JP5769390B2 - Element cooling structure and cooking device equipped with the element cooling structure - Google Patents

Description

  The present invention relates to an element cooling structure for cooling an electronic element and a cooking device provided with the element cooling structure.

  Conventionally, there is an element cooling structure in which an electronic element having a large heat generation amount is attached to a heat sink having a plurality of fins arranged in parallel, and the electronic element is cooled by flowing cooling air from a cooling fan between the fins of the heat sink. . As a device having this type of element cooling structure, for example, a switching element of a drive circuit for driving a heating coil is attached to the heat sink cooling air inflow side, and a temperature sensor is attached to the heat sink cooling air outflow side. There is a cooking device (see, for example, Patent Document 1). In this heating cooker, the temperature of the heat sink is controlled by a temperature sensor to prevent inconveniences such as excessive rise in the temperature of the switching element and failure.

Japanese Patent Laid-Open No. 4-312787 (Claim 1, FIG. 2)

  However, the structure of Patent Document 1 has a problem in that the temperature of the switching element cannot be accurately detected because the mounting positions of the switching element and the temperature sensor are separated on the cooling air inflow side and the outflow side of the heat sink. It was. For this reason, the development of a structure capable of increasing the detection accuracy by disposing the temperature sensor near the switching element without impairing the original purpose such as element cooling has been a future problem.

  The present invention has been made in view of the above points, and provides an element cooling structure capable of accurately detecting the temperature of an electronic element and capable of efficient cooling, and a heating cooker including the element cooling structure. The purpose is to do.

The element cooling structure according to the present invention includes an electronic element attached and a heat sink for radiating heat of the electronic element, and a temperature sensor attached to the heat sink for detecting the temperature of the electronic element. A plurality of fins are arranged in parallel on both sides of a flat base portion having an element attachment region on one side to which an electronic element is attached, excluding the element attachment region. The fin length of the 1st fin and 2nd fin in the whole arrangement space of the heat sink comprised from the 1st fin juxtaposed on the other surface side and the 2nd fin juxtaposed on the one surface of the base part The first fin is made longer than the second fin, and the gap between the first adjacent fin closest to the element mounting region and the adjacent second adjacent fin is arranged on one surface of the base portion. And the temperature sensor mounting region is set larger than the gap between other fins, fixed pin when the length of the fin arrangement direction of the temperature sensor mounting area to secure the fixed terminals of the temperature sensor to the temperature sensor attachment area The length is set substantially the same as the length in the same direction, and grooves are provided at both ends of the temperature sensor mounting region in the fin juxtaposition direction, and the temperature sensor is mounted in close contact with the temperature sensor mounting region . Is.

  A heating cooker according to the present invention includes the element cooling structure described above and a heating coil that heats an object to be heated, and an element of a drive circuit that drives the heating coil is attached to the heat sink as an electronic element. Is.

  ADVANTAGE OF THE INVENTION According to this invention, while being able to detect the temperature of an electronic element accurately, the element cooling structure in which efficient cooling is possible, and a heating cooker provided with the same can be obtained.

It is a perspective view which shows the inside of a main body of the state which removed the top plate of the induction heating cooking appliance provided with the element cooling structure which concerns on one embodiment of this invention. It is AA sectional drawing of FIG. It is BB sectional drawing of FIG. It is CC sectional drawing of FIG. It is DD sectional drawing of FIG. It is an expansion perspective view of the heat sink of FIG. It is the arrow line view which looked at the state which removed the upper case in FIG. 5 from the arrow E direction. It is an enlarged view of the heat sink 80C part of FIG. FIG. 9 is an enlarged view of a portion surrounded by a circle in FIG. 5, and is a cross-sectional view taken along line FF in FIG. 8. It is a figure which shows the state which attached R to the corner | angular part of the upper and lower ends of a temperature sensor attachment area | region.

  Embodiments of the present invention will be described below with reference to the drawings. In addition, in each figure, the same code | symbol shall be attached | subjected to the same part. Below, the example of an induction heating cooking appliance is demonstrated as an apparatus provided with the element cooling structure.

Embodiment 1 FIG.
FIG. 1 is a perspective view showing the inside of a main body in a state where a top plate of an induction heating cooker having an element cooling structure according to an embodiment of the present invention is removed. FIG. 2 is a cross-sectional view taken along the line AA of FIG. 3 is a cross-sectional view taken along line BB in FIG. 4 is a cross-sectional view taken along the line CC of FIG. 5 is a cross-sectional view taken along the line DD of FIG. FIG. 6 is an enlarged perspective view of the heat sink of FIG. In the following description, the side facing the user in FIG. 1 is the front, and each direction is shown in accordance with the front, rear, left, right, up and down directions in FIG.

  The induction heating cooker according to the embodiment of the present invention includes an induction heating cooker main body 1 (hereinafter referred to as “main body 1”), a top plate 2 that closes the upper surface opening of the main body 1, and a top plate 2. And a frame 3. Below the top plate 2, the heating coil 6RC on the right side for induction heating the heated object N such as a metal pan placed on the top plate 2, the heating coil 6 LC on the left side, and the radiant heat are used for heating. A rear central electric heater, for example, a central heating source 7 called a radiant heater is arranged.

  In the upper frame 3 that supports the top plate 2, an intake port 20 </ b> A and an exhaust port 20 </ b> B are provided on the rear side of the top plate 2. On these openings formed on the rear side of the top plate 2, a metal flat plate cover (not shown) having a plurality of small communication holes formed thereon is detachably mounted.

  A door 10 of the grill heating chamber 9 is provided on the left side of the front surface of the main body 1, and a grill heating chamber 9 is provided at the back of the door 10. When the door 10 is closed, the grill heating chamber 9 is a substantially independent sealed space. However, the grill heating chamber 9 is an external space of the main body 1 through the exhaust duct 11 as shown in FIG. It communicates with the indoor space.

  A fan case 40 communicating with the air inlet 20A is disposed on the right rear side of the main body 1, and a cooling fan 41 for cooling the heating coils 6LC and 6RC and a circuit board 51 described later is disposed in the fan case 40. Has been. A board case 50 is disposed in front of the fan case 40, and a circuit board 51 mounted with a drive circuit for driving the heating coils 6LC and 6RC, a heat sink 80 described later, and the like is housed in the insulating board case 50. Yes.

  The substrate case 50 has a configuration in which a lower case 52 and an upper case 53 are vertically combined, and both are configured as an integrally molded product of plastic. The lower case 52 has a substantially box shape with an upper surface opened, and the circuit board 51 is mounted on a mounting base 52a protruding upward from the outer periphery of the bottom surface, and is screwed in a state of slightly floating from the bottom surface of the lower case 52. It is fixed to the lower case 52 by fixing means such as. An upper case 53 having an open bottom surface is fixed to the lower case 52 so as to cover the circuit board 51.

  Ventilation spaces 53A, 53B, and 53C are roughly formed inside the substrate case 50. The ventilation space 53A is a space that communicates with the introduction port 54A provided on the fan case 40 side in the substrate case 50 and faces the cooling fan 41. A heat sink 80 (to be described later) on the circuit board 51 is located in the ventilation space 53A. doing. The ventilation space 53B is a space formed on the left and right sides of the ventilation space 53A, and the ventilation space 53C is a space formed on the leeward side of the ventilation spaces 53A and 53B.

  An exhaust port 54B for exhausting the cooling air in the substrate case 50 upward is formed on the upper surface of the upper case 53 where the ventilation space 53C is formed. In addition, an exhaust port 54 </ b> C that exhausts air after passing through the substrate case 50 toward the grill heating chamber 9 is formed on the surface of the upper case 53 that forms the ventilation space 53 </ b> C facing the grill heating chamber 9. Has been. The ventilation spaces 53A, 53B, and 53C are in communication with each other, and the cooling air from the cooling fan 41 flows into the substrate case 50 from the inlet 54A provided at the rear of the substrate case 50, and the ventilation spaces 53A, 53B, After passing through 53C, the air is exhausted from the exhaust ports 54B and 54C.

  In the main body 1, a horizontal partition plate 60 is provided between a lower space where the substrate case 50, the grill heating chamber 9 and the like are arranged and an upper space where the heating coils 6 LC and 6 RC are arranged. Between the part of the horizontal partition plate 60 and the upper surface of the upper case 53, there is a ventilation space 53D through which a part of the air from the cooling fan 41 flows directly into the upper space without passing through the substrate case 50. Is formed.

Next, the flow of the cooling air in the induction heating cooker will be described with reference to FIGS. The arrows in the figure indicate the flow of cooling air.
When the cooling fan 41 is driven, external air is sucked into the main body 1 from the air inlet 20A. A part of the sucked outside air passes through the fan case 40 to the cooling fan 41 and further flows into the substrate case 50 from the introduction port 54A. The cooling air flowing into the substrate case 50 mainly flows into the ventilation space 53A. The ventilation space 53A is roughly divided into two spaces by a first partition plate 92 provided on a fixing member 90, which will be described later, and a second partition plate 55 depending from the upper case 53. The ventilation space 53A flows into each space separately. The cooling air thus cooled passes between the fins 82 of the heat sink 80 in each space to cool the heat sink 80. Part of the air that has flowed into the ventilation space 53C is exhausted into the upper space from the exhaust port 54B, and the rest is exhausted from the exhaust port 54C toward the grill heating chamber 9 side.

  The remainder of the outside air sucked from the air inlet 20A is directly guided to the upper space without passing through the substrate case 50, and becomes an airflow that mainly cools the heating coil 6RC. The cooling air that has flowed out of the ventilation space 53C and the ventilation space 53D and led to the upper space through the vent 60A provided in the horizontal partition plate 60 is ejected toward the heating coil 6LC and is applied to the lower surface of the heating coil 6RC. After colliding and cooling the heating coil 6RC, it flows toward the heating coil 6LC as shown in FIG. After the heating coil 6LC is cooled, it enters the exhaust duct 70 through the exhaust port 60B provided in the horizontal partition plate 60 and the exhaust port 60C provided at the rear of the main body, and is discharged to the outside from the exhaust port 20B communicating with the exhaust duct 70. The

Next, the cooling structure of the electronic element 100 of the drive circuit that drives the left and right heating coils 6LC and 6RC will be described.
The circuit board 51 has a plurality of heat sinks 80 for radiating the heat of the electronic element 100 (for example, a switching element or the like) 100. Is fixed on the circuit board 51 via the fixing member 90. In this example, two sets of left and right heat sinks 80 are arranged side by side in the direction in which the cooling air flows. However, the two sets are different only in the number of arranged electronic elements 100 and the overall size. Since the structure itself is the same, in the following description, the characteristic part of the present invention will be described focusing on the front heat sinks 80C and 80D side.

  Each of the pair of heat sinks 80C and 80D is made of a metal having good thermal conductivity, such as aluminum, and has a configuration in which a plurality of fins 82 are arranged in parallel on both surfaces of the flat base portion 81 with a space therebetween. Yes.

  The fixing member 90 includes a base 91 for placing and fixing the pair of heat sinks 80C and 80D in a state of being separated from each other, and a first partition that stands upright at a substantially central portion of the base 91 and partitions the pair of heat sinks 80C and 80D. The plate 92 has a configuration in which it is integrally formed of an insulating member. The pair of heat sinks 80C and 80D are configured such that the plurality of fins 82 are arranged in the standing direction of the first partition plate 92 and the tips of the plurality of fins 82 are in contact with the first partition plate 92 or have a slight gap. The fixing member 90 is fixed. If there is a large gap between the tips of the plurality of fins 82 and the first partition plate 92, the cooling air passes through the gap and the cooling efficiency is lowered. In the following description, when it is necessary to distinguish the fins 82, the fins 82 extending from the base portion 81 toward the first partition plate 92 are referred to as first fins 82 </ b> A, and the first partition plate 92 is extended from the base portion 81. Each fin 82 extending on the opposite side is called a second fin 82B.

  In the heat sink 80, a part of the first fin 82A at the bottom is thicker than the other first fins 82A in the height direction, and a pair of engaging grooves 84 provided in the portion 83 with the increased thickness. A pair of locking portions 93 protruding from the upper surface of the base 91 are engaged with each other, and are fixed to the fixing member 90 with screws in that state. Other heat sinks 80 are similarly fixed to the fixing member 90.

  The fixing member 90 to which the pair of heat sinks 80C and 80D are fixed as described above is configured so that the pair of heat sinks 80C and 80D face each other in a direction orthogonal to the direction in which the cooling air from the cooling fan 41 flows. It is fixed to.

7 is an arrow view of the state in which the upper case is removed in FIG. FIG. 8 is an enlarged view of the heat sink 80C portion of FIG.
In the base portion 81 of the heat sink 80C, the second fin 82B is not provided on the lower side of the surface opposite to the surface facing the first partition plate 92, and a planar element mounting region 85 is formed. The electronic element 100 is fixed to the element attachment region 85 with a screw 101. The same applies to the heat sink 80D side and other heat sinks. The second fin 82B is formed shorter than the first fin 82A, and the element attachment region 85 is provided on the side of the second fin 82B formed short from the viewpoint of securing the fin area as the entire heat sink.

  Further, a temperature sensor 110 configured by, for example, a thermistor for detecting the temperature of the electronic element 100 is attached to the heat sink 80, and the temperature of the electronic element 100 detected by the temperature sensor 110 is controlled by a control unit (not shown). Is output. The present invention is characterized by the mounting structure of the temperature sensor 110 among the element cooling structures, and will be described in detail below.

(Location of temperature sensor 110)
9 is an enlarged view of a portion surrounded by a circle in FIG. 5, and is a cross-sectional view taken along line FF in FIG.
The temperature sensor 110 is attached to the surface on the same side as the element attachment region 85 side where the electronic element 100 is attached in the base portion 81 with screws 112. By the way, in the heat sink, it is desirable that a part other than the element attachment region 85 for attaching the electronic element 100 is used as a fin installation surface as much as possible and a plurality of fins 82 are provided as much as possible. For this reason, in the example of FIG. 8, there is a premise that a plurality of fins 82 are desired to be installed in the region above the element mounting region 85 as much as possible. Under the premise, in the present invention, in order to secure an area for attaching the temperature sensor 110 on the same surface as the element attachment area 85, the present invention is as follows. That is, on the same surface as the element attachment region 85 side, the temperature sensor 110 is set to be closer to the gap between the first proximity fin 121 closest to the element attachment region 85 and the adjacent second proximity fin 122 than the other gap. Only a minimum gap that can be installed is secured, and this gap is used as a temperature sensor mounting area 86. By attaching the temperature sensor 110 to the temperature sensor attachment region 86, the temperature sensor 110 can be disposed in the vicinity of the electronic element 100, so that the temperature of the electronic element 100 that is a temperature detection target can be accurately detected.

  From the viewpoint of preferably disposing the temperature sensor 110 in the vicinity of the temperature detection target electronic element 100, the temperature sensor attachment region 86 is brought closer to the electronic element 100 side by that amount without interposing the first proximity fin 121. Configuration is conceivable. However, since the heat from the electronic element 100 is sufficiently transmitted to the first proximity fins 121 close to the electronic element 100 and exhibits a high heat dissipation effect, the structure of removing the first proximity fins 121 is a surface of the heat dissipation effect. Is not preferable. Therefore, in this example, the temperature sensor 110 is attached after leaving the first proximity fin 121 closest to the electronic element 100.

  Here, the temperature sensor attachment region 86 is provided between the first proximity fin 121 and the second proximity fin 122. However, as between the second proximity fin 122 and the third proximity fin 123, A temperature sensor attachment region 86 may be provided between the fins 82 adjacent to each other in the direction away from the element attachment region 85. However, in this configuration, the heat dissipation effect is increased, but on the other hand, since the distance between the temperature sensor 110 and the electronic element 100 is increased, the temperature detection accuracy is decreased. Therefore, the position of the temperature sensor attachment region 86 may be determined in consideration of the balance.

  Further, as described above, when the first proximity fin 121 is deleted and the temperature sensor attachment region 86 is made closer to the electronic element 100 side, the temperature sensor 110 and the electronic element 100 are directly adjacent to each other. Become. In this case, when the temperature sensor 110 is screwed, if the temperature sensor 110 is not stable, the temperature sensor 110 itself may rotate and contact the electronic element 100, and may contact the plastic surface of the electronic element 100 and be damaged. There is sex. However, in the structure of this example, the first proximity fin 121 is provided between the temperature sensor 110 and the electronic element 100, and the two are isolated from each other. Further, as described above, since the temperature sensor 110 is provided between the two adjacent fins 82, the fin 82 itself has an effect that the temperature sensor 110 is retained.

(Thickness of temperature sensor mounting area 86)
9 is an enlarged view of a portion surrounded by a circle in FIG. 5, and is a cross-sectional view taken along line FF in FIG.
The thickness of the temperature sensor mounting region 86 of the base portion 81 is thicker than the thickness of other portions and longer than the length of the shaft portion of the screw 112. Further, the screw hole 113 (see FIG. 9) of the temperature sensor attachment region 86 is configured not to penetrate the base portion 81. Hereinafter, the reason for these structures will be described below.

  In the heat sink 80, the fins 82 mainly exert a heat radiation effect, and the base portion 81 has a role of supporting the fins 82 and also has a role of transferring heat of the electronic element 100 to the fins 82 side. Therefore, the thickness of the base portion 81 is not formed more than necessary from the viewpoint of the cost of the heat sink 80 and the size reduction, and it has a necessary thickness in terms of overall strength. Therefore, there is no thickness that can fix the screw 112. For this reason, the thickness of the temperature sensor attachment region 86 in the base portion 81 is increased to a thickness that allows the screw 112 to be fixed. If the screw hole 113 is penetrated, the metal facet remaining in the screw hole 113 when the screw hole is drilled falls into the heat sink 80 when the screw 112 is screwed into the screw hole 113, and the facet There is a possibility of falling on the circuit board 51 by the cooling air. When the facets fall on the circuit board 51 in this way, there is a possibility that inconveniences such as electrically connecting unintended portions may occur. Therefore, the thickness of the temperature sensor attachment region 86 is set to a thickness that allows the screw 112 to be fixed, and the screw hole 113 is not penetrated. Thereby, it is not necessary to take measures against dropping of the facet onto the circuit board 51.

(Direction of increasing the thickness of the temperature sensor mounting area 86)
Although it is necessary to increase the thickness of the temperature sensor attachment region 86 as described above, the direction in which the thickness is increased is on the second fin 82B side, which is shorter than the first fin 82A. Of the first fin 82A and the second fin 82B, the first fin 82A has a larger fin area and a higher heat dissipation effect. For this reason, it is desired that a large amount of cooling air flows to the first fin 82A side. Therefore, if the thickness is increased on the first fin 82A side, the ventilation cross-sectional area is reduced accordingly, and the flow rate is reduced. For this reason, the thickness is increased toward the second fin 82B side. As a result, more cooling air flows through the first fins 82A than when the thickness is increased toward the first fins 82A, so that the electronic device 100 can be efficiently cooled.

  By the way, since the electronic element 100 is also screwed to the element attachment region 85, the thickness of the element attachment region 85 is formed to be thicker than the other parts, as in the case of the temperature sensor attachment region 86, and penetrates the screw hole. It has a configuration that does not. However, as is clear from FIG. 5, the direction in which the thickness is provided is on the first fin 82 </ b> A side, unlike the temperature sensor attachment region 86. The element attachment region 85 preferably has an area in contact with the entire electronic element 100 from the viewpoint of transferring heat of the electronic element 100 to the heat sink 80 without waste. For this reason, if the thickness of the portion corresponding to the entire element attachment region 85 is increased, a larger material capacity is required for configuring the heat sink 80 than in the configuration of FIG.

  That is, in the configuration of FIG. 5, the thickness is increased by six fins in the fin juxtaposition direction (vertical direction), but when the thickness of the entire element mounting region 85 is increased, three fins in the fin juxtaposition direction are further increased. It will be necessary more and more, leading to cost increase. Further, if the thickness is increased toward the second fin 82B as in the case of the temperature sensor attachment region 86, the position of the electronic element 100 is shifted toward the ventilation space 53B accordingly. As a result, a plurality of components cannot be efficiently arranged on the circuit board 51 as a result of maintaining an insulation distance from other components. Further, when the position of the electronic element 100 is shifted to the ventilation space 53B side, a gap between the partition plate 56 that partitions the ventilation space 53A and the ventilation space 53B and the electronic element 100 becomes narrow, and the surface of the electronic element 100 is cooled. There is a possibility that the wind becomes difficult to pass and the heat dissipation effect is reduced. From this point, the element attachment region 85 is increased in thickness not on the second fin 82B side but on the first fin 82A side. However, when there are no various restrictions as described above, the thickness is increased toward the second fin 82B as in the temperature sensor attachment region 86.

  By the way, since the cooling fan 41 is an axial fan, the wind speed in the center part of the cooling fan 41 is slow, and the wind speed near the outer periphery of the cooling fan 41 is high. For this reason, the second fin 82B side having the element attachment region 85 is disposed outside the ventilation space 53A so that the electronic element 100 is positioned near the outer periphery of the cooling fan 41. Thereby, the cooling air can be positively applied to the vicinity of the root of the first fin 82A close to the electronic element 100 among the plurality of first fins 82A, and the cooling performance is improved.

(Groove 114 of temperature sensor mounting region 86)
As described above, it is desirable that the heat sink 80 has a configuration in which a plurality of fins 82 are provided as much as possible by using the surface of the base portion 81 as a fin installation surface as much as possible. Therefore, it is preferable that the length H of the temperature sensor attachment region 86 in the fin juxtaposition direction (vertical direction in FIG. 9) be as short as possible. For this reason, the length H is set to be approximately the same as the length of the fixed terminal 111 of the temperature sensor 110 in the same direction. Here, since the heat sink 80 is extruded using an extrusion die, it is difficult to form a right-angled shape and has a shape with an R. For this reason, as shown in FIG. 10, the temperature sensor attachment region 86 has a shape with R at the upper and lower corners. Thus, when R is attached, the fixed terminal 111 of the temperature sensor 110 rides on this R portion, and the temperature sensor 110 is in a state of floating from the temperature sensor attachment region 86. In this case, the temperature of the electronic element 100 cannot be accurately detected. Therefore, in this example, as shown in FIG. 9, the temperature sensor mounting region 86 has a structure in which grooves 114 are provided at both upper and lower ends. Thereby, it is possible to prevent the fixed terminal 111 of the temperature sensor 110 from floating from the temperature sensor attachment region 86, and the temperature sensor 110 comes into contact with the temperature sensor attachment region 86, and the temperature can be accurately detected.

  In this example, since the outer shape of the fixed terminal 111 is larger than the outer shape of the temperature sensor 110, the dimension of the temperature sensor mounting region 86 is determined in accordance with the fixed terminal 111 side, and a groove 114 is provided thereon. It was. However, the original purpose is that the temperature sensor 110 can be mounted in contact with the temperature sensor 110 without floating from the temperature sensor mounting area 86 after setting the length of the temperature sensor mounting area 86 in the fin juxtaposition direction as short as possible. It is to do.

  As described above, in the present embodiment, on the same surface as the element mounting area 85 of the heat sink, the element is mounted between the first adjacent fin 121 closest to the element mounting area 85 and the second adjacent fin 122 adjacent thereto or further element mounted. The gap between the fins adjacent to each other in the direction away from the area 85 is made larger than the gap between the other fins as a temperature sensor attachment area 86, and the temperature sensor 110 is attached to this attachment area. Thereby, since the temperature sensor 110 can be arrange | positioned in the vicinity of the electronic element 100, it becomes possible to detect the temperature of the electronic element 100 correctly. Moreover, since the temperature sensor 110 is attached with the first proximity fin 121 closest to the electronic element 100 left, the electronic element 100 can be efficiently cooled. As a result, the number of rotations of the cooling fan 41 can be reduced, and an energy saving effect can be obtained.

  Further, the thickness of the temperature sensor mounting region 86 is set to be thicker than the thickness of other portions and can be fixed by screws, and the direction of increasing the thickness is set to the second fin 82B side. The electronic device 100 can be efficiently cooled compared with the case where the thickness is increased.

  Further, since the screw hole 113 in the temperature sensor mounting region 86 is a screw hole that does not penetrate, the problem of the facet falling onto the circuit board 51 when the screw 112 is screwed into the screw hole 113 can be solved.

  Further, since the grooves 114 are provided at the upper and lower ends of the temperature sensor mounting area 86, the fixed terminal 111 of the temperature sensor 110 can be prevented from floating from the temperature sensor mounting area 86, and the temperature sensor 110 contacts the temperature sensor mounting area 86. The temperature can be detected with high accuracy.

  In the above description, an induction heating cooker is cited as an example of a heating cooker having an element cooling structure, and the switching element of the heating coil drive circuit is cooled as an example. However, the present invention is not limited to this. That is, the present invention can be applied to a device having a configuration in which the heat sink to which the electronic element 100 is attached is cooled by the cooling air from the cooling fan 41. In the above description, the case where the cooking device is a built-in type (system kitchen integrated type) IH cooking heater has been described as an example. However, the cooking device is not limited thereto.

  DESCRIPTION OF SYMBOLS 1 Main body, 2 Top plate, 3 Upper frame, 6LC heating coil, 6RC heating coil, 7 Central heating source, 9 Grill heating chamber, 10 Door, 11 Exhaust duct, 20A Inlet, 20B Exhaust, 40 Fan case, 41 Cooling Fan, 50 substrate case, 51 circuit board, 52 lower case, 52a mounting table, 53 upper case, 53A, 53B, 53C, 53D ventilation space, 54A inlet, 54B exhaust port, 54C exhaust port, 55 second partition plate, 56 partition plate, 60 horizontal partition plate, 60A ventilation port, 60B exhaust port, 60C exhaust port, 70 exhaust duct, 80, 80A, 80B, 80C, 80D heat sink, 81 base portion, 82 fin, 82A first fin, 82B first 2 fins, 83 thickened part, 84 engaging groove, 85 element mounting area, 86 temperature sensor Mounting area, 90 fixing member, 91 base, 92 first partition plate, 93 locking part, 100 electronic element (switching element), 101 screw, 110 temperature sensor, 111 fixing terminal, 112 screw, 113 screw hole, 114 groove 121 First proximity fin, 122 Second proximity fin, 123 Third proximity fin, N Heated object.

Claims (4)

An electronic element is mounted, and a heat sink for dissipating heat of the electronic element;
A temperature sensor attached to the heat sink for detecting the temperature of the electronic element;
The heat sink has a configuration in which a plurality of fins are arranged in parallel on both surfaces of a flat base portion having an element attachment region on one side to which the electronic element is attached, excluding the element attachment region. The fin is composed of a first fin arranged in parallel on the other surface side of the base portion and a second fin arranged in parallel on the one surface of the base portion, and the entire inside of the arrangement space of the heat sink. The distribution of the first fin and the second fin in the fin length direction is made longer than the second fin, and the first fin of the base portion has the largest distribution in the element mounting region. The gap between the near first proximity fin and the adjacent second proximity fin is made larger than the gap between the other fins as a temperature sensor attachment region, and the length of the temperature sensor attachment region in the fin juxtaposition direction But, The temperature sensor fixing terminal is set to a length substantially the same as the length of the fixing terminal when the temperature sensor fixing terminal is fixed to the temperature sensor mounting area, and grooves are formed at both ends of the temperature sensor mounting area in the fin juxtaposition direction. is provided, the element cooling structure, characterized in that the temperature sensor to the temperature sensor attachment area is attached in close contact.   The temperature sensor is fixed to the temperature sensor mounting region with a screw, and the thickness of the temperature sensor mounting region is set to be thicker than the thickness of the other part so that the screw can be fixed. The element cooling structure according to claim 1, wherein the direction is the second fin side.   The element cooling structure according to claim 2, wherein the screw hole for attaching the temperature sensor in the temperature sensor attaching region is a screw hole that does not penetrate. An element cooling structure according to any one of claims 1 to 3 and a heating coil that heats an object to be heated, and an element of a drive circuit that drives the heating coil serves as the electronic element in the heat sink. A cooking device characterized by being attached.

Images