JP2007019526A - Process for fabricating nitride semiconductor element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a process for fabricating a nitride semiconductor element in which a nitride semiconductor layer exhibiting excellent crystallinity is grown while growing the nitride semiconductor layer epitaxially by MOCVD using a zinc oxide based compound of good processability as a substrate without roughening the surface of the substrate by sublimation. <P>SOLUTION: A nitride semiconductor element is formed by (a) forming a protective film 15 on the exposed surface of a substrate 1 composed of a zinc oxide based compound excepting the surface on which a semiconductor layer is formed, (b) placing the substrate 1 in an MOCVD system and growing a first nitride semiconductor layer 2 composed of In<SB>y</SB>Ga<SB>1-y</SB>N (0<y≤0.5) using nitrogen gas as carrier gas, and then (c) growing a desired nitride semiconductor layer. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a semiconductor element using a nitride semiconductor crystal layer, such as a light emitting element such as a light emitting diode (LED) or a laser diode using a nitride semiconductor, or a transistor element such as a HEMT. More specifically, by growing a nitride semiconductor layer on a zinc oxide-based compound substrate, the lattice constant difference between the substrate and the nitride semiconductor layer is reduced, and a nitride semiconductor layer having excellent crystallinity is grown. The present invention relates to a method for manufacturing a nitride semiconductor device that can be easily removed by wet etching even when the substrate is removed.

  In recent years, nitride semiconductor light emitting devices such as blue light emitting diodes (LEDs) and laser diodes using nitride semiconductors have been put into practical use. For example, as shown in FIG. 6, an LED that emits blue light using a nitride semiconductor includes a low-temperature buffer layer 32 made of GaN or the like on a sapphire substrate 31 by MOCVD, and an n-type made of GaN or the like. An active layer comprising a layer 33 and a material having a band gap energy smaller than that of the n-type layer 33 and determining an emission wavelength, for example, an InGaN-based (meaning that the ratio of In and Ga can be variously changed, the same applies hereinafter) compound semiconductor (Light emitting layer) 34 and a p-type layer 35 made of GaN or the like are laminated to form a semiconductor laminated portion 36, and a p-side electrode 38 is provided on the surface via a translucent conductive layer 37. An n-side electrode 39 is provided on the surface of the n-type layer 33 exposed by etching a part of the semiconductor laminated portion 36. Note that the n-type layer 33 and the p-type layer 35 further improve the carrier confinement effect, so that the active layer side has a further band such as an AlGaN-based compound (meaning that the ratio of Al and Ga can be changed variously, the same applies hereinafter). A semiconductor layer having a large gap energy may be used.

When the nitride semiconductor layer is stacked by the MOCVD method, as the substrate, in most cases, a sapphire substrate or a SiC substrate is used as in the example shown in FIG. Incompatible materials are used (see, for example, Patent Document 1). In addition to this, there is an example using a Si substrate, but in Si, the crystallinity of the growing nitride semiconductor layer is further deteriorated, and since Si cannot absorb the emitted light and improve the luminance, it has an added value. Not suitable for high brightness products.
Japanese Patent Laid-Open No. 10-256661 (see paragraph 0002)

  As described above, when a nitride semiconductor layer is grown, in most cases, a sapphire substrate or a SiC substrate is used. However, the sapphire substrate and the SiC substrate are very hard materials, and there are problems that cutting in the case of forming a chip from a wafer is difficult, and the chip is cracked to reduce the yield, resulting in an increase in cost. In the case of a laser diode, it is preferable to cleave in order to form a mirror reflection surface. In particular, sapphire cannot be cleaved with a stable compound.

  In the case of SiC, the substrate absorption is large, and the absorption is particularly large near 400 nm. Furthermore, if the dope is increased to facilitate contact, the substrate absorption is further increased. Thus, when the emission wavelength is shortened, the absorption of light emitted by the substrate is also increased. Therefore, it is preferable to remove the substrate from the viewpoint of improving the external quantum efficiency. In the case of a sapphire substrate, the lower layer, for example, n-type Since the electrodes can be formed on both sides of the semiconductor stack without etching a part of the semiconductor stack in a mesa shape to form an electrode electrically connected to the layer, the substrate can be removed. preferable. However, in order to remove the substrate made of sapphire or SiC from the nitride semiconductor layer, there is only a method of peeling off at the interface by irradiating laser light from the substrate side or removing by polishing. Since laser irradiation is performed for each wafer, the production efficiency is very poor. Polishing is a lattice-mismatched system with nitride semiconductors for both sapphire and SiC substrates, and the coefficient of thermal expansion. Therefore, there is a problem that the wafer is warped or cracked during polishing, and handling is difficult.

The present invention has been made to solve such problems, and uses a zinc oxide compound having good processability, specifically, Mg _x Zn _1-x O (0 ≦ x ≦ 0.5) as a substrate. , While epitaxially growing a nitride semiconductor layer using MOCVD, the surface of the Mg _x Zn _1-x O substrate is grown by sublimation, and the nitride semiconductor layer having excellent crystallinity is grown with excellent characteristics. The object is to provide a method of manufacturing a nitride semiconductor device.

  Still another object of the present invention is to provide a semiconductor light emitting device such as an LED or a semiconductor laser, which uses such a nitride semiconductor, is easy to process and handle, and has a structure capable of improving light emission characteristics such as external quantum efficiency. To provide a manufacturing method.

The present inventor has intensively studied to grow a nitride semiconductor layer by using a substrate that can grow a nitride semiconductor with good crystallinity and can be easily formed into a chip and peeled off the substrate and can be easily handled. As a result, a zinc oxide-based (also called ZnO-based) compound such as Mg _x Zn _1-x O (0 ≦ x ≦ 0.5) that is easy to process is used as a substrate, and a nitride semiconductor is grown on the substrate. A mask is formed on the back and side surfaces of the substrate so that only the surface to be exposed is exposed to a nitrogen atmosphere during the growth of the first nitride semiconductor layer. By eliminating the exposed part of the substrate, the nitride semiconductor layer is grown by a normal MOCVD method, so that the substrate is not affected by hydrogen and becomes uneven, and a clean crystal nitride semiconductor layer is grown. To do It found that it is.

  In other words, zinc oxide-based compounds can grow nitride semiconductors that do not contain In in a hydrogen atmosphere of MOCVD with good crystallinity. At high temperatures of 900 ° C. or higher, zinc oxide sublimates and grows nitride semiconductors. Then, the substrate is roughened, and eventually a nitride semiconductor layer having excellent crystallinity cannot be grown and has not been put into practical use. However, as described above, the first nitride semiconductor layer is grown on the surface by exposing only the surface on which the nitride semiconductor is grown and making the carrier gas nitrogen as little as possible to react with hydrogen at a high temperature. A nitride semiconductor layer can be grown on a zinc oxide-based compound substrate having a lattice constant close to that of the nitride semiconductor, and the first nitride semiconductor layer is very crystalline even if a normal growth method is used. A nitride semiconductor layer having excellent properties could be grown.

Furthermore, the in-plane lattice constant of ZnO is a = 3.252Å, the in-plane lattice constant of GaN is a = 3.189Å, and the in-plane lattice constant of GaN is smaller than that of ZnO, and Δa / a _ZnO = −1. Although the InGaN-based compound has a lattice constant in the a-axis direction larger than that of GaN and the lattice constant in the a-axis of InN is as large as a = 5.76 、, the same lattice as ZnO can be obtained by adding a little In. Focusing on the fact that an InGaN compound having a constant can be formed, it has been found that a nitride semiconductor layer lattice-matched with the substrate at 1% or less, more preferably 0.5% or less, can be grown. For example, the In composition y of an InGaN-based compound lattice-matched with ZnO changes if the lattice constant changes in proportion to the In composition (actually, since the bowing effect due to strain is included, an accurate lattice constant is difficult to calculate. According to Vegard's law, if a (y) = 3.189 (1-y) + 5.76y = 3.252, then y = 0.0245, that is, 2.45%, it is completely lattice matched with ZnO. You can see that Therefore, a nitride semiconductor layer having very excellent crystallinity is obtained by first growing a first nitride semiconductor layer having lattice matching by containing In at such a ratio of lattice matching. I found out that I can.

  When the difference in lattice constant between the first nitride semiconductor layer and the nitride semiconductor layer grown thereon is large, a gradient layer or a superlattice structure may be provided between them. Although the In composition of the first nitride semiconductor layer itself is gradually reduced stepwise or continuously to match the composition of the nitride semiconductor layer thereon, or an InGaN-based compound layer lattice-matched with the substrate, A superlattice structure such as a GaN layer or a layer having a composition of a nitride semiconductor layer thereon may be used. In this way, a semiconductor element such as an n-type layer having a lattice match with the first nitride semiconductor layer is formed on the first nitride semiconductor layer having a lattice match directly with the zinc oxide compound substrate. The nitride semiconductor layer to be formed can be directly grown while relaxing the strain.

The method for manufacturing a nitride semiconductor device according to the present invention includes: (a) forming a protective film on a surface of a substrate made of a zinc oxide compound excluding the semiconductor layer lamination surface; and (b) placing the substrate in a MOCVD apparatus. Then, using a nitrogen gas as a carrier gas, a first nitride semiconductor layer made of In _y Ga _1-y N (0 <y ≦ 0.5) is grown, and (c) a desired nitride semiconductor continues The layer is grown to form a nitride semiconductor device.

  Here, the zinc oxide-based compound means an oxide containing Zn. Specific examples include ZnO, IIA group element and Zn, IIB group element and Zn, or IIA group element and IIB group element and Zn. It means what contains each oxide. The nitride semiconductor is a compound in which a group III element Ga and a group V element N or a part or all of a group III element Ga is replaced with another group III element such as Al and In, and / or Alternatively, it refers to a semiconductor made of a compound (nitride) in which a part of N of the group V element is substituted with another group V element such as P or As.

By growing the first nitride semiconductor layer at a low temperature of 600 to 900 ° C. which is lower than the growth temperature of GaN, the nitride semiconductor layer is grown without the Mg _x Zn _1-x O substrate being roughened. Therefore, it is preferable.

  The growth of the first nitride semiconductor layer can be formed in a superlattice structure or a gradient layer in which the composition of In decreases gradually or stepwise by controlling the flow rate of the In source gas.

  After forming the element in the step (c), part or all of the substrate is removed by wet etching, so that light emitted from the substrate or the like is extracted without being absorbed, thereby improving external quantum efficiency. It is preferable.

  Specifically, a desired nitride semiconductor layer grown on the first nitride semiconductor layer includes at least an n-type layer and a p-type layer so as to form a light emitting layer, and the first nitride A semiconductor light emitting device is formed by growing an n-type layer on the semiconductor layer side and a p-type layer on the surface side, and forming an n-side electrode on the n-type layer exposed by the wet etching. Can do. Further, by forming irregularities on the surface of the n-type layer exposed by the wet etching and then forming the n-side electrode, the light extraction efficiency is improved when an LED is formed.

  Furthermore, the desired nitride semiconductor layer grown on the first nitride semiconductor layer includes at least an n-type layer and a p-type layer so as to form a light emitting layer, and the first nitride semiconductor layer side After forming an n-type layer and a p-type layer on the surface side, forming a p-side electrode on the surface side and then forming a chip, and die bonding the p-side electrode side to a submount A semiconductor light emitting element can be formed by removing a part or all of the substrate by wet etching. In this way, since the substrate can be removed after the element is mounted, a very thin element can be reliably mounted on the submount or the like. As the submount, a metal, any one of AlN, SiC, and diamond, or a surface thereof coated with Cu or Ag can be used.

According to the method for manufacturing a nitride semiconductor device of the present invention, a mask is formed except for a semiconductor layer laminated surface of a substrate made of a zinc oxide compound such as Mg _x Zn _1-x O, and nitrogen gas is used as a carrier gas. Since the first nitride semiconductor layer made of In _y Ga _1-y N is grown, the substrate is not roughened by sublimation even when a gallium nitride compound is grown by the MOCVD method. A nitride semiconductor layer can be grown with clean crystals. As a result, even if an LED, a laser diode (LD), or the like is formed, a high-performance semiconductor light-emitting device with high internal quantum efficiency and a small threshold current can be obtained. A small high-speed transistor (HEMT) with excellent breakdown voltage can be obtained.

Next, a method for manufacturing the nitride semiconductor device of the present invention will be described with reference to the drawings. A nitride semiconductor device obtained by the manufacturing method of the present invention has a nitride semiconductor layer laminated on a substrate 1 as shown in a sectional view of a nitride semiconductor light emitting device (LED chip) as an example in FIG. in the case of forming the nitride semiconductor device Te, the substrate 1 are made of zinc oxide based compound such as _{Mg x Zn 1-x O (} 0 ≦ x ≦ 0.5), in contact with the substrate 1 an in _y A _first nitride semiconductor layer 2 made of Ga _1-y N (0 <y ≦ 0.5) is provided, and a semiconductor element is formed on the first nitride semiconductor layer 2 (FIG. 1). In the example shown, nitride semiconductor layers 3 to 7 are stacked so as to form the light emitting layer of the LED.

That is, the present invention uses a substrate of a zinc oxide compound such as Mg _x Zn _1-x O as the substrate 1 to laminate the nitride semiconductor layer by the MOCVD method, and the In _y Ga _{1- The} feature is that the _yN layer is provided as the first nitride semiconductor layer 2. As described above, when a nitride semiconductor layer is to be grown by the MOCVD method, the higher the growth temperature, the better the quality of the nitride semiconductor film. Therefore, if the nitride semiconductor layer is grown at about 900 to 1100 ° C. in a hydrogen atmosphere, Zinc is sublimated, and the epitaxially growing surface of the substrate becomes uneven, and a nitride semiconductor layer with good film quality cannot be grown. Therefore, a ZnO-based compound such as Mg _x Zn _1-x O has not been used as a substrate. However, as described above, as a result of extensive studies by the present inventors, only the surface on which epitaxial growth is performed is exposed and the other part is covered with a protective film, and the substrate 1 is cleaned in a nitrogen atmosphere and exposed to oxygen. In addition, when the first first nitride semiconductor layer 2 is grown, it is more preferable that the first nitride semiconductor layer 2 is grown by using nitrogen as a carrier gas at a temperature of 800 ° C. or lower. By forming an In-containing layer or a superlattice structure in which an In-containing layer and a GaN layer are alternately stacked, a nitride semiconductor layer having excellent crystallinity can be obtained without damaging a substrate made of a ZnO-based compound. They found that they could grow.

  Since the first nitride semiconductor layer 2 is formed to a thickness of about 10 nm or more, and the growth surface of the substrate is covered with a mask, the subsequent growth of the nitride semiconductor layer is the same as the conventional growth process. The substrate is not roughened and roughened even if it is used, and the nitride semiconductor layer is grown on the first nitride semiconductor layer 2 having a lattice constant close to that of the substrate. It grows as a good semiconductor layer.

As the substrate 1, a ZnO-based compound such as Mg _x Zn _1-x O, for example, a ZnO substrate 1 is used. Such an oxide can be easily removed by wet etching, and since the semiconductor is conductive, one electrode can be taken out from the back side of the substrate, and above all, the nitride semiconductor and the lattice Since the constants are close, it is easy to achieve lattice matching, and by adding an appropriate amount of In to the nitride semiconductor, it is possible to achieve perfect lattice matching with the substrate. Even if the substrate 1 is not ZnO, Mg _x Zn _1-x O mixed with Mg so as not to absorb the light is used when the light emitting wavelength is short, for example, when the light emitting element is used. be able to.

  As described above, when the substrate 1 is exposed to a hydrogen atmosphere at a high temperature, ZnO is sublimated from the exposed surface, the surface becomes uneven, the crystallinity of the substrate itself is lowered, and nitriding is grown on the surface. The crystallinity of the physical semiconductor layer is greatly reduced. Therefore, for example, as shown in FIG. 2, the surface of the ZnO substrate 1 is covered and protected with a protective film 15 that does not evaporate at a high temperature, such as SiO, SiN, or Pt, after being covered with the MOCVD apparatus. A ZnO substrate 1 (wafer) is placed on a cradle 16 made of carbon or molybdenum, and a nitride semiconductor layer is grown.

  As described above, the first nitride semiconductor layer 2 is provided as a layer that first covers the surface of the ZnO substrate 1 so as not to roughen the surface and is lattice-matched with the ZnO substrate 1. Since the lattice mismatch between the substrate 1 and the nitride semiconductor layer is not as great as that of the sapphire substrate and the nitride semiconductor layer, the primary purpose is to prevent sublimation of the ZnO substrate 1, and the lattice constant is completely set. Matching is secondary. That is, as described above, when trying to grow a nitride semiconductor layer by the MOCVD method using the ZnO substrate 1, the ZnO substrate 1 is sublimated at a high temperature of 900 ° C. or higher when the nitride semiconductor layer is grown, and the surface becomes rough. Although it is impossible to grow a nitride semiconductor layer with good crystallinity, it is preferable for the growth of an InGaN-based compound to lower the growth temperature to 900 ° C. or lower, and when hydrogen is used as a carrier gas. It is difficult to grow using nitrogen gas, so that an InGaN compound is first grown on the ZnO substrate 1. Thus, by growing a nitride semiconductor layer made of an InGaN-based compound at 900 ° C. or lower and in a nitrogen gas atmosphere, the nitride semiconductor layer having excellent crystallinity is obtained without causing any rough surface of the ZnO substrate 1. Can grow. The first nitride semiconductor layer needs to match the conductivity type of the substrate 1 when one electrode is formed on the back surface of the substrate 1, but when the electrode is not formed on the back surface of the substrate 1. Either undoped or Si (n dopant) may be doped.

  On the other hand, the first nitride semiconductor layer 2 does not necessarily have to be a layer containing In. For example, as shown in FIG. 3A, an InGaN-based compound layer 21 and a GaN layer 22 are For example, it can also be formed with a superlattice structure in which about 5 nm is alternately laminated (showing the composition change of GaN and InGaN on the right side of the cross-sectional view). In this case, when a similar explanatory diagram is shown in FIG. 3B, the In composition of the superlattice InGaN-based compound layer 21 is reduced toward the surface side and closer to the composition of the n-type layer 3. It is preferable.

  However, as described above, the first nitride semiconductor layer 2 can completely match the in-plane lattice constant with the substrate 1 by adjusting the composition of In, and the substrate and nitride semiconductor layer of different materials can be used. Therefore, it is preferable that a nitride semiconductor layer with very good crystallinity can be grown. If the first nitride semiconductor layer 2 having excellent crystallinity is grown with lattice matching with such a substrate 1, the nitride semiconductor laminated thereon has a lattice constant due to the difference in material composition. Can be grown with good crystallinity even if they are slightly different, but they can be grown with good crystallinity, but by stacking with a superlattice structure or gradient layer between them, the composition is different. Since strain can be relaxed, crystallinity can be further improved. In this case, a superlattice structure or a gradient layer may be provided between the first nitride semiconductor layer 2 and the n-type contact layer 3 shown in FIG. As shown in FIG. 3 (a) or (b), the first nitride semiconductor layer 2 itself may have a superlattice structure, or as shown in FIG. The physical semiconductor layer 2 may be formed of the gradient layer 23.

  That is, in FIG. 3C, an InGaN layer 21 lattice-matched with the ZnO substrate 1 is provided for the first 10 nm or so, and the In composition is gradually decreased on the first layer, and finally, the InGaN layer 21 is grown thereon. It is formed so as to be a GaN layer combined with the composition of the n-type layer 3. The total thickness including the gradient layer is not limited, but is preferably 1 μm or less. This example also shows a state of composition change between GaN and InGaN on the right side of the cross-sectional view. This gradient layer may be changed continuously as in the example shown in FIG. 3C, or may be changed stepwise. Such a change in composition can be obtained, for example, by continuously or stepwise reducing the amount of trimethylindium (TMIn) that is a source gas of In during the growth of the first nitride semiconductor layer by the MOCVD method. .

In the example shown in FIG. 1, the other semiconductor laminated portion 6 includes an n-type layer 3 composed of a contact layer 3a made of Si-doped GaN and a superlattice layer 3b made of InGaN-based compound / GaN of about 1 to 10 μm. Undoped InGaN-based compound / GaN-MQW layer 4a (for example, 3 to 8 pairs of a well layer made of In _0.17 Ga _0.83 N of 1 to 3 nm and a barrier layer made of In _0.01 Ga _0.99 N of 10 to 20 nm are laminated. The active layer 4 composed of a multi-quantum well structure) and an undoped GaN layer 4b is provided in a total of about 0.05 to 0.3 μm, and the p-type layer 5 composed of Mg-doped GaN is provided in a range of about 0.2 to 1 μm. It is formed by.

  In addition, the structure of the semiconductor lamination part 6 is laminated | stacked on a required structure according to the semiconductor element to manufacture, and also in the case of LED, it is not limited to the above-mentioned example, The n-type layer 3 and the p-type layer 5 are In addition, a multilayer structure in which a layer (barrier layer) having a large band gap energy is provided on the active layer side, a superlattice structure or a gradient layer can be provided between semiconductor layers having different compositions, and conversely, The superlattice layer 3b and the undoped GaN layer 4b can be omitted. Further, in this example, the active layer 4 is sandwiched between the n-type layer 3 and the p-type layer 5, but the heterojunction structure in which the n-type layer and the p-type layer are directly joined is also used. Good. In short, when an LED is configured, the n-type layer 3 and the p-type layer 5 may be provided so as to form a light emitting layer. In the above-described example, the example is an LED. However, a laser diode can be similarly formed by forming a stripe-shaped light emitting region.

  Next, a method for manufacturing the nitride semiconductor light emitting device shown in FIG. 1 will be described. First, for example, in addition to the growth surface of the ZnO substrate 1 formed in an n-type, as shown in FIG. 2, the wafer on which the protective film 15 is formed is put in an MOCVD apparatus and heated to about 700 to 900 ° C. in a nitrogen carrier gas. And clean the substrate surface. In this case, care must be taken because if the substrate cleaning is performed at a temperature exceeding 1000 ° C., such as a sapphire substrate, ZnO sublimates and the surface of the epitaxial growth becomes uneven.

  Next, the temperature is lowered to about 800 ° C. while keeping the nitrogen carrier gas, and a first nitride semiconductor layer 2 made of, for example, an InGaN-based compound that is lattice-matched with the substrate 1 is grown by Si doping to about 10 to 100 nm. This Si doping is necessary when an electrode is formed on the back surface of the substrate 1, but may be undoped when an electrode is not formed on the back surface of the substrate. Thereafter, the carrier gas is changed to hydrogen, the substrate temperature is raised to a high temperature of about 900 to 1200 ° C., for example, about 1000 ° C., and the contact layer 3a made of GaN doped with Si is grown, and the temperature is raised to 600 to 800 ° C. The n-type layer 3 is laminated by about 1 to 10 μm by lowering and growing a superlattice layer 3b made of InGaN-based compound / GaN by Si doping. This superlattice layer 3b is provided so as not to apply lattice distortion to the active layer 4 which requires crystallinity.

Subsequently, for example, about 3 to 8 pairs of well layers made of In _0.17 Ga _0.83 N of about 1 to 3 nm and barrier layers made of GaN of about 10 to 20 nm are alternately stacked to form an MQW layer 4a, and further undoped. The active layer 4 composed of the GaN layer 4b is laminated to about 0.05 to 0.3 μm. These may be doped with Si to about 1 × 10 ^{17 to} 5 × 10 ¹⁸ cm ⁻³ . Next, the temperature in the growth apparatus is raised to about 900 to 1200 ° C., for example, about 1000 ° C., and the p-type layer 5 made of Mg-doped GaN is grown by about 0.2 to 1 μm, thereby forming the semiconductor laminated portion 6. To do.

When growing each semiconductor layer from the n-type layer 3, the carrier gas H _{2 is used} together with trimethylethylene gallium (TMG), ammonia (NH ₃ ), trimethylaluminum (TMA), trimethylindium (TMIn), etc. A necessary gas such as SiH ₄ as a dopant gas for forming the reaction gas and n-type, and cyclopentadienylmagnesium (Cp ₂ Mg) as the dopant gas for forming the p-type is supplied to obtain a desired composition. A semiconductor layer having a desired conductivity type can be formed to a desired thickness. The In composition of the InGaN-based compound can be changed by controlling the flow rate of TMIn, which is the In source gas.

Thereafter, a light-transmitting conductive layer 7 made of, for example, ZnO or the like and capable of making ohmic contact with the p-type semiconductor layer 5 is provided on the surface of the semiconductor multilayer portion 6 by about 0.01 to 5 μm. This ZnO is formed by doping Ga so as to have a specific resistance of about 3 to 5 × 10 ⁻⁴ Ω · cm. The translucent conductive layer 7 is not limited to ZnO, and even a thin alloy layer of about 2 to 100 nm of ITO or Ni and Au can diffuse current throughout the chip while transmitting light. it can.

  Then, after polishing the back surface of the substrate 1 so that the thickness of the substrate 1 is about 100 μm, an n-side electrode 9 is formed by laminating Ti / Au or Cr / Pt / Au or the like on the back surface. The p-side electrode 8 is formed with a Ti / Au laminated structure on the surface of the photoconductive layer 7 by a lift-off method, and finally the entire chip is covered with a SiON film (not shown) by a plasma CVD method, and an opening is formed in the electrode portion. To do. Thereafter, the wafer is chipped to form a light emitting element chip having the structure shown in FIG. In addition, when chip-izing, the chip | tip boundary part of the semiconductor lamination part 6 is etched to mesa shape by dry etching previously. As will be described later, the n-side electrode 9 can be formed on the surface of the n-type layer 3 exposed by etching a part of the laminated semiconductor laminated portion 6 without being formed on the back surface of the substrate 1.

  According to the present invention, since a nitride semiconductor layer is laminated on a ZnO-based compound substrate, one electrode can be formed on the back surface of the substrate, and a vertical element that forms a pair of electrodes above and below the chip. It can be. However, even when such a semiconductor substrate is used, as shown in FIG. 4A, an n-side electrode is exposed on the n-type layer 3 exposed by etching a part of the laminated semiconductor laminated portion 6 by dry etching. 9 can be formed. It should be noted that the structure of the semiconductor laminated portion and the like is the same as the example shown in FIG. 1, and the same portions are denoted by the same reference numerals and description thereof is omitted. A flip chip structure in which a pair of electrodes can be connected and mounted directly on a mounting substrate or the like with the upper surface facing down may be employed.

  In the present invention, since a ZnO-based compound substrate is used, in the case of such a structure, as shown in FIG. 4B, the substrate is easily removed by wet etching using HCl or the like. be able to. That is, since the nitride semiconductor layer cannot be etched by wet etching, the substrate can be easily removed by masking the surface side of the electrode portion or the like, and the emission wavelength is shortened. Even when absorbed by the substrate, the external quantum efficiency can be improved by removing the substrate. In this example as well, other structures such as the semiconductor stacked portion 6 are the same as the example shown in FIG. 1, and the same portions are denoted by the same reference numerals and description thereof is omitted. In addition, by growing an InGaN-based compound on the Zn polar surface of ZnO so that the nitride semiconductor layer is grown in the Zn polarity direction of the ZnO substrate and the wet-etched side becomes O polarity, the etching proceeds faster and the productivity is increased. Is good.

As a structure for removing such a substrate, one electrode can be formed on the nitride semiconductor layer exposed by removing the substrate without necessarily forming both electrodes on one surface side. That is, after the p-side electrode 8 is formed in the state of the wafer having the structure shown in FIG. 1, an insulating film 10 such as SiO, SiN or Al ₂ O ₃ is formed on the entire surface, and the p-side electrode 8 is formed on the surface. It is possible to form a mirror structure by opening and exposing and forming a laminated metal film 11 of Ag / Ti / Pt / Au on the entire surface. By immersing in the HCl solution in this state, the metal film and the nitride semiconductor layer are not etched, and only the ZnO substrate 1 can be removed. The n-side electrode 9 can be formed on the exposed surface, and the exposed surface side can be used as a light extraction surface. In this case, the exposed n-type layer may be the first nitride semiconductor layer formed in the n-type, or the n-type layer 3 grown thereon. Alternatively, the ZnO substrate 1 may be formed in an n-type and a part thereof may remain. The metal film 11 described above can be directly die-bonded to a die bonding substrate or the like with an Au—Sn alloy or the like.

  In addition, when mounting on a submount having good thermal conductivity face down, such as a semiconductor laser, a p-side electrode is formed in the wafer state and then chipped, and the p-side electrode side is formed on the submount surface. After bonding to the substrate, the substrate can be removed by etching using the etching solution described above. According to such a method, a very thin element can be mounted without causing any damage during handling. Even in the case of an LED, the light emitted can be used very effectively. In addition, as a submount with favorable heat conduction, a metal, any one of AlN, SiC, and diamond, or a surface thereof coated with Cu or Ag can be used.

  Furthermore, when the n-type electrode is exposed on the exposed surface and the n-side electrode is formed on the exposed surface, it is preferable to form irregularities on the exposed surface by etching or the like, because in the case of an LED, the light extraction efficiency is improved. . In this case, when the unevenness is formed in the nitride semiconductor layer, the unevenness is formed by dry etching or mechanically formed by sandblasting or the like, but the unevenness is formed by wet etching while leaving a part of the ZnO substrate. It can also be formed.

  FIG. 5 shows a transistor formed by forming a first nitride semiconductor layer 2 made of an InGaN-based compound on the surface of the ZnO-based oxide substrate 1 and laminating a nitride semiconductor layer having good crystallinity. FIG. As in the case of the light emitting element, the first nitride semiconductor layer 2 is first grown at a low temperature of 800 ° C. or lower using nitrogen gas as a carrier gas in the MOCVD apparatus, and then the necessary organometallic gas is introduced as described above. Then, an undoped GaN layer 23 of about 4 μm, an undoped AlGaN-based compound electron transit layer 24 of about 10 nm, and an n-type GaN layer 25 of about 5 nm are sequentially grown to have a gate length of about 1.5 μm. A part of the n-type GaN layer 25 is removed by etching so that the space is provided, so that the electron transit layer 24 is exposed. Then, a source electrode 26 and a drain electrode 27 are formed of, for example, a Ti film and an Au film on the n-type GaN layer 25 left with a predetermined interval, and on the surface of the undoped AlGaN-based compound layer 24, For example, a transistor is configured by forming the gate electrode 28 by stacking a Pt film and an Au film. By forming a single-crystal buffer layer 2 on such a substrate surface and growing a GaN layer thereon, a nitride semiconductor layer with very excellent crystallinity can be obtained, a leakage current is small, An excellent high speed transistor (HEMT) is obtained.

  As described above, according to the present invention, the first layer of the InGaN-based compound that can be lattice-matched to the surface of the ZnO-based compound such as ZnO is used as the substrate while the nitride semiconductor layer is stacked. Since the nitride semiconductor layer is provided and the nitride semiconductor layer is laminated on the nitride semiconductor layer, a nitride semiconductor element having extremely excellent crystallinity can be formed. As a result, device characteristics using nitride semiconductors, such as nitride semiconductor light emitting devices such as LEDs and LDs (laser diodes) with excellent light emission characteristics, and nitride transistors such as HEMT with low leakage current and excellent withstand voltage, are greatly improved. Can be improved.

It is sectional explanatory drawing of LED which is an example of the nitride semiconductor element obtained by the manufacturing method of this invention. It is sectional explanatory drawing which shows the example of the protective film in the case of growing a nitride semiconductor layer on a board | substrate by the manufacturing method of this invention. It is a structural example of the 1st nitride semiconductor layer formed on a board | substrate by this invention. It is sectional explanatory drawing which shows the other structural example of the nitride semiconductor light-emitting device obtained by the manufacturing method of this invention. FIG. 5 is a cross-sectional explanatory view of a transistor formed by the manufacturing method of the present invention. It is a figure which shows the structural example of LED using the conventional nitride semiconductor.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Substrate 2 1st nitride semiconductor layer 3 N-type layer 4 Active layer 5 P-type layer 6 Semiconductor laminated part 7 Translucent conductive layer 8 P-side electrode 9 N-side electrode

Claims (8)

(A) A protective film is formed on the surface of the substrate made of a zinc oxide compound excluding the semiconductor layer lamination surface, and (b) the substrate is placed in an MOCVD apparatus, and nitrogen gas is used as a carrier gas. , A first nitride semiconductor layer made of In _y Ga _1-y N (0 <y ≦ 0.5) is grown, and (c) a desired nitride semiconductor layer is subsequently grown to form a nitride semiconductor element. A method for producing a nitride semiconductor device, comprising:   The method for producing a nitride semiconductor device according to claim 1, wherein the growth of the first nitride semiconductor layer is performed at a low temperature of 600 to 900 ° C. lower than a growth temperature of GaN.   3. The growth of the first nitride semiconductor layer is formed in a superlattice structure or a gradient layer in which the composition of In decreases gradually or stepwise by controlling the flow rate of the In source gas. A method of manufacturing a nitride semiconductor device.   The method for producing a nitride semiconductor device according to any one of claims 1 to 3, wherein a part or all of the substrate is removed by wet etching after the device of step (c) is formed.   A desired nitride semiconductor layer grown on the first nitride semiconductor layer includes at least an n-type layer and a p-type layer so as to form a light-emitting layer, and n is formed on the first nitride semiconductor layer side. 5. The nitridation according to claim 4, wherein a semiconductor light emitting device is formed by forming a p-type layer on the surface side so as to become a p-type layer, and forming an n-side electrode on the n-type layer exposed by the wet etching. Manufacturing method for semiconductor devices.   6. The method for producing a nitride semiconductor device according to claim 5, wherein irregularities are formed on a surface of the n-type layer exposed by the wet etching, and then the n-side electrode is formed.   A desired nitride semiconductor layer grown on the first nitride semiconductor layer includes at least an n-type layer and a p-type layer so as to form a light-emitting layer, and n is formed on the first nitride semiconductor layer side. The substrate is formed by growing a p-type layer on the surface side to form a p-type layer, forming a p-side electrode on the surface side, and then die-bonding the p-side electrode side to a submount. The method for producing a nitride semiconductor device according to claim 1, wherein a semiconductor light emitting device is formed by removing a part or all of the substrate by wet etching.   8. The method of manufacturing a nitride semiconductor device according to claim 7, wherein the submount is a metal, one of AlN, SiC, and diamond, or a surface thereof coated with Cu or Ag.

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