JP2012045682A - Fixed abrasive grain wire saw device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve a problem that in a conventional fixed abrasive grain wire saw device, although there is a technique of blowing off sludge and the like clogged in a wire surface by installing a jetting means that jets a high pressure fluid or an ultrasonic vibration fluid toward a fixed abrasive grain wire running at high speed, or although there is a device of imparting ultrasonic vibration through air or a machining liquid to the wire lines running at high speed, sufficient cleaning effects cannot be obtained in any case of them.SOLUTION: An ultrasonic vibration generator is arranged in the running passage of a fixed abrasive grain wire and an applicator installed in the ultrasonic vibration generator is brought into contact with the running fixed abrasive grain wire to directly apply the ultrasonic vibration to the fixed abrasive grain wire.

Description

  The present invention relates to a fixed abrasive wire saw device that can be used for cutting brittle materials such as semiconductor materials, magnetic materials, and ceramics.

  One conventional apparatus for cutting an ingot of silicon, glass, ceramic, brittle metal or the like into a wafer is a fixed abrasive wire saw.

In this fixed abrasive wire saw, a wire row is formed by a fixed abrasive wire in which abrasive grains such as CBN and diamond are fixed on the surface of the wire, and this wire row is run at a high speed. By pressing, the ingot can be sliced into a wafer.
When cutting an ingot with such a fixed abrasive wire saw, the biggest problem is clogging that occurs in the fixed abrasive wire.

As a measure to prevent this clogging, there is a technology to inject high-pressure fluid toward the fixed abrasive wire to blow off sludge etc. clogged on the wire surface, and furthermore, ultrasonic vibration is applied to this high-pressure fluid. There is a technique for giving more efficient sludge and the like (see, for example, Patent Document 1).
There is also a device that applies ultrasonic vibration to a fixed abrasive wire that travels at high speed via air or a working fluid (see, for example, Patent Document 2).

JP-A-11-70456 JP 2001-62700 A

  However, in the above-described conventional technology, the former cannot obtain a sufficient cleaning effect for a fixed abrasive wire traveling at high speed, and even if ultrasonic vibration is applied to the fluid, the fixed abrasive wire However, there is a problem that sufficient vibration is not transmitted, the cleaning effect is small, and the workability is deteriorated at the final stage of processing.

In the latter case, since the ultrasonic vibration is transmitted to the fixed abrasive wire through the air or the processing liquid, sufficient vibration is not transmitted to the fixed abrasive wire, and the cleaning effect is small and the processing is not improved. There's a problem. Furthermore, there is a problem that an apparatus for applying ultrasonic vibration to a fixed abrasive wire via air or a working fluid becomes an extremely large apparatus.
An object of the present invention is to solve such a problem.

  Therefore, the present invention forms a wire array by winding a fixed abrasive wire having abrasive grains fixed on the surface of the wire around a plurality of processing rolls, and pushes the workpiece while reciprocating the fixed abrasive wire. In a fixed abrasive wire saw device that cuts a workpiece into a wafer by applying, an ultrasonic vibration generator is arranged in the traveling path of the fixed abrasive wire, and the metal or synthetic provided in the ultrasonic vibration generator An applicator such as a resin thin plate is brought into contact with the traveling fixed abrasive wire to directly apply ultrasonic vibration of 15 kHz or more to the fixed abrasive wire.

  Furthermore, a wire cleaning device is disposed in the traveling path of the fixed abrasive wire to clean the wire after passing through the workpiece.

  According to the present invention as described above, the fixed abrasive wire is cut by cutting the workpiece by directly applying ultrasonic vibration of 15 kHz or more to the fixed abrasive wire traveling by the applicator provided in the ultrasonic vibration generator. Thus, sludge and the like remaining on the surface can be reliably removed by ultrasonic vibration. Furthermore, the machinability equivalent to ultrasonic cutting is obtained by the directly applied ultrasonic vibration, and the cutting effect of the wafer is improved.

  In addition, by removing sludge and the like remaining on the surface of the fixed abrasive wire with a wire cleaning device after processing the workpiece, the consumption of the fixed abrasive wire can be suppressed. Wire breakage can be prevented and the life of the fixed abrasive wire can be extended. In particular, when the fixed abrasive wire is used in a reciprocating manner, the workpiece is often cut. In such a case, the life of the fixed abrasive wire is greatly increased.

Explanatory drawing which shows an Example Wire row configuration diagram Illustration of ultrasonic generator Illustration of ultrasonic generator

Embodiments of the present invention will be described below with reference to the drawings.
FIG. 1 is an explanatory view showing an embodiment.
The fixed abrasive wire 2 of the fixed abrasive wire saw device 1 is wound around a pair of wire reels 3A and 3B, and is guided by a plurality of guide rollers 4 disposed between the pair of wire reels 3A and 3B. It is supposed to run.

  That is, the pair of wire reels 3A and 3B are connected to a motor (not shown), and the fixed abrasive wire 2 reciprocates between the pair of wire reels 3A and 3B by rotating the pair of wire reels 3A and 3B. Run.

  As shown in FIG. 2, the fixed abrasive wire 2 traveling reciprocally includes a plurality of spindle rollers 5A, 5B, and 5C arranged between a pair of wire reels 3A and 3B. In this embodiment, each axis forms a triangle. It is wound around its respective spindle rollers arranged in parallel. A spiral groove having a predetermined pitch is formed on the peripheral surface of each of the main shaft rollers 5A, 5B, and 5C, and a fixed abrasive wire 2 is wound around the groove to form a wire row 6. .

  Between the main shaft rollers 5A, 5B, and 5C and the wire reels 3A and 3B, there is a traverse device 7 that can move the roller in the axial direction to stabilize the traveling of the fixed abrasive wire 2, and further the traverse device A dancer roller 8 for adjusting the fixed abrasive wire 2 running between the wire 7 and the wire row 6 to have a constant tension is disposed. In the above description, the traverse device 7 is arranged between the wire reels 3A and 3B, but only one of them may be arranged.

  A work table 10 for mounting an ingot 9 as a workpiece is arranged along the wire row 6. The work table 10 is driven by a table feeding device (not shown) and moves the ingot 9 relative to the wire row 6.

  That is, when the fixed abrasive wire 2 is driven by driving a motor (not shown) connected to the wire reels 3A and 3B, and the traveling of the fixed abrasive wire 2 is stabilized, the work table 10 to which the ingot 9 is attached is connected to the wire row 6. Move towards. This presses against the wire row 6 that travels through the ingot 9. The ingot 9 pressed against the wire row 6 is ground by the fixed abrasive wire 2 constituting the wire row 6 and can be cut into a plurality of wafers.

  Between the main shaft rollers 5B and 5C, one or a plurality (two in this embodiment) of ultrasonic vibration horns 11, which are ultrasonic vibration generators, are arranged, and each of the ultrasonic vibration horns 11 is disposed. An applicator 12 made of a metal or synthetic resin thin plate that can be removed and replaced is attached.

  The applicator 12 is brought into contact with the fixed abrasive wire 2 on which the wire row 6 is traveling, and ultrasonic vibrations of 15 kHz or more are directly applied to the fixed abrasive wire 2 to adhere to the surface of the fixed abrasive wire 2. The sludge and the like that have been removed can be shaken off, thereby eliminating clogging of the surface and preventing deterioration of the machinability. In addition, the attachment position of the vibrator 13 in the ultrasonic vibration horn may be an arbitrary position such as a side surface or an upper surface of the ultrasonic vibration horn main body as shown in FIGS.

Further, a wire cleaning device 14 is provided between the wire reel 3A and the main shaft roller 5A and between the wire reel 3B and the main shaft roller 5A, and the fixed abrasive wire 2 traveling reciprocally passes through the wire cleaning device. Thus, sludge and the like remaining on the surface of the fixed abrasive wire 2 are removed by the cleaning liquid. Thereby, disconnection of the fixed abrasive wire 2 is prevented and durability is improved. In addition, by arranging the ultrasonic vibration generating device 15 in the wire cleaning device 14, it becomes possible to further enhance the cleaning effect.
By the above, the fixed abrasive wire saw apparatus of a present Example is comprised.

Below, the usage example of the fixed abrasive wire saw apparatus by the said structure is demonstrated.
Example of use After cutting the ingot while applying ultrasonic vibration directly to the fixed abrasive wire saw of the wire row through the thin plate of the ultrasonic vibration horn, after performing cutting and ultrasonic cleaning in the wire cleaning tank The roughness of the cut surface and the wire diameter of the fixed abrasive wire were measured. Cutting conditions are an average speed of 300 m / min, a table speed of 0.3 m / min, and a wire diameter of 0.14 mm.

Comparative Example After cutting the ingot with a fixed abrasive wire, the roughness of the cut surface of the fixed abrasive wire and the wire diameter of the fixed abrasive wire were measured. The cutting conditions are the same as in the above use example: average speed 300 m / min, table speed 0.3 m / min, wire diameter φ0.14 mm.

DESCRIPTION OF SYMBOLS 1 Fixed abrasive wire saw apparatus 2 Fixed abrasive wire 3A, 3B Wire reel 4 Guide roller 5A, 5B, 5C Spindle roller 6 Wire row 7 Traverse device 8 Dancer roller 9 Ingot 10 Worktable 11 Ultrasonic vibration horn 12 Applicator 13 vibrator 14 wire cleaning device 15 ultrasonic vibration generator

Claims (3)

In a fixed abrasive wire saw device that cuts a workpiece into a wafer by reciprocating a fixed abrasive wire with abrasive grains fixed on the surface of the wire and pressing the workpiece on it,
An ultrasonic vibration generator is disposed in the traveling path of the fixed abrasive wire, and an ultrasonic wave is applied to the fixed abrasive wire by bringing the applicator provided on the ultrasonic vibration generator into contact with the traveling fixed abrasive wire. A fixed abrasive wire saw device characterized in that it is applied directly. 2. The fixed abrasive wire saw device according to claim 1, wherein a wire cleaning device is disposed in the traveling path of the fixed abrasive wire to clean the wire after passing through the workpiece. 3. The fixed abrasive wire saw device according to claim 1 or 2, wherein ultrasonic vibration applied directly to the fixed abrasive wire is 15 kHz or more.

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