JP2012094589A - Laminated solid electrolytic capacitor - Google Patents

Laminated solid electrolytic capacitor Download PDF

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JP2012094589A
JP2012094589A JP2010238635A JP2010238635A JP2012094589A JP 2012094589 A JP2012094589 A JP 2012094589A JP 2010238635 A JP2010238635 A JP 2010238635A JP 2010238635 A JP2010238635 A JP 2010238635A JP 2012094589 A JP2012094589 A JP 2012094589A
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anode
cathode
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solid electrolytic
electrolytic capacitor
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JP5601711B2 (en
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Kiyobumi Aoki
清文 青木
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Nichicon Corp
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Abstract

PROBLEM TO BE SOLVED: To provide a laminated solid electrolytic capacitor that can more reliably prevent a conductive adhesive from adhering to anode terminals via end faces of an insulator.SOLUTION: The laminated solid electrolytic capacitor having a laminate comprising a plurality of laminated capacitor elements, an anode terminal 9 on one side connected to anode parts 7 projecting from one side of the laminate, an anode terminal 9' on the other side connected to anode parts 7' projecting from the other side of the laminate, a coupling part 11 connecting the anode terminal 9 on the one side and the anode terminal 9' on the other side, and cathode terminals 10, 10' connected to a cathode comprising cathode parts of the plurality of capacitor elements further includes a first insulator 12 covering not only lamination surfaces of the cathode terminals 10, 10' and clearances between the coupling part 11 and the cathode terminals 10, 10' but also clearances between the cathode terminals 10, 10' and the anode terminals 9, 9' on the one side and the other side.

Description

本発明は、積層型固体電解コンデンサに関する。   The present invention relates to a multilayer solid electrolytic capacitor.

近年の電子機器の高周波化により、固体電解コンデンサは低ESR、低ESLであることが求められている。本件出願人は、積層型固体電解コンデンサの端子構造について実験を進めた結果、一方側および他方側に対向配置したリードフレームの陽極端子同士を導電性部材(連結部)で直接接続することによって、ESRおよびESLをより低減した構造を提案している(例えば、特許文献1参照)。   With the recent increase in frequency of electronic devices, solid electrolytic capacitors are required to have low ESR and low ESL. As a result of proceeding with the experiment on the terminal structure of the multilayer solid electrolytic capacitor, the applicant of the present application directly connected the anode terminals of the lead frames opposed to one side and the other side with a conductive member (connecting portion), A structure in which ESR and ESL are further reduced is proposed (see, for example, Patent Document 1).

さらに、本件出願人は、上記特許文献1に記載の積層型固体電解コンデンサにおいて、連結部とリードフレームの陰極端子との隙間を覆うように平面視矩形状の絶縁体を配置した構造を提案している(例えば、特許文献2および特許文献3参照)。これらの積層型固体電解コンデンサによれば、コンデンサ素子を積層した積層体とリードフレームの陰極端子とを導電性接着剤で接続する際に、導電性接着剤が連結部に付着して陰極端子と連結部とが短絡するのを防ぐことができる。   Further, the applicant of the present invention has proposed a structure in which an insulator having a rectangular shape in a plan view is disposed so as to cover the gap between the connecting portion and the cathode terminal of the lead frame in the multilayer solid electrolytic capacitor described in Patent Document 1. (For example, refer to Patent Document 2 and Patent Document 3). According to these multi-layer solid electrolytic capacitors, when the laminated body in which the capacitor elements are laminated and the cathode terminal of the lead frame are connected with the conductive adhesive, the conductive adhesive adheres to the connecting portion and the cathode terminal It can prevent that a connection part short-circuits.

特開2007−180327号公報JP 2007-180327 A 特開2009−21355号公報JP 2009-21355 A 特願2009−128852Japanese Patent Application No. 2009-128852

しかしながら、上記特許文献2および特許文献3に記載の積層型固体電解コンデンサでは、積層体と対向する陰極端子の積層面のうち、連結部側の周縁上にのみ絶縁体が配置されているので、塗布された導電性接着剤の量が予定された量よりも多いと、積層体と陰極端子とを接続する際に連結部側に押し広げられた導電性接着剤が、絶縁体の端面を伝って広がり、陽極端子に付着して陰極端子と陽極端子とが短絡しまうことがあり、改善の余地が残されていた。   However, in the multilayer solid electrolytic capacitors described in Patent Document 2 and Patent Document 3, since the insulator is disposed only on the peripheral edge on the connection portion side of the stacked surface of the cathode terminal facing the stacked body, If the amount of the applied conductive adhesive is larger than the expected amount, the conductive adhesive spread to the connecting portion side when connecting the laminate and the cathode terminal will be transmitted through the end face of the insulator. The cathode terminal and the anode terminal may be short-circuited by adhering to the anode terminal, leaving room for improvement.

本発明は上記の事情を鑑みてなされたものであって、その課題とするところは、導電性接着剤が絶縁体の端面を伝って陽極端子に付着するのを、より確実に防ぐことができる積層型固体電解コンデンサを提供することにある。   The present invention has been made in view of the above circumstances, and the problem is that the conductive adhesive can be more reliably prevented from adhering to the anode terminal along the end face of the insulator. The object is to provide a multilayer solid electrolytic capacitor.

上記課題を解決するために、本発明の第1発明に係る積層型固体電解コンデンサは、弁作用金属からなる平板状陽極素子の一方側に陽極部、他方側に陰極部が形成されたコンデンサ素子を陽極部の突出方向が反対になるように複数枚積み重ねて構成した積層体と、積層体の一方側から突出した陽極部に電気的に接続された一方側陽極端子と、積層体の他方側から突出した陽極部に電気的に接続された他方側陽極端子と、一方側陽極端子と他方側陽極端子とを電気的に接続する連結部と、連結部、一方側陽極端子および他方側陽極端子と離間して配置されるとともに、複数のコンデンサ素子の陰極部からなる陰極体に電気的に接続された陰極端子と、を備えた積層型固体電解コンデンサであって、積層体に対向した連結部の積層面と、連結部と陰極端子との隙間とに加えて、陰極端子と一方側および他方側陽極端子との隙間をも覆う第1の絶縁体をさらに備えたことを特徴とする。   In order to solve the above problems, a multilayer solid electrolytic capacitor according to a first aspect of the present invention is a capacitor element in which an anode part is formed on one side and a cathode part is formed on the other side of a flat plate anode element made of a valve metal. A plurality of stacked layers so that the protruding direction of the anode portion is opposite, a one-side anode terminal electrically connected to the anode portion protruding from one side of the stacked body, and the other side of the stacked body The other-side anode terminal electrically connected to the anode portion protruding from the connector, the connecting portion for electrically connecting the one-side anode terminal and the other-side anode terminal, the connecting portion, the one-side anode terminal, and the other-side anode terminal And a cathode terminal electrically connected to a cathode body composed of cathode portions of a plurality of capacitor elements, wherein the coupling portion faces the laminate Laminating surface and connecting portion In addition to the gap between the electrode terminals, and further comprising a first insulator covering also the gap between the cathode terminal and the one side and the other side an anode terminal.

この構成によれば、連結部と陰極端子の隙間に加えて、一方側および他方側陽極端子と陰極端子の隙間も第1の絶縁体で覆われているので、積層体の陰極体とリードフレームの陰極端子とを導電性接着剤で接続する際に、導電性接着剤が連結部に付着するのを防ぐことができ、さらに、導電性接着剤が第1の絶縁体の端面を伝って一方側および他方側陽極端子に付着するのを防ぐこともできる。   According to this configuration, in addition to the gap between the connecting portion and the cathode terminal, the gap between the one side and the other side anode terminal and the cathode terminal is also covered with the first insulator. When the negative electrode terminal is connected with the conductive adhesive, it is possible to prevent the conductive adhesive from adhering to the connecting portion, and further, the conductive adhesive travels along the end face of the first insulator. It is also possible to prevent adhesion to the side and other side anode terminals.

また、上記課題を解決するために、本発明の第2発明に係る積層型固体電解コンデンサは、弁作用金属からなる平板状陽極素子の一方側に陽極部、他方側に陰極部が形成されたコンデンサ素子を陽極部の突出方向が反対になるように複数枚積み重ねて構成した積層体と、積層体の一方側から突出した陽極部に電気的に接続された一方側陽極端子と、積層体の他方側から突出した陽極部に電気的に接続された他方側陽極端子と、一方側陽極端子と他方側陽極端子とを電気的に接続する連結部と、連結部、一方側陽極端子および他方側陽極端子と離間して配置されるとともに、積層体に対向した矩形状の積層面を有し、該積層面が複数のコンデンサ素子の陰極部からなる陰極体に電気的に接続された陰極端子と、を備えた積層型固体電解コンデンサであって、積層体に対向した連結部の積層面上と、陰極端子の積層面における連結部側の周縁上とに加えて、陰極端子の積層面における一方側陽極端子側および他方側陽極端子側の周縁上にも配置された第1の絶縁体をさらに備えたことを特徴とする。   In order to solve the above-described problem, the multilayer solid electrolytic capacitor according to the second aspect of the present invention has a flat plate anode element made of a valve metal having an anode portion on one side and a cathode portion on the other side. A laminated body in which a plurality of capacitor elements are stacked so that the protruding direction of the anode part is opposite; a one-side anode terminal electrically connected to the anode part protruding from one side of the laminated body; The other side anode terminal electrically connected to the anode part protruding from the other side, the connection part electrically connecting the one side anode terminal and the other side anode terminal, the connection part, the one side anode terminal and the other side A cathode terminal disposed apart from the anode terminal and having a rectangular laminated surface facing the laminated body, the laminated surface being electrically connected to a cathode body comprising cathode portions of a plurality of capacitor elements; Multi-layer solid electrolytic condenser with In addition to the laminated surface of the connecting portion facing the laminate and the peripheral edge on the connecting portion side of the laminated surface of the cathode terminal, the one side anode terminal side and the other side anode terminal on the laminated surface of the cathode terminal It further has the 1st insulator arrange | positioned also on the peripheral edge of the side.

この構成によれば、一方側および他方側陽極端子と陰極端子の隙間を第1の絶縁体で覆う代わりに、陰極端子の積層面における一方側陽極端子側の周縁上および他方側陽極端子側の周縁上に第1の絶縁体を配置することで、導電性接着剤が第1の絶縁体の端面を伝って一方側および他方側陽極端子に付着するのを防ぐことができる。   According to this configuration, instead of covering the gap between the one-side and other-side anode terminal and the cathode terminal with the first insulator, on the peripheral edge on the one-side anode terminal side and on the other-side anode terminal side in the laminated surface of the cathode terminal By disposing the first insulator on the periphery, it is possible to prevent the conductive adhesive from adhering to the one side and the other side anode terminals along the end face of the first insulator.

上記第1の絶縁体は、陰極端子の積層面の全周縁上に配置されていることが好ましい。この構成によれば、導電性接着剤を陰極端子の周辺に漏れ出させることなく陰極端子の積層面上に留めておくことができる。   The first insulator is preferably disposed on the entire periphery of the laminated surface of the cathode terminal. According to this configuration, the conductive adhesive can be kept on the laminated surface of the cathode terminal without leaking around the cathode terminal.

本発明の第1および第2発明に係る積層型固体電解コンデンサは、陰極端子の積層面のうち第1の絶縁体が配置されていない領域に配置され、該領域を複数の領域に区画する第2の絶縁体をさらに含んでいてもよい。   The multilayer solid electrolytic capacitor according to the first and second aspects of the present invention is arranged in a region where the first insulator is not disposed on the multilayer surface of the cathode terminal, and the region is divided into a plurality of regions. 2 insulators may further be included.

この構成によれば、第1の絶縁体が配置されていない領域を複数の領域に区画する第2の絶縁体が、積層体の陰極体とリードフレームの陰極端子とに挟まれて導電性接着剤が広がろうとする際の障壁となるので、導電性接着剤の広がりを抑制することができる。さらに、導電性接着剤が第2の絶縁体の上面だけでなく側面にも接着するので、積層体の陰極体とリードフレームの陰極端子との接着強度を向上させることもできる。   According to this configuration, the second insulator that divides the region where the first insulator is not disposed into a plurality of regions is sandwiched between the cathode body of the multilayer body and the cathode terminal of the lead frame, and conductively bonded. Since it becomes a barrier when the agent tries to spread, the spread of the conductive adhesive can be suppressed. Furthermore, since the conductive adhesive adheres not only to the upper surface of the second insulator but also to the side surfaces, the adhesive strength between the cathode body of the laminated body and the cathode terminal of the lead frame can be improved.

また、本発明の第1および第2発明に係る積層型固体電解コンデンサは、上記第1の絶縁体の端面のうち陰極端子の周縁上にある部分に、複数の凹凸を形成してもよい。この構成によれば、導電性接着剤が第1の絶縁体の端面を伝って陰極端子の周辺に漏れ出すまでの移動距離が長くなるので、導電性接着剤を陰極端子の周辺に漏れ出させることなく陰極端子の積層面上に留めておくことができる。   In the multilayer solid electrolytic capacitor according to the first and second inventions of the present invention, a plurality of irregularities may be formed on a portion of the end face of the first insulator on the periphery of the cathode terminal. According to this configuration, since the moving distance until the conductive adhesive leaks to the periphery of the cathode terminal along the end surface of the first insulator is increased, the conductive adhesive leaks to the periphery of the cathode terminal. Without being stuck on the laminated surface of the cathode terminal.

さらに、本発明の第1および第2発明に係る積層型固体電解コンデンサは、前記第1の絶縁体が絶縁テープであることを特徴とする。   Furthermore, the multilayer solid electrolytic capacitor according to the first and second inventions of the present invention is characterized in that the first insulator is an insulating tape.

また、本発明の第1および第2発明に係る積層型固体電解コンデンサは、上記第1の絶縁体の端面のうち陰極端子の周縁上にある部分に、庇部が形成されていてもよく、この場合、庇部は、2つ以上の第1の絶縁体が積層されることにより形成されたものであってもよい。   Further, in the multilayer solid electrolytic capacitor according to the first and second inventions of the present invention, a collar portion may be formed on a portion of the end face of the first insulator on the periphery of the cathode terminal, In this case, the collar part may be formed by laminating two or more first insulators.

この構成によれば、導電性接着剤が庇部と陰極端子の間の空間に流れ込むので、導電性接着剤を陰極端子の積層面上に留めておくことができ、さらに、庇部と陰極端子の間の空間に流れ込んだ導電性接着剤が、この空間を構成する陰極端子の積層面、第1の絶縁体の端面および庇部の下面に接着することで、積層体の陰極体とリードフレームの陰極端子との接着強度を向上させることもできる。   According to this configuration, since the conductive adhesive flows into the space between the collar part and the cathode terminal, the conductive adhesive can be kept on the laminated surface of the cathode terminal, and further, the collar part and the cathode terminal The conductive adhesive that has flowed into the space between the electrodes adheres to the laminated surface of the cathode terminal, the end surface of the first insulator, and the lower surface of the collar portion that constitute this space, so that the cathode body and the lead frame of the laminated body The adhesion strength with the cathode terminal can be improved.

本発明によれば、導電性接着剤が絶縁体の端面を伝って陽極端子に付着するのをより確実に防ぐことができる積層型固体電解コンデンサを提供することができる。   ADVANTAGE OF THE INVENTION According to this invention, the lamination type solid electrolytic capacitor which can prevent more reliably that a conductive adhesive adheres to an anode terminal along the end surface of an insulator can be provided.

本発明の第1の実施形態におけるコンデンサ素子であって、(a)は平面図、(b)は断面図である。It is a capacitor | condenser element in the 1st Embodiment of this invention, Comprising: (a) is a top view, (b) is sectional drawing. 第1の実施形態における積層体であって、(a)は、平面図、(b)は側面図、(c)はリードフレーム上に配置した状態を示す側面図である。It is a laminated body in 1st Embodiment, Comprising: (a) is a top view, (b) is a side view, (c) is a side view which shows the state arrange | positioned on a lead frame. 第1の実施形態におけるリードフレームであって、(a)は平面図、(b)は絶縁テープを配置した状態を示す平面図である。1A is a plan view of a lead frame according to a first embodiment, and FIG. 2B is a plan view showing a state in which an insulating tape is arranged. 第1の実施形態に係る積層型固体電解コンデンサであって(a)は平面図、(b)は(a)を線Aで切断した断面図、(c)は(a)を線Bで切断した断面図である。1A is a plan view, FIG. 2B is a cross-sectional view taken along line A, and FIG. 1C is a cross-sectional view taken along line B. FIG. FIG. 第1の実施形態に係る積層型固体電解コンデンサであって(a)は底面図、(b)は側面図である。1A is a bottom view and FIG. 2B is a side view of a multilayer solid electrolytic capacitor according to a first embodiment. 本発明の第2の実施形態における絶縁テープを示す平面図である。It is a top view which shows the insulating tape in the 2nd Embodiment of this invention. 本発明の第3の実施形態における絶縁テープを示す平面図である。It is a top view which shows the insulating tape in the 3rd Embodiment of this invention. 本発明の第4の実施形態における絶縁テープを示す平面図である。It is a top view which shows the insulating tape in the 4th Embodiment of this invention. 本発明の第5の実施形態における絶縁テープを示す平面図である。It is a top view which shows the insulating tape in the 5th Embodiment of this invention. 本発明の第6の実施形態における絶縁テープを示す部分断面図である。It is a fragmentary sectional view showing the insulating tape in the 6th embodiment of the present invention. 本発明の変形例における絶縁テープを示す平面図である。It is a top view which shows the insulating tape in the modification of this invention.

本発明の好ましい実施形態について、図面を参照して説明する。なお、各図面では、同一部材には同一の符号を付している。   Preferred embodiments of the present invention will be described with reference to the drawings. In the drawings, the same reference numerals are assigned to the same members.

[第1の実施形態]
図1(a)は本発明の第1の実施形態に係る積層型固体電解コンデンサで使用するコンデンサ素子の平面図、(b)は断面図である。同図に示すように、コンデンサ素子Cは、陽極素子1、誘電体膜2、固体電解質層3、カーボン層4、銀層5および這い上がり防止材6から構成されている。
[First Embodiment]
FIG. 1A is a plan view of a capacitor element used in the multilayer solid electrolytic capacitor according to the first embodiment of the present invention, and FIG. As shown in the figure, the capacitor element C is composed of an anode element 1, a dielectric film 2, a solid electrolyte layer 3, a carbon layer 4, a silver layer 5, and a creeping prevention material 6.

陽極素子1は、弁作用金属であるアルミニウムを主成分とする幅(w)10mm、長さ(l)15mmの平板状の薄板であり、その一方側は陽極部7を構成している。誘電体膜2は、陽極素子1の他方側の表面に形成された酸化皮膜層である。固体電解質層3は、誘電体膜2の表面に形成された層であり、例えば、ポリエチレンジオキシチオフェン(PEDOT)等の導電性高分子を含む電解質の化学重合、電解重合、または含浸によって形成された層である。カーボン層4および銀層5は、固体電解質層3の表面に順次形成された陰極引出層であり、固体電解質層3と併せて陰極部を構成している。這い上がり防止材6は、陽極部7と固体電解質層3の間に設けられた、陽極部7と陰極部を絶縁隔離するリング状の膜である。   The anode element 1 is a flat thin plate having a width (w) of 10 mm and a length (l) of 15 mm whose main component is aluminum which is a valve action metal, and one side thereof constitutes an anode part 7. Dielectric film 2 is an oxide film layer formed on the other surface of anode element 1. The solid electrolyte layer 3 is a layer formed on the surface of the dielectric film 2, and is formed, for example, by chemical polymerization, electrolytic polymerization, or impregnation of an electrolyte containing a conductive polymer such as polyethylenedioxythiophene (PEDOT). Layer. The carbon layer 4 and the silver layer 5 are cathode lead layers sequentially formed on the surface of the solid electrolyte layer 3, and together with the solid electrolyte layer 3 constitute a cathode portion. The creeping prevention material 6 is a ring-shaped film provided between the anode portion 7 and the solid electrolyte layer 3 to insulate and isolate the anode portion 7 and the cathode portion.

コンデンサ素子Cは、次のように作製される。まず、表面を電気化学的に粗面化した厚さ0.1mmのアルミニウムの薄板からなる陽極素子1を、アジピン酸アンモニウム水溶液中で10Vの電圧を印加して約60分間陽極酸化を行い、陽極素子1の表面に酸化皮膜層である誘電体膜2を形成する。次いで、誘電体膜2が形成された陽極素子1を幅(w)10mm、長さ(l)15mmの寸法に裁断した後、適切な位置に絶縁性樹脂を周方向に巻きつけるように塗布して這い上がり防止材6を形成し、陽極部7になる領域と陰極部になる領域とに区分する。次いで、上記の裁断によって陽極素子1が露出した裁断面を、再度アジピン酸アンモニウム水溶液中で7Vの電圧を印加して約30分間陽極酸化処理を行い、裁断面にも誘電体膜2を形成する。その後、誘電体膜2の表面に固体電解質層3、カーボン層4、銀層5を順次形成することでコンデンサ素子Cは完成する。   The capacitor element C is manufactured as follows. First, an anode element 1 made of an aluminum thin plate having a thickness of 0.1 mm whose surface was electrochemically roughened was anodized for about 60 minutes by applying a voltage of 10 V in an aqueous solution of ammonium adipate. A dielectric film 2 that is an oxide film layer is formed on the surface of the element 1. Next, after the anode element 1 on which the dielectric film 2 is formed is cut into dimensions of width (w) 10 mm and length (l) 15 mm, an insulating resin is applied around an appropriate position so as to be wound in the circumferential direction. The creeping prevention material 6 is formed and divided into a region to be the anode portion 7 and a region to be the cathode portion. Next, the cut surface where the anode element 1 is exposed by the above cutting is again subjected to an anodizing treatment for about 30 minutes by applying a voltage of 7 V in an aqueous solution of ammonium adipate to form the dielectric film 2 on the cut surface. . Thereafter, the capacitor element C is completed by sequentially forming the solid electrolyte layer 3, the carbon layer 4 and the silver layer 5 on the surface of the dielectric film 2.

図2に上記方法で作製された4枚のコンデンサ素子C1〜C4からなる積層体を示す。同図に示すように、積層体は、コンデンサ素子C1〜C4を陽極部7、7’の突出方向が交互に反対になるように積層したものである。コンデンサ素子C1〜C4の陰極部は、導電性接着剤8によりそれぞれ接続されている(以下、コンデンサ素子C1〜C4の陰極部をまとめて「陰極体」という)。積層体の陽極部7、7’は、リードフレームの陽極端子9、9’に抵抗溶接等の方法でそれぞれ接続されている。また、積層体の陰極体は、リードフレームの陰極端子10に導電性接着剤8を介して接続されている。   FIG. 2 shows a laminate composed of four capacitor elements C1 to C4 manufactured by the above method. As shown in the figure, the laminated body is obtained by laminating capacitor elements C1 to C4 such that the protruding directions of the anode portions 7 and 7 'are alternately opposite. The cathode portions of the capacitor elements C1 to C4 are respectively connected by the conductive adhesive 8 (hereinafter, the cathode portions of the capacitor elements C1 to C4 are collectively referred to as “cathode bodies”). The anode portions 7 and 7 'of the laminate are respectively connected to the anode terminals 9 and 9' of the lead frame by a method such as resistance welding. Further, the cathode body of the laminated body is connected to the cathode terminal 10 of the lead frame via the conductive adhesive 8.

図3(a)に示すように、リードフレームは陽極端子9、9’、陰極端子10、10’および連結部11から構成されている。aを連結部11の幅、Wを外装樹脂13の幅(陽極端子9、9’の幅bと等しい)とすると、(a÷W)×100の値が外装樹脂13の幅に対する連結部11の幅の割合を示す。   As shown in FIG. 3A, the lead frame includes anode terminals 9 and 9 ′, cathode terminals 10 and 10 ′, and a connecting portion 11. When a is the width of the connecting portion 11 and W is the width of the exterior resin 13 (equal to the width b of the anode terminals 9 and 9 ′), the value of (a ÷ W) × 100 corresponds to the width of the exterior resin 13. The ratio of the width of.

陽極端子9、9’は外装樹脂13の幅方向全体にわたって配置され、陽極端子9、9’間は陽極端子9、9’と同じ材質(例えば銅系合金)からなる長さ12.6mmの連結部11で接続されている。本実施形態では、陽極端子9、9’と連結部11とが一体となった、H形リードフレームを使用している。このH形リードフレームの断面は、図4(b)に示すように、両端の陽極端子9、9’が厚く、連結部11が薄くなっている。連結部11は、図5(a)に示すように、外装樹脂13内に埋設されているため、陽極端子9、9’および連結部11は外装樹脂13から抜けにくくなっている。   The anode terminals 9 and 9 'are arranged over the entire width direction of the exterior resin 13, and the anode terminals 9 and 9' are connected to each other with a length of 12.6 mm made of the same material (for example, a copper alloy) as the anode terminals 9 and 9 '. They are connected by the section 11. In this embodiment, an H-shaped lead frame in which the anode terminals 9, 9 'and the connecting portion 11 are integrated is used. In the cross section of the H-shaped lead frame, as shown in FIG. 4B, the anode terminals 9 and 9 'at both ends are thick and the connecting portion 11 is thin. As shown in FIG. 5A, the connecting portion 11 is embedded in the exterior resin 13, so that the anode terminals 9, 9 ′ and the connecting portion 11 are not easily removed from the exterior resin 13.

陰極端子10、10’は、それぞれ幅(c)4.34mm、長さ(d)4.3mmの寸法を有し、連結部11を挟んで線対称に、連結部11から0.5mmの隙間(g1)、陽極端子9、9’から4.15mmの隙間(g2)をもって配置されている。また、図5(b)に示すように、陰極端子10、10’および陽極端子9、9’は、外装樹脂13からの露出面が同一平面になるよう配置されている。   Each of the cathode terminals 10 and 10 ′ has a width (c) of 4.34 mm and a length (d) of 4.3 mm, and is symmetrical with respect to the connecting portion 11 with a gap of 0.5 mm from the connecting portion 11. (G1), with a gap (g2) of 4.15 mm from the anode terminals 9, 9 ′. Further, as shown in FIG. 5B, the cathode terminals 10, 10 'and the anode terminals 9, 9' are arranged such that the exposed surfaces from the exterior resin 13 are on the same plane.

連結部11は、その幅(a)が外装樹脂13の幅(W)の20%となるように、かつ陽極端子9、9’間を最短で接続するように陽極端子9、9’間に配置されている。   The connecting portion 11 has a width (a) that is 20% of the width (W) of the exterior resin 13, and the anode terminals 9 and 9 'are connected as short as possible between the anode terminals 9 and 9'. Has been placed.

絶縁テープ(第1の絶縁体)12は、陰極体と陰極端子10、10’とを導電性接着剤8で接続する際に、連結部11に導電性接着剤8が付着してしまうのを防ぐためのものである。図3(b)に示すように、この絶縁テープ12は、連結部11の積層体と対向する面(積層面)上に配置されている。具体的には、絶縁テープ12として、長さ方向の寸法が12.6mmであるH形のポリイミドテープが、連結部11の積層面全体と、連結部11と陰極端子10、10’との隙間(g1)と、陰極端子10、10’の積層面の周縁のうち連結部11側から0.5mmの幅の部分とを覆うように配置されている。   The insulating tape (first insulator) 12 prevents the conductive adhesive 8 from adhering to the connecting portion 11 when the cathode body and the cathode terminals 10, 10 ′ are connected by the conductive adhesive 8. It is for prevention. As shown in FIG. 3B, the insulating tape 12 is disposed on a surface (laminate surface) facing the laminate of the connecting portion 11. Specifically, an H-shaped polyimide tape having a lengthwise dimension of 12.6 mm is used as the insulating tape 12, and the entire laminated surface of the connecting portion 11 and the gap between the connecting portion 11 and the cathode terminals 10, 10 ′. It arrange | positions so that (g1) and the part of the width | variety of 0.5 mm from the connection part 11 side may be covered among the periphery of the laminated surface of cathode terminal 10 and 10 '.

本実施形態に係る積層型固体電解コンデンサでは、絶縁テープ12である上記ポリイミドテープによって、さらに陰極端子10、10’と陽極端子9、9’との隙間(g2)と、陰極端子10、10’の積層面の周縁のうち陽極端子9、9’側から0.5mmの幅の部分とが覆われている。   In the multilayer solid electrolytic capacitor according to the present embodiment, the polyimide tape as the insulating tape 12 further causes a gap (g2) between the cathode terminals 10 and 10 ′ and the anode terminals 9 and 9 ′ and the cathode terminals 10 and 10 ′. A portion having a width of 0.5 mm from the anode terminals 9, 9 ′ side is covered in the peripheral edge of the laminated surface.

絶縁テープ12は、10μm以下の所定の厚みを有している。この厚みが厚すぎると、積層体の陰極体とリードフレームの陰極端子10、10’との接着強度が弱くなり、この厚みが薄すぎると、陰極体と陰極端子10、10’に挟まれた導電性接着剤8が絶縁テープ12上に溢れ出てしまう。   The insulating tape 12 has a predetermined thickness of 10 μm or less. If this thickness is too thick, the adhesive strength between the cathode body of the laminate and the cathode terminals 10 and 10 'of the lead frame is weakened. If this thickness is too thin, the cathode body and the cathode terminals 10 and 10' are sandwiched. The conductive adhesive 8 overflows on the insulating tape 12.

以上のように、本実施形態に係る積層型固体電解コンデンサによれば、コンデンサ素子C1〜C4からなる積層体をリードフレームに積層する際に、積層体の陰極体とリードフレームの陰極端子10、10’との間で導電性接着剤8が押し広げられても、陰極端子10、10’と陽極端子9、9’の隙間(g2)が絶縁テープ12で覆われているので、押し広げられた導電性接着剤8は絶縁テープ12の端面を伝って積層型固体電解コンデンサの外方向(連結部11側と逆方向)に広がっていく。このため、本実施形態に係る積層型固体電解コンデンサによれば、導電性接着剤8が陽極端子9、9’に付着して、陰極端子10、10’と陽極端子9、9’が短絡するのを確実に防ぐことができる。   As described above, according to the multilayer solid electrolytic capacitor according to the present embodiment, when the multilayer body including the capacitor elements C1 to C4 is stacked on the lead frame, the cathode body of the multilayer body and the cathode terminal 10 of the lead frame, Even if the conductive adhesive 8 is spread between 10 ′ and 10 ′, the gap (g2) between the cathode terminals 10 and 10 ′ and the anode terminals 9 and 9 ′ is covered with the insulating tape 12, so that it is spread. The conductive adhesive 8 spreads along the end face of the insulating tape 12 in the outward direction of the multilayer solid electrolytic capacitor (the direction opposite to the connecting portion 11 side). For this reason, according to the multilayer solid electrolytic capacitor according to the present embodiment, the conductive adhesive 8 adheres to the anode terminals 9 and 9 ′, and the cathode terminals 10 and 10 ′ and the anode terminals 9 and 9 ′ are short-circuited. Can be surely prevented.

さらに、本実施形態に係る積層型固体電解コンデンサでは、従来の積層型固体電解コンデンサ同様に、連結部11と陰極端子10、10’の隙間(g1)が絶縁テープ12で覆われているので、導電性接着剤8の広がりを絶縁テープ12の端面でせき止めることができる。また、たとえ導電性接着剤8が絶縁テープ12上に溢れ出たとしても、連結部11の積層面全体が絶縁テープ12で覆われているので、導電性接着剤8が連結部11の側面や底面に付着するのを防ぐことができる。   Furthermore, in the multilayer solid electrolytic capacitor according to the present embodiment, the gap (g1) between the connecting portion 11 and the cathode terminals 10 and 10 ′ is covered with the insulating tape 12, as in the conventional multilayer solid electrolytic capacitor. The spread of the conductive adhesive 8 can be blocked by the end face of the insulating tape 12. Even if the conductive adhesive 8 overflows on the insulating tape 12, the entire laminated surface of the connecting portion 11 is covered with the insulating tape 12. It can prevent adhering to the bottom.

[第2の実施形態]
図6は、本発明の第2の実施形態に係る積層型固体電解コンデンサで使用する絶縁テープ12Aの平面図である。本実施形態に係る積層型固体電解コンデンサは、絶縁テープ12の代わりに絶縁テープ12Aが配置されていること以外、第1の実施形態に係る積層型固体電解コンデンサと共通している。
[Second Embodiment]
FIG. 6 is a plan view of an insulating tape 12A used in the multilayer solid electrolytic capacitor according to the second embodiment of the present invention. The multilayer solid electrolytic capacitor according to the present embodiment is common to the multilayer solid electrolytic capacitor according to the first embodiment except that an insulating tape 12A is disposed instead of the insulating tape 12.

同図に示すように、絶縁テープ12Aは、連結部11の積層面全体、連結部11と陰極端子10、10’との隙間、陰極端子10、10’と陽極端子9、9’との隙間および陰極端子10、10’の積層面の全周縁を覆うように配置されている。このため、本実施形態に係る積層型固体電解コンデンサによれば、導電性接着剤8が陽極端子9、9’や連結部11の側面および底面に付着するのを防ぐことができ、さらに、導電性接着剤8を陰極端子10、10’の周辺に漏れ出させることなく陰極端子10、10’の積層面上に留めておくことができる。   As shown in the figure, the insulating tape 12A includes the entire laminated surface of the connecting portion 11, the gap between the connecting portion 11 and the cathode terminals 10, 10 ', and the gap between the cathode terminals 10, 10' and the anode terminals 9, 9 '. And it arrange | positions so that the whole periphery of the laminated surface of cathode terminal 10 and 10 'may be covered. For this reason, according to the multilayer solid electrolytic capacitor according to the present embodiment, it is possible to prevent the conductive adhesive 8 from adhering to the side surfaces and the bottom surface of the anode terminals 9, 9 ′ and the connecting portion 11, and further, the conductive The adhesive 8 can be kept on the laminated surface of the cathode terminals 10 and 10 ′ without leaking around the cathode terminals 10 and 10 ′.

[第3の実施形態]
図7は、本発明の第3の実施形態に係る積層型固体電解コンデンサで使用する絶縁テープ12B、12B’の平面図である。本実施形態に係る積層型固体電解コンデンサは、絶縁テープ(第1の絶縁体)12Bに加えて、絶縁テープ(第2の絶縁体)12B’がさらに配置されていること以外、第2の実施形態に係る積層型固体電解コンデンサと共通している。
[Third Embodiment]
FIG. 7 is a plan view of insulating tapes 12B and 12B ′ used in the multilayer solid electrolytic capacitor according to the third embodiment of the present invention. The multilayer solid electrolytic capacitor according to the present embodiment is the second embodiment except that an insulating tape (second insulator) 12B ′ is further arranged in addition to the insulating tape (first insulator) 12B. This is common with the multilayer solid electrolytic capacitor according to the embodiment.

同図に示すように、本実施形態に係る積層型固体電解コンデンサでは、絶縁テープ(第1の絶縁体)12Bが第2の実施形態における絶縁テープ12Aと同様に配置されており、さらに、絶縁テープ(第2の絶縁体)12B’が、陰極端子10、10’の積層面のうち絶縁テープ12Bが配置されていない領域に配置されている。この絶縁テープ12B’は、上記の領域を複数の領域に区画するとともに、複数の開口が形成されたメッシュ状を有している。   As shown in the figure, in the multilayer solid electrolytic capacitor according to the present embodiment, the insulating tape (first insulator) 12B is arranged in the same manner as the insulating tape 12A in the second embodiment, and further, the insulating tape The tape (second insulator) 12B ′ is disposed in a region where the insulating tape 12B is not disposed on the laminated surface of the cathode terminals 10 and 10 ′. The insulating tape 12B 'has a mesh shape in which the above-described region is divided into a plurality of regions and a plurality of openings are formed.

本実施形態に係る積層型固体電解コンデンサによれば、絶縁テープ12B’の側面が導電性接着剤8の広がりを抑制する障壁になるので、導電性接着剤8を陰極端子10、10’の周辺に漏れ出させることなく陰極端子10、10’の積層面上に留めておくことができる。さらに、導電性接着剤8が、陰極端子10、10’の積層面だけでなく絶縁テープ12B’の上面や側面にも接着するので、積層体の陰極体とリードフレームの陰極端子10、10’との接着強度を向上させることができる。なお、絶縁テープ(第1の絶縁体)12Bと絶縁テープ(第2の絶縁体)12B’とは、別体であっても一体であってもよく、互いに厚みが異なっていてもよい。   According to the multilayer solid electrolytic capacitor according to the present embodiment, the side surface of the insulating tape 12B ′ serves as a barrier that suppresses the spread of the conductive adhesive 8, so that the conductive adhesive 8 is disposed around the cathode terminals 10, 10 ′. The cathode terminals 10 and 10 'can be kept on the laminated surface without leaking out. Further, since the conductive adhesive 8 adheres not only to the laminated surface of the cathode terminals 10 and 10 ′ but also to the upper surface and side surfaces of the insulating tape 12B ′, the laminated cathode body and the lead frame cathode terminals 10 and 10 ′. The adhesive strength can be improved. The insulating tape (first insulator) 12B and the insulating tape (second insulator) 12B 'may be separate or integrated, and may have different thicknesses.

[第4の実施形態]
図8は、本発明の第4の実施形態に係る積層型固体電解コンデンサで使用する絶縁テープ12C、12C’の平面図である。本実施形態に係る積層型固体電解コンデンサは、絶縁テープ12B’の代わりに絶縁テープ12C’が配置されていること以外、第3の実施形態に係る積層型固体電解コンデンサと共通している。
[Fourth Embodiment]
FIG. 8 is a plan view of insulating tapes 12C and 12C ′ used in the multilayer solid electrolytic capacitor according to the fourth embodiment of the present invention. The multilayer solid electrolytic capacitor according to the present embodiment is common to the multilayer solid electrolytic capacitor according to the third embodiment except that the insulating tape 12C ′ is disposed instead of the insulating tape 12B ′.

同図に示すように、本実施形態に係る積層型固体電解コンデンサでは、メッシュ状の絶縁テープ12B’の代わりに、スリット状の開口が形成された絶縁テープ(第2の絶縁体)12C’が配置されている。このため、本実施形態に係る積層型固体電解コンデンサによれば、第3の実施形態に係る積層型固体電解コンデンサと同様の効果を得ることができる。   As shown in the figure, in the multilayer solid electrolytic capacitor according to this embodiment, an insulating tape (second insulator) 12C ′ having a slit-shaped opening is used instead of the mesh-shaped insulating tape 12B ′. Has been placed. For this reason, according to the multilayer solid electrolytic capacitor according to the present embodiment, the same effects as those of the multilayer solid electrolytic capacitor according to the third embodiment can be obtained.

[第5の実施形態]
図9は、本発明の第5の実施形態に係る積層型固体電解コンデンサで使用する絶縁テープ12Dの平面図である。本実施形態に係る積層型固体電解コンデンサは、絶縁テープ12の代わりに絶縁テープ12Dが配置されていること以外、第1の実施形態に係る積層型固体電解コンデンサと共通している。
[Fifth Embodiment]
FIG. 9 is a plan view of an insulating tape 12D used in the multilayer solid electrolytic capacitor according to the fifth embodiment of the present invention. The multilayer solid electrolytic capacitor according to the present embodiment is common to the multilayer solid electrolytic capacitor according to the first embodiment except that an insulating tape 12D is disposed instead of the insulating tape 12.

同図に示すように、本実施形態に係る積層型固体電解コンデンサは、絶縁テープ12Dの端面のうち陰極端子10、10’の周縁上にある部分に、複数の山型の凹凸14が形成されている。なお、この凹凸14は、絶縁テープ12Dの厚み方向に沿った複数の凹凸条であってもよいし、端面を粗面化することにより形成したものであってもよい。   As shown in the figure, in the multilayer solid electrolytic capacitor according to the present embodiment, a plurality of mountain-shaped irregularities 14 are formed on a portion of the end face of the insulating tape 12D on the periphery of the cathode terminals 10, 10 ′. ing. The irregularities 14 may be a plurality of irregularities along the thickness direction of the insulating tape 12D, or may be formed by roughening the end surface.

絶縁テープ12Dの端面のうち陰極端子10、10’の周縁上にある部分に、複数の凹凸14を形成することで、導電性接着剤8が端面を伝って陰極端子10、10’の周辺に漏れ出すまでの移動距離が長くなる。さらに、この凹凸14は、導電性接着剤8が端面を伝って移動する際に障壁となる。これらにより、本実施形態に係る積層型固体電解コンデンサによれば、導電性接着剤8が絶縁テープ12Dの端面を伝って広がるのを抑制することができる。   By forming a plurality of projections and depressions 14 on the edge of the insulating tape 12D on the periphery of the cathode terminals 10, 10 ', the conductive adhesive 8 travels along the edge and around the cathode terminals 10, 10'. The moving distance until it leaks becomes longer. Further, the unevenness 14 becomes a barrier when the conductive adhesive 8 moves along the end face. As a result, according to the multilayer solid electrolytic capacitor according to the present embodiment, it is possible to suppress the conductive adhesive 8 from spreading along the end face of the insulating tape 12D.

[第6の実施形態]
図10は、本発明の第6の実施形態に係る積層型固体電解コンデンサで使用する絶縁テープ12Eの部分断面図である。本実施形態に係る積層型固体電解コンデンサは、絶縁テープ12の代わりに絶縁テープ12Eが配置されていること以外、第1の実施形態に係る積層型固体電解コンデンサと共通している。
[Sixth Embodiment]
FIG. 10 is a partial cross-sectional view of an insulating tape 12E used in the multilayer solid electrolytic capacitor according to the sixth embodiment of the present invention. The multilayer solid electrolytic capacitor according to the present embodiment is common to the multilayer solid electrolytic capacitor according to the first embodiment except that an insulating tape 12E is disposed instead of the insulating tape 12.

同図に示すように、本実施形態に係る積層型固体電解コンデンサは、絶縁テープ12Eの端面のうち陰極端子10、10’の周縁上にある部分にわたって、庇部15が形成されている。この庇部15は、大きさの異なる2つ以上の絶縁テープ12Eを積層して形成したものであってもよいし、1つの絶縁テープ12Eの端面の一部に段差を設けることにより形成したものであってもよい。   As shown in the figure, in the multilayer solid electrolytic capacitor according to the present embodiment, a flange portion 15 is formed over a portion of the end face of the insulating tape 12E on the periphery of the cathode terminals 10, 10 '. The flange 15 may be formed by laminating two or more insulating tapes 12E having different sizes, or formed by providing a step on a part of the end surface of one insulating tape 12E. It may be.

本実施形態に係る積層型固体電解コンデンサによれば、庇部15を設けることにより、庇部15と陰極端子10、10’の間の空間に導電性接着剤8が流れ込むので、導電性接着剤8を陰極端子10、10’の積層面上に留めておくことができる。さらに、庇部15と陰極端子10、10’の間の空間に流れ込んだ導電性接着剤8を、この空間を構成する陰極端子10、10’の積層面と、絶縁テープ12Eの端面および庇部15の下面に接着させることで、積層体の陰極体とリードフレームの陰極端子10、10’との接着強度を向上させることができる。   According to the multilayer solid electrolytic capacitor according to the present embodiment, by providing the flange portion 15, the conductive adhesive 8 flows into the space between the flange portion 15 and the cathode terminals 10 and 10 ′. 8 can be kept on the laminated surface of the cathode terminals 10, 10 ′. Further, the conductive adhesive 8 that has flowed into the space between the flange portion 15 and the cathode terminals 10 and 10 ′, the laminated surface of the cathode terminals 10 and 10 ′ constituting the space, the end surface of the insulating tape 12E, and the flange portion. By adhering to the lower surface of 15, the adhesive strength between the cathode body of the laminate and the cathode terminals 10, 10 ′ of the lead frame can be improved.

以上、本発明に係る積層型固体電解コンデンサの好ましい実施形態について説明してきたが、本発明はこれらの構成に限定されるものではない。   The preferred embodiments of the multilayer solid electrolytic capacitor according to the present invention have been described above, but the present invention is not limited to these configurations.

例えば、上記各実施形態は、任意に組み合わせることができる。例えば、第5の実施形態と第6の実施形態を組み合わせて、複数の凹凸14が形成された絶縁テープ12Dに、さらに庇部15を形成してもよい。   For example, the above embodiments can be arbitrarily combined. For example, the flange portion 15 may be further formed on the insulating tape 12D on which the plurality of projections and depressions 14 are formed by combining the fifth embodiment and the sixth embodiment.

この他、上記第1の実施形態では、連結部11の積層面全体と、連結部11と陰極端子10、10’との隙間(g1)と、陰極端子10、10’と陽極端子9、9’との隙間(g2)と、陰極端子10、10’の積層面のうち連結部11側の周縁および陽極端子9、9’側 の周縁とが絶縁テープ12で覆われているが、少なくとも連結部11の積層面と、陰極端子10、10’の積層面のうち連結部11側の周縁および陽極端子9、9’側の周縁とが絶縁テープで覆われていればよい。例えば、図11に示すように、陰極端子10、10’の積層面のうち陽極端子9、9’側の周縁が絶縁テープ12Fで覆われていれば、陰極端子10、10’と陽極端子9、9’との隙間(g2)が覆われていなくても、第1の実施形態に係る積層型固体電解コンデンサと同様の効果を得ることができる。   In addition, in the first embodiment, the entire laminated surface of the connecting portion 11, the gap (g1) between the connecting portion 11 and the cathode terminals 10, 10 ′, the cathode terminals 10, 10 ′, and the anode terminals 9, 9 are used. The gap (g2) between the cathode terminal 10, 10 ′ and the peripheral edge on the connecting portion 11 side and the peripheral edge on the anode terminal 9, 9 ′ side are covered with the insulating tape 12 at least. It is only necessary that the laminated surface of the portion 11 and the peripheral edge on the connecting portion 11 side and the peripheral edge on the anode terminal 9, 9 ′ side of the laminated surface of the cathode terminals 10 and 10 ′ are covered with an insulating tape. For example, as shown in FIG. 11, if the periphery of the anode terminals 9 and 9 ′ side of the laminated surface of the cathode terminals 10 and 10 ′ is covered with the insulating tape 12 </ b> F, the cathode terminals 10 and 10 ′ and the anode terminal 9 are used. Even if the gap (g2) with 9 ′ is not covered, the same effect as the multilayer solid electrolytic capacitor according to the first embodiment can be obtained.

さらに、上記各実施形態では、連結部11と同じ長さである12.6mmの長さの絶縁テープ12を使用したが、絶縁テープ12の長さは任意に変更できる。例えば、絶縁テープ12は陽極端子9、9’の連結部11側から0.5mmの幅の部分を覆うように配置されていてもよい。この構成によれば、絶縁テープ12の四隅が陽極端子9、9’上に配置され、固定されるため、外装樹脂13で封止する際に、絶縁テープ12が変形しにくく形状が安定する。   Furthermore, in each said embodiment, although the insulating tape 12 of the length of 12.6 mm which is the same length as the connection part 11 was used, the length of the insulating tape 12 can be changed arbitrarily. For example, the insulating tape 12 may be disposed so as to cover a portion having a width of 0.5 mm from the connecting portion 11 side of the anode terminals 9 and 9 ′. According to this configuration, since the four corners of the insulating tape 12 are arranged and fixed on the anode terminals 9 and 9 ′, the shape of the insulating tape 12 is not easily deformed when sealed with the exterior resin 13, and the shape is stabilized.

絶縁テープ12としては、ポリイミドテープ以外にも、テフロン(登録商標)テープ、ガラス繊維入りテープ、ポリプロピレンテープ、ポリエチレンテレフタレートテープ、ポリテトラフルオロエチレンテープ、ポリエステルテープなどを使用してもよい。また、絶縁テープ12に代えて、液状材料を使用してもよい。つまり、第1および第2の絶縁体は、絶縁性のある材料であれば同じ効果が得られる。なお、比較的粘性の高い液状材料を使用する場合は、メッシュ状やスリット状等の所望の形状のメタルマスクを用いて、液状材料を限定的に塗布することで、所望の形状の絶縁体を形成することができる。   As the insulating tape 12, in addition to the polyimide tape, a Teflon (registered trademark) tape, a glass fiber-containing tape, a polypropylene tape, a polyethylene terephthalate tape, a polytetrafluoroethylene tape, a polyester tape, or the like may be used. Further, a liquid material may be used in place of the insulating tape 12. That is, the same effect can be obtained if the first and second insulators are insulating materials. In addition, when using a liquid material having a relatively high viscosity, an insulator having a desired shape can be obtained by applying the liquid material in a limited manner using a metal mask having a desired shape such as a mesh shape or a slit shape. Can be formed.

なお、上記各実施形態では、弁作用金属としてアルミニウム、固体電解質層3として導電性高分子を用いたが、アルミニウムに代えてタンタルやニオブ箔またはこれら金属粉末の焼結体を用いてもよいし、導電性高分子に代えて二酸化マンガンを用いてもよい。   In each of the above embodiments, aluminum is used as the valve action metal and a conductive polymer is used as the solid electrolyte layer 3, but tantalum, niobium foil, or a sintered body of these metal powders may be used instead of aluminum. Instead of the conductive polymer, manganese dioxide may be used.

さらに、連結部11の導電性部材は、陽極端子9、9’と同じ材料を使用し、一体に形成したが、陽極材の銅、アルミニウム以外の銀、金、ニオブ、タンタル、導電性高分子等の導電性材料なども有効に利用できる。   Further, the conductive member of the connecting portion 11 is made of the same material as that of the anode terminals 9 and 9 ', and is integrally formed. However, the anode material is copper, silver other than aluminum, gold, niobium, tantalum, conductive polymer. Conductive materials such as can also be used effectively.

さらに、陽極端子9、9’間の連結部11を2本以上とし、その間に陰極端子を配置してもよい。   Further, two or more connecting portions 11 between the anode terminals 9 and 9 'may be provided, and the cathode terminal may be disposed between them.

さらに、上記各実施形態では、コンデンサ素子Cを4枚積層した例について説明したが、コンデンサ素子Cの積層枚数は任意に変更することができる。   Further, in each of the above embodiments, an example in which four capacitor elements C are stacked has been described, but the number of stacked capacitor elements C can be arbitrarily changed.

また、上記実施形態では、リードフレームを積層体の下側に配置した例について説明したが、コンデンサを実装する部分によっては積層体の上面にリードフレームを配置してもよい。   In the above-described embodiment, the example in which the lead frame is disposed on the lower side of the multilayer body has been described. However, the lead frame may be disposed on the upper surface of the multilayer body depending on the portion where the capacitor is mounted.

C、C1〜C4 コンデンサ素子
1 陽極素子
2 誘電体膜
3 固体電解質層
4 カーボン層
5 銀層
6 這い上がり防止材
7、7’ 陽極部
8 導電性接着剤
9、9’ 陽極端子
10、10’ 陰極端子
11 連結部
12、12A〜12F 絶縁テープ(第1の絶縁体)
12B’、12C’ 絶縁テープ(第2の絶縁体)
13 外装樹脂
14 凹凸
15 庇部
C, C1 to C4 Capacitor element 1 Anode element 2 Dielectric film 3 Solid electrolyte layer 4 Carbon layer 5 Silver layer 6 Scoop preventive material 7, 7 ′ Anode portion 8 Conductive adhesive 9, 9 ′ Anode terminal 10, 10 ′ Cathode terminal 11 connecting part 12, 12A-12F Insulating tape (first insulator)
12B ′, 12C ′ insulating tape (second insulator)
13 Exterior resin 14 Concavity and convexity 15

Claims (8)

弁作用金属からなる平板状陽極素子の一方側に陽極部、他方側に陰極部が形成されたコンデンサ素子を前記陽極部の突出方向が反対になるように複数枚積み重ねて構成した積層体と、
前記積層体の一方側から突出した前記陽極部に電気的に接続された一方側陽極端子と、
前記積層体の他方側から突出した前記陽極部に電気的に接続された他方側陽極端子と、
前記一方側陽極端子と前記他方側陽極端子とを電気的に接続する連結部と、
前記連結部、前記一方側陽極端子および前記他方側陽極端子と離間して配置されるとともに、前記複数のコンデンサ素子の陰極部からなる陰極体に電気的に接続された陰極端子と、を備えた積層型固体電解コンデンサであって、
前記積層体に対向した前記連結部の積層面と、前記連結部と前記陰極端子との隙間とに加えて、前記陰極端子と前記一方側および他方側陽極端子との隙間をも覆う第1の絶縁体をさらに備えたことを特徴とする積層型固体電解コンデンサ。
A laminated body constituted by stacking a plurality of capacitor elements in which the anode part is formed on one side and the cathode part is formed on the other side of the flat anode element made of a valve metal so that the protruding direction of the anode part is opposite;
A one-side anode terminal electrically connected to the anode portion protruding from one side of the laminate;
The other-side anode terminal electrically connected to the anode portion protruding from the other side of the laminate,
A connecting portion for electrically connecting the one side anode terminal and the other side anode terminal;
A cathode terminal disposed apart from the coupling portion, the one-side anode terminal, and the other-side anode terminal, and electrically connected to a cathode body comprising cathode portions of the plurality of capacitor elements. A multilayer solid electrolytic capacitor,
In addition to the stacking surface of the connecting portion facing the stacked body and the gap between the connecting portion and the cathode terminal, a first gap that covers the gap between the cathode terminal and the one side anode terminal and the other side anode terminal is also covered. A multilayer solid electrolytic capacitor, further comprising an insulator.
弁作用金属からなる平板状陽極素子の一方側に陽極部、他方側に陰極部が形成されたコンデンサ素子を前記陽極部の突出方向が反対になるように複数枚積み重ねて構成した積層体と、
前記積層体の一方側から突出した前記陽極部に電気的に接続された一方側陽極端子と、
前記積層体の他方側から突出した前記陽極部に電気的に接続された他方側陽極端子と、
前記一方側陽極端子と前記他方側陽極端子とを電気的に接続する連結部と、
前記連結部、前記一方側陽極端子および前記他方側陽極端子と離間して配置されるとともに、前記積層体に対向した矩形状の積層面を有し、該積層面が前記複数のコンデンサ素子の陰極部からなる陰極体に電気的に接続された陰極端子と、を備えた積層型固体電解コンデンサであって、
前記積層体に対向した前記連結部の積層面上と、前記陰極端子の積層面における前記連結部側の周縁上とに加えて、前記陰極端子の積層面における前記一方側陽極端子側および前記他方側陽極端子側の周縁上にも配置された第1の絶縁体をさらに備えたことを特徴とする積層型固体電解コンデンサ。
A laminated body constituted by stacking a plurality of capacitor elements in which the anode part is formed on one side and the cathode part is formed on the other side of the flat anode element made of a valve metal so that the protruding direction of the anode part is opposite;
A one-side anode terminal electrically connected to the anode portion protruding from one side of the laminate;
The other-side anode terminal electrically connected to the anode portion protruding from the other side of the laminate,
A connecting portion for electrically connecting the one side anode terminal and the other side anode terminal;
The connecting portion, the one-side anode terminal, and the other-side anode terminal are disposed apart from each other and have a rectangular laminated surface facing the laminated body, and the laminated surface is a cathode of the plurality of capacitor elements. A cathode terminal electrically connected to a cathode body comprising a portion, and a multilayer solid electrolytic capacitor comprising:
In addition to the laminated surface of the connecting portion facing the laminated body and the peripheral edge on the connecting portion side of the laminated surface of the cathode terminal, the one-side anode terminal side and the other on the laminated surface of the cathode terminal A multilayer solid electrolytic capacitor, further comprising a first insulator disposed on a peripheral edge on the side anode terminal side.
前記第1の絶縁体は、前記陰極端子の積層面の全周縁上に配置されていることを特徴とする請求項1または2に記載の積層型固体電解コンデンサ。   3. The multilayer solid electrolytic capacitor according to claim 1, wherein the first insulator is disposed on the entire periphery of the laminated surface of the cathode terminal. 4. 前記陰極端子の積層面のうち前記第1の絶縁体が配置されていない領域に配置され、該領域を複数の領域に区画する第2の絶縁体と、
をさらに含むことを特徴とする請求項1ないし3のいずれかに記載の積層型固体電解コンデンサ。
A second insulator which is disposed in a region where the first insulator is not disposed in the laminated surface of the cathode terminal, and divides the region into a plurality of regions;
The multilayer solid electrolytic capacitor according to claim 1, further comprising:
前記第1の絶縁体の端面のうち前記陰極端子の周縁上にある部分に、複数の凹凸が形成されていることを特徴とする請求項1ないし4のいずれかに記載の積層型固体電解コンデンサ。   5. The multilayer solid electrolytic capacitor according to claim 1, wherein a plurality of irregularities are formed on a portion of the end face of the first insulator on the periphery of the cathode terminal. . 前記第1の絶縁体は、絶縁テープであることを特徴とする請求項1ないし5のいずれかに記載の積層型固体電解コンデンサ。   The multilayer solid electrolytic capacitor according to claim 1, wherein the first insulator is an insulating tape. 前記第1の絶縁体の端面のうち前記陰極端子の周縁上にある部分に、庇部が形成されていることを特徴とする請求項1ないし6のいずれかに記載の積層型固体電解コンデンサ。   7. The multilayer solid electrolytic capacitor according to claim 1, wherein a flange portion is formed on a portion of the end face of the first insulator on the periphery of the cathode terminal. 前記庇部は、2つ以上の前記第1の絶縁体が積層されることにより形成されたものであることを特徴とする請求項7に記載の積層型固体電解コンデンサ。   8. The multilayer solid electrolytic capacitor according to claim 7, wherein the flange is formed by laminating two or more first insulators.
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JP2008103447A (en) * 2006-10-18 2008-05-01 Matsushita Electric Ind Co Ltd Chip type solid-state electrolytic capacitor
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JP2007116064A (en) * 2005-10-24 2007-05-10 Nichicon Corp Laminated solid electrolytic capacitor
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