JP2011077241A - Method of manufacturing transfer carrier - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate transfer carrier whose flexibility and adhesion are not impaired at high temperature. <P>SOLUTION: The method of manufacturing a substrate transfer carrier forms a sheet by thermosetting a material essentially consisting of a composition obtained by subjecting a mixture containing a silicate compound and polydimethylsiloxane having silicate-modified terminal ends to a hydrolysis reaction and a condensation reaction, then heats the sheet for two hours or longer and eight hours or less at a temperature of 260°C or higher and 300°C or lower, thereby fixing the sheet to a base. This configuration prevents the flexibility and adhesion of the substrate transfer carrier from being impaired at high temperature. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a transport carrier used for transporting a transported object such as a semiconductor device and a printed wiring board.

  Conventionally, printed wiring boards on which electronic components are mounted are used in all electronic devices. In recent years, various printed wiring boards have been provided in order to cope with the reduction in size and weight of electronic devices. Among these printed wiring boards, there is a flexible printed wiring board (hereinafter abbreviated as “FPC”) that is provided with a conductor pattern on the surface of a film-like insulating board and enables the board itself to be bent.

  Since this FPC is a thin film-like substrate, twisting and warping are likely to occur by itself. Therefore, when mounting electronic parts on this FPC, chemical cleaning, plasma processing, etc., a jig called a carrier for transportation is generally used (see Patent Documents 1 and 2).

  As shown in FIG. 2, the general structure of the carrier for transportation is composed of a flat base 20 made of a hard rigid body, and a resin layer 40 having a smooth surface fixed to the surface of the base 20. Become. Since the resin layer 40 has weak adhesiveness, the FPC 30 can be brought into close contact with the resin layer 40 and the position thereof can be held, and the warp and twist of the FPC 30 can be prevented. Further, the FPC 30 can be easily peeled off.

  As a general material used for the resin layer 40, silicone rubber mainly composed of silicon is used. This silicone rubber has heat resistance, is inexpensive and has high safety, and is generally well known as an elastic material.

JP 2001-144430 A JP 2007-266558 A

  However, when the conventional carrier for transportation described in Patent Documents 1 and 2 is repeatedly used in a high-temperature environment such as a reflow furnace, the adhesive strength of the resin layer tends to decrease. For this reason, when repeatedly used and the adhesive strength of the resin layer decreases, there is a problem that the FPC attached to the resin layer floats in a high-temperature environment such as a reflow furnace, and problems such as twisting and warping occur.

  This problem is due to the low heat resistance of the conventional carrier for transporting substrates, and due to the gradual loss of adhesiveness and flexibility in a high temperature environment. In addition, it has been common practice to make the adhesive strength very strong beforehand.

  However, when the FPC is removed at a time when the adhesive strength of the resin layer is strong (initial use), there is a problem that the FPC is damaged due to stress, bending, twisting, and the like. Furthermore, even if the adhesive strength is increased in advance, there is no change in the property that the flexibility and the adhesiveness are lost if it is repeatedly used. did not become.

  The present invention has been made in view of the above-described problems, and an object thereof is to provide a transport carrier in which adhesiveness and the like are not impaired even in a high temperature environment.

[First invention]
1st invention thermosets the material which has as a main component the composition obtained by carrying out the hydrolysis reaction and the condensation reaction of the mixture which has a silicate compound and the polydimethylsiloxane by which the terminal silicate modification | denaturation was carried out, and a sheet | seat is obtained. The present invention relates to a transport carrier in which, after being molded, the sheet is heated at a temperature of 260 ° C. or higher and 300 ° C. or lower for a period of 2 hours or longer and 8 hours or shorter and fixed to the base.

(Sheet)
A sheet | seat consists of a material which has as a main component the composition obtained by carrying out a hydrolysis reaction and a condensation reaction with the silicate compound and the polydimethylsiloxane by which the terminal silicate modification | denaturation was carried out. Hereinafter, polydimethylsiloxane is abbreviated as “PDMS”, and polydimethylsiloxane whose terminal is silicate-modified is abbreviated as “modified PDMS”.

(Silicate compound)
A silicate compound is a metal alkoxide oligomer made of silicon (Si), which has a siloxane (-Si-O-Si-) skeleton in the main chain and an alkoxy group (RO) introduced in the outer chain. It is. Here, (R) which is the alkyl part of the alkoxy group (RO) is exemplified by a methyl group, an ethyl group, a propyl group, and the like. This silicate compound has the property of easily reacting with water.

  Since the silicate compound is an oligomer of a metal alkoxide, it has a higher molecular weight than the metal alkoxide, and is therefore less likely to volatilize. For this reason, when the silicate compound is hydrolyzed, volatilization of the low-molecular siloxane having high volatility contained in the modified PDMS can be further suppressed. Moreover, the silicate compound has high chemical reactivity, and can smoothly advance the condensation reaction.

  Examples of the silicate compound include TEOS (tetraethoxysilane), methyl silicate, ethyl silicate, propyl silicate, and the like. Ethyl silicate is preferred from the standpoints of quality stability and safety. In the case of using methyl silicate for the purpose of increasing the reactivity, it is necessary to reliably carry out the treatment of volatile methanol.

(Modified PDMS)
Modified PDMS is a PDMS end modified with a silicate compound, PDMS having a silanol group at both ends, and an alkoxy having an alkoxy group that is a hydrolyzable functional group on one or both sides of the main chain. It is obtained by reacting with a silane partial condensate.

  This modified PDMS has a much higher functional group concentration than ordinary PDMS. Further, since the modified PDMS has high condensation reactivity with the silicate compound, the alkoxysilane partial condensate contained in the modified PDMS can be smoothly polymerized by being subjected to a condensation reaction smoothly. As the modified PDMS, those having a mass average molecular weight in the range of 5000 to 100,000 are used.

(Composition)
The composition is obtained by subjecting a mixture having the above-described silicate compound and the above-described modified PDMS to hydrolysis and condensation reaction. Since the silicate compound is easily hydrolyzed in the presence of water, the alkoxy group in the molecule of the silicate compound becomes a highly reactive silanol group (—OH group). On the other hand, the modified PDMS is also hydrolyzed to form a silanol group (also referred to as “silanol modification”) due to the presence of water.

  Since both of these silanol groups have high reactivity and at the same time have similar reactivity, aggregation of silanol is caused by hydrolyzing the mixture containing the silicate compound and the modified PDMS. The condensation reaction with the modified PDMS proceeds smoothly without being accelerated. Thereby, the low molecular weight siloxane contained in the modified PDMS is also taken into the reaction product (composition).

  In other words, the low molecular weight siloxane becomes a part of the material constituting the composition by the hydrolysis reaction and the condensation reaction, and does not exist as a simple substance, or the amount existing as a simple substance is very small (the valence of the siloxane is up to 15). ) For this reason, the low molecular weight siloxane does not volatilize from the composition, or the volatilization amount becomes extremely small.

(Sheet molding)
Since the composition is a liquid (sol), in order to form a sheet from the composition, the composition is applied to a tray such as a mold and then cured (solid or semi-solid (gel)) and molded by a drying and firing process. The sheet may have any shape as long as it can be transported by placing a transported object such as an FPC on the surface, but generally has a sheet shape or a flat plate shape.

  And the sheet | seat after the shaping | molding which finished heat processing (dry baking process) is once cooled to normal temperature, Then, it heats at the temperature of 260 degreeC or more and 300 degrees C or less for 2 hours or more and 8 hours or less. Next, it is fixed (held) by sticking or adhering to the surface of a flat base made of a hard rigid body. By heating the sheet (resin layer) at the above temperature for the above time, the unreacted composition remaining on the surface of the sheet reacts, so that flexibility and adhesiveness change even after repeated use. There is almost no stable.

  In addition, a small amount of low-molecular-weight siloxane remains in the silicone rubber used as the resin layer of the conventional carrier for transportation, and the siloxane volatilizes when heated to a high temperature in a reflow furnace or the like. Flexibility and tackiness were impaired. However, since the sheet of the first invention does not contain low-molecular-weight siloxane or the amount of siloxane as a single substance is extremely small (the valence of siloxane is up to 15), It is characterized in that siloxane adheres and the conveyed object is not corroded.

  In addition, when the main component of the resin layer of the conventional carrier for transporting the substrate is a fluororesin, the resin layer is brownish brown and blackish brown, and thus it is difficult to find foreign matters attached to the resin layer. . However, since the sheet (resin layer) of the transport carrier according to the first invention is colorless and transparent, it is easy to find foreign matter.

  As described above, the first aspect of the present invention can provide a stable transport carrier with very little change in adhesiveness even when used repeatedly in a high temperature environment. That is, the FPC attached to the transport carrier of the first invention does not float or peel from the sheet in a high temperature environment. Moreover, when peeling FPC from a sheet | seat, it can always peel off with a fixed force. Furthermore, since the life is long, it is not necessary to frequently perform maintenance work such as sheet replacement.

[Second invention]
In addition, the second invention is a method in which a material mainly composed of a composition obtained by subjecting a mixture having a silicate compound and a polydimethylsiloxane having a silicate-modified terminal to a hydrolysis reaction and a condensation reaction is thermally cured. The present invention relates to a transport carrier in which after the sheet is formed, the sheet is fixed to a base and heated at a temperature of 260 ° C. to 300 ° C. for 2 hours to 8 hours. Even in this configuration, the same effects as those of the first invention described above can be obtained.

[Third invention]
The silicate compound is represented by [Chemical Formula 1] SinO (n-1) (RO) 2 (n + 1) (R = alkyl group, n = 4 to 16). [Chemical Formula 2] SinO (n-1) (RO) 2 (n + 1) (OSi (CH3) 2) m (RO) 2 (n + 1) SinO (n-1) (R = alkyl group, n = 4 to 16, It may be represented by m> 50).

[Fourth Invention]
Moreover, it is preferable that the mixing | blending ratio of the said silicate compound (A) and the said modified | denatured PDMS (B) is the range of 0.1-10, in the molar ratio of A / B. The optimum blending ratio is around 1 in terms of A / B molar ratio. The composition which is the main component of the resin layer of the carrier for transporting a substrate according to the fourth invention is based on this optimum blend ratio, and when flexibility (low hardness) is required, modified PDMS (B) In the case where high hardness is required, the silicate compound (A) is preferably increased.

  However, when increasing the silicate compound (A), if the molar ratio exceeds 10, the volatile components of low-molecular siloxane increase. That is, since the amount of low-molecular-weight siloxane as a simple substance increases, shrinkage or thinning at the time of curing, and in some cases cracks occur. When the molar ratio is less than 0.1, the hydrolysis reaction and condensation reaction between the silicate compound (A) and the modified PDMS (B) are not performed smoothly, resulting in an uncured state, and low molecular weight siloxane remains. .

  The silicate compound is preferably a trimer to a 12-mer (a trimer to a 12-mer). This is because, if it is less than a trimer, the effect of the properties of the silicate is small, and if it is larger than the 12-mer, the viscosity of the silicate compound becomes high, which makes it difficult to handle at the time of synthesis.

  The present invention can provide a transport carrier having substantially constant adhesiveness even when used repeatedly in a high temperature environment.

It is a perspective view of the carrier for conveyance provided with the resin layer which has the composition concerning this invention as a main component. Example 1 It is a perspective view of the carrier for conveyance provided with the conventional resin layer. It is a graph of evaluation 1 of a 90 degree | times peeling test.

  The present invention will be described more specifically with reference to examples. In the examples, “part” and “%” are based on mass (part by mass, mass%) unless otherwise specified.

[Transport carrier]
As shown in FIG. 1, a transport carrier 1 according to the present invention includes a sheet (resin layer) 4 that closely contacts a lower surface of a transported body 3 such as an FPC, and a base 2 to which the sheet 4 is fixed. Since the sheet 4 has a smooth surface and weak adhesiveness, the sheet 4 can be held in close contact with the conveyed object 3 to prevent warpage or twisting of the conveyed object 3 during conveyance. can do. Further, the substrate 3 can be easily peeled off. The base 2 may be a rigid plate such as a metal plate that does not deform (high heat resistance) even in a high temperature environment such as a reflow furnace.

  The conveyance carrier 1 of Example 1 is a sheet 4 (L: a composition that will be described later as a main component formed on the surface of a base 2 of an aluminum flat metal plate (L: 150 × W: 150 × H: 1.5 mm). : 145 × W: 145 × H: 20 μm) was fixed.

(Composition)
The sheet 4 of the carrier 1 according to the present invention has as its main component a composition obtained by subjecting a mixture having a silicate compound and a polydimethylsiloxane having a silicate-modified terminal to a hydrolysis reaction and a condensation reaction. The production of this composition will be specifically described below.

  In a reaction vessel equipped with a stirrer, a thermometer, and a dropping line, ethyl silicate (manufactured by Tama Chemical Industry Co., Ltd., silicate 40 [chemical formula 1] n = 4 to 6 or silicate 45 [chemical formula 1] n = 6 to 8) 1.0 g and 32.0 g of polydimethylsiloxane obtained by alkoxy-modifying ethyl silicate at both ends [Chemical formula 2] (mass average molecular weight; equivalent to 32,000) (HBSIL039 manufactured by Arakawa Chemical Co., Ltd.) were put in the atmosphere (room temperature ) For about 30 minutes to obtain a mixed material solution A. Here, ethyl silicate and the silicate used in the polydimethylsiloxane obtained by alkoxy-modifying ethyl silicate at both ends are the same type. And silicates with the same characteristics were used.

  Then, in the hydrolysis step and the condensation step, the raw material liquid A was added dropwise with a required amount of 0.93 g of water over about 1 hour and stirred and mixed. Then, it naturally cooled to room temperature (25 degreeC) over about 30 minutes, stirring, and obtained the composition.

(Sheet molding)
Since the composition described above is liquid (sol), in order to form the sheet (resin layer) 4 using the composition, the composition is applied to a tray such as a mold and heated to be cured [solid or semi-solid ( Gel)]. Therefore, the above-described composition is uniformly applied to a tray such as a mold so as to have a final thickness of 20 μm, and then heated (dried) at 200 ° C. for 1 hour in a high-temperature furnace (DRC433FA manufactured by Advantech Toyo Co., Ltd.). The sheet 4 was obtained by heating and curing the composition. And after this sheet | seat 4 became normal temperature (25 degreeC), it heated (dry baking process) for 4 hours at 280 degreeC further using the high temperature furnace (DRC433FA by Advantech Toyo Co., Ltd.).

  Then, the above-mentioned sheet | seat 4 was stuck to the surface of the base 2 of the aluminum metal flat plate (L: 150 * W: 150 * H: 1.5mm), and the conveyance carrier 1 was manufactured. In the first embodiment, the sheet 4 is fixed to the base 2 using the adhesiveness of the sheet 4 (simply adhered), but the sheet 4 is fixed to the base using a heat resistant adhesive or the like. It may be fixed to 2.

[Evaluation 1]
Next, evaluation of the 90-degree peel test of the sheet 4 will be described.
In addition, in order to make it the same conditions as the sample (commercially available product) used in the comparative example, the size of the sheet 4 is (length 50 mm × width 50 mm, thickness 20 μm), and the base is a glass epoxy flat plate (length 50 mm × width) 50 mm × 1.8 mm).

(Evaluation carrier)
The above composition is put into a petri dish (50 mm long × 50 mm wide) so as to have a final thickness of 20 μm, and heated at 200 ° C. for 1 hour using a high temperature furnace (DRC433FA manufactured by Advantech Toyo Co., Ltd.) (dry baking treatment). )did. Thereafter, after the molded product (sheet) in the petri dish fell to room temperature, the molded product was removed from the petri dish to obtain a sheet (length 50 mm × width 50 mm, thickness 20 μm). Thereafter, the sheet was placed in the high-temperature furnace described above, and further subjected to heat treatment (dry baking treatment) at 280 ° C. for 4 hours. Then, the sheet was brought into close contact with the upper surface of a glass epoxy flat plate (length 50 mm × width 50 mm × 1.8 mm) to produce a transport carrier.

(Comparative example)
The following two carrier carriers that are commercially available were used as samples for comparison. In either case, the size is a sheet (length 50 mm × width 50 mm × thickness 2 mm) and a glass epoxy flat plate base (length 50 mm × width 50 mm × 1.8 mm).
(1) Sample 1
Magic Resin (registered trademark) (Type-K) manufactured by Taisho Electronics Co., Ltd.
(2) Sample 2
Assist carrier manufactured by Shin-Etsu Polymer Co., Ltd. (model FB-A)

(Evaluation methods)
In order to evaluate the change in peel strength when the transport carrier is used repeatedly, the following evaluation method was used. In other words, place FPC (50mm in length, 50mm in width, 75μm in thickness) on the transport carrier, and apply it by applying light pressure by hand, and measure the peel strength using the method described later before loading into the reflow furnace. did. Further, after heating the transport carrier with the FPC attached thereto for 6 minutes in a reflow oven (250 ° C. to 270 ° C.), the carrier is taken out from the reflow oven and cooled to room temperature (25 ° C.), and then peeled off using a method described later. The strength was measured. Furthermore, after heating the transport carrier to which the FPC has adhered in a reflow furnace (250 ° C. to 270 ° C.) for 6 minutes, taking out from the reflow furnace and cooling to room temperature (25 ° C.), measuring the peel strength 200 times (200 cycles).

The peel strength is measured by picking up the center part of the FPC affixed to the surface of the transport carrier sheet with a pick of a peel tester (90 degree direction), and the strength when the FPC completely peels off (maximum Value: Peak Hold). The peel tester is a small desktop material strength tester EZ manufactured by Shimadzu Corporation
Test (model EZ-S) was used. The peel strength was measured in accordance with JIS K 6256 (2004 JIS Handbook, Rubber I Compounding Agent / Material Test / Measurement Method, Adhesion Test Method for Vulcanized Rubber and Thermoplastic Rubber, page 451).

(Evaluation results)
The evaluation results are shown in FIG. FIG. 3 is a graph obtained by measuring the peel strength of each carrier. As can be seen from FIG. 3, the peel strength (adhesive strength) of Sample 1 gradually decreases from the start of the peel test to 120 cycles, and thereafter the peel strength becomes substantially zero. Moreover, it turns out that the peel strength (adhesive force) of sample 2 gradually decreases until 130 cycles, and thereafter the peel strength becomes substantially zero. On the other hand, it can be seen that the peel strength of the carrier according to the present invention (the carrier for evaluation) is substantially constant from the start of evaluation to the end of 200 cycles.

  The peel strength of the transport carrier according to the present invention (the transport carrier for evaluation) is 250 to 300 (mN / 50 mm), the thin film-like FPC is not burdened, and the peel strength to be removed is a preferable strength. is there. That is, it can be seen that the transport carrier of the present invention (evaluation transport carrier) is superior in adhesiveness and durability (life) compared to Sample 1 and Sample 2. Incidentally, it has been confirmed that the peel strength [250 to 300 (mN / 50 mm)] of the measurement test piece sheet can be maintained even if the peel test is performed 1000 times.

  In FIG. 3, the vertical axis represents the peel strength, and the unit of the peel strength is “mN / 50 mm”. The reason for using such a unit is that the size of the flexible substrate for measuring the peel strength is 50 mm, and expresses the force (mN) applied per 50 mm. “MN” means millinewton “0.001 × N”.

[Evaluation 2: 90 degree peel test of carrier]
(Measurement specimen sheet)
The above composition was poured into a petri dish (length 50 mm × width 50 mm) to a final thickness of 20 μm, heated at 200 ° C. for 1 hour (dry baking treatment), and cooled to room temperature (25 ° C.). The mold was removed from the petri dish, and 30 measurement test piece sheets (length 50 mm × width 50 mm, thickness 20 μm) were prepared.

  Then, as described later, the heating conditions (heating temperature and heating time) are changed and heated (dry baking treatment) using the above-described high-temperature furnace (DRC433FA manufactured by Advantech Toyo Co., Ltd.), and the measurement test piece sheet 1 ~ 30 was obtained. Thereafter, the measurement test piece sheets 1 to 30 were brought into close contact with the upper surface of a glass epoxy flat plate (length 50 mm × width 50 mm × 1.8 mm) to produce transport carriers 1 to 30 for testing.

(Evaluation methods)
The evaluation method is to place each FPC (50 mm long x 50 mm wide x 75 μm thick) on the test carrier 1 to 30 and apply light pressure by hand. The peel strength was measured by the method described above. Further, after heating the test carrier 1 to 30 with the FPC attached thereto for 6 minutes in a reflow furnace (250 ° C. to 270 ° C.), the test carrier was taken out from the reflow furnace and cooled to room temperature (25 ° C.), and then described above. The peel strength was measured using the method. Further, after the test carrier 1 to 30 with the FPC attached is heated again in a reflow furnace (250 ° C. to 270 ° C.) for 6 minutes, it is taken out from the reflow furnace and cooled to room temperature (25 ° C.), and then the peel strength is measured. It was repeated 50 times (50 cycles).

(Evaluation results)
Table 1 shows the peel strengths of the test carrier 1 to 30. The peel test was performed 50 times, and the PP value (peak to peak value) from the maximum value to the minimum value of the peel strength was measured. Are calculated and summarized in a table.

(Criteria)
-Variation in peel strength-
○: PP value is in the range of 0 to 40 (mN / 50 mm) ×: PP value is greater than 40 (mN / 50 mm) Note that the smaller the variation in peel strength, the better. The PP value within the range of 0 to 40 (mN / 50 mm) was set within the range of variation that would not hinder the FPC production.

According to Table 1, if the heating conditions after forming the test piece sheet are a heating temperature of 260 ° C. or more and 300 ° C. or less and a heating time of 2 hours or more and 8 hours or less, a measurement test piece sheet within the criteria is prepared. be able to.
That is, by using a sheet prepared under the heat treatment conditions, a transport carrier having a stable adhesive force can be provided.

  In Table 1, the unit of peel strength was “mN / 50 mm”. The reason for using such a unit is that the size of the FPC for measuring the peel strength is 50 mm, and expresses the force (mN) applied per 50 mm. “MN” means millinewton “0.001 × N”.

  The above-described embodiments have been illustrated for the purpose of explanation, and the present invention is not limited thereto, and can be recognized by those skilled in the art from the description of the claims, the specification, and the drawings. Modifications, deletions, and additions are possible without departing from the technical idea of the present invention.

  For example, in the embodiment described above, the sheet provided in the carrier is prepared by placing the composition in a petri dish and heating it at 200 ° C. for 1 hour using a high-temperature furnace, and then forming the molded product (sheet) in the petri dish at room temperature. Then, the molded product was removed from the petri dish, and the sheet was again placed in a high-temperature furnace, and further subjected to heat treatment at 280 ° C. for 4 hours to perform molding. You may use the thing shape | molded by making it closely_contact | adhere to flat plates made from manufacture, and performing heat processing after that.

In the above-described embodiment, as the silicate compound,
[Chemical Formula 1] SinO (n−1) (RO) 2 (n + 1) (R = alkyl group, n = 4 to 16),
As polydimethylsiloxane having a silicate-modified terminal,
[Chemical Formula 2] SinO (n-1) (RO) 2 (n + 1) (OSi (CH3) 2) m (RO) 2 (n + 1) SinO (n-1) (R = alkyl group, n = 4 to 16, m> 50)
In addition, the blending ratio of the silicate compound (A) and the polydimethylsiloxane (B) having the terminal silicate-modified is 0. You may use the material which is the range of 1-10.

  Moreover, in the above-mentioned Example, the silicate with the same kind and the same characteristic was used for the silicate used by the ethyl silicate and the polydimethylsiloxane which modified the ethyl silicate by the alkoxy at both ends. In this case, since they have similar reactivity, the reaction rate is about the same, which is preferable.

  However, the present invention is not limited to this, and silicates of different types and characteristics (for example, when using ethyl silicate and methyl silicate, when using ethyl silicates having different purity) may be used. . In this case, since a difference occurs between the reaction rates, it is necessary to adjust the synthesis time to make the reaction rates the same and to change the manufacturing conditions.

  As a base used for the carrier for conveyance of the present invention, a metal flat plate, glass epoxy flat plate, plastic flat plate, ceramic flat plate, glass flat plate, or the like may be used. As a metal flat plate, for example, a known metal flat plate such as SUS (abbreviation of stainless steel), aluminum, iron, copper or the like can be used. As a plastic flat plate, for example, polyether sulfone, polyether ketone, polyether imide, polyether Those having excellent heat resistance such as sulfide, polyarylate and polyimide can be used, and alumina, sialon, zirconia, aluminum nitride, silicon nitride, silicon carbide, titanium nitride and the like can be used as the ceramic flat plate.

  In order to mold the resin layer, a composition as a raw material is applied to the surface of a glass plate by a known screen printing method, dip method, doctor blade method, knife coating method, bar coating method, spin coating method, or the like. It may be cured.

  In addition, as described in Example 1, the resin layer in close contact with the base is formed by forming the resin layer in advance and then applying the composition onto the base, followed by drying and baking in an oven. A method may be used.

  In addition, when the composition is applied to the base, it may be attached to the periphery of the base portion with a masking tape, polyimide tape (also referred to as Kapton tape), or the like.

  The invention according to claim 1 is the first invention, the invention according to claim 2 is the second invention, the invention according to claim 3 is the third invention, the invention according to claim 4 is the fourth invention, Then, it can be grasped as follows.

[Fifth Invention]
The transport carrier manufacturing method according to a fifth aspect of the present invention is characterized in that the resin layer does not contain a siloxane having a valence of 15 or less when measured by gas chromatography (GC-MS) at 260 ° C. or less. Any one of Inventions 1 to 4 is described. With this configuration, the same effect as that of the first invention can be obtained.

  The gas chromatograph is an evaluation instrument for measuring the remaining amount of cyclic siloxane, which is a volatile component of low-molecular siloxane, in the material contained in the resin layer. As an evaluation apparatus, for example, a gas chromatograph mass spectrometer with a cooled injection system (hereinafter abbreviated as “CIS”) of a heat desorber [Twistor Desorption Unit (hereinafter abbreviated as “TDU”)] (Gerstel) [Gas Chromatography Mass Spectrometry (hereinafter abbreviated as “GC-MS”) 5975B system manufactured by Agilent Technologies, Inc.] can be used.

  As an evaluation method, in order to vaporize a volatile component in the sample, heating was performed while flowing helium gas to the sample of the sample holder by TDU. And after making the outgas vaporized in helium adsorb | suck to the adsorption tube in a CIS unit, the outgas collected by the adsorption tube was flowed to GC-MS apparatus, and the kind and quantity of the volatile component were measured. The column of the GC-MS apparatus is a capillary column (liquid layer: phenylmethylsiloxane).

  As the details of the measurement conditions, the heating unit was heated at 40 ° C. to 200 ° C. (hold time 5 minutes) at 160 ° C./min with TDU, and passed through an inert capillary tube (temperature: 350 ° C.) for mass spectrometry. To implement.

The GC-MS apparatus has an inlet temperature: −150 ° C. to 12 ° C./second to 325 ° C., a column: Agilent 19091S-433 (column length 60 m, column inner diameter 0.25 mm, column film thickness 0.25 μm), oven: 40 ° C. -25 ° C / min to 300 ° C (hold time 10 minutes), helium flow rate: 1.2 mL / min, MS ion source temperature 230 ° C: MS quadrupole temperature: 150 ° C, MS ionization voltage: 69.9 eV), Scan range: m / z 100-1000
It is. Here, MS is an abbreviation for Mass Spectrometry.

  For example, it can classify | categorize into the area | region of the valence of D3-D15 siloxane which volatilization is feared under high temperature 150 degreeC or more and 260 degrees C or less among volatile components of material, and can summarize each volatile component amount. In this case, it was found that no volatilization of the cyclic siloxane was observed when the valence of the volatile component of the material was 3-15. That is, it was found that the low molecular weight siloxane did not remain in the resin layer according to the present invention (the siloxane having a valence of up to 15 was not included).

  The carrier for transporting a substrate according to the present invention is a carrier for transporting a substrate that can be attached to a sheet-like thin substrate such as a flexible substrate and transported by reflow.

DESCRIPTION OF SYMBOLS 1,10 ... Conveyance carrier 2,20 ... Base 3,30 ... Board | substrate 4,40 ... Resin layer

Claims (4)

After forming a sheet by heating a material mainly composed of a composition obtained by subjecting a mixture having a silicate compound and a polydimethylsiloxane having a terminal silicate-modified polydimethylsiloxane to a hydrolysis reaction and a condensation reaction,
A method for producing a transport carrier, in which the sheet is heated at a temperature of 260 ° C. or higher and 300 ° C. or lower for a period of 2 hours or longer and 8 hours or shorter and fixed to a base. After forming a sheet by heating a material mainly composed of a composition obtained by subjecting a mixture having a silicate compound and a polydimethylsiloxane having a terminal silicate-modified polydimethylsiloxane to a hydrolysis reaction and a condensation reaction,
A method for producing a transport carrier, wherein the sheet is fixed to a base and heated at a temperature of 260 ° C. or more and 300 ° C. or less for 2 hours or more and 8 hours or less. The silicate compound is
[Chemical Formula 1] SinO (n-1) (RO) 2 (n + 1) (R = alkyl group, n = 4 to 16)
And
Polydimethylsiloxane having a silicate-modified terminal is
[Chemical Formula 2] SinO (n-1) (RO) 2 (n + 1) (OSi (CH3) 2) m (RO) 2 (n + 1) SinO (n-1) (R = alkyl group, n = 4 to 16, m> 50)
The manufacturing method of the conveyance carrier of Claim 1 or Claim 2 represented by these. The silicate compound (A);
The proportion of the polydimethylsiloxane (B) blended with the silicate-modified terminal is in the range of 0.1 to 10 in terms of A / B molar ratio. The manufacturing method of the conveyance carrier of description.