TW201220991A - Baked film and method for producing the same, and conveyance carrier and method for producing the same - Google Patents

Abstract

The present invention provides a method for producing baked film comprising coating film forming step and calcining step of calcining the coating film. The coating film forming step is applicating embrocation on substrate by screen printing and forming coating film with average thickness over 100 μ m. The embrocation comprises polydimethylsiloxane composition containing at least polydimethylsiloxane, and has viscosity of 10 Pa.s-200 Pa.s at 25 DEG C. The present invention also provides a method for producing conveyance carrier comprising hole and concave portion forming step, coating film forming step and calcining step of calcining the coating film. The hole and concave portion forming step is forming hole and concave portion on at least one part of substrate. The coating film forming step is applicating embrocation by screen printing and forming coating film after covering the hole and concave portion by mask set on screen board. The embrocation comprises polydimethylsiloxane composition containing at least polydimethylsiloxane.

Description

201220991 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a film which is suitable for, for example, a conductive gland, a surface smoothness of a sentence uniformity, and a method for producing a fired film. The present invention relates to a substrate for transporting ruthenium (4) - a printed wiring board, etc., and a method for producing the carrier and the carrier. L No technology] The film, the insulating film, the adhesive film, etc. are burned == The solvent is dissolved in a solvent to prepare. Then, after applying a screen printing, a dip coating method, or the like to the substrate, the film is fired by drying and drying to produce a fired film. With the miniaturization and high performance of electronic components, the physical properties of the fired film formed by the use, brushing, and dipping coating methods are becoming higher and higher. For example, a carrier for a substrate such as a flexible printed wiring board (Fpc) is used to produce a space of %. In the case of FPC packaging, it is desirable to vertically arrange the substrate and manage the demand for a production site, for example, a higher adhesiveness. In the method of manufacturing a carrier for a substrate, in order to expose the four corners of the aluminum substrate, the four corners of the aluminum substrate are covered with a mask, and the blade is applied by one hand, which is laborious and has poor productivity. The subject. Further, it is coated with a vehicle containing ethyl cellulose dissolved in a solvent.

4- S 201220991 Cloth liquid is susceptible to the following problems: after coating, penetration of the coating film under the solvent-like bear; increase in size due to the flow called sagging (increased coating area); and due to drying and The film is drooped due to softening of the resin during firing. Further, the coating liquid containing a vehicle liquid in which an acrylic resin and a polyvinyl butyral are dissolved in a solvent has a problem that the flatness is poor, the adhesion is too strong, and the coating liquid is stretched by drawing, which has a problem of poor workability. Further, there is a proposal to disclose a coating liquid containing at least a composition of polydimethyloxazepine containing polydimethyl oxaxan (see, for example, JP-A-2009-292970, JP-A-2002-147353) Bulletin No. 44388 and No. 44388 96). However, the coating liquid containing the composition of polydimethyl siloxane is strong in wire drawing property, and it is coated at the time of screen printing due to the movement of the screen printing plate with respect to the movement of the squeegee. The problem of raw sugar on the surface of the film. Therefore, it is desirable to provide a coating which is excellent in leveling property after coating, and which is less likely to cause penetration and sag of the coating film, and which does not easily cause sagging when the coating film is dried and fired, and which has uniform film thickness and high dimensional accuracy. A rapid manufacturing method for film formation and firing of a film. A flexible printed wiring board (FPC) that encapsulates an electronic component such as a semiconductor is a thin film-shaped substrate, and is easily twisted and warped in a single body. Therefore, when the FPC is subjected to encapsulation, drug cleaning, plasma treatment, or the like, it is usually carried out using a jig called a carrier on which an adhesive layer is provided on the substrate (see, for example, JP-A-7-22795, JP-A-2004). -7 1 863 and JP-A-2004-1 58477). When the FPC is mounted on such a carrier, when an electronic component such as a conductor of 201220991 is packaged on the FPC, the portion is a convex portion and the FPC is attached to the carrier. Therefore, it is necessary to form a hole portion in the carrier beforehand to avoid the convex portion. However, since the carrier-based substrate, the material called the adhesive layer, and the laminated structure of the different materials having different hardnesses, when forming the cavity portion, there are problems such as I = grain and wrinkles in the substrate and the adhesive layer. For example, when a metal such as aluminum is used as a substrate for transporting a carrier, and a soft organic material such as polyoxin resin is used as an adhesive layer for transporting a carrier, since the physical properties of the two are largely different, it is difficult for the household p to form a cavity portion. . Further, dust and a grinding agent (oil) which are formed when the adhesive layer of the carrier is formed to form a cavity portion are not easily removed once adhered, and there is a problem that the manufacturing yield of the carrier is poor. SUMMARY OF THE INVENTION An object of the present invention is to provide an excellent leveling property after coating, a coating film which is less likely to cause penetration and sag, and a coating film which is less likely to sag when dried and fired, and which has a uniform film thickness and a size. A fired film having high precision and a method of producing a fired film. 70. It is an object of the present invention to provide a method for preventing dust and a grinding agent (oil) from remaining when a hole portion and a recess portion are formed in a substrate, or a coating liquid which does not adhere to the inner portion of the hole portion and the concave portion. A carrier carrier having a port size σ and a method of manufacturing a carrier carrier capable of producing the carrier in a good manner. In order to solve the above-mentioned results, the inventors of the present invention have conducted intensive studies, and it has been found that by modulating, at least a human dimethyl group having a polydimethyl sulfoxane-containing polydimethyl siloxane is prepared and 25 is prepared. &lt;3 The viscosity of the coating solution is 1〇pa s~2〇〇pa s, the stringiness is reduced' and is formed by screen printing with an average thickness of 1 〇〇μηι by using your field I Utr e The coating film "can promote the leveling property to obtain a smooth fired film. 201220991 In order to solve the problem of the above-mentioned problem, the celebrity fruit of the inventors of the present invention has learned that the hole portion and the concave portion necessary for forming the carrier are not formed after the coating layer is formed on the substrate, and the substrate is applied before the coating liquid is applied. By opening the 3 hole portion and the recess portion ' and removing the dust and the grinding agent (oil), and then performing screen printing on the hole portion and the recess portion of the substrate, the coating liquid can be efficiently produced without adhering to the cavity portion. And a high-quality transport carrier that does not leave dust or oil when forming the cavity or the recess. The present invention is based on the above knowledge, and is a means for solving the above problems, as follows. That is, a method for producing a fired film, comprising: a coating film forming step of containing at least a polydifluorenyl decyl oxide-containing polydifluorenyl decane composition and 25. 〇: a coating liquid having a viscosity of 1 〇Pa.s to 2 〇〇pa\, screen printing on a substrate to form a coating film having an average thickness of (10) (four) or more; and a firing step of coating the film :行,厶〉如刖衣衣乃沄, wherein the average thickness of the coating film is ΙΟΟμιη or more and 150 pm or less &lt;3> as in the above &lt;1&gt; to &lt;2&gt; item/Dani Niang Ganyu A method for producing a fired film, wherein the medium is at 25. (3. The viscosity D and the coating satisfy the following formula: /1^25. The thousand-thickness T of the enamel film T&lt;4&gt; method, the &lt;5&gt; method, and the production of the fired film of any one. In the above-mentioned &lt;1&gt; to &lt;3&gt;, the coating liquid system contains inorganic particles as in the above-mentioned &lt;1&gt; to &lt;4&gt; The method of producing a fire-retardant film according to any one of the above-mentioned items, wherein the substrate is a heat-resistant resin film. <7> A baked crucible characterized by use The method of producing a fired crucible according to any one of the above-mentioned <7>, wherein the fired film is a conductive film, And a method for producing a carrier, comprising: a hole portion and a concave portion forming step of forming a hole portion and a concave portion in at least a part of the substrate; a coating film forming step of containing at least a polydimethyl group after coating the hole portion and the recess portion with a mask provided on the screen The coating liquid of the polydimethyl siloxane composition of the decane is screen-printed to form a coating film, and the baking step is performed by firing the coating film. <10> As described above &lt;9&gt; The manufacturing method of the carrier, wherein the surface area A of the cavity portion and the recess portion and the surface area B' of the mask provided on the screen plate covering the hole portion and the concave portion satisfy b / a 2 0 · 9 - 1.1. &lt;11 The method of manufacturing a carrier according to any one of <9> to <10> wherein the surface area A of the cavity portion and the recess portion and the cover surface of the screen portion and the recess portion are covered by the screen plate. The surface area B of the cover is in accordance with B/A2 1 to 1 -05. <12> The method of manufacturing a carrier according to any one of the items of the above-mentioned item, wherein the plane shape of the hole portion and the concave portion is round The method of manufacturing a carrier carrier according to any one of the items <9> to <12>, wherein the substrate is formed into a hole portion and a recess portion, Substrate cleaning step of substrate cleaning. 201220991 &lt;14&gt; A carrier carrier characterized by using the foregoing &lt;9&gt; The method for producing a carrier for transporting any of the items of the above-mentioned item <13>. In order to solve the above problems, according to the present invention, it is possible to provide an excellent leveling property after coating and a coating film which is less likely to cause penetration and sagging. Further, the coating film during drying and firing is less prone to sagging, and the like, and a fired film having a uniform film thickness and high dimensional accuracy, and a rapid production method of the fired film. In order to solve the problems of the prior art, according to the present invention, it is possible to provide a high quality in which dust and a grinding agent (oil) are not left when a hole portion and a concave portion are formed in a substrate, or the coating liquid does not adhere to the inside of the cavity portion and the concave portion. A carrier carrier and a method of manufacturing a carrier that can efficiently manufacture the carrier. [Embodiment] (Method for producing fired film and fired film) The method for producing a fired film of the present invention comprises a coating film forming step and a firing step, and may be carried out in other steps as necessary. The fired film of the present invention is produced by the method for producing the fired film of the present invention. Hereinafter, the details of the fired film of the present invention will be clearly understood from the description of the method for producing a fired film of the present invention. &lt;Coating film forming step&gt; The coating film forming step is a composition containing at least polydimethyl siloxane containing polydimethyl siloxane and having a viscosity of 1 〇 Pa s 2 〇 (^as) The coating liquid is screen printed on the substrate to form a coating film having an average of ι〇〇μηι or more. 201220991 &lt;&lt;Substrate&gt;&gt; The shape, structure, size, and the like of the substrate are not particularly limited. Depending on the purpose, the above-mentioned size can be appropriately selected according to the purpose, such as a single layer structure or a laminated structure. The substrate is not particularly limited, and may be appropriately selected according to the purpose, for example, a glass substrate, a synthetic resin film (sheet), a metal substrate, a ceramic substrate, etc. The substrate can be subjected to decane as needed. For the above-mentioned glass substrate, for example, a white plate glass, such as a drug treatment such as a coupling agent, a plasma treatment, an ion nozzle plating method, a money method, a gas phase reaction method, or a hollow distillation method. The blue plate glass, the emulsified stone coating, the blue plate glass, etc. The synthetic resin film may, for example, be a polyethylene terephthalate (PET), a polyarylate film, a polyether ketone film, or the like. Polyether phthalimide film, polycarbonate film 'polyether sulfone film, polyester film, acrylic resin film, vinyl chloride resin film, aromatic polyamide resin film, polyamidimide film, polyimine Among these, a heat-resistant resin film such as a polyimide film is particularly preferable. The ceramic substrate may, for example, be alumina 'Sial〇n (Sialon; yttrium aluminum oxynitride). Ceramics, cerium oxide, aluminum nitride, tantalum nitride, tantalum carbide, titanium nitride, etc. Examples of the metal substrate include an aluminum substrate, a copper substrate nickel substrate, an iron substrate, a stainless steel substrate, and the like. In the case of 'lightweight and cheap, good processability and not easy to corrode, the aluminum substrate is

-10- S 201220991 Excellent. According to the purpose, it is preferable that the thickness of the substrate is not particularly preferable, and it is preferable that the thickness of the substrate is not particularly suitable, and ΙΟΟμηη to 5 mm is preferable. <Coating liquid> The coating liquid contains at least a poly-containing polymer. A composition of dimethyl oxalate-oxygenated polydimethyl sulfoxide, which contains inorganic particles and further necessary components. - polymethyl oxalate composition - the polydimethyl siloxane composition can be obtained from the initial group by the phthalate compound and the phthalate modified by the terminal phthalate The oxane is obtained by the hydrolysis and condensation reaction of the lamp. - 夕 酸 酸 酸 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The low-segment south of the ashes acid-like acid is as described _ phthalate compound is a metal alkane made of cerium (Si) with a siloxane (-Si-〇_Si_) in the main chain. A compound that is skeleton and alkoxy (RO). Here, the group (R0) or (R) may, for example, be a methyl group, an ethyl group or a propyl group. The foregoing has the property of being easily reacted with water.

The S phthalate compound is an oligomer of a metal alkoxide which is larger than a metal alkoxide and therefore does not easily volatilize. When the brewed compound is hydrolyzed, it is possible to further suppress the volatilization of the fluorene oxide contained in the polydidecyloxyne which is modified by the pre-error. Further, the above-mentioned money compound can be smoothly subjected to a condensation reaction. Examples of the type of the phthalic acid ester compound include ethyl decyl decoxide - 201220991 S ethyl decanoate and propyl citrate. In terms of quality stability and safety. U ethyl citrate is preferred. In order to improve the reactivity, when the oxime is volatilized, it is necessary to carry out the treatment of the volatile sterol. If necessary, the phthalate compound is [Chemical Formula]: (〇) 2 (n+1) (R = alkyl, n =: 4 ~ 16) surface, ester modification 16) Table, the end of the phthalic acid to form polydimethyl siloxane, can be [Chemical Formula 2]: ^ -) (R〇) 2 (n + lK 〇 SUCH3) 〇 m (RO) 2 (n + I) Sln 〇 (ni) (R = ^ 4 to 16, m: &gt; 50). When the amount is less than that of the terpolymer, the effect of the properties of the phthalate ester is greater than that of the bismuth ester. When the viscosity of the phthalate compound is high, the treatment becomes difficult during the synthesis. : Polydimethyl methoxy oxane modified by decanoic acid ester - a polydimethyl methoxy oxane modified by a terminal phthalate ester, the following: The end of dimethyl methoxy oxane is subjected to a steepening treatment, and is a polydidecyl fluorene oxide which can be modified with ceric acid vinegar having a stanol group at both ends, and One side of the chain is obtained by reacting a functional group capable of hydrolysis, that is, a oxyalkylene partial condensate of an alkoxy group. The polydiindenyl decane which has been modified by modifying the terminal oxalate is significantly higher than the polydimethyl fluorene which is usually modified by terminal phthalate. Functional group concentration. Further, since the polydimethylsiloxane which is obtained by changing the terminal phthalate ester has high condensation reactivity with the above phthalate compound, the polyfluorene which is modified by terminal phthalate is used.

S -12-.201220991 The decane decane partial condensate contained in the oxane can smoothly undergo a condensation reaction and can be hardened and polymerized. The polydithiol oxime obtained by modifying the terminal phthalate can be used in a range of a weight average molecular weight of 5,000 or more and 10 Å or less. In the present invention, a mixture of the above-described phthalic acid ester compound and the above-mentioned polydimethylsiloxane having a terminal phthalate modified is hydrolyzed and condensed. Since the phthalate compound is easily hydrolyzed in the presence of water, the alkoxy group in the molecule of the phthalate compound is a highly reactive stanol group (-OH group). On the other hand, the polydimethyl methoxy hydride obtained by modifying the terminal phthalate ester is similarly hydrolyzed and becomes a stanol group by the presence of water (also referred to as "stanol modification". ). Since both of the stanol groups of the two have high reactivity and similar reactivity, the polydimethyl oxime which is obtained by modifying the phthalic acid ester compound and the terminal phthalate ester is described. Hydrolysis of a mixture of alkane The agglutination of stanol does not accelerate the condensation reaction of the dimethyl methoxy oxane which is modified by the above-mentioned terminal citric acid S. By this, the poly-molecular oxime contained in the poly-methyl oxime oxysulfide can be contained in the reaction product (polydimethyl siloxane composition). in. That is, by hydrolysis and condensation reaction, the low molecular oxymethane is part of a substance that forms a composition of polydimethyl methoxy oxane, not in the form of a monomer, or in a monomeric manner. Very small amount. Therefore, S: -13- 201220991, low-molecular ♦ Oxygen does not volatilize from the poly-f-based stone m composition, or the amount of volatilization is extremely small. The ratio of the phthalate compound (A) to the polybis-f-decyloxane (8) obtained by modifying the terminal phthalate ester is preferably in a range of 1 or more and 10 or less. . The optimal blending ratio is about 1 molar ratio. The polydi-f-decyloxane composition' is in the optimum ratio as: poly: ίί! softness, which is an increase in the above-mentioned modification of the terminal sulphuric acid to a heart-methyl dream reduction (Β) When high hardness is required, the aforementioned phthalate compound (Α) is increased. ^ However, when the aforementioned phthalate compound (Α) is increased, the molar ratio (Α /Β) of the above-mentioned decane composition is more than 1 〇, and the low molecular weight oxime = component is increased. That is, because the low-cutting oxygen chamber is singularized with singularity, and the effect of the present invention cannot be achieved according to the field condition=problem, the 莫/ 耳 耳 (Α/Β) is less than 〇. 丨 compound (4) and the poly- _ = (B) modified by the end ... ... (B) hydrolysis and shrinking t-methyl methoxy oxane solution and condensation reaction system can not smoothly evolve, and low-cut oxygen Residual and /^ fruit ^ not hard effect. In the above-mentioned particles, the above-mentioned particles are appropriately selected without particular limitation of At, and conductivity is sufficient depending on the purpose. These may be used alone or in combination with insulating inorganic particles. When the conductive inorganic particles are added, two or more kinds of them may be used. In the case of the sputum, it is possible to impart electrical conductivity to the fired film. When the insulating inorganic particles are added, it is possible to impart insulation to the fired ruthenium. Examples of the conductive inorganic particles include conductive carbon such as conductive carbon black and conductive carbon graphite, or conductive titanium oxide, conductive tin oxide, conductive zinc oxide, and conductive barium sulfate. Particles such as a conductive oxide such as a conductive titanate or conductive calcium titanate. Examples of the insulating inorganic particles include oxidized cerium, cerium oxide, calcium carbonate, talc, clay, quartz glass, aluminosilicate, glass, mica, cerium oxide, mullite, and Sial. 〇n, block = stone (steatite), forsterite, cordierite (cordiehk month), cerium oxide, tantalum nitride and the like. The content of the inorganic particles in the coating liquid is not particularly limited, and can be appropriately selected according to the purpose, and is preferably from 1% by mass to 9% by weight. Berry - other ingredients -

The other components are mentioned, for example, a thermal polymerization initiator solvent, a particle dispersant, and the like. H For the thermal polymerization initiator, for example, various types of silicone oxides are mentioned. Examples of the organic peroxides include self-identified soil compounds, diacyl peroxide, dioxane oxidized dialkyl groups, peroxy ketals, and alkyl peresters (alkyl pews). Carbonate (percarb〇nate), etc. Among these, it is particularly preferable to use a dialkyl peroxide as a catalyst. For the above-mentioned dioxane, it can be mentioned, for example, by cyclohexanone peroxide.丨, 丨-bis(tri-hexaperoxy)cyclohexanone, isopropyl isopropyl 15--15 201220991 nitrogen, peroxidation - peroxidation -2-ethylhexate, in addition, is sufficient to omit the above-mentioned application of 40 Pa·s to 1 OOPa· less than 10 P a · s after coating, and the film is generated to flow, and it is easy to produce a flat printing plate for thickness unevenness. The unevenness of the coating meter, the vibrating type coating, the mixing ratio, and the like &lt;&lt;screen printing&gt;&gt; is screen printing, and the ink sheet is appropriately selected to the knife-shaped crucible. The i set by the plate forms a coating film. Because of the dot-like coating film, cumene, benzoquinone peroxide, peroxidation Dibutyl isopropyl ester, hexyl hexyl peroxycarbonate, tert-butyl peracid, etc. The solvent may also be used, but when it does not contain a solvent, it is preferred. The viscosity is lOPa.s~2〇〇Pa.s at 25°C, preferably s. It is better to use 20Pa_s~80Pa.s. The above viscosity is due to the influence of weight and surface tension, especially due to The film is wetted and spread at the end of the coating film, and when it is larger than 200 Pa.s, it is not caused by the unevenness of the screen when the screen is printed and removed during the screen printing. The state of the film which is directly refrigerated. The viscosity of the liquid can be measured, for example, using a rheometer, a B-type viscosity meter, etc. The viscosity of the liquid can be adjusted by changing the composition of the coating liquid. By the way, for example, the coating liquid can be placed in the frame according to the purpose, and the movement of the squeegee is moved by the inner surface of the plate-side pressurizing screen, and the coating liquid is pressurized to the ink sheet. The opening portion is extruded in a dot shape and the coating liquid system on the substrate surface has a certain Degree of mobility, the network when the coating film will be leveled (leveling) ^ Thus, the halftone

-16- S 201220991 The printing method is usually provided with a leveling step, which is to place the coating film (printing pattern) for a certain period of time after printing. In the screen used for screen printing, a wire mesh composed of a polymer compound such as Tetr〇N (trade name), nylon, or the like, or a metal such as stainless steel is usually placed on the frame, and the wire mesh is usually placed on the frame. Among the wire meshes, portions other than the printed pattern are formed by masking (filling) with a printing plate film composed of a resist or the like. The average thickness of the coating film formed by screen printing can be adjusted, for example, by changing the distance between the screen and the substrate, the angle of the squeegee, and the like. &lt;&lt;Coating film&gt;&gt; A coating liquid containing the composition of the above polydimethyloxane and having a viscosity of 25 t of lOPa.s to 200 Pa.s was formed on the substrate by screen printing. The average thickness of the coating film of the soil is (7) above the jaws, preferably 1 μm or more and 250 μm or less, and 1 〇〇ηηι or more and 15 〇 μηη below the octagonal soil, the average thickness is less than 1 ΟΟμπι, because it is susceptible to The influence of the unevenness of the substrate makes it difficult for the coating film to be smoothed by leveling, and the surface of the coating film which forms the unevenness or the coating film which exhibits the function is less, resulting in a decrease in the performance of the coating film. situation. Further, the average thickness of the coating film can be measured by a method such as a micrometer or a laser displacement meter, from the total change of the carrier before and after coating, and the coating area. 〜 ♦ In the present invention, after satisfying the average thickness range of the coating liquid in the viscosity range of 25 t, the viscosity of the coating liquid and the flat thickness of the coating film are preferably in a certain relationship. That is, the aforementioned coating liquid is at '. sentence

The viscosity D (Pa.s) of 2 5 C -17-.201220991 and the average thickness τ(μιη) of the coating film are preferably satisfied to satisfy the following formula, and it is preferable to satisfy 12 core%15, 1-5ST. /DS8 is better. When the ratio (T/D) satisfies the above range, it is possible to obtain excellent leveling property after coating, and it is difficult for the coating film to easily permeate and sag, and the coating film is less prone to sag during drying and firing, and the film A fired film of uniform thickness and high dimensional accuracy. &lt;Burning Step&gt; The firing step is a step of firing the film formed in the coating film forming step. The firing step, the method, and the like are not particularly limited, and can be appropriately selected from known methods, and the firing temperature is 180 C to 3 G (TC is preferred, and then fine is required.) It is preferably from 120 minutes to 600 minutes, preferably from 15 minutes to 48 minutes. Further, it is preferred to dry the applied coating liquid before the above-mentioned firing, and: 1 dry cow is not particularly limited. It can be selected according to the purpose, for example, at 5 (rc~1〇(rCi^i〇_~6^ right. The average thickness of the obtained fired film is 1〇- is preferably ΙΟΟμιη~250μηι) <Use> The film produced by the method for producing a fired film of the present invention is suitably used as a light guide film. Θ V electric film, 邑 film and viscous film For the above-mentioned lightning-producing power generation film, for example, it can be used in a flexible electro-luminescence device (OLED; Organic Light-Emitting Diode), a touch screen. , touch panel, organic TFT, actuator, sensor, electronics A conductive film such as a paper, a soft light-adjusting material, or a solar cell. The insulating film can be used, for example, in an insulating film such as a semiconductor, an organic TFT, or an inductor. For example, a carrier for transporting a substrate such as an FPC board, a fixing table for laser processing, a fixing table for machining, etc. can be used. (Manufacturing method of transport carrier and transport carrier) The method for manufacturing the transport carrier of the present invention includes a hole The portion and the concave portion forming step, the coating film forming step, and the firing step, and may include other steps as necessary. The carrier carrier of the present invention can be produced by using the carrier carrier manufacturing method of the present invention. The details of the carrier carrier of the present invention will be clearly described in the description of the method of manufacturing the carrier. <The step of forming the pocket portion and the recess portion> The step of forming the pocket portion and the recess portion is a step of forming the pocket portion and the recess portion in at least a portion of the substrate. &lt;&lt;Substrate&gt;&gt; As the description of the substrate, the method for producing the fired film and the fired film can be used. The thickness of the substrate is the same as that of the method for producing the fired film and the fired film. 5-19-201220991 The shape, size, and number of the hole portion and the recess portion are not particularly limited. For example, in terms of the planar shape of the hole portion and the recess portion, a circular shape, an elliptical shape, a square shape, a square shape, a square shape, a rectangular shape, a pentagon shape, etc. may be mentioned. Among them, the ease of processing and processing are performed. In terms of accuracy, the square is particularly preferable. The size of the above-mentioned pockets and recesses is not limited as long as it can be appropriately selected according to the use or the like. The number of the above-mentioned pockets and recesses is not particularly limited, and is appropriately selected for the purpose, for example, one to one 为 is preferred. . The term "recessed portion" means a portion recessed from the surface of the substrate. In the present invention, the hole portion and the concave portion may be doped. In particular, the method of forming the above-mentioned hole portion and the recessed portion is not particularly limited, and may be appropriately selected according to the purpose, and examples thereof include machining such as machining and machining such as C〇2 laser. &lt;Substrate cleaning step&gt; The substrate cleaning step described above is a step of forming a hole portion and a concave portion of the substrate to wash the substrate. In the case of washing, the dust is cleaned by oil or the like, and is not particularly limited. For example, a method in which the substrate is immersed in the cleaning liquid 2 can be directly rubbed. Method of wave; and use of a brush or the like &lt;coating film forming step&gt; The above-mentioned coating film forming step is a portion to be formed in the aforementioned substrate

S ' 20 - 201220991 and the recessed portion, using the mask provided on the screen to cover the coating of the 曱 彻 的 聚 聚 = = = = = = = = = = 。 。 。 。 。 。 。 。 。 。. &lt;&lt;Coating Liquid&gt;&gt; The coating liquid contains at least a polydimethylsiloxane containing polydimethylsiloxane having a composition of a polydimethylsiloxane. - Polydimethyl siloxane composition _ The above-mentioned polydimethyl oxalate composition can be used in the same manner as the above-described method for producing a fired film and a fired film. - Other components - Other components include, for example, a thermal polymerization initiator, a solvent, inorganic particles, a particle dispersant, and the like. The thermal polymerization initiator is the same as the method for producing the fired film and the fired film. Further, the solvent may be contained. However, when the solvent is not contained, drying after application can be omitted, which is preferable. The viscosity of the coating liquid is the same as that of the fired film and the fired film. &lt;&lt;Screen printing&gt; The above screen printing is the same as the method of producing the fired film and the fired film. In the screen, a mask for covering the hole portion and the recess portion of the substrate is provided. Further, just as the screen printing is performed, the above-mentioned pockets and recesses are covered by using a mask provided on the screen. The surface area A of the hole portion and the recess portion and the surface area B of the mask provided on the screen plate covering the hole portion and the concave portion 21-201220991 portion are preferably B/A 2 0.9 to 1.1 because the coating liquid adheres. In the case of the wall of the cavity portion, it is possible to prevent dust from being easily generated due to abrasion and peeling during use of the carrier, and it is more preferable to satisfy B/A 21 to 1.05. The average thickness of the coating film formed by the above-described screen printing can be adjusted, for example, by changing the distance between the screen and the substrate, the angle of the squeegee, and the like. &lt;&lt;Coating Film&gt;&gt; In the present invention, after coating the above-mentioned pocket portion and recess portion with a mask provided on the screen, at least polydimethylmercapto oxane containing polydimethylsiloxane is contained. The coating liquid of the composition was screen-printed to form a coating film. The average thickness and measurement method of the coating film are the same as those of the above-described fired film and fired film. &lt;Burning Step&gt; The firing step and the average thickness of the fired film are the same as those of the above-described fired film and fired film. &lt;Applications&gt; The carrier carrier produced by the method for producing a carrier of the present invention can be widely used, for example, in a flexible printed wiring board (FPC) for encapsulation of electronic components, chemical cleaning, plasma treatment, and the like. The case is temporarily fixed, a fixed table for laser processing, a fixed table for machining, and the like. [Examples] Hereinafter, examples of the invention will be described, but the invention is not limited at all by the examples.

S -22-201220991 (Example A 1 &gt;&lt;Production of fired film&gt; • Preparation of coating liquid _ [Composition of ~monomethyl oxalate composition] Tama Chemical Industry Co. phthalate compound (The ETHYL·SILICATE 40-Injury Co., Ltd.)... 1.5 parts by mass of polydimethyl methoxy oxane (Arakawa Chemicals weight average molecular weight) made from the end of the product About 30,000) . . . 48.0 The composition of the above-mentioned polydiinyl oxoxane is added in the hydrolysis step and the water is added to the necessary amount of water, and then mixed and mixed. 3 冷却 minute cooling to room temperature to obtain a coating liquid. - Screen printing _ using the prepared coating liquid and according to the screen printing "Niu" shown below, an average thickness of 1 3 was formed on an aluminum substrate having an average thickness of 15 mm. 0 μιη coating film [Screen printing conditions], [3 D processing #1 00μπι mesh stainless steel screen. The size of the mesh portion coated by the screen is the width IGOmm, length 1 () 〇 mm square open v The printing machine used is Newl〇ng Precision Industry Co., Ltd. LS-150TV^. The ink plate used is made of urethane-based rubber and has a 60-degree angle at the corner. The distance between the screen and the aluminum substrate is 4 mm. The printing speed is 印刷. 2 MPa, press-in amount is 0 5 mm, 15 〇mm/sec, and the squeegee is squeegee with a rubber knife 201220991 - firing _ The formed coating film is placed in a firing furnace (ESPEC, constant temperature CLEAN) BENCH PVH222) was fired at 220 ° C for 4 hours. The fired film of Example A 1 was produced by the above. Next, the viscosity of the coating liquid of Example A1 and the average thickness of the coating film were measured as follows. The results are shown in Table 1. Further, in the fired film produced in Example A, the surface smoothness, the adhesion evaluation of the flexible printed wiring board (1), and the adhesion evaluation of the flexible printed wiring board were performed ( 2) The results are shown in Table 1. &lt;Viscosity of Coating Liquid&gt; The viscosity of the coating liquid was Brooks Brook's analog viscosity meter HB2 and was 25. (Measurement was performed. &lt;Average thickness of coating film&gt;; on the work platform, using the digital scale made by Mitutoyo (digimatic indicators) (543 Series), measuring the thickness of the coating film at the center of the coating film formed by coating and 9 points from the center portion to the top, bottom, left, and right sides at a distance of 20 mni, and calculating the arithmetic mean of the coating thicknesses Average thickness of the coating film. &lt;Surface smoothness&gt; The surface smoothness of the produced fired film was visually observed and evaluated in accordance with the following criteria. [Evaluation Criteria] ◎: The surface system is very smooth and the unevenness is not recognized. The surface is partially observed with very weak unevenness Δ: very weak unevenness can be observed on the surface, but it is within the practical range of 24 - 2 201220991 X: Strong unevenness was observed on the surface. <Adhesion evaluation of a flexible printed wiring board (1) &gt; A flexible printed wiring board for a 4 cm X 4 cm digital camera formed on a polyimide film was subsequently produced. The surface of the film was fired and stretched in the direction parallel to the surface with a load of 100 g, and the presence or absence of offset and peeling of the flexible printed wiring board was evaluated in accordance with the following criteria. [Evaluation Criteria] 〇: There is no offset or peeling of the flexible printed wiring board. X: The printed wiring board is offset and peeled off. <Adhesive evaluation of the flexible printed wiring board (2)> Parts with a transistor or the like are attached. The flexible printed wiring board for a digital camera similar to the above is attached to the surface of the fired film to be formed, and then rises in the vertical direction and evaluates whether or not the flexible printed wiring board is subjected to the weight of the flexible printed wiring board according to the following criteria. The effect of the offset and spalling. [Evaluation C): The printed circuit board was not offset or peeled off X: The printed circuit board was offset and peeled off (Examples A2 to A6) &lt;Production of fired film&gt; In Example A1, The fired films of Examples A2 to A6 were produced in the same manner as in Example A1 except that the "preparation of the coating liquid" was changed as shown below. -Preparation of coating liquid - 25-201220991 In Example A 1 'mixing ratio, hydrolysis step and polydimethyl oxalate by modifying the sulphuric acid vinegar compound with terminal phthalate The time of the condensation step is changed to adjust the viscosity of the coating liquid. Then, the viscosity of the coating liquids of Examples A2 to A6 and the average thickness β of the coating film were measured in the same manner as in Example A1. The results are shown in Table i, and the firings prepared in Examples A2 to A6 were prepared. In the same manner as in the actual example, the film was subjected to surface smoothness, adhesion evaluation of the flexible printed wiring board (1), and adhesion evaluation of the flexible printed wiring board (2). The results are shown in Table 1. [Example A7] - Production of fired film - In the same manner as in Example 2 except that the aluminum substrate having a thickness of 5% of the screen printing was changed to a polyimide substrate having a thickness of 100 μm. The fired film of Example Α7 was produced. Further, in the fired film produced in Example 7, the surface smoothness, the adhesion evaluation of the flexible printed wiring board (1), and the adhesion evaluation of the flexible printed wiring board (7) were performed in the same manner as in Example A1. The results are shown in Table 1 ° [Example A8] - Production of fired film - In Example Ai, titanium oxide particles were added in an amount of 1% by mass in addition to the composition of polydimethylsiloxane. Example (10) fired film 201220991 was produced in the same manner as in Example A1 except that the coating liquid obtained by mixing and collecting it was used, and the method of Example A 8 was In the fired film produced, the surface smoothness, the adhesion evaluation of the flexible printed wiring board (1), and the adhesion evaluation of the flexible printed wiring board (2) were carried out in the same manner as in Example A. The results are shown in the table (Comparative Example A1) &lt;Production of the fired film&gt; The comparative example was produced in the same manner as in Example A2 except that the "screen printing conditions" were changed except that the following example was used. A film of A 1 is fired. - Screen printing - [Screen printing conditions] The squeegee used was a urethane rubber and a cone having an angle of 7 〇 was attached to the corner. The distance between the screen and the aluminum substrate is 4 mm. Next, the average thickness of the coating film of Comparative Example A1 was measured in the same manner as in Example A1. The results are shown in Table 1. Further, in the fired film produced in Comparative Example A1, the surface smoothness, the adhesion evaluation of the flexible printed wiring board (1), and the adhesion evaluation of the flexible printed wiring board (2) were performed in the same manner as in Example A1. The results are shown in Table 1 (Comparative Example A2) &lt;Production of the fired film&gt; In the same manner as Example A2 except that the "screen printing conditions" were changed as shown in the following example, The fired film of Comparative Example A2 was produced. -27- 201220991 *&quot; Screen Printing - [Screen Printing Conditions] The squeegee used is a urethane rubber with a 70° angled cone at the corners. The distance between the screen and the aluminum substrate is 2 mm. Next, the average thickness of the coating film of Comparative Example A2 was measured in the same manner as in Example A1. The results are shown in Table 1. In the same manner as in the example A1, the surface of the fired film produced in the comparative example A2 was evaluated for adhesion of the flexible printed wiring board (1) and adhesion evaluation of the flexible printed wiring board (2). The results are shown in Table 1 (Comparative Examples A3 to A4) &lt;Production of the fired film&gt; In the same manner as in the example A1 except that the "screen printing conditions" were changed as shown in the following. The fired film of Comparative Example a 3 to A 4 was produced. - Preparation of coating liquid - In Example A 1, the viscosity of the coating liquid was adjusted by changing the mixing ratio of the phthalic acid ester compound and the polyfluorenyl fluorene oxide obtained by modifying the terminal phthalate. Then, the viscosity of the coating liquid of Comparative Examples A3 to 4 and the average thickness of the coating film were measured in the same manner as in Example A1. The results are shown in Table 1. Further, in the fired film produced in Comparative Examples A3 to A4, the surface smoothness, the adhesion evaluation of the flexible printed wiring board (1), and the adhesion evaluation of the flexible printed wiring board were performed in the same manner as in Example A1. ). The results are shown in Table 1. -28 - 201220991 [Table 11] Viscosity of substrate coating solution: D Average thickness of coating film: --- Type thickness (Pas) Τ (μιη) T/D Example A1 Aluminum 1.5 mm 10 130 ----- 13 Example A2 Aluminum 1.5 mm 50 123 —-«« 2.46 Example A3 Aluminum 1, 5 mm 100 124 1.24 Example A4 Aluminum 1.5 mm 200 110 0.55 Example A5 Aluminum 1.5 mm 15 245 16.3 Example A6 Aluminum 1.5 mm 30 235 7.8 Example A7 Polyimine ΙΟΟμιη 50 123 2.46 Example A8 Aluminum 1.5 mm 20 118 1 5.9 Comparative Example A1 Aluminum 1.5 mm 50 90 1.8 Comparative Example A2 Aluminum 1.5 mm 50 80 1.6 Comparative Example A3 Aluminum 1.5 mm 5 140 28 Comparative Example A4 Aluminum 1.5 mm 230 109 ~--- 0.47 [Table 1-2] Surface smoothness adhesion evaluation (1) Adhesion evaluation Example A1 ◎ 〇〇 Example A2 ◎ 〇〇 Example A3 〇〇〇 Example A4 Δ 〇 〇Example A5 〇〇〇Example A6 ◎ 〇〇Example A7 ◎ 施 Example A8 ◎ 〇〇Comparative Example A1 X (weak orange peel pattern) x (the unevenness of the uneven portion of the substrate is insufficient) — x (The crystal portion of the substrate peeled off due to the load) Comparative Example A2 X (strong orange peel pattern x (the unevenness of the uneven portion of the substrate is insufficient) x (the crystal portion of the substrate is peeled off due to the load) Comparative Example A3 X (liquid sag occurs) 〇〇 Comparative Example A4 X (weak orange peel pattern) 〇〇 201220991 From the results of Table 1 'When Examples Ai to A8 were compared with Comparative Examples A1 to A4', it was found that at least a polydimethyl anthraquinone-containing polydimethyl-xanthene-containing composition was obtained at 25 The coating liquid having a viscosity of °C of lOPa.s to 200 Pa.s is screen-printed on a substrate to form a coating film having an average thickness of 丨〇〇μπι or more and the coating film is fired. At the same time as the leveling property, it is possible to prevent the coating film from penetrating and sagging during screen printing, and sagging in the coating film during drying and baking, and it is possible to produce a fired film having uniform film thickness and good surface smoothness. The fired film produced by the method for producing a fired film according to the present invention is excellent in leveling property after application, and the coating film is less likely to cause penetration and sag, and the coating film during drying and firing is less prone to sagging. Further, the film thickness is uniform and the dimensional accuracy is high, and it can be used as any of a conductive film, an insulating film, and a viscous film in various applications. For example, it can be widely used as a carrier for FPC substrates and for laser processing. Fixed table, fixed table for machining, etc. (Example Β 1) &lt;Production of conveyance carrier&gt; - Preparation of coating liquid _ [Composition of polydidecyl fluorene composition] ETHYL SILICATE 40, Tama Chemical Industry Co., Ltd. Manufactured by the company. 5 parts by mass. Polydimethyl methoxy oxane modified by terminal phthalate ester (manufactured by Arakawa Chemical Industry Co., Ltd., weight average molecular weight about 3 〇, 〇〇〇) . . . a mass fraction of the polydimethyl methoxy oxane composition of the above composition in the hydrolysis step and

S -30- 201220991 Condensation step, adding the required amount of water, adding and stirring and mixing. Subsequently, it was cooled to room temperature with stirring for about 30 minutes to obtain a coating liquid. -Processing of the substrate - Preparation of a circular substrate with a width of 10 mm and a length of 1 l〇mm 'thickness of 15 mm' is arbitrarily set at 5 positions with a circular hole of 5 mm in diameter. The coating liquid of Example B1 was formed on the junction substrate provided with the through-holes in accordance with the screen printing conditions shown below to form a coating film having an average thickness of 120 μm. [Screen printing conditions] A non-mineral steel screen made of #1 〇 〇 μ Hi mesh processed by 3D. The size of the mesh portion coated by the screen is a square having a width of 100 mm and a length of i 〇〇 mm. In order to prevent the portion of the aluminum substrate from forming the through hole from being coated with the coating liquid at the position of the through hole of the corresponding substrate of the screen, a mask having a circular shape of the same diameter of 5 mm was provided. The area ratio (B/A) of the surface area a of the portion of the B 1 ' portion to the surface area B of the mask covering the portion was 19.625 / 19.625 = 1. The printing machine used was a LS-15OTVA type manufactured by Newlong Precision Industries Co., Ltd. The squeegee used was a urethane rubber with a 60° angled cone at the corners. The distance between the screen and the aluminum substrate is 4 mm. The printing pressure was 0.2 MPa, the press-in amount was 〇.5 mm, the printing speed was 150 mm/sec, and the squeegee was a squeegee with a rubber knife attached thereto. -31-.201220991 -Sintering _ The formed coating film was placed in a firing furnace (manufactured by E SPEC Co., Ltd., constant temperature CLEAN BENCH PVH2 2 2), and fired at 22 ° C for 4 hours. The fired film of Example B1 was produced by the above. (Example B 2) - 'Production of carrier carrier - In Example B 1, the same as Example B1 except that the diameter of the mask covering the planar shape of the circular through hole having a diameter of 5 mm was 5.2 mm. The carrier of Example B 2 was produced by the process. In this Example B2, the area ratio (b/A) of the surface area A of the cavity portion to the surface area B of the mask covering the cavity portion was 21.2264 / 19.625 = 1.08. (Example B 3) - Production of conveyance carrier - In the same manner as in Example B 1, except that the diameter of the mask having a planar shape of a circular through hole having a diameter of 5 mm was set to 5.1 mm. 'To make the carrier of Example B3. In this Example B3, the area ratio (B/A) of the surface area A of the cavity portion to the surface area B of the mask covering the cavity portion was 20.41785 / 19.625 = 1.04. (Example B4) - Production of conveyance carrier - In Example B1, the same as Example B1 except that the diameter of the mask which covers the planar shape of the circular penetration hole of 5 mm diameter was 4.8 mm. The carrier carrier of Example B4 was produced. In this Example B4, the surface area ratio (B/A) of the surface area A of the cavity portion and the mask covering the cavity portion was 18.0864/19.625 = 0.92. 201220991 (Example B 5) - Production of carrier carrier - In Example B 1 ', except for a through hole having a circular planar shape in an aluminum substrate, a pit having a depth of 〇5 mm and a diameter of 5 mm was formed by using a pit process. The carrier of Example B 5 was produced in the same manner as in Example B except that the concave portion was formed. In this embodiment B5, the area ratio (B/A) of the surface area A of the concave portion to the surface area B of the mask covering the cavity portion is 1.925/19.625 = 1. (Example B6) - Production of a carrier carrier - In the example B 1, a through-hole having a square shape having a length of 5 mm and having a square shape of 5 mm was provided arbitrarily at five positions on the aluminum substrate, and the square was penetrated. The carrier of Example B6 was produced in the same manner as in Example B1 except that the length of one of the square-shaped masks was 5 mm. The area ratio (B/A) of the surface area a of the portion B6' portion to the surface area B of the mask covering the portion was 25/25 = 1. (Comparative Example B 1) - Production of carrier carrier - In Example B 1 ', except for using an aluminum substrate which is not provided with a through hole, and after screen printing using a screen without a mask, it is arbitrarily at five positions A conveyance carrier of Comparative Example B1 was produced in the same manner as in Example B1 except that a circular hole having a circular shape of 5 mm was provided. &lt;Visual evaluation and results of the cavity portion and the concave portion&gt; For the carrier carriers of Examples B 1 to B 6 and Comparative Example B 1, the visual observation

S -33- .201220991 Check the center of the cave and the concave side. The results are summarized as follows. Example B 1 to B 3 The hole portion had no major problem of extrusion of the coating layer, and no dust was generated. Moreover, there is no problem in the packaging operation of the FPC module even if it is repeatedly used. However, in the case of precise comparison, the embodiment B 1 is in the case of screen printing, and some extrusion is caused by the offset of the alignment position adjustment, and it is known that The surface areas of the mask covering the cavity portion are preferably those in which the surface area of the cavity portion is small, and the embodiments B2 and B3 are preferred. Further, in Example B4, it was observed that the coating layer was slightly extruded to the inside of the cavity portion. A number of peeling occurred due to repeated use of the packaging operation of the FPC module. Further, the Example B 5 recessed portion had no major problem of coating layer extrusion and did not generate dust. Moreover, there is no problem even if the packaging operation of the FPC component is repeated. Further, as in the case of the embodiment B 6 ', even if the planar shape of the cavity portion is square, the cavity portion has no major problem of extrusion of the coating layer, and no dust is generated. In this case, in Comparative Example B1, the inner side of the hole portion was not observed to be extruded, but the effect of the stress at the time of formation of the cavity portion was observed, and a slight sensation was generated around the hole portion and weak observation was observed. Bump. At the time of the packaging operation of the F p C component, the F p C which is thought to be caused by the unevenness is generated. Moreover, the dust at the time of processing adheres to the coating layer. A transport carrier manufactured by using the method for manufacturing a carrier according to the present invention is widely used, for example, in a flexible printed wiring board (FPC) for encapsulation of a two-electronic component, a drug cleaning, a plasma treatment, or the like. Temporary fixing, fixing table for laser processing, fixing for machining, etc.

S -34- 201220991 [Simplified illustration] 〇 &lt;»», [Key component symbol description] None. -35-

Claims (1)

201220991 VII. Patent Application Range: 1. A method for producing a fired film, comprising: a coating film forming step, which comprises at least polydimethyl oxalate containing polydimethyl oxalate a coating liquid having a viscosity of 2 的pa s to 200 Pa.s in a composition of 2 rc, a screen printing of a cylinder having a mean thickness of ΙΟΟμηη or more on a substrate; and a firing step The coating film is fired. 2. The method for producing a fired film according to the first aspect of the invention, wherein the average thickness of the coating film is ΙΟΟμΓΠ or more and 15 μm or less. 3. The method for producing a fired film according to the scope of the patent application of the invention, wherein the viscosity D of the coating liquid at 25 ° C and the average thickness τ of the coating film satisfy the following formula 1 ST/D$20. 4. The method for producing a fired film according to the invention of claim 2, wherein the coating liquid contains inorganic particles. 5. The method of producing a fired film according to the ninth aspect of the invention, wherein the substrate is an aluminum substrate. 6. The method for producing a fired film according to the first aspect of the invention, wherein the substrate is a heat resistant resin film. 7. A fired film 'characterized by a method for producing a fired film'. The method for producing a fired film comprises: a film forming step comprising at least a polydimethyl-containing hard oxygen-containing film a polydidecyloxane composition and a coating liquid having a viscosity of lOPa's to 200 Pa.s at 25, screen printing on a substrate to form a coating film having an average thickness of ΙΟΟμηη or more; and a firing step 'The above coating film is fired. -36-201220991 8. The fired film of claim 7, wherein the film is a film-based film, an insulating film, and a viscous film. 9. A kind of carrier carrier; the ancient and soil private limbs 1 ^ 10,000 method, which is characterized by: a step of forming a crucible and a recess, which is formed on at least one of the substrate to form a hole portion and a recess portion; and a coating film forming step of using at least one of the clusters and the recess portion after the station provided by the screen plate The coating liquid of the polydimethyl siloxane composition of dimethyl hexane is formed into a coating film by a screen printing machine; and the firing step is performed by firing the coating film. 10. The method of manufacturing a carrier according to claim 9 wherein the surface area A of the portion and the recess and the surface area B of the mask disposed on the mesh covering the hole portion and the recess portion satisfy B/AS 0.9 to 1.1. . 1 1 · The manufacturing method of the carrier according to item 10 of the patent application, the surface area A of the hole portion and the recess portion and the surface area B of the mask provided to cover the hole portion and the recess portion satisfy B/Ag 1~ 1.05. The method for manufacturing a carrier according to the ninth aspect of the invention, wherein the planar shape of the portion and the recess is a circular shape or a square shape: 13. A method of manufacturing a carrier according to claim 9 of the patent application, The step of washing the substrate after the substrate is formed into the cavity portion and the recess portion. A carrier carrier, characterized in that the method for manufacturing the carrier carrier comprises: a hole portion and a recess portion forming step of forming a hole portion and a recess portion in at least one of the substrate; The part of the cover is covered by the oxygen mask and the middle part of the plate is in the screen of the plate lr 〇 包 package substrate method part -37- 201220991 coating film forming step, which uses the mask set on the screen to cover the above-mentioned hole and recess Thereafter, a coating liquid containing at least a polydimethyl sulfoxane-containing polydidecyl fluorene-containing composition is screen-printed to form a coating film, and a firing step of smearing the coating smear. S -38 201220991 IV. Designated representative map: (1) The representative representative of the case is: None. (2) A brief description of the component symbols of this representative figure: None. 5. If there is a chemical formula in this case, please disclose the chemical formula that best shows the characteristics of the invention: