JP2012099328A - Organic el display manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an organic EL display manufacturing method in which, when a defect due to inclusion of foreign matter occurs in an organic layer, only a defective portion is locally repaired without damaging the periphery.SOLUTION: Foreign matter mixed in an organic layer is pushed downward up to a surface of the organic layer by a fine needle having a flat tip. Thereafter, an insulating material is applied to only a portion into which the foreign matter has been pushed, by ink jet, a dispenser, an application needle, or the like to form an insulating portion, thereby allowing only a defective portion due to the foreign matter to be locally repaired.

Description

  The present invention relates to a method for manufacturing an organic EL display. In particular, in an organic EL display manufacturing process, when a foreign substance is mixed in the organic layer during the manufacturing process, the organic EL display manufacturing method repairs a defect in the organic layer caused by the foreign substance mixed in the organic layer.

  In recent years, self-luminous organic EL displays using organic EL elements are expected as next-generation displays. The organic EL display has a bright and clear image quality and a self-luminous system, and thus has excellent features such as a wide viewing angle and high responsiveness. An organic EL display has a merit that it is easy to make a thin film because it does not require a backlight, and is expected to be used for a large screen display (television) in the future.

  The organic EL display is composed of a plurality of organic EL elements and a circuit board for causing the organic EL to emit light. On the circuit board, TFTs (thin film transistors) are formed for each organic EL element in order to finely control the current flowing through each EL element. In addition, a correction circuit is formed to suppress variation in current flowing through each EL element.

  An insulating film is formed on the circuit board, and a laminated film having an organic EL element is formed on the insulating film. A connecting portion for connecting the circuit board and each organic EL element is formed in the insulating film.

  The organic EL element is formed on an insulating film formed on a circuit board. A first electrode and a second electrode are provided in a matrix on the insulating film, and a plurality of organic layers are disposed between the first electrode and the second electrode. The organic layer is formed of a light emitting layer containing phosphor molecules, a hole conductive thin film and an electron conductive thin film sandwiching the light emitting layer. When a voltage is applied between the electrodes using the first electrode of the organic EL element as the anode and the second electrode as the cathode, holes are injected from the anode into the hole conductive thin film, and electrons are transferred from the cathode to the electron conductive thin film. Are injected, holes and electrons are combined in the light emitting layer, and the light emitting layer emits light. The organic EL element is protected from the outside air by a sealing layer.

  In the production of an organic EL display, it is important to form a laminated film of organic layers. This is because the state of the organic layer greatly affects the light emission efficiency and power consumption of the organic EL display.

  There are several methods for forming the organic layer. Among them, a coating (printing) method such as an ink jet method, which is advantageous for forming a large area at a low cost, has attracted attention. The inkjet method is a method in which a solution in which an organic material is dissolved in a solvent is applied (printed) to a necessary portion and dried to evaporate the solvent in the solution to form an organic layer. In this way, by repeating application and drying for each organic material, a laminated film of organic layers can be formed.

  As described above, since the organic layer can be collectively formed by coating (printing), the ink-jet method has good material usage efficiency, can easily form a large display, and is low in cost. It can be said that it is suitable for manufacturing in Japan.

  In addition, since the manufacturing process of the organic EL display needs to be laminated while controlling the thickness of the organic layer with an accuracy of several nanometers, the organic layer forming process is generally performed in a clean room. is there. That is, it is necessary to form the organic layer in an environment in which no foreign matter enters the organic layer. However, foreign substances such as very fine particles are mixed in the organic layer from the inside of the device for applying the organic material and the surrounding environment, so it is difficult to prevent the foreign substance from being completely mixed into the organic layer. It is. As a result, there is a problem that foreign matters are mixed into the organic layer in the process of manufacturing the organic EL display.

  When a foreign substance is mixed in the organic layer and a voltage is applied between the first electrode and the second electrode, current leaks between the first electrode and the second electrode through the foreign substance. When the current leaks, the light emission efficiency of the organic EL display decreases, leading to an increase in power consumption. Further, in a pixel in which foreign matter exists, the amount of current flowing through the organic layer (light emitting layer) in the pixel decreases due to current leakage due to the foreign matter. Therefore, the luminance of the light emitting layer in the entire pixel is lowered. Furthermore, if there is a pixel in which a foreign substance exists, current may not flow through the organic layer and light may not be emitted. Alternatively, a protective film is formed to protect the organic layer, but if there is a foreign substance in the organic layer, the sealing layer in the part with the foreign substance becomes defective, and the film thickness in the part with the foreign substance becomes thin, Since the film may be defective, the protection performance deteriorates. When the performance of the sealing layer is deteriorated, the organic layer is deteriorated and the luminance of the light emitting layer is lowered.

  On the other hand, for example, in Patent Document 1, after the organic layer is formed, the insulating film is coated on the portion where the foreign matter adheres to the organic layer, thereby reducing the occurrence of leakage due to the foreign matter and improving the yield of the organic EL display. There is disclosure that it is possible. Patent Document 2 discloses a process of irradiating a foreign substance mixed in the organic layer or on the surface of the organic layer after forming the organic layer to remove the foreign substance mixed in the organic layer, and then using a laser. A process of applying an organic material to the removed part using an application method such as an inkjet method or a needle coating method, and a process of re-forming the organic layer in the part mixed in the organic layer are disclosed. With such a configuration, the foreign matter in the organic layer can be completely removed with a laser, so that it is possible to reduce the occurrence of leakage due to the foreign matter and the formation of defective sealing films.

Japanese Patent Laid-Open No. 11-054286 JP 2004-119243 A

  However, in the manufacturing method of the organic EL display shown in Patent Document 1, repair is performed by forming an insulating portion against foreign matter mixed in the organic layer and insulating the foreign matter portion. Specifically, in the formation of the insulating part, a photosensitive insulating resin is used, and the photosensitive resin is exposed by irradiating light, and the insulating part is formed on the foreign substance part by leaving the insulating resin only on the foreign substance part. Technology.

  FIG. 9 is a cross-sectional view when the insulating portion 3 is formed for the foreign matter 2 mixed in the organic layer 1. When the photosensitive resin is exposed in this manufacturing method, the organic layer 1 is also irradiated with light for exposure. In the above-mentioned Patent Document 1, the deterioration of the organic layer 1 is caused by this light, and there is a problem that the light emission lifetime is reduced. Further, since the foreign matter 2 is left as it is, a region (insulating region 4) that covers the foreign matter with an insulating material is widened, the insulating region 4 is enlarged, a non-light emitting region due to repair is widened, and a luminance reduction in a region where the foreign matter 2 is present It leads to inviting.

  In the case of forming a sealing film for protecting the organic layer 1, if the insulating portion 3 is formed on the foreign matter 2, the insulating portion is formed only on that portion, so that the insulating portion 3 is locally increased by the height 5 of the insulating portion. It becomes a convex shape. When a sealing film is formed in this portion, the sealing film becomes thin due to the convex shape, or a defect can occur in the sealing film. In any case, there is a problem that causes deterioration of the organic layer 1 due to a decrease in sealing performance.

  Moreover, in the conventional manufacturing method of an organic EL display shown in Patent Document 2, the foreign matter mixed in the organic layer is completely removed by the laser, and after removing the foreign material, the organic material is re-applied to remove the defect caused by the foreign matter. Will be repaired.

  10 to 12 are diagrams for explaining Patent Document 2. FIG. As shown in FIG. 10, when the foreign substance 2 mixed in the organic layer 1 is removed by irradiating the laser 7 from the laser oscillator 6, as shown in FIG. 11, the foreign substance removed by the laser and the processed piece 9 of the organic layer are removed. Is scattered around the laser removing unit 8. As shown in FIG. 12, the organic material 10 is applied after removing the foreign matter 2 with a laser. However, since these processed pieces 9 scattered around the laser removal portion are scattered over a wide area, the organic material 10 is completely coated. Can not do it.

  If these processed pieces 9 remain, this processed piece 9 becomes a new foreign substance, which causes a leak when a current is passed through the organic layer 1. Moreover, when forming the sealing layer for protecting the organic layer 1, the sealing layer cannot completely coat the scattered workpiece 9, causing a defect of the sealing layer and deteriorating the organic layer. Will occur.

  The present invention solves the above-mentioned conventional problems, and the defect portion is locally formed without affecting the sealing layer for protecting the organic layer against the defect caused by the foreign matter mixed in the organic layer. An object of the present invention is to provide a method for manufacturing an organic EL display that can be repaired.

  In order to achieve the above object, a method of manufacturing an organic EL display according to the present invention includes a substrate and a plurality of organic EL elements arranged on the substrate, and the organic EL element is formed on the substrate. A method of manufacturing an organic EL display, comprising: a first electrode formed, an organic layer disposed on the first electrode, and a second electrode disposed on the organic layer, the method including at least the following steps: (1) forming an insulating film on the substrate; (2) forming a bank defining an organic layer on the insulating film; (3) applying and forming an organic layer in a region defined by the bank; (4) detecting foreign matter mixed in the organic layer, (5) pushing the foreign matter mixed in the organic layer in a lower direction of the organic layer, and (6) applying an insulating material to the foreign matter. Insulation The step of forming an organic EL display manufacturing method of having.

  At this time, by pressing a fine needle with a flat tip on the surface of the organic layer against the foreign material, the foreign material is pushed down the organic layer, and the size of the foreign material is the stack from the organic layer surface to the substrate surface having the drive circuit. The thickness is preferably equal to or less than the thickness.

  As described above, according to the method of manufacturing an organic EL display of the present invention, when a foreign substance is mixed in the organic layer, the foreign material is pressed and formed below the organic layer, and then the insulating material is locally applied and formed. When the insulating film is applied to the mixed portion, the application area can be minimized. Moreover, in the case of this invention, since the foreign material does not protrude from the organic layer surface, it becomes possible to reduce the coating height and suppress the convex shape.

  Therefore, since it is possible to insulate only a part having foreign matter while suppressing the convex shape locally, the repaired shape can be limitedly reduced in a place where the foreign matter is mixed, and when the leak due to the foreign matter is repaired. Since the non-light-emitting region can be limited to a small size, a reduction in luminance due to repair can be suppressed. Moreover, since it is possible to suppress the height of the convex shape of the repaired portion, the repaired portion does not affect the sealing film, and sealing performance is not deteriorated. For this reason, it is possible to suppress a decrease in the light emission lifetime.

  From the above, the method for producing an organic EL display according to the present invention can increase the yield in the production of an organic EL display and can also produce a high-quality organic EL display.

The figure which shows the flowchart of the manufacturing method of the organic electroluminescent display of this invention. The perspective view which showed the state in which the foreign material mixed in the organic layer in the manufacturing process of an organic electroluminescent display Cross-sectional view showing a state in which foreign matter is mixed in the organic layer during the manufacturing process of the organic EL display Cross section of organic EL display with foreign matter mixed in organic layer (A) In the embodiment of the present invention, the figure before the foreign matter mixed in the organic layer is pushed into the lower part of the organic layer with a fine needle, (b) In the embodiment of the present invention, the foreign matter mixed in the organic layer is fine Of a state where it is pushed into the bottom of the organic layer with a simple needle In the embodiment of the present invention, after the foreign material is pushed into the organic layer, the insulating material is applied, and the insulating portion is formed in the place where the foreign material exists (A) External view of foreign matter mixed in organic layer, (b) External view of foreign matter pushed into organic layer with fine needle (A) An external view after applying an organic material after pushing a foreign substance into the organic layer, (b) a diagram showing a profile of a cross-sectional shape of an insulating portion of the portion where the organic material is applied Cross-sectional view of foreign material mixed in organic layer coated with insulating material by conventional method Sectional view when foreign matter mixed in organic layer of conventional example is removed by laser Cross-sectional view showing a state in which fine debris removed by the laser is scattered after the foreign matter mixed in the organic layer of the conventional example is removed by the laser Sectional drawing which showed the state after re-applying an organic material to the organic layer removed by the laser of the prior art example

  Embodiments of the present invention will be described below with reference to the drawings.

  An organic EL display manufactured by the manufacturing method of the present invention includes a substrate having a drive circuit including at least a TFT, an insulating film formed on the substrate, arranged in a matrix on the insulating film, and a driving circuit. And a connected organic EL element.

  The organic EL element has at least a first electrode disposed on the insulating film, an organic layer disposed on the first electrode, and a second electrode disposed on the organic layer. The organic layer includes at least an organic light emitting layer, but may further include a hole injection layer, a hole transport layer, an electron transport layer, and the like. Moreover, the organic EL element may have arbitrary components, such as a color filter and a sealing film.

As shown in the flowchart of FIG. 1, the manufacturing method of the organic EL display of the present invention is as follows.
(S1) forming an insulating film on a substrate having a driving circuit including a TFT;
(S2) forming a bank defining an organic layer on the insulating film;
(S3) A step of applying an organic material required in each region to a region defined by the bank formed in (S2) to form an organic layer;
(S4) In the organic layer formed in (S3) above, detecting a foreign matter mixed in the organic layer or a foreign matter adhering to the organic layer surface;
(S5) pressing the foreign matter detected in (S4) above into the lower part of the organic layer using a fine needle with a flat tip so that the foreign matter does not protrude from the organic layer surface;
(S6) including a step of locally applying an insulating material only to a portion where the foreign substance is pushed into the lower portion of the organic layer in (S5) to form an insulating portion.

  Hereinafter, features in each of the above steps will be described.

  (1) In the first step (S1), an insulating film is formed on a substrate having a drive circuit for controlling the light emission state by passing a current through the organic EL element. The drive circuit includes a compensation circuit for suppressing variation in TFT and current of the TFT. The type of the substrate on which the circuit is formed is not particularly limited as long as it has insulating properties and desired mechanical characteristics. In general, a glass plate or the like is often used. The substrate may be subjected to surface treatment such as plasma treatment or UV treatment.

  The material of the insulating film is not particularly limited, but in terms of insulation, organic solvent resistance, and process resistance (resistance to plasma treatment, etching treatment, baking treatment), a silicon resin, an acrylic resin, a polyimide resin, a novolac type Phenol resin is preferred. The insulating film is a planarizing film and has a thickness of about 3 to 10 μm. The insulating film is formed with a connection portion for connecting the drive circuit and the first electrode formed on the insulating film.

  (2) In the second step (S2), a bank defining an organic layer is formed on an insulating film formed on a substrate including a drive circuit. Here, “to form a bank on a substrate” not only directly forms a bank on the substrate, but also forms a bank on another member (for example, the first electrode) formed on the substrate. To include. The size and shape of the organic EL element defined by the bank or the like can be freely set according to the desired characteristics (for example, the resolution of the display).

  The bank may define an organic layer for each organic EL element, or may define an area including a plurality of organic EL elements arranged in a line. The plurality of organic EL elements arranged in a line emit light of the same color (red, green or blue).

  The material of the bank is not particularly limited, but acrylic resin, polyimide resin, novolac type phenol resin, etc. are preferable from the viewpoint of insulation, organic solvent resistance, and process resistance (resistance to plasma treatment, etching treatment, and baking treatment). . The material of the bank may be a fluorine resin (acrylic fluorine resin or polyimide fluorine resin). The bank may be subjected to surface treatment such as plasma treatment or UV treatment, whereby the lyophilicity or liquid repellency of the bank surface can be adjusted.

  (3) In the third step (S3), an organic layer is formed by applying a solution containing an organic material to the region defined by the bank formed in the second step. The method for forming the organic layer is not particularly limited as long as it is a coating method. Examples of the coating method include methods such as an inkjet, a dispenser, and a coating needle that can be applied while controlling the organic material at a predetermined position.

  The type of organic material and solvent applied in the bank may be freely selected according to the type of organic layer, desired characteristics, and the like. Examples of the organic material constituting the light emitting layer include polyfluorene-based polymer organic materials.

  An organic EL element is formed by laminating an electrode and a thin film of an organic layer. The thickness of each thin film is controlled at a level of several tens of nm. Even if the manufacturing environment is strictly controlled and the manufacturing equipment is sufficiently maintained, fine foreign matter may enter the part where the solution containing the organic material is applied from the manufacturing environment or inside the equipment. is there. Due to the mixing of the minute foreign matter, a defect occurs in the organic layer. FIG. 2 shows a perspective view when the organic layer 1 is formed between the banks 11 and then the foreign matter 2 is mixed into the organic layer 1, and FIG. 3 shows a cross section taken along the line AA in FIG.

  Further, FIG. 4 shows a cross section when the organic EL element is manufactured in the state as shown in FIG. 3 (the state in which the foreign matter 2 is mixed in the organic layer 1).

  As shown in FIG. 4, the organic EL element is disposed on the substrate 12 including the drive circuit, the insulating film 13 formed on the substrate, the first electrode 14 disposed on the insulating film, and the first electrode. It has the organic layer 1, the 2nd electrode 15 arrange | positioned on an organic layer, and the sealing film 16 arrange | positioned on a 2nd electrode. Foreign matter 2 is mixed in the organic layer 1. As shown in FIG. 4, since the foreign material 2 is in contact with the first electrode 14 and the second electrode 15, if a voltage is applied between the first electrode 14 and the second electrode 15, the foreign material 2 2, current leaks from the first electrode 14 to the second electrode 15, resulting in an increase in power consumption, light emission unevenness due to a decrease in light emission luminance around the foreign matter, and a defective phenomenon in which light emission itself does not occur.

  (4) In the fourth step (S4), it is detected whether or not a poorly formed portion exists in the organic layer formed in the third step (S3). The method for detecting the foreign matter mixed in the organic layer is not particularly limited, and there are a method by visual inspection using a microscope, an image inspection method, a pattern inspection method, and the like. The image inspection method and the pattern inspection method include a “Die to Die inspection method” in which foreign elements are detected by comparing adjacent elements, and a “Die to Database inspection” in which foreign elements are detected by comparing elements and design data. "Method".

  For the foreign matter detected in the organic layer, the size of the foreign matter is measured by a laser microscope or a white interference measuring device. If the size of the detected foreign matter is equal to or less than the thickness from the surface of the substrate including the drive circuit to the outermost surface of the organic layer, the process proceeds to the fifth step (S5), and the foreign matter is pushed into the lower portion of the organic layer. The state that does not protrude.

  (5) In the fifth step, the foreign matter mixed in the organic layer detected in the fourth step (S4) or the foreign matter adhering to the organic layer surface is pushed in the lower direction of the organic layer, and the foreign matter is introduced to the organic layer surface. Avoid protruding.

  As shown in FIG. 5, in order to push the foreign material 2 into the lower part of the organic layer 1, it is only necessary to push it using a fine needle 17 having a flat tip. The diameter of the fine needle 17 is smaller than the inner diameter of the bank, and a needle having a sufficiently large diameter with respect to the foreign material 2 is used so that the foreign material 2 can be completely pushed in. The material of the needle is preferably a hard metal material such as tungsten or stainless steel.

  Specifically, as shown in FIG. 5A, the fine needle 17 is moved to a place where the organic layer 1 is mixed. The fine needle 17 is connected to a control device that can move to a predetermined position, and the tip of the needle 17 is moved to the surface of the organic layer 1 mixed with the foreign matter 2 with respect to the foreign matter 2 mixed in the organic layer 1. Let it stop. Then, as shown in FIG. 5B, since the tip of the needle 17 is stopped on the surface of the organic layer 1, the positional relationship between the organic layer 1 and the needle 17 is clarified, and the tip of the needle 17 is the organic layer. Set to stop at one surface.

  For example, the position of the surface of the organic layer 1 near the foreign material 2 is detected using a laser displacement meter, and the amount of movement of the needle 17 is controlled so that the needle 17 stops on the surface of the organic layer 1. Alternatively, a minute displacement detector is connected to the needle 17 to detect contact with the surface of the organic layer 1 and stop when the needle 17 contacts the surface of the organic layer.

  (6) In the sixth step (S6), an insulating material is applied to the portion where the foreign matter mixed in the organic layer in the fifth step (S5) or the foreign matter adhering to the organic layer surface is pushed into the lower part of the organic layer. The insulating part is locally formed with respect to the portion where the foreign object is pushed.

  As a method of locally applying the insulating material to the portion where the foreign matter 2 is pushed into the lower part of the organic layer, there are an application method such as an inkjet method, a dispenser method, a needle application method, and the like. Any of these coating methods can be applied. However, in the ink jet method and the dispenser method, when applying by discharging a solution, the coating material is spread and applied, and it is difficult to apply a minute amount. There is a possibility that the insulating region will spread.

  Compared to the ink jet method and the dispenser method, it is desirable to apply needle coating as a coating method capable of coating a minute amount of solution. In needle application, droplets are attached to a very fine application needle of several tens to several hundreds of micrometers, and the tip of the application needle is brought into contact with the workpiece, so that only the droplet attached to the tip of the needle is transferred and only a minute amount is applied. can do. However, when the normal needle application method is used, the application needle is pressed against the surface of the organic layer, so when the material adhering to the tip of the needle is transferred to the part where the foreign matter is embedded, the material adhering to the needle contact portion moves to the outer periphery. The solution is pushed out and spreads on the outer periphery of the needle tip.

  Therefore, when the insulating material is applied to the portion where the foreign material is embedded by needle application, the application material is preferably applied by a non-contact needle application method. Instead of applying the tip of the needle with the insulating material in contact with the part where the foreign material is embedded, the contact between the tip of the needle with the insulating material and the part where the foreign material is embedded is brought close to the contact. In this method, the insulating material is transferred to the surface of the organic layer. It is necessary to set the gap between the tip of the application needle and the surface where the foreign matter is embedded to a distance equal to or less than the thickness of the solution attached to the tip of the application needle.

  In order to perform this non-contact needle application, for example, a needle dispenser of Applied Microsystem Co., Ltd. may be used. If this apparatus is used, the position of the application needle can be arbitrarily changed, so that the needle can be applied in a non-contact manner. As shown in FIG. 6, if the insulating material is applied by non-contact needle coating, the insulating region 4 of the insulating material with respect to the foreign material 2 can be reduced, and the foreign material is embedded in the organic layer, so that the coating height is high. Therefore, the insulating portion 3 can be locally formed only in the portion where the foreign material 2 is embedded.

  The solution applied to the part where the foreign material is embedded is the same material as the insulating material formed on the substrate having the driving circuit in the first step, such as silicon resin, acrylic resin, polyimide resin, and novolac type phenol resin. A material such as the above may be used. Alternatively, the solution (organic material and solvent) applied in the third step may be used. In addition, it is preferable to apply the insulating material at a high concentration in order to limit the insulating region as much as possible, and to reduce the amount of the insulating material applied, and to reduce the spread of wetness after application.

After the insulating material is applied, only the portion reapplied with a CO ₂ laser, a spot lamp, or an ultra-small hot air heater is dried. Alternatively, the applied insulating material is dried by heating the entire substrate using a heating furnace.

  As described above, in the manufacturing process of the organic EL display, when a foreign substance is mixed in the organic layer or a foreign substance adheres to the surface of the organic layer, a short circuit due to the foreign substance can be repaired. According to the present invention, it is possible to manufacture an organic EL display with low power consumption by reducing leakage current and with little luminance unevenness at a high yield.

(Example)
FIG. 7A is a view showing an external appearance photograph of the foreign matter mixed in the organic layer.

  The size of the foreign material was about 10 μm. FIG. 7B shows a photograph of the appearance after the foreign matter is pushed in the lower direction of the organic layer with a fine needle having a flat tip at the tip.

  As a fine needle for pushing in the foreign matter, a needle obtained by processing tungsten into a diameter of 50 μm was used. The fine needle was lowered to the height of the surface of the organic layer around the area where the foreign matter was embedded, and the foreign matter was pushed in. As shown in FIG. 7, it can be seen that the foreign matter is pushed into the lower part of the organic layer and the shape of the foreign matter is changed. At this time, it has been confirmed from experiments that the first electrode is not destroyed by pushing in the foreign matter.

  FIG. 8 (a) shows an external view after applying the non-contact needle coating method to a region in which foreign matter is embedded in the lower part of the organic layer with a fine needle, and FIG. 8 (b) shows its cross-sectional profile. Show.

  In FIG. 8B, the horizontal scale is 5 μm, and the vertical scale is 100 nm. The profile of the cross section was measured using a contact-type step gauge. Application was performed using a needle-type dispenser of Applied Microsystem Co., Ltd. as the coating apparatus. The coating material was a polyfluorene polymer organic material, and a coating needle having a needle diameter of 30 μm was used, and the coating was performed with the gap between the surface of the coating needle and the surface of the region where foreign matter was buried below the organic layer approaching 2 μm. From this figure, it is confirmed that the coating is made at the place where the foreign matter is embedded. Further, FIG. 12B shows that the size of the coated region is a coating diameter of 32 μm and a coating height of 362 nm, and insulation can be performed locally.

  As described above, in the manufacturing process of the organic EL display, when foreign matter is mixed in the organic layer or foreign matter adheres to the surface of the organic layer, the foreign matter can be embedded and insulated. An organic EL display without a high yield can be manufactured.

  In the organic EL display manufacturing method of the present invention, when a foreign matter is mixed in the organic layer and a defect is formed, the foreign matter is pushed into the lower portion of the organic layer with a fine needle, and then an insulating material is locally applied. Therefore, it is possible to locally repair only the defective portion due to the foreign matter. Therefore, according to the present invention, in the manufacture of an organic EL display, it is possible to reduce the light emission darkening and reduce the power consumption by reducing the leakage current, and it is possible to manufacture the organic EL display with a high yield. .

  In addition to the method for manufacturing an organic EL display, the present invention can also be applied to the use for manufacturing a device that requires local repair by insulation.

DESCRIPTION OF SYMBOLS 1 Organic layer 2 Foreign material 3 Insulating part 4 Insulating area 5 Insulating part height 11 Bank 12 Substrate 13 Insulating film 14 First electrode 15 Second electrode 16 Sealing film 17 Needle

Claims (4)

A substrate, and a plurality of organic EL elements disposed on the substrate, wherein the organic EL element includes a first electrode formed on the substrate, an organic layer disposed on the first electrode, A method for producing an organic EL display comprising a second electrode disposed on an organic layer, comprising at least the following steps:
(1) forming an insulating film on the substrate;
(2) forming a bank defining an organic layer on the insulating film;
(3) applying and forming an organic layer in a region defined by the bank;
(4) detecting foreign matter mixed in the organic layer;
(5) a step of pushing in the foreign matter mixed in the organic layer in a lower direction of the organic layer;
(6) A step of forming an insulating portion by applying an insulating material to the foreign matter,
A method for producing an organic EL display, comprising: In the fifth step, the needle having a flat tip is pressed against the foreign matter, and the foreign matter is pushed down to the surface of the organic layer to embed the foreign matter under the organic layer.
The manufacturing method of the organic electroluminescent display of Claim 1.   The size of the said foreign material is a manufacturing method of the organic EL display of Claim 1 or 2 which is a magnitude | size below the thickness from the surface of an organic layer to the surface of a board | substrate. In the sixth step, the insulating material is applied to a region where foreign matter is embedded using an inkjet, a dispenser, or an application needle.
The manufacturing method of the organic electroluminescent display as described in any one of Claims 1-3.

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