JP2012094774A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP2012094774A JP2012094774A JP2010242639A JP2010242639A JP2012094774A JP 2012094774 A JP2012094774 A JP 2012094774A JP 2010242639 A JP2010242639 A JP 2010242639A JP 2010242639 A JP2010242639 A JP 2010242639A JP 2012094774 A JP2012094774 A JP 2012094774A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- type
- region
- buffer layer
- type channel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 54
- 239000010410 layer Substances 0.000 claims abstract description 375
- 108091006146 Channels Proteins 0.000 claims abstract description 67
- 108010075750 P-Type Calcium Channels Proteins 0.000 claims abstract description 57
- 108090000699 N-Type Calcium Channels Proteins 0.000 claims abstract description 34
- 102000004129 N-Type Calcium Channels Human genes 0.000 claims abstract description 34
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 150000001875 compounds Chemical class 0.000 claims abstract description 19
- 239000002356 single layer Substances 0.000 claims abstract description 10
- 230000004888 barrier function Effects 0.000 claims description 29
- 230000005669 field effect Effects 0.000 claims description 21
- 238000009792 diffusion process Methods 0.000 claims description 17
- 230000001629 suppression Effects 0.000 claims description 9
- 239000013078 crystal Substances 0.000 description 24
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 description 21
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 19
- 238000005530 etching Methods 0.000 description 15
- 230000002265 prevention Effects 0.000 description 14
- 239000012535 impurity Substances 0.000 description 13
- 238000000034 method Methods 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 9
- 239000000969 carrier Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 230000004048 modification Effects 0.000 description 7
- 238000012986 modification Methods 0.000 description 7
- 230000001681 protective effect Effects 0.000 description 7
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 230000015556 catabolic process Effects 0.000 description 6
- 238000002955 isolation Methods 0.000 description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000011701 zinc Substances 0.000 description 5
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 4
- 238000004088 simulation Methods 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- XCZXGTMEAKBVPV-UHFFFAOYSA-N trimethylgallium Chemical compound C[Ga](C)C XCZXGTMEAKBVPV-UHFFFAOYSA-N 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- RBFQJDQYXXHULB-UHFFFAOYSA-N arsane Chemical compound [AsH3] RBFQJDQYXXHULB-UHFFFAOYSA-N 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 238000001039 wet etching Methods 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- -1 GaAs compound Chemical class 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- BYDQGSVXQDOSJJ-UHFFFAOYSA-N [Ge].[Au] Chemical compound [Ge].[Au] BYDQGSVXQDOSJJ-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 2
- IBEFSUTVZWZJEL-UHFFFAOYSA-N trimethylindium Chemical compound C[In](C)C IBEFSUTVZWZJEL-UHFFFAOYSA-N 0.000 description 2
- YWWDBCBWQNCYNR-UHFFFAOYSA-N trimethylphosphine Chemical compound CP(C)C YWWDBCBWQNCYNR-UHFFFAOYSA-N 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 229910000070 arsenic hydride Inorganic materials 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- HQWPLXHWEZZGKY-UHFFFAOYSA-N diethylzinc Chemical compound CC[Zn]CC HQWPLXHWEZZGKY-UHFFFAOYSA-N 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0605—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits made of compound material, e.g. AIIIBV
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66446—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET]
- H01L29/66462—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET] with a heterojunction interface channel or gate, e.g. HFET, HIGFET, SISFET, HJFET, HEMT
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
- H01L29/7782—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with confinement of carriers by at least two heterojunctions, e.g. DHHEMT, quantum well HEMT, DHMODFET
- H01L29/7783—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with confinement of carriers by at least two heterojunctions, e.g. DHHEMT, quantum well HEMT, DHMODFET using III-V semiconductor material
- H01L29/7785—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with confinement of carriers by at least two heterojunctions, e.g. DHHEMT, quantum well HEMT, DHMODFET using III-V semiconductor material with more than one donor layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/80—Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier
- H01L29/802—Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier with heterojunction gate, e.g. transistors with semiconductor layer acting as gate insulating layer, MIS-like transistors
Abstract
【解決手段】化合物半導体からなる基板10上に、n型チャネルFET領域2とp型チャネルFET領域3とが併設されている。p型チャネルFET領域3において、チャネル層16の下面に接するバッファ層15が、チャネル層16よりも広いバンドギャップを有する第2バッファ層15Bだけで構成された単層構造となっている。さらに、第2バッファ層15Bは、チャネル層16と電子走行層13との間に設けられている。
【選択図】図10
Description
1.実施の形態(図1〜図16)
n型チャネルFET用のエピタキシャル結晶成長層の上に
p型チャネルFET用のエピタキシャル結晶成長層を形成した例
2.変形例(図17、図18)
p型チャネルFET用のエピタキシャル結晶成長層の上に
n型チャネルFET用のエピタキシャル結晶成長層を形成した例
[構成]
図1は、本発明の一実施の形態に係る半導体装置1の断面構成の一例を表すものである。半導体装置1は、化合物半導体系の電界効果トランジスタを含む半導体装置であり、具体的には、図1に示したように、同一の基板10上に、n型チャネルFETの形成された領域(以下「n型チャネルFET領域2」と称する。)と、p型チャネルFETの形成された領域(以下「p型チャネルFET領域3」と称する。)とを備えたものである。本実施の形態において、基板10は、GaAs基板である。
ところで、第1バッファ層15A、第2バッファ層15Bおよびチャネル層16のそれぞれの材料は、図3に示したような組み合わせとなっている。このとき、第2バッファ層15Bは、第1バッファ層15Aおよびチャネル層16よりも広いバンドギャップを有している。または、第2バッファ層15Bは、第1バッファ層15Aおよびチャネル層16よりも広いバンドギャップとなるような組成比となっている。これにより、第2バッファ層15Bとチャネル層16とのヘテロ接合界面には、価電子帯の不連続(バンドオフセット)が生じ、p型チャネルFETのキャリアであるホールのバッファ層15への拡散が抑制されている。つまり、第2バッファ層15Bは、ホール拡散抑制層としての役割を有している。
次に、本実施の形態の半導体装置1の製造方法の一例について説明する。なお、以下では、バッファ層15が第2バッファ層15Bだけで構成されている場合について説明する。
本実施の形態では、p型チャネルFET領域3において、チャネル層16の下面に接するバッファ層15が、チャネル層16よりも広いバンドギャップを有する第2バッファ層15Bを含む多層構造となっているか、または、第2バッファ層15Bだけで構成された単層構造となっている。これにより、バッファ層15とチャネル層16とのヘテロ接合界面に、価電子帯の不連続(バンドオフセット)が生じ、p型チャネルFETのキャリアであるホールのバッファ層15への拡散が抑制される。その結果、p型チャネルFETのオン抵抗を低減することができる。従って、p型チャネルFETのオン抵抗を低減するために、チャネルの厚膜化や、キャリアの高濃度化などをする必要がなくなるので、エンハンスメント型FETを容易に作製することが可能となる。
以上、実施の形態ならびにその変形例を挙げて本発明を説明したが、本発明は実施の形態等に限定されるものではなく、種々の変形が可能である。
Claims (7)
- 化合物半導体基板の上方にp型チャネル電界効果トランジスタ領域を備え、
前記p型チャネル電界効果トランジスタ領域は、
アンドープのバッファ層と、
前記バッファ層に接するp型のチャネル層と、
前記チャネル層内に互いに離間して形成されたp型のソース領域およびp型のドレイン領域と、
前記チャネル層の上方であって、かつ前記ソース領域と前記ドレイン領域との間に形成されたn型のゲート領域と
を有し、
前記バッファ層は、前記チャネル層よりも広いバンドギャップを有するホール拡散抑制層を含む多層構造となっているか、または、前記ホール拡散抑制層だけで構成された単層構造となっている
半導体装置。 - 前記化合物半導体基板の上方であって、かつ前記pチャネル電界効果トランジスタ領域とは異なる領域に、n型チャネル電界効果トランジスタ領域を備えた
請求項1に記載の半導体装置。 - 前記n型チャネル電界効果トランジスタ領域は、
アンドープの電子走行層と、
前記電子走行層にヘテロ接合し、かつ前記電子走行層にn型の電荷を供給するn型の障壁層と
を有する
請求項2に記載の半導体装置。 - 前記n型チャネル電界効果トランジスタ領域は、
前記障壁層内に形成されたp型のゲート領域と、
前記障壁層に接して形成されたソース電極およびドレイン電極と
を有する
請求項3に記載の半導体装置。 - 前記バッファ層、前記チャネル層および前記n型のゲート領域は、前記電子走行層および前記障壁層の上方に形成されている
請求項4に記載の半導体装置。 - 前記バッファ層は、前記ホール拡散抑制層だけで構成された単層構造となっており、
前記障壁層は、前記バッファ層に接して形成されている
請求項5に記載の半導体装置。 - 前記バッファ層、前記チャネル層および前記n型のゲート領域は、前記電子走行層と前記化合物半導体基板との間に形成されている
請求項4に記載の半導体装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010242639A JP2012094774A (ja) | 2010-10-28 | 2010-10-28 | 半導体装置 |
US13/278,798 US8698202B2 (en) | 2010-10-28 | 2011-10-21 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010242639A JP2012094774A (ja) | 2010-10-28 | 2010-10-28 | 半導体装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2012094774A true JP2012094774A (ja) | 2012-05-17 |
Family
ID=46063521
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010242639A Pending JP2012094774A (ja) | 2010-10-28 | 2010-10-28 | 半導体装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8698202B2 (ja) |
JP (1) | JP2012094774A (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014239201A (ja) * | 2013-05-08 | 2014-12-18 | ソニー株式会社 | 半導体装置、アンテナスイッチ回路、および無線通信装置 |
CN105556678B (zh) * | 2013-09-30 | 2018-04-10 | Hrl实验室有限责任公司 | 具有高阈值电压和低导通电阻的常关型iii族氮化物晶体管 |
US9437724B2 (en) * | 2014-04-21 | 2016-09-06 | Panasonic Intellectual Property Management Co., Ltd. | Semiconductor device and method of manufacturing the semiconductor device |
US9299615B1 (en) * | 2014-12-22 | 2016-03-29 | International Business Machines Corporation | Multiple VT in III-V FETs |
US9412744B1 (en) * | 2015-01-30 | 2016-08-09 | International Business Machines Corporation | III-V CMOS integration on silicon substrate via embedded germanium-containing layer |
US9385001B1 (en) * | 2015-03-17 | 2016-07-05 | Toshiba Corporation | Self-aligned ITO gate electrode for GaN HEMT device |
US9923088B2 (en) * | 2016-07-08 | 2018-03-20 | Qorvo Us, Inc. | Semiconductor device with vertically integrated pHEMTs |
US11349023B2 (en) | 2019-10-01 | 2022-05-31 | Taiwan Semiconductor Manufacturing Company, Ltd. | Integration of p-channel and n-channel E-FET III-V devices without parasitic channels |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62209866A (ja) * | 1986-03-10 | 1987-09-16 | Nec Corp | 半導体装置 |
US5479033A (en) * | 1994-05-27 | 1995-12-26 | Sandia Corporation | Complementary junction heterostructure field-effect transistor |
JPH10313096A (ja) * | 1997-05-14 | 1998-11-24 | Nec Corp | 相補型半導体装置とその製造方法 |
JPH11150264A (ja) * | 1997-09-12 | 1999-06-02 | Sony Corp | 半導体装置およびその製造方法ならびに無線通信装置 |
JP2007335586A (ja) * | 2006-06-14 | 2007-12-27 | Sony Corp | 半導体集積回路装置および半導体集積回路装置の製造方法 |
JP2008060359A (ja) * | 2006-08-31 | 2008-03-13 | Sony Corp | 化合物半導体デバイス |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06314668A (ja) * | 1993-04-30 | 1994-11-08 | Fujitsu Ltd | プラズマエッチング方法及びプラズマエッチング装置 |
US6365925B2 (en) | 1997-09-12 | 2002-04-02 | Sony Corporation | Semiconductor device |
JP2001217257A (ja) * | 2000-01-31 | 2001-08-10 | Sony Corp | 半導体装置およびその製造方法 |
JP3790500B2 (ja) * | 2002-07-16 | 2006-06-28 | ユーディナデバイス株式会社 | 電界効果トランジスタ及びその製造方法 |
JP2007194588A (ja) * | 2005-12-20 | 2007-08-02 | Sony Corp | 電界効果トランジスタ及びこの電界効果トランジスタを備えた半導体装置並びに半導体装置の製造方法 |
-
2010
- 2010-10-28 JP JP2010242639A patent/JP2012094774A/ja active Pending
-
2011
- 2011-10-21 US US13/278,798 patent/US8698202B2/en not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62209866A (ja) * | 1986-03-10 | 1987-09-16 | Nec Corp | 半導体装置 |
US5479033A (en) * | 1994-05-27 | 1995-12-26 | Sandia Corporation | Complementary junction heterostructure field-effect transistor |
JPH10313096A (ja) * | 1997-05-14 | 1998-11-24 | Nec Corp | 相補型半導体装置とその製造方法 |
JPH11150264A (ja) * | 1997-09-12 | 1999-06-02 | Sony Corp | 半導体装置およびその製造方法ならびに無線通信装置 |
JP2007335586A (ja) * | 2006-06-14 | 2007-12-27 | Sony Corp | 半導体集積回路装置および半導体集積回路装置の製造方法 |
JP2008060359A (ja) * | 2006-08-31 | 2008-03-13 | Sony Corp | 化合物半導体デバイス |
Also Published As
Publication number | Publication date |
---|---|
US20120126291A1 (en) | 2012-05-24 |
US8698202B2 (en) | 2014-04-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US11031399B2 (en) | Semiconductor device and manufacturing method of the same | |
KR101656531B1 (ko) | 반도체 장치 및 그 제조 방법 | |
JP5469098B2 (ja) | 電界効果トランジスタ及びその製造方法 | |
US7816707B2 (en) | Field-effect transistor with nitride semiconductor and method for fabricating the same | |
US8866192B1 (en) | Semiconductor device, high electron mobility transistor (HEMT) and method of manufacturing | |
JP2012094774A (ja) | 半導体装置 | |
US7786509B2 (en) | Field-effect transistor and method of making same | |
US20090230482A1 (en) | Semiconductor device and manufacturing method thereof | |
US8896028B2 (en) | Semiconductor device, manufacturing method thereof, protective element, and manufacturing method thereof | |
JP2013149732A (ja) | へテロ接合電界効果型トランジスタおよびその製造方法 | |
KR101172857B1 (ko) | 인헨스먼트 노멀리 오프 질화물 반도체 소자 및 그 제조방법 | |
JP2015008244A (ja) | ヘテロ接合電界効果型トランジスタおよびその製造方法 | |
EP4220735A1 (en) | Enhancement-mode hemt and manufacturing process of the same | |
KR20180106026A (ko) | 게이트 누설 전류가 감소된 고 전자 이동도 트랜지스터 | |
TWI545660B (zh) | 高電子移動率電晶體 | |
JP2011166005A (ja) | 窒化物半導体を用いた半導体装置およびその製造方法 | |
JP2010267817A (ja) | 電界効果トランジスタ | |
JP2012023321A (ja) | 半導体トランジスタおよびその製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20131009 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20141014 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20141016 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20141118 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20150114 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20150512 |