JP2013089163A - Noncontact ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a noncontact IC card, even when a bending stress is applied to the surface, eliminating any possibility of causing a trouble in an IC chip or causing a crack on the surface.SOLUTION: The noncontact IC card is formed by: mounting an IC chip 3 on an antenna pattern 2 provided on a substrate 1; bonding a reinforcing plate 11 on the upper surface of the IC chip 3; vertically stacking intermediate layer base material sheets 8 and 9 and a resin sheet 10; and integrating them by heat press or the like. The reinforcing plate 11 has a projection shape larger than that of the IC chip 3, and includes a rugged part 12 at the center, and a flat part 13 formed from the periphery of the rugged part 12 to the ends of the reinforcing plate 11. The bottoms of linear recessed portions 212 of the rugged part 12 come into contact with the upper face of the IC chip 3.

Description

  The present invention relates to a non-contact type IC card used for various certifications, electronic settlement systems, door opening / closing systems, and the like.

  With the recent development of card technology, IC cards are used for a wide range of applications as information recording media used in various systems. In particular, non-contact type IC cards are used for data communication processing with external devices using electromagnetic waves or the like, and therefore do not need to be inserted into a dedicated device when performing information writing processing or reading processing. It is spreading rapidly because of its convenience.

  According to the ISO standard and the JIS standard, the thickness of the non-contact type IC card is limited to about 0.76 mm. Among them, it is necessary to incorporate an IC chip having functions such as a control unit for controlling communication processing and a memory, and an antenna for transmitting and receiving electromagnetic waves.

  Therefore, an antenna pattern is formed on a base material, an IC chip is mounted on the antenna pattern, and the antenna and the IC chip are integrated to reduce the overall thickness.

  However, when a non-contact type IC card is stored in a card case or the like and carried in a pocket or bag, bending stress is applied by external pressure and the card itself is deformed, and the force is applied to the IC chip. Then, there is a possibility that the IC chip is destroyed and the recorded data itself is lost.

  As a countermeasure, it is known that a metallic flat reinforcing plate is disposed on the IC chip to prevent destruction of the IC chip and to ensure operation reliability.

  FIG. 4 is an explanatory view of a non-contact type IC card using a conventional flat plate reinforcing plate. FIG. 4A is a cross-sectional view of a non-contact type IC card using a conventional flat plate reinforcing plate, and FIG. 4B shows an IC chip of a non-contact type IC card using a conventional flat plate reinforcing plate. It is explanatory drawing of a flat reinforcement board.

  A structure of a non-contact type IC card using a conventional flat plate reinforcing plate will be described with reference to FIG. As shown in FIG. 4A, a conventional non-contact type IC card using a flat plate reinforcing plate has an antenna pattern 2 formed on a substrate 1 and an IC chip 3 is placed on the antenna pattern 2 via bumps 4. Has been implemented.

  Next, the flat plate reinforcing plate 6 is bonded directly on the IC chip 3 mounted on the substrate 1. An intermediate layer base sheet having through holes for fitting the IC chip 3 and the flat plate reinforcing plate 6 is produced as the intermediate layer base sheet 8, and an intermediate layer base having no through holes is prepared as the intermediate layer base sheet 9. A material sheet is produced. The intermediate layer base material sheet 8 is disposed on the mounting surface of the base material 1, the intermediate layer base material sheet 9 is disposed on the back surface of the base material 1, and the resin sheets 10 are laminated on the upper and lower sides. After lamination, the sheets are joined by hot pressing or the like to produce a non-contact type IC card.

  The spiral antenna pattern 2 is formed by screen printing, etching, or the like.

  The IC chip 3 is mounted through bumps 4 formed of gold or solder. An adhesive resin 5 is used for connection between the antenna pattern 2 and the IC chip 3.

  The flat reinforcing plate 6 protects the IC chip 3 from external force. Generally, a metallic material such as stainless steel is used, and is bonded directly above the IC chip 3 with an adhesive 7. As shown in FIG. 4B, the size of the flat plate reinforcing plate 6 is larger than the area of the IC chip 3.

  The intermediate layer base sheets 8 and 9 are sheets using a resin, for example, a laminate of heat-fusible resins such as non-crystalline polyester (PET-G) and polyvinyl chloride (PVC). It is used.

  For the resin sheet 10 that is the outermost layer, for example, a resin such as PET-G, PVC, or polyethylene terephthalate (PET) is used.

  Further, Patent Document 1 discloses a technique for improving the bending strength of a non-contact type IC card by forming the reinforcing plate into a waveform instead of a simple flat plate.

  FIG. 5 is an explanatory diagram of a non-contact type IC card using a conventional corrugated reinforcing plate. FIG. 5A is a cross-sectional view of a non-contact type IC card using a conventional corrugated reinforcing plate, and FIG. 5B shows an IC chip of a non-contact type IC card using a conventional corrugated reinforcing plate. It is explanatory drawing of a waveform reinforcement board.

  The structure of a conventional non-contact type IC card using a corrugated reinforcing plate will be described with reference to FIG. As shown in FIG. 5A, the non-contact type IC card using the conventional corrugated reinforcing plate is the same as the non-contact type IC card using the conventional flat plate reinforcing plate except for the corrugated reinforcing plate 16. It is.

  As shown in FIG. 5B, the corrugated reinforcing plate 16 has a corrugated shape in which linear concave portions and linear convex portions having the same length as one side of the outer shape are alternately arranged on the entire surface of the reinforcing plate. . The corrugated reinforcing plate 16 is disposed on the IC chip 3 mounted on the substrate 1 and has a size larger than the area of the IC chip 3. Therefore, the linear concave portion and the linear convex portion of the corrugated reinforcing plate 16 are also arranged on the periphery of the IC chip 3 on the mounting surface side of the substrate 1.

JP 2002-222401 A

  The conventional non-contact type IC card using the flat plate reinforcing plate can increase the strength as compared with the state without the flat plate reinforcing plate, but when the stress is applied, the flat plate reinforcing plate itself may be deformed. For protection, a technique for increasing the strength is desired.

  By the way, it is possible to increase the strength by increasing the thickness of the flat plate reinforcing plate itself, but there is a possibility that the card thickness may be uneven, and when printing photographic prints or letters etc. for use in identification etc. In addition, there is a problem that printing omission is likely to occur.

  In the conventional non-contact type IC card using the corrugated reinforcing plate, when bending stress is applied, the strength is high in the vertical direction with respect to the linear concave portions and the linear convex portions arranged alternately, and the IC chip. However, the reinforcing plate is likely to bend in a direction parallel to the alternately arranged linear concave portions and linear convex portions, and the IC chip may be damaged. .

  Here, it is possible to increase the strength in two directions perpendicular to the two corrugated reinforcing plates on the IC chip by arranging the corrugated reinforcing plates so that the wave direction vertically intersects the upper and lower sides of the IC chip. As described above, since the thickness of the non-contact type IC card is limited, it is not realistic.

In addition, the corrugated reinforcing plate is larger than the area of the IC chip, and has a linear concave portion and a linear convex portion on the entire surface, so that the concave and convex portions are also arranged around the IC chip on the mounting surface side of the substrate. Yes. When a bending stress is applied to the non-contact type IC card, the bending stress is concentrated on the uneven portion of the corrugated reinforcing plate arranged around the IC chip, and a crack occurs on the surface of the non-contact type IC card. There is a fear.

  If there is a crack on the surface of the non-contact type IC card, printing of characters such as photographs and personal information used for identification is unclear and the role of identification may not be fulfilled. It is also conceivable that cracks on the card surface may lead to IC chip malfunctions due to static electricity or the like.

  Although it is possible to increase the strength by increasing the thickness of the corrugated reinforcing plate, the IC chip part becomes thick and the card surface becomes uneven, which may cause problems in printing photographs used for identification etc. is there.

  An object of the present invention is to provide a non-contact type IC card that does not cause defects in the IC chip or cause cracks on the surface even when bending stress is applied to the surface.

  According to the present invention, an IC chip is mounted on an antenna pattern provided on a base material, a reinforcing plate is bonded to the upper surface of the IC chip, an intermediate layer base material sheet and a resin sheet are laminated vertically, It is a non-contact type IC card integrated by hot pressing or the like, wherein the reinforcing plate has a projection shape larger than that of the IC chip, a concavo-convex portion in the center, and an end of the reinforced plate from the periphery of the concavo-convex portion A non-contact type IC card characterized in that the bottom surface of the concave portion of the concavo-convex portion is in contact with the upper surface of the IC chip.

  According to the present invention, the bottom surface of the recess is in contact with at least two positions on the top surface of the IC chip in the cross-section in the stacking direction of the non-contact IC card. It is done.

  According to the present invention, there is provided the non-contact type IC card according to the invention, wherein the uneven portion is a wave-shaped uneven portion formed by alternately arranging linear concave portions and linear convex portions having the same length. can get.

  According to the present invention, the uneven portion is an annular uneven portion comprising a flat portion at the center, an annular recess surrounding the flat portion, and an annular protrusion surrounding the annular recess. A contact type IC card is obtained.

  According to the present invention, it is possible to obtain the non-contact type IC card, wherein the flat portion is any one of a quadrangle, a circle, an ellipse, an oval, a polygon, and a cross.

  According to the present invention, an uneven portion is provided in the central portion of the reinforcing plate that reinforces the IC chip, and the uneven portion is disposed immediately above the IC chip, so that it is thin and has high strength against bending stress. By arranging the flat plate portion from the periphery to the outer edge portion on the periphery of the IC chip on the mounting surface of the base material, it is possible to prevent cracks on the card surface.

  In the non-contact type IC card of the present invention, a rectangular flat part is provided as a flat part at the center part of the uneven part, a square concave part is provided on the outer periphery, and a square convex part is provided on the outer periphery of the square concave part. By forming the letter-shaped concavo-convex portion, it is possible to increase the bending strength not only in the vertical direction but also in the parallel direction of the reinforcing plate.

  The flat portion has a circular shape, an elliptical shape, an oval shape, a polygonal shape, a cross shape, or the like, an annular concave portion is provided on the outer periphery thereof, and an annular concave and convex portion is provided on the outer periphery of the annular concave portion. Thus, the strength can be increased against bending stresses from various directions.

  By providing the flat portion and providing the annular concavo-convex portion around the flat portion, the bending strength can be sufficiently increased without arranging reinforcing plates above and below the mounted IC chip.

  By adopting the structure of the reinforcing plate provided with the concavo-convex portions, a sufficient effect against bending stress can be obtained even if the thickness of the reinforcing plate is thin. In addition, since a thick material is not used for the reinforcing plate, the thickness of the non-contact type IC card does not become uneven.

  Therefore, according to the present invention, it is possible to provide a non-contact type IC card that is thin and does not cause defects in the IC chip or cause cracks on the surface even when bending stress is applied to the card.

Explanatory drawing of the non-contact-type IC card by the 1st Embodiment of this invention. FIG. 1A is a cross-sectional view of a non-contact type IC card according to a first embodiment of the present invention. FIG. 1B is an explanatory diagram of a reinforcing plate and an IC chip according to the first embodiment of the present invention. Explanatory drawing of the non-contact-type IC card by the 2nd Embodiment of this invention. FIG. 2A is a cross-sectional view of a non-contact type IC card according to a second embodiment of the present invention. FIG. 2B is an explanatory diagram of a reinforcing plate and an IC chip according to the second embodiment of the present invention. Explanatory drawing of the 3rd, 4th, 5th embodiment of the reinforcement board of the non-contact-type IC card by this invention. FIG. 3A is a plan view of a third embodiment of a reinforcing plate of a non-contact type IC card according to the present invention. FIG. 3B is a plan view of the fourth embodiment of the reinforcing plate of the non-contact type IC card according to the present invention. FIG. 3C is a plan view of a fifth embodiment of the reinforcing plate of the non-contact type IC card according to the present invention. Explanatory drawing of the non-contact-type IC card using the conventional flat reinforcement board. FIG. 4A is a cross-sectional view of a non-contact type IC card using a conventional flat plate reinforcing plate. FIG. 4B is an explanatory diagram of a flat reinforcing plate and an IC chip of a non-contact type IC card using a conventional flat plate reinforcing plate. Explanatory drawing of the non-contact-type IC card using the conventional waveform reinforcement board. FIG. 5A is a cross-sectional view of a non-contact type IC card using a conventional corrugated reinforcing plate. FIG. 5B is an explanatory diagram of a corrugated reinforcing plate and an IC chip of a non-contact type IC card using a conventional corrugated reinforcing plate.

  Embodiments of a non-contact type IC card according to the present invention will be described below with reference to the drawings.

(First embodiment)
First, a first embodiment of a non-contact type IC card according to the present invention will be described with reference to FIG. FIG. 1A is a cross-sectional view of a non-contact type IC card according to the first embodiment of the present invention. FIG. 1B is an explanatory diagram of a reinforcing plate and an IC chip according to the first embodiment of this invention.

  In the first embodiment of the non-contact type IC card of the present invention, the antenna pattern 2 is formed on the base material 1 as in the conventional non-contact type IC card, and bumps 4 are formed on the electrode portions of the antenna pattern 2. And the IC chip 3 is mounted via the adhesive resin 5 for bonding the IC chip. Next, the reinforcing plate 11 according to the present invention is bonded via the adhesive 7 directly on the IC chip 3 on the mounting surface side of the substrate 1.

  An intermediate layer base material sheet having through holes for fitting the IC chip 3 and the reinforcing plate 11 is produced as the intermediate layer base material sheet 8, and an intermediate layer base material having no through holes is prepared as the intermediate layer base material sheet 9. A sheet is produced. The intermediate layer base material sheet 8 is disposed on the mounting surface of the base material 1, the intermediate layer base material sheet 9 is disposed on the back surface of the base material 1, and the resin sheets 10 are laminated on the upper and lower sides. After lamination, the sheets are joined by hot pressing or the like to obtain the non-contact type IC card of the present invention.

  The substrate 1 is preferably made of a resin such as PET, polyethylene naphthalate (PEN), polyimide (PI), or the like. Further, the shape may be a plate shape, but a film shape is desirable for thinning.

  The antenna pattern 2 is generally used for gravure printing, offset printing, screen printing, etc. after a metal sheet such as aluminum foil or copper foil is bonded and pasted to the substrate 1 on or both surfaces to which the IC chip 3 is bonded. The resist is printed by a simple printing method and is formed by an etching process. Not only the above method but also a conductive paste may be printed.

  The IC chip 3 is more preferably subjected to etching treatment on the cut surface in order to minimize the influence of external stress such as micro cracks on the chip surface and the dicing cut surface.

  The adhesive resin 5 for bonding the IC chip is preferably applied in a paste state on the antenna pattern 2 by a dispenser or printed by a printing method, and the IC chip 3 is preferably mounted using a flip chip method via the bumps 4.

  The adhesive 7 for bonding the reinforcing plate 11 and the IC chip 3 may be any resin as long as it can bond the IC chip 3 and the reinforcing plate 11, but is preferably a resin that exhibits flexibility after curing from the viewpoint of stress absorption. For example, it is preferable to use a sealing resin having an elastic modulus of 1 GPa or less.

  The intermediate layer base sheets 8 and 9 and the resin sheet 10 are preferably made of PET-G, but other thermoplastic resins such as PVC, ABS resin (ABS), polycarbonate (PC), and the like are alloyed. Things may be stacked. The number of laminated layers is preferably large for improving flexibility and flexibility, but is preferably in the range of about 2 to 10 from the viewpoint of workability. Moreover, since it is a multilayer structure, you may use an adhesive agent between each layer.

  As shown in FIG. 1B, the reinforcing plate 11 is composed of a concavo-convex portion 12 at the center and a flat plate portion 13 from the periphery of the concavo-convex portion 12 to the end of the reinforcing plate. In the concavo-convex portion 12, linear convex portions 112 and linear concave portions 212 having the same length are alternately arranged in parallel. In FIG. 1B, three linear convex portions 112 and two linear concave portions 212 are provided. It is a shape provided in place. Here, the greater the number of the linear convex portions 112 and the linear concave portions 212, the higher the strength against bending stress.

  As shown in FIG. 1A, the reinforcing plate 11 is disposed immediately above the IC chip 3, and the bottom surfaces of the two linear recesses of the uneven portion 12 in the cross-section in the stacking direction of the non-contact type IC card are the IC chip 3. It is in contact with the top surface. It is only necessary that the bottom surface of the linear recess 212 is in contact with the top surface of the IC chip at two or more locations in the cross section in the stacking direction. The flat plate portion 13 is disposed on the periphery of the IC chip 3 on the mounting surface of the substrate 1. When bending stress is applied, the uneven portion 12 is in contact with the substrate 1 in the peripheral portion of the IC chip 3. I try not to.

  The reinforcing plate 11 may have a projection shape larger than that of the IC chip, and the uneven portion 12 may have the same or larger area as the IC chip 3. The linear convex portion 112 and the linear concave portion 212 are provided in a direction perpendicular to the longitudinal direction of the reinforcing plate 11 as shown in FIG. Good.

  The reinforcing plate 11 is preferably made of a material having high rigidity so that it can sufficiently withstand bending stress, and a stainless plate, a copper plate, an aluminum plate, a polymer resin, or a material added with a filler may be used. In terms of workability and strength, it is preferable to use a metal material, and a hardness of 400 to 600 HV is particularly preferable.

  The thickness of the reinforcing plate 11 is preferably adjusted according to the material used in the range of several tens to 100 μm in consideration of thinning of the IC card. The area of the reinforcing plate 11 is large enough to cover the IC chip 3, and is preferably about 1.5 to 5 times the IC chip from the viewpoint of material cost.

(Second Embodiment)
Next, a second embodiment of the non-contact type IC card of the present invention will be described with reference to FIG. FIG. 2A is a sectional view of a non-contact type IC card according to the second embodiment of the present invention. FIG. 2B is an explanatory diagram of a reinforcing plate and an IC chip according to the second embodiment of the present invention.

  In the second embodiment of the non-contact type IC card of the present invention, the structure other than the reinforcing plate 21 is the same as that of the first embodiment of the non-contact type IC card of the present invention as shown in FIG. It is the same.

  As shown in FIG. 2B, the reinforcing plate 21 is composed of a concavo-convex portion 22 and a flat plate portion 23. The concavo-convex portion 22 is provided with a rectangular flat portion 322 as a flat portion at the central portion of the reinforcing plate 21, a rectangular recess 222 surrounding the rectangular flat portion 322, and a rectangular shape surrounding the rectangular recess 222. The flat plate portion 23 is a flat plate portion from the periphery of the square-shaped convex portion 122 to the end portion of the reinforcing plate 21.

  As shown in FIG. 2A, the reinforcing plate 21 is disposed immediately above the IC chip 3 on the mounting surface of the substrate 1, and the bottom surface 2 of the rectangular recess 222 in the cross-section in the stacking direction of the non-contact type IC card. The part is in contact with the upper surface of the IC chip 3. The bottom surface of the rectangular recess 222 may be in contact with the top surface of the IC chip 3 at two or more locations in the cross-section in the stacking direction of the non-contact type IC card. The flat plate portion 23 is disposed on the periphery of the IC chip 3 on the mounting surface of the substrate 1.

  The projected shape of the rectangular flat portion 322 is preferably smaller than the size of the IC chip 3 so that the bottom surface of the square-shaped recess 222 is in contact with the IC chip 3. The material, thickness, and size of the reinforcing plate 21 are the same as those in the first embodiment of the non-contact type IC card of the present invention.

(Third embodiment)
Next, a third embodiment of the non-contact type IC card of the present invention will be described with reference to FIG. FIG. 3A is a plan view of a third embodiment of the reinforcing plate of the non-contact type IC card according to the present invention. The third embodiment of the non-contact type IC card of the present invention is the same as the first embodiment of the non-contact type IC card of the present invention except for the reinforcing plate.

  As shown in FIG. 3A, the reinforcing plate 31 includes a concavo-convex portion 32 and a flat plate portion 33. The flat plate portion is composed of a circular flat portion 332 provided at the center of the reinforcing plate 31, a circular concave portion 232 surrounding the circular flat portion 332, and a circular convex portion 132 surrounding the circular concave portion 232. Reference numeral 33 denotes a flat plate portion from the periphery of the circular convex portion 132 to the end portion of the reinforcing plate 31.

  Similar to the second embodiment of the non-contact type IC card of the present invention shown in FIG. 2, the reinforcing plate 31 is disposed immediately above the IC chip 3, and the bottom surface of the circular recess 232 is on the upper surface of the IC chip 3. Arranged to touch. Similar to the second embodiment of the non-contact type IC card of the present invention, two or more bottom surfaces of the circular recesses 232 are in contact with the upper surface of the IC chip 3 in the cross-section in the stacking direction of the non-contact type IC card. That's fine. The flat plate portion 33 is disposed on the periphery of the IC chip 3 on the mounting surface of the base material.

  Since the bottom surface of the circular concave portion 232 is in contact with the IC chip 3, it is desirable that the projected shape of the circular flat portion 332 be smaller than the size of the IC chip 3. The material, thickness, and area of the reinforcing plate 31 are the same as those in the first embodiment of the non-contact type IC card of the present invention.

  The circular flat portion 332, the circular concave portion 232 that surrounds the circular flat portion 332, and the circular convex portion 132 that further surrounds the circular flat portion 332 are not limited to a circular shape, and may be an elliptical shape or an oval shape. It is only necessary that the bottom surface of the recess is in contact with the top surface of the IC chip at two or more locations in the cross section in the non-contact type IC card. The flat plate portion from the periphery of the concavo-convex portion to the end portion of the reinforcing plate may be disposed on the periphery of the IC chip on the mounting surface of the base material.

(Fourth embodiment)
Next, a reinforcing plate according to a fourth embodiment of the non-contact type IC card of the present invention will be described with reference to FIG. FIG. 3B is a plan view of the fourth embodiment of the reinforcing plate of the non-contact type IC card according to the present invention. The fourth embodiment of the non-contact type IC card of the present invention is the same as the first embodiment of the non-contact type IC card of the present invention except for the reinforcing plate.

  As shown in FIG. 3B, the reinforcing plate 41 is composed of a concavo-convex portion 42 and a flat plate portion 43. The flat plate portion includes a hexagonal flat portion 342 provided at the center of the reinforcing plate 41, a hexagonal concave portion 242 surrounding the hexagonal flat portion 342, and a hexagonal convex portion 142 surrounding the hexagonal concave portion 242. Reference numeral 43 denotes a flat plate portion from the periphery of the hexagonal convex portion 142 to the end portion of the reinforcing plate 41.

  Similar to the second embodiment of the non-contact type IC card of the present invention shown in FIG. 2, the reinforcing plate 41 is disposed immediately above the IC chip 3, and the bottom surface of the hexagonal recess 242 is placed on the upper surface of the IC chip 3. Arranged to touch. In the cross section in the stacking direction of the non-contact type IC card, it is only necessary that the bottom surface of the hexagonal concave portion 242 is in contact with the top surface of the IC chip at two or more locations. The flat plate portion 43 is disposed on the periphery of the substrate IC chip.

  Since the bottom surface of the hexagonal concave portion 242 is in contact with the IC chip 3, it is desirable that the projection shape of the hexagonal flat portion 342 is smaller than the size of the IC chip 3. About the material of the reinforcement board 41, thickness, and an area, it is the same as that of 1st Embodiment of the non-contact-type IC card of this invention.

  The hexagonal flat portion 342, the hexagonal concave portion 242 that surrounds the hexagonal flat portion 342, and the hexagonal convex portion 142 that surrounds the hexagonal shape are not limited to the hexagonal shape, and may be polygonal. The two or more locations on the bottom surface of the polygonal recess may be in contact with the top surface of the IC chip. The flat plate portion 43 from the periphery of the concavo-convex portion to the end portion of the reinforcing plate may be disposed on the periphery of the IC chip on the mounting surface of the base material.

(Fifth embodiment)
In addition, a reinforcing plate according to a fifth embodiment of the non-contact type IC card of the present invention will be described with reference to FIG. FIG. 3C is a plan view of the fifth embodiment of the reinforcing plate of the non-contact type IC card according to the present invention. The fifth embodiment of the non-contact type IC card of the present invention is the same as the first embodiment of the non-contact type IC card of the present invention except for the reinforcing plate.

  As shown in FIG. 3C, the reinforcing plate 51 includes a concavo-convex portion 52 and a flat plate portion 53. The flat plate portion includes a cross-shaped flat portion 352 provided at the center of the reinforcing plate 51, a cross-shaped concave portion 252 surrounding the cross-shaped flat portion 352, and a cross-shaped convex portion 152 surrounding the cross-shaped concave portion 252. Reference numeral 53 denotes a flat plate portion from the periphery of the cross-shaped convex portion 152 to the end portion of the reinforcing plate 51.

  Similar to the second embodiment of the non-contact type IC card of the present invention shown in FIG. 2, the reinforcing plate 51 is arranged immediately above the IC chip 3 so that the cross-shaped recess 252 contacts the upper surface of the IC chip. Be placed. In the cross-section in the stacking direction of the non-contact type IC card, it is sufficient that two or more locations on the bottom surface of the cross-shaped recess 252 are in contact with the top surface of the IC chip. The flat part 53 should just be arrange | positioned on the circumference | surroundings of the IC chip of a base material.

  The projected shape of the cross-shaped flat portion 352 is preferably smaller than the size of the IC chip 3 because the bottom surface of the cross-shaped recess 252 is in contact with the IC chip 3. The material, thickness, and size of the reinforcing plate 51 are the same as those in the first embodiment of the non-contact type IC card of the present invention.

Example 1
Embodiment 1 of a non-contact type IC card according to the present invention will be described with reference to FIG.

  As the substrate 1, PET having a thickness of 50 μm and a size of 100 mm × 100 mm square was used.

  The antenna pattern 2 was fabricated so as to correspond to the frequency of 13.56 MHz wireless communication by applying resist printing after applying an aluminum foil having a thickness of 20 μm to one side of the substrate 1 and etching.

  The IC chip 3 for a non-contact type IC card having a wireless communication frequency of 13.56 MHz is processed as the IC chip 3 into dimensions 2.5 mm in length, 2.5 mm in width, and 100 μm in thickness. A bump 4 was formed on the substrate.

  A non-conductive paste (NCP) was applied to the mounting area of the IC chip 3 of the antenna pattern 2 provided on the substrate 1 as a bonding resin 5 for IC chip bonding so as to have a thickness of 50 μm. Next, the surface of the IC chip 3 on which the bumps 4 are provided is pressed against the substrate 1 to bond the bumps 4 and the antenna pattern 2, and the IC chip 3 is bonded to the substrate 1 via the adhesive resin 5. did.

  The reinforcing plate 11 was produced using a stainless steel plate having a thickness of 100 μm. After punching the stainless steel plate into a size of 5.0 × 5.0 mm square, an uneven portion 12 was formed at the center. The concavo-convex portion 12 was formed by alternately forming a linear concave portion 212 and a linear convex portion 112 having a length of 3.0 mm and a depth of 50 μm using a mold with an air press machine.

  The reinforcing plate 11 produced immediately above the IC chip 3 was bonded via an adhesive 7. The adhesive 7 for adhering the reinforcing plate 11 is an acrylic paste-like resin having an elastic modulus after curing of 800 MPa, applied directly on the IC chip 3 with a dispenser, and adhered to the reinforcing plate 11 by thermocompression bonding. .

  At this time, the uneven portion 12 of the reinforcing plate 11 was disposed immediately above the IC chip 3, and the flat plate portion 13 of the reinforcing plate 11 was disposed on the periphery of the IC chip 3 on the mounting surface of the substrate 1.

  Next, using PET-G, an intermediate layer base sheet 8 having an outer diameter of 100 mm × 100 mm square and a thickness of 150 μm and having a through hole (6 mm × 6 mm square) into which the IC chip 3 and the reinforcing plate 11 are fitted. Was made. Similarly, an intermediate layer base sheet 9 having a size of 100 mm × 100 mm square and a thickness of 150 μm in which no through hole was formed was produced using PET-G. The intermediate layer base material sheet 8 was disposed on the mounting surface side of the base material 1, and the intermediate layer base material sheet 9 was disposed and laminated on the back surface side of the base material 1.

  An adhesive made of a thermosetting vinyl-based or vinyl acetate copolymer was applied to the adhesive surface between the intermediate layer base sheets 8 and 9 and the base 1 in a thickness of 5 μm.

  Further, the outermost layer was sandwiched between resin sheets 10 having an outer shape of 100 mm × 100 mm square and a thickness of 150 μm using PET-G, pressurized with a hot press at 0.5 MPa, heated to 120 ° C., and kept pressurized. By cooling to room temperature, a sheet having a thickness of 780 μm was produced. The sheet after hot pressing was punched out into a card size with a metal mold to produce a non-contact type IC card according to the first example of the present invention.

(Example 2)
A non-contact type IC card according to a second embodiment of the present invention will be described with reference to FIG. Similarly to Example 1, the antenna pattern 2 was formed on the substrate 1 and the IC chip 3 was mounted.

  The reinforcing plate 21 is punched into a size of 5.0 × 5.0 mm square using a stainless plate having a thickness of 100 μm in the same manner as in Example 1, and the rectangular flat portion 322 is formed as the uneven portion 22 in the center portion. Then, a square-shaped concave part 222 having a depth of 50 μm and a square-shaped convex part 122 having a height of 50 μm were formed around it. The outer periphery of the concavo-convex part was 3.0 mm × 3.0 mm square. The concavo-convex portion 22 was formed using a mold with an air press machine, as in Example 1.

  Next, in the same manner as in Example 1, the reinforcing plate 21 was bonded directly above the IC chip 3 with the adhesive resin 5. The uneven portion 22 of the reinforcing plate 21 is disposed immediately above the IC chip 3, and the flat plate portion 23 of the reinforcing plate 21 is disposed on the periphery of the IC chip 3 on the mounting surface of the substrate 1 and bonded thereto.

  The intermediate layer base sheets 8 and 9 and the outermost resin sheet 10 are laminated in the same manner as in Example 1 and laminated and integrated by hot pressing to produce a sheet having a thickness of 780 μm, punched with a mold, and carried out. The non-contact type IC card of Example 2 was produced.

(Comparative Example 1)
A comparative example 1 using a non-contact type IC card using a conventional flat plate reinforcing plate will be described with reference to FIG. Similarly to Example 1, the antenna pattern 2 was formed on the substrate 1 and the IC chip 3 was mounted.

  A stainless steel plate having a thickness of 100 μm was produced as a flat plate reinforcing plate 6 by punching into a size of 5.0 × 5.0 mm square, and adhered onto the IC chip 3 of the substrate 1 on which the IC chip 3 was mounted.

  Next, in the same manner as in Example 1, the intermediate layer base sheets 8 and 9 and the resin sheet 10 are laminated, laminated and integrated by hot pressing to produce a sheet having a thickness of 780 μm, and punched with a mold. Comparative Example 1 As a result, a non-contact type IC card using a conventional flat plate reinforcing plate was produced.

(Comparative Example 2)
A comparative example 2 using a non-contact type IC card using a conventional corrugated reinforcing plate will be described with reference to FIG. Similarly to Example 1, the antenna pattern 2 was formed on the substrate 1 and the IC chip 3 was mounted.

  The corrugated reinforcing plate 16 was produced by punching a stainless plate having a thickness of 100 μm into a 5.0 × 5.0 mm square and then processing into a corrugated shape. The corrugated shape was produced by alternately forming linear concave portions and convex portions having a depth and width of 50 μm on the entire surface of the reinforcing plate using a mold with an air press machine. The corrugated reinforcing plate 16 was bonded onto the IC chip 3 in the same manner as in the method of Example 1.

  Next, in the same manner as in Example 1, the intermediate layer base sheets 8 and 9 and the resin sheet 10 are laminated, laminated and integrated by hot pressing, a sheet having a thickness of 780 μm is produced, and punched with a mold, and a comparative example 2, a non-contact type IC card using a conventional corrugated reinforcing plate was produced.

  A bending test and a torsion test were performed on 20 pieces of each of Examples 1, Example 2, Comparative Example 1, and Comparative Example 2 of the non-contact type IC card, and the function of the IC chip was confirmed after each test. Further, it was confirmed whether or not cracks occurred on the card surface after the bending test.

(Bending test)
The test method was implemented based on JISX630555.8. Fix one end of the long side of the non-contact type IC card and move the other end, and flex it 250 times in a sinusoidal form with a frequency of 0.5 Hz from a minimum of 2 mm ± 0.5 mm to a maximum of 20 mm + 0-1 mm. It was. In the same way, the test was performed with the one end of the long side fixed on the back side. Next, one end of the short side was fixed and the other end was moved, and the sine wave was bent 250 times at a cycle of 0.5 Hz from a minimum of 1 mm ± 0.5 mm to a maximum of 10 mm + 0-1 mm. Similarly, the back surface was also tested with one end of the short side fixed. The bending test of 1000 times including the long side and the short side was set as one set, and after 10 sets were repeated, it was confirmed whether the IC chip could not function or the card surface was cracked. The results are shown in Table 1.

(Torsion test)
The test method was implemented based on JISX6305.5.9. Does the IC chip become inoperable after 10 sets of a test in which a twist of 15 ° ± 1 ° is performed 1000 times on the short side of the non-contact IC card with a period of 0.5 Hz from the center part as 10 sets? confirmed. The results are shown in Table 1.

  As shown in Table 1, according to the bending test, the IC chip malfunction occurred in Comparative Examples 1 and 2, but the IC chip malfunction did not occur in Examples 1 and 2. Further, surface cracks occurred only in Comparative Example 2. In the torsion test, the IC chip malfunction occurred in Comparative Examples 1 and 2, but the IC chip malfunction did not occur in Examples 1 and 2.

  Therefore, in the IC card according to the present invention, the bending strength and torsional strength were improved as compared with Comparative Example 1 and Comparative Example 2, and the mechanical strength could be greatly improved. Further, compared with Comparative Example 2, it was possible to prevent the occurrence of cracks on the card surface due to bending stress.

  The contactless IC card of the present invention makes it possible to provide a high-quality IC card that can withstand bending stresses generated in an actual use environment, such as an ID card, membership card, prepaid card, cash card, commuter pass, etc. It can be applied to an IC card system that can contribute to improving the security used.

DESCRIPTION OF SYMBOLS 1 Base material 2 Antenna pattern 3 IC chip 4 Bump 5 Adhesive resin 6 Flat reinforcing plate 7 Adhesive 8, 9 Intermediate | middle layer base material sheet 10 Resin sheets 11, 21, 31, 41, 51 Reinforcing plates 12, 22, 32, 42 , 52 Uneven portion 13, 23, 33, 43, 53 Flat plate portion 16 Corrugated reinforcing plate 112 Linear convex portion 212 Linear concave portion 122 R-shaped convex portion 222 Ro-shaped concave portion 322 Square flat portion 132 Circular convex portion 232 Circular concave portion 332 Circular flat portion 142 Hexagonal convex portion 242 Hexagonal concave portion 342 Hexagonal flat portion 152 Cross-shaped convex portion 252 Cross-shaped concave portion 352 Cross-shaped flat portion

Claims (5)

  An IC chip is mounted on the antenna pattern provided on the substrate, a reinforcing plate is bonded to the upper surface of the IC chip, the intermediate layer substrate sheet and the resin sheet are laminated vertically, and integrated by hot pressing or the like. And the reinforcing plate has a projection shape larger than the IC chip, a concavo-convex portion in the center, and a flat plate portion from the periphery of the concavo-convex portion to the end of the reinforcing plate, And a bottom surface of the concave portion of the concave-convex portion is in contact with an upper surface of the IC chip.   2. The non-contact type IC card according to claim 1, wherein the bottom surface of the recess is in contact with at least two positions on the top surface of the IC chip in a cross-section in the stacking direction of the non-contact type IC card.   The non-contact type IC card according to claim 2, wherein the concavo-convex portion is a corrugated concavo-convex portion formed by alternately arranging linear concave portions and linear convex portions having the same length.   3. The non-contact type according to claim 2, wherein the concavo-convex part is an annular concavo-convex part including a flat part at a center part, an annular concave part surrounding the flat part, and an annular convex part surrounding the annular concave part. IC card.   5. The non-contact type IC card according to claim 4, wherein the flat portion is any one of a quadrangle, a circle, an ellipse, an oval, a polygon, and a cross.

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