JPH10209359A - Element for multi-stage connection-type heat sink and heat sink - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a compact water-cooled heat sink having a desired capacity, simply by mechanically connecting a plurality of elements of the same shape. SOLUTION: A pair of elongated plates 1 are superimposed to form an elongated flat flow path 2a inside, and peripheral edge portions of the plates are hermetically joined, thus constituting an element body 2. Then, a short tube-like first boss portion 3 is joined to each of a pair of cooling liquid outlet/inlet ports provided on both ends of one plate 1, and a short tube-like boss portion 4 is joined to each of a pair of cooling liquid outlet/inlet ports provided on both ends of the other plate 1. In addition, a male screw 3a is formed on an outer circumference of the first boss portion 3. A brim portion 4a is provided on an outer circumference of a distal end portion of the second boss portion 4, and a nut with inner brim 5 is fitted with the second boss portion 4. Then, a semiconductor 6 to be cooled is mounted on an outer surface of the plate 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates generally to a heat sink for cooling a power semiconductor such as a thyristor, and more particularly to a heat sink element and a compact heat sink which can cool a semiconductor by a cooling liquid and change a cooling capacity arbitrarily.

[0002]

2. Description of the Related Art A heat sink for cooling a power semiconductor such as a thyristor is generally of an air-cooling type and comprises a semiconductor mounting base and fins provided so as to conduct heat thereto. Further, as a heat sink for cooling a large-capacity semiconductor or a large number of semiconductors, a water-cooled heat sink using cooling water is also conceivable.

[0003]

In order to increase the capacity of the air-cooled heat sink, it is sufficient to arrange a plurality of heat sink elements in parallel. However, since the water-cooled heat sink needs to circulate the cooling water inside, it is necessary to integrally form the whole for each desired capacity. Therefore, in the case of a heat sink of a small lot, there is a disadvantage that the production cost is increased. Accordingly, an object of the present invention is to provide a compact multi-stage connection type heat sink element capable of mechanically detachably connecting a plurality of elements having the same shape and a heat sink for the same.

[0004]

The multi-stage connection type heat sink element according to the present invention has a dish shape with a slight rising portion formed on at least one peripheral edge, and a coolant inlet / outlet 1a at each longitudinal end. Are formed, and a pair of elongate plates 1 whose entire periphery is aligned with each other are overlapped so that an elongate flat flow path 2a is formed inside, and the peripheries are joined in a liquid-tight manner. An element main body 2 is formed, and one end surfaces of short tubular first boss portions 3 are respectively liquid-tightly joined to the rims of the pair of cooling liquid ports 1a of one of the plates 1 while the other plate 1 One end surfaces of the short tubular second bosses 4 are respectively liquid-tightly joined to the rims of the pair of the cooling liquid inlets / outlets 1a, and the first boss 3 has an external thread 3a formed on the outer periphery thereof, The second boss 4 is The flange portion 4 for retaining nut to Tangaishu
a, a nut 5 with an inner flange, which is screwed in alignment with the male screw 3a so as to be movable in the axial direction, is fitted on the outer surface of the plate 1, and a semiconductor 6 to be cooled is mounted on the outer surface of the plate 1.
Is attached.

Further, according to the second invention, the first boss 3
Alternatively, an O-ring fitting groove 7 for sealing is formed on one end surface of the second boss portion 4, and a mounting plate 8 is previously brazed or soldered and fixed to the outer surface of the plate 1, and a semiconductor is mounted on the mounting plate 8. A bolt hole 8a for fastening is provided. Further, the heat sink of the present invention uses a plurality of the same elements 13 according to the second invention, inserts an O-ring 14 into the O-ring fitting groove 7 of the elements 13, and forms a first boss portion of one of the elements. 3 and the second boss portion of the other element are fastened and fixed in series in the thickness direction of the element via the nut 5 with the inner collar, and the elements 13 are connected in multiple stages, and a pair of elements at the ends in the connection direction are connected. The opening of the boss portion (3 or 4) is closed,
The remaining boss (3 or 4) of the element at its end
The cooling liquid pipe 10 is connected to the opening through a connector 11.

[0006]

Next, an embodiment of the present invention will be described. FIG. 1 is a perspective view of a main part of a multi-stage connection type heat sink element of the present invention, and FIG. 2 is a front view of a main part showing a use state of the element. FIG. 3 is a plan view of a main part of the element, and FIG. 4 is a schematic perspective view showing a use state of the present invention. This multi-stage connection type heat sink element has a pair of plates 1 and a pair of first boss portions 3 and second boss portions 4 protrudingly fixed at both ends thereof. The pair of plates 1 are formed in the same shape, a small rising portion is formed on the peripheral edge, and a small brazing portion 1b for brazing protrudes from the edge. Further, at both ends of each plate 1, a coolant inlet / outlet 1a is formed. Then, the pair of plates 1 are overlapped in the opposite directions to align the respective small flange portions 1b, and the inner fin 9 is inserted inside.

[0007] A reinforcing reinforcement 15 shown in FIG. 3 is arranged on the inner surface of the plate 1 and at the edge of the hole of the coolant inlet / outlet 1a. Then, a flat flow path 2a is formed in the pair of plates 1, and the contact portions of these components are integrally brazed and fixed to form the element body 2. At both ends of the element body 2, the one end surface of the short tubular first boss portion 3 is liquid-tightly brazed and fixed to the hole edge of the coolant inlet / outlet 1a of the lower plate 1. This first
On the outer periphery of the boss 3, a male screw 3a is formed. Further, an O-ring fitting groove 7 is formed on the distal end surface of the first boss portion 3, and an O-ring 14 is fitted therein. Further, one end of a short tubular second boss portion 4 is liquid-tightly brazed and fixed to the edge of the hole of the coolant inlet / outlet 1a of the upper plate 1. On the outer periphery of the opening end of the second boss 4, an annular flange 4 is provided.
a is integrally protruded.

[0008] An inner flanged nut 5 is axially movably fitted to the second boss 4, and the inner flanged nut 5 is screwed into the male screw 3 a of the first boss 3. Is configured. The inner flange portion of the inner flanged nut 5 is supported by the flange portion 4a of the second boss portion 4, so that the inner flanged nut 5 cannot be moved further outward in the axial direction. Next, the mounting plate 8 is provided on the outer surface of the plate 1.
Are fixed integrally by means such as brazing. The mounting plate 8 has a plurality of bolt holes 8a formed at appropriate positions. In addition, the drilling of the bolt hole 8a is
Before or after brazing. The semiconductor 6 is detachably fastened and fixed to the mounting plate 8 via bolts 12.

The element 13 thus constructed is shown in FIG.
And as shown in FIG. 4, they are connected in a plurality of stages. That is, the nut 5 with the inner flange fitted on the second boss 4 on the lower side is screwed and fastened to the external thread 3 a on the outer periphery of the first boss 3 on the upper side. At this time, an O-ring 14 inserted into the end face of the first boss 3 seals the liquid-tight space between them. And the male screw 3a of the element 13 at the bottom
A cap nut (not shown) for closing is fastened and fixed. In addition,
Instead of the cap nut, an element exclusively for the lowermost stage having no cooling liquid inlet / outlet in the lower plate 1 may be manufactured. Further, a coolant pipe 10 provided with a connector 11 at the end is connected to the second boss 4 at the uppermost stage. That is,
By screwing the inner flanged nut 5 to the outer periphery of the connector 11, the coolant pipe 10 and the inside of each element 13 are communicated. Then, the coolant flows in from one coolant pipe 10 and flows out from the other coolant pipe 10 through the flat flow passage 2a of each element 13. While the coolant flows through the flat flow path 2a, each plate 1 and the semiconductor 6 undergo heat exchange via the mounting plate 8.

[0010]

The multi-stage connection type heat sink element of the present invention and the heat sink using the same are provided with a pair of first boss portions 3 and a second boss portion 4 at each of the coolant inlets and outlets 1a of a pair of plates 1. And the second boss 4
The inner flanged nut 5 fitted on the first boss portion 3 is screwed and fastened to the male screw 3a of the first boss portion 3, so that a plurality of elements 13 are superposed in multiple stages, and an inner flanged nut is provided therebetween. A compact heat sink having a desired capacity can be obtained only by fastening and fixing through the joint 5. for that reason,
It can be a versatile heat sink. Further, the first boss portion 3 and the second boss portion 4 constitute spacers between the respective elements, and the adjacent elements can be appropriately separated from each other by a proper distance.

[Brief description of the drawings]

FIG. 1 is a perspective view of an essential part of an element for a multi-stage connection type heat sink according to the present invention.

FIG. 2 is a front view of a main part showing the same use state.

FIG. 3 is a plan view of a main part of the element.

FIG. 4 is a schematic perspective view showing a use state of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Plate 1a Coolant inlet / outlet 1b Small flange part 2 Element main body 2a Flat flow path 3 First boss part 3a Male screw 4 Second boss part 4a Flange part 5 Nut with inner flange 6 Semiconductor 7 O-ring fitting groove 8 Mounting plate 8a Bolt hole 9 Inner fin 10 Coolant pipe 11 Connector 12 Bolt 13 Element 14 O-ring 15 Lean hosement

Claims (3)

[Claims] 1. A pair of elongated plates 1 having at least one peripheral edge formed with a slight rising portion to form a dish and having a coolant inlet / outlet 1a at each of both longitudinal ends thereof, all peripheral edges of which are aligned with each other. The two plates 1 are overlapped so that an elongated flat flow path 2a is formed therein, and their peripheral edges are liquid-tightly joined to form an element body 2. One end surface of a short tubular first boss portion 3 is liquid-tightly joined to the edge of the coolant inlet / outlet 1a, and a short tube is attached to the edge of the pair of coolant inlet / outlet 1a of the other plate 1. One end surfaces of the second boss portions 4 are liquid-tightly joined, respectively. The first boss portion 3 has a male screw 3a formed on the outer periphery thereof. And a shaft 4 Movably in direction and,
An inner flanged nut 5 screwed in alignment with the male screw 3a
And a multi-stage connection type heat sink element in which a semiconductor 6 to be cooled is mounted on the outer surface of the plate 1. 2. An O-ring fitting groove for sealing is formed on one end surface of the first boss portion or the second boss portion, and a mounting plate is formed on an outer surface of the plate. Is a multi-stage connection type heat sink element in which a mounting plate 8 is previously fixed by brazing or soldering and a bolt hole 8a for fastening a semiconductor is provided. 3. A plurality of the same elements 13 according to claim 2, wherein an O-ring is formed in the O-ring fitting groove 7 of the elements 13.
14, the first boss 3 of one element and the second boss of the other element are fastened and fixed in series in the thickness direction of the element via the nut 5 with the inner flange, and the element 13 is multi-staged. And a pair of the bosses (3) of the element at the end in the connection direction.
Or 4) a heat sink configured such that the opening of 4) is closed and the coolant pipe 10 is connected via a connector 11 to the opening of the boss (3 or 4) at the end of the element.