JP2012078983A - High intensity ic card - Google Patents
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- JP2012078983A JP2012078983A JP2010222082A JP2010222082A JP2012078983A JP 2012078983 A JP2012078983 A JP 2012078983A JP 2010222082 A JP2010222082 A JP 2010222082A JP 2010222082 A JP2010222082 A JP 2010222082A JP 2012078983 A JP2012078983 A JP 2012078983A
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- 239000011347 resin Substances 0.000 claims abstract description 10
- 229920005989 resin Polymers 0.000 claims abstract description 10
- 238000007789 sealing Methods 0.000 claims abstract description 7
- 230000003014 reinforcing effect Effects 0.000 claims description 47
- 239000000758 substrate Substances 0.000 claims description 6
- 230000002787 reinforcement Effects 0.000 abstract description 12
- 239000000463 material Substances 0.000 abstract description 9
- 230000006378 damage Effects 0.000 abstract description 4
- 230000032798 delamination Effects 0.000 abstract description 4
- 230000002093 peripheral effect Effects 0.000 abstract description 2
- 230000006866 deterioration Effects 0.000 abstract 1
- 230000009993 protective function Effects 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- 238000009863 impact test Methods 0.000 description 3
- 239000002131 composite material Substances 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
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- Credit Cards Or The Like (AREA)
Abstract
Description
本発明は、身分証明書や定期券などに用いられる電子情報記録カードに関するものである。 The present invention relates to an electronic information recording card used for identification cards and commuter passes.
近年、非接触ＩＣカードは使用事例が増大しており、今後更に増えると考えられる。日常的に使用されるため、状況に応じた信頼性の確保が求められている。非接触ＩＣカードはＩＣチップとアンテナの役割をなす配線からなる。通常は樹脂シート（アンテナシート）上に導電性物質でアンテナパターンを形成し、ＩＣチップと電気的に接合する。このような機能部品をカード状樹脂体に包埋して使用される。ＩＣチップとアンテナシート間接合は半田、異方性導電フィルム等が使用される。以上の構成物質において脆性体はＩＣチップのみである。情報はＩＣチップに保持され、且つＩＣチップは脆性破壊を起こし易い。よって信頼性に関しては、ＩＣチップの保護機構が重要な役割を果たす。上記の理由から、硬い補強板によってＩＣチップを包み込む方法によるＩＣチップ保護機構が考案、実施されてきている。 In recent years, use cases of non-contact IC cards are increasing, and it is considered that they will increase further in the future. Since it is used on a daily basis, it is required to ensure reliability according to the situation. A non-contact IC card consists of an IC chip and wiring that functions as an antenna. Usually, an antenna pattern is formed of a conductive material on a resin sheet (antenna sheet) and is electrically joined to the IC chip. Such functional parts are used by being embedded in a card-like resin body. For bonding between the IC chip and the antenna sheet, solder, an anisotropic conductive film or the like is used. In the above constituent materials, the brittle body is only the IC chip. Information is held in the IC chip, and the IC chip is susceptible to brittle fracture. Therefore, the IC chip protection mechanism plays an important role in terms of reliability. For the above reasons, an IC chip protection mechanism based on a method of wrapping an IC chip with a hard reinforcing plate has been devised and implemented.
このようなＩＣチップ保護機構では、ＩＣチップを含む領域だけが硬くなる。このため、その他のカード部分との剛性の差が大きくなり、カードが曲げられたとき、或いはカードに突起物が押し付けられたとき、ＩＣチップは破壊には至らないがカード基材の破壊や補強板端での層間剥離がみられる場合があった。 In such an IC chip protection mechanism, only the region including the IC chip is hardened. For this reason, the difference in rigidity with other card parts increases, and when the card is bent or when a protrusion is pressed against the card, the IC chip does not break, but the card base breaks or reinforces. In some cases, delamination was observed at the edge of the plate.
カードが曲げられたとき、補強板を用いたＩＣチップ保護機構の縁近傍で生じるカード基材の破壊、補強板端での層間剥離を回避するために幾つかの補強板が考案されている。外周縁近傍が薄い補強板（引用文献１参照）、凹凸外周縁を持つ補強板（引用文献２参照）、外周縁に切込みを入れた補強板（引用文献３参照）である。 Several reinforcing plates have been devised in order to avoid the destruction of the card substrate and delamination at the ends of the reinforcing plate that occur near the edge of the IC chip protection mechanism using the reinforcing plate when the card is bent. A reinforcing plate having a thin outer peripheral edge (see cited document 1), a reinforcing plate having an uneven outer circumferential edge (see cited document 2), and a reinforcing plate having a cut in the outer circumferential edge (see cited document 3).
しかしながら、これらの改良には以下に記す難点がある。
考慮すべき内容は三項目である。第一点は、補強板の大きさである。カードが曲げられたとき、或いはカードに突起物が押し付けられたとき、補強板端でカード基材の歪みは最大になる。歪みは補強板の大きさに比例する。即ち、カード基材が破断しないためには、歪みはある値以下でなければならない。また、補強板とチップとの間は封止樹脂を充填し硬化させるので、補強板が大きいということはカードにおいて硬く振舞う領域が大きくなるということであり、カード基材以外の強度上の問題が生じる。このことから、補強板の大きさは限定される。
However, these improvements have the following drawbacks.
There are three items to consider. The first point is the size of the reinforcing plate. When the card is bent or when a protrusion is pressed against the card, the distortion of the card substrate is maximized at the end of the reinforcing plate. The strain is proportional to the size of the reinforcing plate. That is, in order for the card base material not to break, the strain must be below a certain value. In addition, since a sealing resin is filled between the reinforcing plate and the chip and cured, the large reinforcing plate means that the area that behaves hard in the card becomes large, and there is a problem in strength other than the card base material. Arise. For this reason, the size of the reinforcing plate is limited.
第二点は、補強板外周縁形状である。角があったり、曲率の大きい形状があることは、カード基材の歪みを大きくするので滑らかさが必要である。 A 2nd point is a reinforcement board outer periphery shape. The presence of a corner or a shape having a large curvature increases the distortion of the card base material, and thus requires smoothness.
第三点は低剛性領域では、ＩＣチップ保護機能が低下することである。 The third point is that the IC chip protection function is lowered in the low rigidity region.
特許文献１、特許文献２、特許文献３に共通するのは、補強板外周縁近傍で剛性を低くしている点である。ＩＣチップ保護のためにはＩＣチップを覆う必要があり、その外側に低剛性領域を附加している。このため、補強板面積は均一厚の場合よりも増大する。
また、特許文献２および特許文献３は、前述した三項目全てが該当する。また、特許文献１は、第一点、第三点が該当する。
What is common to Patent Document 1, Patent Document 2, and Patent Document 3 is that the rigidity is lowered in the vicinity of the outer periphery of the reinforcing plate. In order to protect the IC chip, it is necessary to cover the IC chip, and a low-rigidity region is added to the outside. For this reason, a reinforcement board area increases compared with the case of uniform thickness.
Patent Document 2 and Patent Document 3 correspond to all three items described above. Patent Document 1 corresponds to the first point and the third point.
以上から、本発明の課題は、カード基材の破壊や補強板端での層間剥離が発生し難く、ＩＣチップ保護機能低下がない補強板を提供することである。 In view of the above, an object of the present invention is to provide a reinforcing plate that does not easily cause destruction of the card base material or delamination at the end of the reinforcing plate, and does not deteriorate the IC chip protection function.
請求項１に記載の発明は、アンテナ基材上に設けたＩＣチップを封止樹脂を介して挟持する補強板を有するＩＣカードであって、該補強板は円形状であり、かつ該補強板は該補強板中の他の領域よりも剛性が低い帯状の低剛性領域を有していることを特徴とするＩＣカードである。 The invention according to claim 1 is an IC card having a reinforcing plate for sandwiching an IC chip provided on an antenna substrate via a sealing resin, the reinforcing plate being circular, and the reinforcing plate Is an IC card characterized in that it has a belt-like low-rigidity region whose rigidity is lower than that of other regions in the reinforcing plate.
請求項２に記載の発明は、前記帯状の低剛性領域の外周形は円形でＩＣチップよりも１ｍｍ〜３ｍｍ大きく、かつ厚みは５０μｍ〜１５０μｍであり、さらに、該帯状の低剛性領域はＩＣチップより０．５ｍｍ〜１．５ｍｍ外側にあり、かつ前記帯状の低剛性領域の幅は前記厚みの２倍〜５倍であることを特徴とする請求項１に記載のＩＣカードである。 According to a second aspect of the present invention, the outer shape of the belt-like low-rigidity region is circular, 1 mm to 3 mm larger than the IC chip, and the thickness is 50 μm to 150 μm. 2. The IC card according to claim 1, wherein the IC card is 0.5 mm to 1.5 mm outside, and the width of the band-like low-rigidity region is 2 to 5 times the thickness.
請求項３に記載の発明は、前記帯状の低剛性領域の縦弾性係数が、前記補強板中の他の領域の０．３倍〜０．７倍であることを特徴とする請求項１に記載のＩＣカードである。 The invention according to claim 3 is characterized in that the longitudinal elastic modulus of the belt-like low-rigidity region is 0.3 to 0.7 times that of other regions in the reinforcing plate. It is an IC card of description.
本発明のＩＣカードは、曲げに対して高耐性であり、信頼性の高いＩＣカードである。 The IC card of the present invention is a highly reliable IC card that is highly resistant to bending.
以下に本発明を詳しく説明する。 The present invention is described in detail below.
図２に示す従来の補強板を組み込んだＩＣカードが突起物に押付けられたときの変形の様子を模式的にあらわした図が、図６である。ＩＣカード変形に対して、補強板領域は緩やかな変形となり、ＩＣチップの歪みを軽減する。他方、柔らかいカード基材は突起物に沿って変形しようとするが、補強板領域のみ硬く振舞う。このために、補強板端部近傍のカード基材に大きな歪みが発生する。 FIG. 6 schematically shows a deformation state when the IC card incorporating the conventional reinforcing plate shown in FIG. 2 is pressed against the protrusion. With respect to the deformation of the IC card, the reinforcing plate area is gradually deformed, and the distortion of the IC chip is reduced. On the other hand, the soft card substrate tends to deform along the protrusion, but only the reinforcing plate region behaves hard. For this reason, a big distortion generate | occur | produces in the card | curd base material near the reinforcement board edge part.
図３は外周近傍を低剛性領域とした補強板である。高剛性領域が小さく、ＩＣチップ保護機能が劣るため、点圧試験や点衝撃試験でのチップ破壊状況に差が現れる。 FIG. 3 shows a reinforcing plate having a low rigidity region in the vicinity of the outer periphery. Since the high-rigidity area is small and the IC chip protection function is inferior, a difference appears in the chip destruction situation in the point pressure test and the point impact test.
本発明の補強板を図１に示す。また、図４は本発明の補強板を組み込んだＩＣカード構造の説明図である。帯状の低剛性領域の内側は通常の補強板と同様にＩＣカード変形を緩和し、ＩＣチップの歪みを軽減する。帯状の低剛性領域は補強板の他の領域よりも変形が大きい。このために、補強板端部近傍のカード基材歪み増大を減少させる。 The reinforcing plate of the present invention is shown in FIG. FIG. 4 is an explanatory diagram of an IC card structure incorporating the reinforcing plate of the present invention. The inside of the belt-like low-rigidity area reduces the deformation of the IC card and reduces the distortion of the IC chip in the same manner as a normal reinforcing plate. The belt-like low-rigidity region is more deformed than the other regions of the reinforcing plate. For this reason, the increase in card substrate distortion near the end of the reinforcing plate is reduced.
図５はＩＣカードが突起物に押付けられたときの変形の様子を示す。ＩＣカードが突起物に押付けられる状況は静圧的と衝撃的とが考えられるが、衝撃的であれば高弾性率の補強板は更に高弾性的挙動を示す。補強板端部近傍カード基材の歪みは強調される。 FIG. 5 shows a state of deformation when the IC card is pressed against the protrusion. The situation where the IC card is pressed against the projection can be considered to be static pressure or shock, but if it is shocking, the reinforcing plate having a high modulus of elasticity exhibits a higher elastic behavior. The distortion of the card base near the end of the reinforcing plate is emphasized.
帯状の低剛性領域の外周形は、円形でＩＣチップよりも１ｍｍ〜３ｍｍ大きく、その厚みは均一であり５０μｍ〜１５０μｍである。また帯状の低剛性領域は、ＩＣチップより０．５ｍｍ〜１．５ｍｍ外側にあり、前記厚みの２〜５倍の幅の領域である。
本発明で円形とは、一般的な定幅図形である円に限らず、楕円等の円形に近い形状のものも含める。
The outer periphery of the belt-like low-rigidity region is circular and 1 mm to 3 mm larger than the IC chip, and its thickness is uniform and is 50 μm to 150 μm. The belt-like low-rigidity region is 0.5 mm to 1.5 mm outside the IC chip and is a region having a width 2 to 5 times the thickness.
In the present invention, a circle is not limited to a circle that is a general constant-width figure, but includes a circle that is close to a circle such as an ellipse.
また、帯状の低剛性領域は、面積比で０．３〜０．７の適当な密度の孔を開けることにより低剛性とするものである。膜厚を薄くすることで低剛性としても良い。帯状の低剛性領域の縦弾性係数が前記補強板中の他の領域の０．３倍〜０．７倍であることが好ましい。
補強板はＩＣチップに同心状に重ねて設置する。
The belt-like low-rigidity region is made low-rigid by opening holes with an appropriate density of 0.3 to 0.7 in area ratio. Low rigidity may be achieved by reducing the film thickness. It is preferable that the longitudinal elastic modulus of the belt-like low-rigidity region is 0.3 to 0.7 times that of other regions in the reinforcing plate.
The reinforcing plate is installed concentrically on the IC chip.
以下、本発明の実施例を示すが、本発明の技術範囲はこれらの実施例によりなんら限定されるものではない。 Examples of the present invention will be described below, but the technical scope of the present invention is not limited to these examples.
（実施例）
半径４．５ミリ厚さ１００ミクロンのＳＵＳ板（ステンレス板）の半径３．３ミリの外側に０．２ミリ四方の孔を放射状に一列０．２ミリ間隔で開け本発明の補強板（図１）を作成した。ＰＥＮ製アンテナシート上に形成したアルミ薄膜アンテナパターンとＩＣチップとを異方性導電フィルムを用いて電気的に接合させる。ＩＣチップの上に封止樹脂を滴下し複合補強板を重ね、１８０℃３０分間で熱硬化させる。ＩＣチップ反対側も同様にして複合補強板を封止樹脂で固定する。表裏からＰＥＴーＧ製樹脂シートで挟む。その外側にＰＥＴ製外装シートを重ねて１５０℃３０分間の条件でラミネート成型した。模式図を図４に示す。
(Example)
A SUS plate (stainless steel plate) having a radius of 4.5 mm and a thickness of 100 μm. A 0.2 mm square hole is radially formed outside the radius of 3.3 mm at intervals of 0.2 mm in a row. 1) was created. An aluminum thin film antenna pattern formed on a PEN antenna sheet and an IC chip are electrically joined using an anisotropic conductive film. A sealing resin is dropped on the IC chip, the composite reinforcing plate is stacked, and thermosetting is performed at 180 ° C. for 30 minutes. Similarly, the composite reinforcing plate is fixed with a sealing resin on the opposite side of the IC chip. It is sandwiched between PET-G resin sheets from the front and back. The outer packaging sheet made of PET was laminated on the outside, and laminate-molded under conditions of 150 ° C. for 30 minutes. A schematic diagram is shown in FIG.
（比較例１、比較例２）
点衝撃強度を比較するために、比較例１として孔の無い従来型補強板（図２）、比較例２として半径３．３ミリの外側全領域に０．２ミリ四方の孔を０．２ミリ間隔で放射状に開けた補強板（図３）についても、実施例と同じラミネート条件で成型した。
(Comparative Example 1 and Comparative Example 2)
In order to compare the point impact strength, as Comparative Example 1, a conventional reinforcing plate without holes (FIG. 2), and as Comparative Example 2, 0.2 mm square holes were formed in the entire outer region of a radius of 3.3 mm. Reinforcing plates (FIG. 3) opened radially at millimeter intervals were also molded under the same laminating conditions as in the examples.
先に記したように、カードが突起物に押付けられる状況は静圧的と衝撃的とが考えられる。ここでは強度差がより明確な衝撃試験を採用した。点衝撃試験はＪＩＳ Ｋ５６００−５−３に準拠した。落下錘は５０ｇで落下高さを１０ｃｍ、２０ｃｍ、３０ｃｍの３通り実施した。チップ割れに関する結果を表１に、カード割れに関する結果を表２に示す。本発明を実施した試料（実施例）が最も高い耐性を示した。 As described above, the situation in which the card is pressed against the protrusion can be considered to be static pressure or shocking. Here, an impact test with a clearer difference in strength was adopted. The point impact test was based on JIS K5600-5-3. The falling weight was 50 g, and the falling height was 10 cm, 20 cm, and 30 cm. Table 1 shows the results regarding chip cracking, and Table 2 shows the results regarding card cracking. The sample in which the present invention was carried out (Example) showed the highest resistance.
１ ＩＣチップ
２ アンテナシート
３ 補強板
４ 封止樹脂
５ カード基材
６ 従来型の補強板
７ 低剛性領域
８ 突起物
９ 歪の大きい領域
１０ アンテナパターン
１１ 異方性導電フィルム
DESCRIPTION OF SYMBOLS 1 IC chip 2 Antenna sheet 3 Reinforcement board 4 Sealing resin 5 Card base material 6 Conventional reinforcement board 7 Low-rigid area 8 Protrusion 9 Large distortion area 10 Antenna pattern 11 Anisotropic conductive film
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010222082A JP5556550B2 (en) | 2010-09-30 | 2010-09-30 | High strength IC card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010222082A JP5556550B2 (en) | 2010-09-30 | 2010-09-30 | High strength IC card |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2012078983A true JP2012078983A (en) | 2012-04-19 |
| JP5556550B2 JP5556550B2 (en) | 2014-07-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010222082A Expired - Fee Related JP5556550B2 (en) | 2010-09-30 | 2010-09-30 | High strength IC card |
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| Country | Link |
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| JP (1) | JP5556550B2 (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0352255A (en) * | 1989-07-20 | 1991-03-06 | Seiko Instr Inc | Structure of circuit board |
| JP2000082868A (en) * | 1998-09-07 | 2000-03-21 | Sony Corp | Flexible printed wiring board, flexible printed circuit board, and their manufacture |
| JP2000231621A (en) * | 1999-02-12 | 2000-08-22 | Hitachi Ltd | Ic card |
| JP2002163623A (en) * | 2000-11-24 | 2002-06-07 | Sony Corp | Ic card |
| JP2008511893A (en) * | 2004-09-02 | 2008-04-17 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Identification card with contactless RFID chip |
-
2010
- 2010-09-30 JP JP2010222082A patent/JP5556550B2/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0352255A (en) * | 1989-07-20 | 1991-03-06 | Seiko Instr Inc | Structure of circuit board |
| JP2000082868A (en) * | 1998-09-07 | 2000-03-21 | Sony Corp | Flexible printed wiring board, flexible printed circuit board, and their manufacture |
| JP2000231621A (en) * | 1999-02-12 | 2000-08-22 | Hitachi Ltd | Ic card |
| JP2002163623A (en) * | 2000-11-24 | 2002-06-07 | Sony Corp | Ic card |
| JP2008511893A (en) * | 2004-09-02 | 2008-04-17 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Identification card with contactless RFID chip |
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| Publication number | Publication date |
|---|---|
| JP5556550B2 (en) | 2014-07-23 |
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