JP2012079826A - Transfer carrier and manufacturing method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a high quality transfer carrier where dust or grinding agent (oil) does not remain on a substrate when a hole or a recess is formed therein, and coating liquid does not adhere to the inside of the hole or recess, and to provide a method of manufacturing a transfer carrier efficiently.SOLUTION: The manufacturing method of a transfer carrier comprises: a hole or recess formation step of forming a hole or a recess at least in a part of a substrate; a coating film formation step of forming a coating film by screen printing a coating liquid containing polydimethylsiloxane composition, which contains at least polydimethylsiloxane, after coating the hole or recess with a mask provided on a screen plate; and a calcination step of calcining the coating.

Description

  The present invention relates to a transport carrier for transporting a substrate such as a flexible printed circuit board and a method for manufacturing the transport carrier.

  A flexible printed circuit board (FPC) on which electronic components such as semiconductors are mounted is a thin film-like substrate, so that it tends to be twisted or warped by itself. Therefore, when mounting electronic components on the FPC, chemical cleaning, plasma processing, etc., it is generally performed using a jig called a transport carrier having an adhesive layer on a substrate (for example, Patent Documents 1 to 3). 3).

  When an FPC is set on such a carrier, if there is an electronic component such as a semiconductor already mounted on the FPC, that portion becomes a convex portion and becomes an obstacle to setting the FPC on the carrier. For this reason, it is necessary to form a hole part in a conveyance carrier beforehand and to escape a convex part. However, the transport carrier has a laminated structure of different materials with different materials and hardness, that is, the substrate and the adhesive layer, so that when the hole is formed, cracks or wrinkles occur in either the substrate or the adhesive layer. There is a problem of end up. For example, when a metal such as aluminum is used as the substrate of the carrier and a soft organic material such as silicone resin is used as the adhesive layer of the carrier, the physical properties of the two are greatly different. Have difficulty. Furthermore, once dust and grinding chemicals (oil) at the time of forming the hole are attached to the adhesive layer of the transport carrier, it becomes difficult to remove, and there is a problem that the yield of manufacturing the transport carrier is deteriorated.

JP-A-7-22795 JP 2004-71863 A JP 2004-158477 A

  An object of the present invention is to solve the above-described problems and achieve the following objects. That is, the present invention provides a high-quality transport carrier that does not leave dust or grinding chemicals (oil) when forming holes or recesses in the substrate and does not adhere coating liquid to the inside of the holes or recesses. It is an object of the present invention to provide a method for manufacturing a transport carrier capable of efficiently manufacturing the transport carrier.

  As a result of intensive studies by the present inventors in order to solve the above-mentioned problems, the formation of the hole or recess necessary for the carrier is not performed after the coating layer is formed on the substrate but before the coating solution is applied to the substrate. After forming holes or recesses and removing dust and grinding chemicals (oil), screen printing is performed in addition to the holes or recesses of the substrate, so that the coating liquid adheres to the inside (wall) of the holes or recesses. In addition, it has been found that a high-quality transport carrier can be efficiently manufactured without dust or oil remaining when forming a hole or a recess.

The present invention is based on the above findings by the present inventors, and means for solving the above problems are as follows. That is,
<1> A hole or recess forming step for forming a hole or a recess in at least part of the substrate;
A coating film forming step of forming a coating film by screen-printing a coating solution containing a polydimethylsiloxane composition containing at least polydimethylsiloxane after coating the hole or recess with a mask provided on a screen plate; and
A firing step of firing the coating film;
The manufacturing method of the conveyance carrier characterized by including.
<2> The surface area A of the hole or recess and the surface area B of the mask provided on the screen plate covering the hole or recess satisfy the following formula, B / A ≧ 0.9 to 1.1 <1>. The method for manufacturing a carrier according to 1>.
<3> The surface area A of the hole or recess and the surface area B of the mask provided on the screen plate covering the hole or recess satisfy the following formula, B / A ≧ 1 to 1.05 <2> It is a manufacturing method of the conveyance carrier as described in above.
<4> The method for manufacturing a transport carrier according to any one of <1> to <3>, wherein the planar shape of the hole portion or the concave portion is any one of a circular shape and a rectangular shape.
<5> The transport carrier manufacturing method according to any one of <1> to <4>, further including a substrate cleaning step of cleaning the substrate after forming a hole or a recess in the substrate.
<6> A transport carrier manufactured by the transport carrier manufacturing method according to any one of <1> to <5>.

  According to the present invention, conventional problems can be solved, and dust and grinding chemical (oil) when forming holes or recesses in the substrate remain, or the coating liquid adheres to the inside of the holes or recesses. There can be provided a high-quality transport carrier and a transport carrier manufacturing method capable of efficiently manufacturing the transport carrier.

(Transport carrier and transport carrier manufacturing method)
The manufacturing method of the conveyance carrier of this invention includes a hole part thru | or recessed part formation process, a coating-film formation process, and a baking process, and also includes a board | substrate washing | cleaning process and the other process as needed.
The transport carrier of the present invention is manufactured by the transport carrier manufacturing method of the present invention.
Hereinafter, the details of the transport carrier of the present invention will be clarified through the description of the transport carrier manufacturing method of the present invention.

<Hole or recess formation process>
The hole or recess forming step is a step of forming a hole or recess in at least a part of the substrate.

<< Board >>
There is no restriction | limiting in particular about the shape, structure, size, etc. of the said board | substrate, According to the objective, it can select suitably, For example, a film form, a sheet form, etc. are mentioned as said shape. Examples of the structure include a single layer structure and a laminated structure. The size can be appropriately selected according to the application.

  There is no restriction | limiting in particular as said board | substrate, According to the objective, it can select suitably, For example, a glass substrate, a synthetic resin film (sheet), a metal substrate, a ceramic substrate etc. are mentioned. If necessary, the substrate can be subjected to pretreatment such as chemical treatment such as a silane coupling agent, plasma treatment, ion plating method, sputtering method, gas phase reaction method, vacuum deposition method and the like.

Examples of the glass substrate include white plate glass, blue plate glass, and silica-coated blue plate glass.
As the synthetic resin film, for example, polyethylene terephthalate (PET) film, polyarylate film, polyether ketone film, polyether imide, polycarbonate film, polyether sulfone film, polyester film, acrylic resin film, vinyl chloride resin film, An aromatic polyamide resin film, a polyamideimide film, a polyimide film, etc. are mentioned. Among these, a heat resistant resin film such as a polyimide film is particularly preferable.
Examples of the ceramic substrate include alumina, sialon, zirconia, aluminum nitride, silicon nitride, silicon carbide, and titanium nitride.
Examples of the metal substrate include an aluminum substrate, a copper substrate, a nickel substrate, an iron substrate, and a stainless steel substrate. Among these, an aluminum substrate is particularly preferable in that it is lightweight, inexpensive, good workability, and hardly corrodes.

  There is no restriction | limiting in particular as thickness of the said board | substrate, Although it can select suitably according to the objective, 100 micrometers-5 mm are preferable, and 500 micrometers-3 mm are more preferable.

The shape, size, number, etc. of the hole or recess are not particularly limited and can be appropriately selected according to the purpose. For example, the planar shape of the hole or recess can be a circle or an ellipse. , Triangular shape, quadrangular shape, square shape, rectangular shape, pentagonal shape and the like. Among these, a circular shape and a square shape are particularly preferable in terms of ease of processing and processing accuracy.
There is no restriction | limiting in particular as a magnitude | size of the said hole part thru | or a recessed part, According to a use etc., it can select suitably.
There is no restriction | limiting in particular as the number of the said hole part thru | or a recessed part, Although it can select suitably according to the objective, For example, it is preferable that it is 1-10.
The hole means a through hole penetrating the substrate.
The said recessed part means the part depressed from the substrate surface.
In the present invention, the hole and the recess may be mixed.
The method for forming the hole through the recess is not particularly limited and may be appropriately selected depending on the purpose, for example mechanical processing such as a lathe, such as by machining CO ₂ laser.

<Substrate cleaning process>
The substrate cleaning step is a step of cleaning the substrate after forming holes or recesses in the substrate.
The cleaning is not particularly limited as long as processing aid such as oil or generated dust can be cleaned, and can be appropriately selected according to the purpose. For example, a method of immersing a substrate in a cleaning solution, a cleaning solution on a substrate The method of showering, the method using an ultrasonic wave, the method of rubbing directly with a brush etc. are mentioned.

<Coating film formation process>
In the coating film forming step, holes or recesses formed in the substrate are covered with a mask provided on a screen plate, and then a coating liquid containing a polydimethylsiloxane composition containing at least polydimethylsiloxane is screen-printed. It is a process of forming a coating film.

<< Coating liquid >>
The coating solution contains a polydimethylsiloxane composition containing at least polydimethylsiloxane, and further contains other components as necessary.

-Polydimethylsiloxane composition-
The polydimethylsiloxane composition can be obtained by subjecting a silicate compound and a polydimethylsiloxane having a terminal silicate-modified to a hydrolysis reaction and a condensation reaction.

--Silicate compound--
The silicate compound is an oligomer of a metal alkoxide made of silicon (Si), having a siloxane (-Si-O-Si-) skeleton in the main chain and an alkoxy group (RO) introduced in the outer chain. That is. Here, examples of (R) which is an alkyl part of the alkoxy group (RO) include a methyl group, an ethyl group, and a propyl group. The silicate compound has a property of easily reacting with water.

  Since the silicate compound is an oligomer of a metal alkoxide, it has a molecular weight higher than that of the metal alkoxide, so that it is difficult to volatilize. For this reason, when the silicate compound is hydrolyzed, it is possible to further suppress volatilization of the low-volatile siloxane having high volatility contained in the polydimethylsiloxane having the terminal silicate modified. Further, the silicate compound has high chemical reactivity and can smoothly proceed with the condensation reaction.

  Examples of the silicate compound include methyl silicate, ethyl silicate, propyl silicate, and the like. Ethyl silicate is preferred from the standpoints of quality stability and safety. In the case of using methyl silicate for the purpose of increasing the reactivity, it is necessary to reliably carry out the treatment of volatile methanol.

The silicate compound is represented by [Chemical Formula 1]: SinO _(n-1) (RO) _{2 (n + 1)} (R = alkyl group, n = 4 to 16), and the terminal is silicate-modified. Polydimethylsiloxane is represented by [Chemical Formula 2]: SinO _(n-1) (RO) _{2 (n + 1)} (OSi (CH ₃ ) ₂ ) _m (RO) _{2 (n + 1)} Si _n O _(n-1) (R = Alkyl group, n = 4 to 16, m> 50).

  The silicate compound is preferably a trimer to a 12-mer. When the silicate compound is less than a trimer, the effect of the properties of the silicate may be reduced. When the silicate compound is more than a 12-mer, the viscosity of the silicate compound is increased, which may be difficult to handle during synthesis.

--Polydimethylsiloxane modified with silicate at the end--
The terminal silicate-modified polydimethylsiloxane is obtained by modifying the end of polydimethylsiloxane with the silicate compound, silicate-modified polydimethylsiloxane having silanol groups at both ends, and the main chain. One obtained by reacting with an alkoxysilane partial condensate having an alkoxy group which is a hydrolyzable functional group on one side or both sides.

  The terminal silicate-modified polydimethylsiloxane has a much higher functional group concentration than a normal terminal silicate-modified polydimethylsiloxane. In addition, since the terminal silicate-modified polydimethylsiloxane has high condensation reactivity with the silicate compound, the alkoxysilane partial condensate contained in the terminal silicate-modified polydimethylsiloxane smoothly undergoes the condensation reaction. It can be cured and polymerized.

  The terminal silicate-modified polydimethylsiloxane having a weight average molecular weight in the range of 5,000 to 100,000 is used.

  In the present invention, a mixture containing the silicate compound and the polydimethylsiloxane having the terminal silicate-modified is hydrolyzed and condensed.

Since the silicate compound is easily hydrolyzed in the presence of water, the alkoxy group in the molecule of the silicate compound becomes a highly reactive silanol group (—OH group).
On the other hand, the polydimethylsiloxane whose terminal is silicate-modified is similarly hydrolyzed to form a silanol group (also referred to as “silanol-modified”) due to the presence of water.

  Both of these silanol groups have high reactivity and at the same time have similar reactivity, so that a mixture containing the silicate compound and the polydimethylsiloxane having the terminal silicate modified is hydrolyzed. By decomposing, the condensation reaction with the polydimethylsiloxane in which the terminal is silicate-modified proceeds smoothly without accelerating the aggregation of silanol. As a result, the low-molecular siloxane contained in the polydimethylsiloxane whose terminal is silicate-modified is also taken into the reaction product (polydimethylsiloxane composition).

  That is, the low molecular weight siloxane becomes a part of the substance constituting the polydimethylsiloxane composition by the hydrolysis reaction and the condensation reaction, and does not exist as a simple substance, or the amount existing as a simple substance becomes very small. For this reason, low molecular siloxane does not volatilize from a polydimethylsiloxane composition, or the amount of volatilization becomes very small.

  The blending ratio of the silicate compound (A) and the polydimethylsiloxane (B) having the terminal silicate-modified is preferably in the range of 0.1 to 10 in terms of molar ratio (A / B). The optimal blend ratio is around 1 in terms of molar ratio (A / B).

  The polydimethylsiloxane composition is based on the optimum blend ratio, and when the flexibility is required, the polydimethylsiloxane (B) having the terminal silicate modified is increased and, on the contrary, high hardness is required. In that case, it is preferable to increase the silicate compound (A).

  However, in the polydimethylsiloxane composition, when the silicate compound (A) is increased, if the molar ratio (A / B) exceeds 10, the volatile components of the low-molecular siloxane increase. That is, since the amount of the low-molecular siloxane as a simple substance increases, problems such as shrinkage and thinning during curing and occurrence of cracks in some cases may occur, and the effects of the present invention may not be achieved. On the other hand, when the molar ratio (A / B) is less than 0.1, the hydrolysis reaction and condensation reaction between the silicate compound (A) and the polydimethylsiloxane (B) having the terminal silicate-modified are smooth. In some cases, the resultant is uncured and low molecular siloxane remains, and the effects of the present invention may not be achieved.

-Other ingredients-
Examples of the other components include a thermal polymerization initiator, a solvent, inorganic particles, and a particle dispersant.
Examples of the thermal polymerization initiator include various organic peroxides. Examples of the organic peroxides include ketone peroxides, diacylalkyl peroxides, hydroperoxides, dialkyl peroxides, peroxyketals, alkyl peresters, and carbonates. Among these, dialkyl peroxide is particularly preferable from the viewpoint of catalytic activity. Examples of the dialkyl peroxide include cyclohexanone peroxide, 1,1-bis (t-hexaperoxy) cyclohexanone, cumene hydroperoxide, dicumyl peroxide, benzoyl peroxide, diisopropyl peroxide, and di-t-butyl peroxide. Examples thereof include oxide, t-hexylperoxyisopropyl monocarbonate, and t-butylperoxy-2-ethylhexanoate.
Examples of the inorganic particles include conductive inorganic particles and insulating inorganic particles. These may be used individually by 1 type and may use 2 or more types together.
In addition, although the said solvent may be contained, since the drying after application | coating can be skipped if a solvent is not contained, it is preferable.

The viscosity of the coating solution is preferably 10 Pa · s to 200 Pa · s, more preferably 40 Pa · s to 100 Pa · s at 25 ° C. When the viscosity is less than 10 Pa · s, the formed film may flow due to the influence of weight and surface tension, and in particular, may have a non-uniform thickness due to wetting and spreading at the edge of the coating film. -If it exceeds s, leveling after coating is less likely to occur, and therefore, a non-uniform film may remain in which irregularities that occur when transferring screen mesh or separating the screen plate during screen printing remain.
The viscosity of the coating solution can be measured by, for example, a rheometer, a B-type viscometer, a vibration viscometer, or the like.

<< Screen printing >>
The screen printing is not particularly limited and may be appropriately selected depending on the purpose.For example, the coating liquid is put in a frame, and the squeegee is pressed while pressing the inner surface of the screen plate with a spatula-shaped plate called a squeegee. Move. Along with the movement of the squeegee, the coating liquid is pressurized by the squeegee and is pushed out in the form of dots from the openings of the mesh provided in the screen plate, thereby forming a coating film on the substrate surface. Since the coating liquid has a certain degree of fluidity, the coating film is leveled (leveled) if the dot-shaped coating film is allowed to stand. For this reason, the screen printing method usually includes a step of leaving the coating film (printing pattern) for a certain period of time after printing and leveling it.

As the screen plate used for the screen printing, a wire mesh made of a polymer such as tetron or nylon or a metal such as stainless steel is usually attached to a frame, and a portion other than the printing pattern of the wire mesh is made of a resist or the like. It is formed by masking (sealing) with a plate film.
The screen plate is provided with a mask that covers the hole or recess of the substrate. And the said screen printing is performed after coat | covering the said hole part thru | or a recessed part with the mask provided in the screen plate.
The surface area A of the hole or recess and the surface area B of the mask provided on the screen plate covering the hole or recess preferably satisfy the following formula: B / A ≧ 0.9 to 1.1. When the coating liquid adheres to the hole wall, B / A ≧ 1 to 1.05 is satisfied in order to prevent dust from being easily generated due to wear or peeling while using the carrier. More preferred.
The average thickness of the coating film formed by screen printing can be adjusted, for example, by changing the distance between the screen plate and the substrate and the angle of the squeegee.

<< Coating film >>
In the present invention, the hole or recess is covered with a mask provided on a screen plate, and then a coating liquid containing at least a polydimethylsiloxane composition containing polydimethylsiloxane is screen-printed to form a coating film.
The average thickness of the coating film is preferably 100 μm or more, and more preferably 100 μm to 250 μm. If the average thickness is less than 100 μm, it is easily affected by unevenness of the substrate, and smoothing of the coating due to leveling is less likely to occur, so that a surface coating with unevenness can be formed and functions are exhibited. Since there are few materials of the coating film to perform, the performance of a coating film may fall.
The average thickness of the coating film can be measured, for example, by a method using a micro gauge, a laser displacement meter, or the like, or by estimating from a change in the total weight of the carrier before and after coating and a coating area.

<Baking process>
The baking step is a step of baking the coating film formed in the coating film forming step.
The firing conditions and method are not particularly limited and may be appropriately selected from known methods. Specifically, it is preferably 180 ° C to 300 ° C, and preferably 200 ° C to 260 ° C. More preferably, it is preferably 120 minutes to 600 minutes, more preferably 150 minutes to 480 minutes.
Moreover, it is preferable to dry the coating liquid applied before the baking, and the drying conditions are not particularly limited and can be appropriately selected depending on the purpose, for example, about 50 ° C. to 100 ° C. 10 minutes to 60 minutes.

  The average thickness of the obtained fired film is preferably 100 μm or more, and more preferably 100 μm to 250 μm.

<Application>
The transport carrier manufactured by the transport carrier manufacturing method of the present invention is, for example, a temporary fixing when performing electronic component mounting, chemical cleaning, plasma processing, etc. on a flexible printed circuit board (FPC), a fixing base for laser processing, It can be widely used for fixed bases for machining.

  Examples of the present invention will be described below, but the present invention is not limited to these examples.

Example 1
<Production of carrier>
-Preparation of coating solution-
[Composition of polydimethylsiloxane composition]
Silicate compound (ethyl silicate 40, manufactured by Tama Chemical Co., Ltd.) 1.5 parts by mass Polysilicate siloxane modified at the terminal (Arakawa Chemical Industries, Ltd., weight average molecular weight of about 30,000) .. 48.0 parts by mass A polydimethylsiloxane composition having the above composition was added dropwise with a necessary amount of water in the hydrolysis step and the condensation step, followed by stirring and mixing. Then, it cooled to room temperature over about 30 minutes, stirring, and obtained the coating liquid.

-Aluminum substrate processing-
An aluminum substrate having a width of 110 mm, a length of 110 mm, and a thickness of 1.5 mm was prepared by arbitrarily providing five circular through holes with a diameter of 5 mm.

-Screen printing-
Using the coating liquid of Example 1, a coating film having an average thickness of 120 μm was formed on an aluminum substrate provided with through holes under the screen printing conditions shown below.
[Screen printing conditions]
A 3D-processed # 100 μm mesh stainless steel screen plate was used. The size of the mesh portion to be screen-printed is a square having a width of 100 mm and a length of 100 mm.
A mask having a circular planar shape with the same diameter of 5 mm was provided on the screen plate at a position corresponding to the through hole of the substrate so that the coating liquid was not applied to the portion of the aluminum substrate where the through hole was formed.
In Example 1, the area ratio (B / A) between the surface area A of the hole and the surface area B of the mask covering the hole was 19.625 / 19.625 = 1.
As the printing machine used, LS-150TVA type manufactured by Neurong Seimitsu Kogyo Co., Ltd. was used. The squeegee used was made of urethane rubber, and the corners were tapered at an angle of 60 °. The distance between the screen plate and the aluminum substrate was 4 mm.
The printing pressure was 0.2 MPa, the pressing amount was 0.5 mm, the printing speed was 150 mm / sec, and a scraper with a sword rubber was used as the scraper.

-Baking-
The formed coating film was placed in a baking furnace (manufactured by Espec Corp., constant temperature clean bench PVH222) and baked at 220 ° C. for 4 hours. As described above, the carrier of Example 1 was produced.

(Example 2)
-Fabrication of carrier-
In Example 1, the transport carrier of Example 2 is manufactured in the same manner as in Example 1 except that the diameter of the mask having a circular planar shape covering a circular through hole having a diameter of 5 mm is set to 5.2 mm. did.
In Example 2, the area ratio (B / A) between the surface area A of the hole and the surface area B of the mask covering the hole was 21.2264 / 19.625 = 1.08.

(Example 3)
-Fabrication of carrier-
In Example 1, the conveyance carrier of Example 3 is manufactured in the same manner as Example 1 except that the diameter of the mask having a circular planar shape covering the circular through hole having a diameter of 5 mm is 5.1 mm. did.
In Example 3, the area ratio (B / A) between the surface area A of the hole and the surface area B of the mask covering the hole was 20.41785 / 19.625 = 1.04.

Example 4
-Fabrication of carrier-
In Example 1, the conveyance carrier of Example 4 is manufactured in the same manner as Example 1 except that the diameter of the mask having a circular planar shape covering a circular through hole having a diameter of 5 mm is 4.8 mm. did.
In Example 4, the area ratio (B / A) between the surface area A of the hole and the surface area B of the mask covering the hole was 18.0864 / 19.625 = 0.92.

(Example 5)
-Fabrication of carrier-
Example 1 Example 1 was performed in the same manner as Example 1 except that a through-hole having a circular planar shape was formed in the aluminum substrate by circular machining of a circular recess having a depth of 0.5 mm and a diameter of 5 mm. 5 carrier carriers were produced.
In Example 5, the area ratio (B / A) between the surface area A of the recess and the surface area B of the mask covering the recess was 19.625 / 19.625 = 1.

(Example 6)
-Fabrication of carrier-
In the first embodiment, an aluminum substrate is provided with arbitrarily five through holes having a square shape in a planar shape with a side length of 5 mm, and the length of one side of a square mask covering the square through hole is 5 mm. A transport carrier of Example 6 was produced in the same manner as Example 1 except that.
In Example 6, the area ratio (B / A) between the surface area A of the hole and the surface area B of the mask covering the hole was 25/25 = 1.

(Comparative Example 1)
-Fabrication of carrier-
In Example 1, using an aluminum substrate not provided with a through-hole, using a screen plate without a mask, and performing screen printing, the plane shape having a diameter of 5 mm is arbitrarily provided with five circular through-holes. A transport carrier of Comparative Example 1 was produced in the same manner as Example 1 except that it was provided.

<Visual evaluation and results of holes or recesses>
About the conveyance carrier of Examples 1-6 and Comparative Example 1, the hole part or the recessed part and its periphery were observed visually. These results are summarized below.
In Examples 1 to 3, there was no major problem of protrusion of the coating layer in the hole, and no dust was generated. Moreover, there was no problem even when the FPC set was repeatedly used in the mounting work. However, when compared precisely, Example 1 has a slight protrusion due to misalignment of the alignment position during screen printing, and Examples 2 and 3 have a surface area of the hole smaller than the surface area of the mask covering the hole. It was found that is more preferable.
Moreover, in Example 4, the protrusion of the coating layer to the inside of the hole was slightly observed, and some peeling occurred due to repeated use in the mounting work of the FPC set.
Further, in Example 5, there was no major problem of the protrusion of the concave coating layer, and no dust was generated. There was no problem even when the FPC set was repeatedly used in the mounting work.
Further, as in Example 6, even when the planar shape of the hole portion was a square shape, there was no major problem of the protrusion of the coating layer in the hole portion, and no dust was generated.
On the other hand, in Comparative Example 1, no protrusion to the inside of the hole was observed, but minute wrinkles that seem to be the effect of stress at the time of hole formation occurred around the hole, resulting in weak unevenness. Was observed. During the FPC set mounting work, FPC floating that was thought to be due to irregularities occurred. Further, dust during processing adhered to the coating layer.

  The transport carrier manufactured by the transport carrier manufacturing method of the present invention is, for example, a temporary fixing when performing electronic component mounting, chemical cleaning, plasma processing, etc. on a flexible printed circuit board (FPC), a fixing base for laser processing, It can be widely used for fixed bases for machining.

Claims (6)

A hole or recess forming step for forming a hole or recess in at least a part of the substrate; and
A coating film forming step of forming a coating film by screen-printing a coating solution containing a polydimethylsiloxane composition containing at least polydimethylsiloxane after coating the hole or recess with a mask provided on a screen plate; and
A firing step of firing the coating film;
The manufacturing method of the conveyance carrier characterized by including.   2. The surface area A of the hole or recess and the surface area B of the mask provided on the screen plate covering the hole or recess satisfy the following formula: B / A ≧ 0.9 to 1.1. Manufacturing method for the carrier.   The conveyance according to claim 2, wherein the surface area A of the hole or recess and the surface area B of the mask provided on the screen plate covering the hole or recess satisfy the following formula: B / A ≧ 1-1.05. Carrier manufacturing method.   The method for manufacturing a transport carrier according to any one of claims 1 to 3, wherein the planar shape of the hole or recess is either a circular shape or a quadrangular shape.   The manufacturing method of the conveyance carrier in any one of Claim 1 to 4 including the board | substrate washing | cleaning process which wash | cleans this board | substrate after forming a hole part or a recessed part in a board | substrate.   A transport carrier manufactured by the transport carrier manufacturing method according to claim 1.