CN212303624U - Cooling cavity structure for cooling wafer - Google Patents
Cooling cavity structure for cooling wafer Download PDFInfo
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- CN212303624U CN212303624U CN202020891255.2U CN202020891255U CN212303624U CN 212303624 U CN212303624 U CN 212303624U CN 202020891255 U CN202020891255 U CN 202020891255U CN 212303624 U CN212303624 U CN 212303624U
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- cooling
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- air inlet
- block
- inlet block
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Abstract
The utility model discloses a be used for wafer refrigerated cooling chamber structure, include: cooling the chamber body; wafer rack, the setting is in cooling cavity originally internally, and just right pass the piece window, wafer rack includes: the multiple layers of supporting plates are uniformly arranged at intervals from top to bottom, and one wafer is placed on each layer of supporting plate; the cooling block assemblies comprise a plurality of layers, and the periphery of each layer of the supporting plate, which is positioned on the wafer, is symmetrically provided with a plurality of cooling block assemblies. The utility model discloses the quick even cooling of a plurality of wafers can be realized to the cooling chamber structure, guarantees the cooling effect.
Description
Technical Field
The utility model discloses a be used for wafer refrigerated cooling chamber structure belongs to the semiconductor processing field.
Background
In the field of semiconductor processing, wafers are transported back through a transfer chamber after the process chamber has completed processing. In some processes, the reaction temperature is above 100 ℃, and after the wafer is processed and needs to be cooled by a cooling chamber, the wafer can be transmitted back to the Foup or the Cassette by a mechanical arm, so that the damage of the Foup or the Cassette caused by high temperature or the scald caused by taking out the wafer by people is avoided. For some processes, the temperature requirement is high before entering a process chamber, and a chamber is needed to cool the wafer and stably control the wafer at a certain temperature.
When the wafer is cooled, the wafer is conveyed into the cooling chamber through the mechanical arm, and the wafer is placed on the supporting block for cooling through lifting of the mechanical arm. During cooling, the wafer is mainly cooled through heat transfer between the wafer and the supporting block, and the cooling time is long.
When one wafer is in the chamber and then enters another wafer, the wafer is heated by the wafer entering later, so that the temperature of the wafer is abnormal, and the temperature consistency is influenced.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a be used for wafer cooling's cooling chamber structure can avoid the inhomogeneous phenomenon of cooling that a plurality of wafer cooling influences the mutual influence and cause, realizes the quick even cooling of a plurality of wafers, guarantees the cooling effect.
In order to realize the technical purpose, the utility model adopts the following technical scheme:
a cooling chamber structure for wafer cooling, comprising:
the cooling cavity body is provided with a film transmission window for the mechanical arm to extend into/out of on one side of the cavity body of the cooling cavity body;
the wafer rack is arranged in the cooling cavity body and right faces the wafer transfer window, and the wafer rack comprises:
the multiple layers of supporting plates are uniformly arranged at intervals from top to bottom, and one wafer is placed on each layer of supporting plate;
the cooling block subassembly, including a plurality of, be located in on every layer of backup pad the symmetry is equipped with a plurality ofly around the wafer the cooling block subassembly, every cooling block subassembly includes:
the air inlet block is detachably connected with the supporting plate through a fastener;
the air inlet interface is arranged at one end of the air inlet block;
the air inlet channel is arranged in the air inlet block, extends along the axial direction of the air inlet block and is communicated with the air inlet interface;
the air outlet holes comprise a plurality of air outlet holes which are uniformly arranged on the side wall of one side of the air inlet block and communicated with the air inlet channel.
The air inlet block is of a rectangular block structure.
The diameter of the small air outlet hole is 0.1-1.0 mm.
The plurality of air outlet small holes are arranged on the side wall of the air inlet block in an array mode.
The small air outlet holes are round holes or long round holes, the hole interval of each small air outlet hole is 3-10mm, and the axis direction of each small air outlet hole is parallel to the plane of the wafer.
An included angle of 0-15 degrees is formed between the axis direction of the small vent holes and the plane of the wafer.
Has the advantages that:
the utility model is used for the refrigerated cooling chamber structure of wafer is when cooling process, and the upper portion wafer is placed in the backup pad through passing the transmission entering cooling chamber of piece mouth. Cooling gas flows out through the gas inlet block component; the upper and lower gas inlet block assemblies cool the wafer, and gas directly flows out from the upper and lower directions of the wafer, so that the cooling gas directly takes away heat, and the cooling efficiency is improved;
after the lower wafer enters the structure and is placed in place, the cooling gas cools the wafer through the air inlet block assembly, and the cooling efficiency is high, so that the structure does not have the phenomenon that the wafer is heated, and the cooling consistency is ensured.
Drawings
Fig. 1 is a schematic structural view of a cooling chamber body of the present invention;
101, a cavity cover 102, a cavity chamber (103, 204), a screw, 104, a sealing ring 201, a bottom plate, 202, a supporting block, 203, an upper layer air inlet block component 301, an upper layer wafer 302 and a lower layer wafer;
FIG. 2 is a schematic structural view of an intake block assembly;
400, cooling gas 401, a gas inlet block 402, a gas inlet joint 403, a gas inlet channel 404 and a gas outlet small hole;
FIG. 3 is a schematic view of the cooling operation;
503, a middle layer air inlet block component, 603 and a bottom layer air inlet block component;
fig. 4 is a schematic view of the air outlet hole and the angle of the wafer according to the present invention.
Detailed Description
The technical solution of the present invention will be further described in detail with reference to the drawings and specific embodiments.
The utility model discloses an in being applied to the cooling chamber among the semiconductor equipment, carry out the device of direct temperature measurement to the wafer, realized reading in real time to the wafer temperature, guaranteed wafer temperature control's uniformity.
As shown in FIG. 1, the cooling cavity structure is composed of a cavity cover 101, a cavity 102, a screw 103, a sealing ring 104, a bottom plate 201, a supporting block 202, a connecting block 203 and a screw 204.
As shown in fig. 2, the air inlet block assembly 203 includes an air inlet block 401 and an air inlet connector 402, wherein the air inlet block 401 is provided with an air inlet channel 403 and uniformly distributed small air outlet holes 404, and the small air outlet holes 404 are communicated with the air inlet channel 403. Gas can enter from the gas inlet connector 401 and flow out of the gas outlet aperture 404 through the gas inlet channel 403 inside the gas inlet block.
The cooling gas 400 is typically an inert gas, such as nitrogen, and is piped to the inlet fitting 402 into the inlet block 401. The side surface of the gas inlet block 401, facing the wafer direction, is processed with uniform gas outlet holes 404, which can realize the circulation of gas, and the diameter of the gas outlet holes is 0.1-1.0 mm.
As shown in fig. 3, when the cooling process is performed, the upper wafer 301 is transferred into the cooling chamber through the wafer transfer port and placed on the support plate. Cooling gas 400 is introduced into the inlet block assembly 203 and flows out; the upper-layer gas inlet block assembly 203 and the middle-layer gas inlet block assembly 503 cool the upper surface and the lower surface of the upper-layer wafer 301 at the same time, and the cooling gas 400 directly takes away heat, so that the cooling efficiency is improved;
after the lower layer wafer 302 is placed in place after entering the same way, the cooling gas 400 cools the upper surface and the lower surface of the lower layer wafer 302 simultaneously through the middle layer gas inlet block assembly 503 and the bottom layer gas inlet block assembly 603, and because the cooling efficiency is high, the structure can not generate the phenomenon that the lower layer wafer 302 heats the upper layer wafer 301, and the cooling consistency is ensured.
As shown in fig. 4, the gas inlet block assemblies may be arranged according to the conditions of wafers, so as to ensure that gas flows through both the upper and lower portions of the wafers, thereby achieving rapid cooling.
The small gas outlet holes 404 are uniformly distributed round holes or long round holes, the center distance of the uniformly distributed holes ranges from 3 mm to 10mm, and the direction of the holes can be parallel to the wafer or form a certain angle alpha, such as the range of 0-15 degrees.
In summary, the invention provides a cooling cavity structure for wafer cooling, which can avoid uneven cooling caused by mutual influence while realizing cooling of a plurality of wafers, realize rapid and uniform cooling of the plurality of wafers, and ensure the cooling effect.
Claims (6)
1. A cooling chamber structure for wafer cooling, comprising:
the cooling cavity body is provided with a film transmission window for the mechanical arm to extend into/out of on one side of the cavity body of the cooling cavity body;
wafer rack, set up in cooling cavity this internal, and just right pass the piece window, its characterized in that, wafer rack includes:
the multiple layers of supporting plates are uniformly arranged at intervals from top to bottom, and one wafer is placed on each layer of supporting plate;
the cooling block subassembly, including a plurality of, be located in on every layer of backup pad the symmetry is equipped with a plurality ofly around the wafer the cooling block subassembly, every cooling block subassembly includes:
the air inlet block is detachably connected with the supporting plate through a fastener;
the air inlet interface is arranged at one end of the air inlet block;
the air inlet channel is arranged in the air inlet block, extends along the axial direction of the air inlet block and is communicated with the air inlet interface;
the air outlet holes comprise a plurality of air outlet holes which are uniformly arranged on the side wall of one side of the air inlet block and communicated with the air inlet channel.
2. The cooling chamber structure for wafer cooling as claimed in claim 1, wherein the air inlet block is a rectangular block structure.
3. The cooling cavity structure for wafer cooling as claimed in claim 1, wherein the diameter of the gas outlet small hole is 0.1-1.0 mm.
4. The cooling chamber structure for wafer cooling as claimed in claim 1, wherein a plurality of said gas outlet holes are arranged in an array on a sidewall of said gas inlet block.
5. The cooling cavity structure for wafer cooling as claimed in claim 1, wherein the small air outlet holes are round holes or oblong holes, the hole pitch of each small air outlet hole is 3-10mm, and the axis direction of each small air outlet hole is parallel to the wafer plane.
6. The cooling cavity structure for wafer cooling according to claim 1, wherein the hole axis direction of the gas outlet holes has an included angle of 0-15 ° with the wafer plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020891255.2U CN212303624U (en) | 2020-05-25 | 2020-05-25 | Cooling cavity structure for cooling wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020891255.2U CN212303624U (en) | 2020-05-25 | 2020-05-25 | Cooling cavity structure for cooling wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212303624U true CN212303624U (en) | 2021-01-05 |
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ID=73970358
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020891255.2U Active CN212303624U (en) | 2020-05-25 | 2020-05-25 | Cooling cavity structure for cooling wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212303624U (en) |
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2020
- 2020-05-25 CN CN202020891255.2U patent/CN212303624U/en active Active
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