JP2012043606A - Element cooling structure and heating cooker equipped with element cooling structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an element cooling structure and a heating cooker equipped with the element cooling structure which can prevent short circuit of heat sinks having potentials different from each other caused by contact of the heat sinks.SOLUTION: The element cooling structure comprises a circuit board 51 to which electronic elements 100 are electrically connected, a cooling fan 41, a pair of heat sinks 80 to which the electronic elements 100 are respectively attached having potentials different from each other, and a fixing member 90 of insulation fixing the pair of heat sinks 80 to the circuit board 51 such that the pair of heat sinks 80 face each other in a second direction perpendicular to a first direction in which cooling air from the cooling fan 41 flows. The fixing member 90 includes a base 91 on which the pair of heat sinks 80 are loaded at a distance and fixed, and a first partition plate 92 raised on the base 91 so as to separate the pair of heat sinks 80 from each other. The first partition plate 92 is formed so as to protrude upward from above the uppermost face of the pair of heat sinks 80 fixed to the base 91.

Description

  The present invention relates to an element cooling structure for cooling an electronic element and a cooking device provided with the element cooling structure.

  Conventionally, there is an element cooling structure in which an electronic element having a large heat generation amount is attached to a heat sink having a plurality of fins arranged in parallel, and the electronic element is cooled by flowing cooling air from a cooling fan between the fins of the heat sink. . As a cooking device having this type of element cooling structure, for example, “a surface having a heating coil, a heat sink, a drive circuit, and an axial flow type cooling fan inside the main body and perpendicular to the rotation axis of the cooling fan. The heat sinks are placed facing each other in a nearly symmetrical position, and switching elements are provided on the inner surfaces of both heat sinks facing each other and in the vicinity of the rotation center of the cooling fan. There is a cooling device for an electromagnetic cooker in which both heat sinks are cooled by blowing with a cooling fan and driven by a two-stone switching element (see Patent Document 1).

  In this heating cooker, the electric potentials of both heat sinks are different from each other, and if the cooling fan breaks down and both heat sinks heat up abnormally, the support that supports both heat sinks softens and both heat sinks tilt and contact each other. And it is supposed to be short-circuited.

Japanese Patent Laid-Open No. 4-312787 (Claim 1, FIG. 1)

  In the above-described conventional cooking device, when the cooling fan fails, both the heat sinks come into contact with each other to cause an electrical short, so that the circuit board fails. Further, in the above cooking device, there is nothing that separates both heat sinks, and therefore, dust or the like contained in the cooling air may accumulate so as to straddle both heat sinks. There was a problem that the heat sink was in electrical contact and short-circuited.

  The present invention has been made in view of these points, and an object thereof is to provide an element cooling structure capable of preventing an electrical short circuit between heat sinks having different potentials and a heating cooker including the element cooling structure. And

  The element cooling structure according to the present invention includes a circuit board to which electrical elements are electrically connected, a cooling fan, a pair of heat sinks to which electronic elements are attached and different potentials, and cooling air from the cooling fan flows. An insulating fixing member that fixes the pair of heat sinks to the circuit board so that the pair of heat sinks face each other in a second direction orthogonal to one direction, and the fixing members are mounted in a state where the pair of heat sinks are separated from each other. And a first partition plate erected on the base so as to partition between the pair of heat sinks. The first partition plate is an outermost part of the pair of heat sinks fixed on the base. It is configured to protrude upward from the upper surface.

  A heating cooker according to the present invention includes the element cooling structure described above and a heating coil that heats an object to be heated. A driving circuit that drives the heating coil is mounted on a circuit board, and the elements that constitute the driving circuit are electronic. Each element is attached to a pair of heat sinks.

  According to the present invention, the first partition plate of the fixing member that partitions the pair of heat sinks is configured to protrude above the uppermost fins of the pair of heat sinks, so that the pair of heat sinks are straddled. Dust and the like can be prevented from adhering, and an electrical short circuit can be prevented.

It is a perspective view which shows the inside of a main body of the state which removed the top plate of the induction heating cooking appliance provided with the element cooling structure which concerns on Embodiment 1 of this invention. It is AA sectional drawing of FIG. It is BB sectional drawing of FIG. It is CC sectional drawing of FIG. It is DD sectional drawing of FIG. It is an expansion perspective view of the heat sink of FIG. It is operation | movement explanatory drawing at the time of carrying the circuit board of FIG. It is function explanatory drawing as a baffle plate of the protrusion part of the 1st partition plate of FIG. It is a figure which shows the other modification of the element cooling structure which concerns on Embodiment 1 of this invention. It is principal part sectional drawing of the induction heating cooking appliance provided with the element cooling structure which concerns on Embodiment 2 of this invention.

  Embodiments of the present invention will be described below with reference to the drawings. In addition, in each figure, the same code | symbol shall be attached | subjected to the same part. Below, the example of an induction heating cooking appliance is demonstrated as an apparatus provided with the element cooling structure.

Embodiment 1 FIG.
FIG. 1 is a perspective view showing the inside of the main body in a state where the top plate of the induction heating cooker provided with the element cooling structure according to Embodiment 1 of the present invention is removed. FIG. 2 is a cross-sectional view taken along the line AA of FIG. 3 is a cross-sectional view taken along line BB in FIG. 4 is a cross-sectional view taken along the line CC of FIG. 5 is a cross-sectional view taken along the line DD of FIG. FIG. 6 is an enlarged perspective view of the heat sink of FIG. In the following description, the side facing the user in FIG. 1 is the front, and each direction is shown in accordance with the front, rear, left, right, up and down directions in FIG.

  The induction heating cooker according to the embodiment of the present invention includes an induction heating cooker main body 1 (hereinafter referred to as “main body 1”), a top plate 2 that closes the upper surface opening of the main body 1, and a top plate 2. And a frame 3. Below the top plate 2, the heating coil 6RC on the right side for induction heating the heated object N such as a metal pan placed on the top plate 2, the heating coil 6 LC on the left side, and the radiant heat are used for heating. A rear central electric heater, for example, a central heating source 7 called a radiant heater is arranged.

  In the upper frame 3 that supports the top plate 2, an intake port 20 </ b> A and an exhaust port 20 </ b> B are provided on the rear side of the top plate 2. On these openings formed on the rear side of the top plate 2, a metal flat plate cover (not shown) having a plurality of small communication holes formed thereon is detachably mounted.

  A door 10 of the grill heating chamber 9 is provided on the left side of the front surface of the main body 1, and a grill heating chamber 9 is provided at the back of the door 10. When the door 10 is closed, the grill heating chamber 9 is a substantially independent sealed space. However, the grill heating chamber 9 is an external space of the main body 1 through the exhaust duct 11 as shown in FIG. It communicates with the indoor space.

  A fan case 40 communicating with the air inlet 20A is disposed on the right rear side of the main body 1, and a cooling fan 41 for cooling the heating coils 6LC and 6RC and a circuit board 51 described later is disposed in the fan case 40. Has been. A board case 50 is disposed in front of the fan case 40, and a circuit board 51 mounted with a drive circuit for driving the heating coils 6LC and 6RC, a heat sink 80 described later, and the like is housed in the insulating board case 50. Yes.

  The substrate case 50 has a configuration in which a lower case 52 and an upper case 53 are vertically combined, and both are configured as an integrally molded product of plastic. The lower case 52 has a substantially box shape with an upper surface opened, and the circuit board 51 is mounted on a mounting base 52a protruding upward from the outer periphery of the bottom surface, and is screwed in a state of slightly floating from the bottom surface of the lower case 52. It is fixed to the lower case 52 by fixing means such as. An upper case 53 having an open bottom surface is fixed to the lower case 52 so as to cover the circuit board 51.

  Ventilation spaces 53A, 53B, and 53C are roughly formed inside the substrate case 50. The ventilation space 53A is a space that communicates with the inlet 54A provided on the fan case 40 side of the substrate case 50 and faces the cooling fan 41. A heat sink 80 (to be described later) on the circuit board 51 is located in the ventilation space 53A. is doing. The ventilation space 53B is a space formed on the left and right sides of the ventilation space 53A, and the ventilation space 53C is a space formed on the leeward side of the ventilation spaces 53A and 53B.

  An exhaust port 54B for exhausting the cooling air in the substrate case 50 upward is formed on the upper surface of the upper case 53 where the ventilation space 53C is formed. In addition, an exhaust port 54 </ b> C that exhausts air after passing through the substrate case 50 toward the grill heating chamber 9 is formed on the surface of the upper case 53 that forms the ventilation space 53 </ b> C facing the grill heating chamber 9. Has been. The ventilation spaces 53A, 53B, and 53C are in communication with each other, and the cooling air from the cooling fan 41 flows into the substrate case 50 from the inlet 54A provided at the rear of the substrate case 50, and the ventilation spaces 53A, 53B, After passing through 53C, the air is exhausted from the exhaust ports 54B and 54C.

  In the main body 1, a horizontal partition plate 60 is provided between a lower space where the substrate case 50, the grill heating chamber 9 and the like are arranged and an upper space where the heating coils 6 LC and 6 RC are arranged. Between the part of the horizontal partition plate 60 and the upper surface of the upper case 53, there is a ventilation space 53D through which a part of the air from the cooling fan 41 flows directly into the upper space without passing through the substrate case 50. Is formed.

Next, the flow of the cooling air in the induction heating cooker will be described with reference to FIGS. The arrows in the figure indicate the flow of cooling air.
When the cooling fan 41 is driven, external air is sucked into the main body 1 from the air inlet 20A. A part of the sucked outside air passes through the fan case 40 to the cooling fan 41 and further flows into the substrate case 50 from the introduction port 54A. The cooling air flowing into the substrate case 50 mainly flows into the ventilation space 53A, and cools the heat sink 80 through the fins 82 of the heat sink 80 (described later) disposed in the ventilation space 53A. The cooling air after passing through the ventilation spaces 53A and 53B flows into the ventilation space 53C. Part of the air that has flowed into the ventilation space 53C is exhausted into the upper space from the exhaust port 54B, and the rest is exhausted from the exhaust port 54C toward the grill heating chamber 9 side.

  The remainder of the outside air sucked from the air inlet 20A flows into the ventilation space 53D, is directly guided to the upper space without passing through the substrate case 50, and becomes an airflow that mainly cools the heating coil 6RC. The cooling air that has flowed out of the ventilation space 53C and the ventilation space 53D and led to the upper space through the vent 60A provided in the horizontal partition plate 60 is ejected toward the heating coil 6LC and is applied to the lower surface of the heating coil 6RC. After colliding and cooling the heating coil 6RC, it flows toward the heating coil 6LC as shown in FIG. After the heating coil 6LC is cooled, it enters the exhaust duct 70 through the exhaust port 60B provided in the horizontal partition plate 60 and the exhaust port 60C provided at the rear of the main body, and is discharged to the outside from the exhaust port 20B communicating with the exhaust duct 70. The

Next, the cooling structure of the electronic element 100 of the drive circuit that drives the left and right heating coils 6LC and 6RC will be described.
The circuit board 51 has a plurality of heat sinks 80 for radiating the heat of the electronic element (for example, a switching element) 100 (in the case where it is necessary to distinguish each of the heat sinks 80A, 80B, 80C, 80D, the reference numerals are separated. Is fixed on the circuit board 51 via the fixing member 90. The electronic elements 100 having different potentials are screwed to the respective heat sinks 80 to have different potentials. This example shows a configuration in which two pairs of heat sinks 80 facing in a direction perpendicular to the direction in which the cooling air flows (hereinafter also referred to as the left-right direction) are arranged in parallel in the direction in which the cooling air flows. Since the cooling structure of the invention is characterized by the positional relationship between the pair of heat sinks 80 and the fixing member 90 in the left-right direction, in the following description, the pair of heat sinks 80A and 80B and the fixing member 90 on the rear side are described below. The features of the present invention will be described with a focus on the above.

  Each of the pair of heat sinks 80A and 80B is made of a metal having a good thermal conductivity such as aluminum, and has a configuration in which a plurality of fins 82 are arranged in parallel on both surfaces of the flat base portion 81 with a space therebetween. Yes.

  The fixing member 90 is a base 91 that places and fixes the pair of heat sinks 80A and 80B in a state of being separated from each other, and a first partition that stands upright at a substantially central portion of the base 91 and partitions the pair of heat sinks 80A and 80B. The plate 92 has a configuration in which it is integrally formed of an insulating member. The pair of heat sinks 80A and 80B are configured such that the plurality of fins 82 are arranged in the standing direction of the first partition plate 92 and the tips of the plurality of fins 82 are in contact with the first partition plate 92 or have a slight gap. The fixing member 90 is fixed. If there is a large gap between the tips of the plurality of fins 82 and the first partition plate 92, the cooling air passes through the gap and the cooling efficiency is lowered. In the following description, when it is necessary to distinguish the fins 82, the fins 82 extending from the base portion 81 toward the first partition plate 92 are referred to as first fins 82 </ b> A, and the first partition plate 92 is extended from the base portion 81. Each fin 82 extending on the opposite side is called a second fin 82B.

  In the heat sink 80, a part of the first fin 82A at the bottom is thicker than the other first fins 82A in the height direction, and a pair of engaging grooves 84 provided in the portion 83 with the increased thickness. A pair of locking portions 93 protruding from the upper surface of the base 91 are engaged with each other, and are fixed to the fixing member 90 with screws in that state. Other heat sinks 80 are similarly fixed to the fixing member 90.

  The fixing member 90 to which the pair of heat sinks 80A and 80B are fixed as described above is configured so that the pair of heat sinks 80A and 80B face each other in a direction orthogonal to the direction in which the cooling air from the cooling fan 41 flows. It is fixed to.

  In the base portion 81 of the heat sinks 80A and 80B, the lower side of the surface opposite to the surface facing the first partition plate 92 is an element attachment region 85, and the electronic element 100 is attached to the element attachment region 85. . As described above, the pair of heat sinks 80A and 80B are screwed with the electronic elements 100 having different potentials (here, different polarities), and the pair of heat sinks 80A and 80B have different polarities. In addition, the heat sinks 80A and 80B having different polarities are partitioned by the first partition plate 92 over the entire length in the front-rear direction. Therefore, even if the cooling fan 41 fails, the heat sinks 80A and 80B can be prevented from inclining and contacting each other, and as a result, an electrical short circuit can be prevented. In the base portion 81 of the heat sink 80, the temperature sensor 110 is fixed above the element mounting region 85, and the temperature of the electronic element 100 detected by the temperature sensor 110 is output to a control means (not shown). Yes.

  The first partition plate 92 is formed so as to protrude above the uppermost surfaces of the heat sinks 80A and 80B, that is, the upper surface of the uppermost fin 82. This prevents dust or the like contained in the cooling air from accumulating across the upper surface of the uppermost first fin 82 of the pair of heat sinks 80A and 80B. From the viewpoint of preventing dust and the like from being accumulated across the pair of heat sinks 80 </ b> A and 80 </ b> B, it is preferable that the upper end surface of the first partition plate 92 extends until it contacts the upper case 53. However, with this configuration, when the upper case 53 is attached to the lower case 52, there is a possibility that the upper end surface of the first partition plate 92 is pushed in by the upper surface of the upper case 53. In this case, the pushing force is applied to the circuit board 51 through the first partition plate 92 and the base 91, and the circuit board 51 may bend and an element on the circuit board 51 may be loaded. Accordingly, a gap is intentionally provided between the upper end surface of the first partition plate 92 and the upper case 53.

  Further, the pair of heat sinks 80C and 80D provided in front of the pair of heat sinks 80A and 80B are also placed and fixed separately on the base 91 like the pair of heat sinks 80A and 80B. It is partitioned by.

  By the way, the plurality of heat sinks 80 are structures projecting from the upper surface of the circuit board 51, and when the circuit boards 51 on which each component has been mounted are attached to the lower case 52, a plurality of heat sinks 80 are provided as shown in FIG. The circuit board 51 is carried in a state where the heat sink 80 is held together from above and is placed on the lower case 52. At this time, a force in a direction indicated by an arrow in FIG. For this reason, if there is a gap between the pair of heat sinks 80, the pair of heat sinks 80 may be inclined in the direction of each other. In this case, the fixing member 90 is bent, and the circuit board 51 is bent by the bending, and there is a possibility that a load is applied to the elements on the circuit board 51 as described above. On the other hand, since the first partition plate 92 is located in the gap between the pair of heat sinks 80 in this example, even if the heat sink 80 is gripped when the board is attached, the pair of heat sinks 80 may fall in the direction of each other. The above-mentioned inconvenience when the circuit board 51 is attached can be prevented.

  Further, the end face on the cooling air inflow side of the first partition plate 92 protrudes from the end face on the cooling air inflow side of the pair of heat sinks 80A and 80B as shown in FIG. With this configuration, dust or the like can be prevented from being accumulated across the heat sinks 80A and 80B on the end surfaces of the heat sinks 80A and 80B on the cooling air inflow side. Further, the protruding portion 94 in the first partition plate 92 also functions as a current plate. Hereinafter, the function of the protrusion 94 as a current plate will be described with reference to FIG.

  FIG. 8 is a functional explanatory diagram as a rectifying plate of the protruding portion of the first partition plate in FIG. 5. The arrows in the figure indicate the flow of cooling air. The cooling fan 41 is an axial fan, and the rotation direction is determined. Therefore, the cooling air tends to flow in one of the pair of heat sinks 80 in a biased manner. However, the presence of the protruding portion 94 of the first partition plate 92 causes a part of the cooling air from the cooling fan 41 to collide with the protruding portion 94 as shown in FIG. In the example of FIG. 8, the cooling air that is directed toward the heat sink 80 </ b> B hits the protrusion 94 and is guided to the heat sink 80 </ b> A. By providing the protrusion 94 in this way, the cooling air flowing into the ventilation space 53A can be divided and guided to substantially the same flow rate on the side where the heat sink 80A is located and on the side where the heat sink 80B is located. Therefore, each heat sink 80 can be cooled with good balance, and the heat of the electronic element 100 attached to the heat sink 80 can be effectively dissipated.

  In addition, in order to reliably prevent dust from flowing around through the space between the upper end surface of the first partition plate 92 and the upper case 53, the second hanging down from the upper case 53 as shown in FIG. It can also be set as the structure which provided the partition plate 55. FIG. The length of the second partition plate 55 in the front-rear direction (the length in the direction orthogonal to the paper surface of FIG. 9) is substantially the same as the length of the first partition plate 92 in the same direction. It also has the function of The second partition plate 55 is formed integrally with the upper case 53, and in this example, the thickness of the first partition plate 92 from the position facing the first partition plate 92 in the right direction (may be the left direction) from the position facing the first partition plate 92. It is formed so as to hang downward from the position shifted, and the tip end of the suspending overlap with the first partition plate 92 when viewed from the left-right direction. In addition, although the part which the 2nd partition plate 55 and the 1st partition plate 92 overlap was set as the structure which mutually contacts here, it is good also as a structure which has a slight clearance gap.

  As described above, when not only the first partition plate 92 but also the second partition plate 55 is provided, the space between the upper surfaces of the pair of heat sinks 80A and 80B and the upper case 53 is also divided into the heat sink 80A side and the 80B side. Therefore, it is possible to increase the effect of suppressing the wraparound of dust. Further, since the first partition plate 92 and the second partition plate 55 are arranged at positions shifted in the left-right direction rather than on the same straight line in the up-down direction, when the upper case 53 is attached to the lower case 52, as described above. It is possible to prevent the substrate from being bent due to the pushing-in.

  As described above, according to the first embodiment, the first partition plate 92 of the fixing member 90 that partitions the pair of heat sinks 80 protrudes above the uppermost fins 82 of the pair of heat sinks 80. Since it was set as the structure, it can prevent that dust accumulates so that the upper surface of the fin 82 may be straddled. As a result, it is possible to prevent a pair of heat sinks 80 having different potentials from coming into contact with each other and causing a short circuit.

  Further, since the pair of heat sinks 80 having different potentials are insulated by the first partition plate 92, it is possible to prevent a short circuit due to the pair of heat sinks 80 tilting toward each other when the cooling fan 41 fails as in the prior art.

  In addition, since the gap between the pair of heat sinks 80 is filled with the first partition plate 92, even when the plurality of heat sinks 80 are held together when assembled to the lower case 52 of the circuit board 51, the holding force Thus, the heat sinks 80 can be prevented from falling in the directions of each other. Therefore, the substrate failure due to the assembly work can be prevented.

  In addition, since the end face of the first partition plate 92 on the cooling air inflow side protrudes from the end face of the pair of heat sinks 80 on the cooling air inflow side, And the like can be prevented from being deposited across the pair of heat sinks 80.

  Moreover, the cooling air that has flowed into the ventilation space 53A can be guided to the side where the heat sink 80A is located and the side where the heat sink 80B is located at substantially the same flow rate by the protruding portion 94 of the first partition plate 92. Therefore, each heat sink 80 can be cooled with good balance, and the heat of the electronic element 100 attached to the heat sink 80 can be effectively dissipated.

  When the second partition plate 55 is provided in the upper case 53, the air path of the pair of heat sinks 80 in the substrate case 50 can be partitioned into the heat sink 80A side and the 80B side together with the first partition plate 92. it can. Therefore, it is possible to prevent dust from entering between the pair of heat sinks 80A and 80B.

Embodiment 2. FIG.
In the first embodiment, the first partition plate 92 protrudes upward from the uppermost fin 82 of the heat sink 80. However, this configuration may not be adopted due to manufacturing restrictions. For example, this is a case where the board transfer space of the board inspection apparatus for inspecting the electrical performance of the circuit board 51 is configured to the height of the heat sink 80. The second embodiment also relates to a configuration capable of obtaining the same effect as the first embodiment in this case.

FIG. 10: is principal part sectional drawing of the induction heating cooking appliance provided with the element cooling structure which concerns on Embodiment 2 of this invention. In the second embodiment, the components other than the heat sink 80 and the fixing member 90 are the same as those in the first embodiment.
In the induction heating cooker according to the second embodiment, the first partition plate 92 of the fixing member 90 has an uppermost surface (the upper surface of the uppermost fin 82) of the heat sink 80 whose height is fixed on the base 91. It is formed at the same height. In the second embodiment, the uppermost first fin 82A among the first fins 82A is formed shorter than the other first fins 82A. Thus, by forming the uppermost first fin 82A shorter than the other first fins, a space S is formed between the tip of the first fin 82A and the first partition plate 92. A second partition plate 55 that hangs down toward the space S is formed integrally with the upper case 53. The second partition plate 55 is formed so that the drooping tip portion overlaps the first partition plate 92 when viewed from the left-right direction. By this second partition plate 55, the space between the pair of heat sinks 80 and the upper case 53 is partitioned into one side and the other side of the pair of heat sinks 80A and 80B over the entire length of the heat sink 80 in the front-rear direction. It has been. Further, the length of the second partition plate 55 in the front-rear direction (the length in the direction orthogonal to the paper surface of FIG. 10) is substantially the same as the length of the first partition plate 92 in the same direction, and is slightly rectified. It also has a function as a plate. Other configurations are the same as those of the first embodiment.

  According to the second embodiment configured as described above, the same effect as in the first embodiment can be obtained. In addition, although the structure which the part which overlaps mutually in the 1st partition plate 92 and the 2nd partition plate 55 contacts here is shown, it does not necessarily need to contact and dust etc. straddle between a pair of heat sinks 80. There may be a slight gap to the extent that there is nothing. FIG. 10 shows a configuration in which the tips of the first fins 82A of both the heat sinks 80A and 80B are formed short. In this configuration, all the heat sinks 80 are extruded using the same extrusion die. For this reason, at least one of the heat sinks may have a configuration in which the tip of the first fin 82A is formed short. In this example, a configuration in which only the top first fin 82A is formed short is shown, but the present invention is not limited to the top only, and includes a configuration in which a predetermined number of sheets are shortened from the top. Shall be. However, from the viewpoint of the heat dissipation effect, a configuration with only the top is desirable.

  In the above description, an induction heating cooker is cited as an example of a heating cooker having an element cooling structure, and the switching element of the heating coil drive circuit is cooled as an example. However, the present invention is not limited to this. That is, the present invention can be applied to an apparatus having a configuration in which a pair of heat sinks to which electronic elements are attached and different in potential are cooled by cooling air from a cooling fan. In the above description, the case where the cooking device is a built-in type (system kitchen integrated type) IH cooking heater has been described as an example. However, the cooking device is not limited thereto.

  DESCRIPTION OF SYMBOLS 1 Main body, 2 Top plate, 3 Upper frame, 6LC heating coil, 6RC heating coil, 7 Central heating source, 9 Grill heating chamber, 10 Door, 11 Exhaust duct, 20A Inlet, 20B Exhaust, 40 Fan case, 41 Cooling Fan, 50 substrate case, 51 circuit board, 52 lower case, 52a mounting table, 53 upper case, 53A, 53B, 53C, 53D ventilation space, 54A inlet, 54B exhaust port, 54C exhaust port, 55 second partition plate, 60 Horizontal partition plate, 60A Vent, 60B Exhaust, 70 Exhaust duct, 80, 80A, 80B, 80C, 80D Heat sink, 81 Base, 82 Fin, 82A First fin, 82B Second fin, 83 Increased thickness Part, 84 engaging groove, 85 element mounting region, 90 fixing member, 91 base, 92 first partition plate, 9 Engaging portion, 94 protrusion, 100 electronic element, 110 a temperature sensor, N the heated object, S space.

Claims (8)

A circuit board to which electronic elements are electrically connected;
A cooling fan,
A pair of heat sinks with electronic elements attached and different potentials;
An insulating fixing member that fixes the pair of heat sinks to the circuit board so that the pair of heat sinks face each other in a second direction orthogonal to a first direction in which cooling air from the cooling fan flows;
The fixing member has a base for mounting and fixing the pair of heat sinks in a state of being separated from each other, and a first partition plate erected on the base so as to partition the pair of heat sinks, The element cooling structure according to claim 1, wherein the first partition plate is configured to protrude above the uppermost surfaces of the pair of heat sinks fixed on the base.   2. The element cooling structure according to claim 1, wherein an end face on the cooling air inflow side of the first partition plate of the fixing member protrudes from an end face on the cooling air inflow side of the pair of heat sinks. The circuit board is housed in an insulating board case having a lower case and an upper case,
The upper case of the substrate case hangs downward from a position shifted in the second direction from a position facing the first partition plate of the fixing member fixed on the substrate. A second partition plate is formed with a tip portion overlapping the first partition plate when viewed from the second direction, and the second partition plate provides a space between the upper surface of the pair of heat sinks and the upper case. The element cooling structure according to claim 1, wherein the element cooling structure is partitioned into one side and the other side of the pair of heat sinks.   4. The element cooling structure according to claim 3, wherein an end surface on the cooling air inflow side of the second partition plate of the fixing member protrudes from an end surface on the cooling air inflow side of the pair of heat sinks. A circuit board housed in a board case having a lower case and an upper case;
A cooling fan,
A pair of heat sinks, to which electronic elements that are electrically connected to the circuit board are attached and having different electric potentials,
An insulating fixing member that fixes the pair of heat sinks to the circuit board so that the pair of heat sinks face each other in a second direction orthogonal to a first direction in which cooling air from the cooling fan flows;
The fixing member partitions the pair of heat sinks in a state of being spaced apart from each other and the pair of heat sinks, and the height of the pair of heat sinks fixed on the base A first partition plate erected on the base so as to be the same height as the top surface;
Each of the pair of heat sinks has a configuration in which a plurality of fins are arranged in parallel on the surface of the flat base portion, and the plurality of fins are arranged in the standing direction of the first partition plate of the fixing member, In addition, the plurality of fins are fixed on the base of the fixing member so that the tips of the fins are in contact with the first partition plate or have a slight gap, and at least one of the heat sinks of the pair of heat sinks. Among the plurality of fins, a predetermined number of fins from the top are formed shorter than the other fins to form a space between the first partition plate,
A second partition plate that hangs downward toward the space is formed in the upper case, and a hanging tip end portion of the second partition plate overlaps the first partition plate when viewed from the second direction. And
The element cooling is characterized in that the first partition plate and the second partition plate partition the air path of the pair of heat sink portions in the substrate case into one side and the other side of the pair of heat sinks. Construction.   6. The element cooling structure according to claim 5, wherein the predetermined number is one.   6. The cooling air inflow side end surfaces of both the first partition plate and the second partition plate of the fixing member protrude from the cooling air inflow side end surfaces of the pair of heat sinks. Or the element cooling structure of Claim 6.   A drive circuit for driving the heating coil is mounted on the circuit board, the device cooling structure according to any one of claims 1 to 7 and a heating coil for heating an object to be heated. A cooking device, wherein elements constituting a circuit are attached to the pair of heat sinks as the electronic elements, respectively.

Images