JP2012094693A - Wiring board and method for manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wiring board capable of extremely easily connecting a plurality of connection terminals to another wiring board, and a method for manufacturing the same.SOLUTION: A wiring board 11 having a board 21 in which at least one surface of a front surface and a back surface is a mounting surface 21a of various kinds of parts, and a plurality of connection terminals 31 extended from at least one side edge portion of the board 21 and bent in a direction perpendicular to the surface of the board 21, the wiring board 11 to be connected by inserting the plurality of connection terminals 31 into a plurality of through-holes formed in another wiring board juxtaposed so as to be spaced from the board 21, comprises: insulating holding members 37 composed of an insulating material, provided in the plurality of connection terminals 31 at portions except tip end portions to be inserted into the through-holes in an arrangement direction of the connection terminals 31, for holding the connection terminals 31 in an arranged state.

Description

  The present invention relates to a wiring board on which various electric / electronic components are mounted and a method for manufacturing the same.

  Conventionally, a metal core substrate in which an insulating layer is formed on the surface of a metal plate to be a core, and a circuit pattern is formed on the upper surface, and a technique for exposing an end of the metal plate and using it as an external connection terminal Is known (see, for example, Patent Document 1).

  It is also known that a metal core substrate having a part of the metal core as a terminal is used as a terminal by bending a part of the metal core (see, for example, Patent Document 2).

JP 2006-253428 A JP 2007-325343 A

  By the way, in the wiring board, high-density mounting is possible by providing a connection terminal standing and extending on the mounting surface and connecting the connection terminal to another wiring board in parallel.

  However, when a part of the metal core in the metal core substrate is bent and used as a terminal, if the number of terminals is large, the arrangement of the terminals is disturbed due to variations in processing accuracy at the time of terminal formation, leading to through holes in other wiring boards. It becomes difficult to insert and connect the terminals smoothly. For this reason, the complicated assembly operation | work of correcting the arrangement | sequence of a terminal using a jig | tool and inserting in a through hole was required.

  The present invention has been made in view of the above-described circumstances, and an object thereof is to provide a wiring board capable of connecting a plurality of connection terminals to another wiring board very easily and a method for manufacturing the same. is there.

In order to achieve the above-described object, a wiring board according to the present invention is characterized by the following (1) to (4).
(1) a substrate on which at least one of the front surface and the back surface is a mounting surface for various components;
A plurality of connection terminals extending from at least one side edge of the substrate and bent in a direction perpendicular to the surface of the substrate;
The plurality of connection terminals are wiring boards that are inserted and connected to a plurality of through holes formed in another wiring board that is arranged in parallel to the board at an interval,
In the plurality of connection terminals, a holding member made of an insulating material is provided along the arrangement direction of the connection terminals in a portion excluding the tip portion inserted into the through hole, and the connection terminals are formed by the holding member. Be kept in an aligned state.
(2) In the wiring board configured as described in (1) above, the holding member is formed with a support protrusion that protrudes in a connecting direction of the connection terminal to the other wiring board and contacts the other wiring board. Being.
(3) In the wiring board having the above configuration (1) or (2), the holding member protrudes in the direction of connection to the other wiring board rather than the connection terminal, and is formed on the other wiring board. Have a guide pin that can be inserted into the guide hole.
(4) In the array substrate having the structure of any one of (1) to (3), a recess is formed in at least one side edge of the substrate, and the plurality of connection terminals extend from a side surface of the recess. thing.

In the wiring board having the configuration (1), since the plurality of connection terminals are bent in a direction perpendicular to the surface of the board, the connection terminals are inserted into through holes of another wiring board and soldered. Can be easily connected. At this time, since the plurality of connection terminals are held by the holding member and maintained in an aligned state, the disturbance of the arrangement of the connection terminals can be suppressed as much as possible, and the through of another wiring board can be performed without using a jig. It can be smoothly inserted into the hole, and the assembly work of other wiring boards can be facilitated.
In the wiring board having the configuration (2), other wiring boards can be supported by the supporting projections and positioned at predetermined intervals without using components such as spacers or jigs. Therefore, the manufacturing cost can be reduced by shortening the connection work time of other wiring boards.
Moreover, a clearance gap can be formed in the wiring board side in another wiring board by a support protrusion. Thereby, it is possible to smoothly inspect whether or not a good fillet shape is formed at a soldered portion between the other wiring board and the connection terminal.
In the wiring board having the above configuration (3), when the other wiring boards are arranged side by side, the guide pins of the holding member enter the guide holes so that the other wiring boards can be brought close to each other while being positioned at a predetermined position. This makes it possible to insert the connection terminal into the through hole very smoothly. As a result, when other wiring boards are arranged side by side, it is possible to prevent the connection terminals from interfering with the wiring board, thereby reliably preventing problems such as damage to the through holes and breakage of the connection terminals. Connection reliability can be further increased.
In the wiring board having the configuration of the above (4), since the plurality of connection terminals extend from the side surface portion of the recess formed in at least one side edge portion of the board, small wiring boards can be juxtaposed. Can be miniaturized. Further, even when the connection terminal is accommodated in a component such as a connector, for example, the component can be disposed in the recess, so that the height dimension can be suppressed as compared with the case where the component is disposed on the mounting surface. Therefore, it is suitable as a wiring board to be mounted on a device that is required to be downsized.

In order to achieve the above-described object, the method for manufacturing a wiring board according to the present invention is characterized by the following (5).
(5) A substrate in which at least one of the front and back surfaces is a mounting surface for various components, and a connection that extends from at least one side edge of the substrate and is bent in a direction perpendicular to the surface of the substrate. A method of manufacturing a wiring board comprising terminals,
A substrate forming step of forming the substrate by laminating an insulating layer on the front and back of the plurality of aligned metal pieces to be the connection terminals;
A holding member forming step of cutting the insulating layer at the connection terminal forming portion made of a metal piece and forming a long holding member along the arrangement direction of the connecting terminals at the intermediate portion of the connecting terminal from the insulating layer. When,
A connection terminal processing step of bending the connection terminal in a direction perpendicular to the surface of the substrate;
Including.

  In the method for manufacturing a wiring board having the configuration of (5), the wiring board has a plurality of bent connection terminals extending from at least one side edge of the board, and other wiring boards can be arranged in parallel by these connection terminals. A simple wiring board can be easily manufactured. The manufactured wiring board is maintained in a state where the connection terminals are aligned by the holding member, and can be smoothly inserted into the through hole of the other wiring board, facilitating the assembly work of the other wiring board. It can be designed.

  ADVANTAGE OF THE INVENTION According to this invention, the wiring board which can connect a some connection terminal to another wiring board very easily, and its manufacturing method can be provided.

  The present invention has been briefly described above. Further, details of the present invention will be further clarified by reading through the modes for carrying out the invention described below with reference to the accompanying drawings.

It is a figure explaining the wiring board which concerns on embodiment of this invention, (a) is a whole perspective view of a wiring board, (b) is an enlarged side view of the B section of (a). It is a partial sectional view of a wiring board concerning an embodiment of the present invention. It is sectional drawing which shows the structure of the board | substrate which comprises a wiring board. It is a top view of a part of wiring board. It is a side view of a part of a wiring board. It is a whole perspective view of the wiring board in which the other wiring board was arranged in parallel. It is sectional drawing of a part of wiring board in which the other wiring board was arranged in parallel. It is a side view of a part of a wiring board in which other wiring boards are arranged in parallel. FIG. 6 is a side view of a part of the wiring board showing a state in which the connection terminal is inserted into the through hole and another wiring board is arranged. It is a top view of the other wiring board explaining the position shift of the connection terminal with respect to a through hole. It is a side view of a part of a wiring board according to a modification. It is a top view of a part of another wiring board arranged in parallel with the wiring board according to the modification. FIG. 10 is a side view of a part of a wiring board according to a modified example showing a state in which the connection terminal is inserted into the through hole and another wiring board is arranged. It is a partial top view which shows the modification of a wiring board. It is a partial top view which shows the modification of a wiring board. It is a figure explaining the manufacturing process of the wiring board of this invention, Comprising: (a)-(f) is the top view and sectional drawing of a wiring board in the middle of manufacture, respectively. It is a figure explaining the manufacturing process of the wiring board of this invention, Comprising: (a)-(e) is the top view and sectional drawing of a wiring board in the middle of manufacture, respectively.

  Hereinafter, examples of embodiments according to the present invention will be described with reference to the drawings.

  1A and 1B are diagrams for explaining a wiring board according to an embodiment of the present invention. FIG. 1A is an overall perspective view of the wiring board, FIG. 1B is an enlarged side view of a portion B in FIG. FIG. 3 is a cross-sectional view showing a structure of a substrate constituting the wiring board, FIG. 4 is a plan view of a part of the wiring board, and FIG. 5 is a part of the wiring board. FIG.

  As shown in FIGS. 1 and 2, the wiring board 11 of this embodiment includes a board 21 and a plurality of connection terminals 31 provided on the board 21.

  As shown in FIG. 3, the substrate 21 has a plate-like metal core (high thermal conductive layer) 22 formed of copper or a copper alloy at the center in the thickness direction. In addition, an insulating layer 23 made of a synthetic resin having thermosetting properties and insulating properties is formed. A circuit pattern 24 is formed on the surface of the insulating layer 23, and the surface is covered with a resist layer 25. That is, the substrate 21 is a metal core substrate that is provided with the metal core 22 and is excellent in heat dissipation and heat uniformity. As shown in FIG. 2, the front and back surfaces of the substrate 21 are the mounting surface 21a having the circuit pattern 24. Various electrical / electronic components 12 are mounted on the mounting surface 21a. The heat of the electric / electronic component 12 and the like generated on the substrate 21 which is the metal core substrate is smoothly heated by the metal core 22 and radiated to the outside.

  As shown in FIG. 1A and FIG. 4, the wiring board 11 of this embodiment has recesses 26 formed on both side edges of the substrate 21, and the side portions 26 a in the longitudinal direction of these recesses 26. A plurality of connection terminals 31 are extended in an aligned state. These connection terminals 31 are electrically connected to the circuit pattern 24 by, for example, through holes (not shown) formed in the substrate 21.

  The connection terminal 31 is formed from the same conductive metal material as the metal core 22, such as copper or copper alloy, and is sandwiched and fixed by the insulating layer 23 and formed in the same layer as the metal core 22. .

  As shown in FIGS. 2 and 4, these connection terminals 31 have a fixing portion 32 fixed to the substrate 21 and a terminal portion 33 extending from the side surface portion 26 a of the recess 26. The terminal portion 33 is bent in an upward direction perpendicular to the surface of the substrate 21. Further, the bent portion of the terminal portion 33 of the connection terminal 31 is configured as a curved portion 34 that is curved in an arc shape when viewed from the side.

  The connection terminal 31 is provided with a long insulating holding member (holding member) 37 along the arrangement direction of the terminal portions 33. Terminal portions 33 of the aligned connection terminals 31 are fixed to the insulating holding member 37, whereby the connection terminal 31 is held in an aligned state by the insulating holding member 37.

  Further, the insulating holding member 37 is formed with support protrusions 38 protruding upward at upper portions at both ends thereof. As shown in FIGS. 1B and 5, the support protrusion 38 is formed at a height lower than the tip of the terminal portion 33 of the connection terminal 31, and another wiring board is attached to the wiring board 11 of the present invention. When the connection terminals 31 are connected in parallel and connected to another wiring board, the other wiring board is supported and the two wiring boards are positioned at a predetermined interval.

  The insulating holding member 37 is made of a synthetic resin having the same thermosetting and insulating properties as the insulating layer 23 constituting the substrate 21.

  6 is an overall perspective view of a wiring board in which other wiring boards are arranged side by side, FIG. 7 is a cross-sectional view of a part of the wiring board in which other wiring boards are arranged in parallel, and FIG. It is a side view of a part of the printed wiring board.

  As shown in FIGS. 6 to 8, the terminal portion 33 of the connection terminal 31 of the wiring board 11 is connected by soldering to another wiring board 41 that is arranged in parallel with the board 21 at intervals.

  As described above, when another wiring board 41 is arranged side by side on the wiring board 11, first, as shown in FIG. 9, the plurality of connection terminals 31 of the wiring board 11 are inserted into the through holes 41 a of the other wiring board 41. Let

  At this time, if the arrangement of the terminal portions 33 of the plurality of connection terminals 31 is disturbed, as shown in FIG. 10, the distal end portion of the connection terminal 31 with respect to the position of the through hole 41 a of the other wiring substrate 41. The position is shifted, and it is difficult to smoothly insert and connect the terminal portion 33 of the connection terminal 31 to the through hole 41a. For this reason, the complicated assembly operation | work of correcting the arrangement | sequence of the terminal part 33 of the connection terminal 31 using a jig | tool and inserting in the through hole 41a will be needed.

  However, according to this embodiment, since the terminal portions 33 of the plurality of connection terminals 31 are held by the insulating holding member 37, the terminal portions 33 of the connection terminals 31 can be maintained in an aligned state. Thereby, the disorder of the arrangement of the terminal portions 33 of the connection terminals 31 can be suppressed as much as possible, and can be smoothly inserted into the through hole 41a of the other wiring board 41 without using a jig. The assembling work of 41 can be facilitated.

  Then, as described above, when the terminal portion 33 of the connection terminal 31 is inserted into the through hole 41a of the other wiring board 41, the support protrusion 38 of the insulating holding member 37 contacts the back surface of the other wiring board 41 (see FIG. 8). As a result, the other wiring board 41 is restricted from moving toward the base side of the terminal portion 33 from the contact position of the support protrusion 38, and the other wiring board 41 has a predetermined relationship with respect to the board 21 of the wiring board 11. They are positioned and arranged at spaced positions.

  Here, when another wiring board 41 is arranged side by side on the wiring board 11, the other wiring board 41 is soldered to the board 21 in a state where the wiring board 11 is positioned at a predetermined interval and connected to the terminal portion 33. It is necessary to let Therefore, in the wiring board 11 provided with the connection terminal 31 without the insulating holding member 37 having the support protrusion 38, a component such as a spacer or a jig is used in the connection process between the terminal portion 33 and another wiring board 41 by soldering. The other wiring board 41 must be held at a predetermined position with respect to the board 21.

  On the other hand, according to the wiring board 11 provided with the insulating holding member 37 having the support protrusions 38 as described above, other wiring boards 41 can be attached to the support protrusions 38 without using components such as spacers or jigs. It can be supported in a state where it is positioned at a position spaced apart from the substrate 21 of the wiring substrate 11 by a predetermined distance. As a result, when another wiring board 41 is arranged side by side on the wiring board 11, the other wiring board 41 is easily placed at a predetermined distance from the wiring board 11 and soldered and connected. The terminal 31 can be connected. Therefore, the manufacturing cost can be reduced by shortening the connection work time of the other wiring board 41 and the connection reliability can be increased.

  In addition, it is preferable to use a rigid prepreg that constitutes the insulating layer 23 to be the insulating holding member 37. By using such a rigid prepreg, the connection terminals 31 are firmly connected to each other by the insulating holding member 37. It can be fixed and maintained in good alignment.

  Further, a gap can be formed on the wiring board 11 side of the other wiring board 41 by the support protrusion 38. Accordingly, it is possible to smoothly inspect whether or not a good fillet shape is formed at a soldered portion between the other wiring board 41 and the connection terminal 31.

Next, a modified example of the wiring board of the present invention will be described.
A wiring board 11B shown in FIG. 11 is formed by forming a plurality of guide pins 39 in the vicinity of both ends of the insulating holding member 37 so as to protrude in the direction of connection to the wiring board 41B other than the connection terminal 31. These guide pins 39 are formed in a tapered shape that gradually narrows toward the tip. A support protrusion 38 is provided outside the guide pin 39, and the guide pin 39 and the support protrusion 38 are formed as a continuous member.

  As shown in FIG. 12, guide holes 41b are formed at both ends of the array of through holes 41a as another wiring board 41B arranged in parallel with the wiring board 11B having the insulating holding member 37 having the guide pins 39. ing.

  When another wiring board 41B having the guide hole 41b is arranged side by side on the wiring board 11B, first, the guide pin 39 of the insulating holding member 37 enters the guide hole 41b. As a result, as shown in FIG. 13, the other wiring board 41B comes close to the wiring board 11 while being positioned at a predetermined position by inserting the guide pins 39 into the guide holes 41b. 33 is inserted into the through hole 41a very smoothly.

  Therefore, according to the wiring board 11B in which the guide pins 39 are formed on the insulating holding member 37, it is possible to prevent the connection terminal 31 from interfering with the wiring board 41B when another wiring board 41B is arranged in parallel. Therefore, problems such as damage to the through hole 41a and breakage of the connection terminal 31 can be reliably prevented, and connection reliability can be further improved.

  Further, according to the wiring boards 11 and 11B described above, since the connection terminal 31 extends from the side surface portion 26a of the recess 26, the connection terminal 31 is compared with the case where the connection terminal 31 is provided on the mounting surface 21a. By minimizing the occupation of the mounting surface 21a, the size can be reduced. As a result, it is possible to increase the capacity to be accommodated in a device or the like and to be extremely suitable as a wiring board to be mounted on a device that is required to be reduced in size and thickness.

  Furthermore, according to the wiring boards 11 and 11B, the connection terminal 31 is bent in a direction orthogonal to the surface of the substrate 21 from the side surface portion 26a of the recess 26, and the bent portion is curved in an arc shape in a side view. Since the bending portion 34 is used, the bending portion 34 can absorb the external force and stress acting on the connection terminal 31 satisfactorily. For example, even when a device containing the wiring board 11 is mounted on a vehicle such as an automobile, vibrations during running and the like are smoothly absorbed by the curved portion 34, and when the connection terminal 31 is connected to other components or the like. Even if there is a dimensional deviation, the stress caused by the dimensional deviation is smoothly absorbed by the curved portion 34.

  As described above, since the curved portion 34 is formed on the connection terminal 31, an unreasonable force acts on the connection portion 31 where the connection terminal 31 is fixed to the substrate 21 or the connection portion where the terminal portion 33 of the connection terminal 31 is soldered. Can be eliminated.

  In the wiring boards 11 and 11B described above, the case where the connection terminal 31 separated from the metal core 22 is provided as an example, but the connection terminal 31 is formed integrally with the metal core 22 as shown in FIG. May be. In the wiring board 11 </ b> C having the connection terminals 31 formed integrally with the metal core 22, the connection terminals 31 are formed on a part of the metal core 22, and these connection terminals 31 are laterally extended from the side surface portion 26 a of the recess 26. Extend. In the connection terminal 31 formed integrally with the metal core 22 in this manner, for example, the metal core 22 can be used as a ground and the connection terminal 31 can be easily used as a ground terminal.

  Further, as shown in FIG. 15, at least two connection terminals 31 a among the plurality of connection terminals 31 may be integrally formed as a wiring substrate 11 </ b> D so as to be electrically connected inside the substrate 21. Thus, if at least two of the connection terminals 31 are configured to be electrically connected, it is necessary to route a circuit pattern for connecting the two connection terminals on the surface of the substrate. Therefore, the space for mounting various components on the board can be reduced, and the wiring board can be reduced in size.

  Next, a case of manufacturing a wiring board will be described by taking as an example a structure having a connection terminal separated from a metal core.

  FIG. 16 is a diagram for explaining a manufacturing process of a wiring board, and (a) to (f) are a plan view and a cross-sectional view of the wiring board in the middle of manufacturing.

<Metal core processing process>
First, as shown in FIG. 16A, an opening 51 having a plurality of metal pieces 22 a to be the fixing portion 32 and the terminal portion 33 of the connection terminal 31 by pressing the flat metal core 22. Form. At this time, the plurality of metal pieces 22 a are connected to a portion that becomes the tip portion of the terminal portion 33.

<Masking process>
Next, as shown in FIG.16 (b), the heat resistant masking tape 52 is affixed on the front and back of the location used as the front-end | tip part of the terminal part 33 in the metal piece 22a.

<Substrate formation process>
Next, the front and back surfaces of the metal core 22 are roughened by, for example, sandblasting, and then, as shown in FIG. 16C, the insulating layer 23 is laminated on the front and back surfaces of the metal core 22 to form the substrate 21. To do. Thereby, the opening 51 is closed by the insulating layer 23. At this time, since the connecting portion of the metal piece 22a which is the tip portion of the terminal portion 33 is protected by the masking tape 52, roughening due to sandblasting is prevented and the insulating layer 23 is attached. Absent.

<Insulation holding member forming step>
As shown in FIG. 16 (d), the insulating layer 23 is cut by spotting or the like to form the insulating holding member 37 made of the insulating layer 23, and the portion other than the insulating holding member 37 at the location where the terminal portion 33 is formed The insulating layer 23 is removed, and the masking tape 52 is peeled off to expose the connection portion of the metal piece 22a.

  At this time, a portion to be the support protrusion 38 is formed on the insulating holding member 37. Further, when the guide pin 39 is formed on the insulating holding member 37, a portion that becomes the guide pin 39 when the insulating layer 23 is processed is also formed.

<Connecting terminal formation process>
And as shown in FIG.16 (e), processing, such as press processing or cutting using a router, is given to the connection location of the exposed metal piece 22a, and the front-end | tip part of the terminal part 33 is formed. Thereafter, the tip of the terminal portion 33 of the formed connection terminal 31 is plated.

<Connecting terminal machining process>
Finally, as shown in FIG. 16F, the terminal portion 33 of the connection terminal 31 is formed into a predetermined shape by pressing or the like. Specifically, the bending portion 34 is formed by bending the substrate 21 toward one surface and bending the bent portion.

  Through the above steps, the front and back surfaces are the mounting surfaces 21a, and the wiring substrate 11 in which the connection terminals 31 that are integrally held and arranged by the insulating holding members 37 extend from the side edge portions of the substrate 21 can be easily obtained. Can be manufactured.

  In the above manufacturing process, the case where a part of the metal core 22 is used as the connection terminal 31 has been described as an example. However, a plurality of connection terminals 31 formed separately may be used. In this case, in the substrate forming step, the connection terminals 31 are aligned at predetermined positions, the tip portion is masked with the masking tape 52, and the insulating layer 23 is laminated. In this case, processing such as pressing in the connection terminal forming step or cutting using a router is not necessary.

  Next, the case where the wiring board 11 having a structure in which the connection terminals 31 are integrally formed on the metal core 22 (see FIG. 14) will be described.

  FIG. 17 is a diagram for explaining a manufacturing process of a wiring board. FIGS. 17A to 17E are a plan view and a cross-sectional view of the wiring board in the process of manufacturing.

<Metal core processing process>
First, as shown in FIG. 17A, by pressing the flat metal core 22, a plurality of metal pieces 22 a that become the fixing portions 32 and the terminal portions 33 of the connection terminals 31 are removed from the metal core 22. An extended opening 51 is formed.

<Masking process>
Next, as shown in FIG. 17B, a heat-resistant masking tape 52 is attached to the front and back of the portion that becomes the tip of the terminal portion 33 in the metal piece 22a.

<Substrate formation process>
Next, the front and back surfaces of the metal core 22 are roughened by, for example, sandblasting, and then, as shown in FIG. 17C, the insulating layer 23 is laminated on the front and back surfaces of the metal core 22 to form the substrate 21. To do. Thereby, the opening 51 is closed by the insulating layer 23. At this time, since the portion which becomes the tip portion of the terminal portion 33 is protected by the masking tape 52, roughening due to sandblasting is prevented and the insulating layer 23 is not attached.

<Insulation holding member forming step>
As shown in FIG. 17 (d), the insulating layer 23 is cut by spotting or the like to form the insulating holding member 37 made of the insulating layer 23, and the portion other than the insulating holding member 37 at the location where the terminal portion 33 is formed. The insulating layer 23 is removed and the masking tape 52 is peeled off to expose the tip of the metal piece 22a.

  At this time, a portion to be the support protrusion 38 is formed on the insulating holding member 37. Further, when the guide pin 39 is formed on the insulating holding member 37, a portion that becomes the guide pin 39 when the insulating layer 23 is processed is also formed.

<Connecting terminal machining process>
Thereafter, the tip portion of the terminal portion 33 of the formed connection terminal 31 is plated, and as shown in FIG. 17E, the terminal portion 33 of the connection terminal 31 is formed into a predetermined shape by pressing or the like. Specifically, the bending portion 34 is formed by bending the substrate 21 toward one surface and bending the bent portion.

  Through the above steps, the front and back surfaces are the mounting surfaces 21a, and the wiring substrate 11 in which the connection terminals 31 that are integrally held and arranged by the insulating holding members 37 extend from the side edge portions of the substrate 21 can be easily obtained. Can be manufactured.

  In addition, this invention is not limited to embodiment mentioned above, A deformation | transformation, improvement, etc. are possible suitably. In addition, the material, shape, dimensions, number, arrangement location, and the like of each component in the above-described embodiment are arbitrary and are not limited as long as the present invention can be achieved.

11 Wiring board 12 Electrical / electronic components (components)
21 Substrate 21a Mounting surface 22 Metal core (high thermal conductivity layer)
22a Metal piece 31 Connection terminal 34 Bending portion 37 Insulating holding member (holding member)
38 Support projection 39 Guide pin 41 Other wiring board 41a Through hole 41b Guide hole

Claims (5)

A substrate on which at least one of the front surface and the back surface is a mounting surface for various components;
A plurality of connection terminals extending from at least one side edge of the substrate and bent in a direction perpendicular to the surface of the substrate;
The plurality of connection terminals are wiring boards that are inserted and connected to a plurality of through holes formed in another wiring board that is arranged in parallel to the board at an interval,
In the plurality of connection terminals, a holding member made of an insulating material is provided along the arrangement direction of the connection terminals in a portion excluding the tip portion inserted into the through hole, and the connection terminals are formed by the holding member. A wiring board characterized by being held in an aligned state.   The wiring board according to claim 1, wherein the holding member is formed with a support protrusion that protrudes in a connecting direction of the connection terminal to the other wiring board and abuts on the other wiring board. .   2. The holding member includes a guide pin that protrudes in a connecting direction to the other wiring board from the connection terminal and can be inserted into a guide hole formed in the other wiring board. Or the wiring board of Claim 2.   4. The arrangement according to claim 1, wherein a recess is formed in at least one side edge of the substrate, and the plurality of connection terminals extend from a side surface of the recess. substrate. A substrate having at least one of a front surface and a back surface as a mounting surface for various components; and a connection terminal extending from at least one side edge of the substrate and bent in a direction perpendicular to the surface of the substrate. A method for manufacturing a wiring board comprising:
A substrate forming step of forming the substrate by laminating an insulating layer on the front and back of the plurality of aligned metal pieces to be the connection terminals;
A holding member forming step of cutting the insulating layer at the connection terminal forming portion made of a metal piece and forming a long holding member along the arrangement direction of the connecting terminals at the intermediate portion of the connecting terminal from the insulating layer. When,
A connection terminal processing step of bending the connection terminal in a direction perpendicular to the surface of the substrate;
A method for manufacturing a wiring board, comprising:

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