In the present invention, since the photosensitive resin composition layer is formed using the modified epoxy resin as described above, when the thickness of the support is thicker than the conventional one, for example, when it is more than 25 μm and less than 100 μm Even so, its flexibility and resolution can be maintained.

  The photosensitive film consisting of two layers of the support and the photosensitive resin composition layer as described above or the photosensitive film consisting of three layers of the support, the photosensitive resin composition layer, and the protective film, for example, is stored as it is. Alternatively, the protective film may be interposed and wound around the core in a roll shape and stored.

  The method for forming a resist pattern using the photosensitive resin composition or photosensitive element of the present invention is as follows. First, a known screen printing, a step of applying by a roll coater, or a step of applying by laminating or the like, Is laminated on the substrate to form Next, if necessary, a removal process for removing the protective film from the photosensitive element described above is performed, and an actinic ray is irradiated to a predetermined portion of the photosensitive resin composition layer through a mask pattern, so that the photosensitive resin of the irradiated portion is irradiated. An exposure step for photocuring the composition layer is performed. The photosensitive resin composition layer other than the irradiated part is removed by the next development step. In addition, the board | substrate which forms a resist points out a printed wiring board, a board | substrate for semiconductor packages, and a flexible wiring board.

  As the light source of actinic light, a known light source such as a carbon arc lamp, a mercury vapor arc lamp, an ultrahigh pressure mercury lamp, a high pressure mercury lamp, or a xenon lamp that emits ultraviolet rays effectively is used. Moreover, what emits visible light effectively, such as a photographic flood light bulb and a solar lamp, is also used. Further, direct drawing direct laser exposure may be used. By using the component (c) corresponding to each laser light source and exposure method, it is possible to form an excellent pattern.

  In the development process, an alkaline developer such as a dilute solution of sodium carbonate (1 to 5% by mass aqueous solution) at 20 to 50 ° C. is used as the developer, and known spraying, rocking immersion, brushing, scraping, etc. Develop by the method of.

After the development step, it is preferable to perform ultraviolet irradiation or heating with a high-pressure mercury lamp or the like for the purpose of improving solder heat resistance, chemical resistance, and the like. In the case of irradiating ultraviolet rays, the irradiation amount can be adjusted as necessary. For example, the irradiation can be performed at an irradiation amount of about 0.2 to 10 J / cm ² . Moreover, when heating a resist pattern, it is preferable to carry out for about 15 to 90 minutes in the range of about 100-170 degreeC. Furthermore, ultraviolet irradiation and heating can be performed at the same time, and after either one is performed, the other can be performed. When performing ultraviolet irradiation and heating simultaneously, it is more preferable to heat to 60 to 150 ° C. from the viewpoint of effectively imparting solder heat resistance, chemical resistance and the like.

  This photosensitive resin composition layer also serves as a protective film for wiring after soldering to the substrate, has good lamination temperature stability, excellent resolution, excellent flatness, crack resistance, HAST resistance, Since it has gold plating properties, it is effective as a solder resist for printed wiring boards, semiconductor package substrates, and flexible wiring boards.

  The substrate provided with the resist pattern in this manner is then mounted with a semiconductor element or the like (for example, wire bonding or solder connection) and then mounted on an electronic device such as a personal computer.

  EXAMPLES Hereinafter, the present invention will be described more specifically with reference to examples, but the present invention is not limited to these examples.

(Preparation of photosensitive resin composition solution)
The photosensitive resin composition solution was obtained by mixing each component shown in Tables 1-2 by the compounding quantity (mass part) shown to the same table | surface. The following components were used for the components shown in Tables 1 and 2.

<(A) component: resin having an ethylenically unsaturated group and a carboxyl group>
"EXP-2811": acid-modified epoxy acrylate containing tricyclodecane structure modified from epoxy resin containing tricyclodecane structure (EPICLON HP-200, manufactured by DIC Corporation, trade name) (sample name) manufactured by DIC Corporation .
“ZFR-1158”: bisphenol F type epoxy acrylate (manufactured by Nippon Kayaku Co., Ltd., trade name).
“UXE-3024”: urethane-modified epoxy acrylate (trade name) manufactured by Nippon Kayaku Co., Ltd.
“Resin (1)”: a copolymer of methacrylic acid, methyl methacrylate, and butyl acrylate, having a weight average molecular weight of 60,000, an acid value of 110 mg KOH / g, ZP-18, manufactured by Hitachi Chemical Co., Ltd.).

<Component (b): Photopolymerizable monomer having an ethylenically unsaturated group and a tricyclodecane structure>
“NK Espel DCP”: Tricyclodecane dimethanol dimethacrylate (trade name, manufactured by Shin-Nakamura Chemical Co., Ltd.).
"UX-5002D-M20": Tricyclodecane structure-containing urethane acrylate (trade name, manufactured by Nippon Kayaku Co., Ltd.).
“Hitaroid 9082”: urethane acrylate (trade name, manufactured by Hitachi Chemical Co., Ltd.).
“KAYARAD-DPHA”: dipentaerythritol hexaacrylate (trade name, manufactured by Nippon Kayaku Co., Ltd.).
“FA-321M”: 2,2-bis (4- (methacryloxypentaethoxy) phenyl) propane (trade name, manufactured by Hitachi Chemical Co., Ltd.).

<(C) Component: Photopolymerization initiator>
“DAROCURE-TPO”: bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide (trade name, manufactured by Ciba Specialty Chemicals).
“IRGACURE-OXE02”: Etanone, 1- [9-ethyl-6- (2-methylbenzoyl) -9H-carbazol-3-yl]-, 1- (O-acetyloxime) (Ciba Specialty Chemicals) ,Product name).
“IRGACURE-907”: 2-methyl-1 [4- (methylthio) phenyl] -2-morpholinopropan-1-one (trade name, manufactured by Ciba Specialty Chemicals).

<(D) component>
“NC-3000H”: biphenyl aralkyl type epoxy resin (product name) manufactured by Nippon Kayaku Co., Ltd.
“BL-3175”: Block type isocyanate (manufactured by Sumitomo Bayer Urethane Co., Ltd., trade name).

<(E) component: guanamine derivative>
“Benzoguanamine”: 2,4-diamino-6-phenyl-1,3,5-triazine (trade name, manufactured by Nippon Shokubai Co., Ltd.).
“2MA-OK”: 2,4-diamino-6- [2′-methylimidazolyl- (1 ′)]-ethyl-s-triazine isocyanuric acid adduct (trade name, manufactured by Shikoku Kasei Kogyo Co., Ltd.).
“3MT”: 3-mercapto-1,2,4-triazole (trade name, manufactured by Aldrich).

<(F) Component: Melamine>
“Melamine-A”: A melamine dispersion solution using differential melamine (trade name, manufactured by Nissan Chemical Industries, Ltd.) and dispersed to a maximum particle size of 5 μm or less by the following method.
“Melamine-B”: differential melamine (manufactured by Nissan Chemical Industries, maximum particle size of about 15 μm or less, trade name).
(B) Component 40 parts by mass (solid content), melamine 10 parts by mass, and methyl ethyl ketone 50 parts by mass using Starmill LMZ (manufactured by Ashizawa Finetech Co., Ltd.) with 0.6 mm diameter zirconia beads and a peripheral speed of 12 m Dispersion was carried out at / s, and when the maximum particle size became 5 μm or less, the dispersion was terminated to obtain a melamine dispersion. Melamine was added to the photosensitive resin composition by blending the dispersion prepared above.

<(G) Component: Dicyandiamide>
“Dicyandiamide”: “Epicure DICY7” (trade name, manufactured by Japan Epoxy Resin Co., Ltd.).

<Other ingredients>
“Variace B-30”: A barium sulfate dispersion prepared by the following method using barium sulfate “Variace B-30” (trade name, manufactured by Sakai Chemical Industry Co., Ltd.).

  (B) 20 parts by mass (solid content) of the component, 40 parts by mass of the barium sulfate, and 40 parts by mass of methyl ethyl ketone were mixed with Starmill LMZ (manufactured by Ashizawa Finetech Co., Ltd.) using zirconia beads having a diameter of 1.0 mm. Dispersion was carried out at 12 m / s for 3 hours to obtain a barium sulfate dispersion. Barium sulfate was added to the photosensitive resin composition by blending the dispersion prepared above.

“Esper 1108”: polyester elastomer (trade name, manufactured by Hitachi Chemical Co., Ltd.).

Pigment: “phthalocyanine blue” (trade name, manufactured by Toyo Ink Co., Ltd.).

  In the photosensitive resin composition solutions of Examples and Comparative Examples, a mixed solution of methyl ethyl ketone and N, N-dimethylformamide as a diluent at a mass ratio of 1: 1 is used, and the solid content of the resin composition solution is 60% by mass. It was added to become.

＊：表中の配合量は固形分（質量部）での数値を示す。

*: The compounding quantity in a table | surface shows the numerical value in solid content (mass part).

(Production of photosensitive element)
Next, the photosensitive resin composition solution obtained above is uniformly coated on a 16 μm-thick polyethylene terephthalate film (G2-16, trade name, manufactured by Teijin Ltd.) as a support, thereby forming the photosensitive resin composition. A material layer was formed and dried for about 10 minutes at 100 ° C. using a hot air convection dryer. The film thickness after drying of the photosensitive resin composition layer was 20 μm.

  Subsequently, on the surface of the photosensitive resin composition layer opposite to the side in contact with the support, a polyethylene film (NF-15, manufactured by Tamapoly Co., Ltd., trade name) is bonded as a protective film, and is photosensitive. An element (photosensitive film) was obtained.

(Characteristic evaluation of photosensitive film)
Each of the following tests was carried out using the photosensitive films of Examples 1 to 6 and Comparative Examples 1 to 7, respectively, and the coating properties, resolution, gold plating resistance, adhesion when each photosensitive element was used. , And evaluated. The obtained results are shown in Tables 3-4.

(Evaluation of coating properties)
The appearance of the obtained photosensitive film was observed, and the coating properties were determined according to the following criteria.
“A”: Color unevenness and stripes / repels are not observed on the appearance of the coating film.
“B”: Many color irregularities and stripes / repels are observed in the appearance of the coating film.

(Resolution evaluation)
The copper surface of a printed wiring board substrate (E-679, manufactured by Hitachi Chemical Co., Ltd., trade name) obtained by laminating a 12 μm thick copper foil on a glass epoxy substrate was polished with an abrasive brush, washed with water, and dried. Using a press-type vacuum laminator (MVLP-500, manufactured by Meiki Seisakusho Co., Ltd., trade name) on this printed wiring board substrate, the polyethylene film of the photosensitive film is peeled off and laminated, and the pressure is 0.4 MPa. Lamination was performed at a press hot plate temperature of 80 ° C., a vacuuming time of 20 seconds, a laminating press time of 30 seconds, and an atmospheric pressure of 4 kPa or less to obtain a laminate for evaluation.

  A photo tool having a via diameter pattern with a diameter of 10 μm in a range of 30 to 100 μm in diameter as a negative is closely adhered on the evaluation laminate, and an EXM-1201 type exposure machine manufactured by Oak Manufacturing Co., Ltd. The exposure was carried out with an energy amount such that the number of remaining step steps after development of 16.0. Next, after standing at room temperature (25 ° C.) for 1 hour, the polyethylene terephthalate on the laminate was peeled off, and spray development was performed for 60 seconds with a 1 mass% sodium carbonate aqueous solution at 30 ° C. to remove unexposed portions. A resist pattern was formed.

The formed resist pattern was observed with a stereomicroscope, and the resolution was determined according to the following criteria.
“A”: A via diameter of 50 μm can be resolved.
“B”: A via diameter of 50 μm was not resolved.

(Evaluation of electroless Ni / Au plating resistance)
The copper surface of a printed wiring board substrate (E-679, manufactured by Hitachi Chemical Co., Ltd., trade name) obtained by laminating a 12 μm thick copper foil on a glass epoxy substrate was polished with an abrasive brush, washed with water, and dried. Using a press-type vacuum laminator (MVLP-500, trade name, manufactured by Meiki Seisakusho Co., Ltd.) on the printed wiring board substrate, the polyethylene film of the photosensitive film is peeled off and laminated, and the press hot plate temperature is 70. A laminated body for evaluation was obtained under the conditions of ° C., evacuation time 20 seconds, laminate press time 30 seconds, atmospheric pressure 4 kPa or less, and pressure bonding pressure 0.4 MPa.

  A photo tool having a via pattern with a diameter of 200 μm is adhered as a negative on the evaluation laminate, and the number of remaining steps after development of the 41-step tablet using an EXM-1201 type exposure machine manufactured by Oak Manufacturing Co., Ltd. Exposure was performed with an energy amount of 16.0. Subsequently, after leaving still at room temperature for 1 hour, the polyethylene terephthalate on this laminated body was peeled off, and spray development was carried out with a 1 mass% sodium carbonate aqueous solution at 30 ° C. for 60 seconds to form a pattern.

Subsequently, a solder having a via opening with a diameter of 200 μm is obtained by performing ultraviolet irradiation with an energy amount of 1 J / cm ² using an ultraviolet irradiation device manufactured by Oak Manufacturing Co., Ltd., and further performing heat treatment at 160 ° C. for 60 minutes. An evaluation laminate substrate on which a resist was formed was obtained.

  The laminated substrate for evaluation obtained in the same manner as in the above resist shape evaluation is subjected to electroless nickel plating (trade name Nimden NPR-4, manufactured by Uemura Kogyo Co., Ltd.) (further treatment for 15 minutes), and further electroless gold. Plating (trade name Orical TKK-511, manufactured by Uemura Kogyo Co., Ltd.) was applied (treatment for 15 minutes).

For the evaluation substrate thus plated, the plating solution soaked into the bottom of the solder resist, and the solder resist floating and peeling from the substrate were observed with a 100-fold metal microscope, and the following criteria Thus, the electroless Ni / Au plating resistance was evaluated.
“A”: No penetration into the solder resist bottom.
“B”: A penetration of 1 to 10 μm into the bottom of the solder resist.
“C”: other than above.

(Evaluation of adhesion)
CZ treatment (CZ-8100, manufactured by MEC Co., Ltd.) is applied to the copper surface of a printed wiring board substrate (E-679, manufactured by Hitachi Chemical Co., Ltd., trade name) in which a 12 μm thick copper foil is laminated on a glass epoxy substrate. went. Using a press-type vacuum laminator (MVLP-500, trade name, manufactured by Meiki Seisakusho Co., Ltd.) on the printed wiring board substrate, the polyethylene film of the photosensitive film is peeled off and laminated, and a press hot plate temperature of 80 A laminated body for evaluation was obtained under the conditions of ° C., evacuation time 20 seconds, laminate press time 30 seconds, atmospheric pressure 4 kPa or less, and pressure bonding pressure 0.4 MPa.

  Using the EXM-1201 type exposure machine manufactured by Oak Manufacturing Co., Ltd., the laminate for evaluation was exposed with an energy amount such that the number of remaining step steps after development of the 41-step step tablet was 16.0. Subsequently, after leaving still at normal temperature for 1 hour, the polyethylene terephthalate on this laminated body was peeled off, and spray development was performed for 60 seconds with 1 mass% sodium carbonate aqueous solution of 30 degreeC.

Subsequently, using an ultraviolet irradiation device manufactured by Oak Manufacturing Co., Ltd., ultraviolet irradiation was performed with an energy amount of 1 J / cm ² , and further a heat treatment was performed at 160 ° C. for 60 minutes to obtain an adhesion evaluation substrate.

  Next, an underfill (CEL-C-3730S, manufactured by Hitachi Chemical Co., Ltd., trade name) was formed on the evaluation substrate in a cylindrical shape having a diameter of 3 mm, and cured at 165 ° C. for 2 hours.

Using a series 4000 manufactured by dage, the above-mentioned adhesion evaluation substrate was subjected to shear strength measurement at room temperature (25 ° C.), and the adhesion strength was calculated. Adhesion was determined according to the following criteria.
“A”: Adhesion strength of 2.0 MPa or more.
“B”: Adhesive strength of less than 2.0 MPa.

(Evaluation of warpage)
On one side of a 0.06 mm thick glass epoxy substrate (50 mm × 50 mm) from which copper was removed by etching the copper foil of a printed wiring board substrate (E-679, manufactured by Hitachi Chemical Co., Ltd., trade name) Next, a cured product of the solder resist is formed as described above (the entire surface is exposed, and development, ultraviolet irradiation, and heat treatment are performed), and then the substrate on which the solder resist is formed is cut out and the warp height at the four corners is increased. The thickness was measured with a ruler and evaluated according to the following criteria.
"A": The average value of the warp height at the four corners is less than 5 mm.
“B”: The average value of the warp height at the four corners is 5 mm or more and less than 10 mm.
“C”: The average value of the warp height at the four corners is 10 mm or more.

The comparative example 1 which does not use the melamine of (f) component is inferior to gold-plating resistance and adhesiveness, and the melamine of (f) component is 10 mass parts with respect to a total of 100 mass parts of (a) component and (b) component. Comparative Examples 2 and 3 used in excess of are inferior in resolution and coating properties. Further, Comparative Example 4 in which the guanamine derivative as the component (e) is not used is inferior in gold plating resistance and adhesion, and uses a photopolymerizable monomer having an ethylenically unsaturated group and a tricyclodecane structure as the component (b). The comparative example 5 which does not have is inferior to gold plating tolerance and a curvature. Furthermore, the comparative example 6 which does not use the epoxy resin of component (d) is inferior to gold plating resistance and warpage.
On the other hand, according to the examples of the present invention using the prescribed amounts of the components (a) to (g), the printed wiring having excellent coating properties, resolution, Ni / Au plating resistance, warpage, and adhesion. A photosensitive resin composition and a photosensitive element that can form an optimal solder resist for a board, a semiconductor package substrate, and a flexible wiring board can be provided.

Claims (9)

(A) component: a resin having an ethylenically unsaturated group and a carboxyl group;
(B) component: a photopolymerizable monomer having an ethylenically unsaturated group and a tricyclodecane structure;
(C) component: a photopolymerization initiator;
(D) component: an epoxy resin;
(E) component: a guanamine derivative represented by the following general formula (1);
(F) component: melamine,
(G) a component: a dicyandiamide, a photosensitive resin composition comprising:
The photosensitive resin composition which contains 0.1 mass part or more and less than 10 mass parts when the melamine of the said (f) component makes the sum total of (a) component and (b) component 100 mass parts.

(In the general formula (1), R is a substituent other than NH ₂ and may contain one or more substituents having 1 to 12 carbon atoms, or an oxygen atom or a nitrogen atom.)   The photosensitive resin composition according to claim 1, wherein the maximum particle size of melamine as the component (f) is 10 μm or less.   The component (b) is at least one selected from the group consisting of dimethylol tricyclodecane diacrylate, dimethylol tricyclodecane dimethacrylate, tricyclodecanediol diacrylate, and tricyclodecanediol dimethacrylate. The photosensitive resin composition of Claim 1 or Claim 2. The photosensitive resin composition according to claim 1, wherein the component (b) has a partial structure represented by the following general formula (2) or general formula (3).

[In General Formula (2) or General Formula (3), R ¹ and R ² represent a direct bond, an alkylene, or an arylene group. ]   The compound having a partial structure represented by the general formula (2) or the general formula (3) is a diol compound containing a tricyclodecane structure, a diisocyanate compound, and at least one ethylenically unsaturated group in the molecule. The photosensitive resin composition according to claim 4, which is a urethane compound obtained by reacting a compound having one hydroxyl group.   The photosensitive resin composition according to claim 4, wherein the diisocyanate compound is a diisocyanate having a ring structure.   7. The compound having at least one ethylenically unsaturated group and one hydroxyl group in the molecule is a compound having three ethylenically unsaturated groups in the molecule. Photosensitive resin composition. The photosensitive resin composition according to claim 7, wherein the compound having three ethylenically unsaturated groups in the molecule is represented by the following general formula (4).

[In General Formula (4), a plurality of R ³ or R ⁴ may be the same or different, each R ³ represents an alkylene group or an arylene group having 1 to 10 carbon atoms, and R ⁴ represents a hydrogen atom or a carbon number. 1 to 10 represents an alkyl group or an aryl group, and l, m and n each represents an integer of 1 to 10. ]   A photosensitive element provided with a support body and the photosensitive resin composition layer which consists of the photosensitive resin composition in any one of Claims 1-8 formed on this support body.