JP2012084704A - Heat exchanger for double side cooling of semiconductor - Google Patents

Heat exchanger for double side cooling of semiconductor Download PDF

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JP2012084704A
JP2012084704A JP2010230146A JP2010230146A JP2012084704A JP 2012084704 A JP2012084704 A JP 2012084704A JP 2010230146 A JP2010230146 A JP 2010230146A JP 2010230146 A JP2010230146 A JP 2010230146A JP 2012084704 A JP2012084704 A JP 2012084704A
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semiconductor
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pipes
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JP5580162B2 (en
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Shiro Fujishima
史郎 藤島
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T Rad Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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Abstract

PROBLEM TO BE SOLVED: To solve such a problem of a double side cooling semiconductor device that it requires a large number of components including a contractible part in the shape of a bellows, a presser plate for compressing in the lamination direction, through bolts and nuts, and thereby the structure is complicated, and to provide a highly versatile heat exchanger for double side cooling of a semiconductor.SOLUTION: The heat exchanger for double side cooling of a semiconductor has first and second flat elements 1, 2 which internally conduct fluid for cooling and are coupled while facing the planes each other. A pair of connection pipes 3, 4 are projected from each end of each flat element 1, 2 while facing each other. The outer periphery of the connection pipes 3, 4 are threaded 5, 6 reversely to each other and a connection nut 7 is screwed therebetween.

Description

本発明は、パワートランジスタ等の半導体をその両面から冷却する熱交換器に関する。   The present invention relates to a heat exchanger that cools a semiconductor such as a power transistor from both sides thereof.

下記特許文献１の両面冷却半導体装置が提案されている。
これは複数の偏平冷却管を積層したものであり、各偏平冷却管の両端部に厚み方向に縮む蛇腹状等の可縮部を設け、可縮部において各冷却管どうしを接続する。それと共に、冷却管の４隅にボルトおよびナットからなる締結部材を貫通し、それによって各偏平管どうしを互いに締結して、各偏平冷却管の対向面間に半導体モジュールを挟持させるものである。 The double-sided cooling semiconductor device of the following patent document 1 is proposed.
This is formed by laminating a plurality of flat cooling pipes, each of the flat cooling pipes is provided with a constrictible portion such as a bellows that shrinks in the thickness direction, and the cooling pipes are connected to each other in the shrinkable portion. At the same time, fastening members made of bolts and nuts are passed through the four corners of the cooling pipe, whereby the flat tubes are fastened to each other, and the semiconductor module is sandwiched between the opposing surfaces of the flat cooling pipes.

特許第４０８９５９５号公報Japanese Patent No. 4089595

上記両面冷却半導体装置は部品点数が多く、構造が複雑となる。すなわち、蛇腹状等の可縮部と、積層方向に圧縮するための押さえ板、貫通ボルトおよびナットが必要となる。さらには、可縮部の加工が面倒であると共に、可縮部の可縮量の変更がしにくく、各種厚さの半導体への対応性が小さい欠点がある。すなわち、被冷却対象の変化に対する適用性および設計の自由度が低い欠点がある。
そこで本発明は部品点数が少なく且つ、汎用性の高い両面冷却用熱交換器を提供することを課題とする。 The double-sided cooling semiconductor device has a large number of parts and a complicated structure. That is, a contractible portion such as a bellows, a pressing plate for compressing in the stacking direction, a through bolt and a nut are required. Furthermore, the processing of the shrinkable part is troublesome, and it is difficult to change the shrinkable amount of the shrinkable part, and there is a drawback that the adaptability to semiconductors of various thicknesses is small. That is, there is a drawback that the applicability to the change of the object to be cooled and the degree of freedom of design are low.
Then, this invention makes it a subject to provide the heat exchanger for double-sided cooling with few parts and high versatility.

請求項１に記載の本発明は、夫々内部に冷却用の流体が流通し、それらの平面が互いに対向して連結される偏平な第１エレメント(1)と第２エレメント(2)とを有し、各エレメント(1)(2)の平面の両端部に一対づつの接続パイプ(3)(4)が対向して突設され、それぞれの接続パイプ(3)(4)の外周に、ネジ山(5)(6)が螺刻され、その対向する接続パイプ(3)(4)間が連結ナット(7)の螺着により、各エレメント(1)(2)間距離が互いに近づくように、対向する接続パイプ(3)(4)の外周の前記ネジ山(5)(6)は互いに逆向きの外ネジに螺刻され、または連結ナット(7)の内面の軸方向両端部に逆向きの一対の内ネジが螺刻され、
接続パイプ(3)(4)間が連結ナット(7)の螺着により各エレメント(1)(2)間に半導体(8)の両面が挟持されると共に、前記各接続パイプ(3)(4)が各エレメント間を連通する前記流体の流通路とされた半導体の両面冷却用熱交換器である。 The present invention described in claim 1 has a flat first element (1) and a second element (2) in which a cooling fluid flows inside and the planes of which are connected to face each other. Then, a pair of connection pipes (3) and (4) project from both ends of the plane of each element (1) and (2) so as to face each other, and screws are attached to the outer periphery of each connection pipe (3) and (4). The ridges (5) and (6) are threaded, and the distance between the elements (1) and (2) becomes closer to each other by screwing the connecting nut (7) between the opposing connection pipes (3) and (4). The threads (5) and (6) on the outer periphery of the connecting pipes (3) and (4) facing each other are threaded by external screws opposite to each other, or reversed at both axial ends of the inner surface of the connecting nut (7). A pair of internal screws are threaded,
Between the connecting pipes (3) and (4), both sides of the semiconductor (8) are sandwiched between the elements (1) and (2) by screwing the connecting nut (7), and the connecting pipes (3) and (4) are connected. ) Is a heat exchanger for cooling both sides of a semiconductor, which is used as a flow path for the fluid communicating between the elements.

請求項２に記載の本発明は、夫々内部に冷却用の流体が流通し、それらの平面が互いに対向して連結される偏平な第１エレメント(1)と第２エレメント(2)とを有し、各エレメント(1)(2)の平面の両端部に一対づつの接続パイプ(3)(4)が対向して突設され、それぞれの接続パイプ(3)(4)の内周に、ネジ山(5)(6)が螺刻され、その対向する接続パイプ(3)(4)間が、外周にネジ山を有する連結パイプ(9)により連結されて、各エレメント(1)(2)間の距離が互いに近づくように、対向する接続パイプ(3)(4)の内周の前記ネジ山(5)(6)は互いに逆向きに螺刻された内ネジが形成され、または連結パイプ(9)の外面の軸方向両端部に逆向きの一対の外ネジが螺刻され、
その対向する接続パイプ(3)(4)間が連結パイプ(9)により連結されて、その各エレメント (1)(2)間に半導体(8)が挟持されると共に、前記各接続パイプ(3)(4)が各エレメント間を連通する前記流体の流通路とされた半導体の両面冷却用熱交換器である。 The present invention according to claim 2 has a flat first element (1) and a second element (2) in which a cooling fluid flows inside and the planes of which are connected to face each other. Then, a pair of connection pipes (3) and (4) are provided oppositely projecting from both ends of the plane of each element (1) and (2), and on the inner periphery of each connection pipe (3) and (4), The threads (5) and (6) are threaded, and the connecting pipes (3) and (4) facing each other are connected by a connecting pipe (9) having a thread on the outer periphery, and each element (1) (2 ), The inner threads of the opposing connection pipes (3) and (4) are formed with internal threads that are threaded in opposite directions or connected to each other. A pair of opposite external screws are threaded on both axial ends of the outer surface of the pipe (9),
The connecting pipes (3) and (4) facing each other are connected by a connecting pipe (9), and a semiconductor (8) is sandwiched between the elements (1) and (2). (4) is a heat exchanger for double-sided cooling of a semiconductor which is used as a fluid flow path communicating between the elements.

本発明の熱交換器は、一対のエレメント１、２の各平面間に半導体８の両面が挟持されるものにおいて、各エレメント１、２の平面の両端部に突設された接続パイプ３、４にネジ山５、６が螺刻され、それらの間が連結ナット７（または連結パイプ）によって互いに近接するように締結されるから、構造が簡単で且つ半導体８の締結および分離作業がきわめて容易である。それと共に、その接続パイプ３、４自体が各エレメント間を連通する流体の流通路とされているから、部品点数が少なく、体裁の良い両面冷却用熱交換器を提供できる。   In the heat exchanger according to the present invention, both surfaces of the semiconductor 8 are sandwiched between the flat surfaces of the pair of elements 1 and 2, and the connection pipes 3 and 4 projecting from both ends of the flat surfaces of the elements 1 and 2. Since the threads 5 and 6 are threaded on each other and are fastened so as to be close to each other by the connecting nut 7 (or connecting pipe), the structure is simple and the semiconductor 8 is fastened and separated very easily. is there. At the same time, since the connecting pipes 3 and 4 themselves serve as fluid flow paths communicating between the elements, it is possible to provide a heat exchanger for double-sided cooling with a small number of parts and good appearance.

本発明の第１実施例の一部断面正面図。The partial cross section front view of 1st Example of this invention. 同要部縦断面図。The principal part longitudinal cross-sectional view. 同要部分解斜視図。FIG. 本発明の第２実施例の要部縦断面図。The principal part longitudinal cross-sectional view of 2nd Example of this invention.

次に図面に基づいて本発明の実施の形態につき説明する。
（第１実施例）
図１〜図３は、本発明の第１実施例を示している。この両面冷却用熱交換器は、１以上のインバータやパワートランジスタ等の半導体８をその両面から冷却するものである。この例では、二つのエレメント１、２が積層されているが、それを多段にすることができる。各エレメント１、２は内部に冷却用の流体が流通するものである。 Next, embodiments of the present invention will be described with reference to the drawings.
(First embodiment)
1 to 3 show a first embodiment of the present invention. This double-sided cooling heat exchanger cools the semiconductor 8 such as one or more inverters and power transistors from both sides. In this example, two elements 1 and 2 are laminated, but it can be multi-staged. Each of the elements 1 and 2 has a cooling fluid flowing therein.

各エレメント１、２は一対の皿状に形成されたプレート1a、1b、プレート2a、2bをそのフランジ部で接合し、内部にインナーフィン13を配置している。各エレメントの両端部には一対づつの開口と、その開口縁に接続パイプ３、４の一端が接続され、それらがエレメントの内部に連通する。互いに対向する接続パイプ３、４の外周には、それぞれ互いに逆向きのネジ山５、６が螺刻されている。一例として接続パイプ３のネジ山５を右ネジとすれば、接続パイプ４のネジ山６は左ネジとなる。   Each element 1 and 2 has a pair of plate-shaped plates 1a and 1b and plates 2a and 2b joined together at their flange portions, and an inner fin 13 is disposed inside. A pair of openings is connected to both ends of each element, and one ends of connection pipes 3 and 4 are connected to the edges of the openings, which communicate with the inside of the element. On the outer circumferences of the connecting pipes 3 and 4 facing each other, screw threads 5 and 6 opposite to each other are threaded. As an example, if the thread 5 of the connection pipe 3 is a right-hand thread, the thread 6 of the connection pipe 4 is a left-hand thread.

また、この例ではエレメント２のプレート2aの外表面に一対のストッパ14が僅かに突設され、それらが半導体８の両端縁の位置決めを行なう。この例では、下側のエレメント２は、その上側のプレート2aのみに連通孔が形成されている。そして、上側のエレメント１は上下のプレート1a、1bともに連通孔が設けられ、プレート1bの連通孔には接続パイプ３の一端が接合され、その上側のプレート1aの連通孔にはボス部15の一端開口が接続されている。   In this example, a pair of stoppers 14 slightly project from the outer surface of the plate 2 a of the element 2, and they position both ends of the semiconductor 8. In this example, the lower element 2 has a communication hole only in the upper plate 2a. The upper element 1 is provided with communication holes in both the upper and lower plates 1a and 1b. One end of the connection pipe 3 is joined to the communication hole of the plate 1b, and the boss 15 is connected to the communication hole of the upper plate 1a. One end opening is connected.

このようにしてなるエレメント１、２は、それぞれの各部品間が一体的にろう付け固定される。なお、ろう付けに代えて、溶接、一部接着剤を用いることもできる。ついで、一対のエレメント１、２間に伝熱性弾性シート16を介して半導体８が挟持され、上下方向の各接続パイプ３、４間を連結ナット７によって締結する。この連結ナット７は図3に示す如く、その外周にフランジ部17を有し、その外周が六角等に形成されて、スパナ等の工具の把持面を形成する。その連結ナット７の内面にはネジ（右ネジまたは左ネジのいずれか一方）が螺刻されている。そして、この連結ナット７を接続パイプ３、４の外周に螺着することにより、エレメント１、２間が縮小する。これは、上下のネジ山５とネジ山６は互いに逆向きに螺刻されているため、連結ナット７の回転により両者は近づく。また、逆方向に回転させれば両者は遠ざかる。   The elements 1 and 2 thus constructed are integrally brazed and fixed between the respective parts. In place of brazing, welding or partial adhesive can be used. Next, the semiconductor 8 is sandwiched between the pair of elements 1 and 2 via the heat conductive elastic sheet 16, and the connecting pipes 3 and 4 in the vertical direction are fastened by the connecting nut 7. As shown in FIG. 3, the connecting nut 7 has a flange portion 17 on its outer periphery, and its outer periphery is formed in a hexagon or the like to form a gripping surface of a tool such as a spanner. A screw (either a right screw or a left screw) is threaded on the inner surface of the connecting nut 7. Then, by screwing the connecting nut 7 around the outer periphery of the connecting pipes 3 and 4, the space between the elements 1 and 2 is reduced. This is because the upper and lower screw threads 5 and 6 are threaded in the opposite directions, so that the two come closer by the rotation of the connecting nut 7. Moreover, if it rotates in a reverse direction, both will move away.

そして、上側のエレメント１の一対のボス部15に冷却用流体のパイプ端が接続され、一方のボス部15から冷媒12が各エレメント１、２内に供給され、他方のボス部から流出する。そして、その冷媒12と半導体８との間に熱交換が行なわれる。冷媒12としては冷却水や気液二相状態の冷媒その他を使用することができる。   Then, the pipe end of the cooling fluid is connected to the pair of boss portions 15 of the upper element 1, the refrigerant 12 is supplied from one boss portion 15 into each element 1, and flows out from the other boss portion. Then, heat exchange is performed between the refrigerant 12 and the semiconductor 8. As the refrigerant 12, cooling water, a gas-liquid two-phase refrigerant, or the like can be used.

（変形例）
上記実施例では接続パイプ３，４の各ネジ山５、６を互いに逆向きに螺刻したが、それに替えてネジ山５、６の向きを同一とし且つ、連結ナット７の軸方向一端側と他端側にそれぞれ逆向きのネジを螺刻してもよい。 (Modification)
In the above embodiment, the threads 5 and 6 of the connection pipes 3 and 4 are threaded in opposite directions. Instead, the directions of the threads 5 and 6 are the same, and one end side of the connecting nut 7 in the axial direction is provided. You may screw the screw of the direction opposite to the other end side, respectively.

（第２実施例）
次に、図４は本発明の第２の実施の形態を示し、この例が前記第１実施例と異なる点は、対向する接続パイプ３、４が、その内側で連結パイプ９によって接続されるものである。連結パイプ９の外周には一定方向の外ネジが形成され、接続パイプ３、４の内面には互いに逆向きのネジ山５、６が螺刻されている。そして、連結パイプ９の軸方向の中間位置にフランジ部17が突設されている。そして、フランジ部17を回転させることにより、一対の接続パイプ３、４間を縮小し、半導体８をエレメント１、２の偏平な面で挟持するものである。 (Second embodiment)
Next, FIG. 4 shows a second embodiment of the present invention. This example is different from the first example in that the connecting pipes 3 and 4 facing each other are connected by a connecting pipe 9 inside thereof. Is. External threads in a certain direction are formed on the outer periphery of the connecting pipe 9, and screw threads 5 and 6 opposite to each other are threaded on the inner surfaces of the connection pipes 3 and 4. A flange portion 17 projects from an intermediate position in the axial direction of the connecting pipe 9. Then, by rotating the flange portion 17, the space between the pair of connection pipes 3, 4 is reduced, and the semiconductor 8 is sandwiched between the flat surfaces of the elements 1, 2.

（変形例）
上記図４の実施例では接続パイプ３、４の内面に形成したネジ山５、６を互いに逆向きとしたが、それに替えて各ネジ山５、６を同一向きとし、連結パイプ９外周の外ネジを、軸方向の一端側で右ネジとし、他端側で左ネジとすることができる。
なお、第１実施例および第２実施例において、複数の半導体８を挟持するには、図において各エレメント１の上方に他のエレメント１を別の連結ナット７又は連結パイプ９を介して接続すればよい。このとき、エレメント１の上下に突設された接続パイプのネジ山は逆向きにする。 (Modification)
In the embodiment of FIG. 4 above, the threads 5 and 6 formed on the inner surfaces of the connection pipes 3 and 4 are opposite to each other. The screw can be a right-hand thread on one end side in the axial direction and a left-hand thread on the other end side.
In the first embodiment and the second embodiment, in order to sandwich the plurality of semiconductors 8, another element 1 is connected above each element 1 via another connection nut 7 or connection pipe 9 in the drawing. That's fine. At this time, the threads of the connection pipe protruding from the top and bottom of the element 1 are reversed.

１ エレメント
1a,1b プレート
２ エレメント
2a，2b プレート
３ 接続パイプ
４ 接続パイプ
５ ネジ山
６ ネジ山
７ 連結ナット 1 element
1a, 1b Plate 2 elements
2a, 2b Plate 3 Connection pipe 4 Connection pipe 5 Thread 6 Thread 7 Connection nut

８ 半導体
９ 連結パイプ
10 外ネジ
11 外ネジ
12 冷媒
13 インナーフィン
14 ストッパ
15 ボス部
16 伝熱性弾性シート
17 フランジ部 8 Semiconductor 9 Connection pipe
10 External screw
11 External screw
12 Refrigerant
13 Inner fin
14 Stopper
15 Boss
16 Heat transfer elastic sheet
17 Flange

Claims (2)

夫々内部に冷却用の流体が流通し、それらの平面が互いに対向して連結される偏平な第１エレメント(1)と第２エレメント(2)とを有し、各エレメント(1)(2)の平面の両端部に一対づつの接続パイプ(3)(4)が対向して突設され、それぞれの接続パイプ(3)(4)の外周に、ネジ山(5)(6)が螺刻され、その対向する接続パイプ(3)(4)間が連結ナット(7)の螺着により、各エレメント(1)(2)間距離が互いに近づくように、対向する接続パイプ(3)(4)の外周の前記ネジ山(5)(6)は互いに逆向きの外ネジに螺刻され、または連結ナット(7)の内面の軸方向両端部に逆向きの一対の内ネジが螺刻され、
接続パイプ(3)(4)間が連結ナット(7)の螺着により各エレメント(1)(2)間に半導体(8)の両面が挟持されると共に、前記各接続パイプ(3)(4)が各エレメント間を連通する前記流体の流通路とされた半導体の両面冷却用熱交換器。 Each of the elements (1), (2) has a flat first element (1) and a second element (2) in which cooling fluid flows inside and the planes of which are connected to each other. A pair of connection pipes (3) and (4) are provided to project at both ends of the flat surface of the plate, and threads (5) and (6) are threaded on the outer periphery of each connection pipe (3) and (4). The opposing connection pipes (3) (4) are connected so that the distance between the elements (1) and (2) approaches each other by screwing the connecting nut (7) between the opposing connection pipes (3) and (4). ) Of the outer periphery of the screw (5) and (6) are threaded on the outer threads that are opposite to each other, or a pair of inner threads that are oppositely threaded on both axial ends of the inner surface of the connecting nut (7). ,
Between the connecting pipes (3) and (4), both sides of the semiconductor (8) are sandwiched between the elements (1) and (2) by screwing the connecting nut (7), and the connecting pipes (3) and (4) are connected. ) Is a heat exchanger for double-sided cooling of a semiconductor, which serves as a flow path for the fluid communicating between the elements. 夫々内部に冷却用の流体が流通し、それらの平面が互いに対向して連結される偏平な第１エレメント(1)と第２エレメント(2)とを有し、各エレメント(1)(2)の平面の両端部に一対づつの接続パイプ(3)(4)が対向して突設され、それぞれの接続パイプ(3)(4)の内周に、ネジ山(5)(6)が螺刻され、その対向する接続パイプ(3)(4)間が、外周にネジ山を有する連結パイプ(9)により連結されて、各エレメント(1)(2)間の距離が互いに近づくように、対向する接続パイプ(3)(4)の内周の前記ネジ山(5)(6)は互いに逆向きに螺刻された内ネジが形成され、または連結パイプ(9)の外面の軸方向両端部に逆向きの一対の外ネジが螺刻され、
その対向する接続パイプ(3)(4)間が連結パイプ(9)により連結されて、その各エレメント (1)(2)間に半導体(8)が挟持されると共に、前記各接続パイプ(3)(4)が各エレメント間を連通する前記流体の流通路とされた半導体の両面冷却用熱交換器。 Each of the elements (1), (2) has a flat first element (1) and a second element (2) in which cooling fluid flows inside and the planes of which are connected to each other. A pair of connection pipes (3) and (4) are provided to project at both ends of the flat surface of each other, and threads (5) and (6) are threaded on the inner periphery of each connection pipe (3) and (4). The connecting pipes (3) and (4) facing each other are connected by a connecting pipe (9) having a thread on the outer periphery, so that the distance between the elements (1) and (2) approaches each other. The threads (5) and (6) on the inner periphery of the opposing connection pipes (3) and (4) are formed with internal threads that are threaded in opposite directions, or both axial ends of the outer surface of the connection pipe (9) A pair of opposite external screws are threaded on the part,
The connecting pipes (3) and (4) facing each other are connected by a connecting pipe (9), and a semiconductor (8) is sandwiched between the elements (1) and (2). (4) A heat exchanger for double-sided cooling of a semiconductor, wherein (4) serves as a fluid flow passage communicating between the elements.
JP2010230146A 2010-10-13 2010-10-13 Heat exchanger for double-sided cooling of semiconductors Expired - Fee Related JP5580162B2 (en)

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