JP2012060168A - Substrate processing device, maintenance method for substrate processing device, control method for substrate processing device, protection method for substrate processing device, and manufacturing method for semiconductor device, and device state transition method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate processing device of which maintenance operation can be done safely by a maintenance man even when the substrate processing device is turned on.SOLUTION: A substrate processing device comprises: a transition instruction part for causing a device state to transition from a waiting state where it is possible to enter the substrate processing device and it is possible to receive execution instructions of a recipe to an execution ready state where it is impossible to enter the substrate processing device and it is possible to execute the recipe; an event detection part for detecting generation of a specific event in which the transition from the waiting state to the execution ready state is forbidden and for notifying the transition instruction part of the generation; and a control part for forbidding the transition from the waiting state to the execution ready state when the generation of the specific event is detected to have been generated.

Description

  The present invention relates to a substrate processing apparatus for processing a substrate, a control method for a substrate processing apparatus, a semiconductor device manufacturing method, and an apparatus state transition method.

  2. Description of the Related Art Conventionally, a substrate processing step for processing a substrate based on a recipe in which processing conditions and processing procedures are defined has been performed as a step of manufacturing a device such as a DRAM or an IC. The operation of each part of the substrate processing apparatus that performs this process is controlled by the control part.

  Maintenance (maintenance work) of the substrate processing apparatus is performed by maintenance personnel entering the substrate processing apparatus in order to perform component replacement, repair, operation check of each part, and readjustment of each part. At that time, in order to shorten the time spent for the maintenance work, the maintenance work may be performed while the substrate processing apparatus is turned on.

  However, since the maintenance work is performed with the substrate processing apparatus turned on, the state transition condition is satisfied at a place not intended by the maintenance staff during the maintenance, and the state is automatically changed to an executable state. There was a risk of being executed.

  The present invention relates to a substrate processing apparatus, a method for controlling a substrate processing apparatus, a method for manufacturing a semiconductor device, and an apparatus state in which maintenance personnel can safely perform maintenance work even if maintenance is performed with the substrate processing apparatus turned on. The purpose is to provide a transition method.

  According to one aspect of the present invention, an apparatus state in which entry into the substrate processing apparatus is possible, and an apparatus state in which entry into the substrate processing apparatus is impossible from a standby state in which a recipe execution instruction can be accepted. A transition instruction unit that transitions the apparatus state to an executable state where the recipe can be executed, and the transition instruction unit that detects the occurrence of a predetermined event that prohibits the transition from the standby state to the executable state And a substrate processing apparatus having a control unit that prohibits transition from the standby state to the executable state when the occurrence of the predetermined event is detected.

  According to another aspect of the present invention, an apparatus can enter the substrate processing apparatus from an initial state immediately after the substrate processing apparatus is turned on, and can accept a predetermined recipe execution instruction. A process of transitioning the apparatus state to a standby state, and the apparatus state from the standby state to an executable state in which the predetermined recipe can be executed in an apparatus state incapable of entering the substrate processing apparatus And a step of transitioning the apparatus state from the executable state to a running state in which a predetermined process is executed in accordance with the processing conditions and processing procedures defined in the predetermined recipe. A control method for a processing apparatus, wherein a predetermined event that prohibits transition from the standby state to the executable state occurs in the standby state, and the executable state from the standby state Transition is prohibited in the control method of a substrate processing apparatus that does not perform the predetermined recipe is provided.

According to still another aspect of the present invention, the apparatus is in an apparatus state in which entry into the substrate processing apparatus is possible from an initial state immediately after the substrate processing apparatus is turned on, and an instruction to execute a predetermined recipe is received. A process of transitioning the apparatus state to a possible standby state, and the apparatus from the standby state to an executable state in which the predetermined recipe can be executed in an apparatus state incapable of entering the substrate processing apparatus A state transition step, and a step of transitioning the apparatus state from the executable state to a running state in which a predetermined process is executed in accordance with the processing condition and processing procedure defined in the predetermined recipe. In the in-execution state, the semiconductor device manufacturing method executes the predetermined recipe to execute a predetermined process on the substrate, and is executable from the standby state in the standby state. When a predetermined event for prohibiting a transition to state occurs, the manufacturing method of the from the standby state by prohibiting the transition of the to the executable state not executing the predetermined recipe semiconductor device is provided.

  According to still another aspect of the present invention, the apparatus is in an apparatus state in which the apparatus can enter the apparatus from the initial state immediately after the apparatus is turned on, and can receive a predetermined recipe execution instruction. The device state is changed, the device state is changed from the standby state to a device state incapable of entering the device and the predetermined recipe can be executed, and the execution is possible. When the apparatus state is transitioned from the state to an executing state in which a predetermined process is executed in accordance with the processing conditions and processing procedures defined in the predetermined recipe, and when the predetermined recipe is completed, A device state transition method for transitioning a device state to a standby state, wherein when a predetermined event that prohibits transition from the standby state to the executable state occurs, the execution is possible from the standby state. Device state transition process to prohibit the transition to state is provided.

  According to the substrate processing apparatus of the present invention, even when a maintenance operation is performed while the substrate processing apparatus is turned on, a predetermined recipe is not automatically executed, thereby improving safety during the maintenance operation. To do.

1 is a schematic configuration diagram of a substrate processing system according to an embodiment of the present invention. It is a perspective view of the substrate processing apparatus which concerns on one Embodiment of this invention. It is side surface perspective drawing of the substrate processing apparatus which concerns on one Embodiment of this invention. It is a longitudinal cross-sectional view of the processing furnace of the substrate processing apparatus which concerns on one Embodiment of this invention. It is a block block diagram of the substrate processing controller with which the substrate processing apparatus which concerns on one Embodiment of this invention is provided, and its periphery. It is a figure which illustrates the definition of the communication state of the substrate processing apparatus which concerns on one Embodiment of this invention, a group management apparatus, the state of a substrate processing apparatus, and the communication state of a substrate processing controller and a substrate conveyance system. It is a figure explaining the state transition of the substrate processing apparatus which concerns on one Embodiment of this invention. It is a flowchart which illustrates the board | substrate process and purge cleaning process which concern on one Embodiment of this invention.

<One Embodiment of the Present Invention>
Hereinafter, an embodiment of the present invention will be described.

(1) Configuration of Substrate Processing System First, the configuration of a substrate processing system according to an embodiment of the present invention will be described with reference to FIG. FIG. 1 is a schematic configuration diagram of a substrate processing system according to an embodiment of the present invention.

As shown in FIG. 1, the substrate processing system according to the present embodiment includes at least one substrate processing apparatus 100, and a host computer 600 and a group management apparatus 500 connected to the substrate processing apparatus 100 so as to exchange data. And. The substrate processing apparatus 100 is configured to execute a processing process based on a recipe in which processing procedures and processing conditions are defined. The substrate processing apparatus 100 and the group management apparatus 500 and / or the host computer 600 are connected by a network 400 such as a local line (LAN) or a wide area line (WAN).

(2) Configuration of Substrate Processing Apparatus Next, the configuration of the substrate processing apparatus 100 according to the present embodiment will be described with reference to FIGS. FIG. 2 is a perspective view of the substrate processing apparatus according to one embodiment of the present invention. FIG. 3 is a side perspective view of the substrate processing apparatus according to the embodiment of the present invention. The substrate processing apparatus 100 according to the present embodiment is configured as a vertical apparatus that performs oxidation, diffusion processing, CVD processing, and the like on a substrate such as a wafer according to a predetermined recipe.

  As shown in FIGS. 2 and 3, the substrate processing apparatus 100 according to the present embodiment includes a housing 111 configured as a pressure vessel. A front maintenance port 103 serving as an opening provided for maintenance is provided in the front front portion of the front wall 111a of the casing 111. The front maintenance port 103 is provided with a pair of front maintenance doors 104 as an access mechanism for opening and closing the front maintenance port 103. A pod (substrate container) 110 containing a wafer (substrate) 200 such as silicon is used as a carrier for transporting the wafer 200 into and out of the housing 111.

  A pod loading / unloading port (substrate container loading / unloading port) 112 is opened on the front wall 111 a of the housing 111 so as to communicate between the inside and the outside of the housing 111. The pod loading / unloading port 112 is opened and closed by a front shutter (substrate container loading / unloading port opening / closing mechanism) 113. On the front front side of the pod loading / unloading port 112, a load port (substrate container delivery table) 114 is installed as a mounting portion. On the load port 114, the pod 110 is placed and aligned. The pod 110 is configured to be transferred onto the load port 114 by an in-process transfer device (not shown) such as OHT (Overhead Hoist Transport).

  A rotary pod shelf (substrate container mounting shelf) 105 is installed at an upper portion of the housing 111 at a substantially central portion in the front-rear direction. A plurality of pods 110 are stored on the rotary pod shelf 105. The rotary pod shelf 105 includes a support column 116 that is erected vertically and is intermittently rotated in a horizontal plane, and a plurality of shelf plates (substrate containers) that are radially supported by the support column 116 at the upper, middle, and lower positions. Mounting stage) 117. The plurality of shelf plates 117 are configured to hold a plurality of pods 110 in a state where they are mounted.

  A pod transfer device (substrate container transfer device) 118 is installed between the load port 114 and the rotary pod shelf 105 in the housing 111. The pod transfer device 118 includes a pod elevator (substrate container lifting mechanism) 118a that can be moved up and down while holding the pod 110, and a pod transfer mechanism (substrate container transfer mechanism) 118b as a transfer mechanism. The pod transfer device 118 moves the pod 110 between the load port 114, the rotary pod shelf 105, and the pod opener (substrate container lid opening / closing mechanism) 121 by the continuous operation of the pod elevator 118a and the pod transfer mechanism 118b. It is comprised so that it may convey mutually.

A sub-housing 119 is provided in the lower part of the housing 111 from the substantially central portion in the front-rear direction to the rear end in the housing 111. A pair of wafer loading / unloading ports (substrate loading / unloading ports) 120 that transfer the wafer 200 into and out of the sub-casing 119 are provided on the front wall 119a of the sub-casing 119 so as to be arranged vertically in two stages. Yes. Pod openers 121 are respectively installed at the upper and lower wafer loading / unloading ports 120.

  Each pod opener 121 includes a pair of mounting bases 122 on which the pod 110 is mounted, and a cap attaching / detaching mechanism (lid attaching / detaching mechanism) 123 that attaches / detaches a cap (cover) of the pod 110. The pod opener 121 is configured to open and close the wafer loading / unloading port of the pod 110 by attaching / detaching the cap of the pod 110 placed on the placing table 122 by the cap attaching / detaching mechanism 123.

  In the sub casing 119, a transfer chamber 124 that is fluidly isolated from a space in which the pod transfer device 118, the rotary pod shelf 105, and the like are installed is configured. A wafer transfer mechanism (substrate transfer mechanism) 125 is installed in the front region of the transfer chamber 124. The wafer transfer mechanism 125 includes a wafer transfer device (substrate transfer device) 125a that can rotate or linearly move the wafer 200 in the horizontal direction, and a wafer transfer device elevator (substrate transfer device) that moves the wafer transfer device 125a up and down. (Elevating mechanism) 125b. As shown in FIG. 2, the wafer transfer device elevator 125 b is installed between the right end of the front area of the transfer chamber 124 of the sub-housing 119 and the right end of the housing 111. The wafer transfer device 125 a includes a tweezer (substrate holding body) 125 c as a mounting portion for the wafer 200. The wafer 200 can be loaded (charged) and unloaded (discharged) with respect to the boat (substrate holder) 217 by the continuous operation of the wafer transfer device elevator 125b and the wafer transfer device 125a. ing.

  In the rear region of the transfer chamber 124, a standby unit 126 that houses and waits for the boat 217 is configured. A processing furnace 202 is provided above the standby unit 126. The lower end portion of the processing furnace 202 is configured to be opened and closed by a furnace port shutter (furnace port opening / closing mechanism) 147.

  As shown in FIG. 2, a boat elevator (substrate holder lifting mechanism) 115 that lifts and lowers the boat 217 is installed between the right end of the standby section 126 and the right end of the casing 111 of the sub casing 119. . An arm 128 as a connecting tool is connected to the elevator platform of the boat elevator 115. A seal cap 219 serving as a lid is horizontally installed on the arm 128. The seal cap 219 is configured to support the boat 217 vertically and to close the lower end portion of the processing furnace 202.

  This embodiment is mainly composed of a rotary pod shelf 105, a boat elevator 115, a pod transfer device (substrate container transfer device) 118, a wafer transfer mechanism (substrate transfer mechanism) 125, a boat 217, and a rotation mechanism 254 described later. The substrate transfer system according to the above is configured. The rotary pod shelf 105, the boat elevator 115, the pod transfer device (substrate container transfer device) 118, the wafer transfer mechanism (substrate transfer mechanism) 125, the boat 217, and the rotation mechanism 254 are transferred as a sub-controller described later. The controller 11 is electrically connected.

  The boat 217 includes a plurality of holding members. The boat 217 is configured to hold a plurality of wafers 200 (for example, about 50 to 125 wafers) horizontally in a state where the centers are aligned in the vertical direction.

  As shown in FIG. 2, a clean unit 134 is installed at the left end of the transfer chamber 124 opposite to the wafer transfer device elevator 125b side and the boat elevator 115 side. The clean unit 134 includes a supply fan and a dustproof filter so as to supply a clean atmosphere or clean air 133 that is an inert gas. Between the wafer transfer device 125a and the clean unit 134, a notch alignment device (not shown) is installed as a substrate alignment device for aligning the circumferential position of the wafer.

  The clean air 133 blown out from the clean unit 134 flows around the boat 217 in the notch alignment device, wafer transfer device 125a, and standby unit 126 (not shown), and is then sucked in by a duct (not shown) to the outside of the casing 111. Or is circulated to the primary side (supply side) that is the suction side of the clean unit 134 and is blown out again into the transfer chamber 124 by the clean unit 134.

  A plurality of device covers (not shown) are attached to the outer periphery of the housing 111 and the sub-housing 119 as a mechanism for entering the substrate processing apparatus 100. These apparatus covers are removed during maintenance work, and maintenance personnel can enter the substrate processing apparatus 100. A door switch 130 is provided as an entrance sensor at the ends of the casing 111 and the sub casing 119 facing the device cover. Also, a door switch 130 is provided as an entrance sensor at the end of the casing 111 facing the front maintenance door 104. A substrate detection sensor 140 that detects the placement of the pod 110 is provided on the load port 114. The switches and sensors such as the door switch 130 and the substrate detection sensor 140 are electrically connected to a substrate processing apparatus controller 240 described later via an input / output controller 15 described later.

(3) Operation of Substrate Processing Apparatus Next, the operation of the substrate processing apparatus 100 according to the present embodiment will be described with reference to FIGS.

  As shown in FIGS. 2 and 3, when the pod 110 is supplied to the load port 114 by an in-process transfer device (not shown), the pod 110 is detected by the substrate detection sensor 140, and the pod loading / unloading port 112 is at the front. It is opened by the shutter 113. Then, the pod 110 on the load port 114 is carried into the housing 111 from the pod carry-in / out port 112 by the pod carrying device 118.

  The pod 110 carried into the housing 111 is automatically transferred onto the shelf plate 117 of the rotary pod shelf 105 by the pod transfer device 118 and temporarily stored. Thereafter, the pod 110 is transferred from the shelf 117 onto the mounting table 122 of one pod opener 121. Note that the pod 110 carried into the housing 111 may be directly transferred onto the mounting table 122 of the pod opener 121 by the pod transfer device 118. At this time, the wafer loading / unloading port 120 of the pod opener 121 is closed by the cap attaching / detaching mechanism 123, and clean air 133 is circulated and filled in the transfer chamber 124. For example, when the transfer chamber 124 is filled with nitrogen gas as clean air 133, the oxygen concentration in the transfer chamber 124 becomes, for example, 20 ppm or less, which is much lower than the oxygen concentration in the casing 111 that is an atmospheric atmosphere. It is set to be.

  The pod 110 mounted on the mounting table 122 is pressed against the opening edge of the wafer loading / unloading port 120 in the front wall 119a of the sub-housing 119, and the cap is removed by the cap attaching / detaching mechanism 123. Then, the wafer loading / unloading port is opened. Thereafter, the wafer 200 is picked up from the pod 110 through the wafer loading / unloading port by the tweezer 125c of the wafer transfer device 125a, aligned in the notch alignment device, and then in the standby unit 126 at the rear of the transfer chamber 124. Are loaded into the boat 217 (charging). The wafer transfer device 125 a loaded with the wafer 200 in the boat 217 returns to the pod 110 and loads the next wafer 200 into the boat 217.

During the loading operation of the wafer 200 to the boat 217 by the wafer transfer mechanism 125 in the one (upper or lower) pod opener 121, the other (lower or upper) pod opener 121 is placed on the mounting table 122. The pod 110 is transferred from the rotary pod shelf 105 by the pod transfer device 118 and transferred, and the opening operation of the pod 110 by the pod opener 121 is simultaneously performed.

  When a predetermined number of wafers 200 are loaded into the boat 217, the lower end portion of the processing furnace 202 closed by the furnace port shutter 147 is opened by the furnace port shutter 147. Subsequently, the boat 217 holding the wafer 200 group is loaded into the processing furnace 202 when the seal cap 219 is lifted by the boat elevator 115.

  After loading, arbitrary processing is performed on the wafer 200 in the processing furnace 202. After the processing, the boat 217 storing the processed wafers 200 is unloaded from the processing chamber 201 in a procedure almost opposite to the above procedure except for the wafer alignment process in the notch aligner 135, and the processed wafers are processed. The pod 110 storing 200 is carried out of the casing 111.

(4) Configuration of Processing Furnace Next, the configuration of the processing furnace 202 according to the present embodiment will be described with reference to FIG. FIG. 4 is a longitudinal sectional view of the processing furnace 202 of the substrate processing apparatus 100 according to one embodiment of the present invention.

As shown in FIG. 4, the processing furnace 202 includes a process tube 203 as a reaction tube. The process tube 203 includes an inner tube 204 as an internal reaction tube and an outer tube 205 as an external reaction tube provided on the outside thereof. The inner tube 204 is made of a heat resistant material such as quartz (SiO ₂ ) or silicon carbide (SiC). The inner tube 204 is formed in a cylindrical shape with an upper end and a lower end opened. A processing chamber 201 for processing a wafer 200 as a substrate is formed in a hollow cylindrical portion in the inner tube 204. The processing chamber 201 is configured to accommodate a boat 217 described later. The outer tube 205 is provided concentrically with the inner tube 204. The outer tube 205 has an inner diameter larger than the outer diameter of the inner tube 204, is formed in a cylindrical shape with the upper end closed and the lower end opened. The outer tube 205 is made of a heat resistant material such as quartz or silicon carbide.

  A heater 206 as a heating mechanism is provided outside the process tube 203 so as to surround the side wall surface of the process tube 203. The heater 206 has a cylindrical shape. The heater 206 is vertically installed by being supported by a heater base 251 as a holding plate.

  A manifold 209 is disposed below the outer tube 205 so as to be concentric with the outer tube 205. The manifold 209 is made of, for example, stainless steel. The manifold 209 is formed in a cylindrical shape with an upper end and a lower end opened. The manifold 209 is engaged with the lower end portion of the inner tube 204 and the lower end portion of the outer tube 205, respectively. The manifold 209 is provided to support the lower end portion of the inner tube 204 and the lower end portion of the outer tube 205. An O-ring 220a as a seal member is provided between the manifold 209 and the outer tube 205. By supporting the manifold 209 on the heater base 251, the process tube 203 is installed vertically. A reaction vessel is formed by the process tube 203 and the manifold 209.

A processing gas nozzle 230 a and a purge gas nozzle 230 b as gas introduction portions are connected to a seal cap 219 described later so as to communicate with the inside of the processing chamber 201. A processing gas supply pipe 232a is connected to the processing gas nozzle 230a. A processing gas supply source (not shown) or the like is connected to the upstream side of the processing gas supply pipe 232 (the side opposite to the connection side with the processing gas nozzle 230a) via an MFC (mass flow controller) 241a as a gas flow rate controller. Yes. A purge gas supply pipe 232b is connected to the purge gas nozzle 230b. A purge gas supply source (not shown) or the like is connected to the upstream side of the purge gas supply pipe 232b (on the opposite side to the connection side with the purge gas nozzle 230b) via an MFC (mass flow controller) 241b as a gas flow rate controller.

  A processing gas supply system according to this embodiment is mainly configured by a processing gas supply source (not shown), the MFC 241a, the processing gas supply pipe 232a, and the processing gas nozzle 230a. A purge gas supply system according to this embodiment is mainly configured by a purge gas supply source (not shown), the MFC 241b, the purge gas supply pipe 232b, and the purge gas nozzle 230b. The gas supply system according to this embodiment is mainly constituted by the processing gas supply system and the purge gas supply system. A gas supply controller 14 as a sub-controller described later is electrically connected to the MFCs 241a and 241b.

  The manifold 209 is provided with an exhaust pipe 231 that exhausts the atmosphere in the processing chamber 201. The exhaust pipe 231 is disposed at the lower end portion of the cylindrical space 250 formed by the gap between the inner tube 204 and the outer tube 205. The exhaust pipe 231 communicates with the cylindrical space 250. On the downstream side of the exhaust pipe 231 (on the side opposite to the connection side with the manifold 209), a pressure sensor 245 as a pressure detector, for example, a pressure regulator 242 configured as an APC (Auto Pressure Controller), a vacuum such as a vacuum pump, etc. The exhaust device 246 is connected in order from the upstream side. The gas exhaust mechanism according to the present embodiment is mainly configured by the exhaust pipe 231, the pressure sensor 245, the pressure adjusting device 242, and the vacuum exhaust device 246. A pressure controller 13 as a sub-controller described later is electrically connected to the pressure adjusting device 242 and the pressure sensor 245.

  Below the manifold 209, a seal cap 219 is provided as a furnace port lid that can airtightly close the lower end opening of the manifold 209. The seal cap 219 is brought into contact with the lower end of the manifold 209 from the lower side in the vertical direction. The seal cap 219 is made of a metal such as stainless steel. The seal cap 219 is formed in a disc shape. On the upper surface of the seal cap 219, an O-ring 220b is provided as a seal member that comes into contact with the lower end of the manifold 209.

  A rotation mechanism 254 for rotating the boat is installed near the center of the seal cap 219 and on the side opposite to the processing chamber 201. The rotation shaft 255 of the rotation mechanism 254 passes through the seal cap 219 and supports the boat 217 from below. The rotation mechanism 254 is configured to be able to rotate the wafer 200 by rotating the boat 217.

  The seal cap 219 is configured to be lifted and lowered in the vertical direction by a boat elevator 115 as a substrate holder lifting mechanism vertically installed outside the process tube 203. By moving the seal cap 219 up and down, the boat 217 can be transferred into and out of the processing chamber 201. A conveyance controller 11 as a sub-controller described later is electrically connected to the rotation mechanism 254 and the boat elevator 115.

As described above, the boat 217 as a substrate holder is configured to hold a plurality of wafers 200 in a multi-stage by aligning the wafers 200 in a horizontal posture and in a state where their centers are aligned with each other. The boat 217 is made of a heat resistant material such as quartz or silicon carbide. Boat 21
7, a plurality of heat insulating plates 216 as heat insulating members are arranged in a horizontal posture in multiple stages. The heat insulating plate 216 is formed in a disc shape. The heat insulating plate 216 is made of a heat resistant material such as quartz or silicon carbide. The heat insulating plate 216 is configured to make it difficult to transfer heat from the heater 206 to the manifold 209 side.

  A temperature sensor 263 as a temperature detector is installed in the process tube 203. The heater 206 and the temperature sensor 263 mainly constitute the heating mechanism according to this embodiment. A temperature controller 12 as a sub-controller described later is electrically connected to the heater 206 and the temperature sensor 263.

  The substrate processing system according to this embodiment is mainly configured by the processing furnace 202, a heating mechanism, a gas supply system, a gas exhaust mechanism, a seal cap 219, a rotating mechanism 219, a boat elevator 115, a boat 217, various sub-controllers, and sensors. Has been.

(5) Operation of Processing Furnace Subsequently, as one step of the semiconductor device manufacturing process, a method of forming a thin film on the wafer 200 by the CVD method using the processing furnace 202 according to the above configuration will be described with reference to FIG. explain. In the following description, the operation of each part constituting the substrate processing apparatus 100 is controlled by the substrate processing apparatus controller 240. In this case, the substrate processing apparatus controller 240 selects and executes an optimum substrate processing recipe (process recipe) as a recipe for forming a thin film on the wafer 200.

  When a plurality of wafers 200 are loaded into the boat 217 (wafer charge), as shown in FIG. 4, the boat 217 holding the plurality of wafers 200 is lifted by the boat elevator 115 and loaded into the processing chamber 201. (Boat loading). In this state, the seal cap 219 seals the lower end of the manifold 209 via the O-ring 220b.

  The processing chamber 201 is evacuated by the evacuation device 246 so that a desired pressure (degree of vacuum) is obtained. At this time, based on the pressure value measured by the pressure sensor 245, the opening degree of the valve of the pressure adjusting device 242 is feedback-controlled. In addition, the heater 206 is heated so that the inside of the processing chamber 201 has a desired temperature. At this time, the energization amount to the heater 206 is feedback controlled based on the temperature value detected by the temperature sensor 263. Subsequently, the boat 217 and the wafers 200 are rotated by the rotation mechanism 254.

  Next, the processing gas supplied from the processing gas supply source and controlled to have a desired flow rate by the MFC 241a flows through the gas supply pipe 232a and is introduced into the processing chamber 201 from the nozzle 230a. The introduced processing gas rises in the processing chamber 201, flows out from the upper end opening of the inner tube 204 into the cylindrical space 250, and is exhausted from the exhaust pipe 231. The gas comes into contact with the surface of the wafer 200 when passing through the processing chamber 201, and at this time, a thin film is deposited on the surface of the wafer 200 by a thermal CVD reaction.

  When a preset processing time has elapsed, purge gas supplied from a purge gas supply source and controlled to have a desired flow rate by the MFC 241b is supplied into the processing chamber 201, and the processing chamber 201 is replaced with an inert gas. At the same time, the pressure in the processing chamber 201 is returned to normal pressure.

Thereafter, the seal cap 219 is lowered by the boat elevator 115 to open the lower end of the manifold 209, and the boat 217 holding the processed wafer 200 is carried out from the lower end of the manifold 209 to the outside of the process tube 203 (boat unloading). Loading). Thereafter, the processed wafer 200 is taken out from the boat 217 and stored in the pod 110 (wafer discharge).

  As described above, a substrate processing recipe (process recipe) for processing a substrate on the wafer 200 or the like includes at least a loading (boat loading) step, a step of processing a substrate according to processing conditions and processing steps, and an unloading (boat). Loading) process. Furthermore, as in this embodiment, it may be defined to execute wafer charge or wafer discharge.

(6) Configuration of Controller for Substrate Processing Apparatus Subsequently, the controller for substrate processing apparatus 240 that controls the operation of each part constituting the processing furnace 202 and its peripheral block configuration will be described with reference to FIGS. .

  FIG. 5 is a block diagram of a substrate processing controller and its surroundings provided in the substrate processing apparatus according to an embodiment of the present invention. FIG. 6 is a diagram illustrating definitions of the communication state between the substrate processing apparatus and the group management apparatus, the state of the substrate processing apparatus, and the communication state between the substrate processing controller and the substrate transport system according to an embodiment of the present invention. . FIG. 7 is a diagram illustrating state transition of the substrate processing apparatus 100 according to an embodiment of the present invention. FIG. 8 is a flowchart illustrating substrate processing and purge cleaning processing according to an embodiment of the invention.

(Controller for substrate processing equipment)
The substrate processing apparatus controller 240 includes a CPU (central processing unit) 1a as a main control unit, a memory (RAM) 1b as a temporary storage unit, a hard disk (HDD) 1c as a fixed storage unit (storage unit), and a communication control unit. As a computer having a transmission / reception module 1d and a clock function (not shown). The hard disk 1c includes a transition instruction program file, an event detection program file, a recipe file such as a substrate processing recipe as a process recipe and a purge cleaning process recipe as a maintenance recipe, various screen files, various icon files, etc. (Not shown) is stored. The transition instruction unit 2 and the event detection unit 3 are realized on the memory 1b when the transition instruction program file and the event detection program are executed, respectively.

  The substrate processing recipe is a recipe in which processing conditions and processing procedures for processing the wafer 200 are defined. As described above, the substrate processing recipe (process recipe) executes at least a loading (boat loading) step, a step of processing a substrate according to processing conditions and processing steps, and a carrying out (boat loading) step. In some cases, it is further defined to execute wafer charge or wafer discharge. The purge cleaning processing recipe is a recipe in which processing conditions, processing procedures, and the like for purging the inside of the processing chamber 201 by supplying purge gas into the processing chamber 201 are defined. Note that the purge cleaning process recipe may be defined to further execute a loading process and an unloading process of the boat 217, a wafer charge, and a wafer discharge, like the process recipe. The recipe file includes setting values (control values) to be transmitted to sub controllers such as the external combustion controller 10, the transport controller 11, the temperature controller 12, the pressure controller 13, and the gas supply controller 14, the transmission timing, etc., for substrate processing and purge cleaning. It is set for each processing step.

A touch panel 7 as an operation unit is connected to the substrate processing apparatus controller 240. The touch panel 7 displays an operation screen for accepting input of operation commands to the above-described substrate transport system and substrate processing system, and notifies the event detection unit 3 described later when an operation command is input. It is configured. The operation screen includes various display fields and operation buttons for confirming the state of the substrate transfer system and the substrate processing system and inputting operation instructions to the substrate transfer system and the substrate processing system. The operation unit is not limited to being configured as the touch panel 7, and may be configured with a monitor and a keyboard like a personal computer.

(Connection between substrate processing equipment controller and group management equipment)
The transmission / reception module 1 d of the substrate processing apparatus controller 240 is communicably connected to a group management apparatus 500 such as a host computer 600 or a monitor server via a network 400.

  As shown in the upper part of FIG. 6, the communication state between the substrate processing apparatus 100 (transmission / reception module 1 d of the substrate processing apparatus controller 240) and the group management apparatus 500 includes, for example, offline (OFF LINE) and online (ON LINE). There are two states. Although not shown, the communication state with the host computer 600 has two states, online and offline, like the group management apparatus 500.

  The offline includes the following two states. In the first state, the connection between the substrate processing apparatus 100 and the group management apparatus 500 is being disconnected, and the operation of the substrate processing apparatus 100 by the command input from the group management apparatus 500 is invalid. The operation of the substrate processing apparatus 100 by command input is in a valid state. In the second state, the substrate processing apparatus 100 and the group management apparatus 500 are connected, but the operation of the substrate processing apparatus 100 by the command input from the group management apparatus 500 is invalid, and the command input from the touch panel 7 is performed. The operation of the substrate processing apparatus 100 is in an effective state.

  On-line is a state in which the substrate processing apparatus 100 and the group management apparatus 500 are connected, and the operation of the substrate processing apparatus 100 is enabled by a command input from the group management apparatus 500.

  The transmission / reception module 1d is configured to control communication with the group management device 500 and to notify the event detection unit 3 described later when the communication state with the group management device 500 goes offline. Yes.

(Connection between substrate processing controller and sub-controller)
The external combustion controller 10, the transfer controller 11, the temperature controller 12, the pressure controller 13, the gas supply controller 14, and the input / output controller 15 as sub-controllers are connected to the transmission / reception module 1d of the substrate processing apparatus controller 240, respectively. .

  The external combustion controller 10 is configured to control a combustion operation by an external combustion device (not shown) provided in the processing furnace 202. When the sensors built in the external combustion device (not shown) each show a predetermined value, an abnormal value, or the like, the external combustion controller 10 notifies the event detection unit 3 described later to that effect. It is configured.

  The transfer controller 11 includes a rotary pod shelf 105, a boat elevator 115, a pod transfer device (substrate container transfer device) 118, a wafer transfer mechanism (substrate transfer mechanism) 125, a boat 217, and a rotation mechanism that constitute a substrate transfer system. It is configured to control each of the 254 transport operations. Although not shown, a rotary pod shelf 105, a boat elevator 115, a pod transfer device (substrate container transfer device) 118, a wafer transfer mechanism (substrate transfer mechanism) 125, a boat 217, and a rotation mechanism constituting a substrate transfer system. Each sensor 254 has a built-in sensor. The transport controller 11 is configured to notify the event detection unit 3 described later when each of these sensors indicates a predetermined value or an abnormal value.

  Note that the communication state between the substrate processing controller 240 (transmission / reception module 1d of the substrate processing apparatus controller 240) and the transfer controller 11 includes, for example, local (LOCAL) and remote (REMOTE) as shown in the lower part of FIG. There are two states. Local (LOCAL) means that the connection between the substrate processing controller 240 and the substrate transport system is being disconnected, the operation of the substrate transport system by command input from the substrate processing controller 240 is invalid, and the command from the touch panel 7 The operation of the substrate transfer system by input is invalid. Remote (REMOTE) is a state in which the substrate processing controller 240 and the substrate transport system are being connected, and the operation of the substrate transport system by command input from the substrate processing apparatus controller 240 is effective.

  The temperature controller 12 controls the temperature of the heater 206 of the processing furnace 202 to adjust the temperature in the processing furnace 202, and when the temperature sensor 263 indicates a predetermined value or an abnormal value, an event described later It is configured to notify the detection unit 3 to that effect.

  The pressure controller 13 controls the pressure adjustment device 242 based on the pressure value detected by the pressure sensor 245 so that the pressure in the processing chamber 201 becomes a desired pressure at a desired timing, and the pressure sensor 245. Is a predetermined value or an abnormal value, the event detection unit 3 described later is notified to that effect.

  The gas supply controller 14 is configured to control the supply and stop of gas from the processing gas supply pipe 232a and the purge gas supply pipe 232b by opening and closing a gas valve (not shown). Further, the gas supply controller 14 is configured to control the MFCs 241a and 241b so that the flow rate of the gas supplied into the processing chamber 201 becomes a desired flow rate at a desired timing. When a gas valve (not shown) or a sensor (not shown) included in the MFC 241a, 241b shows a predetermined value or an abnormal value, the gas supply controller 14 notifies the event detection unit 3 described later to that effect. Is configured to do.

  The input / output controller 15 turns on / off the switches and sensors such as the door switch 130 and the substrate detection sensor 140 to open / close the casing 111, the sub casing 119, the front maintenance door 104, etc., and to the load port 114. It is configured to detect the placement of the pod 110. The input / output controller 15 is configured to detect a predetermined event or detect the occurrence of an abnormality from the detection results of the switches and sensors, and notify the event detection unit 3 to that effect.

(Event detector)
The event detection program file is read from the hard disk 1c to the memory 1b and executed by the CPU 1a so that the event detection unit 3 described later is realized in the controller for substrate processing apparatus 240.

  The event detection unit 3 is configured to detect the occurrence of various events and notify the transition instruction unit 2 described later. Specifically, the event detection unit 3 receives predetermined events from the external combustion controller 10, the transport controller 11, the temperature controller 12, the pressure controller 13, the gas supply controller 14, the input / output controller 15, the touch panel 7, and the transmission / reception module 1d. When the notification of the detection is received, the transition instruction unit 2 is notified of the notification.

  For example, when the event detection unit 3 receives a notification from the external combustion controller 10 that a sensor incorporated in the external combustion device (not shown) indicates a predetermined value or an abnormal value, the event detection unit 3 changes the state. It is configured to notify the instruction unit 2.

  In addition, for example, the event detection unit 3 includes a rotary pod shelf 105, a boat elevator 115, a pod transfer device (substrate container transfer device) 118, a wafer transfer mechanism (substrate transfer mechanism) 125, a boat, which constitute a substrate transfer system. 217 and a sensor built in the rotation mechanism 254 are configured to notify the transition instructing unit 2 when a notification that the sensor indicates a predetermined value or an abnormal value is received from the transport controller 11. .

  Further, for example, when the event detection unit 3 receives a notification from the temperature controller 12 or the pressure controller 13 that the temperature sensor 263 or the pressure sensor 245 indicates a predetermined value or an abnormal value, the transition instruction unit 2 Configured to notify.

  Further, for example, the event detection unit 3 indicates that a gas valve (not shown) or a sensor (not shown) included in the MFCs 241a and 241b indicates that a predetermined value, an abnormal value, or the like indicates a predetermined value, an abnormal value, or the like. When the notification is received from the gas supply controller 14, it is configured to notify the transition instruction unit 2 to that effect.

  Further, for example, the event detection unit 3 may notify that the casing 111, the sub casing 119, the front maintenance door 104, etc. are opened or closed, or that the pod 110 is placed on the load port 114, that is, When the detection results from the switches and sensors such as the door switch 130 and the substrate detection sensor 140 are received from the input / output controller 15, a notification to that effect is sent to the transition instruction unit 2.

  Further, for example, the event detection unit 3 indicates that the communication state with the sub-controller (external combustion controller 10, transport controller 11, temperature controller 12, pressure controller 13, gas supply controller 14) or input / output controller 15 is offline. When the notification is received from the transmission / reception module 1d, it is configured to notify the transition instruction unit 2 to that effect.

  For example, when the event detection unit 3 receives a notification from the transmission / reception module 1d that the communication state with the group management device 500 is offline, the event detection unit 3 notifies the transition instruction unit 2 to that effect.

  Communication between the transition instruction unit 2 and the event detection unit 3 is performed using a shared memory area or the like that is dynamically secured in the memory 1b when the transition instruction program and the event detection program are activated. It is configured as follows. For example, when either the transition instruction unit 2 or the event detection unit 3 writes a message in the shared memory area or the like, the other reads the message written in the shared memory area or the like at a predetermined timing.

(Transition instruction part)
The transition instruction program file is read from the hard disk 1c to the memory 1b and executed by the CPU 1a, so that the transition instruction unit 2 is realized in the substrate processing apparatus controller 240.

  As shown in FIG. 7, the transition instruction unit 2 sets the device state (device mode) of the substrate processing apparatus 100 in an initial state (RESET mode), a standby state (IDLE mode), an executable state (STANDBY mode), and being executed. It is configured to transition between five states: a state (RUN mode) and an end state (END mode). These five states are shown in the middle of FIG.

  As shown in FIG. 7, when the power of the substrate processing apparatus 100 is turned on (POWER ON), the transition instruction unit 2 is configured to set the state of each part of the substrate processing apparatus 100 to the initial state (RESET mode). ing.

  The initial state (RESET mode) is an initial state (POWER ON) immediately after the substrate processing apparatus 100 is turned on, or a state immediately after the substrate processing apparatus 100 is reset due to a trouble occurring in the substrate processing apparatus 100. This is the initial state. Specifically, for example, a rotary pod shelf 105, a boat elevator 115, a pod transfer device (substrate container transfer device) 118, a wafer transfer mechanism (substrate transfer mechanism) 125, a boat 217 and a rotation constituting the substrate transfer system. The mechanisms 254 are moved to the origin positions and are stopped. Further, the substrate processing system, for example, the gas exhaust mechanism, the heating mechanism, and the gas supply system are stopped. In addition, an initial screen is displayed on the touch panel 7, and the transmission / reception module 1 d can communicate with the group management apparatus 500 and the host computer 600.

  When the state of each part of the substrate processing apparatus 100 becomes the initial state (RESET mode), the transition instruction unit 2 is in a state where the apparatus state of the substrate processing apparatus 100 can enter the substrate processing apparatus 100, and It is configured to shift to a standby state (IDLE mode) in which an instruction to execute a substrate processing recipe or a purge cleaning processing recipe can be received.

  The standby state (IDLE mode) is an apparatus state in which entry into the substrate processing apparatus 100 is possible, and a state in which a recipe execution instruction can be received. The standby state (IDLE mode) is a state where the maintenance staff can enter the substrate processing apparatus 100 and perform maintenance work by opening the front maintenance door 104 or removing the apparatus cover (not shown). Say. Specifically, the power supply to the substrate processing system, for example, the heater 206 of the heating mechanism is stopped (or the power is supplied so that the heater 206 is at room temperature (default)), or the substrate is transported. For example, the wafer transfer mechanism (substrate transfer mechanism) 125 that constitutes the system stops driving (fixes) at the origin position and does not automatically operate (or the wafer transfer mechanism (substrate) directly by the maintenance staff. This means a state in which the maintenance staff can safely work in the substrate processing apparatus 100, including a state in which the transfer mechanism 125) can be moved safely.

  When the apparatus state of the substrate processing apparatus 100 becomes a standby state (IDLE mode), the transition instruction unit 2 enters a “waiting state” for waiting for the occurrence of a predetermined event and uses the clock function of the substrate processing apparatus controller 240. Then, the measurement of the elapsed time after completing the transition to the standby state (IDLE mode) is started.

  When the notification indicating that the occurrence of a predetermined event has been detected from the event detection unit 3 while in the “waiting state” described above, the transition instruction unit 2 sets the apparatus state of the substrate processing apparatus 100 to the standby state. Transition from the state (IDLE mode) to the executable state (STANDBY mode) is prohibited, and the state is kept in the standby state (IDLE mode).

  Here, the predetermined event is, for example, (a) the case 111, the sub case 119, the front maintenance door 104, etc. are opened (for example, the door switch 130 has been notified to that effect), (B) The connection between the substrate processing apparatus 100 and the group management apparatus 500 is being disconnected, the operation of the substrate processing apparatus 100 by a command input from the group management apparatus 500 becomes invalid, and the substrate processing apparatus 100 by a command input from the touch panel 7 (C) The connection between the substrate processing controller 240 and the substrate transfer system is being disconnected, and the operation of the substrate transfer system by the command input from the substrate processing controller 240 becomes invalid. The operation of the substrate transfer system by the command input from the touch panel 7 has become invalid (the above-mentioned local (LOCAL) state) Became possible), etc. is applicable. Hereinafter, such an event is also referred to as a transition prohibition event.

Further, when the pod 110 containing the wafer 200 is placed on the load port 114 while the transition instruction unit 2 is in the “waiting state” described above, the substrate processing apparatus 100 is in a standby state (IDLE mode). ) To an executable state (STANDBY mode). The executable state (STANDBY mode) is an apparatus state in which entry into the substrate processing apparatus 100 is impossible and a recipe can be executed. When a substrate processing recipe execution instruction (start instruction) is input from the group management apparatus 500 or the touch panel 7 in the executable state (STANDBY mode), the transition instruction unit 2 changes the apparatus state of the substrate processing apparatus 100 to the executable state. It is configured to make a transition from the (STANDBY mode) to the executing state (RUN mode) of the substrate processing recipe. Specifically, when the pod 110 is placed on the load port 114 by an in-process transfer device (not shown), the substrate detection sensor 140 detects the pod 110 and the pod 110 is placed on the load port 114. Is notified to the transition instruction unit 2 via the event detection unit 3. Furthermore, when an execution instruction (start instruction) for a substrate processing recipe is input from the group management apparatus 500 or the touch panel 7, the execution instruction is notified to the transition instruction unit 2. And the transition instruction | indication part 2 is comprised so that the apparatus state of the substrate processing apparatus 100 may be changed from the executable state (STANDBY mode) to the executing state (RUN mode) of a substrate processing recipe.

  While the transition instruction unit 2 is in the “waiting state” described above, the pod 110 containing the wafer 200 is not placed on the load port 114, or the substrate processing recipe is received from the group management apparatus 500 or the touch panel 7. If the execution instruction is not input, or the predetermined time has elapsed without receiving a notification from the event detection unit 3 that the occurrence of the predetermined event (transition prohibited event) has been detected, the transition instruction unit 2 The apparatus state of the apparatus 100 is configured to automatically transition from a standby state (IDLE mode) to an executable state (STANDBY mode). Thereafter, the transition instruction unit 2 automatically transitions the apparatus state of the substrate processing apparatus 100 from an executable state (STANDBY mode) to a running state (RUN mode) in which a purge cleaning process recipe as a maintenance recipe is executed. It is configured as follows.

  The in-execution state (RUN mode) is a state in which various recipes defined in the recipe file are being executed. In the in-execution state (RUN mode), the substrate processing controller 240 is a sub controller such as the external combustion controller 10, the transport controller 11, the temperature controller 12, the pressure controller 13, and the gas supply controller 14 based on the description in the recipe file. A predetermined set value (control value) is transmitted to the controller at a predetermined timing.

  Note that the transition instruction unit 2 does not interrupt the progress of the purge cleaning process recipe even when the execution instruction of the substrate processing recipe is received from the group management device 500 or the touch panel 7 in the running state (RUN mode). It is configured to wait for the start of the substrate processing recipe and start the substrate processing step after the purge cleaning processing step is completed.

  When the execution of the substrate processing recipe or the purge cleaning processing recipe is completed, the transition instruction unit 2 changes the state of the substrate processing apparatus 100 from the executing state (RUN mode) to the end state (END mode). The end state (END mode) is a state in which the execution of the recipe is ended. Note that the end state (END mode) has two states: a normal end state in which the recipe ends normally and an abnormal end state in which the recipe ends abnormally due to some trouble.

In the executable state (STANDBY mode), for example, by pressing the IDLE button on the operation screen displayed on the touch panel 7, the state is forcibly changed from the executable state (STANDBY mode) to the standby state (IDLE mode). It is possible to make it. In this case, for example, it is effective when the production line temporarily stops for some reason and waits for the pod 110 (wafer 200). Also, in any one of the standby state (IDLE mode), the executable state (STANDBY mode), the executing state (RUN mode), and the end state (END mode), for example, the RESET button on the operation screen is pressed. By operating, it is possible to forcibly shift to the initial state (RESET mode). In this case, for example, it is effective when an apparatus trouble or the like occurs and the substrate processing apparatus 100 is returned to the initial state (RESET mode).

(7) State Transition Operation of Substrate Processing Apparatus Next, the state transition operation of the substrate processing apparatus 100 will be described with reference to FIGS.

(Initial state (RESET mode))
As shown in FIG. 7, when the power of the substrate processing apparatus 100 is turned on (POWER ON), the transition instruction unit 2 sets the state of each part of the substrate processing apparatus 100 to the initial state (RESET mode).

(Standby state (IDLE mode))
When the state of each part of the substrate processing apparatus 100 becomes the initial state (RESET mode), the transition instruction unit 2 is in a state where the state of the substrate processing apparatus 100 can enter the substrate processing apparatus 100 and A transition is made to a standby state (IDLE mode) in which an instruction to execute a process recipe or purge cleaning process recipe can be received.

  When the apparatus state of the substrate processing apparatus 100 becomes a standby state (IDLE mode), the transition instruction unit 2 enters a “waiting state” for waiting for the occurrence of a predetermined event and uses the clock function of the substrate processing apparatus controller 240. And start measuring elapsed time.

  When the notification indicating that the occurrence of a predetermined event (transition prohibited event) has been detected from the event detection unit 3 while in the “waiting state” described above, the transition instruction unit 2 The state is prohibited from transitioning from the standby state (IDLE mode) to the executable state (STANDBY mode) and held in the standby state (IDLE mode).

  Further, when the pod 110 is placed on the load port 114 while the “waiting state” is in the above-described state and a substrate processing recipe execution instruction is input from the group management device 500 or the touch panel 7, the transition instruction unit 2. Shifts the state of the substrate processing apparatus 100 from the standby state (IDLE mode) to the executable state (STANDBY mode). After that, when the substrate processing controller 240 selects (prepares) a predetermined substrate processing recipe, the transition instruction unit 2 changes the apparatus state of the substrate processing apparatus 100 from the executable state (STANDBY mode) to the executing state (RUN mode). Transition to.

  Further, during the above-described “waiting state”, the pod 110 is not placed on the load port 114, or the execution instruction of the substrate processing recipe is not input from the group management device 500 or the touch panel 7, or the event detection When a predetermined time has elapsed without receiving a notification from the unit 3 that the occurrence of a predetermined event (transition prohibition event) has been detected, the transition instruction unit 2 changes the apparatus state of the substrate processing apparatus 100 to the standby state (IDLE). Mode) to an executable state (STANDBY mode) automatically. After that, when the substrate processing controller 240 selects (prepares) a predetermined cleaning recipe, the transition instruction unit 2 changes the apparatus state of the substrate processing apparatus 100 from the executable state (STANDBY mode) to the executing state (RUN mode). Transition.

(Running state (RUN mode))
In the execution state (RUN mode), the substrate processing controller 240 executes the substrate processing recipe when the pod 110 is placed on the load port 114 (the wafer 200 is loaded into the substrate processing apparatus 100), and the recipe Based on the description in the file, a predetermined set value (control value) is transmitted at a predetermined timing to sub-controllers such as the external fuel controller 10, the transport controller 11, the temperature controller 12, the pressure controller 13, and the gas supply controller 14. To do. As described above, when an instruction to execute a substrate processing recipe is input from the group management device 500 or the touch panel 7, the substrate processing controller 240 executes the substrate processing recipe in the executing state (RUN mode). In addition, when the wafer 200 is not put into the substrate processing apparatus 100 and transitioned to the running state (RUN mode), the substrate processing controller 240 performs purge cleaning processing as a maintenance recipe in the running state (RUN mode). Run the recipe.

(End status (END mode))
When the execution of the substrate processing recipe or the purge cleaning processing recipe is completed, the transition instruction unit 2 changes the apparatus state of the substrate processing apparatus 100 from the executing state (RUN mode) to the end state (END mode).

  When the apparatus state of the substrate processing apparatus 100 becomes the end state (END mode), the transition instruction unit 2 changes the apparatus state of the substrate processing apparatus 100 from the end state (END mode) to the standby state (IDLE mode), Thereafter, the above operation is repeated as illustrated in FIG.

(8) Effects according to the present embodiment According to the present embodiment, the following one or more effects are achieved.

(A) According to the present embodiment, upon receiving a notification that the occurrence of a predetermined event (transition prohibition event) has been detected in the standby state (IDLE mode), the apparatus state of the substrate processing apparatus 100 is changed to the substrate processing apparatus. 100 is an apparatus state in which entry into the apparatus 100 is possible, and an apparatus state in which entry into the substrate processing apparatus 100 is impossible from a standby state (IDLE mode) in which an instruction to execute a recipe can be received, and execution of a recipe is performed. It is configured to prohibit the transition to a possible executable state (STANDBY mode). Thereby, even if the maintenance staff performs the maintenance of the substrate processing apparatus 100 in the standby state (IDLE mode), the substrate processing apparatus 100 automatically transitions from the standby state (IDLE mode) to the executable state (STANDBY mode). This can be suppressed.

(B) According to the present embodiment, in the standby state (IDLE mode), the pod 110 is not placed on the load port 114, or the execution instruction of the substrate processing recipe is not input from the group management device 500 or the touch panel 7. Alternatively, when a predetermined time has passed without receiving a notification from the event detection unit 3 that the occurrence of a predetermined event (transition prohibition event) has been detected, the apparatus state of the substrate processing apparatus 100 is executed as a purge cleaning process recipe. Therefore, it is configured to transit to the running state (RUN mode). Accordingly, since the purge cleaning process can be automatically performed during the idle time of the substrate process, the inside of the process chamber 201 can be always kept clean and productivity can be improved.

(C) According to the present embodiment, when the casing 111, the sub casing 119, the front maintenance door 104, etc. are opened in the standby state (IDLE mode), the apparatus state of the substrate processing apparatus 100 is changed to the standby state (IDLE mode). ) To an executable state (STANDBY mode). As a result, when maintenance personnel perform maintenance of the substrate processing apparatus 100 in the standby state (IDLE mode), the substrate processing apparatus 100 is maintained even if the casing 111, the sub-casing 119, the front maintenance door 104, etc. are opened. It is possible to suppress the transition from the standby state (IDLE mode) to the executable state (STANDBY mode) without an instruction.

(D) According to the present embodiment, when the connection between the substrate processing controller 240 and the substrate transport system is local (LOCAL) in the standby state (IDLE mode), the apparatus state of the substrate processing apparatus 100 is changed to the standby state. It is configured to prohibit the transition from the (IDLE mode) to the executable state (STANDBY mode). Thus, when maintenance personnel perform maintenance of the substrate processing apparatus 100 in the standby state (IDLE mode), the substrate processing apparatus 100 is operated even if a predetermined time elapses while the substrate transport system is operated locally (LOCAL). Can be suppressed from the standby state (IDLE mode) to the executable state (STANDBY mode).

(E) According to the present embodiment, when the connection between the substrate processing apparatus 100 and the group management apparatus 500 becomes offline (OFF LINE) in the standby state (IDLE mode), the apparatus state of the substrate processing apparatus 100 is changed to the standby state. It is configured to prohibit the transition from the state (IDLE mode) to the executable state (STANDBY mode). Accordingly, when the maintenance staff performs the maintenance of the substrate processing apparatus 100 in the standby state (IDLE mode), even if the connection between the substrate processing apparatus 100 and the group management apparatus 500 is set to offline (OFF LINE), the substrate processing apparatus 100. Can be automatically suppressed from the standby state (IDLE mode) to the executable state (STANDBY mode).

(F) According to the present embodiment, even if an instruction to execute a substrate processing recipe is received from the group management apparatus 500 or the touch panel 7 in the running state (RUN mode), the progress of the purge cleaning process recipe is not interrupted. It is configured to wait for the start of the substrate processing recipe and start the substrate processing step after the purge cleaning processing step is completed. Thereby, since the purge cleaning process recipe can be surely executed to the end without being terminated halfway, the inside of the process chamber 201 can be always kept clean.

<Other Embodiments of the Present Invention>
In the present embodiment, the maintenance recipe (purge cleaning process recipe) is automatically executed when a predetermined time has elapsed while in the “waiting state”. Without being limited thereto, even if the “waiting time” continues for a predetermined time, it may be configured to transition to an executable state (STANDBY mode) and wait for a maintenance recipe execution instruction. Further, in order to execute the maintenance recipe, the maintenance recipe may be changed to the executable state (STANDBY mode) manually (for example, a maintenance person operates the touch panel 7). Further, a semiconductor manufacturing apparatus is shown as an example of the substrate processing apparatus, but the apparatus is not limited to the semiconductor manufacturing apparatus, and may be an apparatus for processing a glass substrate such as an LCD device. Further, the specific content of the substrate processing is not questioned, and it may be processing such as annealing processing, oxidation processing, nitriding processing, and diffusion processing as well as film forming processing. The film formation process may be, for example, a process for forming a CVD, PVD, oxide film, or nitride film, or a process for forming a film containing a metal.

  As mentioned above, although embodiment of this invention was described concretely, this invention is not limited to the above-mentioned embodiment, It can change variously in the range which does not deviate from the summary.

<Preferred embodiment of the present invention>
Hereinafter, preferred embodiments of the present invention will be additionally described.

According to one aspect of the invention,
A substrate processing apparatus that executes a recipe in which processing conditions and processing procedures are defined, and performs predetermined processing,
A control unit for controlling the operation of each unit of the substrate processing apparatus;
The controller is
The apparatus state of the substrate processing apparatus is an apparatus state in which entry into the substrate processing apparatus is possible, and entry into the substrate processing apparatus is impossible from a standby state in which an instruction to execute the recipe can be received. A transition instruction unit for transitioning to an executable state where the recipe is executable,
An event detector that detects the occurrence of a predetermined event that prohibits transition from the standby state to the executable state and notifies the transition instruction unit;
With
When the transition instruction unit receives a notification that the occurrence of the event has been detected, a substrate processing apparatus is provided that prohibits transition from the standby state to the executable state.

  Preferably, the recipe is a substrate processing recipe for processing the substrate.

Also preferably,
The substrate processing apparatus includes a processing chamber for storing the substrate,
The recipe is a purge cleaning process recipe in which a purge gas is supplied into the processing chamber to purge the processing chamber.

Also preferably,
The substrate processing apparatus includes a mechanism for entering the substrate processing apparatus,
An entry sensor for notifying the event detection unit that the entry mechanism has been opened;
With
In the standby state, the event detection unit detects the occurrence of the predetermined event and notifies the transition instruction unit when receiving the notification of the open state from the entry sensor.

Also preferably,
The substrate processing apparatus includes:
A substrate transfer system for transferring the substrate into and out of the processing chamber;
An operation unit that receives an input of an operation command to the substrate transfer system and notifies the event detection unit that the operation command has been input;
With
When the event detection unit receives a notification from the operation unit that the operation command is input to the substrate transfer system in the standby state, the event detection unit detects the occurrence of the predetermined event and performs the transition instruction. Notify the department.

Also preferably,
The substrate processing apparatus includes:
A substrate processing system for processing the substrate;
An operation unit that receives an operation command input to the substrate processing system and notifies the event detection unit that the operation command has been input,
With
When the event detection unit receives a notification that the operation command is input to the substrate processing system from the operation unit in the standby state, the event detection unit detects the occurrence of the predetermined event and performs the transition instruction. Notify the department.

Also preferably,
The substrate processing apparatus is connected to a group management apparatus to control communication with the group management apparatus, and a communication control unit that notifies the event detection unit that the communication state with the group management apparatus is offline. Prepared,
In the standby state, when receiving notification that the communication with the group management device is offline, the event detection unit detects the occurrence of the predetermined event and notifies the transition instruction unit.

Also preferably,
The substrate processing apparatus includes:
A placement unit on which a substrate container for housing the substrate is placed;
A substrate detection sensor for notifying the event detection unit that the substrate container has been placed on the placement unit;
With
The transition instruction unit
After receiving the notification that the occurrence of the predetermined event is detected from the event detection unit within a predetermined time after the apparatus state of the substrate processing apparatus is changed to the standby state, the apparatus state of the substrate processing apparatus Prohibiting the transition from the standby state to the executable state,
When receiving the notification that the substrate container is placed from the substrate detection sensor without receiving the notification that the occurrence of the event is detected from the event detection unit within the predetermined time, the substrate Transition the apparatus state of the processing apparatus from the standby state to the executable state and wait for an instruction to execute the substrate processing recipe.
If the notification that the occurrence of the event is detected is not received from the event detection unit within the predetermined time, the apparatus state of the substrate processing apparatus is changed from the standby state to the executable state, and the purge cleaning is performed. Run the processing recipe.

Also preferably,
The substrate processing apparatus includes:
A heating mechanism for heating the substrate;
A temperature control unit that controls the temperature of the heating mechanism to adjust the substrate to a predetermined temperature, and notifies the event detection unit that the heating mechanism has become abnormal,
With
When the event detection unit receives a notification from the temperature control unit that the heating mechanism has become abnormal in the standby state, the event detection unit detects the occurrence of the predetermined event and notifies the transition instruction unit.

Also preferably,
The substrate processing apparatus includes:
A gas exhaust mechanism for exhausting the atmosphere in the processing chamber;
A pressure control unit that controls the gas exhaust mechanism to adjust the pressure in the processing chamber, and notifies the event detection unit that the gas exhaust mechanism has become abnormal;
With
In the standby state, the event detection unit detects the occurrence of the predetermined event and notifies the transition instruction unit when receiving a notification from the pressure control unit that the gas exhaust mechanism has become abnormal. .

Also preferably,
The substrate processing apparatus includes:
A placement unit on which a substrate container for housing the substrate is placed;
A substrate container transport device for transporting the substrate container placed on the placement unit to a predetermined position of the substrate processing apparatus;
While controlling the substrate container transfer device, and when the substrate container transfer device becomes abnormal, a transfer control unit to notify the event detection unit,
With
When the event detection unit receives a notification from the transfer control unit that the substrate container transfer device has become abnormal in the standby state, the event detection unit detects the occurrence of the predetermined event and notifies the transition instruction unit. Notice.

Also preferably,
The substrate processing apparatus includes:
A substrate transfer device for transferring the substrate from inside and outside the substrate container transfer device;
While controlling the substrate transfer device, and when the substrate transfer device becomes abnormal, a transfer control unit to notify the event detection unit,
With
When the event detection unit receives a notification from the transfer control unit that the substrate transfer apparatus has become abnormal in the standby state, the event detection unit detects the occurrence of the predetermined event and notifies the transition instruction unit .

Also preferably,
The substrate processing apparatus includes:
A substrate holder for holding the substrate in the processing chamber;
A substrate holder lifting mechanism for raising and lowering the substrate holder into the processing chamber;
While controlling the substrate holder lifting mechanism, if the substrate holder lifting mechanism becomes abnormal, a transfer control unit for notifying the event detection unit,
With
In the standby state, when the event detection unit receives a notification from the transfer control unit that the substrate holder lifting mechanism has become abnormal, the event detection unit detects the occurrence of the predetermined event and notifies the transition instruction unit. Notice.

Also preferably,
The substrate processing apparatus includes:
A rotation mechanism for rotating the substrate holder in the processing chamber;
The rotation mechanism control unit that controls the rotation mechanism and notifies the event detection unit when the rotation mechanism becomes abnormal.
With
In the standby state, when the event detection unit receives a notification from the rotation mechanism control unit that the rotation mechanism has become abnormal, the event detection unit detects the occurrence of the predetermined event and notifies the transition instruction unit .

Preferably,
The control unit is configured as a computer having a central processing unit, a memory, a storage unit, a display unit, an input unit, and a communication unit,
The storage unit stores a transition instruction program and an event detection program,
The transition instruction program is read from the storage unit to the memory and executed by the central processing unit to realize the transition instruction unit in the control unit,
The event detection program is read from the storage unit to the memory and executed by the central processing unit, thereby realizing the event detection unit in the control unit.

  Preferably, the transition instruction unit waits for the start of the substrate processing recipe without interrupting the progress of the purge cleaning processing recipe even when the execution instruction of the substrate processing recipe is received while the purge cleaning processing recipe is being executed. And the substrate processing recipe is started after completion of the purge cleaning processing recipe.

2 Transition instruction unit 3 Event detection unit 200 Wafer (substrate)
240 Controller for substrate processing apparatus (control unit)

Claims (14)

The apparatus is ready to enter the substrate processing apparatus and is in a standby state in which an instruction to execute a predetermined recipe can be received, and the apparatus is incapable of entering the substrate processing apparatus and can execute a recipe. A substrate processing apparatus that holds an apparatus state including an executable state,
During the maintenance work in the standby state, if the occurrence of a predetermined event that prohibits the transition from the standby state to the executable state is detected within a predetermined time, the execution is possible from the standby state even if the predetermined time has elapsed. A substrate processing apparatus configured to prohibit transition to a state and maintain the standby state. The apparatus is ready to enter the substrate processing apparatus and is in a standby state in which an instruction to execute a predetermined recipe can be received, and the apparatus is incapable of entering the substrate processing apparatus and can execute a recipe. A maintenance method for a substrate processing apparatus for maintaining an apparatus state including an executable state,
During the maintenance work in the standby state, if the occurrence of a predetermined event that prohibits the transition from the standby state to the executable state is detected within a predetermined time, the execution is possible from the standby state even if the predetermined time has elapsed. A maintenance method for a substrate processing apparatus configured to prohibit transition to a state and maintain the standby state. The apparatus is ready to enter the substrate processing apparatus and is in a standby state in which an instruction to execute a predetermined recipe can be received, and the apparatus is incapable of entering the substrate processing apparatus and can execute a recipe. A substrate processing apparatus that holds an apparatus state that includes an executable state and a running state in which a predetermined process is executed in accordance with a processing condition and a processing procedure defined in the predetermined recipe,
In the standby state,
When a substrate container containing a substrate is placed on the load port within a predetermined time, the apparatus state is changed from the standby state to the executable state, and an instruction to execute a substrate processing recipe is issued as the predetermined recipe. When input, the device state is configured to transition from the executable state to the executing state,
When the predetermined time elapses without the occurrence of a predetermined event that prohibits the transition from the standby state to the executable state without placing a substrate processing container containing a substrate on the load port, the standby state A substrate processing apparatus configured to transition the apparatus state from the executable state to the in-execution state in order to transition the apparatus state from the executable state to the executable state and execute a maintenance recipe as the predetermined recipe. The apparatus is ready to enter the substrate processing apparatus and is in a standby state in which an instruction to execute a predetermined recipe can be received, and the apparatus is incapable of entering the substrate processing apparatus and can execute a recipe. A control method of a substrate processing apparatus for holding an apparatus state including an executable state and an executing state in which a predetermined process is executed in accordance with a processing condition and a processing procedure defined in the predetermined recipe,
In the standby state,
When a substrate container containing a substrate is placed on the load port within a predetermined time, the apparatus state is changed from the standby state to the executable state, and an instruction to execute a substrate processing recipe is issued as the predetermined recipe. When input, the device state is configured to transition from the executable state to the executing state,
When the predetermined time elapses without the occurrence of a predetermined event that prohibits the transition from the standby state to the executable state without placing a substrate processing container containing a substrate on the load port, the standby state A method for controlling a substrate processing apparatus, wherein the apparatus state is shifted from the executable state to the in-execution state in order to transition the apparatus state from the executable state to the executable state and execute a maintenance recipe as the predetermined recipe. The apparatus is ready to enter the substrate processing apparatus and is in a standby state in which an instruction to execute a predetermined recipe can be received, and the apparatus is incapable of entering the substrate processing apparatus and can execute a recipe. An apparatus state including a ready state, a running state in which a predetermined process is executed in accordance with processing conditions and a processing procedure defined in the predetermined recipe, and an end state in which the execution of the predetermined recipe is finished A substrate processing apparatus for holding
In the standby state,
When the predetermined time elapses without the occurrence of a predetermined event that prohibits the transition from the standby state to the executable state without placing a substrate container in which a substrate is stored on the load port, The apparatus state is changed to the executable state, and the apparatus state is changed from the executable state to the in-execution state in order to execute a maintenance recipe as the predetermined recipe.
When the execution of the predetermined recipe ends, the substrate processing apparatus changes the apparatus state from the in-execution state to the end state and then changes from the end state to the standby state. The apparatus is ready to enter the substrate processing apparatus and is in a standby state in which an instruction to execute a predetermined recipe can be received, and the apparatus is incapable of entering the substrate processing apparatus and can execute a recipe. An apparatus state including a ready state, a running state in which a predetermined process is executed in accordance with processing conditions and a processing procedure defined in the predetermined recipe, and an end state in which the execution of the predetermined recipe is finished A maintenance method of a substrate processing apparatus for holding
When the predetermined time elapses without the occurrence of a predetermined event that prohibits the transition from the standby state to the executable state without placing a substrate container in which a substrate is stored on the load port, The apparatus state is changed to the executable state, and the apparatus state is changed from the executable state to the in-execution state in order to execute a maintenance recipe as the predetermined recipe.
When the execution of the predetermined recipe is finished, the maintenance method for the substrate processing apparatus is caused to make a transition from the running state to the finished state and then to make the transition from the finished state to the standby state. A substrate container in which a substrate is accommodated on a load port is placed within a predetermined time in a standby state in which the apparatus can enter the substrate processing apparatus and can receive an instruction to execute a predetermined recipe. And transition from the standby state to the executable state where the recipe can be executed in an apparatus state in which entry into the substrate processing apparatus is impossible,
When an instruction to execute a substrate processing recipe is input as the predetermined recipe, the apparatus state is changed from the executable state to an in-execution state in which a predetermined process is executed in accordance with processing conditions and processing procedures defined in the predetermined recipe. A substrate processing apparatus configured to make a transition. In a stand-by state in which the apparatus can enter the substrate processing apparatus and can receive an instruction to execute a predetermined recipe, the substrate container in which the substrate is stored on the load port is not placed within a predetermined time. When the predetermined time elapses without occurrence of a predetermined event that prohibits the transition from the standby state to the executable state where the recipe is executable in an apparatus state in which entry into the substrate processing apparatus is impossible. Transition the device state from the standby state to the executable state,
In order to execute a maintenance recipe as the predetermined recipe, the apparatus state is shifted from the executable state to an in-execution state in which predetermined processing is executed in accordance with processing conditions and processing procedures defined in the predetermined recipe. The substrate processing apparatus comprised in. A substrate container in which a substrate is accommodated on a load port is placed within a predetermined time in a standby state in which the apparatus can enter the substrate processing apparatus and can receive an instruction to execute a predetermined recipe. And transitioning the apparatus state from the standby state to an executable state where the recipe is executable in an apparatus state incapable of entering the substrate processing apparatus;
When an instruction to execute a substrate processing recipe is input as the predetermined recipe, the apparatus state is changed from the executable state to an in-execution state in which predetermined processing is performed in accordance with processing conditions and processing procedures defined in the predetermined recipe. Including a transition step,
A method of manufacturing a semiconductor device in which the substrate processing recipe is executed in the executing state. In a stand-by state in which the apparatus can enter the substrate processing apparatus and can receive an instruction to execute a predetermined recipe, the substrate container in which the substrate is stored on the load port is not placed within a predetermined time. When the predetermined time has elapsed without the occurrence of a predetermined event that prohibits the transition from the standby state to the executable state where the recipe can be executed in an apparatus state in which entry into the substrate processing apparatus is impossible. Transitioning the device state from the standby state to the executable state;
A step of transitioning the apparatus state from the executable state to an in-execution state in which a predetermined process is executed in accordance with a processing condition and a processing procedure defined in the predetermined recipe in order to execute a maintenance recipe as the predetermined recipe Including
A maintenance method for a substrate processing apparatus in which the maintenance recipe is executed in the running state. The apparatus is in an apparatus state in which entry into the substrate processing apparatus is possible and a recipe execution instruction can be accepted. A transition instruction unit that transitions the device state to an executable executable state;
An event detector that detects the occurrence of a predetermined event that prohibits transition from the standby state to the executable state and notifies the transition instruction unit;
A control configured to hold the standby state by prohibiting the transition from the standby state to the executable state even if the predetermined time has elapsed if the occurrence of the predetermined event is detected within the predetermined time Substrate processing apparatus having a portion. It is an apparatus state in which entry into the substrate processing apparatus is possible and entry into the substrate processing apparatus is impossible after a predetermined time from a standby state in which a predetermined recipe execution instruction can be accepted. A method for controlling a substrate processing apparatus, comprising a step of transitioning an apparatus state to an executable state in which the recipe for the process is executable,
When a predetermined event that prohibits the transition from the standby state to the executable state within the predetermined time occurs, by prohibiting the transition from the standby state to the executable state, by holding the standby state, A method of controlling a substrate processing apparatus that does not execute the predetermined recipe. It is an apparatus state in which entry into the substrate processing apparatus is possible and entry into the substrate processing apparatus is impossible after a predetermined time from a standby state in which a predetermined recipe execution instruction can be accepted. Transitioning the device state to an executable state where the predetermined recipe is executable;
Transitioning the apparatus state from the executable state to an executing state in which a predetermined process is executed in accordance with the processing conditions and processing procedures defined in the predetermined recipe;
A method of manufacturing a semiconductor device having
If a predetermined event that prohibits transition from the standby state to the executable state within the predetermined time does not occur and a substrate container in which a substrate is stored on the load port is placed, When the apparatus state is transitioned from the standby state to the executable state, and the execution instruction of the substrate processing recipe is input as the predetermined recipe, the apparatus state is transitioned from the executable state to the in-execution state,
A method of manufacturing a semiconductor device in which the substrate processing recipe is executed in the executing state. From the initial state immediately after the device is turned on, the device state transitions from the initial state to the standby state in which it is possible to enter the device and accept the execution instruction of the predetermined recipe,
An apparatus state transition method for transitioning the apparatus state from the standby state to an executable state in which the predetermined recipe can be executed after the predetermined time has elapsed,
Device state transition that prohibits transition from the standby state to the executable state and maintains the standby state when a predetermined event that prohibits transition from the standby state to the executable state occurs within the predetermined time Method.

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