JP2012099732A - Substrate cleaning apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate cleaning apparatus capable of removing foreign substances on the surface of the substrate more certainly.SOLUTION: A substrate cleaning apparatus 1 comprises: a substrate conveyance part 12 which can reciprocate a substrate 11; a roller unit 13 which removes foreign substances on the surface of the substrate 11, the foreign substances being to be moved by the substrate conveyance part 12; and a PLC 14 which controls the substrate conveyance part 12 and the roller unit 13. The PLC14 controls the substrate conveyance part 12 to move the substrate 11 forward or backward to make the substrate 11 pass the roller unit 13 for the number of movement according to the number of cleaning counts. The substrate conveyance part 12 comprises: belts 21a and 21b which convey the substrate 11; pulleys 22a, 22b, 22c, and 22d which support the belts 21a and 21b; and a reversible motor 23 which rotates the pulleys 22a, 22b, 22c, and 22d: The rotation direction of the pulleys 22a, 22b, 22c, and 22d can be switched.

Description

  The present invention relates to a substrate cleaning apparatus for removing (cleaning) foreign matters on the surface of a substrate as a pre-process for manufacturing a printed wiring board (hereinafter referred to as “substrate”).

  When mounting electronic components on a substrate, surface mounting technology in which the substrate is purchased from the substrate manufacturer, and the substrate supply device, printing machine, mounter, conveyor, reflow furnace, and substrate storage device are arranged in order from the upstream side. (SMT) was supplied to the production line.

  For this reason, foreign matters such as dust and dust adhere to the substrate, and these foreign matters cause problems such as solder defects. However, conventionally, in a board to be incorporated in an electronic device or the like, the size of a chip component (electronic component) mounted on the board is 1.6 mm (length) × 0.8 mm (width) at a minimum and is not so small. It was. For this reason, even if foreign matters are adhered on the substrate in the previous stage or in the middle of the manufacture of the substrate, the decrease in the yield due to the defective solder is small and does not become a particular problem.

  However, recently, electronic components mounted on a substrate are 1.0 mm (length) × 0.5 mm (width), 0.6 mm (length) × 0.3 mm (width), 0.4 mm (length) × The number of extremely small chip components such as 0.2 mm (width) has increased, and the number of electronic components mounted on one substrate has increased, and the density of component mounting has been increased. For this reason, defects due to foreign matters such as dust adhered to the substrate frequently occur, causing a problem of yield reduction.

  As a method for solving defects caused by foreign matters such as dust, it has been proposed to incorporate a substrate cleaning device into a production line in order to remove foreign matters on the surface of the substrate (for example, Patent Document 1). Such a substrate cleaning device is disposed between the upstream substrate supply device and the downstream printing press, and removes foreign matter on the surface of the substrate while the substrate is transported from the substrate supply device to the printing press. Part.

  The foreign matter removing unit has a roller unit having an adhesive roller for transferring foreign matter on the surface of the substrate, or a brush unit having a brush that contacts the surface of the substrate while rotating and removes foreign matter on the surface of the substrate. The processing which removes the foreign material of the surface of the board | substrate by is performed. In some cases, both the brush unit and the roller unit are used in combination.

Japanese Patent No. 4326472

  By performing the process of removing foreign substances on the surface of the substrate as described above, the yield is greatly improved. However, an increase in the number of electronic components mounted on a single board and an increase in the density of component mounting tend to further advance, and further improvement in yield is desired. As the number of electronic components mounted on a single board increases and the density of component mounting further increases, the importance of removing foreign substances on the surface of the board will increase, resulting in dust, etc. Therefore, it is required to more surely remove foreign matters on the surface of the substrate so as not to cause defects.

  An object of the present invention is to provide a substrate cleaning apparatus that can more reliably remove foreign substances on the surface of a substrate.

  In order to achieve the above object, the substrate cleaning apparatus of the present invention is characterized in that the substrate is reciprocated to remove the foreign matter a plurality of times.

  By increasing the number of times of performing the processing for removing the foreign matter, the foreign matter on the surface of the substrate can be more reliably removed. Here, in order to perform the foreign substance removal processing a plurality of times, it is conceivable to incorporate a plurality of substrate cleaning apparatuses in the production line, but there is a disadvantage that the production line becomes long. In addition, when the substrate cleaning apparatus is provided with a plurality of foreign substance removing portions in order to perform the process of removing the foreign substances on the surface of the substrate a plurality of times, there is a disadvantage that the substrate cleaning apparatus becomes large. On the other hand, according to the present invention, since the number of treatments for removing foreign substances by reciprocating the substrate itself is increased, it is not necessary to lengthen the production line or enlarge the substrate cleaning apparatus.

  In the current printed wiring board manufacturing process, the time required for the substrate cleaning process is significantly shorter than the time required for the subsequent printing process, mounting process or reflow process, and the time required for reciprocating the board is long. Even if it increases, the throughput of the manufacturing process does not decrease.

  A substrate cleaning apparatus according to the present invention includes a substrate transport unit that can reciprocate a substrate, a foreign material removal unit that removes foreign material on the surface of the substrate moved by the substrate transport unit, and a control that controls the substrate transport unit and the foreign material removal unit. A section.

  The control unit controls the substrate transport unit to move the substrate forward or backward, and allows the substrate to pass through the foreign matter removing unit by the number of movements corresponding to the number of cleanings.

  In the substrate cleaning apparatus according to the present invention, the control unit preferably has a user interface for setting the number of times of cleaning.

  In the substrate cleaning apparatus according to the present invention, the substrate transport unit preferably includes a belt that transports the substrate, a pulley that supports the belt, and a motor that rotates the pulley, and the rotation direction of the pulley is switchable. .

  In the substrate cleaning apparatus according to the present invention, the foreign matter removing unit rotates in synchronization with the movement of the substrate, presses and contacts the surface of the substrate while adhering to the surface of the substrate, and adsorbs the foreign matter on the surface of the substrate. However, it is preferable that the roller unit has an adhesive roller for transferring foreign matter on the surface of the substrate adsorbed on the surface of the adsorption roller.

  In the substrate cleaning apparatus according to the present invention, it is preferable that the substrate cleaning apparatus further includes a moving unit that moves the roller unit to a retracted position away from a position in contact with the surface of the substrate.

  In the substrate cleaning apparatus according to the present invention, it is preferable that the control unit controls the substrate to move backward while the roller unit is moved to the retracted position.

  The substrate cleaning apparatus according to the present invention further includes a brush unit provided on the upstream side of the foreign matter removing unit, the brush unit contacting the surface of the substrate while rotating and removing the foreign matter on the surface of the substrate, and the brush It is preferable to have a suction part that sucks the removed foreign matter.

  In the substrate cleaning apparatus according to the present invention, the foreign matter removing unit is a brush unit having a brush that contacts the surface of the substrate while rotating and removes the foreign matter on the surface of the substrate, and a suction unit that sucks the foreign matter removed by the brush. Preferably there is.

  In the substrate cleaning apparatus according to the present invention, a first sensor which is provided at a position separated from the foreign substance removing unit by an amount equal to or longer than the length of the substrate and detects the passage of the end of the substrate, and a substrate downstream from the foreign substance removing unit. And a second sensor that detects the passage of the end of the substrate, and the control unit is configured to detect the substrate based on the detection signals of the first and second sensors. It is preferable to detect passage in the foreign matter removing unit.

  According to the present invention, it is possible to more reliably remove foreign matter on the surface of the substrate by increasing the number of times of removing the foreign matter on the surface of the substrate.

  In addition, according to the present invention, it is possible to increase the number of times of removing foreign substances on the surface of the substrate without lengthening the production line or increasing the size of the substrate cleaning device.

It is a figure which shows the whole structure of the manufacturing line of the printed wiring board incorporating the board | substrate cleaning apparatus by this invention. It is a figure which shows 1st Embodiment of the substrate cleaning apparatus by this invention. It is the figure which looked at the substrate cleaning device of Drawing 2 from the substrate supply device side. It is a flowchart of operation | movement of 1st Embodiment of the substrate cleaning apparatus by this invention. It is a figure for demonstrating operation | movement of 1st Embodiment of the substrate cleaning apparatus by this invention. It is a figure for demonstrating other operation | movement of 1st Embodiment of the substrate cleaning apparatus by this invention. It is a figure which shows 2nd Embodiment of the substrate cleaning apparatus by this invention. It is a figure for demonstrating operation | movement of 2nd Embodiment of the substrate cleaning apparatus by this invention. It is a figure which shows 3rd Embodiment of the substrate cleaning apparatus by this invention.

Embodiments of a substrate cleaning apparatus according to the present invention will be described with reference to the drawings. In the drawings, the same components are denoted by the same reference numerals.
FIG. 1 is a diagram showing the overall configuration of a printed wiring board production line incorporating a substrate cleaning apparatus according to the present invention. In the production line shown in FIG. 1, a substrate supply device 2 is disposed upstream of the substrate cleaning device 1, and a printing machine 3, a mounter 4, a conveyor 5, a reflow furnace 6, and the downstream of the substrate cleaning device 1. The substrate storage device 7 is arranged in order. There is also a production line process in which the conveyor 5 is not provided.

  The substrate supply device 2 automatically supplies substrates to the substrate cleaning device 1 one by one. The substrate cleaning device 1 outputs a substrate supply signal to the substrate supply device 2 when a substrate request signal is input from the printing machine 3 and processing for removing foreign matter on the surface of the substrate is possible. In response to this, the substrate supply device 2 supplies the substrate to the substrate cleaning device 1. As will be described later, the substrate cleaning device 1 removes foreign matter on the surface of the substrate supplied from the substrate supply device 2 and then supplies the substrate to the printing machine 3. The printing machine 3 receives the board request signal from the mounter 4 and outputs a board supply signal to the board cleaning device 1 when solder printing on the board is possible. In response to this, a substrate is supplied from the substrate cleaning device 1, solder printing is performed on the substrate supplied from the substrate cleaning device 1, and then supplied to the mounter 4. The mounter 4 mounts components on the substrate supplied from the printing machine 3 and supplies the components to the reflow furnace 6 via the conveyor 5. Therefore, the substrate supplied to the reflow furnace 6 is a substrate that has finished solder printing and component mounting. The reflow furnace 6 heat-treats the substrate supplied from the mounter 4 via the conveyor 5. The substrate after the heat treatment is stored in the substrate storage device 7 from the reflow furnace 6.

  FIG. 2 is a diagram showing a first embodiment of a substrate cleaning apparatus according to the present invention. In FIG. 2, the substrate cleaning apparatus 1 includes a substrate transport unit 12 that reciprocates the substrate 11, a roller unit 13 that removes foreign matters on the surface of the substrate 11, a programmable logic controller (PLC) 14, and the roller unit 13. 11 includes a moving unit 15 that moves to a position away from a position that contacts the surface of the eleventh surface, electrostatic removers 16a and 16b, and sensors 17a and 17b.

  The substrate transport unit 12 includes two parallelly arranged belts 21a and 21b for mounting both ends of the substrate 11 to transport the substrate 11, and pulleys 22a, 22b, 22c for supporting the belts 21a and 21b, 22d and a reversible motor 23 such as a step motor for rotating the pulley 22a clockwise or counterclockwise. In FIG. 2, the direction in which the substrate 11 is moved from the right side to the left side is the forward direction, that is, the direction in which the substrate 11 is moved from the upstream side to the downstream side is the forward direction, and the reverse direction is the reverse direction. The pulley 22a rotates counterclockwise when the substrate 11 is moved forward and clockwise when the substrate 11 is moved backward.

  The PLC 14 has a touch panel (user interface) (not shown) that allows a user to perform various processing operations including processing to remove foreign matter on the surface of the substrate 11, and includes operations performed by the touch panel and sensors 17 a and 17 b. It functions as a control unit that controls the roller unit 13, the moving unit 15, and the reversible motor 23 based on the signal.

  The roller unit 13 functions as a foreign matter removing unit, and is applied to the suction rollers 31a and 31b and the two suction rollers 31a and 31b, which are pressed against the surface of the substrate 11 to press and attract the foreign matter on the surface of the substrate. And an adhesive roller 32 that transfers foreign matter on the surface of the substrate 11 adsorbed by the adsorbing rollers 31a and 31b while being in pressure contact.

  The suction rollers 31a and 31b are formed of silicon rubber or other rubber resin. The suction rollers 31a and 31b may be either conductive or non-conductive. To prevent static electricity from being generated on the surface of the substrate 11 due to the suction rollers 31a and 31b contacting and rubbing against the substrate 11. It is preferable that the suction rollers 31a and 31b have conductivity. The adsorption rollers 31a and 31b adsorb foreign matters such as dust on the surface of the substrate 11 due to wettability of silicon rubber or other rubber-based resin, and remove foreign matters on the surface of the substrate 11. Since the suction rollers 31a and 31b do not have an adhesive or the like on their surfaces, the adhesive or the like does not adhere to the substrate 11 from the suction rollers 31a and 31b.

  The adhesive roller 32 is rotationally driven counterclockwise by a motor (not shown) under the control of the PLC 14. Since the suction rollers 31 a and 31 b are in contact with the adhesive roller 32, the suction rollers 31 a and 31 b are rotated clockwise with the rotation of the adhesive roller 32.

  When the adhesive roller 32 is in pressure contact with the suction rollers 31 a and 31 b, dust or the like adsorbed from the substrate 11 to the suction rollers 31 a and 31 b is transferred to the adhesive roller 32. Therefore, the surfaces of the suction rollers 31a and 31b are always kept clean, and the effect of removing foreign matters on the surface of the substrate 11 is maintained.

  The moving unit 15 moves the roller unit 13 between a position in contact with the surface of the substrate 11 and a retracted position away from the substrate 11 under the control of the PCL 13. Thereby, when the board | substrate 11 passes under the roller unit 13, it can be in the state which the adsorption | suction rollers 31a and 31b contact the surface of the board | substrate 11, or the state which does not contact.

  The suction rollers 31a and 31b have a certain degree of elasticity, and make pressure contact from above the substrate 11 by utilizing this elasticity. For this reason, the lower ends of the suction rollers 31 a and 31 b immediately before the foreign matter on the surface of the substrate 11 is removed by the roller unit 13 are positioned below the upper surface of the substrate 11 being conveyed. When the substrate 11 is conveyed in such a state, the front end portion of the substrate 11 first strikes the suction roller 31a or the suction roller 31b. Thereafter, the substrate 11 is sandwiched and transported between the suction roller 31a or the suction roller 31b and the transport belts 21a and 21b by the frictional force between the suction roller 31a or the suction roller 31b and the transport belts 21a and 21b. In the middle of this conveyance, the surface of the substrate 11 is subjected to a process for removing foreign matter by the suction rollers 31a and 31b. In order to prevent the suction rollers 31a and 31b from rubbing against the surface of the substrate 11 when the suction rollers 31a and 31b remove foreign matter on the surface of the substrate 11, the linear velocity of the adhesive roller 32 is set to the belts 21a and 21b. Is preferably the same as the speed at which the substrate 11 is conveyed.

  The static eliminator 16a is disposed between the sensor 17a and the roller unit 13, and neutralizes static electricity on the surface of the substrate 11 before removing the foreign matter on the upper surface of the substrate 11, thereby removing the foreign matter on the surface of the substrate 11. Make it easy to remove. The electrostatic removal unit 16b is disposed between the roller unit 13 and the sensor 17b, neutralizes static electricity on the surface of the substrate 11 after the process of removing foreign matter on the upper surface of the substrate 11, and causes foreign matter on the surface of the substrate 11 by static electricity. Prevents redeposition. As the electrostatic removal units 16a and 16b, either a contact type or a non-contact type can be used.

  The sensor 17a is disposed at a first position separated from the end of the roller unit 13 by an amount equal to or longer than the length of the substrate 11, and detects that the front end or the rear end of the substrate 11 has moved to the first position. A signal is transmitted to the PLC 14. When the sensor 17b detects that the tip of the substrate 11 has moved to the second position, the sensor 17b is arranged at a second position separated from the end of the roller unit 13 by a distance equal to or longer than the length of the substrate 11. Send. In the present embodiment, the distance between the upstream end of the roller unit 13 and the sensor 17a and the distance between the downstream end of the roller unit 13 and the sensor 17b are both equal to or longer than the length of the substrate 11. Distance.

  FIG. 3 is a view of the substrate cleaning apparatus of FIG. 2 as viewed from the substrate supply apparatus side. In FIG. 3, other than the belts 21 a and 21 b, the suction roller 31 a and the adhesive roller 32 of the roller unit 13, and the substrate 11 are omitted for simplicity of illustration.

  FIG. 4 is a flowchart of the operation of the first embodiment of the substrate cleaning apparatus according to the present invention, and FIG. 5 is a diagram for explaining the operation of the first embodiment of the substrate cleaning apparatus according to the present invention. is there. The processing flow shown in FIG. 4 is performed when the PLC 14 executes a control program installed in the PLC 14.

  First, the PLC 14 determines whether or not the cleaning mode has been selected by the touch panel (step S1). In the selection of the cleaning mode, the number of cleanings k for cleaning the substrate 11 is set. Here, when the number of times of cleaning k is 1, the substrate 11 passes only once through the roller unit 13, that is, only moves once in the forward direction. When the cleaning count k is 2, the substrate 11 passes through the roller unit 13 once in the forward direction, then passes through the roller unit 13 in the reverse direction, and passes again through the roller unit 13 in the forward direction. In other words, the substrate 11 performs one forward movement and k-1 reciprocating movements. When the cleaning mode is selected, the PLC 14 further sets a built-in counter count n to an initial value “0” in order to count the number of cleanings.

Next, the PLC 14 determines whether or not a signal has been received from the sensor 17a, that is, whether or not the tip of the substrate 11 has moved to the first position as shown in FIG. 5A (step S2).
Thereafter, as shown in FIG. 5A, the PLC 14 controls the moving unit 15 to lower the roller unit 13 to bring the roller unit 13 into contact with the surface of the substrate 11, and rotates the pulley 22 a counterclockwise. The reversible motor 23 is rotated forward and a motor (not shown) is rotated forward to drive the adhesive roller 32 counterclockwise (step S3). Further, the PLC 14 operates the electrostatic removers 16a and 16b. In step S3, the substrate 11 is transported in the direction of arrow a (forward direction) by the belts 21a and 21b, and as shown in FIG. 5B, the roller unit 13 removes foreign matter on the surface of the substrate 11. The forward rotation of the reversible motor 23 may be started immediately after the tip of the substrate 11 is moved to the first position or may be started after the substrate 11 is disposed on the belts 21a and 21a.

  Next, the PLC 14 determines whether or not a signal is received from the sensor 17b, that is, whether or not the tip of the substrate 11 has moved to the second position as shown in FIG. 5C (step S4). When the tip of the substrate 11 moves to the second position, the PLC 14 stops the motor for rotationally driving the reversible motor 23 and the adhesive roller 32 (step S5), and stops the operation of the electrostatic removers 16a and 16b. To do. Before the process of removing foreign matter on the upper surface of the substrate 11, static electricity on the entire surface of the substrate 11 is neutralized by the electrostatic remover 16a, and foreign matter on the entire surface of the substrate 11 is easily removed. Moreover, since the static electricity of the whole surface of the board | substrate 11 is neutralized by the static eliminator 16b after the process which removes the foreign material on the upper surface of the board | substrate 11, the board | substrate 11 will be in the state which is not electrically charged.

  Further, the PLC 14 increments the count n of the counter by 1 (step S6), and determines whether the count n is k or more (step S7).

  If the count n is greater than or equal to k, the cleaning process for the set number of cleanings has been performed, so the PLC 14 determines whether or not a substrate supply signal has been input from the printing machine 3 (step S8). When the substrate supply signal is input, the PLC 14 rotates the reversible motor 23 in order to rotate the pulley 22a counterclockwise, supplies the substrate 11 to the printing machine 3 (step S9), and ends this routine. .

  When the count n is less than k, the PLC 14 controls the moving unit 15 to raise the roller unit 13 and reverses the reversible motor 23 to rotate the pulley 22a clockwise as shown in FIG. 5D ( Step S10). As a result, even when the substrate 11 moves in the backward direction under the roller unit 13, the surface of the substrate 11 is not in contact with the suction roller 31 a and the adhesive roller 32 of the roller unit 13.

  In step S10, as shown in FIG. 5E, the substrate 11 is conveyed in the direction of arrow b (reverse direction) by the belts 21a and 21b and passes below the roller unit 13. The PLC 14 determines whether or not a signal has been received from the sensor 17b, that is, whether or not the rear end of the substrate 11 has moved to the first position as shown in FIG. 5F (step S11). When the rear end of the substrate 11 has moved to the first position, the PLC 14 stops the reversible motor 23 (step S12) and proceeds to step S3.

  As described above, in step S3, as shown in FIG. 5G, the roller unit 13 is lowered, the reversible motor 23 is rotated forward, and the motor for driving the adhesive roller 32 to rotate counterclockwise is rotated. Therefore, the above operation is repeated according to the number of cleanings.

  In the current printed wiring board manufacturing process, the time required for the substrate cleaning process is significantly shorter than the time required for the subsequent printing process, mounting process, or reflow process. Therefore, even if the substrate is reciprocated in order to perform the cleaning process a plurality of times by the substrate cleaning apparatus 1, the increase in time does not affect the throughput of the manufacturing process.

  In the first embodiment, when the substrate 11 is moved in the reverse direction, the roller unit 13 is moved to the retracted position in step S10 so that the surface of the substrate 11 does not contact the roller unit 13. . However, when the substrate 11 is moved in the reverse direction, as shown in FIG. 6A, the roller unit 13 is not retracted, and the adhesive roller 32 is driven to rotate clockwise, and as shown in FIG. 31 b may be in pressure contact with the surface of the substrate 11. Accordingly, even when the substrate 11 moves in the backward direction, the cleaning process of the surface of the substrate 11 by the roller unit 13 is performed. In other words, 2k-1 cleaning processes are performed with respect to the cleaning count k in the first embodiment. In order to perform such an operation, it is required that the motor for rotationally driving the adhesive roller 32 is a reversible motor.

  Also in this case, as shown in FIG. 6C, when it is detected that the rear end of the substrate 11 has reached the first position, the motor for rotationally driving the reversible motor 23 and the adhesive roller 32 is stopped. Furthermore, it is preferable to operate the electrostatic removers 16a and 16b when the substrate 11 is moved in the backward direction. Also in this case, the linear velocity of the adhesive roller 32 is set so that the suction rollers 31a and 31b do not rub the surface of the substrate 11 when the suction rollers 31a and 31b remove foreign matter on the surface of the substrate 11. The belts 21a and 21b preferably have the same speed as the substrate 11 is conveyed.

  Further, it is preferable that all the dust adsorbed by the suction rollers 31a and 31b is transferred to the adhesive roller 32. Therefore, the sensors 17a and 17b are arranged at positions where the arc length from the bottom of the suction rollers 31a and 31b to the contact position with the adhesive roller 32 is added to the length of the substrate 11 from the bottom of the suction rollers 31a and 31b. It is preferable.

  As described above, according to the first embodiment, the foreign matter on the surface of the substrate 11 can be simply changed by changing the operation sequence of the existing apparatus without lengthening the production line or increasing the size of the substrate cleaning apparatus 1. The process of removing can be performed a plurality of times. Further, since the suction rollers 31a and 31b can uniformly contact the surface of the substrate 11, foreign substances on the surface of the substrate 11 can be more reliably removed. Therefore, the performance can be improved without increasing the device cost, and the investment effect on the equipment can be enhanced.

  FIG. 7 is a diagram showing a second embodiment of the substrate cleaning apparatus according to the present invention. A substrate cleaning apparatus 41 shown in FIG. 7 is used in place of the substrate cleaning apparatus 1 in the production line shown in FIG. The substrate cleaning device 41 has the same configuration as the substrate cleaning device 1 except that it includes a brush unit 42 instead of the roller unit 13 and the moving unit 15.

  The brush unit 42 functions as a foreign matter removing unit, and includes two brushes 43 a and 43 b that rotate while contacting the surface of the substrate 11 to remove foreign matter on the surface of the substrate 11, and a vacuum unit 44.

  The brushes 43a and 43b are formed in a cylindrical shape from the antistatic treated fibers, and remove foreign matter on the surface of the substrate 11 when contacting the surface of the substrate 11. The brushes 43a and 43b are driven to rotate clockwise and counterclockwise by a motor (not shown) under the control of the PLC 14, respectively.

  The vacuum unit 44 collects the suction part 45 that sucks foreign matter on the surface of the substrate 11 removed by the brushes 43a and 43b, the duct 46 through which the foreign matter sucked by the suction part 45 passes, and the foreign matter that has passed through the duct 46. And a filter 47.

  In the second embodiment, when the tip of the substrate 11 supplied from the substrate supply device 2 moves to the first position, the PLC 14 rotates the pulley 22a counterclockwise as shown in FIG. 8A. In order to rotate the reversible motor 23 forward and to rotate the brushes 43a and 43b clockwise and counterclockwise, respectively, a motor (not shown) is driven. As a result, the substrate 11 is conveyed in the direction of arrow a (forward direction) by the belts 21a and 21b, and as shown in FIG. 8B, the brush unit 42 performs a process of removing foreign matter on the surface of the substrate 11.

  When further cleaning is performed after the tip of the substrate 11 has moved to the second position as shown in FIG. 8C, the PLC 14 is reversible to rotate the pulley 22a clockwise as shown in FIG. 8D. The motor 23 is reversed, the substrate 11 is conveyed in the direction of the arrow b (retracted direction) by the belts 21a and 21b, and as shown in FIG. 8E, a process of removing foreign matter on the surface of the substrate 11 by the brush unit 42 is performed. As shown in FIG. 8F, when the rear end of the substrate 11 moves to the second position, the reversible motor 23 is stopped.

  As in the first embodiment, the moving unit 15 is provided, and the brush unit 42 can be moved between a position in contact with the surface of the substrate 11 and a position away from the substrate 11 under the control of the PCL 13. The substrate 11 may be moved in the backward direction with the brush unit 42 retracted.

  According to the second embodiment, the process of removing the foreign matter on the surface of the substrate 11 can be performed a plurality of times without lengthening the production line or increasing the size of the substrate cleaning device 41. Moreover, since the brushes 43a and 43b are used, even if there are many foreign substances adhering to the surface of the board | substrate 11, a foreign substance can be removed effectively.

  FIG. 9 is a diagram showing a third embodiment of the substrate cleaning apparatus according to the present invention. A substrate cleaning apparatus 51 shown in FIG. 9 is used in place of the substrate cleaning apparatus 1 in the production line shown in FIG. The substrate cleaning device 51 is provided with the brush unit 42 of the second embodiment on the upstream side of the substrate cleaning device 1 described above.

  In the third embodiment, the substrate 11 supplied from the substrate supply device 2 is supplied to the substrate cleaning device 1 after being cleaned by the brush unit 42, and then the first embodiment. Performs the same operation as. For example, when the cleaning process is performed only once by the brush unit 42 and the cleaning process is performed a plurality of times by the substrate cleaning apparatus 1, the substrate 11 reciprocates only on both sides of the substrate cleaning apparatus 1, and the brush unit 42. It does not move to the part of. At this time, when the moving unit 15 moves only the substrate cleaning device 1, it is preferable that the substrate cleaning device 1 and the brush unit 42 are separated from each other by the length of the substrate 11 or more. Further, after the cleaning process by the brush unit 42 is performed a plurality of times, the substrate cleaning apparatus 1 may perform the cleaning process a plurality of times.

  In the third embodiment, it is possible to perform both the cleaning process by the brush unit 42 and the cleaning process by the substrate cleaning apparatus 1 a plurality of times. In that case, the brush unit 42 is provided close to the substrate cleaning apparatus 1, and the substrate 11 reciprocates on both sides of the brush unit 42 and the substrate cleaning apparatus 1. Also in this case, not only the substrate cleaning apparatus 1 but also the brush unit 42 may be moved to the retracted position.

  According to the third embodiment, the process of removing foreign matter on the surface of the substrate 11 can be performed a plurality of times without lengthening the production line or increasing the size of the substrate cleaning device 51. Further, since both the suction rollers 31a and 31b and the brushes 43a and 43b are used, the foreign matter can be effectively removed even if there are many foreign matters attached to the surface of the substrate 11, and the foreign matter on the surface of the substrate 11 can be removed. Can be removed more reliably.

  The present invention is not limited to the above-described embodiment, and many changes and modifications can be made. For example, the configurations of the first to third embodiments can be combined as appropriate. In the drawing, the substrate supply device is arranged on the right side of the substrate cleaning device and the printer is arranged on the left side of the substrate cleaning device. However, the printer is arranged on the right side of the substrate cleaning device and the substrate cleaning device is arranged. The substrate supply device 2 can be arranged on the left side.

  Further, the case where at least one of the roller unit and the brush unit is disposed only on the front surface side of the substrate has been described, but either one or both of the roller unit and the brush unit are disposed on both the front surface side and the back surface side of the substrate. Can also be arranged.

  Further, instead of using a sensor to reciprocate the substrate, the substrate transfer unit can be controlled by the PLC so as to reciprocate the substrate for a time corresponding to the reciprocating distance.

  In addition, a first sensor that is provided at a position separated from the roller unit or brush unit upstream by a length equal to or longer than the length of the substrate, detects the passage of the end of the substrate, and the length of the substrate downstream from the roller unit or brush unit. The case where both of the second sensors that are provided at positions separated from each other and detect the passage of the end portion of the substrate is used has been described, but any of these sensors is used to detect the passage of the end portion of the substrate. Only one of them can be used.

  Furthermore, a reversible motor that rotates the pulley clockwise or counterclockwise can be provided for each pulley, and the number of suction rollers and the number of brushes can be other than two (for example, one).

1, 41, 51 Substrate cleaning device 2 Substrate supply device 3 Printer 4 Mounter 5 Conveyor 6 Reflow oven 7 Substrate storage device 11 Substrate 12 Substrate transport unit 13 Roller unit 14 Programmable logic controller (PLC)
DESCRIPTION OF SYMBOLS 15 Moving part 16a, 16b Electrostatic eliminator 17a, 17b Sensor 21a, 21b Belt 22a, 22b, 22c, 22d Pulley 23 Reversible motor 31a, 31b Adsorption roller 32 Adhesive roller 42 Brush unit 43a, 43b Brush 44 Vacuum unit 45 Suction part 46 Duct 47 Filter

Claims (10)

A substrate transfer section capable of reciprocating the substrate;
A foreign matter removing unit that removes foreign matter on the surface of the substrate moved by the substrate transport unit;
A substrate cleaning apparatus comprising: a control unit that controls the substrate transport unit and the foreign matter removing unit.   2. The substrate cleaning according to claim 1, wherein the control unit controls the substrate transport unit to move the substrate forward or backward, and allows the substrate to pass through the foreign matter removing unit by the number of times of movement corresponding to the number of times of cleaning. apparatus.   The substrate cleaning apparatus according to claim 2, wherein the control unit has a user interface for setting the number of times of cleaning. The substrate transport unit includes a belt that transports the substrate, a pulley that supports the belt, and a motor that rotates the pulley.
The substrate cleaning apparatus according to claim 1, wherein a rotation direction of the pulley can be switched.   The foreign matter removing unit rotates in synchronization with the movement of the substrate, presses and contacts the surface of the substrate and sucks foreign matter on the surface of the substrate, and presses and contacts the suction roller 5. The substrate cleaning apparatus according to claim 1, wherein the substrate cleaning device includes: an adhesive roller configured to transfer a foreign matter on the surface of the substrate adsorbed on the surface of the adsorption roller.   The substrate cleaning apparatus according to claim 5, further comprising a moving unit that moves the roller unit to a retracted position that is separated from a position in contact with the surface of the substrate.   The substrate cleaning apparatus according to claim 6, wherein the control unit controls the substrate to move backward while the roller unit is moved to the retracted position. A brush unit provided on the upstream side of the foreign matter removing section;
8. The brush unit according to claim 5, further comprising: a brush that contacts the surface of the substrate while rotating and removes foreign matter on the surface of the substrate; and a suction unit that sucks the foreign matter removed by the brush. 2. The substrate cleaning apparatus according to item 1.   2. The brush unit having a brush unit that includes a brush that removes foreign matter on the surface of the substrate by contacting the surface of the substrate while rotating, and a suction unit that sucks the foreign matter removed by the brush. 5. The substrate cleaning apparatus according to any one of items 1 to 4. A first sensor that is provided at a position separated from the foreign substance removal portion by an amount equal to or longer than the length of the substrate, and detects the passage of the end portion of the substrate;
A second sensor that is provided at a position spaced apart from the foreign substance removal unit by a length equal to or longer than the length of the substrate, and that detects passage of an end of the substrate;
10. The substrate cleaning apparatus according to claim 1, wherein the control unit detects the passage of the substrate through the foreign matter removing unit based on detection signals of the first and second sensors. 11.

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