JP2012083551A5 - - Google Patents

Download PDF

Info

Publication number
JP2012083551A5
JP2012083551A5 JP2010229651A JP2010229651A JP2012083551A5 JP 2012083551 A5 JP2012083551 A5 JP 2012083551A5 JP 2010229651 A JP2010229651 A JP 2010229651A JP 2010229651 A JP2010229651 A JP 2010229651A JP 2012083551 A5 JP2012083551 A5 JP 2012083551A5
Authority
JP
Japan
Prior art keywords
hole
main surface
filling
fitting
fitting hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2010229651A
Other languages
English (en)
Japanese (ja)
Other versions
JP5341047B2 (ja
JP2012083551A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2010229651A priority Critical patent/JP5341047B2/ja
Priority claimed from JP2010229651A external-priority patent/JP5341047B2/ja
Publication of JP2012083551A publication Critical patent/JP2012083551A/ja
Publication of JP2012083551A5 publication Critical patent/JP2012083551A5/ja
Application granted granted Critical
Publication of JP5341047B2 publication Critical patent/JP5341047B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2010229651A 2010-10-12 2010-10-12 部品支持基板及びその製造方法 Active JP5341047B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010229651A JP5341047B2 (ja) 2010-10-12 2010-10-12 部品支持基板及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010229651A JP5341047B2 (ja) 2010-10-12 2010-10-12 部品支持基板及びその製造方法

Publications (3)

Publication Number Publication Date
JP2012083551A JP2012083551A (ja) 2012-04-26
JP2012083551A5 true JP2012083551A5 (cg-RX-API-DMAC7.html) 2012-11-22
JP5341047B2 JP5341047B2 (ja) 2013-11-13

Family

ID=46242486

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010229651A Active JP5341047B2 (ja) 2010-10-12 2010-10-12 部品支持基板及びその製造方法

Country Status (1)

Country Link
JP (1) JP5341047B2 (cg-RX-API-DMAC7.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6200552B1 (ja) * 2016-06-07 2017-09-20 株式会社フジクラ コネクタ付きケーブル
US10768320B2 (en) 2017-05-11 2020-09-08 University Of New Hampshire Field deployable neutron/gamma spectrometer
CN120777411B (zh) * 2025-08-27 2025-12-12 太原理工大学 一种减振降噪复合管及其制备方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4639101B2 (ja) * 2004-03-31 2011-02-23 日本特殊陶業株式会社 部品支持基板及びその製造方法、光デバイス
JP5235635B2 (ja) * 2008-12-06 2013-07-10 日本特殊陶業株式会社 光導波路付き配線基板およびその製造方法

Similar Documents

Publication Publication Date Title
JP2010219210A5 (ja) 半導体装置
EP2003091A4 (en) SUBSTRATE WITH MICROFINES MOUNTED ON THE SURFACE METAL LUBRICATION
WO2008063209A3 (en) Optoelectronic devices utilizing materials having enhanced electronic transitions
JP2009541033A5 (cg-RX-API-DMAC7.html)
GB2444184B (en) Transducers for electronic devices
SG152101A1 (en) An interconnect structure and a method of fabricating the same
JP2010245280A5 (cg-RX-API-DMAC7.html)
JP2016046418A5 (cg-RX-API-DMAC7.html)
JP2009532912A5 (cg-RX-API-DMAC7.html)
JP2013019825A5 (cg-RX-API-DMAC7.html)
JP2010535608A5 (cg-RX-API-DMAC7.html)
JP2009141844A5 (cg-RX-API-DMAC7.html)
TW201129865A (en) Photosensitive composition, photosensitive solder resist composition, photosensitive solder resist film, permanent pattern, permanent pattern forming method and printed board
TWI346985B (en) Methods for forming the semiconductor devices
TWI348881B (en) Method for manufacturing wiring board with parts, method for manufacturing wiring board with solder humps, and wiring board
SG10201401166YA (en) Integrated circuit packaging system with embedded pad on layered substrate and method of manufacture thereof
JP2009146969A5 (cg-RX-API-DMAC7.html)
WO2009057259A1 (ja) 電子部品実装構造体およびその製造方法
JP2012083551A5 (cg-RX-API-DMAC7.html)
JP2012160734A5 (cg-RX-API-DMAC7.html)
EP2287233A4 (en) RESIN PARTICLE WITH MANY RENFONCEMENTS ON ITS SURFACE
GB201104297D0 (en) A semiconductor device comprising a carbon based material for through hole vias
EP2698400A3 (en) Epoxy resin compound and radiant heat circuit board Using the same
JP2014033389A5 (cg-RX-API-DMAC7.html)
JP2009004648A5 (cg-RX-API-DMAC7.html)