JP2012067273A - Polyamide resin composition, and molded article composed of the same - Google Patents

Polyamide resin composition, and molded article composed of the same Download PDF

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JP2012067273A
JP2012067273A JP2010287444A JP2010287444A JP2012067273A JP 2012067273 A JP2012067273 A JP 2012067273A JP 2010287444 A JP2010287444 A JP 2010287444A JP 2010287444 A JP2010287444 A JP 2010287444A JP 2012067273 A JP2012067273 A JP 2012067273A
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polyamide resin
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JP2012067273A5 (en
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Motoharu Yoshikawa
元晴 吉川
Masayuki Mizoshita
雅之 溝下
Hiroo Karasawa
啓夫 唐澤
Keiichi Hattori
恵一 服部
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Toray Industries Inc
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Abstract

PROBLEM TO BE SOLVED: To provide a flame-retardant polyamide resin composition excellent in moldability, and excellent in glow wire characteristic, toughness, flame retardancy and electric characteristics, and to provide a molded article composed of the same.SOLUTION: The polyamide resin composition is prepared by blending 100 pts.wt. of (A) an aliphatic polyamide resin containing (A1) a copolymerized polyamide of ≥50 to ≤98 wt.% of (a1) a caproamide unit and ≥2 to <50 wt.% of (a2) a hexamethylene adipamide unit, and 10 to 30 pts.wt. of (B) a triazine compound.

Description

本発明は、成形性に優れ、グローワイヤー特性、靭性、難燃性、電気特性に優れるポリアミド樹脂組成物およびそれからなる成形品に関する。   The present invention relates to a polyamide resin composition excellent in moldability and excellent in glow wire characteristics, toughness, flame retardancy, and electrical characteristics, and a molded article comprising the same.

従来、ポリアミド樹脂は、機械特性、耐熱性、難燃性、電気特性や成形加工性等に優れている事から電気分野において広く用いられており、特にコネクター用途には不可欠な樹脂である。しかし、近年では製品の小型化に伴い、コネクターも小型化、薄肉化が進んでおり、樹脂に求められる難燃性の要求が厳しくなり、高度な難燃化技術が求められるようになっている。なかでも、グローワイヤー着火温度については、IEC60335−1規格(「家庭用及び類似用途の電気機器安全性」)の改訂により、要求温度が725℃から775℃に変更され、また、用いられる製品厚みを超えず最も製品厚みに近い厚みで試験する事が規定された。また、電気特性の指標としてIEC60112に規定されている耐トラッキング指数がよく用いられ、600V以上が要求されている。この改訂により、従来用いられている難燃性ポリアミド樹脂では不十分であることが明確となった。   Conventionally, polyamide resins have been widely used in the electrical field because they are excellent in mechanical properties, heat resistance, flame retardancy, electrical properties, molding processability, and the like, and are indispensable particularly for connector applications. However, in recent years, with the miniaturization of products, connectors are also becoming smaller and thinner, and the demand for flame retardancy required for resins has become stricter, and advanced flame retarding technology has been demanded. . In particular, with regard to the glow wire ignition temperature, the required temperature has been changed from 725 ° C to 775 ° C due to the revision of the IEC 60335-1 standard ("safety of electrical equipment for home and similar use"), and the product thickness used. It was stipulated that the test should be conducted at a thickness closest to the product thickness without exceeding. In addition, the tracking resistance index defined in IEC60112 is often used as an index of electrical characteristics, and 600 V or more is required. This revision clarified that the conventionally used flame retardant polyamide resin is insufficient.

これらの課題を解決する為に、特許文献1ではトリアジン系難燃剤を多量に添加する事により、グローワイヤー着火温度775℃を達成し、耐トラッキング指数も600Vを達成したと報告されているが、トリアジン系化合物の多量添加により機械特性に劣っており、特にコネクター用途には必須とされる靭性が著しく失われる課題がある。また、特許文献2にはオレフィン樹脂を用いて靭性を付与する技術を紹介しているが、重要な難燃性がV−2であり、著しく難燃性に欠如している課題がある。さらに、特許文献3では、ホスフィン酸塩、ホウ酸亜鉛等を配合する事により、優れたグローワイヤー特性を達成したと報告しているが、靭性などの機械特性の点で不十分であった。   In order to solve these problems, Patent Document 1 reports that a glow wire ignition temperature of 775 ° C. and a tracking resistance index of 600 V have been achieved by adding a large amount of a triazine flame retardant. The mechanical properties are inferior due to the addition of a large amount of the triazine compound, and there is a problem that the toughness essential for the connector application is significantly lost. Patent Document 2 introduces a technique for imparting toughness using an olefin resin, but the important flame retardancy is V-2, and there is a problem that the flame retardancy is remarkably lacking. Furthermore, Patent Document 3 reports that excellent glow wire characteristics have been achieved by blending phosphinates, zinc borate and the like, but it is insufficient in terms of mechanical properties such as toughness.

特開2008−239896号公報JP 2008-239896 A 特開2009−275121号公報JP 2009-275121 A 特表2008−512525号公報Special table 2008-512525 gazette

本発明は、成形性に優れ、グローワイヤー特性、靭性、難燃性、電気特性に優れる難燃性ポリアミド樹脂組成物およびこれからなる成形品を提供する。   The present invention provides a flame-retardant polyamide resin composition having excellent moldability and excellent glow wire characteristics, toughness, flame retardancy, and electrical characteristics, and a molded article comprising the same.

そこで本発明者らは上記の課題を解決すべく鋭意検討した結果、特定の共重合ポリアミド樹脂に、トリアジン化合物を配合することによって、前記目的を達成し得ることを見いだし本発明に至った。   Thus, as a result of intensive studies to solve the above problems, the present inventors have found that the above object can be achieved by blending a specific copolymerized polyamide resin with a triazine compound.

すなわち本発明は、以下のとおりである。
(1)(A1)(a1)カプロアミド単位50重量%以上98重量%未満および(a2)ヘキサメチレンアジパミド単位2重量%以上50重量%未満の共重合ポリアミドを含む(A)ポリアミド樹脂100重量部に対して、(B)トリアジン系化合物を10〜30重量部配合してなることを特徴とするポリアミド樹脂組成物。
(2)(A)ポリアミド樹脂が、さらに(A2)(a1)カプロアミド単位2重量%以上50重量%未満および(a2)ヘキサメチレンアジパミド単位50重量%以上98重量%未満の共重合ポリアミドを含むことを特徴とする(1)記載のポリアミド樹脂組成物。
(3)前記(A1)と(A2)の比が、(A1)/(A2)=15/85〜85/15である(2)記載のポリアミド樹脂組成物。
(4)(A)ポリアミド樹脂が、さらに(A3)ポリヘキサメチレンアジパミド樹脂を含むことを特徴とする(1)〜(3)のいずれか記載のポリアミド樹脂組成物。
(5)前記(A1)と(A3)の重量比が、(A1)/(A3)=10/90〜90/10である(4)記載のポリアミド樹脂組成物。
(6)トリアジン系化合物がメラミンシアヌレートであることを特徴とする(1)〜(5)のいずれか記載のポリアミド樹脂組成物。
(7)メラミンシアヌレートの平均粒子径が15μm以下であることを特徴とする(6)記載のポリアミド樹脂組成物。
(8)(A)ポリアミド樹脂100重量部に対して、(C)ジアミン化合物と脂肪酸化合物との重縮合物を0.1〜1.0重量部配合してなることを特徴とする(1)〜(7)のいずれか記載のポリアミド樹脂組成物。
(9)(1)〜(8)いずれか記載のポリアミド樹脂組成物を、射出成形、押出成形、ブロー成形から選ばれる少なくとも1種の方法で成形してなる成形品。
(10)成形品が、筐体、外装部品またはコネクターであることを特徴とする(9)記載の成形品。
(11)IEC60695−2−13に準拠した試験において、グローワイヤー着火温度が、製品厚み0.75mm、1.5mm、3mmのすべてにおいて775℃以上である(9)または(10)記載の成形品。
That is, the present invention is as follows.
(A) (A1) (a1) containing a copolymerized polyamide of 50% by weight to less than 98% by weight of caproamide units and (a2) 2% by weight to less than 50% by weight of hexamethylene adipamide units (A) 100% by weight of polyamide resin A polyamide resin composition comprising 10 to 30 parts by weight of (B) triazine-based compound with respect to parts.
(2) The (A) polyamide resin further comprises (A2) (a1) a copolymer polyamide having 2 to 50% by weight of caproamide units and (a2) 50 to 98% by weight of hexamethylene adipamide units. The polyamide resin composition according to (1), comprising:
(3) The polyamide resin composition according to (2), wherein the ratio of (A1) to (A2) is (A1) / (A2) = 15/85 to 85/15.
(4) The polyamide resin composition according to any one of (1) to (3), wherein the (A) polyamide resin further comprises (A3) a polyhexamethylene adipamide resin.
(5) The polyamide resin composition according to (4), wherein the weight ratio of (A1) to (A3) is (A1) / (A3) = 10/90 to 90/10.
(6) The polyamide resin composition according to any one of (1) to (5), wherein the triazine compound is melamine cyanurate.
(7) The polyamide resin composition according to (6), wherein the average particle size of melamine cyanurate is 15 μm or less.
(8) (A) 0.1 to 1.0 part by weight of polycondensate of diamine compound and fatty acid compound is blended with 100 parts by weight of polyamide resin (1) -Polyamide resin composition in any one of (7).
(9) A molded product obtained by molding the polyamide resin composition according to any one of (1) to (8) by at least one method selected from injection molding, extrusion molding, and blow molding.
(10) The molded product according to (9), wherein the molded product is a casing, an exterior part, or a connector.
(11) The molded article according to (9) or (10), wherein the glow wire ignition temperature is 775 ° C. or higher in all of the product thicknesses of 0.75 mm, 1.5 mm, and 3 mm in a test based on IEC60695-2-13 .

本発明によれば、特定の共重合ポリアミド樹脂にトリアジン系化合物を配合する事により、溶融時の粘度低下効果を引き起こし成形性に優れるだけでなく、高い難燃性、優れたグローワイヤー性、優れた耐トラッキング性を有するポリアミド樹脂組成物を提供できる。さらに、結晶化度、結晶化速度を抑制する効果により、優れた金型転写性を有する事から製品外観に優れ、更には特に靭性に優れるポリアミド樹脂組成物を提供できる。   According to the present invention, by blending a triazine-based compound with a specific copolymer polyamide resin, not only the viscosity lowering effect at the time of melting is caused and the moldability is excellent, but also high flame retardancy, excellent glow wire property, excellent In addition, a polyamide resin composition having tracking resistance can be provided. Furthermore, due to the effect of suppressing the crystallization degree and the crystallization speed, a polyamide resin composition having excellent product appearance and particularly excellent toughness can be provided since it has excellent mold transferability.

以下、本発明の実施形態を説明する。本発明において「重量」とは「質量」を意味する。   Embodiments of the present invention will be described below. In the present invention, “weight” means “mass”.

本発明で用いられる(A)ポリアミド樹脂とは、(A1)(a1)カプロアミド単位50重量%以上98重量%未満および(a2)ヘキサメチレンアジパミド単位2重量%以上50重量%未満の共重合ポリアミドを含むことが重要である。(a1)カプロアミド単位と(a2)ヘキサメチレンアジパミド単位の共重合比率は(a1)/(a2)=70/30〜99/1(重量比)が好ましく、さらに好ましくは(a1)/(a2)=90/10〜97/3(重量比)である。(a1)カプロアミド単位を多く含むポリアミドを使用することにより、後に述べる(B)トリアジン系化合物を多量に配合した場合でも靭性低下が抑えられ、且つ外観が損なわれない。   The (A) polyamide resin used in the present invention is a copolymer of (A1) (a1) 50% by weight to 98% by weight of caproamide units and (a2) 2% by weight to 50% by weight of hexamethylene adipamide units. It is important to include a polyamide. The copolymerization ratio of (a1) caproamide unit and (a2) hexamethylene adipamide unit is preferably (a1) / (a2) = 70/30 to 99/1 (weight ratio), more preferably (a1) / ( a2) = 90/10 to 97/3 (weight ratio). (A1) By using a polyamide containing a large amount of caproamide units, even when (B) a triazine compound described later is blended in a large amount, a decrease in toughness is suppressed and the appearance is not impaired.

さらに本発明では(A1)に(A2)(a1)カプロアミド単位2重量%以上50重量%未満および(a2)ヘキサメチレンアジパミド単位50重量%以上98重量%以下の共重合ポリアミドを配合することが好ましい。(A2)を配合することにより、溶融粘度を低下させる事ができる。また、吸水時にも靱性を損なうことなく難燃剤の高配合が可能となり、成形品の外観も良好となる。(a1)カプロアミド単位と(a2)ヘキサメチレンアジパミド単位の共重合比率は(a1)/(a2)=30/70〜1/99(重量比)が好ましく、さらに好ましくは(a1)/(a2)=10/90〜1/99(重量比)である。   Further, in the present invention, (A1) is blended with (A2) (a1) a caproamide unit of 2% by weight to less than 50% by weight and (a2) a hexamethylene adipamide unit of 50% by weight or more and 98% by weight or less. Is preferred. By blending (A2), the melt viscosity can be lowered. In addition, the flame retardant can be highly blended without impairing the toughness even at the time of water absorption, and the appearance of the molded product can be improved. The copolymerization ratio of (a1) caproamide unit and (a2) hexamethylene adipamide unit is preferably (a1) / (a2) = 30/70 to 1/99 (weight ratio), more preferably (a1) / ( a2) = 10/90 to 1/99 (weight ratio).

(A1)と(A2)を併用する場合の配合比率に特に制限は無いが、(A1)/(A2)=15/85〜85/15が好ましく、さらに好ましくは(A1)/(A2)=20/80〜80/20である。   Although there is no restriction | limiting in particular in the mixture ratio in the case of using (A1) and (A2) together, (A1) / (A2) = 15 / 85-85 / 15 is preferable, More preferably, (A1) / (A2) = 20/80 to 80/20.

また本発明では(A1)に(A3)ヘキサメチレンアジパミド樹脂を配合することが好ましい。(A3)を配合する事により、グローワイヤー性を損なうことなく、結晶化特性が改善される事により離型性をはじめとする成形性が大幅に向上する。(A1)と(A3)を併用する場合の配合比率(重量比)に特に制限は無いが(A1)/(A3)=10/90〜90/10が好ましく、さらに好ましくは(A1)/(A3)=15/85〜85/15である。   Moreover, in this invention, it is preferable to mix | blend (A3) hexamethylene adipamide resin with (A1). By blending (A3), the moldability including mold releasability is greatly improved by improving the crystallization characteristics without impairing the glow wire property. Although there is no restriction | limiting in particular in the mixture ratio (weight ratio) in the case of using (A1) and (A3) together, (A1) / (A3) = 10 / 90-90 / 10 are preferable, More preferably, (A1) / ( A3) = 15/85 to 85/15.

好ましい(A)共重合ポリアミド樹脂としては、(A1)(a1)カプロアミド単位50重量%以上98重量%以下および(a2)ヘキサメチレンアジパミド単位2重量%以上50重量%未満の共重合ポリアミド樹脂、(A2)(a1)カプロアミド単位2重量%以上50重量%未満および(a2)ヘキサメチレンアジパミド単位50重量%以上98重量%以下の共重合ポリアミド樹脂を含む樹脂が挙げられる。また、(A1)(a1)カプロアミド単位50重量%以上98重量%以下および(a2)ヘキサメチレンアジパミド単位2重量%以上50重量%未満の共重合ポリアミド樹脂、(A3)ポリヘキサメチレンアジパミド樹脂を含むものも好ましい。(A3)ポリヘキサメチレンアジパミド樹脂を含む事により、結晶化特性が改善され成形性が大幅に改善するだけでなく、耐熱性が大幅に向上する。成形加工性、相溶性などの必要特性に応じて、更に他のポリアミド樹脂を加えて混合物として用いることも実用上好適である。   Preferable (A) copolymerized polyamide resin is (A1) (a1) copolymer polyamide resin of 50% by weight to 98% by weight of caproamide unit and (a2) hexamethylene adipamide unit of 2% by weight to less than 50% by weight. And (A2) (a1) 2 to 50% by weight of caproamide units and (a2) a resin containing a copolymerized polyamide resin having 50 to 98% by weight of hexamethylene adipamide units. (A1) (a1) 50% by weight to 98% by weight of caproamide units and (a2) a copolymerized polyamide resin having 2% by weight to 50% by weight of hexamethylene adipamide units, (A3) polyhexamethylene adipa Those containing a mid resin are also preferred. By including (A3) polyhexamethylene adipamide resin, not only the crystallization characteristics are improved and the moldability is greatly improved, but also the heat resistance is greatly improved. Depending on the required properties such as moldability and compatibility, it is also practically preferable to add another polyamide resin and use it as a mixture.

他のポリアミド樹脂の具体的な例は、アミノ酸、ラクタムあるいはジアミンとジカルボン酸を主たる構成成分とするポリアミドである。その主要構成成分の代表例としては、6−アミノカプロン酸、11−アミノウンデカン酸、12−アミノドデカン酸、パラアミノメチル安息香酸などのアミノ酸、ε−カプロラクタム、ω−ラウロラクタムなどのラクタム、テトラメチレンジアミン、ヘキサメチレンジアミン、1,5−ペンタンジアミン、2−メチルペンタメチレンジアミン、ノナメチレンジアミン、ウンデカメチレンジアミン、ドデカメチレンジアミン、2,2,4−/2,4,4−トリメチルヘキサメチレンジアミン、5−メチルノナメチレンジアミン、メタキシレンジアミン、パラキシレンジアミン、1,3−ビス(アミノメチル)シクロヘキサン、1,4−ビス(アミノメチル)シクロヘキサン、1−アミノ−3−アミノメチル−3,5,5−トリメチルシクロヘキサン、ビス(4−アミノシクロヘキシル)メタン、ビス(3−メチル−4−アミノシクロヘキシル)メタン、2,2−ビス(4−アミノシクロヘキシル)プロパン、ビス(アミノプロピル)ピペラジン、アミノエチルピペラジンなどの脂肪族、脂環族、芳香族のジアミン、およびアジピン酸、スペリン酸、アゼライン酸、セバシン酸、ドデカン二酸、テレフタル酸、イソフタル酸、2−クロロテレフタル酸、2−メチルテレフタル酸、5−メチルイソフタル酸、5−ナトリウムスルホイソフタル酸、2,6−ナフタレンジカルボン酸、ヘキサヒドロテレフタル酸、ヘキサヒドロイソフタル酸などの脂肪族、脂環族、芳香族のジカルボン酸が挙げられ、本発明においては、これらの原料から誘導されるナイロンホモポリマーまたはコポリマーを各々単独または混合物の形で用いることができる。   Specific examples of other polyamide resins are polyamides mainly composed of amino acids, lactams or diamines and dicarboxylic acids. Representative examples of the main constituents include amino acids such as 6-aminocaproic acid, 11-aminoundecanoic acid, 12-aminododecanoic acid and paraaminomethylbenzoic acid, lactams such as ε-caprolactam and ω-laurolactam, and tetramethylenediamine. , Hexamethylenediamine, 1,5-pentanediamine, 2-methylpentamethylenediamine, nonamethylenediamine, undecamethylenediamine, dodecamethylenediamine, 2,2,4- / 2,4,4-trimethylhexamethylenediamine, 5-methylnonamethylenediamine, metaxylenediamine, paraxylenediamine, 1,3-bis (aminomethyl) cyclohexane, 1,4-bis (aminomethyl) cyclohexane, 1-amino-3-aminomethyl-3,5 5-trimethylcyclohexa , Bis (4-aminocyclohexyl) methane, bis (3-methyl-4-aminocyclohexyl) methane, 2,2-bis (4-aminocyclohexyl) propane, bis (aminopropyl) piperazine, aminoethylpiperazine, etc. , Cycloaliphatic, aromatic diamines, and adipic acid, speric acid, azelaic acid, sebacic acid, dodecanedioic acid, terephthalic acid, isophthalic acid, 2-chloroterephthalic acid, 2-methylterephthalic acid, 5-methylisophthalic acid Examples include aliphatic, alicyclic, and aromatic dicarboxylic acids such as acid, 5-sodium sulfoisophthalic acid, 2,6-naphthalenedicarboxylic acid, hexahydroterephthalic acid, and hexahydroisophthalic acid. Each of nylon homopolymers or copolymers derived from It can be used alone or in the form of mixtures.

本発明において、他のポリアミド樹脂としては、150℃以上の融点を有する耐熱性や強度に優れたポリアミド樹脂が好ましい。具体的な例としては、ポリカプロアミド(ナイロン6)、ポリペンタメチレンアジパミド(ナイロン56)、ポリテトラメチレンアジパミド(ナイロン46)、ポリヘキサメチレンセバカミド(ナイロン610)、ポリヘキサメチレンドデカミド(ナイロン612)、ポリウンデカンアミド(ナイロン11)、ポリドデカンアミド(ナイロン12)、ポリカプロアミド/ポリヘキサメチレンテレフタルアミドコポリマー(ナイロン6/6T)、ポリヘキサメチレンアジパミド/ポリヘキサメチレンイソフタルアミドコポリマー(ナイロン66/6I)、ポリヘキサメチレンテレフタルアミド/ポリヘキサメチレンイソフタルアミドコポリマー(ナイロン6T/6I)、ポリヘキサメチレンテレフタルアミド/ポリドデカンアミドコポリマー(ナイロン6T/12)、ポリヘキサメチレンアジパミド/ポリヘキサメチレンテレフタルアミド/ポリヘキサメチレンイソフタルアミドコポリマー(ナイロン66/6T/6I)、ポリキシリレンアジパミド(ナイロンXD6)、ポリヘキサメチレンテレフタルアミド/ポリ−2−メチルペンタメチレンテレフタルアミドコポリマー(ナイロン6T/M5T)、ポリノナメチレンテレフタルアミド(ナイロン9T)およびこれらの混合物などが挙げられる。   In the present invention, the other polyamide resin is preferably a polyamide resin having a melting point of 150 ° C. or more and excellent in heat resistance and strength. Specific examples include polycaproamide (nylon 6), polypentamethylene adipamide (nylon 56), polytetramethylene adipamide (nylon 46), polyhexamethylene sebamide (nylon 610), polyhexa Methylene dodecanamide (nylon 612), polyundecanamide (nylon 11), polydodecanamide (nylon 12), polycaproamide / polyhexamethylene terephthalamide copolymer (nylon 6 / 6T), polyhexamethylene adipamide / polyhexa Methylene isophthalamide copolymer (nylon 66 / 6I), polyhexamethylene terephthalamide / polyhexamethylene isophthalamide copolymer (nylon 6T / 6I), polyhexamethylene terephthalamide / polydodecanamide copolymer ( Iron 6T / 12), polyhexamethylene adipamide / polyhexamethylene terephthalamide / polyhexamethylene isophthalamide copolymer (nylon 66 / 6T / 6I), polyxylylene adipamide (nylon XD6), polyhexamethylene terephthalamide / Poly-2-methylpentamethylene terephthalamide copolymer (nylon 6T / M5T), polynonamethylene terephthalamide (nylon 9T), and mixtures thereof.

本発明で用いるポリアミド樹脂の分子量は特に制限はないが、98%濃硫酸中に1g/dlの濃度で溶解した溶液の相対粘度が25℃で1.8〜5.0の範囲であることが好ましい。得られる樹脂組成物の流動性の観点からより好ましくは1.8〜4.0の範囲である。   The molecular weight of the polyamide resin used in the present invention is not particularly limited, but the relative viscosity of a solution dissolved in 98% concentrated sulfuric acid at a concentration of 1 g / dl is in the range of 1.8 to 5.0 at 25 ° C. preferable. More preferably, it is in the range of 1.8 to 4.0 from the viewpoint of fluidity of the resulting resin composition.

本発明では(A)ポリアミド樹脂100重量部に対して、(B)トリアジン系化合物を10〜30重量部含有することが必要である。トリアジン系化合物を配合することで高いグローワイヤー性、難燃性が得られる。   In this invention, it is necessary to contain 10-30 weight part of (B) triazine type compound with respect to 100 weight part of (A) polyamide resin. By blending a triazine compound, high glow wire properties and flame retardancy can be obtained.

本発明に用いる(B)トリアジン系化合物とは、トリアジン骨格を有する、窒素元素を含有する化合物であり、熱可塑性樹脂に配合して難燃性を付与することが可能な難燃剤として知られている化合物である。具体的な例としては、メラミン、メレム、メラム、メロン、およびこれらとシアヌール酸の塩、シアヌール酸、およびこれらの混合物が挙げられる。塩の代表例としては、メラミンシアヌレートが挙げられる。本発明で使用する(B)トリアジン系化合物としては、耐熱性、ポリアミド樹脂との混合性の良さから、メラミンシアヌレートがとりわけ好ましい。(B)トリアジン系化合物の平均粒子径は、15μm以下が好ましく、更に好ましくは10μm以下、とりわけ好ましくは5μm以下である。平均粒子径が15μm以下であれば、吸水時の靭性がより向上する。なお、平均粒子径はJIS K 5600−9−3(2006年)に準じて測定をした値から算出した数平均粒子径である。   The (B) triazine compound used in the present invention is a compound containing a nitrogen element and having a triazine skeleton, and is known as a flame retardant that can be blended with a thermoplastic resin to impart flame retardancy. It is a compound. Specific examples include melamine, melem, melam, melon, and their salts with cyanuric acid, cyanuric acid, and mixtures thereof. A typical example of the salt is melamine cyanurate. As the (B) triazine compound used in the present invention, melamine cyanurate is particularly preferable from the viewpoint of heat resistance and good miscibility with the polyamide resin. (B) The average particle size of the triazine compound is preferably 15 μm or less, more preferably 10 μm or less, and particularly preferably 5 μm or less. If the average particle diameter is 15 μm or less, the toughness at the time of water absorption is further improved. In addition, an average particle diameter is the number average particle diameter computed from the value measured according to JISK5600-9-3 (2006).

本発明では(A)ポリアミド樹脂100重量部に対して、(C)ジアミン化合物と脂肪酸化合物との重縮合物を0.1〜1.0重量部配合することが実用上好ましい。ジアミン化合物と脂肪酸化合物との重縮合物を配合することで離型性が大幅に改善され、より薄型、複雑形状の成形品を容易に得ることができる。成形品の外観と機械特性、グローワイヤー性のバランスから、より好ましくは0.3〜0.9重量部の範囲である。ジアミン化合物としては、例えば、エチレンジアミン、テトラメチレンジアミン、ヘキサメチレンジアミン、1,5−ペンタンジアミン、2−メチルペンタメチレンジアミン、ノナメチレンジアミン、ウンデカメチレンジアミン、ドデカメチレンジアミン、2,2,4−/2,4,4−トリメチルヘキサメチレンジアミン、5−メチルノナメチレンジアミン、メタキシレンジアミン、パラキシレンジアミンなどが挙げられ、エチレンジアミンが好ましい。脂肪酸化合物としては、例えば、セバシン酸、ステアリン酸、アジピン酸、スペリン酸、アゼライン酸などが挙げられ、セバシン酸、ステアリン酸が好ましい。   In the present invention, it is practically preferable to blend 0.1 to 1.0 parts by weight of the polycondensate of (C) a diamine compound and a fatty acid compound with respect to 100 parts by weight of the (A) polyamide resin. By blending a polycondensate of a diamine compound and a fatty acid compound, the releasability is greatly improved, and a molded product having a thinner and complex shape can be easily obtained. More preferably, it is in the range of 0.3 to 0.9 parts by weight from the balance of appearance, mechanical properties and glow wire property of the molded product. Examples of the diamine compound include ethylenediamine, tetramethylenediamine, hexamethylenediamine, 1,5-pentanediamine, 2-methylpentamethylenediamine, nonamethylenediamine, undecamethylenediamine, dodecamethylenediamine, 2,2,4- / 2,4,4-trimethylhexamethylenediamine, 5-methylnonamethylenediamine, metaxylenediamine, paraxylenediamine and the like, and ethylenediamine is preferred. Examples of the fatty acid compound include sebacic acid, stearic acid, adipic acid, speric acid, and azelaic acid, and sebacic acid and stearic acid are preferable.

本発明のポリアミド樹脂組成物には、さらに本発明の目的を損なわない範囲で他のポリマー、銅系熱安定剤、ヒンダードフェノール系、リン系、イオウ系などの酸化防止剤、熱安定剤、紫外線吸収剤、滑剤、他の離型剤、帯電防止剤、および染料・顔料を含む着色剤などの通常の添加剤を1種以上添加することができる。   In the polyamide resin composition of the present invention, other polymers, copper-based heat stabilizers, hindered phenol-based, phosphorus-based, sulfur-based antioxidants, heat stabilizers, etc., as long as the object of the present invention is not impaired. One or more usual additives such as ultraviolet absorbers, lubricants, other mold release agents, antistatic agents, and coloring agents including dyes and pigments can be added.

本発明のポリアミド樹脂組成物からは、優れたグローワイヤー性を有する成形品が得られる。具体的にはIEC60695−2−13に準拠した試験において、グローワイヤー着火温度が、製品厚み0.75mm、1.5mm、3mmにおいて775℃以上であることが好ましく、より好ましくは800℃以上であり、さらに好ましくは825℃以上である。グローワイヤー着火温度とは、GW−IT(Glow Wire Ignition Temperature)と呼ばれ、所望の温度に昇温したワイヤーを規定厚みを有した樹脂成形品に押し当て、着火しない若しくは着火後5秒以内に消火する温度のことである。   From the polyamide resin composition of the present invention, a molded product having excellent glow wire properties can be obtained. Specifically, in a test in accordance with IEC60695-2-13, the glow wire ignition temperature is preferably 775 ° C. or higher, more preferably 800 ° C. or higher at product thicknesses of 0.75 mm, 1.5 mm, and 3 mm. More preferably, it is 825 ° C. or higher. The glow wire ignition temperature is called GW-IT (Glow Wire Ignition Temperature), and the wire heated to a desired temperature is pressed against a resin molded product having a specified thickness and does not ignite or within 5 seconds after ignition. The temperature at which the fire is extinguished.

本発明のポリアミド樹脂組成物の製造方法は特に制限はなく、例えば単軸または2軸の押出機やニーダー等の混練機を用いて220〜330℃の温度で溶融混練する方法等が挙げられる。また、(B)トリアジン系化合物などの難燃剤は、その分散性が良好なほど高い難燃効果が発現するため、樹脂成分と同時に配合する製造方法が好ましい。   There is no restriction | limiting in particular in the manufacturing method of the polyamide resin composition of this invention, For example, the method of melt-kneading at the temperature of 220-330 degreeC using kneading machines, such as a monoaxial or biaxial extruder and a kneader, etc. are mentioned. Moreover, since the flame retardant such as the (B) triazine compound exhibits a higher flame retardant effect as its dispersibility becomes better, a production method in which it is blended simultaneously with the resin component is preferable.

本発明のポリアミド樹脂組成物は、射出成形、押出成形、ブロー成形など通常の方法で容易に成形することができ、得られた成形品は、成形性に優れ、グローワイヤー特性、靭性、難燃性、電気特性に優れ、電気電子部品、自動車部品等に好適である。また、電気電子部品に求められる特性である、グローワイヤー特性、靭性、難燃性、電気特性に特に優れることから、コネクター部品に好適である。   The polyamide resin composition of the present invention can be easily molded by ordinary methods such as injection molding, extrusion molding, blow molding, etc. The obtained molded product has excellent moldability, glow wire characteristics, toughness, flame retardancy Excellent in electrical properties and electrical characteristics, and suitable for electrical and electronic parts, automobile parts and the like. In addition, since it is particularly excellent in glow wire characteristics, toughness, flame retardancy, and electrical characteristics, which are characteristics required for electrical and electronic parts, it is suitable for connector parts.

本発明のポリアミド樹脂組成物を成形してなる成形品をこれらの部品とすることによって、従来では達成することのできなかった、優れた成形性、外観と、高い難燃性、優れたグローワイヤー性、優れた耐トラッキング性を有する部品が得られるためこれらの用途に好適である。   By using these parts as molded products formed by molding the polyamide resin composition of the present invention, excellent moldability, appearance, high flame retardancy, and excellent glow wire that could not be achieved in the past And parts having excellent tracking resistance can be obtained, which is suitable for these applications.

本発明のポリアミド樹脂組成物を用いた成形品は、液晶テレビ、プラズマディスプレー、PDA、小型テレビ、ラジオ、ノートパソコン、パソコン、プリンター、スキャナー、パソコン周辺機器、ビデオデッキ、DVDデッキ、CDデッキ、MDデッキ、DATデッキ、アンプ、カセットデッキ、ポータブルCDプレーヤー、ポータブルMDプレーヤー、デジタルカメラ、家庭用電話、オフィス用電話、玩具、医療機器、炊飯器部品、電子レンジ部品、音響部品、照明部品、冷蔵庫部品、エアコン部品、ファクシミリ部品、コピー機部品に用いられるコネクターに特に好適である   Molded articles using the polyamide resin composition of the present invention are liquid crystal televisions, plasma displays, PDAs, small televisions, radios, notebook computers, personal computers, printers, scanners, personal computer peripherals, video decks, DVD decks, CD decks, MDs. Deck, DAT deck, amplifier, cassette deck, portable CD player, portable MD player, digital camera, home phone, office phone, toys, medical equipment, rice cooker parts, microwave oven parts, acoustic parts, lighting parts, refrigerator parts Particularly suitable for connectors used in air conditioner parts, facsimile parts, and copier parts

以下、実施例を挙げてさらに本発明を詳細に説明するが、本発明はこれらにより限定されるものではない。実施例および比較例に用いた測定方法を以下に示す。   EXAMPLES Hereinafter, although an Example is given and this invention is demonstrated further in detail, this invention is not limited by these. Measurement methods used in Examples and Comparative Examples are shown below.

(1)靱性
ISO1874−2に従い、実施例および比較例で得られたペレットを、日精樹脂工業(株)製の射出成形機PS60により、シリンダ温度300℃、金型表面温度100℃、スクリュー回転数150rpm、平行部流速200mm/秒、射出/冷却=20/20秒の条件で射出成形し、ISO Type−A規格の試験片を成形し、得られた試験片をアルミの防湿袋に真空密閉した。この試験片を用いて、以下の標準方法に従って測定した。
引張り破断ひずみ:ISO 527−1、−2
なお、3%吸水時の物性は、試験片を60℃温水中に浸漬し、試験片の重量変化により吸水率を求め、その値が3%となった時点で同様に測定した。
(1) Toughness According to ISO1874-2, the pellets obtained in the examples and comparative examples were subjected to a cylinder temperature of 300 ° C., a mold surface temperature of 100 ° C., and a screw rotation speed by an injection molding machine PS60 manufactured by Nissei Plastic Industry Co., Ltd. Injection molding was carried out under the conditions of 150 rpm, parallel part flow rate 200 mm / sec, injection / cooling = 20/20 sec, ISO Type-A standard test specimens were molded, and the obtained test specimens were vacuum-sealed in aluminum moisture-proof bags. . Using this test piece, measurement was performed according to the following standard method.
Tensile breaking strain: ISO 527-1, -2
The physical properties at the time of 3% water absorption were measured in the same manner when the test piece was immersed in warm water at 60 ° C., the water absorption was determined by the weight change of the test piece, and the value reached 3%.

(2)難燃性
実施例および比較例で得られたペレットを用いて、UL94(米国Under Writer Laboratories Incで定められた規格)の方法に従って測定した。
(2) Flame retardancy Using the pellets obtained in the examples and comparative examples, the flame retardancy was measured according to the method of UL94 (standard established by Under Writer Laboratories Inc., USA).

(3)グローワイヤー着火温度(GW−IT)
実施例および比較例で得られたペレットを、日精樹脂工業(株)製の射出成形機NEX1000により、シリンダ温度280℃、金型表面温度80℃、スクリュー回転数150rpm、射出圧力100MPa、射出速度100mm/秒、射出/冷却=20/20秒の条件で射出成形し、80×80×相応厚み(mm)の試験片を成形した。得られた試験片を用いて、IEC60695−2−13に準拠し、80×80×相応厚み(mm)の成形品にて測定した。
(3) Glow wire ignition temperature (GW-IT)
The pellets obtained in the examples and comparative examples were subjected to a cylinder temperature of 280 ° C., a mold surface temperature of 80 ° C., a screw rotation speed of 150 rpm, an injection pressure of 100 MPa, and an injection speed of 100 mm using an injection molding machine NEX1000 manufactured by Nissei Plastic Industry. / Second, injection / cooling = 20/20 seconds, injection molding was performed, and a test piece of 80 × 80 × corresponding thickness (mm) was molded. Using the obtained test piece, it was measured with a molded product of 80 × 80 × corresponding thickness (mm) according to IEC60695-2-13.

(4)耐トラッキング性
実施例および比較例で得られたペレットを、日精樹脂工業(株)製の射出成形機NEX1000により、シリンダ温度280℃、金型表面温度80℃、スクリュー回転数150rpm、射出圧力100MPa、射出速度100mm/秒、射出/冷却=20/20秒の条件で射出成形し、80×80×3mmの試験片を成形した。得られた試験片を用いて、UL746Aに準拠して測定した。
(4) Tracking resistance The pellets obtained in the examples and comparative examples were injected into a cylinder temperature of 280 ° C., a mold surface temperature of 80 ° C., a screw rotation speed of 150 rpm, by an injection molding machine NEX1000 manufactured by Nissei Plastic Industry Co., Ltd. Injection molding was performed under the conditions of a pressure of 100 MPa, an injection speed of 100 mm / sec, and an injection / cooling = 20/20 sec, and 80 × 80 × 3 mm test pieces were molded. It measured based on UL746A using the obtained test piece.

(5)離型性
実施例および比較例で得られたペレットを、射出成形機NEX1000により、シリンダ温度280℃、金型表面温度80℃、スクリュー回転数150rpm、射出圧力100MPa、射出速度100mm/秒、射出/冷却=20/20秒の条件で射出成形し、25×25×25(mm)、肉厚1mmの箱型成形品を成形した。離型時にかかるエジェクタプレートへの負荷をロードセルで測定し、この数値を離型力とした。
(5) Releasability The pellets obtained in the examples and comparative examples were subjected to a cylinder temperature of 280 ° C., a mold surface temperature of 80 ° C., a screw rotation speed of 150 rpm, an injection pressure of 100 MPa, and an injection speed of 100 mm / sec. And injection / cooling = 20/20 seconds were injection-molded to form a box-shaped product having a size of 25 × 25 × 25 (mm) and a thickness of 1 mm. The load applied to the ejector plate at the time of mold release was measured with a load cell, and this value was taken as the mold release force.

参考例1 (A1)共重合ポリアミド樹脂
ε−カプロラクタム95.0重量%とヘキサメチレンジアミンとアジピン酸の塩5.0重量%とを純水に溶解し、水分を1重量%添加したものを重合用の原料とし、得られた原料を重合塔に送った。重合塔上部、中間部、下部に取り付けられたヒーターにより重合塔の温度を加熱調整しながら、原料を反応させた。水浴中に吐出したポリマーをストランドカッターでペレタイズし、得られたペレットを95℃/20h/浴比20倍にて熱水抽出を行い、未反応原料とオリゴマーを除去した。抽出後80℃/30h減圧乾燥し、(A1)共重合ポリアミド樹脂を得た。JIS−K6810に従った98%硫酸での相対粘度:2.75であった。
Reference Example 1 (A1) Copolymerized polyamide resin ε-caprolactam 95.0% by weight, hexamethylenediamine and 5.0% by weight of adipic acid salt were dissolved in pure water, and water added at 1% by weight was polymerized. The raw material thus obtained was sent to a polymerization tower. The raw materials were reacted while adjusting the temperature of the polymerization tower with a heater attached to the upper part, middle part, and lower part of the polymerization tower. The polymer discharged into the water bath was pelletized with a strand cutter, and the obtained pellets were subjected to hot water extraction at 95 ° C./20 h / bath ratio 20 times to remove unreacted raw materials and oligomers. After extraction, it was dried under reduced pressure at 80 ° C./30 h to obtain (A1) a copolymerized polyamide resin. Relative viscosity with 98% sulfuric acid according to JIS-K6810: 2.75.

参考例2 (A2)共重合ポリアミド樹脂
ヘキサメチレンジアミンとアジピン酸の当モル塩97.0重量%、およびε−カプロラクタム3.0重量%を重合缶に投入し、水分量が45重量%となるように水分を加え、重合缶内をNで置換した後、260℃まで昇温した。ついで1.7MPaにて1h制圧・重合後、吐出・カッティングし(A2)共重合ポリアミド樹脂を得た。JIS−K6810に従った98%硫酸での相対粘度:2.60であった。
Reference Example 2 (A2) Copolymerized polyamide resin 97.0% by weight of an equimolar salt of hexamethylenediamine and adipic acid and 3.0% by weight of ε-caprolactam were put into a polymerization can, and the water content became 45% by weight. Thus, water was added and the inside of the polymerization can was replaced with N 2 , and then the temperature was raised to 260 ° C. Subsequently, the pressure was controlled and polymerized at 1.7 MPa for 1 hour, and then discharged and cut to obtain a copolymer polyamide resin (A2). Relative viscosity with 98% sulfuric acid according to JIS-K6810: 2.60.

参考例3 (A3)ポリヘキサメチレンアジパミド樹脂
ポリアミド66(東レ株式会社製“アミラン”(登録商標)CM3001N:96%硫酸法粘度値145ml/g)を使用した。
Reference Example 3 (A3) Polyhexamethylene adipamide resin Polyamide 66 (“Amilan” (registered trademark) CM3001N: 96% sulfuric acid method viscosity value 145 ml / g, manufactured by Toray Industries, Inc.) was used.

参考例4 (B)トリアジン系化合物
イタルマッチ社製:MC25(メラミンシアヌレート)を用いた。なお、JIS K 5600−9−3に準じて平均粒子径(数平均値)を測定したところ、4μmであった。
Reference example 4 (B) Triazine type compound Italmatch company make: MC25 (melamine cyanurate) was used. In addition, it was 4 micrometers when the average particle diameter (number average value) was measured according to JISK5600-9-3.

参考例5 大粒径メラミンシアヌレート
市場より入手したメラミンシアヌレートを目開き15μmのメッシュを用いて振動篩にて篩い分けし、メッシュ上に残ったものを用いた。
Reference Example 5 Melamine cyanurate having a large particle size Melamine cyanurate obtained from the market was sieved with a vibrating sieve using a mesh having an opening of 15 μm, and the one remaining on the mesh was used.

参考例6 (C)ジアミン化合物と脂肪酸化合物との重縮合物
共栄社化学社製:WH215(エチレンジアミンとセバシン酸、ステアリン酸との重縮合物)を用いた。
Reference Example 6 (C) Polycondensate of diamine compound and fatty acid compound Kyoeisha Chemical Co., Ltd. product: WH215 (polycondensate of ethylenediamine, sebacic acid and stearic acid) was used.

[実施例1〜3]
参考例1に示した(A1)共重合ポリアミド樹脂、参考例4に示した(B)トリアジン系化合物を、表1に示す配合量2軸押出機(東芝機械社製:TEM58)を用いてシリンダ設定温度290℃、スクリュー回転数200rpmの条件下でトップフィード(基込めフィード)し、溶融混練し、ストランド状のガットを成形し、冷却バスで冷却後、カッターで造粒しペレットを得た。得られたペレットを用いて、前記の評価方法によって諸特性を調べた。その結果を表1に示す。
[Examples 1 to 3]
Using (A1) copolymerized polyamide resin shown in Reference Example 1 and (B) triazine-based compound shown in Reference Example 4, a cylinder using a compounding amount twin-screw extruder shown in Table 1 (manufactured by Toshiba Machine Co., Ltd .: TEM58) Top feed (base feed) was performed under the conditions of a preset temperature of 290 ° C. and a screw rotation speed of 200 rpm, melt kneading, forming a strand-shaped gut, cooling with a cooling bath, and granulating with a cutter to obtain pellets. Using the obtained pellets, various characteristics were examined by the above evaluation method. The results are shown in Table 1.

[実施例4〜13]
参考例1に示した(A1)共重合ポリアミド樹脂、参考例2に示した(A2)共重合ポリアミド樹脂、参考例4に示した(B)トリアジン系化合物を表1〜2に示す配合量で、実施例1と同様にしてペレットを得て諸特性を調べた。その結果を表1〜2に示す。
[Examples 4 to 13]
(A1) copolymerized polyamide resin shown in Reference Example 1, (A2) copolymerized polyamide resin shown in Reference Example 2, and (B) triazine-based compound shown in Reference Example 4 in the blending amounts shown in Tables 1-2. In the same manner as in Example 1, pellets were obtained and examined for various characteristics. The results are shown in Tables 1-2.

[実施例14]
参考例4に示した(B)トリアジン系化合物を参考例5に示した大粒径メラミンシアヌレートに変更した以外は実施例2と同様にしてペレットを得て諸特性を調べた。その結果を表2に示す。
[Example 14]
Pellets were obtained in the same manner as in Example 2 except that the (B) triazine compound shown in Reference Example 4 was changed to the large particle size melamine cyanurate shown in Reference Example 5, and various properties were examined. The results are shown in Table 2.

[実施例15]
参考例1に示した(A1)共重合ポリアミド樹脂、参考例3に示した(A3)ポリヘキサメチレンアジパミド樹脂、参考例4に示した(B)トリアジン系化合物を表2に示す配合量で、実施例1と同様にしてペレットを得て諸特性を調べた。その結果を表2に示す。
[Example 15]
(A1) Copolymerized polyamide resin shown in Reference Example 1, (A3) Polyhexamethylene adipamide resin shown in Reference Example 3, and (B) Triazine compound shown in Reference Example 4 are shown in Table 2. Then, pellets were obtained in the same manner as in Example 1 and various characteristics were examined. The results are shown in Table 2.

[実施例16〜17]
参考例1に示した(A1)共重合ポリアミド樹脂、参考例2に示した(A2)共重合ポリアミド樹脂、参考例4に示した(B)トリアジン系化合物、参考例6に示した(C)ジアミン化合物と脂肪酸化合物との重縮合物を表2に示す配合量で、実施例1と同様にしてペレットを得て諸特性を調べた。その結果を表2に示す。
[Examples 16 to 17]
(A1) copolymerized polyamide resin shown in Reference Example 1, (A2) copolymerized polyamide resin shown in Reference Example 2, (B) triazine compound shown in Reference Example 4, (C) shown in Reference Example 6 The polycondensate of a diamine compound and a fatty acid compound was blended in the amounts shown in Table 2, and pellets were obtained in the same manner as in Example 1 to examine various properties. The results are shown in Table 2.

[実施例18]
参考例1に示した(A1)共重合ポリアミド樹脂、参考例3に示した(A3)ポリヘキサメチレンアジパミド樹脂、参考例4に示した(B)トリアジン系化合物、参考例6に示した(C)ジアミン化合物と脂肪酸化合物との重縮合物を表2に示す配合量で、実施例1と同様にしてペレットを得て諸特性を調べた。その結果を表2に示す。
[Example 18]
(A1) Copolyamide resin shown in Reference Example 1, (A3) Polyhexamethylene adipamide resin shown in Reference Example 3, (B) Triazine compound shown in Reference Example 4, shown in Reference Example 6 (C) The polycondensate of a diamine compound and a fatty acid compound was blended in the amounts shown in Table 2, and pellets were obtained in the same manner as in Example 1 to examine various properties. The results are shown in Table 2.

[比較例1〜2]
参考例1に示した(A1)共重合ポリアミド樹脂、参考例4に示した(B)トリアジン系化合物を表3に示す配合量で、実施例1と同様にしてペレットを得て諸特性を調べた。その結果を表3に示す。
[Comparative Examples 1-2]
(A1) Copolymer polyamide resin shown in Reference Example 1 and (B) Triazine compound shown in Reference Example 4 were blended in the amounts shown in Table 3, and pellets were obtained in the same manner as in Example 1 to examine various properties. It was. The results are shown in Table 3.

[比較例3〜4]
参考例2に示した(A2)共重合ポリアミド樹脂、参考例4に示した(B)トリアジン系化合物を表3に示す配合量で、実施例1と同様にしてペレットを得て諸特性を調べた。その結果を表3に示す。
[Comparative Examples 3 to 4]
(A2) Copolyamide resin shown in Reference Example 2 and (B) Triazine compound shown in Reference Example 4 were blended in the amounts shown in Table 3, and pellets were obtained in the same manner as in Example 1 to examine various properties. It was. The results are shown in Table 3.

[比較例5]
参考例1に示した(A1)共重合ポリアミド樹脂、参考例3に示した(A3)ポリヘキサメチレンアジパミド樹脂、参考例4に示した(B)トリアジン系化合物を表3に示す配合量で、実施例1と同様にしてペレットを得て諸特性を調べた。その結果を表3に示す。
[Comparative Example 5]
(A1) Copolymerized polyamide resin shown in Reference Example 1, (A3) Polyhexamethylene adipamide resin shown in Reference Example 3, and (B) Triazine compound shown in Reference Example 4 are shown in Table 3. Then, pellets were obtained in the same manner as in Example 1 and various characteristics were examined. The results are shown in Table 3.

[比較例6]
参考例3に示した(A3)ヘキサメチレンアジパミド樹脂、参考例4に示した(B)トリアジン系化合物を表3に示す配合量で、実施例1と同様にしてペレットを得て諸特性を調べた。その結果を表3に示す。
[Comparative Example 6]
(A3) hexamethylene adipamide resin shown in Reference Example 3 and (B) triazine-based compound shown in Reference Example 4 were blended in the amounts shown in Table 3 to obtain pellets in the same manner as in Example 1 and various properties. I investigated. The results are shown in Table 3.

Figure 2012067273
Figure 2012067273

Figure 2012067273
Figure 2012067273

Figure 2012067273
Figure 2012067273

Claims (11)

(A1)(a1)カプロアミド単位50重量%以上98重量%未満および(a2)ヘキサメチレンアジパミド単位2重量%以上50重量%未満の共重合ポリアミドを含む(A)ポリアミド樹脂100重量部に対して、(B)トリアジン系化合物を10〜30重量部配合してなることを特徴とするポリアミド樹脂組成物。 (A1) containing (a1) 50% by weight to caproamide unit of 50% by weight or more and less than 98% by weight and (a2) a copolymer polyamide containing 2% by weight or more and less than 50% by weight of hexamethylene adipamide unit (A) to 100 parts by weight of polyamide resin (B) A polyamide resin composition comprising 10 to 30 parts by weight of a triazine compound. (A)ポリアミド樹脂が、さらに(A2)(a1)カプロアミド単位2重量%以上50重量%未満および(a2)ヘキサメチレンアジパミド単位50重量%以上98重量%未満の共重合ポリアミドを含むことを特徴とする請求項1記載のポリアミド樹脂組成物。 (A) The polyamide resin further comprises (A2) (a1) a copolymer polyamide of 2 to 50% by weight of caproamide units and (a2) 50 to 98% by weight of hexamethylene adipamide units. The polyamide resin composition according to claim 1, wherein 前記(A1)と(A2)の比が、(A1)/(A2)=15/85〜85/15である請求項2記載のポリアミド樹脂組成物。 The polyamide resin composition according to claim 2, wherein the ratio of (A1) to (A2) is (A1) / (A2) = 15/85 to 85/15. (A)ポリアミド樹脂が、さらに(A3)ポリヘキサメチレンアジパミド樹脂を含むことを特徴とする請求項1〜3のいずれか記載のポリアミド樹脂組成物。 The polyamide resin composition according to any one of claims 1 to 3, wherein the (A) polyamide resin further comprises (A3) a polyhexamethylene adipamide resin. 前記(A1)と(A3)の重量比が、(A1)/(A3)=10/90〜90/10である請求項4記載のポリアミド樹脂組成物。 The polyamide resin composition according to claim 4, wherein a weight ratio of (A1) to (A3) is (A1) / (A3) = 10/90 to 90/10. トリアジン系化合物がメラミンシアヌレートであることを特徴とする請求項1〜5のいずれか記載のポリアミド樹脂組成物。 The polyamide resin composition according to claim 1, wherein the triazine compound is melamine cyanurate. メラミンシアヌレートの平均粒子径が15μm以下であることを特徴とする請求項6記載のポリアミド樹脂組成物。 The polyamide resin composition according to claim 6, wherein the average particle size of melamine cyanurate is 15 µm or less. (A)ポリアミド樹脂100重量部に対して、(C)ジアミン化合物と脂肪酸化合物との重縮合物を0.1〜1.0重量部配合してなることを特徴とする請求項1〜7のいずれか記載のポリアミド樹脂組成物。 (A) The polycondensate of (C) a diamine compound and a fatty acid compound is blended in an amount of 0.1 to 1.0 part by weight with respect to 100 parts by weight of the polyamide resin. Any one of the polyamide resin compositions. 請求項1〜8いずれか記載のポリアミド樹脂組成物を、射出成形、押出成形、ブロー成形から選ばれる少なくとも1種の方法で成形してなる成形品。 A molded article formed by molding the polyamide resin composition according to any one of claims 1 to 8 by at least one method selected from injection molding, extrusion molding, and blow molding. 成形品が、筐体、外装部品またはコネクターであることを特徴とする請求項9記載の成形品。 The molded article according to claim 9, wherein the molded article is a casing, an exterior part, or a connector. IEC60695−2−13に準拠した試験において、グローワイヤー着火温度が、製品厚み0.75mm、1.5mm、3mmのすべてにおいて775℃以上である請求項9または10記載の成形品。 The molded article according to claim 9 or 10, wherein, in a test based on IEC60695-2-13, the glow wire ignition temperature is 775 ° C or higher in all of the product thicknesses of 0.75 mm, 1.5 mm, and 3 mm.
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