JP2012101342A - Surface treatment agent for polishing pad and spray for polishing pad - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a surface treatment agent for a polishing pad and a spray for a polishing pad by which a thin and uniform film made of a thermosetting resin can be formed on the surface of a polishing pad without replacing a used pad with new one.SOLUTION: The spray 1 for the polishing pad is provided by filling a spray container 2 with a surface treatment agent for a polishing pad made of a dispersant 3 prepared by dispersing a thermosetting resin, such as urethane resin and epoxy resin, in a solvent and showing a viscosity of 1,000 cP (centipoise) or lower at 20°C and with a high-pressure gas.

Description

  The present invention applies a thermosetting resin such as a urethane resin or an epoxy resin to the surface of a polishing pad used when polishing an object to be polished such as a lens, a silicon wafer for a semiconductor device, or a glass substrate for a liquid crystal display. The polishing pad surface treatment agent and a polishing pad spray using the polishing pad surface treatment agent.

  Conventionally, polishing work using a polishing pad has been performed on objects to be polished that require high-precision flatness such as lenses, silicon wafers for semiconductor devices, glass substrates for liquid crystal displays, glass substrates for hard disks, and aluminum substrates. Yes. In the polishing process of an object requiring such high flatness, the main purpose is to improve the surface roughness after performing rough polishing, which is generally intended to adjust the flatness. Final polishing is performed.

  As a polishing pad used for performing these polishing processes, for example, a urethane-impregnated nonwoven fabric type polishing pad in which a nonwoven fabric fiber base material formed by intertwining fibers is impregnated with a polyurethane resin and cured (for example, a patent) A urethane resin solution is applied on a base material made of a nonwoven fabric or resin film composed of a non-woven fabric or a fiber made of fibers, and this is solidified to form a porous silver surface layer having a large number of bubbles. A suede type polishing pad (see, for example, Patent Document 2) in which a nap layer that is a porous polishing layer is formed by grinding the surface of a surface layer has been used so far. When polishing the surface of the object to be polished, for example, these polishing pads are stuck on a rotatable polishing surface plate and the object to be polished held by the polishing head is pressed against the polishing pad. Thus, polishing is performed by relatively rotating the polishing platen and the polishing head while supplying the polishing slurry in which the abrasive grains, which are abrasives, are dispersed on the polishing pad.

Japanese Patent Laid-Open No. 10-249737 JP 2010-149259 A

  However, in the conventional polishing process, it is necessary to replace the polishing pad on the polishing surface plate as the polishing pad surface is worn. In particular, a large-diameter polishing pad has a problem that production efficiency is lowered because a large amount of time is required for this replacement work. In addition, since the shape accuracy is an important factor in polishing processing of lenses and the like, it is required to make the surface of the polishing pad uniform.

  The present invention has been made in view of the problems as described above, and it is possible to form a thin and uniform film made of a thermosetting resin on the surface of the polishing pad without performing a replacement operation of the polishing pad. An object of the present invention is to provide a polishing pad surface treatment agent and a polishing pad spray.

  In order to achieve the above object, the surface treatment agent for a polishing pad according to claim 1 is characterized by comprising a dispersion in which a thermosetting resin is dispersed in a solvent.

  The surface treatment agent for a polishing pad according to claim 2 is characterized in that the thermosetting resin has an A hardness in the range of 70-100.

  The surface treating agent for a polishing pad according to claim 3 is characterized in that the thermosetting resin is a one-component type room temperature curing type.

  The surface treatment agent for a polishing pad according to claim 4 is characterized in that the dispersion has a viscosity at 20 ° C. of 1000 cP or less.

  The surface treatment agent for a polishing pad according to claim 5 is characterized in that the thermosetting resin is an epoxy resin.

  The surface treatment agent for a polishing pad according to claim 6 is characterized in that solid particles are mixed in the dispersion. Further, as this solid particle, in order to prevent scratches on the surface of the object to be polished, it is preferable to use a particle whose hardness is softer than the abrasive grains contained in the polishing slurry used in the polishing process. For example, inorganic particles, metal particles, organic particles, or the like that meet these conditions are used depending on the application.

  The spray for polishing pad according to claim 7 is characterized in that the surface treatment agent for polishing pad is filled in a sprayable container.

  The spray for a polishing pad according to claim 8 is characterized in that the sprayable container is filled with a high-pressure gas.

  According to the surface treating agent for a polishing pad of the present invention, by applying a dispersion liquid in which a thermosetting resin is dispersed in a solvent to the surface of the polishing pad conventionally used for polishing, the surface of the polishing pad is coated. A film made of a thermosetting resin such as urethane resin can be easily formed. Therefore, once the polishing pad is affixed to the polishing surface plate, a film made of a thermosetting resin is applied to the surface of the polishing pad without replacing the polishing pad even if the surface of the polishing pad is worn out thereafter. By forming, it becomes possible to perform the polishing process again, so that the production efficiency can be improved.

  Moreover, according to this invention, A thermosetting resin in the range of 70-100 is used. As a result, since the dispersion liquid is applied to the surface of the polishing pad, a film of a thermosetting resin having a soft hardness is formed, so that the abrasive slips between the polishing pad and the object to be polished during the polishing process. Can be prevented. Further, by using a thermosetting resin having such a soft hardness, it is possible to reduce wear due to polishing.

  Further, according to the present invention, a one-component type room temperature curing (natural curing) type thermosetting resin is used. Thereby, since the thermosetting resin on the surface of the polishing pad can be easily cured, the production efficiency can be further improved and a polishing pad in which a thermosetting resin film is formed on the surface is manufactured. In some cases, the manufacturing efficiency of the polishing pad can also be improved.

  Further, according to the present invention, since the dispersion has a low viscosity of 1000 cP (centipoise) or less, the dispersion can be easily and thinly applied to the surface of the polishing pad. As a result, the film made of the thermosetting resin on the surface of the polishing pad is thinly and evenly formed, so it can be used effectively even for non-abrasive objects such as lenses, where shape accuracy is an important factor in polishing processing. Can do.

  According to the present invention, an epoxy resin is used as the thermosetting resin. Thereby, a film made of an epoxy resin can be formed on the surface of the polishing pad. Therefore, when performing polishing using this polishing pad, the polishing material (abrasive grains) contained in the polishing slurry supplied onto the polishing pad is temporarily polished by the chemical affinity of the epoxy functional groups. Since it is firmly held on the surface, the polishing efficiency can be improved.

  Moreover, according to the present invention, solid particles are mixed in the dispersion. As a result, a film made of a thermosetting resin containing solid particles is formed on the surface of the polishing pad, so that when polishing is performed, a gap is provided between the surface of the object to be polished and the polishing pad, and the polishing slurry is formed. It becomes easy to flow in and polishing characteristics can be improved. Further, since the unevenness can be formed on the surface of the polishing pad by the solid particles, it is possible to improve the retention of abrasive grains, promote the discharge of chips and the like, reduce the friction with the object to be polished, and the like. .

  Further, according to the polishing pad spray of the present invention, conventionally, a polishing pad surface treatment agent comprising a dispersion liquid in which a thermosetting resin is dispersed is sprayed on the surface of the polishing pad used for polishing, Since it can be applied, a film made of a thermosetting resin can be easily formed on the surface of the polishing pad.

  Also, according to the polishing pad spray of the present invention, a thermosetting resin film can be easily formed on the surface of a conventional polishing pad, so that the polishing pad manufacturer newly invests in equipment. There is no need, and it becomes possible to manufacture a polishing pad in which a thermosetting resin film is formed on the surface of the polishing pad. In addition, by using the polishing pad spray of the present invention, the surface of the non-polishing object can be made into a thermosetting resin while utilizing the hardness of the conventional polishing pad. It can correspond to.

It is a schematic explanatory drawing which shows an example of the state at the time of apply | coating an epoxy resin (thermosetting resin) to the surface of a polishing pad using the spray for polishing pads which concerns on this invention.

  Hereinafter, embodiments of a surface treatment agent for a polishing pad and a spray for a polishing pad according to the present invention will be described with reference to the drawings. The polishing pad surface treatment agent and polishing pad spray according to the present invention are mainly composed of a nonwoven fabric fiber base material formed by entanglement of conventional polishing pads and fibers, a plastic film such as polyvinyl chloride, bakelite, and the like. By spraying and applying a dispersion in which a thermosetting resin is dispersed in a solvent on the surface of a substrate or the like, a film made of a thermosetting resin is formed.

  As shown in FIG. 1, a polishing pad spray 1 is a polishing pad surface treatment agent (hereinafter referred to as “a polishing pad surface treatment agent”) comprising a dispersion 3 in which an epoxy resin is dispersed as a thermosetting resin in a container 2 capable of spraying the contents. It is simply filled with high-pressure gas together with the dispersion). Using such a polishing pad spray 1, the dispersion liquid 3 in which the epoxy resin is dispersed is sprayed onto the substrate 4 to apply the epoxy resin film 5 to the polishing pad 6 as shown in FIG. It can be easily formed on the surface.

  The container 2 in which the dispersion liquid 3 is filled is made of, for example, a metal can such as steel or aluminum, and is used for spraying the internal dispersion liquid 3 pressurized by high-pressure gas to the outside. A cap 8 provided with a nozzle 7 is provided at the tip. The nozzle 7 has a plurality of thin holes (not shown) communicating from the inside to the outside, and the dispersion 3 is sprayed by vigorously pushing the dispersion 3 through the holes to the outside.

  The dispersion 3 is obtained by dispersing an epoxy resin in a solvent. As the epoxy resin used in the dispersion 3, it is preferable to use an A resin having an A hardness in the range of 70 to 100. By using such a soft epoxy resin for the polishing pad spray 1, as shown in FIG. 1, the epoxy resin film 5 formed on the surface of the polishing pad 6 can reduce wear due to polishing. In addition, it is possible to prevent the abrasive from slipping between the epoxy resin film 5 on the surface of the polishing pad 6 and the object to be polished during the polishing process. Moreover, in order to further increase the temporary holding force with respect to the abrasive, it is preferable to use an epoxy resin having a lot of free functional groups. Moreover, since it can harden | cure easily by using the 1 liquid type normal temperature hardening (natural hardening) type epoxy resin, the manufacturing efficiency of the polishing pad 6 can be improved.

  As a solvent for dispersing the epoxy resin, for example, a solvent such as MEK (methyl ethyl ketone) or IPA (isopropyl alcohol) can be used. However, the solvent is not particularly limited, and a conventionally known solvent may be appropriately used. good.

  In addition, an epoxy resin having a low viscosity is used so that the viscosity of the dispersion 3 at 20 ° C. is 1000 cP (centipoise) or less. When the low-viscosity dispersion liquid 3 is used in this way, it becomes easy to apply the epoxy resin thinly and uniformly by spraying the dispersion liquid 3 on the surface of the substrate 4. Accordingly, since the epoxy resin film 5 having a thin and uniform surface can be formed on the polishing pad 6, it is also effective for non-polishing objects whose shape accuracy is an important factor in polishing processing of lenses and the like. A polishing pad can be manufactured.

  Next, an example of a method for forming the epoxy resin film 5 on the surface of the polishing pad 6 using the polishing pad spray 1 will be described.

  As shown in FIG. 1, first, a user sprays a dispersion 3 in which an epoxy resin is dispersed on the surface of a substrate 2 using a polishing pad spray 1 to apply the epoxy resin substantially uniformly. At this time, the application thickness of the epoxy resin may be set to a desired thickness corresponding to the type of the object to be polished, but at least 10 μm or more in consideration of the life of the polishing pad 6 when performing the polishing process. It is preferable to apply so as to have a thickness of 5 mm.

  And the epoxy resin apply | coated on this base material 2 is hardened. For example, in the case of using a photocurable epoxy resin, the epoxy resin is cured by irradiating ultraviolet rays after the epoxy resin is uniformly applied. Thereby, the polishing pad 6 in which the thin-film epoxy resin film 3 having a uniform surface is formed on the substrate 2 is generated.

  In addition, since the epoxy resin film 5 is formed on the surface of the polishing pad 6 in this way, when polishing is performed using the polishing pad 6, it is included in the polishing slurry supplied onto the polishing pad 6. Abrasive materials (abrasive grains) such as cerium oxide, zirconium oxide, colloidal silica, etc., are temporarily held firmly on the surface of the polishing pad 6 by chemical affinity due to the functional groups of the epoxy. Therefore, the polishing material can be prevented from being dragged and moved by the object to be polished along with the relative rotation of the polishing pad 6 and the object to be polished. Can be improved.

  In this embodiment, an example using the dispersion 3 (surface treatment agent for polishing pad) in which an epoxy resin is dispersed in a solvent is described. However, the dispersion 3 may be other thermosetting such as urethane resin. A resin in which an epoxy resin is added to a resin and dispersed in a solvent, a resin in which a thermosetting resin other than an epoxy resin is dispersed in a solvent, or the like can also be used.

  Moreover, what mixed solid particle | grains previously with such a dispersion liquid 3 can also be used as a surface treating agent for polishing pads. In order to prevent the surface of the workpiece from being scratched by the solid particles during the polishing process, the solid particles have a hardness higher than that of the abrasive grains contained in the polishing slurry used during the polishing process. It is preferable to use a soft material. As the solid particles, for example, inorganic particles such as abrasive grains, organic particles such as polymer fine particles, metal particles, or the like can be used depending on the application.

  By using a surface treatment agent for a polishing pad in which such solid particles are mixed with the dispersion 3, a film made of a thermosetting resin containing solid particles is formed on the surface of the polishing pad. When performing, a gap is provided between the surface of the object to be polished and the polishing pad so that the polishing slurry can easily flow in and the polishing characteristics can be improved. Further, since the unevenness can be formed on the surface of the polishing pad by the solid particles, it is possible to improve the retention of abrasive grains, promote the discharge of chips and the like, reduce the friction with the object to be polished, and the like. . In addition, when inorganic particles such as metal oxide particles are used as the solid particles, effects such as oxidation action and chip adsorption can be further achieved. In addition, when polymer fine particles are used as the solid particles, the lubricity can be improved. Moreover, when metal particles are used as the solid particles, a catalytic action and a reducing action can be achieved. As described above, depending on the type of solid particles mixed in the dispersion 3, the material of the solid particles can be used in addition to improving the retention of abrasive grains, promoting the discharge of chips and the like, and reducing the friction with the object to be polished. Therefore, it is preferable to select these solid particles according to the requirements at the time of polishing.

  In addition, a mixture of fibers such as plastic in the dispersion 3 can be used as a surface treatment agent for a polishing pad. By using a surface treatment agent for a polishing pad in which such a fiber is mixed with the dispersion liquid 3, a film made of a thermosetting resin containing the fiber is formed on the surface of the polishing pad, and the surface of the polishing pad is formed by the fiber. As in the case where the above solid particles are mixed, the effect of improving the retention of abrasive grains, promoting the discharge of chips and the like, and reducing the friction with the object to be polished is achieved. be able to.

  In addition, a so-called pore material such as starch, salt or sugar mixed with the dispersion 3 may be used as a surface treatment agent for a polishing pad. When the surface treatment agent for a polishing pad mixed with such a pore material is used, a film made of a thermosetting resin containing the pore material is formed on the surface of the polishing pad. Therefore, a plurality of pores are formed on the surface of the polishing pad by rinsing the surface of the polishing pad using a substance that elutes only a pore material such as water, so that the polishing used for polishing is performed. A structural grip force for abrasive grains contained in the slurry can be obtained.

  Moreover, the polishing pad and the base material on which the epoxy resin is applied to the surface by the polishing pad spray 1 according to the present invention are not particularly limited, and are conventionally used according to the type of non-polished material. Can be applied to things.

  In addition, the polishing pad spray 1 according to the present embodiment is described using an example in which a container 2 that can be sprayed with a high-pressure gas together with a dispersion 3 in which an epoxy resin is dispersed in a solvent is used. The polishing pad spray 1 is not limited to such a form. For example, instead of using the pressure of a high-pressure gas, an electric spray type using an electric pump or an air spray using an external air pressure is used. What is necessary is just to be able to spray the dispersion liquid 3 with which it filled in the container 2 outside, such as a type thing. The container 2 is not limited to a metal can or the like, and a plastic container or another container may be used.

  The embodiment of the present invention is not limited to the above-described embodiment, and can be appropriately changed without departing from the scope of the idea of the present invention.

  The surface treatment agent for polishing pad and the spray for polishing pad according to the present invention can be effectively used as a surface treatment agent and a spray for easily forming a film of a thermosetting resin on the surface of the polishing pad.

1 Polishing pad spray 2 Container 3 Dispersion liquid (Polishing pad surface treatment agent)
4 Base material 5 Epoxy resin film 6 Polishing pad

Claims (8)

  A surface treatment agent for a polishing pad, comprising a dispersion in which a thermosetting resin is dispersed in a solvent.   The surface treatment agent for a polishing pad according to claim 1, wherein the thermosetting resin has an A hardness in the range of 70 to 100.   The surface treatment agent for a polishing pad according to claim 1 or 2, wherein the thermosetting resin is a one-pack type room temperature curing type.   The surface treatment agent for a polishing pad according to claim 1, wherein the dispersion has a viscosity at 20 ° C. of 1000 cP or less.   The surface treatment agent for a polishing pad according to claim 1, wherein the thermosetting resin is an epoxy resin.   The surface treatment agent for a polishing pad according to claim 1, wherein solid particles are mixed in the dispersion.   A spray for polishing pad, comprising a sprayable container filled with the surface treatment agent for polishing pad according to claim 1.   The polishing pad spray according to claim 7, wherein the sprayable container is filled with a high-pressure gas.

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