JP2001126976A - Substrate treatment system and maintenance method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate treatment system for carrying out maintenance like confirmation of operation, while a carriage mechanism is driven at given speed, and provide a maintenance method. SOLUTION: A substrate treatment system for carrying out a given process on a substrate (W) includes a frame body 2, a treatment unit 11 with a plurality of treatment units, such as COT and DEV, for various kinds of treatment on the substrate (W), a carriage mechanism 22 put in the treatment unit 11 for carrying the substrate (W) between treatment units, an interlock mechanism 61 for stopping the carriage mechanism 22 when a working door 51 mounted on the frame body 2 is opened, interlock releasing keys 56, 57, and 58 for releasing the interlock mechanism 61, and control means 60 and 70 for reducing the carriage speed of the carriage mechanism 22 to a speed lower than the prescribed speed of normal treatment time, when the interlock releasing keys 56, 57, and 58 are operated.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a substrate processing apparatus for performing various processes on a substrate such as a semiconductor wafer and a maintenance method for the substrate processing apparatus for performing maintenance such as operation check in such a substrate processing apparatus.

[0002]

2. Description of the Related Art In a photolithography process of a semiconductor device, a resist is applied to a surface of a semiconductor wafer, a resist film formed by the resist is exposed according to a predetermined circuit pattern, and the exposed pattern is developed. A circuit pattern is formed on the resist film.

Conventionally, a resist coating and developing system has been used to carry out such a series of steps. Such a resist coating and developing processing system includes a processing station in which various processing units for performing various processing for coating and developing on a semiconductor wafer are arranged in multiple stages,
A cassette station for accommodating a plurality of semiconductor wafers is mounted, a semiconductor station for carrying semiconductor wafers one by one to a processing station, and a semiconductor station for carrying out processed semiconductor wafers from the processing station and storing them in a cassette. An interface unit for transferring a semiconductor wafer to and from the exposure apparatus is provided integrally. Further, a main wafer transfer mechanism for loading and unloading semiconductor wafers to and from the processing units arranged in these multiple stages is provided, and a wafer transfer mechanism for transferring the wafer is also provided in the interface section and the cassette station.

[0004]

Incidentally, in such a resist coating / developing processing system, when a series of processing is performed on a semiconductor wafer, an emergency situation occurs or a periodic inspection is performed. The work door of the processing unit is opened. At this time, from the viewpoint of safety or the like, an interlock mechanism that stops all processing operations of each processing unit and also stops the main wafer transfer mechanism and other transfer mechanisms operates. It has become.

However, in addition to the case described above, for example, after initial setting or restoration work, it is desired to confirm whether or not the main wafer transfer mechanism or the like can perform a predetermined operation as set. There is.

[0006] Such an operation check must be performed by opening the work door. However, when the work door is opened, the interlock mechanism is operated, so that the operation cannot be checked as it is. For this reason, it is conceivable to confirm the operation by not operating the interlock sensor by any means.However, the main wafer transfer mechanism and the transfer mechanism of the interface section are classified as industrial robots, and from the viewpoint of safety, It is stipulated by law that the moving speed during maintenance is lower than the normal processing speed, and the operation cannot be checked at the normal processing speed.

In order to confirm the operation of the processing unit such as the transport mechanism or the coating processing unit as described above, the signal from the interlock sensor is shut off by some means to activate the interlock mechanism. It is necessary to avoid it and it is complicated.

The present invention has been made in view of such circumstances, and has as its object to provide a substrate processing apparatus capable of performing maintenance such as operation confirmation while moving a transport mechanism at a predetermined speed, and a maintenance method thereof. I do.
It is another object of the present invention to provide a substrate processing apparatus capable of releasing an interlock and performing maintenance without complicated operation.

[0009]

According to a first aspect of the present invention, there is provided a substrate processing apparatus for performing a predetermined process on a substrate, comprising: a housing; A processing unit having a plurality of processing units for performing various types of processing, a transfer mechanism disposed in the processing unit, for transferring a substrate between the processing units, and a transfer mechanism when a work door provided on a housing is opened. Interlock means for stopping the mechanism;
Interlock releasing means for releasing the interlock means, and control means for setting the moving speed of the transport mechanism to a predetermined speed lower than that during normal processing when the interlock releasing means is operated. A substrate processing apparatus is provided.

According to a second aspect of the present invention, there is provided a substrate processing apparatus for performing a predetermined process on a substrate, the processing unit having a housing and a plurality of processing units for performing various processes on the substrate. An interface unit to which another device is connected and transfers a substrate between the processing unit and another device, a first transfer mechanism arranged in the processing unit and transferring a substrate between processing units, A second transport mechanism that is disposed in the interface unit and transports a substrate between the processing unit and the other device; and a first and a second transport mechanism that open a work door provided in a housing. 2, the interlock means for stopping the transport mechanism, the interlock release means for releasing the interlock means, and the first transport mechanism, or the first and the second when the interlock release means is operated. Two The substrate processing apparatus characterized by comprising a control means for the feed mechanism slow predetermined speed the movement speed than in the normal process is provided.

According to a third aspect of the present invention, there is provided a substrate processing apparatus for performing predetermined processing on a substrate, the processing unit having a housing and a plurality of processing units for performing various processing on the substrate. An interface unit to which another device is connected and which transfers a substrate between the processing unit and the other device; a loading / unloading unit for loading / unloading a substrate to / from the processing unit; A first transport mechanism for transporting the substrate between the processing units, a second transport mechanism disposed in the interface unit for transporting the substrate between the processing station and the other device, A third transfer mechanism that is disposed in the unit and transfers a substrate between the processing unit and the first, second, and third transfer units when a work door provided in a housing is opened. Interlock means for stopping the mechanism; And interlock canceling means for canceling the interlock means, when actuated the interlock releasing means, the first conveying mechanism or the first,
And a control means for moving the second transfer mechanism at a predetermined speed lower than that during normal processing.

According to a fourth aspect of the present invention, there is provided a substrate processing apparatus for performing a resist coating process on a substrate and a developing process after exposure, the coating device performing a resist coating process on the housing and the substrate. A processing unit and a processing unit having a development processing unit that develops the pattern after the resist film formed by applying the resist liquid is exposed to a predetermined pattern, and an exposure apparatus is connected, and the processing unit and the exposure apparatus An interface unit for transferring a substrate between the first unit and a first transfer mechanism arranged in the processing unit and transferring the substrate between the processing units; and a first transfer mechanism arranged in the interface unit and configured to communicate with the processing unit and the other device. A second transport mechanism for transporting the substrate between the second transport mechanism and an interlocking hand for stopping the first and second transport mechanisms when a work door provided in the housing is opened. Interlock releasing means for releasing the interlock means, and moving speed of the first transport mechanism or the first and second transport mechanisms when the interlock is released by the interlock releasing means. And a control means for setting a predetermined speed lower than that during normal processing.

According to a fifth aspect of the present invention, there is provided a substrate processing apparatus for performing a resist coating process on a substrate and a developing process after exposure, comprising a housing and a coating process for performing a resist coating process on the substrate. A processing unit having a unit and a development processing unit for developing the pattern after the resist film formed by applying the resist liquid is exposed to a predetermined pattern, and an exposure apparatus is connected, and the processing unit and the exposure apparatus An interface unit for transferring substrates between the processing unit, a loading / unloading unit for loading / unloading the substrate to / from the processing unit, a first transfer mechanism disposed in the processing unit, and transferring the substrate between processing units; A second transport mechanism that is disposed in the processing unit and transports the substrate between the processing unit and the other device; and a transport mechanism that is disposed in the loading / unloading unit and transports the substrate to and from the processing unit. When a third transfer mechanism for feeding and a work door provided on the housing are opened, the first, second,
Interlock means for stopping the third transport mechanism, interlock release means for releasing the interlock means, and the first transport mechanism or the first transport mechanism when the interlock release means is operated. And the second
And a control unit for setting the moving speed of the transfer mechanism to a predetermined speed lower than that during normal processing.

According to a sixth aspect of the present invention, there is provided a substrate processing apparatus for performing a predetermined process on a substrate, comprising: a housing; a processing unit having a plurality of processing units for performing various processes on the substrate; Interlock means for stopping the plurality of processing units when a work door provided on the housing is opened,
Interlock release means for releasing the interlock means, and control means for controlling such that at least one of the plurality of processing units is not stopped when the interlock release means is operated. A substrate processing apparatus is provided.

According to a seventh aspect of the present invention, there is provided a substrate processing apparatus for performing a resist coating process on a substrate and a developing process after exposure, the coating device performing a resist coating process on the housing and the substrate. When a processing unit having a processing unit, a processing unit having a development processing unit for developing a pattern after a resist film formed by applying a resist solution is exposed to a predetermined pattern, and a work door provided in a housing are opened. ,
Interlock means for stopping the coating processing unit and the developing processing unit, interlock releasing means for releasing the interlock means, and when the interlock is released by the interlock releasing means, the coating processing unit and And a control unit for controlling at least one of the development processing units so as not to be stopped.

According to an eighth aspect of the present invention, a processing section having a plurality of processing units for performing various types of processing on a substrate, a transport mechanism disposed in the processing section and transporting the substrate between the processing units, A maintenance method for the substrate processing apparatus, comprising: an interlock means for stopping the transfer mechanism when a work door provided on the body is opened. A maintenance method for the substrate processing apparatus is provided, wherein the locking means is released and the moving speed of the transport mechanism is set to a predetermined speed lower than that during normal processing.

According to a ninth aspect of the present invention, a coating unit for applying a resist to a substrate and developing the resist film formed by applying a resist solution after the resist film is exposed to a predetermined pattern. A processing unit having a development processing unit, an exposure unit connected to the processing unit, an interface unit for transferring a substrate between the processing unit and the exposure unit, and a processing unit disposed in the processing unit and transporting the substrate between the processing units A first transport mechanism, a second transport mechanism disposed in the interface unit for transporting the substrate between the processing unit and the other device, and a work door provided on the housing opened. A maintenance method of the substrate processing apparatus for maintaining the substrate processing apparatus, comprising: an interlock unit for stopping the first and second transport mechanisms. During Maintenance Manual, releasing the interlocking means, the first conveying mechanism or the first,
And a maintenance method for the substrate processing apparatus, wherein the moving speed of the second transport mechanism is lower than that during normal processing.

According to the present invention, the interlock releasing means is provided, and the interlock is released by operating the interlock releasing means, and at this time, the predetermined transport mechanism is moved at a predetermined speed lower than that in the normal processing. As a result, even if the work door is opened during maintenance, the predetermined transport mechanism is not interlocked and the speed is reduced to the predetermined speed, so that the predetermined transport mechanism is moved at the predetermined speed. Maintenance such as operation check can be performed while doing so.

Further, since the interlock releasing means is provided and the interlock is released by a key operation or the like, the interlock can be released without complicated operation.

[0020]

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is a perspective view schematically showing a resist coating and developing system according to an embodiment of the present invention, FIG. 2 is a plan view thereof, FIG. 3 is a front view thereof, and FIG. 4 is a rear view thereof.

This resist coating and developing processing system 1
As shown in FIG. 1, a cassette station 10 having a housing 2 in which a loading / unloading station is provided, a processing station 11 having a plurality of processing units, and an exposure apparatus ( (Not shown)
And an interface unit 12 for transferring the wafer W between the two. As shown in FIG. 1, a main operation panel 13 is provided on the housing 2 at a position corresponding to the cassette station 10, and a sub operation panel 15 is provided at a position corresponding to the processing unit 11. The main operation panel 13 and the sub operation panel 15 have display units 14 and 1 respectively capable of displaying various operation screens.
6 are provided, and these display units 14 and 16 can be operated by a touch panel method.

In the cassette station 10, a plurality of semiconductor wafers W (hereinafter simply referred to as "wafers W") as objects to be processed are mounted on a wafer cassette CR in units of, for example, 25 wafers. This is for loading or unloading the wafer W from this system to another system, or for transferring the wafer W between the wafer cassette CR and the processing station 11.

In the cassette station 10, as shown in FIG.
A plurality of (four in the figure) positioning projections 20a along the direction
The wafer cassette CR can be placed at a position of the projection 20a in a line with the respective wafer entrances facing the processing station 11 side. In the wafer cassette CR, the wafers W are arranged in a vertical direction (Z direction). Also, the cassette station 10
A wafer transfer mechanism 21 (third transfer mechanism) is provided between the wafer cassette mounting table 20 and the processing station 11. The wafer transfer mechanism 21 has a wafer transfer arm 21a movable in the cassette arrangement direction (X direction) and the wafer arrangement direction (Z direction) of the wafers W therein. The wafer cassette CR can be selectively accessed. The wafer transfer arm 21a is configured to be rotatable in the θ direction, and includes an alignment unit (ALIM) and an extension unit (E) belonging to a _third processing unit G3 on the processing station 11 side described later.
XT).

The processing station 11 is provided with a plurality of processing units for performing a series of steps for performing coating and phenomena on the wafer W, and these are arranged at predetermined positions in multiple stages. The wafers W are processed one by one. As shown in FIG. 2, the processing station 11 has a transfer path 22a in the center, in which a main wafer transfer mechanism 22 (first transfer mechanism) is provided. Of processing units are arranged. The plurality of processing units are divided into a plurality of processing units, and each processing unit includes a plurality of processing units arranged in multiple stages along a vertical direction.

As shown in FIG. 4, the main wafer transfer mechanism 22 is provided with a wafer transfer section 46 inside a cylindrical support 49 so as to be able to move up and down in the vertical direction (Z direction). The cylindrical support 49 is rotatable by a rotational driving force of a motor (not shown), and accordingly, the wafer transfer unit 46 is also integrally rotatable.

The wafer transfer section 46 includes a plurality of wafer transfer arms 48 movable in the front-rear direction of a transfer base 47, and the transfer of the wafer W between the processing units is realized by the wafer transfer arms 48. ing.

Further, as shown in FIG.
, Four processing units G₁, G ₂, G₃, G₄But
It is arranged around the eha transport path 22a. These
First and second processing units G₁, G₂Is the front of the system
(The front side in FIG. 2), the third processing
Part G₃Is located adjacent to the cassette station 10.
And the fourth processing unit G₄Is adjacent to the interface unit 12
It is arranged.

As shown in FIG. 3, the first processing unit G _1, 2 single spinner type process units to place the wafer W on the spin chuck (not shown) performs a predetermined process in a cup CP In this embodiment, a resist coating unit (COT) for coating a resist on the wafer W and a developing unit (DEV) for developing a resist pattern are arranged in two stages from the bottom in this embodiment. Are stacked. Similarly, the second processing section G _2, a resist coating unit as two spinner-type processing units (C
OT) and the development processing unit (DEV) are stacked in two stages from the bottom.

As described above, the resist coating unit (C)
The reason for disposing the OT) or the like on the lower side is that the waste liquid of the resist solution is inherently more complicated than the waste liquid of the developer both mechanically and in terms of maintenance.
This is because arranging OT) or the like at the lower level reduces its complexity. However, if necessary, a resist coating unit (COT) and the like can be arranged in the upper stage.

[0030] In the third processing unit G ₃ are, as shown in FIG. 4, the oven-type processing units of the wafer W is placed on a mounting table SP performs predetermined processing are multi-tiered.
That is, a cooling unit (CO
L), an adhesion unit (AD) for performing a so-called hydrophobizing process for improving the fixability of the resist, an alignment unit (ALIM) for positioning, and a wafer W
Extension unit (EXT) for loading and unloading
Four heat processing units (H) for performing a heat process on the wafer W before and after the exposure process and after the development process
P) are stacked in eight stages in order from the bottom. A cooling unit (COL) is provided instead of the alignment unit (ALIM), and the cooling unit (COL) is provided.
May have an alignment function.

[0031] The fourth processing unit G ₄ also, the oven-type processing units are multi-tiered. That is, a cooling unit (COL), an extension cooling unit (EXTCOL) which is a wafer loading / unloading section provided with a cooling plate, and an extension unit (EX
T), a cooling unit (COL), and four heat treatment units (HP) are stacked in eight stages from the bottom.

As described above, the cooling unit (COL) and the extension cooling unit (EXTCOL) having a low processing temperature are arranged in the lower stage, and the heating processing unit (HP) having a high processing temperature is arranged in the upper stage. Thermal interference can be reduced. Of course, a random multi-stage arrangement may be used.

The back side of the processing station 11 is a space, and other processing units can be arranged as needed. As the other processing units, basically, similarly to the third and fourth processing units G ₃ and G ₄ , those having a structure in which open processing units are stacked in multiple stages can be used. .

The interface section 12 has the same length as the processing station 11 in the depth direction (X direction). As shown in FIGS. 2 and 3, a portable pickup cassette CR and a stationary buffer cassette BR are arranged in two stages at the front of the interface section 12, and a peripheral exposure device 23 is arranged at the rear. A wafer transfer mechanism 24 (second transfer mechanism) is provided at the center. The wafer transfer mechanism 24 has a wafer transfer arm 24a. The wafer transfer arm 24a moves in the X direction and the Z direction to move both cassettes CR,
The BR and the peripheral exposure device 23 can be accessed. Further, the wafer transfer arm 24a is rotatable in θ direction, the extension unit included in the fourth processing unit G ₄ of the processing station 11 (EXT) and,
Further, a wafer transfer table (not shown) on the adjacent exposure apparatus side can be accessed.

Although not shown, a filter unit is provided on the ceiling of the processing station 11 and the interface section 12, and the inside of the processing station 11 and the interface section 12 is provided with clean air passing through the filter. A downflow is formed.

In such a resist coating and developing system, first, in the cassette station 10, the wafer transfer arm 21 a of the wafer transfer mechanism 21 stores the unprocessed wafer W on the cassette mounting table 20. Access the CR and access the cassette C
Taking out one wafer W from R, it is transported to the third processing section _{G 3} of the extension unit (EXT).

The wafer W is carried into the processing station 11 from the extension unit (EXT) by the wafer transfer section 46 of the main wafer transfer mechanism 22. Then, the alignment unit (AL) of the _third processing unit G3
After alignment by IM), the wafer is transported to an adhesion processing unit (AD), where it is subjected to a hydrophobizing process (HMDS process) for improving the fixability of the resist. Since this process involves heating, the wafer W is then transferred to the cooling unit (COL) by the wafer transfer unit 46.
And cooled.

After the adhesion process is completed, the wafer W cooled by the cooling unit (COL) is continuously
The resist transfer unit (C
OT), where a coating film is formed. After the completion of the coating process, the wafer W is subjected to a pre-baking process in one of the heat processing units (HP) of the processing units G ₃ and G ₄ , and thereafter cooled in one of the cooling units (COL).

The cooled wafer W is supplied to the third processing unit G ₃
Is conveyed to the alignment unit (ALIM), where it is aligned, it is conveyed to the interface section 12 via the fourth processing unit group G ₄ of the extension units (EXT).

In the interface section 12, after peripheral exposure is performed by a peripheral exposure device 23 to remove excess resist, the wafer W is exposed in accordance with a predetermined pattern by an exposure apparatus (not shown) provided adjacent to the interface section 12. Is subjected to an exposure process.

The wafer W after exposure is returned again to the interface section 12 by the wafer transport mechanism 24, an extension unit included in the fourth processing unit _{G 4} (EX
T). Then, the wafer W is transferred to any one of the heat processing units (HP) by the wafer transfer unit 46 and subjected to post-exposure bake processing.
Next, it is cooled by a cooling unit (COL).

Thereafter, the wafer W is transferred to the development processing unit (D
(EV), where the exposure pattern is developed. After the development is completed, the wafer W is transferred to any one of the heat processing units (HP) and subjected to post-baking processing, and then cooled by the cooling unit (COL). After such a series of processing is completed, and returned to the cassette station 10 through the third processing unit group G ₃ of the extension unit (EXT), is inserted into one of the wafer cassettes CR.

Next, maintenance in the resist coating and developing system will be described. As shown in FIG. 5A, the system housing 2 is provided with a work door 51 that can be opened during an emergency or maintenance, and an interlock sensor 52 is attached to the work door 51. ing. This interlock sensor 52
For example, it is a magnet sensor using a magnet, and as shown in FIG. 5B, is constituted by a magnet 53 attached to a work door 51 and a detection unit 54 attached to a support unit 55. . When the work door (window) 51 is closed as shown in FIG. 5B, the magnet 53 is in contact with the detection unit 54, but as shown in FIG. When the door 51 is opened, the magnet 53 is separated from the detection unit 54 and the magnetic field detected by the detection unit 54 changes. Therefore, it is detected that the work door 51 is opened by the change in the detected magnetic field. As a result, the interlock mechanism operates as described later, and the transport system and each processing unit are stopped.

As shown in FIG. 6, for example, three interlock release keys 56 for level 1 to level 3 are provided on the sub operation panel 15 so that the operation of the transport mechanism and the processing unit can be checked during maintenance. , 57, 58 are provided. When all of these interlock release keys are off, the interlock mechanism operates, but when any of them is on, the interlock by the interlock mechanism is released as described later. Thus, the work door can be opened and closed, and predetermined control is executed.

Next, a control system for performing control during maintenance will be described. FIG. 7 is a block diagram showing a control system for performing control during maintenance. The main controller 70 controls the entire system, and controls the unit controllers of each processing unit and the transport mechanism. For example, processing station 11
Interface units such as the unit controller 71 of the main wafer transfer mechanism 22, the unit controller 72 of the coating processing unit (COT), the unit controller 73 of the development processing unit (DEV), the unit controller 74 of the wafer transfer mechanism 21 in the cassette station 10, etc. The unit controller 75 and the like of the wafer transfer mechanism 24 in 12 are controlled by the main controller 70.

As described above, the interlock mechanism 61 sends a signal for stopping all the processing units and the transport mechanism to the main controller when any of the interlock sensors 52 detects that the work door 51 has been opened. 70. The interlock release / control unit 60
When any of the interlock release keys 56, 57, 58 is turned on, a signal for releasing the interlock is output to the interlock mechanism 61 and a predetermined signal is output to the main controller 70. When the main controller 70 receives the interlock release signal, an alarm display “interlock is released” is displayed on the display unit 76, the alarm buzzer 77 is intermittently sounded, and the signal tower 78 flashes red. Thus, the operator is notified that the interlock has been released by the predetermined interlock release key.

Specifically, for example, when the level 1 interlock release key 56 is turned on, a release signal of the interlock mechanism 61 is transmitted, and a signal for stopping each transport mechanism is transmitted. The coating processing unit (COT) and the developing processing unit (DEV), which are spinner-based processing units, are in a normal operation state. For example, when the level 2 interlock release key 57 is turned on, a release signal of the interlock mechanism 61 is transmitted, and the main wafer transport mechanism 22 of the processing station 11 is transmitted.
Further, a signal for setting a maintenance mode in which the wafer transfer mechanism 24 of the interface section 12 is moved at a lower speed than during normal processing is transmitted, and the wafer transfer mechanism 21 of the cassette station 10, a coating processing unit (COT) which is a spinner processing unit, and Development unit (DE
V) is a normal operation state. Further, for example, when the level 3 interlock release key 58 is turned on, a release signal of the interlock mechanism 61 is transmitted, and the main wafer transport mechanism 22 of the processing station 11 and the wafer transport mechanism of the interface section 12 are transmitted. A signal for stopping the processing operation of the coating processing unit (COT) and the developing processing unit (DEV), which are the spinner-based processing units, is transmitted.

Next, a control flow at the time of maintenance will be described with reference to FIG. First, it is determined whether or not the above-described interlock mechanism 61 is released (STEP 101). If not, it is determined whether or not the work door 51 is opened (STEP 101).
102), if the work door 51 is open, stop all the transport mechanism and the processing unit (STEP 1).
03). This is a normal mode in which the interlock mechanism 61 operates.

On the other hand, if the interlock is released in STEP 101, it is determined whether or not this is a level 1 key operation (STEP 104). When it is determined that the operation is a level 1 key operation, all the transport mechanisms are stopped (STEP 105). In this case, the spinner-based processing units (COT) and developing unit (DEV) are in a normal operation state. This level 1 state is used when confirming the operation of the spinner processing unit. In this case, since the wafer transfer mechanism is stopped, the operation of only the spinner-based processing unit can be safely checked.

If it is determined in STEP 104 that the operation is not a level 1 key operation, it is determined whether or not the operation is a level 2 key operation (STEP 106). If it is determined that the operation is a level 2 key operation, the processing station 11
Main wafer transfer mechanism 22 and interface section 12
Is set to a maintenance mode in which the wafer transfer mechanism 24 is moved at a lower speed than during normal processing (STEP 107). In this case, the transport mechanism 2 of the cassette station 10
1. A coating unit (C, a spinner-based processing unit)
OT), the development processing unit (DEV) and the heat treatment system unit are in a normal operation state. This level 2 state
Confirmation of processing in each unit and operation of wafer transfer mechanism,
It is used when confirming the delivery of a wafer. As described above, the main wafer transfer mechanism 22 of the processing station 11 and the wafer transfer mechanism 2 of the interface unit 12
No. 4 is classified as an industrial robot, and is stipulated by law from the viewpoint of safety that the moving speed during maintenance is lower than the normal processing speed. Although the maintenance such as the operation check cannot be performed, as described above, the moving speed of these transport mechanisms is set to a specified value or less (composition speed 250 m
The operation can be confirmed by setting the maintenance mode (m / sec or less). Since the wafer transfer mechanism 21 of the cassette station 10 is not classified as an industrial robot, maintenance such as operation confirmation can be performed even at a normal speed, so that the speed is not reduced. When turning on, the moving speed may be reduced.

If it is determined in step 106 that the operation is not a level 2 key operation, it is determined whether the operation is a level 3 key operation (STEP 108). If it is determined that the operation is a level 3 key operation, the processing station 1
1 main wafer transfer mechanism 22 and interface section 1
In the maintenance mode in which the second wafer transfer mechanism 24 is moved at a lower speed than during the normal processing, the coating processing unit (COT) and the developing processing unit (DEV), which are spinner processing units, are stopped (STEP 10).
9). The level 3 state is used when confirming the operation of only the wafer transfer mechanism. The state of level 2 is used when confirming the operation of the wafer transfer mechanism in relation to the operation of the spinner unit, while the state of level 3 is suitable for confirming the operation of an operation unrelated to the processing unit.

By performing the control as described above, the maintenance can be performed by releasing the interlock without any complication. Further, by releasing the interlock mechanism 61 and performing predetermined control in this way, a desired operation can be confirmed. In particular, it is possible to check the operation of the transport mechanism while moving the transport mechanism at a predetermined speed.

Note that the present invention is not limited to the above embodiment, and various modifications are possible. For example, in the above embodiment, the case where the present invention is applied to the resist coating and developing processing system has been described. However, the present invention is not limited to this and can be applied to other substrate processing apparatuses. Further, the substrate to be processed is not limited to a semiconductor wafer, and can be applied to other substrates such as a substrate for a liquid crystal display (LCD). Also, the interlock release key does not need to have all of the above level 1 to level 3 keys. When the interlock is released, the operation is not limited to the key operation but may be another operation such as a button operation.

[0054]

As described above, according to the present invention,
An interlock release unit is provided, and the interlock is released by operating the interlock release unit.At this time, the predetermined transport mechanism is moved at a predetermined speed lower than that during the normal processing. Even if the work door is opened, the prescribed transport mechanism is not interlocked and the speed is reduced to the prescribed speed, so perform maintenance such as operation check while moving the prescribed transport mechanism at the prescribed speed. Can be.

Further, since an interlock releasing means is provided and the interlock is released by a key operation or the like, it is possible to release the interlock and perform a desired maintenance without complicated operation.

[Brief description of the drawings]

FIG. 1 is a perspective view schematically showing an overall configuration of a semiconductor wafer resist coating and developing processing system according to an embodiment of the present invention.

FIG. 2 is a plan view showing the resist coating and developing system shown in FIG.

FIG. 3 is a front view of the resist coating and developing system shown in FIG. 1;

FIG. 4 is a rear view of the resist coating and developing system shown in FIG. 1;

FIG. 5 is a schematic diagram showing an interlock sensor of a work door provided on a housing of the system of FIG. 1 and its operation.

FIG. 6 is a diagram showing an interlock release key provided on an operation panel.

FIG. 7 is a block diagram showing a control system that performs control during maintenance of the resist coating and developing system of FIG. 1;

FIG. 8 is a flowchart showing control during maintenance of the resist coating and developing system of FIG. 1;

DESCRIPTION OF SYMBOLS 1; resist coating and developing system 2; housing 10; cassette station (loading / unloading section) 11; processing station 12; interface section 21; wafer transfer mechanism (third transfer mechanism) 22; Mechanism (first transfer mechanism) 24; wafer transfer mechanism (second transfer mechanism) 51; work door 52; interlock sensor 56 to 58; interlock release key 60; interlock release / control unit (control means) 61; interlock mechanism 70; main controller (control means) W; semiconductor wafer (substrate)

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Jun Okura 2655 Tsukure, Kikuyo-cho, Kikuchi-gun, Kumamoto Prefecture Tokyo Electron Kyushu Co., Ltd. Kumamoto Office F-term (reference) 5F031 CA02 DA17 FA01 FA11 FA12 FA15 GA47 GA48 GA49 GA50 MA02 MA26 MA27 PA06 5F046 AA28 CD01 CD05 CD06 DA29 JA22 LA18

Claims (14)

[Claims] 1. A substrate processing apparatus for performing a predetermined process on a substrate, comprising: a housing; a processing unit having a plurality of processing units for performing various processes on the substrate; and a processing unit disposed in the processing unit. A transport mechanism for transporting the substrate between them, an interlock means for stopping the transport mechanism when a work door provided on the housing is opened, an interlock release means for releasing the interlock means, A substrate processing apparatus, comprising: a control unit that sets a moving speed of the transport mechanism to a predetermined speed lower than that during normal processing when the interlock releasing unit is operated. 2. A substrate processing apparatus for performing predetermined processing on a substrate, comprising: a housing; a processing unit having a plurality of processing units for performing various processing on the substrate; An interface unit for transferring a substrate between the processing unit and another device; a first transfer mechanism disposed in the processing unit for transferring the substrate between processing units; and a processing unit disposed in the interface unit for performing the processing. A second transfer mechanism for transferring a substrate between the unit and the other device; and an interlock for stopping the first and second transfer mechanisms when a work door provided on a housing is opened. Means, interlock release means for releasing the interlock means, and when the interlock release means is actuated, the moving speed of the first transport mechanism, or the first and second transport mechanisms, is passed. The substrate processing apparatus characterized by comprising a control means for the slow predetermined speed than during processing. 3. A substrate processing apparatus for performing predetermined processing on a substrate, comprising: a housing; a processing unit having a plurality of processing units for performing various processing on the substrate; An interface unit for transferring a substrate between the processing unit and the another device; a loading / unloading unit for loading / unloading the substrate with respect to the processing unit; and a substrate disposed in the processing unit and transporting the substrate between processing units. A first transfer mechanism, a second transfer mechanism disposed in the interface unit, for transferring a substrate between the processing station and the other device; a second transfer mechanism disposed in the loading / unloading unit; Interlock means for stopping the first, second, and third transfer mechanisms when a third transfer mechanism for transferring the substrate between the first transfer mechanism and a work door provided on the housing is opened; Release the interlock means Interlock releasing means, and when the interlock releasing means is actuated, the moving speed of the first transport mechanism or the first and second transport mechanisms is set to a predetermined speed lower than that during normal processing. A substrate processing apparatus comprising: 4. The interlocking means stops each processing unit at the time of interlocking, and when the interlocking means is released by the interlock releasing means, the plurality of processing units are opened when the work door is opened. 4. The substrate processing apparatus according to claim 1, wherein at least one of the processing units is not stopped. 5. The interlock means stops each processing unit at the time of interlock, and when the interlock means is released by the interlock release means, the plurality of processing units are opened when the work door is opened. The substrate processing apparatus according to any one of claims 1 to 3, wherein the processing unit is kept stopped. 6. A substrate processing apparatus for performing a resist coating process on a substrate and a development process after exposure, comprising: a housing; a coating processing unit for performing a resist coating process on the substrate; A processing unit having a development processing unit for developing the pattern after the resist film is exposed in a predetermined pattern; and an interface unit to which an exposure apparatus is connected and for transferring a substrate between the processing unit and the exposure apparatus. A first transport mechanism disposed in the processing unit and transporting the substrate between the processing units; and a second transport mechanism disposed in the interface unit and transporting the substrate between the processing unit and the other device. A transport mechanism; interlock means for stopping the first and second transport mechanisms when a work door provided on a housing is opened; Interlock releasing means for releasing the means; and when the interlock is released by the interlock releasing means, the moving speed of the first transport mechanism or the first and second transport mechanisms is set to be higher than that during normal processing. And a control means for setting a predetermined low speed. 7. A substrate processing apparatus for performing a resist coating process on a substrate and a developing process after exposure, comprising: a housing; a coating processing unit for performing a resist coating process on the substrate; A processing unit having a development processing unit for developing the pattern after the resist film is exposed in a predetermined pattern; and an interface unit to which an exposure apparatus is connected and for transferring a substrate between the processing unit and the exposure apparatus. A loading / unloading unit for loading / unloading a substrate from / to the processing unit; a first transport mechanism disposed in the processing unit for transporting the substrate between processing units; and a processing unit located in the interface unit, A second transport mechanism for transporting the substrate between the apparatus and the other apparatus; and a third transporter disposed in the loading / unloading section and transporting the substrate to and from the processing section. Interlock means for stopping the first, second, and third transport mechanisms when a work door provided on the housing is opened; interlock release means for releasing the interlock means; A control unit for setting the moving speed of the first transport mechanism or the first and second transport mechanisms to a predetermined speed lower than that during normal processing when the interlock release unit is operated. A substrate processing apparatus characterized by the above-mentioned. 8. The interlock means stops the coating processing unit and the developing processing unit at the time of interlock, and opens the work door when the interlock means is released by the interlock release means. The substrate processing apparatus according to claim 6, wherein at least one of the coating processing unit and the developing processing unit is not stopped when the processing is performed. 9. The interlock means stops the coating processing unit and the developing processing unit during interlock, and opens the work door when the interlock means is released by the interlock releasing means. 8. The substrate processing apparatus according to claim 6, wherein the coating processing unit and the developing processing unit are stopped when the processing is performed. 10. A substrate processing apparatus for performing a predetermined process on a substrate, comprising: a housing; a processing unit having a plurality of processing units for performing various processes on the substrate; and a work door provided on the housing. When opening, the interlock means for stopping the plurality of processing units, the interlock release means for releasing the interlock means, and when the interlock release means is activated, the Control means for controlling at least one of them so as not to be stopped. 11. A substrate processing apparatus for performing a resist coating process and a development process after exposure on a substrate, comprising: a housing; a coating processing unit for performing a resist coating process on the substrate; A processing unit having a development processing unit that develops the resist film after the resist film is exposed in a predetermined pattern; and a coating unit and the development processing when a work door provided in a housing is opened. Interlock means for stopping the unit, interlock releasing means for releasing the interlock means, and when the interlock is released by the interlock releasing means, at least one of the coating processing unit and the developing processing unit Control means for controlling so as not to be stopped. . 12. The substrate processing apparatus according to claim 1, wherein the interlock release unit transmits a release signal to the interlock unit by a key operation. 13. A processing unit having a plurality of processing units for performing various types of processing on a substrate, a transport mechanism disposed in the processing unit and transporting the substrate between the processing units, and a work door provided on a housing. A maintenance method for a substrate processing apparatus for maintaining a substrate processing apparatus, comprising: an interlock means for stopping the transport mechanism when the transport mechanism is opened. A maintenance speed of the substrate processing apparatus, wherein the moving speed of the substrate is set to a predetermined speed lower than that in the normal processing. 14. A processing unit having a coating unit for performing a resist coating process on a substrate, and a developing unit for developing a pattern after a resist film formed by applying a resist solution is exposed to a predetermined pattern. An interface unit to which an exposure apparatus is connected and for transferring a substrate between the processing unit and the exposure apparatus; a first transport mechanism disposed in the processing unit and transporting a substrate between processing units; A second transfer mechanism that is disposed in the unit and transfers a substrate between the processing unit and the other device; and a first and a second transfer mechanism that opens a work door provided in a housing. A maintenance method for a substrate processing apparatus for maintaining a substrate processing apparatus, comprising: an interlock means for stopping a transfer mechanism. A maintenance method for the substrate processing apparatus, wherein the interlock means is released, and the moving speed of the first transfer mechanism or the first and second transfer mechanisms is set to a predetermined speed lower than that during normal processing. .