JP2012084744A5 - - Google Patents
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- Publication number
- JP2012084744A5 JP2012084744A5 JP2010230826A JP2010230826A JP2012084744A5 JP 2012084744 A5 JP2012084744 A5 JP 2012084744A5 JP 2010230826 A JP2010230826 A JP 2010230826A JP 2010230826 A JP2010230826 A JP 2010230826A JP 2012084744 A5 JP2012084744 A5 JP 2012084744A5
- Authority
- JP
- Japan
- Prior art keywords
- protective film
- film
- forming
- copper ion
- semiconductor wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000001681 protective effect Effects 0.000 claims description 25
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 14
- 229910001431 copper ion Inorganic materials 0.000 claims description 14
- 239000004065 semiconductor Substances 0.000 claims description 13
- 238000005247 gettering Methods 0.000 claims description 11
- 239000003795 chemical substances by application Substances 0.000 claims description 7
- 238000001179 sorption measurement Methods 0.000 claims description 7
- 239000007787 solid Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims 4
- 239000007864 aqueous solution Substances 0.000 claims 2
- 230000015572 biosynthetic process Effects 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 239000002738 chelating agent Substances 0.000 claims 1
- 239000003086 colorant Substances 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims 1
- 229910001385 heavy metal Inorganic materials 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 150000002736 metal compounds Chemical class 0.000 claims 1
- 239000006078 metal deactivator Substances 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 6
- 238000011109 contamination Methods 0.000 description 3
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010230826A JP5918926B2 (ja) | 2010-10-13 | 2010-10-13 | 保護膜形成用フィルムおよび半導体チップの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010230826A JP5918926B2 (ja) | 2010-10-13 | 2010-10-13 | 保護膜形成用フィルムおよび半導体チップの製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014260263A Division JP6085288B2 (ja) | 2014-12-24 | 2014-12-24 | 保護膜形成用フィルムおよび半導体チップの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012084744A JP2012084744A (ja) | 2012-04-26 |
| JP2012084744A5 true JP2012084744A5 (enExample) | 2013-09-05 |
| JP5918926B2 JP5918926B2 (ja) | 2016-05-18 |
Family
ID=46243305
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010230826A Active JP5918926B2 (ja) | 2010-10-13 | 2010-10-13 | 保護膜形成用フィルムおよび半導体チップの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5918926B2 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6411142B2 (ja) * | 2014-09-09 | 2018-10-24 | 株式会社ディスコ | 保護被膜の被覆方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05226308A (ja) * | 1992-02-18 | 1993-09-03 | Sony Corp | 半導体ウエハの裏面処理方法及びその装置 |
| JP2000124177A (ja) * | 1998-10-15 | 2000-04-28 | Sony Corp | 半導体装置の製造方法 |
| JP3544362B2 (ja) * | 2001-03-21 | 2004-07-21 | リンテック株式会社 | 半導体チップの製造方法 |
| JP2008218930A (ja) * | 2007-03-07 | 2008-09-18 | Furukawa Electric Co Ltd:The | エネルギー線硬化型チップ保護用フィルム |
| US20100007007A1 (en) * | 2008-07-08 | 2010-01-14 | Samsung Electronics Co., Ltd | Semiconductor package |
-
2010
- 2010-10-13 JP JP2010230826A patent/JP5918926B2/ja active Active
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