JP2012074657A - Auxiliary tool for sticking adhesive sheet - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an auxiliary tool for sticking an adhesive sheet by means of which the sticking work of a work piece can be carried out easily in a short time when a plurality of work pieces are attached to one frame with an adhesive sheet interposed therebetween.SOLUTION: The auxiliary tool for sticking an adhesive sheet is used when a plurality of work pieces are attached to an annular frame while being stuck to an adhesive sheet. The auxiliary tool for sticking an adhesive sheet comprises: a planar tool body provided with a plurality of housing parts each having a shape corresponding to that of the work piece and a depth shallower than the thickness of the work piece and having an outside diameter corresponding to the opening of the annular frame; and a plurality of micro protrusions which reduce adhesion of the adhesive sheet formed on the surface of the tool body to which the adhesive sheet is stuck.

Description

  The present invention relates to an adhesive sheet sticking auxiliary jig used when a plurality of workpieces are stuck to an adhesive sheet and attached to an annular frame.

  In a semiconductor device manufacturing process, a silicon or gallium arsenide wafer cut from an ingot by a wire saw or the like is ground and polished by a grinding apparatus or a polishing apparatus and then planarized, and then a plurality of ICs, LSIs, etc. are formed on the surface. A circuit element is formed.

  The wafer on which the circuit elements are formed is ground and polished on the back surface by a grinding device or a polishing device, and then cut using a cutting device having a cutting blade or a laser oscillator to be divided into individual circuit elements, and each semiconductor A device is manufactured.

  When processing a workpiece using a processing device such as a cutting device or a grinding device, the workpiece is disclosed in advance in Japanese Patent Laid-Open No. 5-114647 in order to improve the handleability of the workpiece. In some cases, it may be attached to an annular frame by sticking to a simple adhesive sheet.

  Further, when the size of the workpiece is small, for example, as disclosed in Japanese Patent Application Laid-Open No. 2009-146949 or Japanese Patent Application Laid-Open No. 2001-196328, a plurality of workpieces are mounted on one annular frame. In some cases, a plurality of workpieces are processed at a time.

Japanese Patent Laid-Open No. 5-114647 JP 2009-146949 A JP 2001-196328 A Japanese Patent No. 2562936

  However, when trying to increase the number of workpieces to be mounted on one frame as much as possible, it takes time to consider the optimal arrangement of the workpieces each time an operator sticks the workpieces to the adhesive sheet. There is a problem of end.

  Further, when the machining to be performed later is machining using laser irradiation means or a cutting blade, the cutting start position of the workpiece is usually detected by using so-called auto alignment as disclosed in Patent Document 4, for example.

  In auto alignment, a target pattern is detected at a predetermined position on the chuck table, and alignment is performed based on the detected target pattern. When the target pattern is not detected at the predetermined position, the target pattern is searched for in the region near the predetermined position. Therefore, if the workpiece attachment position is different for each frame, alignment takes a very long time.

  Therefore, it is very important to make the attachment position of the work piece in each frame accurate, but it is very difficult for the operator to visually position the work piece and stick it to the adhesive sheet. There is a problem that is difficult.

  The present invention has been made in view of the above points, and the object of the present invention is to attach a workpiece when attaching a plurality of workpieces to one frame via an adhesive sheet. It is to provide an auxiliary jig for sticking an adhesive sheet that can be carried out easily and in a short time.

  According to the present invention, an adhesive sheet sticking auxiliary jig used when attaching a plurality of workpieces to an adhesive sheet and mounting them on an annular frame, the shape corresponding to the shape of the workpiece and the workpiece A plurality of accommodating portions having a depth shallower than the thickness of the object, and formed on a plate-shaped jig body having an outer diameter corresponding to the opening of the annular frame, and an adhesive sheet attaching surface of the jig body. Also provided is an adhesive sheet sticking auxiliary jig characterized by comprising a plurality of minute protrusions for reducing the adhesive strength of the adhesive sheet.

  When attaching a plurality of workpieces to the annular frame via the pressure-sensitive adhesive sheet, using the pressure-sensitive adhesive sheet sticking auxiliary jig of the present invention makes it easy to attach the workpiece to the pressure-sensitive adhesive sheet in a short time. Can be implemented.

FIG. 1 (A) is a plan view of an adhesive sheet sticking auxiliary jig according to the first embodiment of the present invention, and FIG. 1 (B) is a longitudinal sectional view thereof. It is a surface side perspective view of a semiconductor wafer. It is a top view of the state which mounted the annular frame and the auxiliary jig on the holding table, and accommodated the semiconductor wafer in the accommodating part of the auxiliary jig. It is a longitudinal cross-sectional view which shows a mode that an adhesive sheet is affixed on the back surface and annular frame of the semiconductor wafer accommodated in the accommodating part of an auxiliary jig. It is a schematic perspective view of an adhesive sheet sticking machine. It is a partial cross section side view of an adhesive sheet sticking machine. It is a partial cross section side view of the adhesive sheet sticking machine in the state where the cutter assembly is lowered to the operation position. It is a top view in the state where a plurality of semiconductor wafers were attached to an annular frame via an adhesive sheet. It is a perspective view which shows the laser dicing which is an example of a process. FIG. 10 (A) is a plan view of an adhesive sheet sticking auxiliary jig according to the second embodiment of the present invention, and FIG. 10 (B) is a longitudinal sectional view thereof.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Referring to FIG. 1 (A), a plan view of the pressure-sensitive adhesive sheet sticking auxiliary jig 2 according to the first embodiment of the present invention is shown. FIG. 1B is a longitudinal sectional view thereof.

  An adhesive sheet sticking auxiliary jig (hereinafter simply referred to as an auxiliary jig) 2 is formed from a plate-shaped jig body 4 having a plurality of workpiece storage portions (sometimes simply referred to as storage portions) 6. The The jig body 4 is made of a metal such as aluminum or a resin.

  For example, when each of the workpiece accommodating portions 6 accommodates a semiconductor wafer 11 as shown in FIG. 2, the workpiece accommodating portion 6 has a circular shape having a diameter slightly larger than the outer diameter of the semiconductor wafer 11. The shape of the object accommodating part 6 is not limited to a circle, but needs to be a shape that matches the shape of the workpiece.

  The depth of the workpiece accommodating portion 6 is set to be shallower than the thickness of the workpiece. For example, when the workpiece is a semiconductor wafer 11 whose back surface is ground as shown in FIG. 2 and processed to a thickness of about 100 μm, the depth of the workpiece accommodating portion 6 needs to be shallower than 100 μm. There is.

  Here, the semiconductor wafer 11 which is a kind of workpiece will be briefly described with reference to FIG. The semiconductor wafer 11 is made of, for example, a silicon wafer whose back surface is ground and having a thickness of 100 μm, and a plurality of streets (division lines) 13 are formed in a lattice shape on the front surface 11a. A device 15 such as an IC or an LSI is formed in each of the areas partitioned by.

  The semiconductor wafer 11 configured as described above includes a device region 17 in which the device 15 is formed, and an outer peripheral surplus region 19 that surrounds the device region 17. A notch 21 is formed on the outer periphery of the semiconductor wafer 11 as a mark indicating the crystal orientation of the silicon wafer.

  Referring to FIG. 1 again, the jig body 4 is formed with alignment auxiliary lines 8 orthogonal to each other. Further, marks 10 for aligning the notches 21 of the semiconductor wafer 11 are formed so as to face the accommodating portions 6.

  Furthermore, a large number of minute protrusions 12 for reducing the adhesive force of the adhesive sheet are formed on the entire surface of the jig body 4 (adhesive sheet attachment surface). The microprotrusions 12 are formed of a sphere having a diameter of 0.5 mm, for example, but are not limited to this shape.

  Referring to FIG. 3, for example, the annular frame 14 and the auxiliary jig 2 are placed on the frame placement area 44 of the holding table 42 of the adhesive sheet bonding machine 22 as shown in FIG. The top view of the state accommodated in the workpiece accommodating part 6 upward is shown. Four placement auxiliary lines 45 that are 90 degrees apart from each other are formed on the frame placement portion 44 of the holding table.

  After the annular frame 14, the auxiliary jig 2 and the semiconductor wafer 11 were set in this way, as shown in FIG. 4, a glue layer 27 was formed on the base material 25 on the back surface 11b of the annular frame 14 and the semiconductor wafer 11. The pressure-sensitive adhesive sheet 24 is adhered by rolling the roller 30 in the direction of arrow A.

  At this time, since the depth of the accommodating portion 6 of the auxiliary jig 2 is set to be shallower than the thickness of the wafer 11, the wafer 11 protrudes from each accommodating portion 6 of the auxiliary jig 2, as shown in FIG. Since a large number of minute protrusions 12 are formed on the surface of the auxiliary jig 2, it is possible to prevent the auxiliary jig 2 from being attached to the adhesive sheet 24.

  An example in which the adhesive sheet attaching process is automated will be described with reference to FIGS. Referring to FIG. 5, the pressure-sensitive adhesive sheet pasting machine 22 is configured such that a pressure-sensitive adhesive sheet 24 wound in a roll shape is rolled into a roll shape with a take-up shaft 38 and a feeding roll 26 on which a shaft 25 is mounted. A winding roll 36 for winding is provided.

  The adhesive sheet 24 delivered from the delivery roll 26 passes between the fixed roller 28, the sheet sticking movable roller 30, and the sheet peeling operation rollers 32 and 34 and is taken up by the take-up shaft 38 of the take-up roll 36.

  Reference numeral 42 denotes a holding table on which the annular frame 14, the auxiliary jig 2, and the semiconductor wafer 11 are placed and sucked and fixed as shown in FIG. 3, and has a frame placement area 44 on which the annular frame 14 is placed and fixed. Yes. In the frame placement area 44, four placement assist lines 45 that are 90 degrees apart from each other are formed.

  The holding table 42 advances and retreats in a direction perpendicular to the feeding direction of the adhesive sheet 24, a work area 46 for setting the annular frame 14, the auxiliary jig 2 and the wafer 11 on the holding table 42, and the adhesive sheet 24 in the annular frame. 14 and a sheet attaching region 48 to be attached to the wafer 11.

  Reference numeral 40 denotes a cutter assembly. As shown in a partial cross-sectional side view of FIG. 6, a mounting base 52 that moves up and down by driving means (not shown), and a driving means (not shown) around the shaft 56 with respect to the mounting base 52. And a revolving arm 54 that revolves.

  A sheet cutter 58 is attached to the swivel arm 54 so as to be movable in the horizontal direction. The sheet cutter 58 is moved and adjusted in the radial direction of the annular frame 14 according to the inch diameter of the annular frame 14.

  Referring again to FIG. 5, a console 53 for controlling the operation is provided on the front side of the adhesive sheet pasting machine 22, and the operator controls the operation of the sheet pasting machine 22 by touching the console 53.

  Hereinafter, the operation of the pressure-sensitive adhesive sheet pasting machine 22 configured as described above will be described. First, the operator positions and places the annular frame 14 in the frame placement area 44 of the holding table 42, and further, the auxiliary line 8 is aligned with the placement auxiliary line 45 in the opening 16 of the annular frame 14. Auxiliary jig 2 is fitted to the wafer 11, and the wafer 11 is positioned and accommodated so that the notch 21 coincides with the mark 10 in the accommodating portion 6 of the auxiliary jig 2.

  When the button A is pressed, the annular frame 14 and the auxiliary jig 2 are sucked and held by the holding table 42, and the holding table 42 is moved in the direction indicated by the arrow 55 and positioned in the sheet sticking region 48.

  In order to attach the adhesive sheet 24 to the annular frame 14 and the wafer 11 positioned in the sheet attaching region 48 as shown by the dotted line in FIG. 6, the sheet attaching movable roller 30 reciprocates as indicated by the arrow S. exercise. Thereby, the adhesive sheet 24 is integrally bonded to the annular frame 14 and the wafer 11. At this time, the cutter assembly 40 is in the raised standby position.

  Next, as shown in FIG. 7, the cutter assembly 40 is lowered and the adhesive sheet 24 on the annular frame 14 is pressed by the sheet cutter 58. In this state, the adhesive arm 24 is cut into a circular shape by the sheet cutter 58 by turning the turning arm 54 360 degrees about the shaft 56. After the cutting is completed, the cutter assembly 40 returns to the standby position.

  Next, the outer used adhesive sheet 24 cut by the sheet cutter 58 is peeled off from the annular frame 14 by the movement of the sheet peeling rollers 32 and 34. That is, the sheet peeling rollers 32 and 34 are reciprocated in the direction of arrow S in FIG. Pull out to the landing area 48.

  Next, the auxiliary frame 2 in which the annular frame 14 and the wafer 11 in which the adhesive sheet 24 has been attached is accommodated in the accommodating portion 6 is placed and fixed on the holding table 42 to the work area 46 shown in FIG. Moved.

  In this work area 46, the operator takes out the annular frame 14 and the wafer 11 integrated by the adhesive sheet 24, and when turned over, a plurality of wafers 11 are attached to the annular frame 14 via the adhesive sheet 24 as shown in FIG. It will be in the state.

  The annular frame 14 is formed with two notches 18 and 20 having different shapes for contacting a positioning pin provided on the chuck table of the processing apparatus. As is clear when FIG. 8 is compared with FIG. 3, the annular frame 14 of FIG. 8 is an inverted version of the annular frame 14 shown in FIG.

  In this state, the wafer is accommodated in a wafer cassette of a laser processing apparatus or a cutting apparatus, and is supported on the annular frame 14 via an adhesive sheet 24 by a chuck table 64 of the laser processing apparatus as shown in FIG. A plurality of semiconductor wafers 11 are sucked and held.

  In FIG. 9, reference numeral 66 denotes a laser beam irradiation unit, and a condenser 68 is attached to the tip thereof. Reference numeral 70 denotes an imaging unit that images an area to be laser processed. In the laser dicing by the laser processing apparatus, first, an image of the area to be diced of the wafer 11 held on the chuck table 64 is detected to detect the street 13, and alignment is performed to align the condenser 68 with the street 13 to be diced. To do.

  After alignment, the chuck table 64 and the laser beam irradiation unit 66 are moved relative to each other in the direction of the arrow X while irradiating the wafer 11 with a laser beam having an absorptive wavelength from the condenser 68. A laser processing groove is formed on the street 13.

  In the present embodiment, since the plurality of semiconductor wafers 11 are aligned and adhered to the adhesive sheet 24, laser processing grooves can be formed on the streets 13 of the plurality of semiconductor wafers 11 by one processing feed.

  Laser machining grooves are formed in all the streets 13 extending in the first direction while indexing and feeding the chuck table 64 and the laser beam irradiation unit 66 in the Y direction orthogonal to the X direction by street pitch.

  After forming the laser processing grooves in all the streets 13 extending in the second direction orthogonal to the first direction after rotating the chuck table 64 by 90 degrees, the annular frame 14 is set in, for example, an expanding device, By expanding the pressure-sensitive adhesive sheet 24 in the radial direction and applying an external force to the wafer 11, the wafer 11 can be divided into individual devices 15 starting from the laser processing groove.

  Instead of laser dicing by a laser processing apparatus, the wafer 11 may be diced into individual devices 15 by a cutting apparatus called a dicer. In the case of dicing with a cutting device, in order to completely cut the wafer 11 with a cutting blade, the annular frame 14 is clamped with a clamp disposed on the chuck table of the cutting device, and the upper surface of the annular frame 14 is attached to the adhesive sheet. Dicing with a cutting blade is performed after pulling down from the upper surface of 24.

  Referring to FIG. 10 (A), a plan view of the pressure-sensitive adhesive sheet sticking auxiliary jig 72 of the second embodiment of the present invention is shown. FIG. 10B is a longitudinal sectional view thereof. In the jig main body 74 of the auxiliary jig 72 of the present embodiment, an accommodating portion 76 composed of a large number of through holes is formed.

  Since the accommodating portion 76 is formed from a through hole, the thickness of the jig main body 74 needs to be smaller than the thickness of the workpiece accommodated in the accommodating portion 76. The jig main body 74 is further formed with four auxiliary lines 78 for alignment that are 90 degrees apart from each other.

  On the surface (adhesive sheet attaching surface) of the jig main body 74, a large number of minute projections 82 are formed to reduce the adhesive force of the adhesive sheet. Similar to the microprojections 12 of the first embodiment, the microprojections 82 are in point contact with the adhesive layer of the adhesive sheet, and are formed for the purpose of easily peeling the adhesive sheet from the adhesive sheet sticking auxiliary jig 72.

  In the above-described embodiment, the example in which the wafer 11 after being attached to the pressure-sensitive adhesive sheet 24 is applied to dicing by a laser or a cutting blade has been described. However, the pressure-sensitive adhesive sheet sticking auxiliary jig of the present invention is limited to dicing only. However, the present invention may be applied to polishing using a grinding apparatus or polishing using a polishing apparatus.

  In the case of grinding by a grinding apparatus, the wafer 11 is accommodated in the accommodating portion 6 of the auxiliary jig 2 with the surface 11a of the wafer 11 facing up, and the adhesive sheet 24 is stuck to the surface 11a of the wafer 11 and the annular frame 14. To wear. As a result, when reversed after the attaching step, the back surface 11b of the wafer 11 is exposed, and the back surface 11b of the wafer 11 can be ground with a grinding wheel.

  In addition, when using adhesion of the adhesive sheet 24 using the auxiliary jig 2 or 72 for grinding or polishing, the holding table of the auxiliary jig 2 or 72 is used for grinding or polishing the entire back surface of the wafer 11. There is no need to align the workpiece with respect to the auxiliary jig 2 or 72, and there is no need to align the workpiece with respect to the accommodating portions 6 and 76 of the auxiliary jig 2 or 72.

2 Auxiliary jig for sticking adhesive sheet 4 Jig body 6 Housing part 8 Auxiliary line 10 Mark 11 Semiconductor wafer 12 Micro projection 14 Annular frame 16 Opening part 24 Adhesive sheet 22 Adhesive sheet sticking machine 42 Holding table 44 Frame mounting area 45 Auxiliary line 72 Auxiliary jig 74 for attaching adhesive sheet Jig main body 76 Housing part 78 Auxiliary line 82 Small protrusion

Claims (1)

A pressure-sensitive adhesive sheet sticking auxiliary jig used when attaching a plurality of workpieces to a pressure-sensitive adhesive sheet and attaching it to an annular frame,
A plate-shaped jig body having a shape corresponding to the shape of the workpiece and a plurality of accommodating portions having a depth shallower than the thickness of the workpiece, and having an outer diameter corresponding to the opening of the annular frame;
A plurality of minute protrusions for reducing the adhesive force of the adhesive sheet formed on the adhesive sheet attaching surface of the jig body;
An auxiliary jig for attaching a pressure-sensitive adhesive sheet, comprising:

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