JP2012028745A - Wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wiring board which has a connection terminal column capable of positioning in regard to a connection terminal column of another wiring board without using a connector.SOLUTION: A wiring board 1 includes a connection terminal column 21 which is formed in one surface of a substrate 11 and connected to a connection terminal column of another substrate. A first mark 27 is provided in a specific position established based on a specific portion of the connection terminal column 21 for positioning in regard to the connection terminal column of another substrate. They are configured so that a specific position of another substrate can be visually recognized through the first mark 27.

Description

  The present invention relates to a wiring board provided with a connection terminal row connected to a connection terminal row of another substrate.

  Conventionally, when connecting a connection terminal row on a wiring board and a connection terminal row on another board, the connection terminal rows are connected to each other via a connector. However, with the miniaturization of electronic devices, there is an increasing demand for reducing the space at the connection portion between the connection terminal rows. Therefore, as shown in Patent Document 1, a method of connecting connection terminal rows without using a connector has been proposed.

  According to the technique of Patent Document 1, an insulating layer is formed around the connected terminal row of the substrate to form a groove corresponding to the connected terminal row. And the connection terminal row | line | column of a wiring board and the connection terminal row | line | column of a board | substrate are positioned by inserting the connection terminal row | line | column of the wiring board connected to this board | substrate in this groove | channel.

Japanese Patent Laid-Open No. 10-41599

  However, although the technique of the above-mentioned document 1 can be applied when connecting the connection terminal row protruding from the end face of the substrate to the connection terminal row of another substrate, the connection terminal rows provided on the surface of the substrate are connected to each other. This technology cannot be applied when connecting the two.

  Also, when connecting the connection terminal rows provided on the surface of the substrate, the connection terminal rows are opposed to each other, so that the operator can only see the back side of the connection terminal row and can visually recognize the connection terminal row. Therefore, it is difficult to position the connection terminal rows.

  This invention is made | formed in view of such a situation, The objective is to provide the wiring board which can position a connection terminal row | line | column easily with respect to the connection terminal row | line of another board | substrate.

In the following, means for achieving the above object and its effects are described.
(1) The invention according to claim 1 is a wiring board including a connection terminal array formed on one surface of a substrate and connected to a connection terminal array of another substrate, and a specific portion of the connection terminal array A mark for positioning with respect to the connected terminal row of the other substrate is provided at a specific position set with reference to the reference, and the specific position of the other substrate can be visually recognized through this mark The gist is that it is said.

  According to the present invention, since the specific position of the other substrate can be visually recognized through this mark, the mark on the wiring board and the specific position of the other substrate can be matched. Therefore, when the positional relationship between the connected terminal row on the other board and the specific position is the same as the positional relationship between the connection terminal row on the wiring board and the mark, the mark on the wiring board and the specific position on the other board are By matching, both can be positioned in a predetermined arrangement. In addition, since the specific position of the other board is visually recognized through the mark on the wiring board, the connection terminal string is connected to the connected terminal string even if the connection terminal string on the wiring board and the connected terminal string on the board are not visible. Can be positioned.

  (2) The invention described in claim 2 is the wiring board according to claim 1, wherein the mark is at least one of the connection terminals constituting the connection terminal row, or an edge or corner of the connection terminal. It is the gist.

  According to the present invention, since the connection terminal or a part thereof is used as a positioning mark, it is not necessary to form a new mark on the wiring board by printing or laser marking. For this reason, since the process of forming the mark can be omitted, the manufacturing process of the wiring board can be simplified. Further, since it is not necessary to secure a space for forming the mark, the wiring board 1 can be made small.

  (3) The invention described in claim 3 is the wiring board according to claim 2, wherein the substrate includes two first substrates that cover portions other than the connection terminal row of the wiring, and the back side of the connection terminal row. And a second substrate that supports the surface, and the second substrate is formed of a substrate that can see through the other substrate.

  In the present invention, since the second substrate is transparent, the connection terminal can be used as a mark for positioning. Since the connected terminals of other boards can be visually recognized with reference to the connecting terminals functioning as marks, the connecting terminals of the wiring board can be formed by matching the connecting terminals with the connected terminals of the other boards. It can position with respect to the to-be-connected terminal row | line | column.

(4) The invention according to claim 4 is the wiring board according to any one of claims 1 to 3, wherein the substrate can be seen through the other substrate. .
According to this invention, since the board | substrate of a wiring board is transparent, the specific position of another board | substrate can be visually recognized on the basis of a mark. Thereby, the same mark of a wiring board and the specific position of another board | substrate can be corresponded, and the connection terminal row | line | column of a wiring board can be positioned with respect to the to-be-connected terminal row | line | column of a board | substrate.

(5) The invention according to claim 5 is the wiring board according to claim 1, characterized in that the mark is a through-hole penetrating the substrate.
According to this invention, since the mark is a through hole, a specific position of another substrate can be visually recognized through the through hole. Thereby, the same mark of a wiring board and the specific position of another board | substrate can be corresponded, and the connection terminal row | line | column of a wiring board can be positioned with respect to the to-be-connected terminal row | line | column of a board | substrate.

(6) The invention according to claim 6 is the wiring board according to claim 1, wherein the mark is a notch provided at an end portion of the substrate.
According to the present invention, since the mark is a notch, a specific position of another substrate can be visually recognized through the notch. Thereby, the same mark of a wiring board and the specific position of another board | substrate can be corresponded, and the connection terminal row | line | column of a wiring board can be positioned with respect to the to-be-connected terminal row | line | column of a board | substrate.

  (7) The invention according to claim 7 is the wiring board according to any one of claims 1 to 6, wherein the mark is an allowable range of misalignment between the mark and a specific position of the other substrate. The gist is that it stipulates.

  According to this invention, it is possible to visually recognize whether or not the positional deviation between the mark on the wiring board and the other substrate is within an allowable range. Thereby, it can be easily determined whether or not the connection terminal row of the wiring board and the connected terminal row of the substrate are in a predetermined positional relationship.

  Note that when the connection terminal is a mark, the connection terminal and the connected terminal of another substrate are preferably approximately the same size, but one may be slightly larger than the other. When the connection terminal is smaller, the alignment range can be visually recognized when the connection terminal is placed on the connection target terminal of another substrate. On the contrary, when the connection terminal is larger than the connection terminal of the other board, when the connection terminal is placed on the connection terminal of the other board, all of the connection terminals of the other board are hidden. Then, it is determined that the positional deviation between the wiring board and the other substrate is within an allowable range.

  (8) In the wiring board according to any one of claims 1 to 7, the invention according to claim 8 is a conductive resin containing conductive particles on the upper surface of each connection terminal constituting the connection terminal row. The conductive connection layer formed by the above-described method is provided, and an insulating layer that insulates the connection terminals is provided between at least one set of connection terminals of the connection terminals constituting the connection terminal row. The gist of the present invention is that it is formed of an insulating adhesive that adheres to each other.

  According to this invention, when the connection terminal row of the wiring board and the connected terminal row of the other substrate are connected, the insulating layer adheres to the portion between the connected terminal rows of the other substrate. That is, the connection terminal row of one substrate and the connected terminal row of the other substrate are electrically connected via the conductive connection layer, and one wiring board and the other substrate are bonded by an insulating adhesive. . For this reason, compared with what does not adhere | attach one wiring board and another board | substrate with an insulating adhesive agent, the intensity | strength of the connection part of a wiring board and a board | substrate can be enlarged.

  (9) The invention according to claim 9 is the wiring board according to any one of claims 1 to 8, wherein the connection terminal portion includes a portion where the connection terminal row is formed. The gist is that a reinforcing plate to be reinforced is provided and the mark is provided on the connection terminal portion.

  According to this invention, the connection terminal row is reinforced by the reinforcing plate. Further, since the mark is formed on the reinforcing plate, the position accuracy of the mark with respect to the reference position of the connection terminal row can be increased.

(10) The invention according to claim 10 is the wiring board according to claim 9, wherein the reinforcing plate is provided with a heating hole corresponding to the connection terminal row.
According to this invention, since the reinforcing plate is provided with the heating holes, when the connection terminal row is heated, the portion where the connection terminal row is provided can be heated without using the reinforcement plate. For this reason, the connection terminal row can be rapidly heated to a predetermined temperature as compared with the case where the portion where the connection terminal row is provided is covered with the reinforcing plate.

  (11) According to an eleventh aspect of the present invention, in the wiring board according to any one of the first to tenth aspects, two marks are provided at different positions with reference to a specific portion of the connection terminal row. The gist is that

  According to this invention, by matching the two marks with the specific positions of the corresponding other boards, the terminal arrangement direction of the connection terminal row of the wiring board is matched with the terminal arrangement direction of the connected terminal row. Both can be positioned.

  ADVANTAGE OF THE INVENTION According to this invention, the wiring board which has a connection terminal row | line | column which can be positioned with respect to the connection terminal row | line of another board | substrate can be provided, without using a connector.

The perspective view shown to the perspective structure of a part of connection terminal part about the wiring board of embodiment of this invention. The top view which shows the planar structure of the back surface of the wiring board of the embodiment. The schematic diagram which shows typically the connection method of the wiring board and board | substrate of the embodiment. The top view which planarly viewed what positioned the wiring board and board | substrate of the embodiment. The schematic diagram which shows typically the adhesion method of the wiring board and board | substrate of the embodiment. The top view which planarly viewed what positioned this wiring board and board | substrate about the 1st modification of embodiment of this invention. The top view which planarly viewed what positioned this wiring board and board | substrate about the 2nd modification of embodiment of this invention. The top view which planarly viewed what positioned this wiring board and board | substrate about the 3rd modification of embodiment of this invention. The perspective view shown in the perspective structure of a part of connection terminal part about the 4th modification of embodiment of this invention. Sectional drawing of the product in a manufacture process about the wiring board of the modification. Sectional drawing of the product in a manufacture process about the wiring board of the modification.

With reference to FIGS. 1-5, one Embodiment which actualized the wiring board of this invention is described.
As shown in FIGS. 1 and 2, the wiring board 1 includes a main body portion 10 and a connection terminal portion 20 provided at a distal end portion of the main body portion 10. The connection terminal portion 20 is connected to the connected terminal portion 50 of the substrate 40.

  The main body 10 is composed of a wiring pattern 12 formed of a conductive material, a substrate 11 that sandwiches the wiring pattern 12, and an adhesive that is applied between the substrate 11 and the wiring pattern 12 to bond the substrate 11 and the wiring pattern 12 together. Layer 13. The wiring pattern 12 is an arrangement of a plurality of conductors.

  A transparent substrate 11 is used. Specifically, the substrate 11 is transparent so that the other substrate 40 can be seen through. The adhesive that forms the adhesive layer 13 is transparent when cured. Specifically, an adhesive that is transparent to the extent that the other substrate 40 can be seen through when the adhesive is cured is used. That is, by providing the transparent substrate 11 and the transparent adhesive layer 13, the wiring board 1 is transparent, and when the wiring board 1 is viewed from one surface side, the wiring board 1 is disposed on the other surface side. It has a transparent structure.

  Examples of the substrate 11 include an insulating resin sheet of polyethylene terephthalate having a thickness of 12 μm. The adhesive layer 13 is formed with a polyester adhesive on the substrate 11 with a thickness of 30 μm. Examples of the wiring pattern 12 include a copper foil wire having a thickness of 35 μm.

  The connection terminal portion 20 is provided between the base portion 20A, the connection terminal 22 provided on the upper surface of the base portion 20A, the conductive connection layer 23 formed on the upper surface of each connection terminal 22, and the adjacent connection terminal 22. And the reinforcing plate 26 that reinforces the connection terminal portion 20. The base portion 20 </ b> A includes a portion provided by extending the substrate 11 of the main body portion 10 and a portion provided by extending the adhesive layer 13 of the main body portion 10. Hereinafter, the arrangement direction of the connection terminals 22 is referred to as a terminal arrangement direction XA, and the longitudinal direction of the connection terminals 22 is referred to as a wiring direction YA.

  The connection terminals 22 are provided by extending the wiring pattern 12 and are arranged in parallel with each other at equal intervals to form the connection terminal row 21. The distance DA between the adjacent connection terminals 22 (center line) is 0.5 mm or 0.3 to 1.0 mm, and the distance between the side ends of the adjacent connection terminals 22 (hereinafter, “inter-terminal distance DB”) is 0.2 mm or 0.15 to 0.3 mm. Each connection terminal 22 is provided on the laminated adhesive layer 13 on the substrate 11, and the lower part of the connection terminal 22 is embedded in the adhesive layer 13.

  The conductive connection layer 23 is formed on the upper surface of each connection terminal 22. The conductive connection layer 23 is formed with a thickness of 15 μm using, for example, a thermoplastic silver paste. In addition, as a silver paste, it is preferable to use the silver paste containing the flaky silver powder with an average particle diameter of 0.5-5 micrometers, and the spherical silver powder with an average particle diameter of 20 nm or less by which the organic substance was metal-coated. By containing spherical silver powder having an average particle diameter of 20 nm or less in the silver paste, the surface of the conductive connection layer 23 can be made smooth. For this reason, this makes it possible to increase the contact area between the surface portion of the conductive connection layer 23 and the connected terminal 52 of the substrate 40.

  The insulating layer 24 is provided on the adhesive layer 13. The height of the upper surface of the insulating layer 24 is provided at a position higher than the position of the upper surface of the conductive connection layer 23 with the upper surface of the substrate 11 as the reference surface 25. The step HA between the insulating layer 24 and the conductive connection layer 23 is set to be larger than the height of the connected terminal 52 of the other substrate 40. The end surface distance WA between the insulating layers 24 adjacent to each other is the same as or longer than the length in the width direction of the connected terminal 52 of the substrate 40.

  Examples of the insulating adhesive that forms the insulating layer 24 include a polyester-based hot-melt connecting agent. For example, the insulating layer 24 preferably has a melting temperature of 120 ° C. to 150 ° C. When the melting temperature is lower than 120 ° C., the adhesive strength between the wiring board 1 and the other substrate 40 may be reduced. If the melting temperature is higher than 150 ° C., the substrate 11 may be deformed or the adhesive force between the substrate 11 and the adhesive layer 13 may be reduced.

  The reinforcing plate 26 is provided on the back side of the connection terminal portion 20, that is, the side opposite to the surface (back surface) on which the connection terminal 22 is formed. The reinforcing plate 26 is transparent, and the connecting terminal portion 20 is transparent when the reinforcing plate 26 is provided on the connecting terminal portion 20. Examples of the reinforcing plate 26 include a polyethylene terephthalate substrate and a polyimide substrate. In addition, the reinforcing plate 26 having a heat resistance temperature higher than the melting temperature of the insulating adhesive is used as the reinforcing plate 26.

  As shown in FIG. 2, the reinforcing plate 26 is formed with heating holes 30 corresponding to the connection terminal rows 21. The heating hole 30 is provided in a substantially square shape. The upper side 31 and the lower side 32 of the heating hole 30 are orthogonal to the longitudinal direction of the connection terminal 22. The left side 33 of the heating hole 30 is disposed outside the connection terminal row 21 and extends along the wiring direction YA, and the right side 34 is disposed outside the connection terminal row 21 and extends along the wiring direction YA. Has been.

  Further, a first mark 27 and a second mark 28 are provided at both ends of the connection terminal portion 20. The first mark 27 and the second mark 28 are used to align the connecting terminal 22 and the connected terminal row 51 when connecting the connecting terminal row 21 of the wiring board 1 to the connected terminal row 51 of the substrate 40. Used. The first mark 27 and the second mark 28 are formed by laser marker or ink jet printing, stamping printing, stamping mark molding, or the like.

  Hereinafter, in FIG. 3, the intersection of the right edge of the rightmost connection terminal 22 and the leading edge of the wiring board 1 is defined as an origin (reference position) KA for defining the position of the first mark 27. An axis passing through the origin KA and in the same direction as the terminal arrangement direction X is taken as an X axis, and an axis passing through the origin KA and in the same direction as the wiring direction Y is taken as a Y axis. The connection terminal 22 provided with the origin is referred to as a reference terminal 22K.

  In FIG. 2, the first mark 27 is formed on the right side of the connection terminal 22 at the right end of the connection terminal row 21 and on the portion where the reinforcing plate 26 is provided. The first mark 27 has a cross shape. The first mark 27 is provided so that the center point thereof is the coordinates (X1, Y1).

  In FIG. 2, the second mark 28 is formed on the left side of the connection terminal 22 at the left end of the connection terminal row 21 and on the portion where the reinforcing plate 26 is provided. The second mark 28 has a cross shape. The second mark 28 is provided so that the center point thereof is the coordinates (X2, Y1).

With reference to FIG. 3, the board | substrate 40 to which the wiring board 1 is connected is demonstrated.
The substrate 40 includes a base plate 41 formed of glass epoxy resin and a connected terminal portion 50 provided on one surface of the base plate 41.

  The connected terminal portion 50 includes a connected terminal row 51 including a plurality of connected terminals 52. The interval between adjacent connected terminals 52 is the same as the interval between adjacent connection terminals 22. Hereinafter, the arrangement direction of the connected terminals 52 is referred to as a terminal arrangement direction XB, and the longitudinal direction of the connected terminals 52 is referred to as a wiring direction YB.

  A third mark 53 and a fourth mark 54 are provided at both ends of the connected terminal portion 50. The third mark 53 and the fourth mark 54 align the connected terminal row 51 and the connecting terminal 22 when connecting the connected terminal row 51 of the substrate 40 and the connecting terminal row 21 of the wiring board 1. Used for.

  In FIG. 3, the vertex at the upper right corner of the connected terminal connected to the reference terminal 22K (hereinafter referred to as “referenced terminal 52K”) is the origin (reference position) KB for defining the position of the third mark 53. And An axis passing through the origin KB and in the same direction as the terminal arrangement direction XB is defined as an X axis, and an axis passing through the origin KB and in the same direction as the wiring direction YB is defined as a Y axis.

  The third mark 53 is formed on the right side of the connected terminal 52 at the right end of the connected terminal row 51 in FIG. The third mark 53 has a cross shape. The third mark 53 is provided so that the center point thereof is the coordinates (X1, Y1).

  The fourth mark 54 is formed on the left side of the connected terminal 52 at the left end of the connected terminal row 51 in FIG. The fourth mark 54 has a cross shape. The fourth mark 54 is provided so that the center point thereof is the coordinates (X2, Y1).

With reference to FIG. 3 and FIG. 4, the positioning method of the wiring board 1 and the board | substrate 40 is demonstrated.
First, the substrate 40 is fixed to the base 61 with the surface on which the connected terminal 52 is provided facing upward. This fixing is performed in such a manner that the substrate 40 can be easily removed from the base 61 after the connection between the wiring board 1 and the substrate 40 is completed. For example, the base 61 and the substrate 40 are temporarily fixed with an adhesive tape. Alternatively, a ferromagnetic material such as iron can be used as the base 61, and the substrate 40 can be fixed to the base 61 using a magnet.

  Next, the wiring board 1 is positioned with respect to the substrate 40 with the connection terminals 22 facing downward. Specifically, the connecting terminal portion 20 of the wiring board 1 and the connected terminal portion 50 of the substrate 40 are overlapped, the center of the first mark 27 and the center of the third mark 53 are aligned, and the second mark 28 is aligned. The wiring board 1 is positioned with respect to the substrate 40 so that the center of the fourth mark 54 coincides with the center of the fourth mark 54. The positioning operation is performed by using a microscope to detect a positional deviation between the center of the first mark 27 and the center of the third mark 53 and a positional deviation between the center of the second mark 28 and the center of the fourth mark 54. It is preferable to carry out so as to fall within a predetermined range (hereinafter, “allowable range”). For example, when the inter-terminal distance DB is 0.2 mm, the allowable range of misalignment is ± 0.05 mm.

  The first mark 27 and the second mark 28 are provided at predetermined coordinates with the specific position of the reference terminal 22K as the origin KA. The third mark 53 and the fourth mark 54 are provided at predetermined positions with the specific position of the reference terminal 52K as the origin KB. The coordinates of the first mark 27 and the third mark 53 are the same, and the coordinates of the second mark 28 and the fourth mark 54 are the same. Due to such a relationship, the connection terminal row 21 of the wiring board 1 and the connected terminal row 51 of the substrate 40 are positioned without deviation from each other.

  When the wiring board 1 and the substrate 40 are overlapped, the conductive connection layer 23 of the connection terminal 22 and the connected terminal row 51 corresponding to the connection terminal 22 come into contact with each other and the insulating layer 24 is connected. It is in a state of being fitted between the terminals 52.

With reference to FIG. 5, the wiring board 1, the board | substrate 40, and the adhesion | attachment method are demonstrated.
After positioning the wiring board 1 and the substrate 40, the heater portion 71 of the heater 70 is pressed against the portion corresponding to the heating hole 30 of the reinforcing plate 26 to heat the connection terminal row 21 of the wiring board 1. At this time, since a part of the insulating layer 24 is melted, a portion between the insulating layer 24 of the wiring board 1 and the connected terminal 52 is bonded.

According to this embodiment, the following effects are produced.
(1) In the present embodiment, the first mark for positioning with respect to the connected terminal row 51 of the other substrate 40 at a specific coordinate set based on the specific position (origin KA) of the reference terminal 22K. 27 is provided. The third mark 53 at a specific position on the other substrate 40 can be seen through the first mark 27.

  According to this configuration, the third mark 53 of the other substrate 40 can be visually recognized through the first mark 27 with the first mark as a reference, so that the first mark 27 of the wiring board 1 and the other substrate 40 can be seen. The third mark 53 can be matched.

  Further, since the positional relationship between the connected terminal row 51 and the third mark 53 of the other substrate 40 is the same as the positional relationship between the connecting terminal row 21 and the first mark 27 of the wiring board 1, By matching the first mark 27 with the third mark 53 of the other substrate 40, both can be positioned in a predetermined arrangement.

  Further, since the third mark 53 of the other substrate 40 is visually recognized through the first mark 27 of the wiring board 1, the connection terminal row 21 of the wiring board 1 and the connected terminal row 51 of the substrate 40 cannot be visually recognized. Even so, the connection terminal row 21 can be positioned with respect to the connected terminal row 51.

  (2) In the present embodiment, the substrate 11 is transparent, and the other substrate 40 can be seen through the first mark 27. According to this configuration, since the substrate 11 of the wiring board 1 is transparent, the third mark 53 of another substrate 40 can be visually recognized through the first mark 27 with reference to the first mark. As a result, the first mark 27 of the wiring board 1 and the third mark 53 of the other substrate 40 can be aligned to position the connection terminal row 21 of the wiring board 1 with respect to the connected terminal row 51.

  (3) In the present embodiment, a conductive connection layer 23 formed of silver paste containing silver powder is provided on the upper surface of each connection terminal 22 constituting the connection terminal row 21, and the connection terminals 22 are connected between the connection terminals 22. An insulating layer 24 that insulates 22 from each other is provided. The insulating layer 24 is formed of a hot melt adhesive.

  According to this configuration, when the connection terminal row 21 of the wiring board 1 and the connected terminal row 51 of the other substrate 40 are connected, the insulating layer 24 is a portion between the connected terminal row 51 of the other substrate 40. Adhere with. That is, the connection terminal row 21 of one wiring board 1 and the connected terminal row 51 of the other substrate 40 are electrically connected via the conductive connection layer 23. Further, the wiring board 1 and the other substrate 40 are bonded by a hot melt adhesive. For this reason, compared with what the wiring board 1 and the other board | substrate 40 are not adhere | attached with a hot-melt-adhesive agent, the intensity | strength of the connection part of the wiring board 1 and the board | substrate 40 can be enlarged.

  (4) In the present embodiment, the reinforcing plate 26 that reinforces the connecting terminal portion 20 is provided on the connecting terminal portion 20 including the portion where the connecting terminal row 21 is formed. Further, the first mark 27 is provided on the connection terminal portion 20.

  According to this configuration, the connection terminal row 21 is reinforced by the reinforcing plate 26. Further, since the first mark 27 is formed on the reinforcing plate 26, the positional accuracy of the first mark 27 with respect to the reference position (origin KA) of the connection terminal row 21 can be increased.

  (5) In the present embodiment, the heating holes 30 are provided corresponding to the connection terminal rows 21. According to this configuration, since the reinforcing plate 26 is provided with the heating holes 30, when the connection terminal row 21 is heated, the portion where the connection terminal row 21 is provided is heated without using the reinforcement plate 26. can do. For this reason, the connection terminal row | line | column 21 can be heated to predetermined temperature rapidly compared with the thing in which the part in which the connection terminal row | line | column 21 is provided is covered with the reinforcement board 26. FIG.

  (6) In the present embodiment, the first mark 27 and the second mark 28 are provided at different positions with a specific portion of the connection terminal row 21 as a reference. According to this configuration, the first mark 27 is matched with the third mark 53 of the other substrate 40 and the second mark 28 is matched with the fourth mark 54 of the other substrate 40, whereby the connection terminal of the wiring board 1 is obtained. The terminal arrangement direction XA of the row 21 and the terminal arrangement direction XB of the connected terminal row 51 can be matched to position both.

<First Modification>
With reference to FIG. 6, the modification of the positioning structure of the wiring board 1 with respect to the board | substrate 40 is demonstrated.
The wiring board 1 of this modification is obtained by adding the following changes to the configuration of the above embodiment. That is, in the above embodiment, the wiring board 1 and the substrate are arranged so that the center of the first mark 27 and the center of the third mark 53 coincide, and the center of the second mark 28 and the center of the fourth mark 54 coincide. 40. On the other hand, in the present modification, the first mark 127 has a shape in which the third mark 153 enters inside. The relationship between the second mark and the fourth mark is the same as the relationship between the first mark 127 and the third mark 153. Hereinafter, the detailed change from the structure of the said embodiment which arises with this change is demonstrated. About the structure which is common in the said embodiment, the same code | symbol is attached | subjected and the description is abbreviate | omitted.

  In FIG. 6, the first mark 127 of the wiring board 1 is formed on the right side of the connection terminal 22 at the right end of the connection terminal row 21 and on the portion where the reinforcing plate 26 is provided. The first mark 127 has a donut shape having a predetermined inner diameter.

  On the other hand, the third mark 153 is circular, and the diameter is smaller than the inner diameter of the first mark 127. For example, the difference between the inner diameter of the first mark 127 and the diameter of the third mark 153 is 0.1 mm. That is, when the third mark 153 is within the first mark 127, the positional deviation between the center of the first mark 127 and the center of the third mark 153 is within ± 0.05 mm.

  When positioning the connection terminal row 21 of the wiring board 1 and the connected terminal row 51 of the board 40, the wiring board 1 and the board 40 are positioned so that the third mark 153 is placed inside the first mark 127. . Thereby, it is possible to easily visually recognize whether or not the positional deviation between the first mark 127 and the third mark 153 is within the allowable range.

According to this modification, in addition to the effects (1) to (6), the following effects can be achieved.
(7) In the present modification, the first mark 127 is configured to define an allowable range of positional deviation between the first mark 127 and the third mark 153 of the other substrate 40. According to this configuration, it is possible to visually recognize whether or not the positional deviation between the first mark 127 of the wiring board 1 and the third mark 153 of the other substrate 40 is within an allowable range. Thereby, it can be easily determined whether or not the connection terminal row 21 of the wiring board 1 and the connected terminal row 51 of the substrate 40 are in a predetermined positional relationship.

<Second Modification>
With reference to FIG. 7, the modification of the positioning structure of the wiring board 1 with respect to the board | substrate 40 is demonstrated.
The wiring board 1 of this modification is obtained by adding the following changes to the configuration of the above embodiment. That is, in the above embodiment, the wiring board 1 and the substrate are arranged so that the center of the first mark 27 and the center of the third mark 53 coincide, and the center of the second mark 28 and the center of the fourth mark 54 coincide. 40. On the other hand, in the present modification, the first mark 227 is formed in a shape in which the third mark 253 enters inside. The relationship between the second mark and the fourth mark is the same as the relationship between the first mark 227 and the third mark 253. Hereinafter, the detailed change from the structure of the said embodiment which arises with this change is demonstrated. About the structure which is common in the said embodiment, the same code | symbol is attached | subjected and the description is abbreviate | omitted.

  In FIG. 7, the first mark 227 of the wiring board 1 is formed on the right side of the connection terminal 22 at the right end of the connection terminal row 21 and on the portion where the reinforcing plate 26 is provided. The first mark 227 is a through hole having a predetermined diameter.

  On the other hand, the third mark 253 is circular, and the diameter is smaller than the diameter of the first mark 227. For example, the difference between the diameter of the first mark 227 and the diameter of the third mark 253 is 0.1 mm. That is, when the third mark 253 is within the first mark 227, the positional deviation between the center of the first mark 227 and the center of the third mark 253 is within ± 0.05 mm.

  When positioning the connection terminal row 21 of the wiring board 1 and the connected terminal row 51 of the board 40, the wiring board 1 is arranged so that the third mark 253 is placed inside the first mark 227, as in the first modification. And the substrate 40 are positioned. Thereby, it is possible to easily recognize whether or not the positional deviation between the first mark 227 and the third mark 253 is within an allowable range.

  In the case of this modification, since the first mark 227 is formed as a through hole, the substrate 11 and the adhesive layer 13 do not need to be transparent. Therefore, the substrate 11 and the adhesive layer 13 can be selected from colored materials.

According to this modification, in addition to the effects (1) to (7), the following effects can be achieved.
(8) In the present modification, the first mark 227 is configured as a through hole penetrating the substrate 11. According to this structure, since the 1st mark 227 is a through-hole, the 3rd mark 253 of the other board | substrate 40 can be visually recognized through this through-hole. Thereby, the first mark 227 of the wiring board 1 and the third mark 253 of the other substrate 40 are aligned to position the connection terminal row 21 of the wiring board 1 with respect to the connected terminal row 51 of the substrate 40. it can.

<Third Modification>
With reference to FIG. 8, the modification of the positioning structure of the wiring board 1 with respect to the board | substrate 40 is demonstrated.
The wiring board 1 of this modification is obtained by adding the following changes to the configuration of the modification 2. That is, in the second modification, the first mark 227 is configured as a through hole. On the other hand, in the present modification, the first mark 327 is configured as a notch. The relationship between the second mark and the fourth mark is the same as the relationship between the first mark 327 and the third mark 353. Hereinafter, the detailed change from the structure of the said embodiment which arises with this change is demonstrated. About the structure which is common in the said embodiment, the same code | symbol is attached | subjected and the description is abbreviate | omitted.

  The first mark 327 of the wiring board 1 is formed by cutting out a part of the right end of the connection terminal portion 20 in FIG. 8, and the shape of the first mark 327 is rectangular. The notch as the first mark 327 is formed by a press die.

  On the other hand, the third mark 353 has a rectangular shape and is smaller than the first mark 327. For example, the difference between the length of the first mark 327 in the terminal arrangement direction XA and the length of the third mark 353 in the terminal arrangement direction XB is 0.1 mm, and the length of the first mark 327 in the wiring direction YA and the third mark 353 are different. The difference from the length in the wiring direction YB is 0.1 mm. That is, when the third mark 353 is within the first mark 327, the positional deviation between the center (diagonal point) of the first mark 327 and the center (diagonal point) of the third mark 353 is within ± 0.05 mm. Become.

  When positioning the connection terminal row 21 of the wiring board 1 and the connected terminal row 51 of the board 40, the wiring board 1 is arranged so that the third mark 353 is placed inside the first mark 327, as in the first modification. And the substrate 40 are positioned. Thereby, it is possible to easily visually recognize whether or not the positional deviation between the first mark 327 and the third mark 353 is within the allowable range.

  In the case of this modification, since the first mark 327 is formed as a notch, it is not necessary to make the substrate 11 and the adhesive layer 13 transparent. Therefore, the substrate 11 and the adhesive layer 13 can be selected from colored materials.

According to this modification, in addition to the effects (1) to (7), the following effects can be achieved.
(9) In the present modification, the first mark 327 is configured as a notch provided at the end of the substrate 11. According to this configuration, since the first mark 327 is a notch, the third mark 353 of the other substrate 40 can be visually recognized through the notch. Thereby, the first mark 327 of the wiring board 1 and the third mark 353 of the other board 40 are made to coincide with each other, and the connection terminal row 21 of the wiring board 1 is positioned with respect to the connected terminal row 51 of the board 40. Can do.

<Fourth Modification>
With reference to FIG. 9, the modification of the positioning structure of the wiring board 1 with respect to the board | substrate 40 is demonstrated.
In the wiring board 1 of the embodiment shown in FIG. 3, the first mark 27 and the second mark 28 are formed on the connection terminal portion 20. On the other hand, in the present modification shown in FIG. 9, the two connection terminals 22 are used as the first mark and the second mark. In this case, the third mark to be matched with the first mark, that is, the mark on the connected terminal portion 50 side of the other substrate 40 becomes the connected terminal 52 connected to the connecting terminal 22. Similarly, the fourth mark to be matched with the second mark, that is, the mark on the connected terminal portion 50 side of the other substrate 40 becomes the connected terminal 52 connected to the connecting terminal 22. Hereinafter, the detailed change from the structure of the said embodiment which arises with this change is demonstrated. About the structure which is common in the said embodiment, the same code | symbol is attached | subjected and the description is abbreviate | omitted.

  The main body 10 is applied between the wiring pattern 12 formed of a conductive material, the first substrate 111 sandwiching the wiring pattern 12, and the first substrate 111 and the wiring pattern 12, and the first substrate 111 and the wiring pattern 12. And the second substrate 120 that supports the connection terminal row. The wiring pattern 12 is the same as that in the first embodiment, and is formed of, for example, a copper foil wire having a thickness of 35 μm.

  An example of the first substrate 111 is a polyethylene terephthalate insulating resin sheet having a thickness of 12 μm. In the first embodiment described above, the transparent substrate 11 is used, but in this modification, an opaque substrate can be used as the first substrate 111.

  The adhesive layer 112 is formed with a polyester-based adhesive having a thickness of 20 to 100 μm on the substrate 11. In the first embodiment described above, the adhesive layer 112 is transparent when it is cured, but in this modification, it may be transparent or opaque when cured.

  The first substrate 111 covers the portion other than the portion constituting the connection terminal portion 20, leaving the end portion of the wiring pattern 12 in the extending direction, that is, the portion constituting the connection terminal portion 20. The second substrate 120 is directly attached to the connection terminal portion 20.

  The second substrate 120 includes a rigid substrate 121 and an adhesive layer 122 that adheres to the connection terminals 22. The adhesive layer 122 is applied to one surface of the substrate 121. The adhesive layer 122 is transparent and maintains a transparent state even when heated. The substrate 121 is also transparent, and is formed of a polyethylene terephthalate insulating resin sheet having a thickness of 50 to 150 μm.

  The second substrate 120 is bonded to the connection terminal row 21 through the adhesive layer 122. The second substrate 120 functions as a reinforcing plate that suppresses deformation of the connection terminal 22. The first substrate 111 corresponds to the substrate 11 of the embodiment. The second substrate 120 corresponds to the reinforcing plate 26 of the embodiment.

  The shape of the second substrate 120 is not limited. In the present modification, the tip of the connection terminal 22 and the second substrate 120 are aligned with the edge, but the second edge is such that the edge of the second substrate 120 is located on the extension of the tip of the connection terminal 22. The substrate 120 may be formed.

  The structure of the connection terminal portion 20 is the same as that of the connection terminal portion 20 of the first embodiment. That is, the conductive connection layer 23 is formed on the upper surface of the connection terminal 22. An insulating layer 24 is formed between adjacent connection terminals 22.

The positioning of the connection terminal row 21 of the wiring board 1 and the connected terminal row 51 of the substrate 40 is performed as follows.
Each of the connection terminals 22 at both ends of the connection terminal row 21 is defined as a first mark and a second mark. Then, the connection terminal 52 (third mark) at one end of the substrate 40 is confirmed through the connection terminal 22 which is the first mark, the connection terminal 22 and the connection terminal 52 are matched, and the second mark The connected terminal 52 (fourth mark) on the other end of the substrate 40 is confirmed through the connecting terminal 22, and the connecting terminal 22 and the connected terminal 52 are matched. At this time, light may be irradiated from the wiring board 1 toward the substrate 40 so that the connected terminal row 51 of the substrate 40 can be clearly seen.

  Further, when the connection terminal 22 and the connected terminal 52 are matched, the edge of the connection terminal 22 may be used as a reference as follows. This positioning will be described with reference to FIG. Although the wiring board 1 shown in FIG. 3 is different from the wiring board 1 of this modification, the arrangement structure of the connection terminals 22 and the arrangement structure of the connection terminals 22 of the wiring board 1 of this modification are the same. 3 is used in the description of positioning when the terminal 22 and the connected terminal 52 are matched.

  The distance between the edge 22A (see FIG. 3) of the first mark connection terminal 22 and the edge 52A (see FIG. 3) of the third mark connected terminal 52 and the end of the second mark connection terminal 22 The connection terminal row 21 and the connected terminal row 51 are aligned so that the distance between the edge 22B and the edge 52B of the fourth mark connected terminal 52 is equal. In this case, instead of using the edge of the connection terminal 22 as a mark, the corner of the connection terminal 22 may be a mark for alignment.

With reference to FIG. 10 and FIG. 11, the manufacturing method of the said wiring board 1 is demonstrated.
As shown in FIG. 10A, a plurality of copper foil wires are arranged in parallel to form a wiring pattern 12. The first sheet 200 is bonded to one surface of these wiring patterns 12, and then the second sheet 200 is bonded from the other surface so as to coincide with the first sheet 200.

  The first sheet 200 is composed of a base material sheet made of the same material as the first substrate 111. An adhesive that becomes the adhesive layer 112 by heating is applied to one surface of the base material sheet.

  The first sheet 200 is a sheet that is long in one direction, and a rectangular window 201 is formed in the extending direction at a predetermined distance. The length of the window 201 in the extending direction is about twice the length of the connection terminal portion 20. The width of the window 201 is larger than the width of the connection terminal row 21. The distance between the adjacent windows 201 matches the length of the wiring board 1. That is, the window 201 is formed in a portion corresponding to the connection terminal row 21. And when the sheet | seat 200 is affixed on the wiring pattern 12, the window 201 of two sheets substantially corresponds so that the connection terminal part 20 is not covered.

  As shown in FIGS. 10A and 11A, the sheet is cut along the first cutting line CA, the second cutting line CB, and the third cutting line CC. Thereby, the wiring board 1 is cut out. Next, as shown in FIG. 11B, the second substrate 120 is bonded to both ends of the wiring board 1. A part of the second substrate 120 overlaps with the sheet 200 (that is, the first substrate 111).

Next, a transfer sheet 130 for forming the conductive connection layer 23 and the insulating layer 24 on the connection terminal portion 20 is prepared.
As shown in FIG. 11C, the transfer sheet 130 is obtained by alternately applying a conductive material 133 corresponding to the conductive connection layer 23 and an insulating material 132 corresponding to the insulating layer 24 on the release sheet 131. It is.

  For example, a silicone layer is formed on the surface of the release sheet 131. This is to prevent the conductive material 133 and the insulating material 132 from being attached to the release sheet 131 when the release sheet 131 is peeled off after the conductive material 133 and the insulating material 132 are attached to the connection terminal portion 20.

The conductive material 133 is formed of, for example, a thermoplastic silver paste.
The conductive material 133 is formed by applying a silver paste to a predetermined region of the release sheet 131 by screen printing, that is, a region corresponding to the connection terminal 22, and then drying and further curing.

  The insulating material 132 is formed of, for example, a polyester-based hot melt connecting agent (hereinafter referred to as “hot melt”). Hot melt is applied to a predetermined region of the release sheet 131, that is, a region between the adjacent connection terminals 22 by screen printing, and the hot melt is dried. The transfer sheet 130 is formed as described above.

  As shown in FIG. 11D, the transfer sheet 130 is affixed to the connection terminal portion 20 of the wiring board 1, and the conductive material 133 is applied to the connection terminal 22 and the insulating material 132 is applied to the second substrate 120 by a press plate or the like. Press. When the conductive material 133 and the insulating material 132 are pressed against the second substrate 120 by a press plate or the like, heating is performed at 120 to 200 ° C. Thereafter, the release sheet 131 is removed. The wiring board 1 is formed by the above steps.

  10 and 11, the sheet is cut and separated into the wiring board 1, and then the second substrate 120 is bonded to transfer the conductive material 133 and the insulating material 132. However, the second substrate 120 corresponds to the connection terminal portion 20. You may cut | disconnect a sheet | seat, after adhere | attaching to the part to perform. Alternatively, the sheet may be cut after the second substrate 120 is bonded to a portion corresponding to the connection terminal portion 20 and the conductive material 133 and the insulating material 132 are transferred to the second substrate 120.

According to this modification, in addition to the effects according to the effects (1) to (6), the following effects are obtained.
(10) In this modification, the connection terminals 22 are used as the first mark and the second mark in order to position the connection terminal row 21 with respect to the other substrate 40. Thereby, the connected terminal 52 as the third mark of the other substrate 40 can be visually recognized with reference to the connecting terminal 22 as the first mark. Further, the connected terminal 52 as the fourth mark of the other substrate 40 can be visually recognized through the connecting terminal 22 as the second mark. Thereby, the connection terminal 22 and the connection terminal 52 of the other board | substrate 40 can be matched, and the connection terminal row | line | column 21 of the wiring board 1 can be positioned with respect to the connection terminal row | line | column 51 of the board | substrate 40. FIG.

(Other embodiments)
In addition, the embodiment of the present invention is not limited to the embodiment shown in the above-described embodiment and modifications, and can be implemented by changing it as shown below, for example. Further, the following modifications are not applied only to the above-described embodiments, and different modifications can be combined with each other.

  In the above embodiment, two marks are provided on the wiring board 1 for positioning with respect to the substrate 40, but one mark may be provided. In this case, the first mark 27 of the wiring board 1 and the third mark 53 of the substrate 40 are made to coincide so that the terminal arrangement direction XA of the connection terminal row 21 and the terminal arrangement direction XB of the connected terminal row 51 coincide. The wiring board 1 is rotated with respect to the substrate 40.

  In the above-described embodiment, the reinforcing plate 26 of the wiring board 1 is a single layer, but may be two or more layers. In this case, the heating hole 30 may be formed so as to penetrate through the two layers. Moreover, you may provide the hole 30 for a heating only in one outer layer.

In the above embodiment, the reinforcing plate 26 of the wiring board 1 is provided with the heating hole 30, but this may be omitted. In this case, the connection terminal portion 20 is heated via the reinforcing plate 26.
In the above embodiment, the reinforcing plate 26 of the wiring board 1 is a frame body that surrounds the outer periphery of the connection terminal portion 20, but the reinforcing plate 26 is not limited to this form. For example, it is good also as a form which covers only the front-end | tip part of the wiring board 1. FIG. Moreover, it can also be set as the form which covers the front-end | tip part and both ends of the wiring board 1. FIG.

  In the above embodiment, the first mark 27 and the second mark 28 are formed on the reinforcing plate 26. However, these marks 27 and 28 can be provided at places other than the portion where the reinforcing plate 26 is provided.

In the above embodiment, the reinforcing plate 26 is provided on the back surface of the wiring board 1, but this may be omitted.
In the above embodiment, the insulating layer 24 is formed of two layers, but the structure of the insulating layer 24 is not limited to this. For example, the insulating layer 24 can be formed of three or more layers. Moreover, although the conductive connection layer 23 is formed of one layer, it may be formed of two or more layers.

  In the above embodiment, the conductive connection layer 23 is formed of silver paste, but can be formed of anisotropic resin instead. In this case, the conductive resin 23 is formed by compressing the anisotropic resin in a step after applying the anisotropic resin.

  In the above embodiment, the insulating layer 24 higher than the position of the upper surface of the conductive connection layer 23 is formed. As a method for forming such an insulating layer 24, the insulating layer 24 is formed into two layers by screen printing, and after the insulating layer 24 and the conductive connection layer 23 are formed at the same height, the conductive connection layer 23 is compressed. There are methods.

  In the above embodiment, the insulating layer 24 is formed between the connection terminals 22, but instead of this, the outside of the connection terminal 22 at one end and the connection terminal 22 at the other end of the connection terminal row 21. The insulating layer 24 can be formed only on the outer side. Moreover, it is good also as a structure which provides the insulating layer 24 in any one or 2 or more between each connection terminal 22. FIG.

  In the fourth modified example, as shown in FIG. 9, the second substrate 120 is directly attached to one surface of the connection terminal row 21, but the following configuration may be used. That is, at least one of the first substrates 111 is made of a transparent material, and the transparent first substrate 111 is extended to the connection terminal portion 20, and the second substrate 120 is attached to the first substrate 111. . The transparency of the first substrate 111 and the second substrate 120 is such that when the two substrates are bonded together, the other substrate 40 can be seen through. That is, even with such a structure, since the plywood bonded to the first substrate 111 and the second substrate 120 is transparent, the connection terminal 22 and the connected terminal 52 of another substrate 40 are the same as in the fourth modification. Thus, the connection terminal row 21 of the wiring board 1 can be positioned with respect to the connected terminal row 51 of the substrate 40.

  DESCRIPTION OF SYMBOLS 1 ... Wiring board, 10 ... Main-body part, 11 ... Board | substrate, 12 ... Wiring pattern, 13 ... Adhesive layer, 20 ... Connection terminal part, 20A ... Base part, 21 ... Connection terminal row | line | column, 22 ... Connection terminal, 22K ... Reference | standard Terminal, 22A ... End edge, 22B ... End edge, 23 ... Conductive connection layer, 24 ... Insulating layer, 25 ... Reference plane, 26 ... Reinforcing plate, 27 ... First mark, 28 ... Second mark, 30 ... Hole for heating 31 ... Upper side, 32 ... Lower side, 33 ... Left side, 34 ... Right side, 40 ... Board, 41 ... Base plate, 50 ... Connected terminal portion, 51 ... Connected terminal row, 52 ... Connected terminal, 52A ... Edge , 52B ... edge, 52K ... reference terminal, 53 ... third mark, 54 ... fourth mark, 60 ... assembly jig, 61 ... base, 62 ... upper surface, 63 ... first positioning pin, 64 ... second positioning Pin 70: Heating machine 71 ... Heater part 111 ... First substrate 112 ... Adhesion Layer, 120 ... second substrate, 121 ... substrate, 122 ... adhesive layer, 130 ... transfer sheet, 131 ... release sheet, 132 ... insulating materials, 133 ... conductive material, 200 ... sheet, 201 ... window.

Claims (11)

In a wiring board comprising a connection terminal row formed on one surface of a substrate and connected to a connected terminal row of another substrate,
A mark for positioning with respect to the connected terminal row of the other substrate is provided at a specific position set with reference to a specific portion of the connection terminal row, and the other substrate is specified through the mark. A wiring board characterized in that the position can be visually confirmed. The wiring board according to claim 1,
The wiring board is characterized in that the mark is at least one of the connection terminals constituting the connection terminal row, or an edge or a corner of the connection terminal. The wiring board according to claim 2,
The substrate includes two first substrates that cover portions other than the connection terminal row of wiring, and a second substrate that supports the back side surface of the connection terminal row, and the second substrate is the other substrate. A wiring board characterized by being formed of a substrate that can be seen through. In the wiring board as described in any one of Claims 1-3,
The circuit board is characterized in that the substrate can be seen through the other substrate. The wiring board according to claim 1,
The wiring board, wherein the mark is a through-hole penetrating the substrate. The wiring board according to claim 1,
The wiring board, wherein the mark is a notch provided in an end portion of the substrate. In the wiring board as described in any one of Claims 1-6,
The wiring board according to claim 1, wherein the mark defines an allowable range of positional deviation between the mark and a specific position of the other board. In the wiring board as described in any one of Claims 1-7,
A conductive connection layer formed of a conductive resin containing conductive particles is provided on the upper surface of each connection terminal constituting the connection terminal row;
An insulating layer that insulates the connection terminals is provided between at least one set of connection terminals of the connection terminals constituting the connection terminal row,
The wiring board, wherein the insulating layer is formed of an insulating adhesive that adheres by heating. In the wiring board as described in any one of Claims 1-8,
In the connection terminal portion including the portion where the connection terminal row is formed, a reinforcing plate for reinforcing the connection terminal portion is provided,
The wiring board, wherein the connection terminal portion is provided with the mark. The wiring board according to claim 9, wherein
The reinforcing board is provided with a heating hole corresponding to the connection terminal row. In the wiring board as described in any one of Claims 1-10,
Two of the marks are provided at different positions with reference to a specific portion of the connection terminal row.

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