JP2012028476A5 - - Google Patents

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Publication number
JP2012028476A5
JP2012028476A5 JP2010164409A JP2010164409A JP2012028476A5 JP 2012028476 A5 JP2012028476 A5 JP 2012028476A5 JP 2010164409 A JP2010164409 A JP 2010164409A JP 2010164409 A JP2010164409 A JP 2010164409A JP 2012028476 A5 JP2012028476 A5 JP 2012028476A5
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Japan
Prior art keywords
layer
thickness
superlattice structure
ingan
well layer
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JP2010164409A
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Japanese (ja)
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JP2012028476A (en
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Priority to JP2010164409A priority Critical patent/JP2012028476A/en
Priority claimed from JP2010164409A external-priority patent/JP2012028476A/en
Publication of JP2012028476A publication Critical patent/JP2012028476A/en
Publication of JP2012028476A5 publication Critical patent/JP2012028476A5/ja
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Claims (5)

n側コンタクト層と、活性層と、p側コンタクト層と、を順に備える半導体発光素子であって、
前記n側コンタクト層と前記活性層との間には、前記n側コンタクト層側から順に、GaN又はInGaNからなる第1障壁層及びInGaNからなる第1井戸層を含む第1超格子構造体と、GaN又はInGaNからなる第2障壁層及びInGaNからなる第2井戸層を含む第2超格子構造体と、が設けられ、
前記第2超格子構造体の平均In混晶比は、前記第1超格子構造体の平均In混晶比よりも小さいことを特徴とする半導体発光素子
A semiconductor light emitting device comprising an n-side contact layer, an active layer, and a p-side contact layer in order,
A first superlattice structure including a first barrier layer made of GaN or InGaN and a first well layer made of InGaN in order from the n-side contact layer side between the n-side contact layer and the active layer; A second superlattice structure including a second barrier layer made of GaN or InGaN and a second well layer made of InGaN, and
An average In mixed crystal ratio of the second superlattice structure is smaller than an average In mixed crystal ratio of the first superlattice structure .
前記n側コンタクト層と前記活性層との間には、前記n側コンタクト層側から順に、GaNからなる第1障壁層及びInGaNからなる第1井戸層を含む第1超格子構造体と、GaNからなる第2障壁層及びInGaNからなる第2井戸層を含む第2超格子構造体と、が設けられ、
前記第1井戸層の膜厚と前記第2井戸層の膜厚とは実質的に同じであると共に、前記第1障壁層の膜厚と前記第2障壁層の膜厚とは実質的に同じであり、
前記第2井戸層のIn混晶比は、前記第1井戸層のIn混晶比よりも小さいことを特徴とする請求項1に記載の半導体発光素子。
Between the n-side contact layer and the active layer, in order from the n-side contact layer side, a first superlattice structure including a first barrier layer made of GaN and a first well layer made of InGaN, and GaN A second superlattice structure including a second barrier layer made of and a second well layer made of InGaN,
The thickness of the first well layer and the thickness of the second well layer are substantially the same, and the thickness of the first barrier layer and the thickness of the second barrier layer are substantially the same. And
2. The semiconductor light emitting device according to claim 1, wherein an In mixed crystal ratio of the second well layer is smaller than an In mixed crystal ratio of the first well layer.
前記第1超格子構造体の膜厚は、前記第2超格子構造体の膜厚よりも厚いことを特徴とする請求項1又は2に記載の半導体発光素子。   3. The semiconductor light emitting element according to claim 1, wherein a film thickness of the first superlattice structure is larger than a film thickness of the second superlattice structure. 前記第1井戸層の膜厚は、前記第1障壁層の膜厚よりも厚いことを特徴とする請求項1から3のいずれかに記載の半導体発光装置。   4. The semiconductor light emitting device according to claim 1, wherein a thickness of the first well layer is larger than a thickness of the first barrier layer. 5. 前記第2障壁層の膜厚は、前記第2井戸層の膜厚よりも厚いことを特徴とする請求項1から4のいずれかに記載の半導体発光装置。   5. The semiconductor light emitting device according to claim 1, wherein a thickness of the second barrier layer is larger than a thickness of the second well layer.
JP2010164409A 2010-07-22 2010-07-22 Method for manufacturing light emitting device Pending JP2012028476A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010164409A JP2012028476A (en) 2010-07-22 2010-07-22 Method for manufacturing light emitting device

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Application Number Priority Date Filing Date Title
JP2010164409A JP2012028476A (en) 2010-07-22 2010-07-22 Method for manufacturing light emitting device

Publications (2)

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JP2012028476A JP2012028476A (en) 2012-02-09
JP2012028476A5 true JP2012028476A5 (en) 2013-06-20

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5510183B2 (en) * 2010-08-19 2014-06-04 日亜化学工業株式会社 Nitride semiconductor light emitting device
JP6026116B2 (en) * 2012-03-09 2016-11-16 シャープ株式会社 Nitride semiconductor light emitting device and manufacturing method thereof
WO2013187171A1 (en) * 2012-06-13 2013-12-19 シャープ株式会社 Nitride semiconductor light emitting element and method for manufacturing same
JP2014146684A (en) * 2013-01-29 2014-08-14 Stanley Electric Co Ltd Semiconductor light-emitting element and manufacturing method of the same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3622562B2 (en) * 1998-03-12 2005-02-23 日亜化学工業株式会社 Nitride semiconductor light emitting diode
US6635904B2 (en) * 2001-03-29 2003-10-21 Lumileds Lighting U.S., Llc Indium gallium nitride smoothing structures for III-nitride devices
KR100674862B1 (en) * 2005-08-25 2007-01-29 삼성전기주식회사 Nitride semiconductor light emitting device
JP2007019526A (en) * 2006-08-11 2007-01-25 Rohm Co Ltd Process for fabricating nitride semiconductor element

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