CN111023650A - Cooling device and cooling system - Google Patents
Cooling device and cooling system Download PDFInfo
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- CN111023650A CN111023650A CN201911364861.7A CN201911364861A CN111023650A CN 111023650 A CN111023650 A CN 111023650A CN 201911364861 A CN201911364861 A CN 201911364861A CN 111023650 A CN111023650 A CN 111023650A
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- cooling
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D1/00—Devices using naturally cold air or cold water
- F25D1/02—Devices using naturally cold air or cold water using naturally cold water, e.g. household tap water
Abstract
The invention relates to a cooling device comprising: a chamber; the two hollow cooling discs are positioned in the cavity and oppositely arranged, and are used for cooling a to-be-cooled part positioned between the two cooling discs; each cooling disc is provided with a cooling water inlet communicated with an external cooling water supply structure and a cooling water outlet communicated with an external cooling water recovery structure; the supporting structure is used for supporting the piece to be cooled and arranged on the side wall of the chamber, and the supporting structure is positioned between the two cooling disks; and the adjusting structure is used for controlling at least one cooling disc to move so that the distances between the two cooling discs and the piece to be cooled are equal. The invention also relates to a cooling system.
Description
Technical Field
The invention relates to the technical field of cooling, in particular to a cooling device and a cooling system.
Background
High temperature processes are an essential component of semiconductor manufacturing processes. The existence of high temperature processes places higher demands on semiconductor processing equipment. When the high-temperature silicon wafer is placed in the chamber, the temperature is about 300-400 ℃. The main cooling means is to rely on the metal plate on the back side for cooling and the N on the front side2And cooling the gas atmosphere. In the cooling process, the back of the silicon chip is close to the metal cooling plate, the specific heat capacity of the metal is small, and the silicon chipThe cooling speed of the back surface is high; the front surface of the silicon wafer is mainly dependent on N2And heat transfer and cooling are carried out, the specific heat capacity of the gas is large, and the cooling speed of the front surface of the silicon wafer is low. The temperature difference exists between the front side and the back side of the high-temperature silicon wafer, the internal stress of the silicon wafer is uneven due to the temperature difference, surface defects are generated, and the silicon wafer deforms and is concave or convex when serious.
Disclosure of Invention
In order to solve the above technical problems, the present invention provides a cooling apparatus and a cooling system, which solve the problem of defects and even deformation caused by uneven cooling of both surfaces of a silicon wafer.
In order to achieve the purpose, the invention adopts the technical scheme that: a cooling device, comprising:
a chamber;
the cooling plates are positioned in the cavity and are oppositely arranged, and the cooling plates are of hollow structures and used for cooling the to-be-cooled part positioned between the two cooling plates; each cooling disc is provided with a cooling water inlet communicated with an external cooling water supply structure and a cooling water outlet communicated with an external cooling water recovery structure;
the supporting structure is used for supporting the piece to be cooled and arranged on the side wall of the chamber, and the supporting structure is positioned between the two cooling disks;
and the adjusting structure is used for controlling at least one cooling disc to move so that the distances between the two cooling discs and the piece to be cooled are equal.
Optionally, the cooling device further comprises a first water inlet pipeline and a second water inlet pipeline which are respectively communicated with the cooling water inlets of the two cooling disks, and the first water inlet pipeline and the second water inlet pipeline are connected with the same cooling water supply structure.
Optionally, the cooling device further comprises a first water inlet pipeline and a second water inlet pipeline which are respectively communicated with the cooling water inlets of the two cooling discs, one end of the second water inlet pipeline is connected to the corresponding cooling water inlet of the cooling disc, and the other end of the second water inlet pipeline is communicated with the through hole in the side wall of the first water inlet pipeline.
Optionally, the adjusting structure includes a driving portion for independently controlling the movement of the two cooling disks, and a transmission portion connected to the corresponding cooling disk, and the driving portion controls the corresponding cooling disk to move toward or away from the other cooling disk through the transmission of the transmission portion.
Optionally, the distance between each cooling disc and the piece to be cooled is 2mm-5 mm.
Optionally, the support structure comprises support portions on at least two opposite side walls of the chamber, the support portions being obliquely arranged on the respective side walls.
Optionally, a cooling gas inlet is further disposed on a first side wall of the chamber, and a cooling gas outlet is disposed on a second side wall of the chamber opposite to the first side wall.
Optionally, the temperature sensor is disposed on the inner side wall of the chamber, one side of the gas cooling structure is communicated with the cooling gas supply structure through a pipeline, the other side of the gas cooling structure is communicated with the cooling gas inlet through a pipeline, and the gas cooling structure is configured to adjust the temperature of the cooling gas and/or the flow rate of the cooling gas input into the chamber according to a signal of the temperature sensor, so that the temperature in the chamber is maintained within a preset range.
The invention also provides a cooling system, which comprises the cooling device, and further comprises a cooling water supply structure, a cooling water recovery structure, a cooling gas supply structure and a cooling gas recovery structure.
The invention has the beneficial effects that: the piece to be cooled between the two cooling disks is cooled through the two cooling disks, and the temperature of the two surfaces of the piece to be cooled is guaranteed to be uniform.
Drawings
FIG. 1 is a schematic view of a semiconductor processing apparatus according to the related art;
FIG. 2 is a schematic view showing a structure of a cooling apparatus in the related art;
fig. 3 is a schematic view showing a cooling apparatus according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the drawings of the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the invention, are within the scope of the invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Fig. 1 is a general semiconductor processing apparatus for a high temperature process. The semiconductor device has the following structure: a silicon chip loading platform (Loadport)01, an atmospheric robot carrying module (AMT robot module)02, a silicon chip transfer Chamber (Loadlock)03, a Buffer Chamber (Buffer robot Chamber)04 and a high-temperature reaction Chamber (Chamber A/B/C) 05.
The flow of producing the silicon wafer by using the semiconductor processing equipment is as follows: the atmospheric robot takes the silicon wafer from the wafer stage 01 and places the silicon wafer on the upper layer of the transfer chamber 03 (fig. 2 shows the first silicon wafer 20 placed on the upper layer of the transfer chamber). And the mechanical arm of the buffer chamber 04 is used for relaying, and the silicon wafer in the conveying chamber 03 is taken down and placed in the high-temperature reaction chamber 05. After the high-temperature reaction is completed, the robot in the buffer chamber 04 takes out the silicon wafer in the high-temperature reaction chamber 05, puts the silicon wafer into the lower layer of the transfer chamber 03 (fig. 2 shows the second silicon wafer 10 put into the lower layer of the transfer chamber), cools and cools the silicon wafer, and then takes out the silicon wafer by the atmospheric robot and puts the silicon wafer back to the loading platform.
After the high-temperature silicon wafer is put into the transfer chamber, two problems inevitably exist:
1. the problem of inconsistent temperature of the front side and the back side of the high-temperature silicon wafer:
as shown in fig. 2, the transfer chamber 03 is mainly composed of chamber walls, a silicon wafer tilting support structure 07, a cooling metal plate 06, an air supply port 031, an air exhaust port 032, and a cooling water system (including a water inlet 08 and a water outlet 09). When the high-temperature silicon wafer is put into the transfer chamber, the temperature is about 300-400 ℃. The main cooling means is to rely on the metal sheet 06 on the back side for cooling and the N on the front side2And cooling the gas atmosphere. In the cooling process, the back of the silicon wafer is close to the metal cooling plate, the specific heat capacity of metal is small, and the cooling speed of the back of the silicon wafer is high; the front surface of the silicon wafer is mainly dependent on N2And heat transfer and cooling are carried out, the specific heat capacity of the gas is large, and the cooling speed of the front surface of the silicon wafer is low. The temperature difference exists between the front side and the back side of the high-temperature silicon wafer, the internal stress of the silicon wafer is uneven due to the temperature difference, surface defects are generated, and the silicon wafer deforms and is concave or convex when serious.
2. The problem that the cooling time of the high-temperature silicon wafer in the conveying cavity is too long is solved:
the high-temperature silicon wafer can be taken out from the conveying cavity only after being cooled to a certain set temperature in the conveying cavity. The cooling rate within the transfer chamber directly affects the throughput of the semiconductor processing equipment. How to increase the cooling speed and shorten the cooling time is of great importance to the production efficiency of semiconductor processing equipment.
To the uneven problem of the two sides cooling of silicon chip to and the slow problem of silicon chip cooling rate, this embodiment provides a cooling device, treats the cooling piece through being located the cooling dish that treats cooling piece two sides and cools off, prevents to treat the cooling inequality on cooling piece two sides, and can be quick will treat that the cooling piece cools off to predetermineeing the temperature, improves the productivity.
The cooling device of the present embodiment is applicable to cooling of silicon wafers, and is not limited to cooling of silicon wafers.
Specifically, the present embodiment provides a cooling device, as shown in fig. 3, including:
a chamber 1;
two hollow cooling discs 2 which are oppositely arranged and are positioned in the chamber 1 are used for cooling the piece to be cooled 100 which is positioned between the two cooling discs 2; each cooling disc 2 is provided with a cooling water inlet communicated with an external cooling water supply structure and a cooling water outlet communicated with an external cooling water recovery structure;
a support structure for supporting the object 100 to be cooled, said support structure being arranged on the side wall of the chamber 1 and said support structure being located between the two cooling pans 2;
and the adjusting structure is used for controlling at least one cooling disc 2 to move so that the distances between the two cooling discs 2 and the piece to be cooled 100 are equal.
When the cooling device of this embodiment is applied to the cooling of silicon chip, cavity 1 is conveying cavity 1 among the semiconductor device, and the setting of double-deck cooling plate 2 can treat simultaneously that two surfaces that set up mutually back to each other of cooling piece 100 cool through the same cooling medium, avoids treating the temperature inequality of two sides of cooling piece 100 because the cooling medium is different to cause, and adopts the slower N of cooling for treating cooling piece 100 one side2And gas cooling, namely cooling by adopting the cooling disc 2 which is fast in cooling, and cooling by adopting the double-layer cooling disc 2 in the embodiment also shortens the cooling time of the silicon wafer. The high temperature silicon wafer needs to be cooled in the transfer chamber 1, and the cooling is completed only after the temperature is reduced to a certain set value. The design of the double-layer metal cooling disc 2 increases the cooling speed of the front surface of the silicon wafer and shortens the cooling time reaching a certain set value.
In this embodiment, the cooling plate 2 is a metal cooling plate 2 made of metal.
In order to ensure that the temperatures of the two cooling disks 2 are the same and the temperatures of the two opposite sides of the to-be-cooled object 100 are uniform, it is necessary to ensure that the temperatures of the cooling water entering the two cooling disks 2 are the same, and there are various structural manners for making the temperatures of the cooling water entering the two cooling disks 2 be the same, and two specific embodiments adopted in this embodiment are described below.
In a specific implementation manner of this embodiment, the cooling device further includes a first water inlet pipeline 3 and a second water inlet pipeline 4 respectively communicated with the cooling water inlets of the two cooling disks 2, and the first water inlet pipeline 3 and the second water inlet pipeline 4 are connected to the same cooling water supply structure.
In order to ensure the supply of the cooling water, the first water inlet pipe 3 and the second water inlet pipe 4 may also adopt different cooling water supply structures, so that in order to ensure that the temperatures of the cooling water entering the two cooling disks 2 are the same, a temperature sensor 7 and a temperature regulator are required to be additionally arranged, the temperature sensor 7 and the temperature regulator may be arranged on the first water inlet pipe 3 and the second water inlet pipe 4, or may be arranged in the cooling water supply structure, and the temperature of the cooling water entering each cooling disk 2 is regulated by a signal temperature regulator of the temperature sensor 7, so that the temperatures of the cooling water entering the two cooling disks 2 are the same.
In another specific implementation manner of this embodiment, the cooling device further includes a first water inlet pipeline 3 and a second water inlet pipeline 4 respectively communicated with the cooling water inlets of the two cooling trays 2, one end of the second water inlet pipeline 4 is connected to the corresponding cooling water inlet of the cooling tray 2, and the other end of the second water inlet pipeline 4 is communicated with the through hole on the side wall of the first water inlet pipeline 3, as shown in fig. 3.
In this embodiment, the adjusting structure includes a driving portion for independently controlling the movement of the two cooling disks 2, and a transmission portion connected to the corresponding cooling disk 2, and the driving portion controls the corresponding cooling disk 2 to move toward or away from the other cooling disk 2 through the transmission of the transmission portion.
Through the independent driving of the two cooling disks 2 by the driving part, the distance between each cooling disk 2 and the piece to be cooled 100 can be flexibly controlled, so that the distances between the two cooling disks 2 and the piece to be cooled 100 are the same, the distance between each cooling disk 2 and the piece to be cooled 100 is ensured to be the optimal distance, and each cooling disk 2 cannot be in contact with the piece to be cooled 100.
When the piece 100 to be cooled is a silicon wafer, when a high-temperature silicon wafer is radiated in the conveying chamber 1 in a heat conduction mode, the distances between the front side and the back side of the silicon wafer and the metal cooling disc 2 are equal, and the cooling speeds of the front side and the back side of the silicon wafer are equal, so that the phenomenon of uneven temperature of the front side and the back side of the silicon wafer is effectively prevented, the internal stress of the silicon wafer is reduced, and the problems of defects and deformation caused by uneven temperature are solved.
In the present embodiment, the distance between each cooling disc 2 and the to-be-cooled object 100 is 2mm to 5mm, but not limited thereto.
In this embodiment, the support structure comprises supports 5 on at least two opposite side walls of the chamber 1, the supports 5 being obliquely arranged on the respective side walls.
The inclined arrangement of the supporting part 5 reduces the contact area between the to-be-cooled part 100 and the supporting part 5, and ensures the cooling effect of the to-be-cooled part 100.
In this embodiment, a cooling gas inlet is further disposed on a first sidewall of the chamber 1, and a cooling gas outlet is disposed on a second sidewall of the chamber 1 opposite to the first sidewall.
In this embodiment, the cooling apparatus further includes a temperature sensor 7 and a gas cooling structure 6, the temperature sensor 7 is disposed on the inner sidewall of the chamber 1, one side of the gas cooling structure 6 is communicated with a cooling gas supply structure through a pipeline, the other side of the gas cooling structure is communicated with the cooling gas inlet through a pipeline, and the gas cooling structure 6 is configured to adjust the temperature of the cooling gas input into the chamber 1 according to a signal of the temperature sensor 7 so as to maintain the temperature in the chamber 1 within a preset range.
In this embodiment, the cooling gas is N2However, the present invention is not limited thereto.
In this embodiment, the gas cooling structure 6 is set at a constant temperature, generally between 15 ℃ and 21 ℃.
Preferably, the gas cooling structure 6 sets the temperature of the cooling gas entering the chamber 1 to be the same as the temperature of the cooling water entering the cooling plate 2, so as to ensure that the cooling speed of the upper surface of the object 100 to be cooled is consistent with the cooling speed of the lower surface of the object 100 to be cooled at the same time point. The phenomenon that the internal stress of the to-be-cooled piece 100 is not uniform, even deformation and the like caused by the fact that the cooling speed of the upper surface and the cooling speed of the lower surface of the to-be-cooled piece 100 are not uniform is avoided.
When the cooling device is applied to cooling a silicon wafer, the member to be cooled 100 is a silicon wafer, N2Is first supplied to the gas cooling structure 6 by the plant gas supply. N is a radical of2After passing through the gas cooling structure 6, the temperature is kept constant, and then the gas is introduced into the transfer chamber 1, so that the transfer chamber 1 is kept at a constant temperature. When a high-temperature silicon wafer is placed in the transfer chamber 1 and the temperature in the transfer chamber 1 fluctuates, the temperature sensor 7 detects the temperature change and feeds back a signal to the gas cooling structure 6. After receiving the temperature fluctuation signal, the gas cooling structure 6 adjusts the operation power to keep the temperature of the gas delivered into the transfer chamber 1 constant. Thereby ensuring that the gas atmosphere in the transfer chamber 1 maintains a constant temperature, ensuring that the piece to be cooled 100 radiates heat outwards uniformly, and avoiding the phenomenon of non-uniform internal stress of the piece to be cooled 100 caused by non-uniform temperature.
In this embodiment, the inlet air temperature, that is, the temperature of the cooling gas entering the chamber 1, may be set according to actual requirements, so as to ensure that the gas atmosphere in the chamber 1 is at the optimal temperature.
The invention also provides a cooling system, which comprises the cooling device, and further comprises a cooling water supply structure, a cooling water recovery structure, a cooling gas supply structure and a cooling gas recovery structure.
When the cooling system is applied to cooling the silicon wafers in the conveying chamber 1, the arrangement of the two layers of metal cooling discs 2 which are oppositely arranged is adopted, so that the cooling time of the silicon wafers to be cooled in the conveying chamber 1 is shortened, and the time of the silicon wafer conveying process is reduced. The output efficiency per unit time is increased.
The arrangement of the temperature sensor 7 and the gas cooling structure 6 ensures the constancy of the gas temperature in the chamber 1 and the cooling effect.
While the foregoing is directed to the preferred embodiment of the present invention, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (9)
1. A cooling apparatus, comprising:
a chamber;
the cooling plates are positioned in the cavity and are oppositely arranged, and the cooling plates are of hollow structures and used for cooling the to-be-cooled part positioned between the two cooling plates; each cooling disc is provided with a cooling water inlet communicated with an external cooling water supply structure and a cooling water outlet communicated with an external cooling water recovery structure;
the supporting structure is used for supporting the piece to be cooled and arranged on the side wall of the chamber, and the supporting structure is positioned between the two cooling disks;
and the adjusting structure is used for controlling at least one cooling disc to move so that the distances between the two cooling discs and the piece to be cooled are equal.
2. The cooling apparatus as claimed in claim 1, further comprising a first water inlet pipe and a second water inlet pipe respectively communicating with the cooling water inlets of the two cooling trays, the first water inlet pipe and the second water inlet pipe being connected to a same cooling water supply structure.
3. The cooling device as claimed in claim 1, further comprising a first water inlet pipe and a second water inlet pipe respectively communicating with the cooling water inlets of the two cooling trays, wherein one end of the second water inlet pipe is connected to the cooling water inlet of the corresponding cooling tray, and the other end of the second water inlet pipe communicates with the through hole on the side wall of the first water inlet pipe.
4. The cooling device as claimed in claim 1, wherein the adjusting structure comprises a driving portion for independently controlling the movement of the two cooling disks, and a transmission portion connected to the corresponding cooling disk, and the driving portion controls the corresponding cooling disk to move toward or away from the other cooling disk through the transmission of the transmission portion.
5. A cooling device according to claim 1, characterized in that the distance between each cooling disc and the piece to be cooled is 2-5 mm.
6. A cooling device according to claim 1, wherein the support structure comprises supports on at least two opposite side walls of the chamber, the supports being obliquely arranged on the respective side walls.
7. The cooling apparatus as claimed in claim 1, wherein a first side wall of the chamber is further provided with a cooling gas inlet, and a second side wall of the chamber opposite to the first side wall is provided with a cooling gas outlet.
8. The cooling apparatus as claimed in claim 7, further comprising a temperature sensor disposed on an inner sidewall of the chamber, and a gas cooling structure having one side communicating with a cooling gas supply structure through a pipe and the other side communicating with the cooling gas inlet through a pipe, the gas cooling structure being configured to adjust a temperature of the cooling gas and/or a flow rate of the cooling gas inputted into the inside of the chamber according to a signal of the temperature sensor such that the temperature inside the chamber is maintained within a preset range.
9. A cooling system comprising the cooling apparatus according to any one of claims 1 to 8, and further comprising a cooling water supply structure, a cooling water recovery structure, a cooling gas supply structure, and a cooling gas recovery structure.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911364861.7A CN111023650B (en) | 2019-12-26 | 2019-12-26 | Cooling device and cooling system |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911364861.7A CN111023650B (en) | 2019-12-26 | 2019-12-26 | Cooling device and cooling system |
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| CN111023650A true CN111023650A (en) | 2020-04-17 |
| CN111023650B CN111023650B (en) | 2022-02-22 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112509954A (en) * | 2021-02-04 | 2021-03-16 | 北京中硅泰克精密技术有限公司 | Semiconductor process equipment and bearing device thereof |
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| CN111023650B (en) | 2022-02-22 |
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Address after: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Patentee after: Xi'an Yisiwei Material Technology Co.,Ltd. Patentee after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Patentee before: Xi'an yisiwei Material Technology Co.,Ltd. Patentee before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |
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