JP2012049199A - Light-emitting unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light-emitting unit having higher reliability with a simpler configuration.SOLUTION: A light-emitting unit 10 comprises: a unit body 1 which includes an optical lens unit 1a arranged on one end 10a side and a recessed portion 1b arranged on the other end 10b side, and which is integrally formed of a translucent material; a mounting substrate 3 provided with an LED 2 as a solid light-emitting element which is housed in the recessed portion 1b of the unit body 1 and emits light via the optical lens unit 1a; an electric wire 4 which is electrically connected to the LED 2 and is led out from the recessed portion 1b; and a sealing resin portion 5 which seals the mounting substrate 3 housed in the recessed portion 1b of the unit body 1 and part of the electric wire 4 into the recessed portion 1b. The sealing resin portion 5 has a plurality of recesses 5a and 5b which are recessed from the other end 10b side toward the mounting substrate 3 side.

Description

  The present invention relates to a light emitting unit that can be used, for example, as a light source for a signboard, a sign or a sign.

  Conventionally, in order to display signs, signs, and signs in a light emitting manner, for example, a light emitting device in which a plurality of light emitting units are attached to a mounting panel having a shape such as an advertising character or logo is provided. The entire mounting panel is irradiated.

  As a light emitting unit used in this type of light emitting device, for example, as shown in FIG. 6A, an optical lens portion 51a made of a translucent material is provided on one end side, and light is transmitted through the optical lens portion 51a inside. The mounting substrate 53 on which the solid-state light emitting element 52 that emits light is mounted, and a part of the power supply wire 54 (see FIG. 6B) that is electrically connected to the solid-state light emitting element 52 have elasticity. In addition, one stored in a unit body 51 molded with a white synthetic resin excellent in corrosion resistance and heat resistance is known (for example, see Patent Document 1). The solid-state light emitting element 52 includes an LED chip 52a that is electrically connected to the electric wire 54 via a joint portion (not shown) or the like in the housing recess 52ba of the package body 52b of the solid-state light emitting element 52. In addition, the light emitting unit 510 emits light from the mounting leg 43 having a locking claw 43a formed at the tip thereof for locking to the coupling hole of the mounting panel so that the light emitting unit 510 can be mounted to a mounting panel (not shown). The unit body 51 of the unit 510 is provided. Further, the light emitting unit 510 includes a bushing portion 41 (see FIG. 6B) that suppresses the occurrence of a gap between the unit body 51 and the electric wire 54. The light-emitting device 500 can be made to emit light by attaching each light-emitting unit 510 to a mounting panel having a predetermined shape according to advertising characters or logos, instead of being arranged in the above-described housing.

  The light emitting device 500 including a plurality of such light emitting units 510 emits neon light by causing the solid state light emitting elements 52 of the respective light emitting units 510 to emit light by the power from the power supply unit 526 as shown in FIG. The lifetime is longer than that of a light source such as a tube, and the frequency of replacement can be reduced. In addition, the light emitting device 500 is beginning to spread because the light emitting units 510 can be relatively freely arranged in a predetermined shape in accordance with the shape of the mounting panel, and thus can be easily implemented.

JP 2008-33270 A

  By the way, in the light emitting unit 510 described above, a part of the optical lens portion 51a, the mounting substrate 53 on which the solid light emitting element 52 is mounted, and a part of the electric wire 54 are molded in order to prevent moisture from entering from outside. It is sealed with a unit body 51 made of a synthetic resin such as polyester. When the entire unit body 51 of the light emitting unit 510 is formed by sealing with a synthetic resin mold, the light emitting unit 510 is generally a synthetic resin such as a thermosetting polyester having excellent heat dissipation properties like a metal material. However, since the amount of the synthetic resin is also large, it tends to take time to form the unit body 51.

  Therefore, the light emitting unit includes an optical lens portion provided on one end side and a recess portion provided on the other end side, and a unit body integrally formed in advance with a translucent material, and in the recess portion of the unit body. It is conceivable to provide a sealing resin portion in which a part of the solid light-emitting element and the electric wire is arranged and the inside of the hollow portion is sealed with a resin material made of synthetic resin. That is, the light emitting unit has a configuration in which a part of the function of the unit body that houses the solid light emitting element and a part of the electric wire is provided in the optical lens unit. As a result, since the optical lens unit and the unit body are integrally formed in the light emitting unit, a resin that forms a sealing resin unit for suppressing moisture intrusion from the outside with a simple configuration. The amount of material used can be reduced.

  However, in the light emitting unit, it is necessary for the optical lens unit to efficiently transmit light from the solid light emitting element, and there is a limitation on the light-transmitting material used for the optical lens unit. Therefore, there are few choices of the translucent material used for the unit body formed integrally with the optical lens unit. In addition, the light emitting unit is required to have airtightness, adhesiveness, and the like in a sealing resin portion that seals a hollow portion of a unit body formed integrally with the optical lens portion. Therefore, even when the light-emitting unit is formed on the unit body using a resin material as a translucent material, the resin material of the unit body and the resin material of the sealing resin portion that seals the inside of the recess portion have a thermal expansion coefficient. Are composed of different materials.

  Here, the light emitting unit generates heat as the solid light emitting element emits light, and the sealing resin portion that seals the recess of the unit body of the light emitting unit may thermally expand and contract. Therefore, in the light emitting unit, a soft sealing resin portion is defined in the unit body as compared with the unit body formed integrally with the optical lens portion, and there is a possibility that the sealing resin portion is deformed.

  In particular, in the light emitting unit, the amount of heat generated by the solid light emitting element tends to increase as the output of the solid light emitting element increases. Therefore, in the light emitting unit, the deformation of the sealing resin portion is caused by thermal expansion of the sealing resin portion due to heat generation during light emission of the solid light emitting element or thermal contraction due to cooling of the sealing resin portion when the fixed light emitting element is turned off. There is a risk of becoming larger.

  In the light emitting unit, the deformation of the sealing resin part displaces the mounting substrate housed inside, etc., so that the light use efficiency of the light emitted from the solid light emitting element through the optical lens part decreases and the light distribution characteristics change There is a risk of causing. In addition, the light emitting unit may be deteriorated in waterproofness due to deformation of the sealing resin portion, and moisture may enter from the interface between the unit body and the sealing resin portion.

  Therefore, at the present time when a light emitting unit with a simpler structure and higher reliability is required, the structure of the light emitting unit described above is not sufficient, and further improvements are required.

  The present invention has been made in view of the above-described reasons, and an object thereof is to provide a light emitting unit having a simpler configuration and higher reliability.

  The light-emitting unit of the present invention includes an optical lens portion provided on one end side and a recess portion provided on the other end side, and a unit body integrally formed of a light-transmitting material, and the inside of the recess portion of the unit body A mounting substrate having a solid-state light-emitting element that is housed in the optical lens unit and emits light through the optical lens unit, an electric wire that is electrically connected to the solid-state light-emitting element and led out from the indented part, and the indented part of the unit body A light emitting unit having a sealing resin part for sealing the mounting substrate housed in a part and a part of the electric wire in the hollow part, the sealing resin part being mounted from the other end side It has the several recessed part which fell down toward the board | substrate side, It is characterized by the above-mentioned.

  In the light emitting unit, the unit body includes a pair of gate portions that inject a resin material that becomes the sealing resin portion into the recess portion when the sealing resin portion is molded, and the pair of gate portions face each other through the recess portion. Preferably, the plurality of recesses are provided on the side wall of the unit body, and are provided in line symmetry with a straight line connecting the pair of gate portions as the symmetry axis on the other end side.

  In this light emitting unit, the concave portion is preferably a columnar cavity whose opening shape is circular.

  In this light emitting unit, the sealing resin portion is preferably made of a thermoplastic hot melt material.

  The light emitting unit of the present invention has a remarkable effect that a light emitting unit with a simpler configuration and higher reliability can be provided.

The light emitting unit of embodiment is shown, (a) is a schematic sectional drawing, (b) is a schematic perspective view, (c) is a schematic bottom view. It is a schematic explanatory drawing which shows the light-emitting device provided with the light emission unit in the same as the above. It is a schematic sectional drawing which shows the main manufacturing processes of the light emission unit in the same as the above. (A)-(c) is a schematic bottom view which shows the principal part of another light emitting unit in the same as the above. It is a graph which shows the temperature fall of the principal part in the main manufacturing process of the light emission unit in the same as the above. A prior art example is shown, (a) is a schematic sectional drawing of a light emitting unit, (b) is a schematic perspective view of the light-emitting device provided with the light emitting unit.

  Hereinafter, the light emitting unit 10 of the present embodiment will be described with reference to FIGS. 1 to 5. In addition, in each figure, the same number is attached | subjected with respect to the same component, and the overlapping description is abbreviate | omitted.

  As shown in FIG. 1, the light emitting unit 10 of the present embodiment includes an optical lens portion 1 a provided on one end 10 a side and a hollow portion 1 b provided on the other end 10 b side, and is integrally formed with a translucent material. The formed unit body 1, the mounting substrate 3 including the LED 2 that is a solid light emitting element that is accommodated in the recess 1b of the unit body 1 and emits light through the optical lens portion 1a, and the package body 2b of the LED 2 The LED chip 2a housed in the housing recess 2ba is electrically connected, and the power supply wires 4 and 4 to the LED chip 2a led out from the recess 1b and the recess 1b of the unit body 1 are provided. And a sealing resin portion 5 that seals a part of the mounting substrate 3 and the electric wires 4 and 4 housed therein.

  In particular, in the light emitting unit 10 of the present embodiment, the sealing resin portion 5 has a plurality of concave portions 5a and 5b that are depressed from the other end 10b side toward the mounting substrate 3 side.

  More specifically, in the light emitting unit 10 of the present embodiment, the unit body 1 is integrally formed with an optical lens part 1a provided on the one end 10a side and a hollow part 1b provided on the other end 10b side. The molded product. The molded product of the unit body 1 is formed using an acrylic resin, which is a translucent resin material, as the translucent material.

  Further, in the unit body 1 used in the light emitting unit 10 of the present embodiment, the optical lens portion 1a protrudes in a cylindrical shape from a rectangular parallelepiped body body portion 1ab (see FIG. 2), and the optical lens portion 1a Forms a mortar-shaped concave surface 1aa recessed inward. The optical lens unit 1a is aligned with the LED 2 such that the optical axis of the LED 2 coincides with the optical axis of the concave surface 1aa of the optical lens unit 1a. As a result, the light emitting unit 10 not only emits the light emitted from the LED 2 along the optical axis of the LED 2 but also refracts on the concave surface 1aa that is an interface between the optical lens portion 1a and air. It is possible to radiate the light emitting unit 10 as well.

  Further, the unit body 1 of the light emitting unit 10 has the LED 2 on the inner bottom surface side of the recessed portion 1b so that the light emitted from the LED 2 can be efficiently emitted to the outside of the light emitting unit 10 through the optical lens portion 1b. A smooth surface 1ad that can be in close contact with the light emitting surface side of the light emitting device is provided. The unit body 1 includes a mounting surface 3 on which the LED 2 is mounted by means of a smooth surface 1ad and a protruding portion 1ac protruding from the inner bottom surface side of the recess 1b of the unit body 1, and a light emitting surface side of the LED 2 and a unit body. It supports so that a clearance gap may not be formed between 1 smooth surface 1ad.

  As shown in FIG. 1C, the unit body 1 used in the light emitting unit 10 of the present embodiment has an outer shape on the other end 10b side opposite to the one end 10a side where the light of the LED 2 is emitted is approximately 20 mm ×. It has a rectangular shape in plan view of 20 mm and is provided with a recessed portion 1b that is recessed inward. The unit body 1 is provided with a notch 1d capable of accommodating each electric wire 4 led out from the inside of the recess 1b of the unit body 1 on the side wall of the recess 1b. Two cutouts 1d are provided on each side wall facing each other through a recess 1b in the rectangular unit body 1 in plan view. Moreover, the unit body 1 seals the inside of the hollow part 1b of the unit body 1 by a manufacturing process of the light emitting unit 10 to be described later on a pair of side walls orthogonal to the pair of side walls from which the electric wires 4 of the unit body 1 lead out. U-shaped gate portions 1c are respectively provided so that a resin material can be injected (see FIG. 1B). FIG. 1A shows a cross section taken along the line AA in FIG.

  The optical lens portion 1a of the unit body 1 in the light emitting unit 10 of the present embodiment is formed in a mortar-shaped concave surface 1aa which has a cylindrical outer shape and is recessed inward on the light emitting surface. Instead, various shapes such as a convex lens shape may be selected in accordance with desired light distribution characteristics. Further, the body main body portion 1ab of the unit body 1 is not limited to the outer shape on the other end 10b side, but may be a circular shape or a polygonal shape.

  In the light emitting unit 10 of the present embodiment, the unit body 1 is formed integrally with the optical lens portion 1a using an acrylic resin having excellent transmittance with respect to the light emitted from the LED 2. Such a unit body 1 can be compared by injection-molding acrylic resin into a mold that has been designed in advance so that it can have the shape of the unit body 1 having the optical lens portion 1a and the hollow portion 1b. Can be formed easily. In addition, as a translucent material of the unit body 1, what is necessary is just to use the translucent material which can discharge | emit the light from LED2 efficiently, and is not limited only to an acrylic resin. Therefore, as the translucent material of the unit body 1, for example, an epoxy resin, a silicone resin, glass, or the like can be used.

  Next, LED2 is used for the solid light emitting element used for the light emitting unit 10 of this embodiment. The LED 2 includes an LED chip 2a and a package body 2b in which the LED chip 2a can be arranged.

When the LED 2 is energized, a ceramic (with an LED chip 2a that emits blue light having a peak wavelength in the range of, for example, 420 nm to 490 nm, and a housing recess 2ba that houses the LED chip 2a provided on one surface is provided. For example, an alumina package body 2b is provided. The housing recess 2ba absorbs a part of the blue light emitted from the LED chip 2a and emits fluorescent light having a longer wavelength (for example, yellow light) (for example, Y ₃ Al activated by Ce). Translucent resin (for example, silicone resin) containing aluminate-based phosphors such as Tb ₃ Al ₅ O ₁₂ activated by ₅ O ₁₂ or Ce and Ba ₂ SiO ₄ activated by Eu , An epoxy resin, an acrylic resin, a polycarbonate resin, or the like). Further, the LED 2 is provided with an external connection electrode (not shown) on the other surface of the package body 2b, and the external connection electrode and the conductor pattern (not shown) of the mounting substrate 3 are made of solder. Are electrically connected via a joint (not shown). The light emitted from the LED chip 2a can be, for example, blue light having high energy among visible light, but is not limited to only blue light. The LED chip 2a may use ultraviolet light or light of other wavelengths in order to efficiently excite the phosphor of the wavelength conversion member 2c. Examples of the LED chip 2a include those having a gallium nitride compound semiconductor layer having a pn junction on a crystal growth substrate such as a sapphire substrate, a gallium nitride substrate, or a silicon carbide substrate.

  The LED 2 uses a pair of conductive patterns (not shown) provided on the inner bottom surface of the package body 2b, and the conductive pattern is electrically connected to the external connection electrode, whereby the LED chip 2a is energized. Can be configured. As the outer peripheral shape of the package body 2b, for example, a rectangular shape can be used. The housing recess 2ba in the package main body 2b is opened in a circular shape, and the opening area gradually increases as the distance from the inner bottom surface increases. The light emitted from the LED chip 2a to the side by the inner side surface is emitted from the optical lens portion 1a. It constitutes a reflective surface that reflects to the side. The package body 2b having such a housing recess 2ba can be formed not only from a ceramic one but also from a molded product of a resin containing a white pigment.

  The translucent resin includes not only a phosphor that absorbs a part of the light from the LED chip 2a and emits longer-wavelength fluorescence, but also a diffusing material made of silicon oxide, aluminum oxide, or the like, and various colorings. An agent may be included. Further, as the phosphor of the wavelength conversion member 2c, for example, a plurality of types of phosphors may be used in various ways as desired, for example, to improve color adjustment and color rendering. That is, the phosphor used for the wavelength conversion member 2c is not limited to the yellow phosphor, and may include, for example, a red phosphor and a green phosphor.

  By the way, in the light emitting unit 10 of this embodiment, LED2 which light-emits white is used as a solid light emitting element, However, The light emission color of LED2 is not restricted to white, For example, red, orange, yellow, green, blue, etc. may be sufficient. . Further, the solid light emitting element is not limited to the LED 2, and an organic EL (Electroluminescence) element may be used.

  In the light emitting unit 10 of the present embodiment, one LED 2 is mounted on the front surface 3a side of the mounting substrate 3. However, the number of LEDs 2 is not limited to one, and a plurality of LEDs 2 may be used. In this case, each LED 2 may be electrically connected in series, parallel, or series-parallel as appropriate. Furthermore, the same type of LED 2 may be used, or a plurality of LEDs 2 that emit different emission wavelengths may be used. For example, a configuration of the light emitting unit 10 including three types of LEDs 2 capable of emitting red light, green light, and blue light for the purpose of changing the emission color, for example, may be employed.

  In the light emitting unit 10 of the present embodiment, the mounting substrate 3 is configured by a printed wiring board in which an appropriate conductor pattern is formed on an insulating base material made of glass epoxy resin or the like. Note that not only the LED 2 but also a Zener diode that is connected in antiparallel with the LED 2 and prevents electrostatic destruction of the LED 2 may be mounted on the mounting substrate 3. In addition, the mounting substrate 3 is formed with a through hole (not shown) in order to connect the flexible electric wire 4. The mounting board 3 is formed with four lands (not shown) having a circular outer periphery around each through hole on the surface 3a of the mounting board 3 via the conductor pattern. Of the four lands formed on the mounting substrate 3, a conductor connected to the land connected to the upper left electric wire 4 and the land connected to the upper right electric wire 4 on the paper surface of FIG. The LED 2 is arranged through the pattern and the external connection electrode. Similarly, of the four lands, the land connected to the lower left electric wire 4 and the land connected to the lower right electric wire 4 on the paper surface of FIG. For the feed wiring.

  The light emitting unit 10 of the present embodiment uses an electric wire in which a single core wire is covered with an insulating coating as the electric wire 4. More specifically, the electric wire 4 has high heat resistance and excellent corrosion resistance, such as a fluororesin-coated copper wire (for example, a Fulbon electric wire) in which the core wire is formed of a copper wire and the insulating coating is formed of a fluororesin film. Something is used. The electric wire 4 is formed by inserting the copper wire portion exposed by peeling the fluororesin film through the through hole from the back surface 3b side of the mounting substrate 3, and by the solder portion (not shown) made of solder on the front surface 3a side of the mounting substrate 3 described above. It is joined with the land.

  The light emitting unit 10 of the present embodiment is formed by using a thermoplastic polyester resin as a resin material for the mounting substrate 3 including the LED 2 housed in the recess 1b of the unit body 1 and a part of the electric wires 4 and 4. The sealing resin portion 5 is sealed. Since the light emitting unit 10 includes the optical lens portion 1a and the hollow portion 1b and uses the unit body 1 integrally formed of a light-transmitting material, the amount of the resin material for sealing is small, and sealing is performed. It is possible to shorten the time required for molding the sealing resin portion 5 formed using the resin material for use (cooling time of the resin material).

The sealing resin portion 5 used in the light emitting unit 10 of the present embodiment is solid at normal temperature, and is liquefied by being melted by heating and attached to the recess portion 1b of the unit body 1, and the recess portion 1b is formed by cooling and solidification. It is formed using a thermoplastic hot melt material that can be sealed. In the light emitting unit 10 of the present embodiment, the thermoplastic polyester resin that is a thermoplastic hot melt material is used as the resin material of the sealing resin portion 5, but is not limited to the thermoplastic polyester resin.
The sealing resin portion 5 of the light emitting unit 10 can also be formed using other thermoplastic hot melt materials such as polyolefin resin, polyamide resin, and reactive urethane resin as a resin material. Thereby, the light emitting unit 10 of this embodiment has a low viscosity of the resin material while shortening the cooling time of the resin material as compared with the case where the sealing resin portion 5 is molded using the thermosetting resin. It is also possible to reduce molding defects due to curing during injection during low speed molding due to the above.

  The light emitting unit 10 of the present embodiment includes a plurality of concave portions 5a and 5b in which the sealing resin portion 5 is depressed from the other end 10 side of the light emitting unit 10 toward the mounting substrate 3 side. The recesses 5 a and 5 b are provided in the sealing resin portion 5 so that the depth of all the recesses 5 a and 5 b does not reach the mounting substrate 3 in the recess 1 b of the unit body 1. Thereby, the light emitting unit 10 of this embodiment can improve waterproofness and insulation even in an environment exposed outdoors.

  That is, in the light emitting unit 10 of the present embodiment, even if the sealing resin portion 5 is heated by heat generated by the light emission of the LED 2 and thermal expansion occurs in the sealing resin portion 5 or the like, the recesses 5a and 5b are formed in the sealing resin portion. The deformation of the sealing resin portion 5 accompanying the thermal expansion of 5 can be suppressed. The recesses 5a and 5b can contribute to suppressing stress generated at the interface between the sealing resin part 5 and the unit body 1 due to thermal expansion of the sealing resin part 5 and the like. As a result, the light emitting unit 10 of the present embodiment has a change in the light use efficiency of the light emitted from the LED 2 and the light distribution characteristics due to the displacement of the mounting substrate 3 due to the deformation of the sealing resin portion 5 or the like. It is possible to suppress the occurrence. Similarly, the light emitting unit 10 of the present embodiment has a waterproof property that is reduced due to the deformation of the sealing resin portion 5, and prevents moisture from entering from the interface between the unit body 1 and the sealing resin portion 5. Is possible.

  In addition, the light emitting unit 10 of this embodiment may be appropriately provided with a bushing portion that suppresses a gap between the electric wire 4 and the unit body 1 through which the electric wire 4 connected to the mounting substrate 3 is inserted.

  For example, as shown in FIG. 2, the light emitting device 20 including the light emitting unit 10 according to the present embodiment includes a plurality of (here, four) light emitting units 10 connected by flexible wires 4. 10 is configured to be inserted into a window hole 30 a penetrating the mounting plate 30 from the rear surface side of the mounting plate 30 and mounted using a fixing spring 31.

  The light emitting unit 10 of the present embodiment is configured by attaching each light emitting unit 10 to the mounting plate 30 by a fixing spring 31 including a central piece 33 made of a V-shaped leaf spring and continuously connecting both leg pieces 32 and 32, for example. Can be attached to. The fixing spring 31 is arranged in such a manner that the central piece 33 abuts on the other end 10 b side of the light emitting unit 10. The fixing spring 31 is arranged so that the central piece 33 of the fixing spring 31 is sandwiched between the pair of protrusions 5c, 5c of the light emitting unit 10 (see FIG. 1B).

  In the fixing spring 31, the central piece 33 is bent in a V shape so that the distance between the leg pieces 32, 32 becomes longer as the distance between the leg pieces 32, 32 approaches each other (see FIG. 2). For example, the fixing spring 31 can displace the tip portions of both leg pieces 32, 32 to the respective recesses 1 ae provided on the outer surface of the unit body 1, and the central piece 33 is a pair of the sealing resin portion 5. Are arranged so as to be sandwiched between the protrusions 5c, 5c. In addition, the fixing spring 31 has locking claws 32a and 32a that can be locked to the peripheral portion of the window hole 30a on the front surface side of the mounting plate 30 at the other end of both leg pieces 32 and 32 in an integrated manner. . The fixing spring 31 can be formed by bending a stainless spring steel plate having excellent corrosion resistance and high spring properties. Note that the bending angle of the locking claws 32 a and 32 a is not particularly limited, and may be an appropriate bending angle at which the light emitting unit 10 can be held on the mounting plate 30.

  In addition, the mounting plate 30 to which the light emitting unit 10 of the present embodiment is attached may be formed by arranging circular window holes 30a along a predetermined shape to be displayed by the light emitting device 20. In the mounting plate 30, the inner diameter of each window hole 30 a is set to be slightly larger than the outer diameter of the optical lens portion 1 a in the unit body 1. Note that the surface of the mounting plate 30 may be covered with a white pigment or the like so that the light refracted and irradiated by the concave surface 1aa of the optical lens portion 1a of the light emitting unit 10 can be efficiently reflected.

  The light emitting unit 10 displaces both leg pieces 32 and 32 of the fixing spring 31 to the recess 1ae side of the unit body 1 so that the light emitting unit 10 can be easily inserted into the window hole 30a when the light emitting unit 10 is attached to the mounting plate 30. In the light emitting unit 10, the locking claws 32 a and 32 a of the fixing spring 31 are attached to the rear surface of the mounting plate 30 together with the optical lens portion 1 a of the unit body 1 in a state where both the leg pieces 32 and 32 of the fixing spring 31 are displaced. It inserts into the window hole 30a from the side. Thereafter, in the light emitting unit 10, the locking claws 32 a and 32 a at the distal ends of the leg pieces 32 and 32 are locked to the peripheral portion of the window hole 30 a on the front side of the mounting plate 30 by the spring force of the fixing spring 31. Accordingly, the light emitting unit 10 can be attached to the attachment plate 30 relatively easily.

  The light emitting unit 10 can be detachably attached to the attachment plate 30 from one direction without using a tool such as a driver, an adhesive, a dedicated socket, or the like by using the fixing spring 31. Further, by setting the total length of the electric wires 4 between the light emitting units 10 longer than the arrangement pitch of the window holes 30a in the mounting plate 30, the arrangement density of the light emitting units 10 on the mounting plate 30 can be easily changed. It becomes possible.

  The light emitting device 20 including a plurality of light emitting units 10 has the light emitting units 10 electrically connected in series. For example, the power unit 26 converts AC power from an external commercial power source into DC power. Are configured to be supplied to the light emitting unit 10. That is, the light emitting device 20 defines the electrical connection relationship with the electric wires 4 so that the plurality of light emitting units 10 are electrically connected in series.

  The power supply unit 26 includes a rectifier circuit including a diode bridge that rectifies and smoothes AC power from a commercial power supply, a smoothing capacitor that smoothes the output of the rectifier circuit, and outputs the smoothing capacitor to each light emitting unit 10 as a power source. A circuit board on which a constant current circuit for supplying a constant current is formed is provided inside a waterproof structure.

  The power supply unit 26 is provided with a first connector portion 28 at the ends of a pair of electric wires 27, 27 connected to the output side of the constant current circuit. On the other hand, the plurality of light emitting units 10 are provided with second connector portions 34 that are detachably connected to the first connector portion 28 at the tips of the electric wires 4 and 4 at both ends of the series circuit. Here, the 1st connector part 28 and the 2nd connector part 34 are set as the structure which can be waterproofed by making it connect. In the light emitting device 20, when the power supply unit 26 and the plurality of light emitting units 10 are separated from each other, the first connector 28 on the power supply unit 26 side and the second connector 34 on the plurality of light emitting units 10 side. An extension harness (not shown) may be appropriately provided between the two.

  Next, the main manufacturing process of the light emitting unit 10 of this embodiment is demonstrated using FIG.

  In the light emitting unit 10 according to the present embodiment, when the light emitting unit 10 is formed, the mounting substrate 3 including the LEDs 2 and a part of the electric wires 4 are disposed in the hollow portion 1b of the molded product of the unit body 1 formed in advance. Thus, it is housed in the pair of molds 21 and 22.

  The mold 21 is provided with cylindrical pins 23 and 24 that protrude into the recess 1b. Here, the pin 23 provided in the mold 21 is movable and configured to be able to press the back surface 3b side of the mounting substrate 3 housed in the recess 1b. That is, in the manufacturing process of the light emitting unit 10 according to the present embodiment, the substrate pressing process (in which the light emitting surface side of the LED 2 provided on the surface 3a side of the mounting substrate 3 is brought into contact with the smooth surface 1ad side of the unit body 1 by the pins 23 ( (See FIG. 3A). The pin 25 is non-movable and fixed to the mold 21 and is separated from the back surface 3 b of the mounting substrate 3.

  Next, a resin material to be the sealing resin portion 5 is injected from the gate portions 1c and 1c provided on the side walls (perpendicular to the paper surface of FIG. 3A) of the unit body 1 facing each other through the recess portion 1b. Let

  Here, in the light emitting unit 10 of the present embodiment, the resin material spreads from the gate portions 1c, 1c of the unit body 1 to the entire molds 21, 22 while ensuring the fluidity of the resin material to be the sealing resin portion 5. Thus, the arrangement of the recesses 5a and 5b is designed.

  That is, the light emitting unit 10 of the present embodiment includes a pair of gates into which a plurality of concave portions 5a and 5b are injected with a resin material that becomes the sealing resin portion 5 when the sealing resin portion 5 is molded on the other end 10b side. A straight line connecting the portions 1c and 1c is provided symmetrically about the axis of symmetry (see the broken line in FIG. 1C).

  The recesses 5a and 5b in the light emitting unit 10 of the present embodiment use the cylindrical pins 23 and 24 protruding into the recess 1b, so that the opening shape of the recesses 5a and 5b is circular in the sealing resin portion 5. A columnar cavity is formed. The light emitting unit 10 has a circular shape in the recesses 5a and 5b, so that the molds 23 and 24 that are inserted into the molds 21 and 22 to form the recesses 5a and 5b are separated from the sealing resin portion 5. It becomes possible to make it excellent. Moreover, the pins 23 and 24 can also function to suppress the fluidity of the resin material injected from the gate portions 1c and 1c from being lowered by making the pins 23 and 24 cylindrical. Thereby, the pins 23 and 24 can suppress the maintenance frequency of the pins 23 and 24 and improve maintainability.

  In the light emitting unit 10 of the present embodiment, the unit body 1 is formed by using a translucent resin material formed integrally with the optical lens portion 1a. The unit body 1 formed of a translucent resin material has a lower thermal conductivity than a metal material or the like, and the unit body 1 itself is not good in heat dissipation. Therefore, the light emitting unit 10 tends to be hard to be cooled because the heat of the resin material constituting the sealing resin portion 5 injected into the hollow portion 1b of the unit body 1 is trapped in the hollow portion 1b.

  However, in the light emitting unit 10 of the present embodiment, in the molding process of the sealing resin portion 5, not only the concave portion 5b provided in the central portion but also the concave portions 5a are provided in the corner portions, thereby improving the cooling time of the resin material. Can be shortened. Moreover, the light emitting unit 10 of this embodiment can also reduce the usage-amount of the resin material which comprises the sealing resin part 5 by providing several recessed part 5a, 5b in the sealing resin part 5. FIG.

  Therefore, the light emitting unit 10 of the present embodiment is provided with a plurality of recesses 5a and 5b in the sealing resin portion 5 so that the resin material injected from the gate portion 1c of the unit body 1 when the sealing resin portion 5 is molded. It is possible to shorten the cooling time for cooling.

  In the light emitting unit 10 of the present embodiment, the recesses 5a and 5b are columnar cavities with circular openings. Note that the columnar cavities are not limited to columnar cavities, and can be appropriately formed into cavities such as a truncated cone shape and a truncated pyramid shape. As specific dimensions of the recesses 5a and 5b, for example, each of the openings has a circular shape with a diameter of 2.5 mm, and a columnar cavity with a depth of 2.6 mm ensures insulation and waterproofness. Moreover, each recessed part 5a is formed in the four corners used as the corner part of the hollow part 1b at intervals of 13 mm. In addition, the pin 23 corresponding to one recess 5b provided in the center portion shifted by 2.5 mm from the center of the light emitting unit 10 to the one gate portion 1c side allows the mounting substrate 3 to be attached to the unit body 1 when the light emitting unit 10 is molded. The mounting substrate 3 is prevented from being lifted from the inner bottom surface side of the recess portion 1b by restraining it to the inner bottom surface side of the recess portion 1b.

  Thereby, the back surface 3b side of the mounting substrate 3 is pressed, and the light emitting surface side of the LED 2 provided on the front surface 3a side of the mounting substrate 3 can be brought into contact with the smooth surface 1ad side of the unit body 1. Therefore, the finally formed light emitting unit 10 can efficiently emit light from the LED 2 to the outside of the light emitting unit 10 through the optical lens portion 1a.

  Next, the manufacturing process of the light emitting unit 10 is performed in such a manner that the pin 23 that forms the recess 5b in the pair of molds 21 and 22 cools and solidifies the resin material that becomes the sealing resin portion 5. A pin separation step is provided to move the back surface 3b away from the back surface 3b side (see FIG. 3B).

  Thereby, the pin 23 provided in the center part can form the recessed part 5b by the depth by which the hollow part 1b of the unit body 1 is sealed, without exposing the back surface 3b side of the mounting substrate 3 to an external environment. . In the manufacturing process of the light emitting unit 10 of this embodiment, in the substrate pressing step, the pin 23 is inserted from the other end 10b side of the light emitting unit 10 to a depth of 4.7 mm to press the back surface 3b side of the mounting substrate 3. . Further, in the pin separation step, the concave portion 5b is formed by separating the pin 23 from the back surface 3b of the mounting substrate 3 to the depth of 2.6 mm from the other end 10b side of the light emitting unit 10.

  In the light emitting unit 10 of the present embodiment, a plurality of (six in this case) recesses 5a and 5b are provided symmetrically about a straight line connecting a pair of gate portions 1c and 1c into which a resin material is injected. Thus, the pins 23 and 24 forming the recesses 5a and 5b provided in the mold 21 suppress the decrease in the fluidity of the resin material and suppress the decrease in the mass productivity when the light emitting unit 10 is manufactured. It becomes possible to do.

  The other four recesses 5a provided at the corners are formed by the pins 24 at the same depth as the recesses 5b formed by the pins 23 as the resin material is injected and the resin material is cured. Yes. The recess 5a can be formed by providing a pin 24 that is fixed in advance on the inner surface of the mold 21 in accordance with the position, shape, and size of the recess 5a formed in the sealing resin portion 5.

  Therefore, the plurality of recesses 5a and 5b on the other end 10b side of the light emitting unit 10 are not limited to the arrangement shown in FIG. 1C, and for example, as shown in FIG. As a symmetry axis connecting 1c and 1c (see the broken line in FIG. 4A), a total of three recesses 5a and 5b may be provided on the symmetry axis in line symmetry. Here, the recess 5b formed by the pin 23 that presses the mounting substrate 3 toward the unit body 1 when the sealing resin portion 5 is molded has a rectangular outer shape so that a force is applied to the mounting substrate 3 substantially evenly. The unit body 1 is arranged at the center. In addition, the recesses 5a and 5a provided in the vicinity of the gate portions 1c and 1c suppress the decrease in the injection speed of the resin material when the resin material is injected from the gate portions 1c and 1c, and the recess portion of the unit body 1 It arrange | positions so that the flow of the resin material can be produced in the corner part direction (left-right direction of Fig.4 (a)) in 1b.

  The light emitting unit 20 shown in FIG. 4B has a total of five recesses 5a and 5b in line symmetry with a straight line connecting the pair of gate portions 1c and 1c as an axis of symmetry (see the broken line in FIG. 4B). Provided. Here, one recess 5b formed by the pin 23 that presses the mounting substrate 3 toward the unit body 1 when the sealing resin portion 5 is molded has a rectangular outer shape so that a force is applied to the mounting substrate 3 substantially evenly. It is arranged at the center of the unit body 1 having a shape. The remaining four recesses 5a are provided at the four corners of the recess 1b of the rectangular unit body 1, respectively. As a result, the light emitting unit 20 shown in FIG. 4B shortens the cooling time required for molding the sealing resin portion 5 as compared with the light emitting unit 20 shown in FIG. It is possible to further reduce the internal stress accompanying the thermal expansion or the like.

  The light emitting unit 20 shown in FIG. 4C has a total of seven concave portions 5a and 5b in line symmetry with a straight line connecting the pair of gate portions 1c and 1c as an axis of symmetry (see the broken line in FIG. 4C). Provided. The recesses 5a and 5b in FIG. 4C are arranged so that the recesses 5a are substantially aligned with the position of the recess 5a in FIG. 4A and the position of the recess 5a in FIG. Here, in order to increase the force for pressing the mounting substrate 3, the recess 5b has a circular shape with an opening shape of 4 mm in diameter, and a circular shape with a diameter of 2.5 mm in the opening shape of a plurality of (in this case, six) recesses 5a. Is bigger than. Therefore, the sizes of the recesses 5a and 5b are not necessarily the same.

  Thereby, the light emitting unit 10 forms the flow of the resin material in the four corners of the recess 1b of the rectangular unit body 1 while suppressing a decrease in the injection speed of the resin material when the resin material is injected. Can do. Further, the light emitting unit 10 can reduce the cooling time required for molding the sealing resin portion 5 and further reduce internal stress accompanying thermal expansion of the sealing resin portion 5. In addition, in each light emitting unit 10 shown in FIG. 4, although a pair of projection part 5c, 5c in the light emitting unit 10 shown in FIG.1 (c) is not provided, what is necessary is just to provide suitably as needed.

  In addition, the result of having measured the temperature of the resin material at the time of shaping | molding which forms the light emission unit 10 is shown in FIG. 5 indicates the temperature drop of the resin material during molding of the sealing resin portion 5 in the light emitting unit shown for comparison with the light emitting unit 10 of the present embodiment. The light emitting unit shown for comparison is formed in the same manner as the light emitting unit 10 of FIG. 1 except that the light emitting unit 10 shown in FIG. Moreover, the solid line in FIG. 5 has shown the temperature fall of the resin material at the time of shaping | molding of the sealing resin part 5 in the light emission unit 10 of this embodiment shown in FIG. As is clear from the graph of FIG. 5, the light emitting unit 10 of the present embodiment in which the sealing resin portion 5 shown in FIG. 1 has six recesses 5 a and 5 b has the recess 5 a at the center of the sealing resin portion 5. It can be seen that the temperature drop of the resin material is accelerated compared to the light emitting unit for comparison provided in only one. From the graph of FIG. 5, the light emitting unit 10 of the present embodiment is intended to shorten the time required for the temperature of the resin material to decrease from 200 ° C. to 100 ° C. by 12 seconds compared to the light emitting unit for comparison. Can do. Therefore, the light emitting unit 10 of the present embodiment can reduce the cost by improving the mass productivity of the light emitting unit 10 by reducing the time required for molding the sealing resin portion 5.

  As described in detail above, the light emitting unit 10 of the present invention can be a light emitting unit 10 having a simpler configuration and higher reliability.

DESCRIPTION OF SYMBOLS 1 Unit body 1a Optical lens part 1b Recessed part 1c Gate part 2 LED (solid light emitting element)
3 Mounting substrate 4 Electric wire 5 Sealing resin part 5a, 5b Concave part 10 Light emitting unit 10a One end 10b The other end

Claims (4)

A unit body integrally formed of a translucent material with an optical lens portion provided on one end side and a recess portion provided on the other end side; and the optical lens portion housed in the recess portion of the unit body A mounting substrate including a solid light emitting element that emits light through the wire, an electric wire that is electrically connected to the solid light emitting element and led out from the hollow portion, and the mounting housed in the hollow portion of the unit body A light-emitting unit having a sealing resin portion for sealing a substrate and a part of the electric wire in the hollow portion,
The light-emitting unit, wherein the sealing resin portion has a plurality of recesses that are recessed from the other end side toward the mounting substrate side.   The unit body has a pair of gate portions for injecting a resin material to be the sealing resin portion into the recess portion when the sealing resin portion is molded, on the side walls of the unit body facing each other through the recess portion. 2. The light emitting unit according to claim 1, wherein the plurality of concave portions are provided in line symmetry with respect to a straight line connecting the pair of gate portions as a symmetry axis on the other end side. .   The light emitting unit according to claim 1, wherein the concave portion is a columnar cavity having a circular opening shape.   The light emitting unit according to claim 1, wherein the sealing resin portion is made of a thermoplastic hot melt material.

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