JP2012038847A - Cooling structure of electronic component mounting substrate - Google Patents

Cooling structure of electronic component mounting substrate Download PDF

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JP2012038847A
JP2012038847A JP2010176157A JP2010176157A JP2012038847A JP 2012038847 A JP2012038847 A JP 2012038847A JP 2010176157 A JP2010176157 A JP 2010176157A JP 2010176157 A JP2010176157 A JP 2010176157A JP 2012038847 A JP2012038847 A JP 2012038847A
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metal
ceramic
substrate
electronic component
component mounting
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JP5631100B2 (en
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Hideyo Osanai
英世 小山内
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Dowa Metaltech Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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Abstract

PROBLEM TO BE SOLVED: To provide a cooling structure of an electronic component mounting substrate which exhibits excellent heat dissipation.SOLUTION: An electronic component mounting substrate 10 in which an electronic component 16 is held fixedly between metal circuit boards 24 and 28 of metal-ceramic circuit boards 12 and 14 where the metal circuit boards 24 and 28 are bonded to one surface of ceramic substrates 22 and 26 is held by means of a pair of coolers 44 and cooled. In such a cooling structure, the metal circuit boards 24 and 28 are bonded directly to one surfaces of the ceramic substrates 22 and 26. One cooler 44 is bonded directly to the other surface of the ceramic substrate 22 of the metal-ceramic circuit board 12 out of the two metal-ceramic circuit boards 12 and 14.

Description

本発明は、電子部品搭載基板の冷却構造に関し、特に、セラミックス基板の少なくとも一方の面に金属回路板が接合した金属−セラミックス回路基板に電子部品が搭載された電子部品搭載基板の冷却構造に関する。   The present invention relates to a cooling structure for an electronic component mounting substrate, and more particularly to a cooling structure for an electronic component mounting substrate in which an electronic component is mounted on a metal-ceramic circuit substrate in which a metal circuit board is bonded to at least one surface of a ceramic substrate.

近年、電気自動車、電車、工作機械などの大電流を制御するために、パワーモジュールが使用されている。従来のパワーモジュールでは、ベース板と呼ばれている金属板または複合材の一方の面に金属−セラミックス絶縁基板が半田付けにより固定され、この金属−セラミックス絶縁基板上に半導体チップが半田付けにより固定されている。また、ベース板の他方の面（裏面）には、ねじ止めなどにより熱伝導グリースを介して金属製の放熱フィンや冷却ジャケットが取り付けられている。   In recent years, power modules have been used to control large currents in electric vehicles, trains, machine tools, and the like. In a conventional power module, a metal-ceramic insulating substrate is fixed to one surface of a metal plate or composite material called a base plate by soldering, and a semiconductor chip is fixed to the metal-ceramic insulating substrate by soldering. Has been. Further, a metal radiating fin or a cooling jacket is attached to the other surface (back surface) of the base plate through heat conductive grease by screwing or the like.

この金属−セラミックス絶縁基板へのベース板や半導体チップの半田付けは加熱により行われるため、半田付けの際に接合部材間の熱膨張係数の差によりベース板の反りが生じ易い。また、半導体チップから発生した熱は、金属−セラミックス絶縁基板と半田とベース板を介して放熱フィンや冷却ジャケットにより空気や冷却水に逃がされるため、半田付けの際にベース板の反りが生じると、放熱フィンや冷却ジャケットをベース板に取り付けたときのクリアランスが大きくなり、放熱性が極端に低下するという問題がある。さらに、半田自体の熱伝導率が低いため、大電流を流すパワーモジュールでは、より高い放熱性が求められていた。   Since the base plate and the semiconductor chip are soldered to the metal-ceramic insulating substrate by heating, the base plate is likely to warp due to the difference in thermal expansion coefficient between the joining members during soldering. Also, the heat generated from the semiconductor chip is released to the air and cooling water by the heat radiation fins and the cooling jacket through the metal-ceramic insulating substrate, the solder, and the base plate, so that the base plate warps during soldering. There is a problem that the clearance when the radiating fins and the cooling jacket are attached to the base plate is increased, and the heat dissipation is extremely lowered. Furthermore, since the thermal conductivity of the solder itself is low, higher power dissipation is required for a power module that passes a large current.

このような問題を解決するため、ベース板と金属−セラミックス絶縁基板との間を半田付けすることなく、アルミニウムまたはアルミニウム合金からなるベース板をセラミックス基板に直接接合した金属−セラミックス回路基板が提案されている（例えば、特許文献１参照）。   In order to solve such problems, a metal-ceramic circuit board is proposed in which a base plate made of aluminum or an aluminum alloy is directly bonded to a ceramic substrate without soldering between the base plate and the metal-ceramic insulating substrate. (For example, refer to Patent Document 1).

しかし、ハイブリッド自動車や電気自動車などで使用されているインバータは、絶縁ゲート形バイポーラトランジスタ（ＩＧＢＴ）などの半導体素子を内蔵した半導体モジュールを使用しており、大容量であるために発熱量も大きいので、特許文献１に提案された金属−セラミックス回路基板のベース板に熱伝導グリースを介して金属製の放熱フィンや冷却ジャケットが取り付けても、放熱性が不十分な場合があった。そのため、半導体モジュールなどの電子部品を両主面から挟持するように積層配置された冷却管が提案されている（例えば、特許文献２、３参照）。   However, inverters used in hybrid vehicles and electric vehicles use semiconductor modules with built-in semiconductor elements such as insulated gate bipolar transistors (IGBTs), and because of their large capacity, they generate large amounts of heat. Even if metal radiating fins or cooling jackets are attached to the base plate of the metal-ceramic circuit board proposed in Patent Document 1 via thermal conductive grease, there is a case where the heat dissipation is insufficient. For this reason, cooling pipes have been proposed in which the electronic components such as a semiconductor module are stacked and sandwiched from both main surfaces (see, for example, Patent Documents 2 and 3).

特開２００２−７６５５１号公報（段落番号００１５）JP 2002-76551 A (paragraph number 0015) 特開２００７−１７３３７２号公報（段落番号０００８）JP 2007-173372 A (paragraph number 0008) 特開２０１０−１０４１８号公報（段落番号０００８）JP2010-10418A (paragraph number 0008)

しかし、特許文献２および３の冷却管では、電子部品と冷却管の間（電子部品と冷却管の間に絶縁物が介在している場合には絶縁物と冷却管の間）の接触を十分にするために、これらの間に熱伝導グリースを介在させる必要があり、電子部品の両面を冷却しても、放熱性が十分でなかった。   However, in the cooling pipes of Patent Documents 2 and 3, sufficient contact between the electronic component and the cooling pipe (when an insulator is interposed between the electronic component and the cooling pipe) is sufficient. Therefore, it is necessary to interpose a thermal grease between them, and even if both sides of the electronic component are cooled, the heat dissipation is not sufficient.

したがって、本発明は、このような従来の問題点に鑑み、放熱性に優れた電子部品搭載基板の冷却構造を提供することを目的とする。   Therefore, in view of such a conventional problem, an object of the present invention is to provide a cooling structure for an electronic component mounting board having excellent heat dissipation.

本発明者らは、上記課題を解決するために鋭意研究した結果、セラミックス基板の一方の面に金属回路板が接合した２つの金属−セラミックス回路基板の金属回路板の間に電子部品が挟持されて固定された電子部品搭載基板を一対の冷却器により挟持して冷却する冷却構造において、２つの金属−セラミックス回路基板の各々の金属−セラミックス回路基板のセラミックス基板の一方の面に金属回路板を直接接合させ、２つの金属−セラミックス回路基板の一方の金属−セラミックス回路基板のセラミックス基板の他方の面に一対の冷却器の一方の冷却器を直接接合させることにより、放熱性に優れた電子部品搭載基板の冷却構造を提供することができることを見出し、本発明を完成するに至った。   As a result of diligent research to solve the above-mentioned problems, the present inventors pinched and fixed an electronic component between two metal-ceramic circuit board metal circuit boards in which the metal circuit board was bonded to one surface of the ceramic board. In a cooling structure in which the mounted electronic component mounting substrate is sandwiched and cooled by a pair of coolers, the metal circuit board is directly bonded to one surface of the ceramic substrate of each of the two metal-ceramic circuit substrates. An electronic component mounting board having excellent heat dissipation by directly joining one cooler of a pair of coolers to the other surface of the ceramic substrate of one metal-ceramic circuit board of two metal-ceramic circuit boards The present inventors have found that a cooling structure can be provided and have completed the present invention.

すなわち、本発明による電子部品搭載基板の冷却構造は、セラミックス基板の一方の面に金属回路板が接合した２つの金属−セラミックス回路基板の金属回路板の間に電子部品が挟持されて固定された電子部品搭載基板を一対の冷却器により挟持して冷却する冷却構造において、２つの金属−セラミックス回路基板の各々の金属−セラミックス回路基板のセラミックス基板の一方の面に金属回路板が直接接合し、２つの金属−セラミックス回路基板の一方の金属−セラミックス回路基板のセラミックス基板の他方の面に一対の冷却器の一方の冷却器が直接接合していることを特徴とする。   That is, the cooling structure for an electronic component mounting board according to the present invention is an electronic component in which the electronic component is sandwiched and fixed between two metal-ceramic circuit board metal circuit boards bonded to one surface of the ceramic board. In a cooling structure in which a mounting board is sandwiched and cooled by a pair of coolers, a metal circuit board is directly bonded to one surface of the ceramic board of each of the two metal-ceramic circuit boards. One cooler of the pair of coolers is directly bonded to the other surface of the ceramic substrate of one metal-ceramic circuit substrate of the metal-ceramic circuit substrate.

この電子部品搭載基板の冷却構造において、２つの金属−セラミックス回路基板の他方の金属−セラミックス回路基板のセラミックス基板の他方の面に金属部材が直接接合しているのが好ましい。この場合、２つの金属−セラミックス回路基板の他方の金属−セラミックス回路基板のセラミックス基板の他方の面に直接接合した金属部材が、熱伝導グリースを介して、一対の冷却器の他方の冷却器に接合しているのが好ましい。また、２つの金属−セラミックス回路基板の他方の金属−セラミックス回路基板のセラミックス基板に貫通穴が形成され、このセラミックス基板の他方の面に金属部材から離間して電極接続用金属板が直接接合し、この電極接続用金属板が貫通穴に充填された金属を介して他方の金属−セラミックス回路基板の金属回路板と電気的に接続されているのが好ましい。   In the cooling structure of the electronic component mounting substrate, it is preferable that the metal member is directly bonded to the other surface of the ceramic substrate of the other metal-ceramic circuit substrate of the two metal-ceramic circuit substrates. In this case, the metal member directly bonded to the other surface of the ceramic substrate of the other metal-ceramic circuit substrate of the two metal-ceramic circuit substrates is connected to the other cooler of the pair of coolers via the thermal conductive grease. It is preferable to join. In addition, a through hole is formed in the ceramic substrate of the other metal-ceramic circuit substrate of the two metal-ceramic circuit substrates, and the metal plate for electrode connection is directly bonded to the other surface of the ceramic substrate away from the metal member. The electrode connecting metal plate is preferably electrically connected to the metal circuit board of the other metal-ceramic circuit board through the metal filled in the through hole.

上記の電子部品搭載基板の冷却構造において、冷却器が、平板状の金属部材の一方の面に多数のフィンが形成された一対のフィン付き冷却板であり、２つの金属−セラミックス回路基板の一方の金属−セラミックス回路基板のセラミックス基板の他方の面に、一対のフィン付き冷却板の一方のフィン付き冷却板のフィンと反対側の面が直接接合しているのが好ましい。また、２つの金属−セラミックス回路基板の他方の金属−セラミックス回路基板のセラミックス基板の他方の面に金属部材が直接接合しているのが好ましい。この場合、２つの金属−セラミックス回路基板の他方の金属−セラミックス回路基板のセラミックス基板の他方の面に直接接合した金属部材が、熱伝導グリースを介して、一対のフィン付き冷却板の他方のフィン付き冷却板のフィンと反対側の面に接合しているのが好ましい。また、２つの金属−セラミックス回路基板の他方の金属−セラミックス回路基板のセラミックス基板に貫通穴が形成され、このセラミックス基板の他方の面に金属部材から離間して電極接続用金属板が直接接合し、この電極接続用金属板が貫通穴に充填された金属を介して他方の金属−セラミックス回路基板の金属回路板と電気的に接続されているのが好ましい。   In the cooling structure for an electronic component mounting board, the cooler is a pair of finned cooling plates in which a large number of fins are formed on one surface of a flat metal member, and one of the two metal-ceramic circuit boards. It is preferable that the other surface of the pair of finned cooling plates is directly bonded to the other surface of the ceramic substrate of the metal-ceramic circuit substrate. Moreover, it is preferable that the metal member is directly joined to the other surface of the ceramic substrate of the other metal-ceramic circuit substrate of the two metal-ceramic circuit substrates. In this case, the metal member directly bonded to the other surface of the ceramic substrate of the other metal-ceramic circuit substrate of the two metal-ceramic circuit substrates is connected to the other fin of the pair of cooling plates with fins via the thermal conductive grease. It is preferable to join to the surface of the attached cooling plate opposite to the fin. In addition, a through hole is formed in the ceramic substrate of the other metal-ceramic circuit substrate of the two metal-ceramic circuit substrates, and the metal plate for electrode connection is directly bonded to the other surface of the ceramic substrate away from the metal member. The electrode connecting metal plate is preferably electrically connected to the metal circuit board of the other metal-ceramic circuit board through the metal filled in the through hole.

上記の電子部品搭載基板の冷却構造において、金属部材が金属板であるのが好ましい。また、
一方の冷却器が、鋳型内にセラミックス基板を配置させた後に金属溶湯を注湯して冷却することによって、一方の金属−セラミックス回路基板のセラミックス基板の他方の面に直接接合しているのが好ましい。 In the cooling structure for an electronic component mounting board, the metal member is preferably a metal plate. Also,
One cooler is directly bonded to the other surface of the ceramic substrate of one metal-ceramic circuit board by pouring molten metal after cooling the ceramic substrate in the mold and cooling it. preferable.

本発明によれば、放熱性に優れた電子部品搭載基板の冷却構造を提供することができる。   ADVANTAGE OF THE INVENTION According to this invention, the cooling structure of the electronic component mounting board excellent in heat dissipation can be provided.

本発明による電子部品搭載基板の冷却構造の実施の形態によって冷却される電子部品搭載基板を概略的に示す側面図である。It is a side view which shows roughly the electronic component mounting substrate cooled by embodiment of the cooling structure of the electronic component mounting substrate by this invention. 図１の電子部品搭載基板の上側の金属−セラミックス回路基板の平面図である。It is a top view of the metal-ceramics circuit board of the upper side of the electronic component mounting board | substrate of FIG. 図２Ａの金属−セラミックス回路基板の側面図である。It is a side view of the metal-ceramic circuit board of FIG. 2A. 図２Ａの金属−セラミックス回路基板の裏面を示す図である。It is a figure which shows the back surface of the metal-ceramics circuit board of FIG. 2A. 図１の電子部品搭載基板を冷却するフィン付き冷却板の平面図である。It is a top view of the cooling plate with a fin which cools the electronic component mounting board of FIG. 図３Ａのフィン付き冷却板の長手方向側面図である。3B is a longitudinal side view of the finned cooling plate of FIG. 3A. FIG. 図３Ａのフィン付き冷却板の裏面を示す図である。It is a figure which shows the back surface of the cooling plate with a fin of FIG. 3A. 図３Ａのフィン付き冷却板の幅方向（短手方向）側面図である。It is a width direction (short side direction) side view of the finned cooling plate of FIG. 3A. 図３Ａのフィン付き冷却板に下側の金属−セラミックス回路基板と電子部品を搭載した状態を示す平面図である。It is a top view which shows the state which mounted the lower metal-ceramics circuit board and the electronic component on the cooling plate with a fin of FIG. 3A. 図４Ａの長手方向側面図である。FIG. 4B is a longitudinal side view of FIG. 4A. 図３Ａのフィン付き冷却板に下側の金属−セラミックス回路基板と電子部品と上側の金属−セラミックス回路基板を搭載し、エミッタ電極およびコレクタ電極を取り付けた状態を示す平面図である。It is a top view which shows the state which mounted the lower metal-ceramics circuit board, the electronic component, and the upper metal-ceramics circuit board on the cooling plate with a fin of FIG. 3A, and attached the emitter electrode and the collector electrode. 図５Ａの長手方向側面図である。FIG. 5B is a longitudinal side view of FIG. 5A. 本発明による電子部品搭載基板の冷却構造の実施の形態を概略的に示す側面図である。It is a side view which shows roughly the embodiment of the cooling structure of the electronic component mounting board | substrate by this invention.

以下、添付図面を参照して、本発明による電子部品搭載基板の冷却構造の実施の形態について詳細に説明する。   Embodiments of a cooling structure for an electronic component mounting board according to the present invention will be described below in detail with reference to the accompanying drawings.

図１に示すように、本発明による電子部品搭載基板の冷却構造の実施の形態によって冷却される電子部品搭載基板１０は、下側の金属−セラミックス回路基板１２と、上側の金属−セラミックス回路基板１４と、下側の金属−セラミックス回路基板１２と上側の金属−セラミックス回路基板１４の間に配置された電子部品１６、例えば、厚さ１００μｍ程度のダイオード１８および絶縁ゲート形バイポーラトランジスタ（ＩＧＢＴ）またはＭＯＳ型電界効果トランジスタ（ＭＯＳ−ＦＥＴ）２０からなる電子部品１６とを備えている。   As shown in FIG. 1, the electronic component mounting board 10 cooled by the embodiment of the cooling structure of the electronic component mounting board according to the present invention includes a lower metal-ceramic circuit board 12 and an upper metal-ceramic circuit board. 14, an electronic component 16 disposed between the lower metal-ceramic circuit board 12 and the upper metal-ceramic circuit board 14, such as a diode 18 having a thickness of about 100 μm and an insulated gate bipolar transistor (IGBT) or And an electronic component 16 composed of a MOS field effect transistor (MOS-FET) 20.

下側の金属−セラミックス回路基板１２は、（本実施の形態では略矩形の平面形状の）セラミックス基板２２と、このセラミックス基板２２の上面に直接接合した（セラミックス基板２２より小さい）略矩形の平面形状のアルミニウムなどの金属からなる１つまたは複数（図４Ａに示すように、本実施の形態では２つ）の金属回路板２４とを備えている。なお、下側の金属−セラミックス回路基板１２は、例えば、（図示しない）鋳型内にセラミックス基板２２を配置させた後にアルミニウム溶湯などの金属溶湯を注湯して冷却することによって、金属回路板２４を形成する際にセラミックス基板２２に直接接合させることによって製造することができる。   The lower metal-ceramic circuit board 12 includes a ceramic substrate 22 (which has a substantially rectangular planar shape in the present embodiment) and a substantially rectangular plane which is directly bonded to the upper surface of the ceramic substrate 22 (which is smaller than the ceramic substrate 22). And one or more (two in this embodiment, as shown in FIG. 4A) metal circuit boards 24 made of a metal such as aluminum having a shape. The lower metal-ceramic circuit board 12 is cooled by pouring a molten metal such as an aluminum melt after the ceramic substrate 22 is placed in a mold (not shown), for example. Can be manufactured by directly bonding to the ceramic substrate 22.

上側の金属−セラミックス回路基板１４は、図１および図２Ａ〜図２Ｃに示すように、略矩形の平面形状のセラミックス基板２６と、このセラミックス基板２６の下面に直接接合した（セラミックス基板２６より小さい）略矩形の平面形状の１つまたは複数（本実施の形態では３つの帯状）のアルミニウムなどの金属からなる金属回路板２８と、セラミックス基板２６の上面に直接接合した（セラミックス基板２６より小さい）略矩形の平面形状のアルミニウムなどの金属からなる金属部材（または金属板）３０および電極接続用金属板３２とを備えている。電極接続用金属板３２は、金属部材３０から離間して配置され、セラミックス基板２６の長手方向一端側の周縁部に沿って帯状に延びている。また、セラミックス基板２６には、電極接続用金属板３２に対向する位置に、１つまたは複数（本実施の形態では３つ）の貫通穴（スルーホール）２６ａが所定の間隔で形成されており、これらの貫通穴２６ａにアルミニウムなどの金属が充填されて金属回路板２８と電極接続用金属板３２とを電気的に接続している。なお、上側の金属−セラミックス回路基板１４は、例えば、（図示しない）鋳型内にセラミックス基板２６を配置させた後にアルミニウム溶湯などの金属溶湯を注湯して冷却して、貫通穴２６ａの内部の金属溶湯を固化させるとともに金属回路板２８と金属部材３０と電極形成用金属板３２を形成する際に、これらをセラミックス基板２６に直接接合させることによって製造することができる。   As shown in FIGS. 1 and 2A to 2C, the upper metal-ceramic circuit board 14 is directly bonded to the substantially rectangular planar ceramic substrate 26 and the lower surface of the ceramic substrate 26 (smaller than the ceramic substrate 26). ) Directly bonded to the upper surface of the ceramic substrate 26 (which is smaller than the ceramic substrate 26) and one or more (three strips in the present embodiment) of a substantially rectangular planar shape made of a metal such as aluminum. A metal member (or metal plate) 30 made of a metal such as aluminum having a substantially rectangular planar shape and a metal plate 32 for electrode connection are provided. The electrode-connecting metal plate 32 is disposed apart from the metal member 30 and extends in a strip shape along the peripheral edge on one end side in the longitudinal direction of the ceramic substrate 26. Further, one or a plurality of (three in the present embodiment) through holes (through holes) 26 a are formed at predetermined intervals on the ceramic substrate 26 at positions facing the electrode connecting metal plate 32. These through holes 26 a are filled with a metal such as aluminum to electrically connect the metal circuit board 28 and the electrode connecting metal plate 32. The upper metal-ceramic circuit board 14 is formed by, for example, placing a ceramic substrate 26 in a mold (not shown) and then pouring and cooling a molten metal such as a molten aluminum, so that the inside of the through hole 26a. When the molten metal is solidified and the metal circuit board 28, the metal member 30, and the electrode forming metal board 32 are formed, they can be manufactured by directly bonding them to the ceramic substrate 26.

図１に示すように、電子部品１６の下面は、それぞれ（例えば、厚さ１００μｍ程度の）半田３４を介して下側の金属−セラミックス回路基板１２の金属回路板２４の上面に接合され、電子部品１６の他方の面（上面）は、それぞれ（例えば、厚さ１００μｍ程度の）半田３４を介して上側の金属−セラミックス回路基板１４の金属回路板２８の下面に接合されている。   As shown in FIG. 1, the lower surface of the electronic component 16 is bonded to the upper surface of the metal circuit board 24 of the lower metal-ceramic circuit board 12 via a solder 34 (for example, about 100 μm thick). The other surface (upper surface) of the component 16 is joined to the lower surface of the metal circuit board 28 of the upper metal-ceramic circuit board 14 via a solder 34 (for example, having a thickness of about 100 μm).

また、下側の金属−セラミックス回路基板１２の金属回路板２４の上面の一端側には、コレクタ電極３６が接続され、上側の金属−セラミックス回路基板１４の電極接続用金属板３２の上面には、エミッタ電極３８が接続されている。また、ＩＧＢＴまたはＭＯＳ−ＦＥＴ２０の上面（の金属回路板２４の上面の他端側に対向する部分）には、ゲート電極４０が接続されている。なお、上側の金属−セラミックス回路基板１４の金属部材３０の上面には、熱伝導グリース４２が塗布される。   A collector electrode 36 is connected to one end of the upper surface of the metal circuit board 24 of the lower metal-ceramic circuit board 12, and an upper surface of the electrode connection metal plate 32 of the upper metal-ceramic circuit board 14. The emitter electrode 38 is connected. A gate electrode 40 is connected to the upper surface of the IGBT or MOS-FET 20 (the portion facing the other end of the upper surface of the metal circuit board 24). A heat conductive grease 42 is applied to the upper surface of the metal member 30 of the upper metal-ceramic circuit board 14.

本発明による電子部品搭載基板の冷却構造の実施の形態では、電子部品搭載基板１０の両主面が一対のフィン付き冷却板４４によって冷却されるようになっている。   In the embodiment of the cooling structure for an electronic component mounting board according to the present invention, both main surfaces of the electronic component mounting board 10 are cooled by a pair of finned cooling plates 44.

一対のフィン付き冷却板４４の各々は、図３Ａ〜図３Ｄに示すように、略矩形の平面形状の平板部４４ａの一方の面（裏面）の周縁部を除いた部分に多数のフィン４４ｂが形成されたアルミニウム部材などの金属部材からなる。多数のフィン４４ｂは、平板部４４ａから垂直方向に突出し且つ平板部４４ａの長手方向に延びる多数の板状体であり、互いに平板部４４ａの幅方向（短手方向）に所定の間隔で離間して配置されている。また、平板部４４ａの各々の角部付近には、貫通穴４４ｃが形成されている。なお、各々のフィン付き冷却板４４は、例えば、（図示しない）鋳型内にアルミニウム溶湯などの金属溶湯を注湯して冷却することによって製造することができる。   As shown in FIGS. 3A to 3D, each of the pair of finned cooling plates 44 has a large number of fins 44 b in a portion excluding the peripheral portion of one surface (back surface) of a substantially rectangular flat plate portion 44 a. It consists of metal members, such as the formed aluminum member. The large number of fins 44b are a large number of plate-like bodies protruding in the vertical direction from the flat plate portion 44a and extending in the longitudinal direction of the flat plate portion 44a, and are separated from each other at a predetermined interval in the width direction (short direction) of the flat plate portion 44a. Are arranged. A through hole 44c is formed near each corner of the flat plate portion 44a. Each finned cooling plate 44 can be manufactured, for example, by pouring a metal melt such as an aluminum melt into a mold (not shown) and cooling it.

図４Ａおよび図４Ｂに示すように、一対のフィン付き冷却板４４の一方（下側のフィン付き冷却板４４）の平板部４４ａの上面（フィン４４ｂと反対側の平面）には、１つまたは複数（本実施の形態では３つ）の下側の金属−セラミックス回路基板１２のセラミックス基板２２が直接接合している。すなわち、下側のフィン付き冷却板４４の平板部４４ａの上面のフィン４４ｂに対応する部分に、１つまたは複数（本実施の形態では３枚）のセラミックス基板２２の各々の下面が直接接合し、これらのセラミックス基板２２の各々の上面に、１つまたは複数（本実施の形態では２つ）の金属回路板２４が直接接合している。また、上述したように、金属回路板２４の各々の上面に、それぞれ１つまたは複数（本実施の形態では２つ）のダイオード１８およびＩＧＢＴまたはＭＯＳ−ＦＥＴ２０が半田３４を介して取り付けられている。なお、下側の金属−セラミックス回路基板１２は、例えば、１つまたは複数（本実施の形態では３枚）のセラミックス基板２２を（図示しない）鋳型内の同一面上に所定の間隔で配置させた後に、アルミニウム溶湯などの金属溶湯を注湯して冷却することによって、フィン付き冷却板４４および（それぞれのセラミックス基板２２上に）１つまたは複数（本実施の形態では２つ）の金属回路板２４を形成する際に、セラミックス基板２２に金属回路板２４およびフィン付き冷却板４４に直接接合させることによって製造することができる。   As shown in FIG. 4A and FIG. 4B, one or the other is provided on the upper surface (the plane opposite to the fins 44b) of the flat plate portion 44a of one of the pair of finned cooling plates 44 (lower finned cooling plate 44). A plurality (three in the present embodiment) of the lower metal-ceramic circuit boards 12 are directly bonded to the ceramic substrate 22. That is, the lower surfaces of one or a plurality of (three in the present embodiment) ceramic substrates 22 are directly bonded to the portions corresponding to the fins 44b on the upper surface of the flat plate portion 44a of the cooling plate 44 with fins on the lower side. One or a plurality of (two in the present embodiment) metal circuit boards 24 are directly bonded to the upper surface of each of the ceramic substrates 22. Further, as described above, one or a plurality of (two in the present embodiment) diodes 18 and IGBTs or MOS-FETs 20 are attached to the upper surface of each of the metal circuit boards 24 via the solder 34. . The lower metal-ceramic circuit board 12 includes, for example, one or a plurality (three in the present embodiment) of ceramic substrates 22 arranged at a predetermined interval on the same surface in a mold (not shown). After that, by pouring a metal melt such as an aluminum melt and cooling it, the finned cooling plate 44 and one or more (two in this embodiment) metal circuit (on each ceramic substrate 22) When the plate 24 is formed, it can be manufactured by directly joining the ceramic substrate 22 to the metal circuit plate 24 and the finned cooling plate 44.

図５Ａおよび図５Ｂは、下側のフィン付き冷却板４４の平板部４４ａの上面（フィン４４ｂと反対側の平面）に電子部品搭載基板１０に取り付けられた状態を示している。すなわち、図５Ａおよび図５Ｂは、それぞれの電子部品１６（それぞれの対のダイオード１８およびＩＧＢＴまたはＭＯＳ−ＦＥＴ２０）の上面に、上側の金属−セラミックス回路基板１４の金属回路板２８が半田３４を介して取り付けられ、コレクタ電極３６およびエミッタ電極３８が取り付けられた状態を示している。   5A and 5B show a state in which the electronic component mounting substrate 10 is attached to the upper surface of the flat plate portion 44a of the lower finned cooling plate 44 (the plane opposite to the fins 44b). That is, FIG. 5A and FIG. 5B show that the metal circuit board 28 of the upper metal-ceramic circuit board 14 is placed on the upper surface of each electronic component 16 (respective pair of diodes 18 and IGBT or MOS-FET 20) via the solder 34. The collector electrode 36 and the emitter electrode 38 are attached.

図６は、１つ以上（本実施の形態では４個）の電子部品１６を搭載した１つ以上（本実施の形態では３個）の電子部品搭載基板１０が一対のフィン付き冷却板４４によって挟持されて固定された状態を示している。図６に示すように、下側のフィン付き冷却板４４の平板部４４ａの上面（フィン４４ｂと反対側の平面）に取り付けられた電子部品搭載基板１０は、それぞれ電極内臓樹脂ケース４６内に配置され、コレクタ電極３６、エミッタ電極３８およびベース電極４０がそれぞれ電極内臓樹脂ケース４６に接続され、各々の電極内臓樹脂ケース４６内にエポキシ樹脂（またはＳｉゲルおよびエポキシ樹脂）などの樹脂４８が充填されている。また、電子部品搭載基板１０の各々（の上側の金属−セラミックス回路基板１４の金属部材３０）の上面には、上側のフィン付き冷却板４４がその平板部４４ａのフィン４４ｂと反対側の面が下向きになるように熱伝導グリース４２を介して配置され、１つ以上（本実施の形態では４つ）のボルト５０を上側および下側のフィン付き冷却板４４の平板部４４ａの貫通穴４４ｃに通してそれぞれナット５２を締結することによって、電子部品搭載基板１０が一対のフィン付き冷却板４４に挟持されて固定されている。   FIG. 6 shows that one or more (three in the present embodiment) electronic component mounting substrates 10 on which one or more (four in the present embodiment) electronic components 16 are mounted are provided by a pair of finned cooling plates 44. It shows a state of being pinched and fixed. As shown in FIG. 6, the electronic component mounting substrates 10 attached to the upper surface of the flat plate portion 44 a of the lower finned cooling plate 44 (the plane opposite to the fins 44 b) are respectively disposed in the electrode-embedded resin case 46. The collector electrode 36, the emitter electrode 38, and the base electrode 40 are respectively connected to the electrode-embedded resin case 46, and each electrode-embedded resin case 46 is filled with a resin 48 such as epoxy resin (or Si gel and epoxy resin). ing. Further, on the upper surface of each of the electronic component mounting substrates 10 (the metal member 30 of the upper metal-ceramic circuit board 14), the upper finned cooling plate 44 has a surface opposite to the fins 44b of the flat plate portion 44a. It arrange | positions through the heat conductive grease 42 so that it may face down, and 1 or more (4 in this Embodiment) bolt 50 is inserted in the through-hole 44c of the flat plate part 44a of the cooling plate 44 with a fin on the upper side and the lower side. The electronic component mounting board 10 is sandwiched and fixed between the pair of finned cooling plates 44 by tightening the nuts 52 respectively.

このようにして、本発明による電子部品搭載基板の冷却構造の実施の形態では、セラミックス基板２２、２６の一方の面に金属回路板２４、２８が直接接合した２つの金属−セラミックス回路基板１２、１４の金属回路板２４、２８間に電子部品１６を挟持して固定した電子部品搭載基板１０の両面を一対のフィン付き冷却板４４によって冷却しているので、放熱性を向上させることができる。   Thus, in the embodiment of the electronic component mounting board cooling structure according to the present invention, the two metal-ceramic circuit boards 12, in which the metal circuit boards 24, 28 are directly joined to one surface of the ceramic boards 22, 26, Since both surfaces of the electronic component mounting substrate 10 in which the electronic component 16 is sandwiched and fixed between the 14 metal circuit boards 24 and 28 are cooled by the pair of finned cooling plates 44, heat dissipation can be improved.

特に、本発明による電子部品搭載基板の冷却構造の実施の形態では、電子部品１６の下面を冷却するための下側の金属−セラミックス回路基板１４の金属回路板２４がセラミックス基板２２と直接接合し且つこのセラミックス基板２２が下側のフィン付き冷却板４４と直接接合しているので、電子部品１６の下面を冷却するための下側の金属−セラミックス回路基板１４と下側のフィン付き冷却板４４との間に熱伝導グリースを使用する必要がなく、さらに放熱性を向上させることができる。   In particular, in the embodiment of the cooling structure for the electronic component mounting board according to the present invention, the metal circuit board 24 of the lower metal-ceramic circuit board 14 for cooling the lower surface of the electronic component 16 is directly joined to the ceramic board 22. In addition, since the ceramic substrate 22 is directly bonded to the lower finned cooling plate 44, the lower metal-ceramic circuit substrate 14 and the lower finned cooling plate 44 for cooling the lower surface of the electronic component 16 are used. It is not necessary to use thermal conductive grease between the two, and heat dissipation can be further improved.

また、本発明による電子部品搭載基板の冷却構造の実施の形態では、電子部品搭載基板１０の上側の金属−セラミックス回路基板１４にスルーホールを設けているので、電極を接合し易く且つコンパクトな電子部品搭載基板１０にすることができる。   Further, in the embodiment of the cooling structure for the electronic component mounting board according to the present invention, since the metal-ceramic circuit board 14 on the upper side of the electronic component mounting board 10 is provided with a through hole, it is easy to join electrodes and a compact electronic device. The component mounting board 10 can be obtained.

なお、上述した本発明による電子部品搭載基板の冷却構造の実施の形態では、放熱フィンとしてフィン付き冷却板４４を使用した例について説明したが、放熱フィンの代わりに冷却ジャケットを使用してもよい。その場合、例えば、フィン付き冷却板４４のフィン４４ｂを覆うようにカバーを取り付けて、その内部に冷却材が流れるようにすればよい。   In the above-described embodiment of the cooling structure for an electronic component mounting board according to the present invention, the example in which the finned cooling plate 44 is used as the radiation fin has been described. However, a cooling jacket may be used instead of the radiation fin. . In that case, for example, a cover may be attached so as to cover the fins 44b of the finned cooling plate 44 so that the coolant flows through the cover.

１０ 電子部品搭載基板
１２ 下側の金属−セラミックス回路基板
１４ 上側の金属−セラミックス回路基板
１６ 電子部品
１８ ダイオード
２０ ＩＧＢＴまたはＭＯＳ−ＦＥＴ
２２、２６ セラミックス基板
２６ａ 貫通穴（スルーホール）
２４、２８ 金属回路板
３０ 金属部材（金属板）
３２ 電極接続用金属板
３４ 半田
３６ コレクタ電極
３８ エミッタ電極
４０ ベース電極
４２ 熱伝導グリース
４４ フィン付き冷却板
４４ａ 平板部
４４ｂ フィン
４４ｃ 貫通穴
４６ 電極内臓樹脂ケース
４８ 樹脂
５０ ボルト
５２ ナット DESCRIPTION OF SYMBOLS 10 Electronic component mounting board 12 Lower metal-ceramic circuit board 14 Upper metal-ceramic circuit board 16 Electronic component 18 Diode 20 IGBT or MOS-FET
22, 26 Ceramic substrate 26a Through hole (through hole)
24, 28 Metal circuit board 30 Metal member (metal plate)
32 Electrode connecting metal plate 34 Solder 36 Collector electrode 38 Emitter electrode 40 Base electrode 42 Thermal conductive grease 44 Finned cooling plate 44a Flat plate portion 44b Fin 44c Through hole 46 Electrode built-in resin case 48 Resin 50 Bolt 52 Nut

Claims (10)

セラミックス基板の一方の面に金属回路板が接合した２つの金属−セラミックス回路基板の金属回路板の間に電子部品が挟持されて固定された電子部品搭載基板を一対の冷却器により挟持して冷却する冷却構造において、２つの金属−セラミックス回路基板の各々の金属−セラミックス回路基板のセラミックス基板の一方の面に金属回路板が直接接合し、２つの金属−セラミックス回路基板の一方の金属−セラミックス回路基板のセラミックス基板の他方の面に一対の冷却器の一方の冷却器が直接接合していることを特徴とする、電子部品搭載基板の冷却構造。 Cooling in which an electronic component mounting board is sandwiched and cooled by a pair of coolers between two metal-ceramic circuit board metal circuit boards bonded to one surface of the ceramic board. In the structure, the metal circuit board is directly bonded to one surface of the ceramic substrate of each of the two metal-ceramic circuit boards, and the metal-ceramic circuit board of one of the two metal-ceramic circuit boards is bonded. A cooling structure for an electronic component mounting substrate, wherein one cooler of a pair of coolers is directly bonded to the other surface of the ceramic substrate. 前記２つの金属−セラミックス回路基板の他方の金属−セラミックス回路基板のセラミックス基板の他方の面に金属部材が直接接合していることを特徴とする、請求項１に記載の電子部品搭載基板の冷却構造。 The cooling of the electronic component mounting substrate according to claim 1, wherein a metal member is directly bonded to the other surface of the ceramic substrate of the other metal-ceramic circuit substrate of the two metal-ceramic circuit substrates. Construction. 前記２つの金属−セラミックス回路基板の他方の金属−セラミックス回路基板のセラミックス基板の他方の面に直接接合した金属部材が、熱伝導グリースを介して、前記一対の冷却器の他方の冷却器に接合していることを特徴とする、請求項２に記載の電子部品搭載基板の冷却構造。 A metal member directly bonded to the other surface of the ceramic substrate of the other metal-ceramic circuit substrate of the two metal-ceramic circuit substrates is bonded to the other cooler of the pair of coolers via thermal conductive grease. The cooling structure for an electronic component mounting board according to claim 2, wherein the electronic component mounting board is cooled. 前記２つの金属−セラミックス回路基板の他方の金属−セラミックス回路基板のセラミックス基板に貫通穴が形成され、このセラミックス基板の他方の面に前記金属部材から離間して電極接続用金属板が直接接合し、この電極接続用金属板が貫通穴に充填された金属を介して前記他方の金属−セラミックス回路基板の金属回路板と電気的に接続されていることを特徴とする、請求項２または３に記載の電子部品搭載基板の冷却構造。 A through-hole is formed in the ceramic substrate of the other metal-ceramic circuit substrate of the two metal-ceramic circuit substrates, and the metal plate for electrode connection is directly bonded to the other surface of the ceramic substrate so as to be separated from the metal member. The metal plate for electrode connection is electrically connected to the metal circuit board of the other metal-ceramic circuit board through the metal filled in the through hole. A cooling structure of the electronic component mounting board described. 前記冷却器が、平板状の金属部材の一方の面に多数のフィンが形成された一対のフィン付き冷却板であり、前記２つの金属−セラミックス回路基板の一方の金属−セラミックス回路基板のセラミックス基板の他方の面に、前記一対のフィン付き冷却板の一方のフィン付き冷却板のフィンと反対側の面が直接接合していることを特徴とする、請求項１に記載の電子部品搭載基板の冷却構造。 The cooler is a pair of finned cooling plates in which a large number of fins are formed on one surface of a flat metal member, and the ceramic substrate of one metal-ceramic circuit substrate of the two metal-ceramic circuit substrates 2. The electronic component mounting substrate according to claim 1, wherein a surface opposite to the fin of one of the finned cooling plates of the pair of finned cooling plates is directly bonded to the other surface of the electronic component mounting substrate. Cooling structure. 前記２つの金属−セラミックス回路基板の他方の金属−セラミックス回路基板のセラミックス基板の他方の面に金属部材が直接接合していることを特徴とする、請求項５に記載の電子部品搭載基板の冷却構造。 6. The cooling of an electronic component mounting board according to claim 5, wherein a metal member is directly bonded to the other surface of the ceramic substrate of the other metal-ceramic circuit substrate of the two metal-ceramic circuit substrates. Construction. 前記２つの金属−セラミックス回路基板の他方の金属−セラミックス回路基板のセラミックス基板の他方の面に直接接合した金属部材が、熱伝導グリースを介して、前記一対のフィン付き冷却板の他方のフィン付き冷却板のフィンと反対側の面に接合していることを特徴とする、請求項６に記載の電子部品搭載基板の冷却構造。 The metal member directly bonded to the other surface of the ceramic substrate of the other metal-ceramic circuit substrate of the two metal-ceramic circuit substrates is attached with the other fin of the pair of finned cooling plates via thermal conductive grease. The cooling structure for an electronic component mounting board according to claim 6, wherein the cooling structure is bonded to a surface of the cooling plate opposite to the fin. 前記２つの金属−セラミックス回路基板の他方の金属−セラミックス回路基板のセラミックス基板に貫通穴が形成され、このセラミックス基板の他方の面に前記金属部材から離間して電極接続用金属板が直接接合し、この電極接続用金属板が貫通穴に充填された金属を介して前記他方の金属−セラミックス回路基板の金属回路板と電気的に接続されていることを特徴とする、請求項６または７に記載の電子部品搭載基板の冷却構造。 A through-hole is formed in the ceramic substrate of the other metal-ceramic circuit substrate of the two metal-ceramic circuit substrates, and the metal plate for electrode connection is directly bonded to the other surface of the ceramic substrate so as to be separated from the metal member. The metal plate for electrode connection is electrically connected to a metal circuit plate of the other metal-ceramic circuit board through a metal filled in a through hole, according to claim 6 or 7, A cooling structure of the electronic component mounting board described. 前記金属部材が金属板であることを特徴とする、請求項２乃至４および６乃至８のいずれかに記載の電子部品搭載基板の冷却構造。 9. The cooling structure for an electronic component mounting substrate according to any one of claims 2 to 4 and 6 to 8, wherein the metal member is a metal plate. 前記一方の冷却器が、鋳型内にセラミックス基板を配置させた後に金属溶湯を注湯して冷却することによって、前記一方の金属−セラミックス回路基板のセラミックス基板の他方の面に直接接合していることを特徴とする、請求項１乃至１０のいずれかに記載の電子部品搭載基板の冷却構造。 The one cooler is directly bonded to the other surface of the ceramic substrate of the one metal-ceramic circuit substrate by pouring and cooling the molten metal after the ceramic substrate is placed in the mold. The cooling structure for an electronic component mounting board according to claim 1, wherein the electronic component mounting board is cooled.
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