JP2012028300A - Backlight assembly, backlight unit, and liquid crystal display device - Google Patents

Backlight assembly, backlight unit, and liquid crystal display device Download PDF

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JP2012028300A
JP2012028300A JP2010283082A JP2010283082A JP2012028300A JP 2012028300 A JP2012028300 A JP 2012028300A JP 2010283082 A JP2010283082 A JP 2010283082A JP 2010283082 A JP2010283082 A JP 2010283082A JP 2012028300 A JP2012028300 A JP 2012028300A
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connector
chassis
emitting element
light emitting
power supply
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JP5100823B2 (en
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Takeharu Naito
丈晴 内藤
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Japan Aviation Electronics Industry Ltd
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Japan Aviation Electronics Industry Ltd
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Priority to JP2010283082A priority Critical patent/JP5100823B2/en
Priority to US13/065,391 priority patent/US8730430B2/en
Priority to KR1020110038936A priority patent/KR101255436B1/en
Priority to TW100116606A priority patent/TWI474083B/en
Priority to CN201110150770.0A priority patent/CN102313202B/en
Publication of JP2012028300A publication Critical patent/JP2012028300A/en
Priority to KR1020120120020A priority patent/KR101323432B1/en
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    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336Illuminating devices
    • G02F1/133602Direct backlight
    • G02F1/133608Direct backlight including particular frames or supporting means
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1345Conductors connecting electrodes to cell terminals
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336Illuminating devices
    • G02F1/133602Direct backlight
    • G02F1/133603Direct backlight with LEDs
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336Illuminating devices
    • G02F1/133602Direct backlight
    • G02F1/133612Electrical details

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Planar Illumination Modules (AREA)
  • Liquid Crystal (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a backlight assembly, a backlight unit, and a liquid crystal display device capable of cost reduction easily.SOLUTION: A light-emitting element substrate 26 on which light-emitting elements 25 are mounted is arranged on the front face of a chassis 3, and a first connector 24 is inserted and connected to this. On the other hand, a power supply substrate 31 which supplies power to the light-emitting element substrate 26 is arranged on the rear face of the chassis 3 and a second connector 32 is mounted on this. Then, by mutually insertion-connecting the first connector 24 and the second connector 32, power is supplied from the power supply substrate 31 to the light-emitting element substrate 26 through the first connector 24 and the second connector 32. The second connector 32 may be electrically connected to the power supply substrate 31 through a harness.

Description

本発明は、表示装置のためのバックライトアセンブリ、それを用いたバックライトユニット、及び液晶表示装置に関する。   The present invention relates to a backlight assembly for a display device, a backlight unit using the same, and a liquid crystal display device.

液晶を用いた表示装置は、ブラウン管等の表示装置と比べて軽量薄型で消費電力が低いため、携帯機器やコンピュータ、大型テレビ等の表示装置に幅広く用いられている。液晶それ自体は発光しないため、表示装置において画面を表示するためには、液晶の後方から光を照射するバックライトユニットが用いられることがある。バックライトユニットは、通常、LED(Light Emitting Diode)等の発光素子を有する発光素子基板と、発光素子に電力や制御信号を供給する電力供給基板と、発光素子基板と電源供給基板を接続する電気伝導路とを有するバックライトアセンブリを含む。   Since display devices using liquid crystals are lighter and thinner and consume less power than display devices such as cathode ray tubes, they are widely used in display devices such as portable devices, computers, and large televisions. Since the liquid crystal itself does not emit light, a backlight unit that emits light from behind the liquid crystal may be used to display a screen on the display device. The backlight unit usually includes a light emitting element substrate having a light emitting element such as an LED (Light Emitting Diode), a power supply substrate that supplies power and a control signal to the light emitting element, and an electrical connection that connects the light emitting element substrate and the power supply substrate. A backlight assembly having a conductive path.

バックライトアセンブリとしては、例えば発光素子基板と電源供給基板をシャーシの表裏にそれぞれ固定し、シャーシに設けられた穴にハーネスを通し、そのハーネスを電気伝導路として発光素子基板と電源供給基板とを電気的に接続する構造のものがある(特許文献1参照)。このような構造のバックライトアセンブリにあっては、シャーシの穴を介して粉塵等のゴミがバックライトユニットの内部に入りこまないようにするために、穴を塞ぐ必要がある。   As the backlight assembly, for example, the light emitting element substrate and the power supply board are fixed to the front and back of the chassis, the harness is passed through the hole provided in the chassis, and the light emitting element substrate and the power supply board are connected to each other using the harness as an electrical conduction path. There is an electrical connection structure (see Patent Document 1). In the backlight assembly having such a structure, it is necessary to close the hole so that dust or the like does not enter the backlight unit through the hole of the chassis.

次に、特許文献1に開示されたものとは異なるが類似の構造をもつバックライトアセンブリの例を図31〜図33を用いて説明する。   Next, an example of a backlight assembly different from that disclosed in Patent Document 1 but having a similar structure will be described with reference to FIGS.

図31および図32に示すように、シャーシ103の前面の周辺部は枠103bを形成しており、枠103bにはLED等の発光素子131および発光素子コネクタ133を有する発光素子基板123a〜123fがネジ止めされている(発光素子基板123d、123e、123fは図示せず)。   As shown in FIGS. 31 and 32, a frame 103b is formed on the periphery of the front surface of the chassis 103, and light emitting element substrates 123a to 123f each having a light emitting element 131 such as an LED and a light emitting element connector 133 are formed on the frame 103b. Screwed (light emitting element substrates 123d, 123e, 123f are not shown).

一方、図33に示すように、シャーシ103の後面には発光素子基板123a〜123fに電力や制御信号を供給する電源供給基板237がネジ止めされており、電源供給基板237には電源供給基板コネクタ235が搭載されている。   On the other hand, as shown in FIG. 33, a power supply board 237 for supplying power and control signals to the light emitting element boards 123a to 123f is screwed to the rear surface of the chassis 103. The power supply board connector 237 has a power supply board connector. 235 is mounted.

発光素子基板123a〜123fと電源供給基板237はハーネス233を介して電気的に接続されている。具体的には、ハーネス233はその一端が発光素子コネクタ133と接続される発光素子側コネクタ143を構成しており、他端が電源供給基板コネクタ235と接続される電源供給基板側コネクタ(図示せず)を構成している。   The light emitting element substrates 123 a to 123 f and the power supply substrate 237 are electrically connected via a harness 233. Specifically, the harness 233 constitutes a light emitting element side connector 143 whose one end is connected to the light emitting element connector 133 and the other end is connected to a power supply board connector 235 (not shown). )).

また、シャーシ103にはハーネス233を通すための穴234が設けられている。穴234はゴム栓231で塞がれており、ゴム栓231にはハーネス233を通すためのスリット状の小穴231aが設けられている。   Further, the chassis 103 is provided with a hole 234 through which the harness 233 is passed. The hole 234 is closed with a rubber plug 231, and the rubber plug 231 is provided with a slit-shaped small hole 231 a for allowing the harness 233 to pass through.

このようなバックライトアセンブリの組み立て方法としては、以下のような工程が必要である。
(1)発光素子基板123a〜123fをシャーシ103に取り付ける。
(2)ハーネス233の発光素子側コネクタ143と発光素子基板123a〜123fの発光素子コネクタ133を接続し、ハーネス233を穴234よりシャーシ103の後面側に引き出す。
(3)穴234をゴム栓231で塞ぐ。
(4)シャーシ103の後面に電源供給基板237を固定する。
(5)電源供給基板237の電源供給基板コネクタ235と、ハーネス233の電源供給基板側コネクタを接続する。
As a method for assembling such a backlight assembly, the following steps are required.
(1) The light emitting element substrates 123a to 123f are attached to the chassis 103.
(2) The light emitting element side connector 143 of the harness 233 and the light emitting element connector 133 of the light emitting element substrates 123a to 123f are connected, and the harness 233 is pulled out from the hole 234 to the rear surface side of the chassis 103.
(3) The hole 234 is closed with the rubber plug 231.
(4) The power supply board 237 is fixed to the rear surface of the chassis 103.
(5) The power supply board connector 235 of the power supply board 237 and the power supply board side connector of the harness 233 are connected.

特開2009−295587号公報JP 2009-295587 A

しかしながら、このように、ハーネスをシャーシの穴に通して前後両面の基板(発光素子基板123a〜123fと電源供給基板237)をコネクタで接続する構造では、ゴム栓231、発光素子コネクタ133、電源供給基板コネクタ235、および両端にコネクタを備えたハーネス233が必須の構成となり、これ以上の部品点数の削減が困難であるため、コスト削減が難しいという問題があった。   However, in such a structure in which the harness is passed through a hole in the chassis and the front and rear substrates (the light emitting element substrates 123a to 123f and the power supply substrate 237) are connected by connectors, the rubber plug 231, the light emitting element connector 133, and the power supply The board connector 235 and the harness 233 provided with connectors at both ends are indispensable components, and it is difficult to reduce the number of parts beyond this, so there is a problem that cost reduction is difficult.

また、上記した構造では、アセンブリの組み立ての際にハーネスをシャーシの穴に通して前後両面の基板と接続する工程が必要となるが、液晶表示装置のバックライトユニットのように、各部材をスタック(積層)して組み立てていく構造においては、このようなハーネスを穴に通す工程を含むと非常に作業性が悪くなり、工数も嵩むため、製造コストがかかるという問題があった。   In addition, the above-described structure requires a step of connecting the harness through the holes in the chassis and connecting to the front and rear substrates when assembling the assembly. However, like the backlight unit of the liquid crystal display device, the members are stacked. In the structure of assembling (stacking) and assembling, there is a problem that if such a step of passing the harness through the hole is included, workability is extremely deteriorated and man-hours are increased, resulting in increased manufacturing costs.

さらに、液晶表示装置はその特性によって、同一のハーネスや発光素子基板を用い、異なる電源供給基板を用いたものがあるが、上記構造では電源供給基板の種類によらず、ハーネス側のコネクタに対応したコネクタを電源供給基板に搭載しなければならないため、電源供給基板の設計の自由度が小さく、コストがかかるという問題があった。   In addition, some liquid crystal display devices use the same harness or light-emitting element substrate due to their characteristics, and use different power supply substrates. However, the above structure supports connectors on the harness side regardless of the type of power supply substrate. Since the connector must be mounted on the power supply board, there is a problem that the degree of freedom in designing the power supply board is small and the cost is high.

本発明は、このような問題に鑑みてなされたもので、その目的は、従来よりもコストの削減が容易なバックライトアセンブリ、バックライトユニット、及び液晶表示装置を提供することにある。   The present invention has been made in view of such problems, and an object of the present invention is to provide a backlight assembly, a backlight unit, and a liquid crystal display device that can be reduced in cost more easily than in the past.

本発明の第1の例示的態様に係るバックライトアセンブリは、シャーシと、前記シャーシの前面に配置され、発光素子が実装された発光素子基板と、前記シャーシの後面に配置され、前記発光素子基板に電力を供給する電源供給基板と、前記シャーシに保持され、前記発光素子基板が嵌合接続された第1のコネクタと、前記電源供給基板に実装されかつ前記第1のコネクタに嵌合接続された第2のコネクタとを含み、前記電源供給基板から前記発光素子基板に前記第1のコネクタ及び前記第2のコネクタを介して電力を供給することを特徴とする。   A backlight assembly according to a first exemplary embodiment of the present invention includes a chassis, a light emitting element substrate disposed on a front surface of the chassis and mounted with a light emitting element, and disposed on a rear surface of the chassis. A power supply board for supplying power to the power supply, a first connector held by the chassis and fitted and connected to the light emitting element board, and mounted on the power supply board and fitted and connected to the first connector. And supplying a power from the power supply substrate to the light emitting element substrate via the first connector and the second connector.

本発明の第2の例示的態様に係るバックライトアセンブリは、シャーシと、前記シャーシの前面に配置され、発光素子が実装された発光素子基板と、前記シャーシの後面に配置され、前記発光素子基板に電力を供給する電源供給基板と、前記シャーシに保持され、前記発光素子基板が嵌合接続された第1のコネクタと、前記電源供給基板にハーネスを介して接続されかつ前記第1のコネクタに嵌合接続された第2のコネクタとを含み、前記電源供給基板から前記発光素子基板に前記第1のコネクタ及び前記第2のコネクタを介して電力を供給することを特徴とする。   A backlight assembly according to a second exemplary embodiment of the present invention includes a chassis, a light emitting element substrate disposed on a front surface of the chassis and mounted with a light emitting element, and disposed on a rear surface of the chassis. A power supply board for supplying power to the power supply, a first connector held in the chassis and fitted and connected to the light emitting element board, and connected to the power supply board via a harness and connected to the first connector. And a second connector connected by fitting, wherein power is supplied from the power supply substrate to the light emitting element substrate via the first connector and the second connector.

本発明の例示的態様に係るバックライトユニットは、上記バックライトアセンブリと、前記シャーシの前面側に配置された光学系とを含むことを特徴とする。   A backlight unit according to an exemplary aspect of the present invention includes the backlight assembly and an optical system disposed on a front side of the chassis.

本発明の例示的態様に係る液晶表示装置は、上記バックライトユニットと、液晶表示部とを含み、前記光学系は前記バックライトアセンブリと前記液晶表示部との間に配置されていることを特徴とする。   A liquid crystal display device according to an exemplary embodiment of the present invention includes the backlight unit and a liquid crystal display unit, and the optical system is disposed between the backlight assembly and the liquid crystal display unit. And

本発明によれば、従来よりもコストの削減が容易なバックライトアセンブリ、バックライトユニット、及び液晶表示装置を提供することが可能である。   According to the present invention, it is possible to provide a backlight assembly, a backlight unit, and a liquid crystal display device that can be reduced in cost more easily than in the past.

液晶表示装置の分解斜視図。The disassembled perspective view of a liquid crystal display device. 本発明の第1の実施形態に係るバックライトアセンブリのシャーシに第1のコネクタを組み付ける過程を説明するための一部のみを示す分解斜視図。The disassembled perspective view which shows only a part for demonstrating the process in which the 1st connector is assembled | attached to the chassis of the backlight assembly which concerns on the 1st Embodiment of this invention. 第1の実施形態において、シャーシに第1のコネクタを組み付けた状態の一部のみを示す斜視図。The perspective view which shows only a part of the state which assembled | attached the 1st connector to the chassis in 1st Embodiment. 第1の実施形態において、シャーシに取り付けられる発光素子基板の平面図。The top view of the light emitting element substrate attached to a chassis in 1st Embodiment. 図4Aの一部のみを示す拡大図。The enlarged view which shows only a part of FIG. 4A. 第1の実施形態において、発光素子基板に放熱用部材を取り付けた部品の斜視図。The perspective view of the component which attached the member for thermal radiation to the light emitting element board | substrate in 1st Embodiment. 図5Aの一部のみを示す拡大図。The enlarged view which shows only a part of FIG. 5A. 図5Aに示す部品をシャーシに組み付ける前の状態を示す斜視図。FIG. 5B is a perspective view showing a state before the components shown in FIG. 5A are assembled to the chassis. 図6Aの一部のみを示す拡大図。FIG. 6B is an enlarged view showing only a part of FIG. 6A. 第1の実施形態において、第2のコネクタを搭載した電源供給基板をシャーシに組み付ける過程を説明するための一部のみを示す分解斜視図。FIG. 4 is an exploded perspective view showing only a part for explaining a process of assembling a power supply board on which a second connector is mounted in a chassis in the first embodiment. 図7の状態における要部のみの拡大断面斜視図。The expanded cross-section perspective view of only the principal part in the state of FIG. 第1の実施形態において、電源供給基板をシャーシに組み付けた状態の一部のみを示す斜視図。The perspective view which shows only a part of the state which assembled | attached the power supply board to the chassis in 1st Embodiment. 第1の実施形態における第1のコネクタを示し、(a)は斜視図、(b)は平面図、(c)は正面図、(d)は側面図。The 1st connector in 1st Embodiment is shown, (a) is a perspective view, (b) is a top view, (c) is a front view, (d) is a side view. 第1の実施形態における第1のコネクタに含まれた第1のハウジングの斜視図。The perspective view of the 1st housing contained in the 1st connector in a 1st embodiment. 第1の実施形態における第1のコネクタに含まれた第1のコンタクトの斜視図。The perspective view of the 1st contact contained in the 1st connector in a 1st embodiment. 第1の実施形態における第2のコネクタを示し、(a)は斜視図、(b)は平面図、(c)は正面図、(d)は側面図、(e)は異なる方向から見た斜視図。The 2nd connector in 1st Embodiment is shown, (a) is a perspective view, (b) is a top view, (c) is a front view, (d) is a side view, (e) is seen from a different direction. Perspective view. 第1の実施形態における第2のコネクタに含まれた第2のコンタクトの斜視図。The perspective view of the 2nd contact contained in the 2nd connector in 1st Embodiment. 第1の実施形態における第2のコネクタに含まれたホールドダウンの斜視図。The perspective view of the holddown contained in the 2nd connector in 1st Embodiment. 第1の実施形態における第1のコネクタと第2のコネクタとの接続前の状態を示す断面図。Sectional drawing which shows the state before the connection of the 1st connector and 2nd connector in 1st Embodiment. 第1の実施形態における第1のコネクタと第2のコネクタとの第1の接続状態を示す断面図。Sectional drawing which shows the 1st connection state of the 1st connector and 2nd connector in 1st Embodiment. 第1の実施形態における第1のコネクタと第2のコネクタとの第2の接続状態を示す断面図。Sectional drawing which shows the 2nd connection state of the 1st connector and 2nd connector in 1st Embodiment. 本発明の第2の実施形態に係るバックライトアセンブリにおける第1のコネクタと電源供給基板との接続態様を示す断面図。Sectional drawing which shows the connection aspect of the 1st connector and power supply board in the backlight assembly which concerns on the 2nd Embodiment of this invention. 第2の実施形態において、バックライトアセンブリのシャーシに第1のコネクタを組み付ける過程を説明するための前面(表面)側から見た斜視図。The perspective view seen from the front (surface) side for demonstrating the process in which the 1st connector is assembled | attached to the chassis of a backlight assembly in 2nd Embodiment. 第2の実施形態において、シャーシに組み付けた第1のコネクタに発光素子基板を接続する過程を説明するための前面側から見た斜視図。The perspective view seen from the front side for demonstrating the process of connecting a light emitting element board | substrate to the 1st connector assembled | attached to the chassis in 2nd Embodiment. 第2の実施形態において、シャーシに組み付けた第1のコネクタに発光素子基板が接続された状態を示す、図21と同様な斜視図。The perspective view similar to FIG. 21 which shows the state by which the light emitting element board | substrate was connected to the 1st connector assembled | attached to the chassis in 2nd Embodiment. 図22に示す状態における発光素子基板の後面(裏面)側から見た斜視図。The perspective view seen from the back surface (back surface) side of the light emitting element substrate in the state shown in FIG. 第1のコネクタに第2のコネクタが接続された、図23と同様な斜視図。The perspective view similar to FIG. 23 with which the 2nd connector was connected to the 1st connector. 第2の実施形態において、第1のコネクタと第2のコネクタとが接続された状態を示す平面図。The top view which shows the state in which the 1st connector and the 2nd connector were connected in 2nd Embodiment. 第2の実施形態における第1のコネクタを示し、(a)は正面図、(b)は背面図、(c)は平面図、(d)は底面図、(e)は右側面図。The 1st connector in 2nd Embodiment is shown, (a) is a front view, (b) is a rear view, (c) is a top view, (d) is a bottom view, (e) is a right view. 図26(a)のA−A線に沿って得られた断面図。Sectional drawing obtained along the AA line of Fig.26 (a). 第1のコネクタとシャーシとの関係を示した一部のみの図27と同様な断面図。FIG. 28 is a cross-sectional view similar to FIG. 27 showing only a part of the relationship between the first connector and the chassis. 図26(a)のB−B線に沿って得られた断面図。Sectional drawing obtained along the BB line of Fig.26 (a). 第2の実施形態における第1のコネクタと発光素子基板との関係を示した説明用断面図。Sectional drawing for description which showed the relationship between the 1st connector and light emitting element board | substrate in 2nd Embodiment. 従来のバックライトアセンブリの例を示す平面図。The top view which shows the example of the conventional backlight assembly. 図31の点線で囲まれた領域の拡大斜視図であって、(a)は領域αの拡大斜視図、(b)は領域βの拡大斜視図、(c)は領域γの拡大斜視図。FIG. 32 is an enlarged perspective view of a region surrounded by a dotted line in FIG. 31, wherein (a) is an enlarged perspective view of the region α, (b) is an enlarged perspective view of the region β, and (c) is an enlarged perspective view of the region γ. 図31の裏面図。The reverse view of FIG.

以下、図面に基づいて本発明の実施形態について説明する。
まず、図1を参照して、液晶表示装置100の全体構成を説明する。
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
First, the overall configuration of the liquid crystal display device 100 will be described with reference to FIG.

図1に示すように、液晶表示装置100は、液晶を用いた前部の液晶表示部300と、液晶表示部300に光を照射するための後部のバックライトユニット200と、これらを搭載したフレーム15とを有している。バックライトユニット200は、バックライトアセンブリ1と、そのバックライトアセンブリ1の前面側に、即ち、バックライトアセンブリ1と液晶表示部300との間に配置された光学系とを含んでいる。   As shown in FIG. 1, a liquid crystal display device 100 includes a front liquid crystal display unit 300 using liquid crystal, a rear backlight unit 200 for irradiating the liquid crystal display unit 300 with light, and a frame on which these are mounted. 15. The backlight unit 200 includes the backlight assembly 1 and an optical system disposed on the front side of the backlight assembly 1, that is, between the backlight assembly 1 and the liquid crystal display unit 300.

バックライトアセンブリ1は金属製のシャーシ3を含んでいる。光学系は、シャーシ3の前面に順次積層された反射シート5、導光板7、拡散シート9、プリズムシート11、集光シート13を有している。   The backlight assembly 1 includes a metal chassis 3. The optical system includes a reflection sheet 5, a light guide plate 7, a diffusion sheet 9, a prism sheet 11, and a light collection sheet 13 that are sequentially stacked on the front surface of the chassis 3.

次に、図2〜図9を参照して、第1の実施形態に係るバックライトアセンブリを、それの製造方法と共に明らかにする。   Next, the backlight assembly according to the first embodiment will be clarified together with the manufacturing method thereof with reference to FIGS.

図2において、シャーシ3は、矩形板状の主板部3aと、その主板部3aの各辺若しくはその近傍から前面側に突出した枠板部3bとを有している。主板部3aの一辺における枠板部3bの近傍には前面から後面に向けてへこんだ凹部3cが形成され、さらに凹部3cの底面にシャーシ穴部3dが形成されている。シャーシ穴部3dには、後文にて詳述する第1のコネクタ24が挿通されて固定される。シャーシ3に第1のコネクタ24を実装した状態を図3に示す。なお、第1のコネクタ24を設置したシャーシ3の全体は図6Aに示されている。   In FIG. 2, the chassis 3 has a rectangular plate-shaped main plate portion 3 a and a frame plate portion 3 b that protrudes to the front side from each side of the main plate portion 3 a or the vicinity thereof. In the vicinity of the frame plate portion 3b on one side of the main plate portion 3a, a recessed portion 3c that is recessed from the front surface to the rear surface is formed, and a chassis hole portion 3d is formed on the bottom surface of the recessed portion 3c. A first connector 24, which will be described in detail later, is inserted and fixed in the chassis hole 3d. FIG. 3 shows a state in which the first connector 24 is mounted on the chassis 3. The entire chassis 3 in which the first connector 24 is installed is shown in FIG. 6A.

さらに、図4A及び図4Bに示すようにLED(Light Emitting Diode)等の多数の発光素子25が一面に一列に実装された細長い発光素子基板26を2つ用意し、これらを図5A及び図5Bに示すように一つの放熱用部材27に直列に配置する。これらの発光素子基板26は、互いに隣接した端部に、幅方向で一側に互いに平行に突出した基板凸部26aを有している。一方、放熱用部材27は、発光素子基板26の発光素子25を実装した面とは反対の面に対向する裏打ち部27aと、裏打ち部27aとは直角な放熱部27bと、放熱部27bに形成された凸部挿入口27cとを有している。   Further, as shown in FIGS. 4A and 4B, two elongated light emitting element substrates 26 each having a large number of light emitting elements 25 such as LEDs (Light Emitting Diodes) mounted in a line on one surface are prepared, and these are shown in FIGS. 5A and 5B. As shown in FIG. 4, the heat dissipating members 27 are arranged in series. These light-emitting element substrates 26 have substrate convex portions 26a that protrude in parallel to one side in the width direction at end portions adjacent to each other. On the other hand, the heat radiating member 27 is formed on the lining portion 27a facing the surface opposite to the surface on which the light emitting element 25 is mounted of the light emitting element substrate 26, the heat radiating portion 27b perpendicular to the lining portion 27a, and the heat radiating portion 27b. And a convex portion insertion opening 27c.

発光素子基板26は、基板凸部26aが凸部挿入口27cに挿通された状態で放熱用部材27に組み付けられ、かつ、長手方向に間隔をもつ複数のネジ止め穴26bを利用して放熱用部材27にネジ止め固定される。また、基板凸部26aの一面には、凸部挿入口27cを通って放熱部27bの反対側に露出した二つの導電性の接触部26cが設けられている。これらの接触部26cは発光素子基板26の回路を介して発光素子25に接続されている。   The light-emitting element substrate 26 is assembled to the heat radiation member 27 with the substrate convex portion 26a inserted through the convex portion insertion port 27c, and uses a plurality of screw holes 26b spaced in the longitudinal direction for heat radiation. The member 27 is fixed with screws. In addition, two conductive contact portions 26c exposed on the opposite side of the heat radiating portion 27b through the convex portion insertion port 27c are provided on one surface of the substrate convex portion 26a. These contact portions 26 c are connected to the light emitting element 25 through the circuit of the light emitting element substrate 26.

発光素子基板26に放熱用部材27を取り付けてなる発光部品28を、第1のコネクタ24を設置したシャーシ3の前面に、図6A及び図6Bに示すように配置し、基板凸部26aを第1のコネクタ24に挿入しかつ放熱用部材27をシャーシ3にネジ止めする。かくして、図1に示すバックライトアセンブリ1の前面側には、第1のコネクタ24を介して通電可能な多数の発光素子25がシャーシ3の一片の近傍に沿って配列固定される。   A light-emitting component 28 in which a heat dissipation member 27 is attached to the light-emitting element substrate 26 is disposed on the front surface of the chassis 3 on which the first connector 24 is installed as shown in FIGS. The heat dissipation member 27 is screwed to the chassis 3. Thus, on the front side of the backlight assembly 1 shown in FIG. 1, a large number of light-emitting elements 25 that can be energized via the first connector 24 are arranged and fixed along the vicinity of one piece of the chassis 3.

一方、図1に示すバックライトアセンブリ1の後面側には、発光素子基板26に電力を供給するための電源供給基板31が備えられている。電源供給基板31はシャーシ3の後面に平行に配置されかつシャーシ3にネジ止めにより固定されている。   On the other hand, a power supply substrate 31 for supplying power to the light emitting element substrate 26 is provided on the rear surface side of the backlight assembly 1 shown in FIG. The power supply board 31 is disposed in parallel to the rear surface of the chassis 3 and is fixed to the chassis 3 by screws.

図7及び図8に示すように、電源供給基板31の後面には、後文にて詳述する第2のコネクタ32が実装されている。第2のコネクタ32は第1のコネクタ24と嵌合して電気的接続を得ることができるものである。第2のコネクタ32と第1のコネクタ24との嵌合を可能にするため、電源供給基板31には第2のコネクタ32に対応して嵌合用開口31aが形成されている。   As shown in FIGS. 7 and 8, the second connector 32, which will be described in detail later, is mounted on the rear surface of the power supply board 31. The second connector 32 can be fitted with the first connector 24 to obtain an electrical connection. In order to allow the second connector 32 and the first connector 24 to be fitted, the power supply board 31 is formed with a fitting opening 31 a corresponding to the second connector 32.

第2のコネクタ32と第1のコネクタ24との嵌合を伴って電源供給基板31はシャーシ3の後面に配置固定した状態を図9に示した。   FIG. 9 shows a state where the power supply board 31 is arranged and fixed on the rear surface of the chassis 3 with the fitting of the second connector 32 and the first connector 24.

次に、図1〜図9と共に図10〜図12をも参照して、第1のコネクタ24について説明する。   Next, the first connector 24 will be described with reference to FIGS. 10 to 12 together with FIGS.

第1のコネクタ24は、シャーシ3を貫通する絶縁性の第1のハウジング34と、第1のハウジング34に保持された4本の導電性の第1のコンタクト35とを含んでいる。   The first connector 24 includes an insulating first housing 34 that penetrates the chassis 3, and four conductive first contacts 35 that are held by the first housing 34.

第1のハウジング34は、二つの基板凸部26aをそれぞれ挿入するための二つの基板挿入口34aと、第2のコネクタ32に嵌合されるときの挿入を誘う一対の挿入誘い部34bと、シャーシ穴部3dに挿入されたときにシャーシ3に突き当たるシャーシ突き当て面34cと、シャーシ突き当て面34cと協働してシャーシ係合部として働き、第1のコネクタ24をシャーシ3に対し拘束若しくは固定するためのバネ性をもつ対のシャーシ係合爪34dと、第2のコネクタ32に嵌合したときに第2のコネクタ32に突き当たるコネクタ突き当て面34eとを有している。各挿入誘い部34bの先端には誘い易くするための面取りがある。   The first housing 34 includes two board insertion openings 34a for inserting the two board projections 26a, and a pair of insertion invitation parts 34b for inviting insertion when fitted to the second connector 32, The chassis abutting surface 34c that abuts against the chassis 3 when inserted into the chassis hole 3d and the chassis abutting surface 34c work together as a chassis engaging portion to restrain the first connector 24 with respect to the chassis 3 or A pair of chassis engaging claws 34d having spring properties for fixing and a connector abutting surface 34e that abuts against the second connector 32 when fitted to the second connector 32 are provided. There is a chamfer at the tip of each insertion invitation part 34b to facilitate invitation.

第1のコンタクト35の各々は、第1のハウジング34に圧入する二つの圧入部35a、35bを有している。第1のコンタクト35の中間部にある圧入部35aを、ここでは、第1のハウジング34に係合する係合部と呼ぶ。第1のコンタクト35の係合部35aの一側にはバネ部35cが、係合部35aの反対側には直線的にのびた平板状のコネクタ接触部35dが、それぞれ形成されている。バネ部35cは、発光素子基板26の基板凸部26aに設けた接触部26cと一対一で接触する基板接触部35eと、第1のハウジング34に係合してバネ部35bの煽りを防止する煽り防止部35fとを有している。基板接触部35eは基板挿入口34aに配置される。   Each of the first contacts 35 has two press-fit portions 35 a and 35 b that are press-fit into the first housing 34. Here, the press-fit portion 35 a in the intermediate portion of the first contact 35 is referred to as an engaging portion that engages with the first housing 34. A spring portion 35c is formed on one side of the engagement portion 35a of the first contact 35, and a flat plate-like connector contact portion 35d extending linearly is formed on the opposite side of the engagement portion 35a. The spring portion 35c engages with the first housing 34 and the substrate contact portion 35e that makes a one-to-one contact with the contact portion 26c provided on the substrate convex portion 26a of the light emitting element substrate 26, thereby preventing the spring portion 35b from being bent. And a twist preventing portion 35f. The substrate contact portion 35e is disposed in the substrate insertion port 34a.

次に、図1〜図9と共に図13〜図15をも参照して、第2のコネクタ32について説明する。   Next, the second connector 32 will be described with reference to FIGS. 13 to 15 together with FIGS.

第2のコネクタ32は、絶縁性の第2のハウジング37と、第2のハウジング37に保持された4本の導電性の第2のコンタクト38と、第2のハウジング37に固定された一対のホールドダウン39とを含んでいる。   The second connector 32 includes an insulating second housing 37, four conductive second contacts 38 held in the second housing 37, and a pair of fixed to the second housing 37. Hold-down 39.

第2のハウジング37は、第1のコネクタ24のうちシャーシ3を貫通して後部に突出した部分を受け入れるための嵌合用凹部37aを有している。嵌合用凹部37aの両端部には、第1ハウジング34の一対の挿入誘い部34bを受け入れるために幅広の一対の誘い受け部37bがそれぞれ形成されている。嵌合用凹部37aの入口周辺には誘い易くするための面取りがある。   The second housing 37 has a fitting recess 37 a for receiving a portion of the first connector 24 that protrudes rearwardly through the chassis 3. A pair of wide invitation receiving portions 37b are formed at both ends of the fitting recess 37a to receive the pair of insertion invitation portions 34b of the first housing 34, respectively. There is a chamfer around the entrance of the fitting recess 37a for easy invitation.

第2のコンタクト38の各々は、第2のハウジング37に圧入係合する2箇所の圧入部又は係合部38aと、係合部38aの一側のバネ部38bと、係合部38aの他側の端子部38cとを有している。端子部38cは、電源供給基板31に形成したスルーホール(図示せず)に半田付け接続される。バネ部38bは蛇行しつつのび、コネクタ接触部38dと煽り防止部38eとを有している。コネクタ接触部38dは、第1のコンタクト35のコネクタ接触部35dに接触するための部分である。煽り防止部38eは、第2のハウジング37に係合してバネ部38bの煽りを防止するための部分である。   Each of the second contacts 38 includes two press-fitting parts or engaging parts 38a that are press-fitted into the second housing 37, a spring part 38b on one side of the engaging part 38a, and the engaging part 38a. Side terminal portion 38c. The terminal portion 38c is soldered and connected to a through hole (not shown) formed in the power supply substrate 31. The spring portion 38b is meandering and has a connector contact portion 38d and a twist preventing portion 38e. The connector contact portion 38 d is a portion for contacting the connector contact portion 35 d of the first contact 35. The twist preventing portion 38e is a portion for engaging the second housing 37 to prevent the spring portion 38b from being twisted.

ホールドダウン39は、金属板に打ち抜き加工を施して作られたものであり、第2のハウジング37に圧入される圧入部39aと、電源供給基板31からの第2のコネクタ32の浮き上がりを防止する実装時浮き防止部39bと、電源供給基板31のスルーホール(図示せず)に半田付け固定される基板半田付け部39cとを有している。   The hold-down 39 is made by punching a metal plate and prevents the press-fitting portion 39 a press-fitted into the second housing 37 and the second connector 32 from being lifted from the power supply board 31. A mounting-preventing floating portion 39b and a substrate soldering portion 39c fixed to the through hole (not shown) of the power supply substrate 31 by soldering are provided.

次に、図16〜図18を参照して、第1のコネクタ24と第2のコネクタ32との接続について説明する。   Next, the connection between the first connector 24 and the second connector 32 will be described with reference to FIGS.

図16のように第1のコネクタ24と第2のコネクタ32とを位置合わせし、図17に示す第1の形態又は図18に示す第2の形態のように両者を嵌合させる。ここで、図17におけるシャーシ3と電源供給基板31との間隔t1は、図18におけるシャーシ3と電源供給基板31との間隔t2よりも狭い。しかし、いずれの場合であっても、第1のコネクタ24と第2のコネクタ32とに所望の電気的接続を得ることができる。即ち、第1のコネクタ24におけるコネクタ接触部35dの有効接触長が長いので、接触位置を変えることにより、シャーシ3と電源供給基板31の位置変動に対応することが可能である。   The first connector 24 and the second connector 32 are aligned as shown in FIG. 16, and both are fitted as in the first embodiment shown in FIG. 17 or the second embodiment shown in FIG. Here, the distance t1 between the chassis 3 and the power supply board 31 in FIG. 17 is narrower than the distance t2 between the chassis 3 and the power supply board 31 in FIG. However, in any case, a desired electrical connection can be obtained between the first connector 24 and the second connector 32. That is, since the effective contact length of the connector contact portion 35d in the first connector 24 is long, it is possible to cope with the position fluctuation of the chassis 3 and the power supply board 31 by changing the contact position.

また、上述した構造によると、ゴム栓やハーネスが不要となる上に、組み立ての際にハーネスをシャーシ3の穴に通して表裏の基板(発光素子基板および電源供給基板)と接続する工程が不要となるため工数を削減でき、したがって製造コストを下げることができる。さらにハーネスをシャーシの穴に通して表裏でそれぞれ基板と接続する工程が不要であるため、各部材をスタック(積層)して組み立てていくのに好適であり、組み立て時の作業性が良好となり、バックライトアセンブリ1およびバックライトユニット200の製造コストも抑制できる。   Further, according to the above-described structure, a rubber plug and a harness are not required, and a process of connecting the harness to the front and back substrates (light emitting element substrate and power supply substrate) through the hole of the chassis 3 at the time of assembly is unnecessary. Therefore, the number of man-hours can be reduced, and thus the manufacturing cost can be reduced. In addition, since there is no need to connect the harness to the board on the front and back through the holes in the chassis, it is suitable for stacking (stacking) each member and assembling, and the workability during assembly is good, The manufacturing cost of the backlight assembly 1 and the backlight unit 200 can also be suppressed.

次に、図19〜図30を参照して、第2の実施形態に係るバックライトアセンブリを、それの製造方法と共に説明にする。なお、図1〜図18とは構造が多少相違しても同様な機能をもつ部分には同じ参照符号を付し、そしてそれらについての説明を省略することがある。   Next, the backlight assembly according to the second embodiment will be described with reference to FIGS. 1 to 18, even if the structure is slightly different, parts having similar functions are denoted by the same reference numerals, and description thereof may be omitted.

図2〜図9を参照して説明した第1の実施形態に係るバックライトアセンブリでは第2のコネクタ32が電源供給基板31に実装されているが、第2のコネクタ32は電源供給基板31にフレキシブルなハーネスを介して電気的に接続されてもよい。   In the backlight assembly according to the first embodiment described with reference to FIGS. 2 to 9, the second connector 32 is mounted on the power supply board 31, but the second connector 32 is attached to the power supply board 31. It may be electrically connected via a flexible harness.

さらには、図19に示すように、ハーネス41の第2のコネクタ32とは反対側の端部に第3のコネクタ42を接続し、電源供給基板31に実装接続した第4のコネクタ43に第3のコネクタ42を嵌合接続することで、第2のコネクタ32をハーネス41、第3のコネクタ42、及び第4のコネクタ43を介して、電源供給基板31に電気的に接続することもできる。この場合、ハーネス41、第2のコネクタ32、及び第3のコネクタ42を合せて、ハーネスコネクタと呼ぶこともできる。   Further, as shown in FIG. 19, the third connector 42 is connected to the end of the harness 41 opposite to the second connector 32, and the fourth connector 43 mounted and connected to the power supply board 31 is connected to the fourth connector 43. The second connector 32 can be electrically connected to the power supply board 31 via the harness 41, the third connector 42, and the fourth connector 43 by fitting and connecting the three connectors 42. . In this case, the harness 41, the second connector 32, and the third connector 42 may be collectively referred to as a harness connector.

第2のコネクタ32が電源供給基板31にフレキシブルなハーネス41を介して接続された構造によると、シャーシ3に固定される電源供給基板31に対し第2のコネクタ32が位置可変になる。したがって、同じくシャーシ3に固定される第1のコネクタ24に対する第2のコネクタ32の位置合わせが容易になる。   According to the structure in which the second connector 32 is connected to the power supply board 31 via the flexible harness 41, the position of the second connector 32 is variable with respect to the power supply board 31 fixed to the chassis 3. Therefore, the second connector 32 can be easily aligned with the first connector 24 that is also fixed to the chassis 3.

図20〜図25を参照して、バックライトアセンブリ1の変形例におけるシャーシ3に対する各部品の組み付けについて説明する。   With reference to FIG. 20 to FIG. 25, assembly of each component to the chassis 3 in a modification of the backlight assembly 1 will be described.

まず図20において、シャーシ3のシャーシ穴部3dに前面(表面)側から第1のコネクタ24を挿通させる。このとき、第1のコネクタ24の第1のハウジング34の外周に形成したフランジ34fがシャーシ3の主板部3aに当接することで、第1のコネクタ24はシャーシ3に係止され、図21の状態となる。   First, in FIG. 20, the first connector 24 is inserted into the chassis hole 3 d of the chassis 3 from the front (front) side. At this time, the flange 34f formed on the outer periphery of the first housing 34 of the first connector 24 comes into contact with the main plate portion 3a of the chassis 3, so that the first connector 24 is locked to the chassis 3, and FIG. It becomes a state.

図21において、多数の発光素子25を実装した発光素子基板26に放熱用部材27を取り付けてなる発光部品28を、第1のコネクタ24を設置したシャーシ3の前面に配置する。その際、二つの基板凸部26aを第1のコネクタ24の二つの基板挿入口34aにそれぞれ挿入し、図22の状態を得る。   In FIG. 21, a light emitting component 28 in which a heat dissipation member 27 is attached to a light emitting element substrate 26 on which a large number of light emitting elements 25 are mounted is disposed on the front surface of the chassis 3 on which the first connector 24 is installed. At that time, the two board projections 26a are respectively inserted into the two board insertion openings 34a of the first connector 24, and the state shown in FIG. 22 is obtained.

図22の状態で、放熱用部材27をシャーシ3にネジ止めする。かくして、図1に示すバックライトアセンブリ1の前面側には、第1のコネクタ24を介して通電可能な多数の発光素子25がシャーシ3の一片の近傍に沿って配列固定される。なお、フランジ34fが主板部3aと放熱用部材27とに挟まれることで、第1のコネクタ24の固定がなされる。   In the state of FIG. 22, the heat dissipation member 27 is screwed to the chassis 3. Thus, on the front side of the backlight assembly 1 shown in FIG. 1, a large number of light-emitting elements 25 that can be energized via the first connector 24 are arranged and fixed along the vicinity of one piece of the chassis 3. The first connector 24 is fixed by the flange 34f being sandwiched between the main plate portion 3a and the heat dissipation member 27.

図23に移り、シャーシ3の後面(裏面)側には第1のコネクタ24の一部が突出し、ここに二つのコネクタ挿入口34gが形成されている。一方、第2のコネクタ32はハーネス41の一端に電気的に接続されたものである。ハーネス41の他端は、シャーシ3の後面に平行に配置されかつシャーシ3にネジ止めにより固定されている電源供給基板31に電気的に接続されている。第2のコネクタ32を第1のコネクタ24のコネクタ挿入口34gに嵌合させ、図24の状態を得る。かくして、電源供給基板31から、ハーネス41、第2のコネクタ32、及び第1のコネクタ24を介して、発光素子基板26に電力を供給することができるようになる。   23, a part of the first connector 24 protrudes on the rear surface (back surface) side of the chassis 3, and two connector insertion holes 34g are formed therein. On the other hand, the second connector 32 is electrically connected to one end of the harness 41. The other end of the harness 41 is electrically connected to a power supply board 31 that is arranged in parallel to the rear surface of the chassis 3 and fixed to the chassis 3 by screws. The second connector 32 is fitted into the connector insertion port 34g of the first connector 24, and the state shown in FIG. 24 is obtained. Thus, power can be supplied from the power supply substrate 31 to the light emitting element substrate 26 via the harness 41, the second connector 32, and the first connector 24.

図24の状態における第1のコネクタ24と第2のコネクタ32との関係を図25に示す。図25では、第2のコネクタ32に設けた可動レバー32aの一端のロック爪32bが第1のコネクタ24のロック部34hに係合することで、第1のコネクタ24と第2のコネクタ32とを嵌合状態でロックしている。レバー32aの他端に外力Fを加えることで、ロック爪32bをロック部34hから外して第1のコネクタ24と第2のコネクタ32とのロックを容易に解放することができる。   The relationship between the first connector 24 and the second connector 32 in the state of FIG. 24 is shown in FIG. In FIG. 25, the lock claw 32 b at one end of the movable lever 32 a provided on the second connector 32 is engaged with the lock portion 34 h of the first connector 24, so that the first connector 24 and the second connector 32 are Is locked in the mated state. By applying an external force F to the other end of the lever 32a, the lock claw 32b can be removed from the lock portion 34h, and the lock between the first connector 24 and the second connector 32 can be easily released.

次に、図19と共に図26〜図30を参照して、第2の実施形態に係るバックライトアセンブリにおける第1のコネクタ24について説明を補足する。なお、図10〜図12に示した第1のコネクタと同様な部分については同じ参照符号を付して説明を省略する。   Next, the first connector 24 in the backlight assembly according to the second embodiment will be supplemented with reference to FIGS. 26 to 30 together with FIG. Note that portions similar to those of the first connector illustrated in FIGS. 10 to 12 are denoted by the same reference numerals, and description thereof is omitted.

図26と共に図27を参照すると、第1のコネクタ24の第1のハウジング34は、ロック部34hとは反対側の端部に、フランジ34fの途切れ部34jに対応して弾性部34kを有している。弾性部34kは、図28に示すように、フランジ34fと協働して第1のコネクタ24をシャーシ3に対し拘束若しくは固定する部分である。即ち、フランジ34fと弾性部34kとは合せて、シャーシ係合部として働く。   Referring to FIG. 27 together with FIG. 26, the first housing 34 of the first connector 24 has an elastic portion 34k corresponding to the cut-off portion 34j of the flange 34f at the end opposite to the lock portion 34h. ing. As shown in FIG. 28, the elastic portion 34k is a portion that restrains or fixes the first connector 24 to the chassis 3 in cooperation with the flange 34f. That is, the flange 34f and the elastic portion 34k together serve as a chassis engaging portion.

図26と共に図29を参照すると、第1のハウジング34とこれに組み込まれた第1のコンタクト35との関係が明瞭に示されている。   Referring to FIG. 29 together with FIG. 26, the relationship between the first housing 34 and the first contact 35 incorporated therein is clearly shown.

第1のハウジング34は、薄い板状に形成された導電体よりなる第1のコンタクト35をそれぞれ圧入された4つのコンタクト受け穴44を有している。各コンタクト受け穴44は、第1のコンタクト35と同様に薄いスリット状に形成されているが、その一部にのみ幅広部44aを形成されている。幅広部44aは、第1のハウジング34をプラスチック成形する際に、コンタクト受け穴44の形成を容易にするであろう。   The first housing 34 has four contact receiving holes 44 into which first contacts 35 made of a thin plate-like conductor are press-fitted. Each contact receiving hole 44 is formed in a thin slit shape like the first contact 35, but a wide portion 44a is formed only in a part thereof. The wide portion 44a will facilitate the formation of the contact receiving hole 44 when the first housing 34 is plastic molded.

また第1のハウジング34には、図29における右端に、第1のコンタクト35の押圧を可能にする切欠き部45が形成され、また図29の左端に、第1のコンタクト35の検査や確認を可能にする穴部46が形成されている。   Further, the first housing 34 is formed with a notch 45 that allows the first contact 35 to be pressed at the right end in FIG. 29, and the first contact 35 is inspected and confirmed at the left end in FIG. 29. A hole 46 is formed to enable the above.

第1のコンタクト35は、第1のハウジング34に圧入固定された固定部(係合部)51、固定部51から一側に突出したピン部(接触部)52、固定部51から他側に蛇行しつつ延在したスプリング部53、スプリング部53の延在端に一体形成され、スプリング部53によってプリロードを付与されて第1ハウジング34の当接面54に当接した当接部55、及び当接部55からのびて第1ハウジング34のガイド穴56に挿通された可動部57を有している。当接部55の端部は円弧形状のR部58により丸く形成されている。また可動部57には、接点61と斜面部62とストレート部63とが形成されている。ピン部52には、前述した第2のコネクタ32が電気的に接続される。ここで、スプリング53、当接部55、可動部57、R部58、接点61、斜面部62、及びストレート部63は、合せてバネ部として働く。   The first contact 35 includes a fixed portion (engagement portion) 51 that is press-fitted and fixed to the first housing 34, a pin portion (contact portion) 52 that protrudes from the fixed portion 51 to one side, and the fixed portion 51 to the other side. A spring portion 53 that extends while meandering, a contact portion 55 that is integrally formed with the extended end of the spring portion 53, is preloaded by the spring portion 53 and contacts the contact surface 54 of the first housing 34, and The movable portion 57 extends from the contact portion 55 and is inserted into the guide hole 56 of the first housing 34. The end portion of the contact portion 55 is rounded by an arc-shaped R portion 58. Further, the movable portion 57 is formed with a contact 61, a slope portion 62, and a straight portion 63. The second connector 32 described above is electrically connected to the pin portion 52. Here, the spring 53, the contact portion 55, the movable portion 57, the R portion 58, the contact point 61, the slope portion 62, and the straight portion 63 work together as a spring portion.

なお、図19に示す第2のコンタクト38については、図14の第2のコンタクトと同様な機能をもつ部分に同じ参照符号を付して説明を省略する。   For the second contact 38 shown in FIG. 19, the same reference numerals are given to portions having the same functions as those of the second contact in FIG.

図30に示すように、発光素子基板26の基板凸部26aが第1ハウジング34の基板挿入口34aに挿入されると、基板凸部26aにより斜面部62が押されることにより可動部57がスプリング部53に逆らって退行し、接点61が基板凸部26aの接触部26cに接触する。   As shown in FIG. 30, when the substrate convex portion 26a of the light emitting element substrate 26 is inserted into the substrate insertion port 34a of the first housing 34, the inclined portion 62 is pushed by the substrate convex portion 26a, whereby the movable portion 57 is spring-loaded. Retreating against the portion 53, the contact 61 contacts the contact portion 26c of the substrate convex portion 26a.

可動部57が退行した状態でも、ストレート部63の少なくとも一部がガイド穴56に挿入されているように設計されている。これにより、ストレート部63の傾きを防止して、スプリング部53の座屈変形を阻止することができる。   Even when the movable portion 57 is retracted, at least a part of the straight portion 63 is designed to be inserted into the guide hole 56. Thereby, the inclination of the straight part 63 can be prevented and the buckling deformation of the spring part 53 can be prevented.

さらに、当接部55の端部がR部58により丸く形成されているので、たとえストレート部63が少し傾いたとしても、当接部55の端部がコンタクト受け穴44の内壁に係合して動作不良を引き起こすことも防止される。   Further, since the end portion of the contact portion 55 is rounded by the R portion 58, the end portion of the contact portion 55 engages with the inner wall of the contact receiving hole 44 even if the straight portion 63 is slightly inclined. This also prevents malfunctions.

また、第1のコネクタ24の高さ寸法hを比較的小さくすることができるので、バックライトアセンブリ及びそれを用いた表示装置の全体寸法の低減が容易である。   Moreover, since the height dimension h of the first connector 24 can be made relatively small, it is easy to reduce the overall dimensions of the backlight assembly and the display device using the backlight assembly.

上記第1及び第2の実施形態の各々には、次に例示するような様々な変形が可能である。   Each of the first and second embodiments can be variously modified as exemplified below.

シャーシ3の一辺にのみ発光素子基板26を設けた場合を図示しているが、必ずしも一辺にのみ設けた場合には限定されず、発光素子基板26をシャーシ3の複数辺に設けてもよい。   Although the case where the light emitting element substrate 26 is provided only on one side of the chassis 3 is illustrated, the present invention is not necessarily limited to the case where it is provided only on one side, and the light emitting element substrate 26 may be provided on a plurality of sides of the chassis 3.

第1のハウジング34のシャーシ突き当て面34cは、シャーシ3に対し、第1のハウジング34に備えたシャーシ係合爪34dにより位置決めされているが、シャーシ3に固定の発光素子基板26により位置決めされてもよい。後者の場合には、第1のハウジング34にシャーシ係合爪34dを備える必要なく第1のハウジング34を拘束することができる。なお、いずれの場合にも、シャーシ突き当て面34cがシャーシ3に係合するシャーシ係合部として働く。   The chassis abutting surface 34 c of the first housing 34 is positioned with respect to the chassis 3 by the chassis engaging claws 34 d provided in the first housing 34, but is positioned by the light emitting element substrate 26 fixed to the chassis 3. May be. In the latter case, the first housing 34 can be restrained without the need for providing the first housing 34 with the chassis engaging claws 34d. In either case, the chassis abutting surface 34 c functions as a chassis engaging portion that engages with the chassis 3.

第1のハウジング34は、シャーシ3に拘束若しくは固定される代わりに、例えば放熱板(ヒートシンク)のような他の部材に拘束若しくは固定されてもよい。   Instead of being restrained or fixed to the chassis 3, the first housing 34 may be restricted or fixed to another member such as a heat radiating plate (heat sink).

なお、本発明は上記実施形態に限られることはなく、またその一部又は全部は以下の付記のようにも記載され得るがそれらには限られない。   In addition, this invention is not limited to the said embodiment, The one part or all part can also be described like the following additional remarks, but it is not restricted to them.

(付記1)
シャーシと、前記シャーシの前面に配置され、発光素子が実装された発光素子基板と、前記シャーシの後面に配置され、前記発光素子基板に電力を供給する電源供給基板と、前記シャーシに保持され、前記発光素子基板が嵌合接続された第1のコネクタと、前記電源供給基板に実装されかつ前記第1のコネクタに嵌合接続された第2のコネクタとを含み、前記電源供給基板から前記発光素子基板に前記第1のコネクタ及び前記第2のコネクタを介して電力を供給することを特徴とするバックライトアセンブリ。
(Appendix 1)
A chassis, a light emitting element substrate disposed on the front surface of the chassis and mounted with a light emitting element, a power supply board disposed on the rear surface of the chassis and supplying power to the light emitting element substrate, and held by the chassis; A first connector to which the light emitting element substrate is fitted and connected; and a second connector which is mounted on the power supply substrate and is connected to the first connector, the light emission from the power supply substrate. A backlight assembly, wherein power is supplied to the element substrate via the first connector and the second connector.

(付記2)
シャーシと、前記シャーシの前面に配置され、発光素子が実装された発光素子基板と、前記シャーシの後面に配置され、前記発光素子基板に電力を供給する電源供給基板と、前記シャーシに保持され、前記発光素子基板が嵌合接続された第1のコネクタと、前記電源供給基板にハーネスを介して接続されかつ前記第1のコネクタに嵌合接続された第2のコネクタとを含み、前記電源供給基板から前記発光素子基板に前記第1のコネクタ及び前記第2のコネクタを介して電力を供給することを特徴とするバックライトアセンブリ。
(Appendix 2)
A chassis, a light emitting element substrate disposed on the front surface of the chassis and mounted with a light emitting element, a power supply board disposed on the rear surface of the chassis and supplying power to the light emitting element substrate, and held by the chassis; A first connector to which the light emitting element substrate is fitted and connected; and a second connector which is connected to the power supply substrate via a harness and is fitted and connected to the first connector. A backlight assembly, wherein power is supplied from a substrate to the light emitting element substrate via the first connector and the second connector.

(付記3)
前記第1のコネクタは、前記シャーシを貫通した絶縁性の第1のハウジングと、前記第1のハウジングに保持された導電性の第1のコンタクトとを含む、付記1又は2に記載のバックライトアセンブリ。
(Appendix 3)
The backlight according to claim 1 or 2, wherein the first connector includes an insulative first housing penetrating the chassis and a conductive first contact held by the first housing. assembly.

(付記4)
前記第1のコンタクトは、前記第1のハウジングに係合した係合部と、前記係合部の一側に設けた、前記発光素子基板と接触するバネ部と、前記係合部の反対側に設けた、前記第2のコネクタと接触する接触部とを有する、付記3に記載のバックライトアセンブリ。
(Appendix 4)
The first contact includes an engaging portion engaged with the first housing, a spring portion provided on one side of the engaging portion and contacting the light emitting element substrate, and an opposite side of the engaging portion. The backlight assembly according to appendix 3, further comprising: a contact portion that is provided on the second connector and contacts the second connector.

(付記5)
前記第1のハウジングは、前記発光素子基板を挿入する挿入口と、前記シャーシに係合するシャーシ係合部とを有する、付記3又は4に記載のバックライトアセンブリ。
(Appendix 5)
5. The backlight assembly according to appendix 3 or 4, wherein the first housing includes an insertion port into which the light emitting element substrate is inserted and a chassis engagement portion that engages with the chassis.

(付記6)
前記第2のコネクタは、絶縁性の第2のハウジングと、前記第2のハウジングに保持された導電性の第2のコンタクトと、前記第2のハウジングに固定されたホールドダウンとを含み、前記ホールドダウンは前記電源供給基板に半田付け固定された、付記1、3、4、及び5のいずれか一項に記載のバックライトアセンブリ。
(Appendix 6)
The second connector includes an insulating second housing, a conductive second contact held by the second housing, and a holddown fixed to the second housing, The backlight assembly according to any one of appendices 1, 3, 4, and 5, wherein the hold down is fixed to the power supply board by soldering.

(付記7)
前記第2のコンタクトは、前記第2のハウジングに係合する係合部と、前記第1のコンタクトの接触部に接触するためのバネ部とを有する、付記1〜6のいずれか一項に記載のバックライトアセンブリ。
(Appendix 7)
The said 2nd contact has an engaging part engaged with the said 2nd housing, and the spring part for contacting the contact part of the said 1st contact, It is any one of the appendixes 1-6. The backlight assembly as described.

(付記8)
付記1〜7のいずれか一項に記載のバックライトアセンブリと、前記シャーシの前面側に配置された光学系とを含むことを特徴とするバックライトユニット。
(Appendix 8)
A backlight unit comprising: the backlight assembly according to any one of appendices 1 to 7; and an optical system disposed on a front side of the chassis.

(付記9)
前記光学系は、前記シャーシの前面に順次積層された、反射シート、導光板、拡散シート、プリズムシート、及び集光シートを含む、付記8に記載のバックライトユニット。
(Appendix 9)
The backlight unit according to appendix 8, wherein the optical system includes a reflection sheet, a light guide plate, a diffusion sheet, a prism sheet, and a light collection sheet, which are sequentially stacked on the front surface of the chassis.

(付記10)
付記8又は9に記載のバックライトユニットと、液晶表示部とを含み、前記前記光学系は前記バックライトアセンブリと前記液晶表示部との間に配置されていることを特徴とする液晶表示装置。
(Appendix 10)
A liquid crystal display device comprising the backlight unit according to appendix 8 or 9 and a liquid crystal display unit, wherein the optical system is disposed between the backlight assembly and the liquid crystal display unit.

(付記11)
前記バックライトユニット及び前記液晶表示部を搭載したフレームを含む、付記10に記載の液晶表示装置。
(Appendix 11)
The liquid crystal display device according to appendix 10, including a frame on which the backlight unit and the liquid crystal display unit are mounted.

本発明は、テレビジョン受信機の液晶モニタなどの液晶表示装置に利用可能である。   The present invention is applicable to a liquid crystal display device such as a liquid crystal monitor of a television receiver.

100 液晶表示装置
200 バックライトユニット
300 液晶表示部
1 バックライトアセンブリ
3 シャーシ
3a 主板部
3b 枠板部
3c 凹部
3d シャーシ穴部
5 反射シート
7 導光板
9 拡散シート
11 プリズムシート
13 集光シート
15 フレーム
24 第1のコネクタ
25 発光素子
26 発光素子基板
26a 基板凸部
26b ネジ止め穴
26c 接触部
27 放熱用部材
27a 裏打ち部
27b 放熱部
27c 凸部挿入口
28 発光部品
31 電源供給基板
31a 嵌合用開口
32 第2のコネクタ
32a 可動レバー
32b ロック爪
34 第1のハウジング
34a 基板挿入口(挿入口)
34b 挿入誘い部
34c シャーシ突き当て面
34d シャーシ係合爪
34e コネクタ突き当て面
34f フランジ
34g コネクタ挿入口
34h ロック部
34j 途切れ部
34k 弾性部
35 第1のコンタクト
35a 圧入部(係合部)
35b 圧入部
35c バネ部
35d コネクタ接触部(接触部)
35e 基板接触部
35f 煽り防止部
37 第2のハウジング
37a 嵌合用凹部
37b 誘い受け部
38 第2のコンタクト
38a 係合部
38b バネ部
38c 端子部
38d コネクタ接触部
38e 煽り防止部
39 ホールドダウン
39a 圧入部
39b 実装時浮き防止部
39c 基板半田付け部
41 ハーネス
42 第3のコネクタ
43 第4のコネクタ
44 コンタクト受け穴
44a 幅広部
51 固定部(係合部)
52 ピン部(接触部)
53 スプリング部
54 当接面
55 当接部
56 ガイド穴
57 可動部
58 R部
61 接点
62 斜面部
63 ストレート部
103 シャーシ
103b 枠
123a〜123c 発光素子基板
131 発光素子
133 発光素子コネクタ
143 発光素子側コネクタ
231 ゴム栓
231a 小穴
233 ハーネス
234 穴
235 電源供給基板コネクタ
237 電源供給基板
DESCRIPTION OF SYMBOLS 100 Liquid crystal display device 200 Backlight unit 300 Liquid crystal display part 1 Backlight assembly 3 Chassis 3a Main board part 3b Frame board part 3c Recessed part 3d Chassis hole part 5 Reflection sheet 7 Light guide plate 9 Diffusion sheet 11 Prism sheet 13 Condensing sheet 15 Frame 24 First connector 25 Light emitting element 26 Light emitting element substrate 26a Substrate convex portion 26b Screw hole 26c Contact portion 27 Heat radiating member 27a Backing portion 27b Heat radiating portion 27c Protruding portion insertion port 28 Light emitting component 31 Power supply substrate 31a Fitting opening 32 2 connector 32a movable lever 32b lock claw 34 first housing 34a board insertion slot (insertion slot)
34b Insertion-inducing portion 34c Chassis abutting surface 34d Chassis engaging claw 34e Connector abutting surface 34f Flange 34g Connector insertion port 34h Locking portion 34j Breaking portion 34k Elastic portion 35 First contact 35a Press-fit portion (engaging portion)
35b Press-fit part 35c Spring part 35d Connector contact part (contact part)
35e Substrate contact portion 35f Warpage prevention portion 37 Second housing 37a Recess for fitting 37b Guide receiving portion 38 Second contact 38a Engagement portion 38b Spring portion 38c Terminal portion 38d Connector contact portion 38e Warpage prevention portion 39 Hold down 39a Press fit portion 39b Floating prevention portion 39c mounting soldering portion 41 harness 42 third connector 43 fourth connector 44 contact receiving hole 44a wide portion 51 fixing portion (engaging portion)
52 Pin part (contact part)
53 Spring part 54 Contact surface 55 Contact part 56 Guide hole 57 Movable part 58 R part 61 Contact 62 Slope part 63 Straight part 103 Chassis 103b Frame 123a-123c Light emitting element substrate 131 Light emitting element 133 Light emitting element connector 143 Light emitting element side connector 231 Rubber plug 231a Small hole 233 Harness 234 Hole 235 Power supply board connector 237 Power supply board

Claims (11)

シャーシと、前記シャーシの前面に配置され、発光素子が実装された発光素子基板と、前記シャーシの後面に配置され、前記発光素子基板に電力を供給する電源供給基板と、前記シャーシに保持され、前記発光素子基板が嵌合接続された第1のコネクタと、前記電源供給基板に実装されかつ前記第1のコネクタに嵌合接続された第2のコネクタとを含み、前記電源供給基板から前記発光素子基板に前記第1のコネクタ及び前記第2のコネクタを介して電力を供給することを特徴とするバックライトアセンブリ。   A chassis, a light emitting element substrate disposed on the front surface of the chassis and mounted with a light emitting element, a power supply board disposed on the rear surface of the chassis and supplying power to the light emitting element substrate, and held by the chassis; A first connector to which the light emitting element substrate is fitted and connected; and a second connector which is mounted on the power supply substrate and is connected to the first connector, the light emission from the power supply substrate. A backlight assembly, wherein power is supplied to the element substrate via the first connector and the second connector. シャーシと、前記シャーシの前面に配置され、発光素子が実装された発光素子基板と、前記シャーシの後面に配置され、前記発光素子基板に電力を供給する電源供給基板と、前記シャーシに保持され、前記発光素子基板が嵌合接続された第1のコネクタと、前記電源供給基板にハーネスを介して接続されかつ前記第1のコネクタに嵌合接続された第2のコネクタとを含み、前記電源供給基板から前記発光素子基板に前記第1のコネクタ及び前記第2のコネクタを介して電力を供給することを特徴とするバックライトアセンブリ。   A chassis, a light emitting element substrate disposed on the front surface of the chassis and mounted with a light emitting element, a power supply board disposed on the rear surface of the chassis and supplying power to the light emitting element substrate, and held by the chassis; A first connector to which the light emitting element substrate is fitted and connected; and a second connector which is connected to the power supply substrate via a harness and is fitted and connected to the first connector. A backlight assembly, wherein power is supplied from a substrate to the light emitting element substrate via the first connector and the second connector. 前記第1のコネクタは、前記シャーシを貫通した絶縁性の第1のハウジングと、前記第1のハウジングに保持された導電性の第1のコンタクトとを含む、請求項1又は2に記載のバックライトアセンブリ。   3. The back according to claim 1, wherein the first connector includes an insulating first housing that penetrates the chassis, and a conductive first contact that is held by the first housing. 4. Light assembly. 前記第1のコンタクトは、前記第1のハウジングに係合する係合部と、前記係合部の一側に設けた、前記発光素子基板と接触するバネ部と、前記係合部の反対側に設けた、前記第2のコネクタと接触する接触部とを有する、請求項3に記載のバックライトアセンブリ。   The first contact includes an engaging portion that engages with the first housing, a spring portion that is provided on one side of the engaging portion and that contacts the light emitting element substrate, and is opposite to the engaging portion. The backlight assembly according to claim 3, further comprising: a contact portion that is provided on the second connector and contacts the second connector. 前記第1のハウジングは、前記発光素子基板を挿入する挿入口と、前記シャーシに係合するシャーシ係合部とを有する、請求項3又は4に記載のバックライトアセンブリ。   5. The backlight assembly according to claim 3, wherein the first housing has an insertion port into which the light emitting element substrate is inserted, and a chassis engaging portion that engages with the chassis. 前記第2のコネクタは、絶縁性の第2のハウジングと、前記第2のハウジングに保持された導電性の第2のコンタクトと、前記第2のハウジングに固定されたホールドダウンとを含み、前記ホールドダウンは前記電源供給基板に半田付け固定された、請求項1、3、4、及び5のいずれか一項に記載のバックライトアセンブリ。   The second connector includes an insulating second housing, a conductive second contact held by the second housing, and a holddown fixed to the second housing, The backlight assembly according to claim 1, wherein the hold-down is soldered and fixed to the power supply substrate. 前記第2のコンタクトは、前記第2のハウジングに係合する係合部と、前記第1のコンタクトの接触部に接触するためのバネ部とを有する、請求項1〜6のいずれか一項に記載のバックライトアセンブリ。   The said 2nd contact has an engaging part engaged with the said 2nd housing, and a spring part for contacting the contact part of the said 1st contact, The any one of Claims 1-6. The backlight assembly described in. 請求項1〜7のいずれか一項に記載のバックライトアセンブリと、前記シャーシの前面側に配置された光学系とを含むことを特徴とするバックライトユニット。   A backlight unit comprising: the backlight assembly according to claim 1; and an optical system disposed on a front side of the chassis. 前記光学系は、前記シャーシの前面に順次積層された、反射シート、導光板、拡散シート、プリズムシート、及び集光シートを含む、請求項8に記載のバックライトユニット。   The backlight unit according to claim 8, wherein the optical system includes a reflection sheet, a light guide plate, a diffusion sheet, a prism sheet, and a light collection sheet, which are sequentially stacked on the front surface of the chassis. 請求項8又は9に記載のバックライトユニットと、液晶表示部とを含み、前記前記光学系は前記バックライトアセンブリと前記液晶表示部との間に配置されていることを特徴とする液晶表示装置。   10. A liquid crystal display device comprising the backlight unit according to claim 8 and a liquid crystal display unit, wherein the optical system is disposed between the backlight assembly and the liquid crystal display unit. . 前記バックライトユニット及び前記液晶表示部を搭載したフレームを含む、請求項10に記載の液晶表示装置。   The liquid crystal display device according to claim 10, comprising a frame on which the backlight unit and the liquid crystal display unit are mounted.
JP2010283082A 2010-06-25 2010-12-20 Backlight assembly, backlight unit, and liquid crystal display device Active JP5100823B2 (en)

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JP2010283082A JP5100823B2 (en) 2010-06-25 2010-12-20 Backlight assembly, backlight unit, and liquid crystal display device
US13/065,391 US8730430B2 (en) 2010-06-25 2011-03-21 Backlight assembly for supplying electric power to a light-emitting element via a connector and a backlight unit and a liquid crystal display which use the backlight assembly
KR1020110038936A KR101255436B1 (en) 2010-06-25 2011-04-26 Backlight assembly for supplying electric power to a light-emitting element via a connector, and a backlight unit and a liquid crystal display which use the backlight assembly
TW100116606A TWI474083B (en) 2010-06-25 2011-05-12 Backlight assembly for supplying electric power to a light-emitting element via a connector, and a backlight unit and a liquid crystal display which use the backlight assembly
CN201110150770.0A CN102313202B (en) 2010-06-25 2011-06-07 Backlight assembly, backlight unit, and liquid crystal display
KR1020120120020A KR101323432B1 (en) 2010-06-25 2012-10-26 Backlight assembly for supplying electric power to a light-emitting element via a connector, and a backlight unit and a liquid crystal display which use the backlight assembly

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012226901A (en) * 2011-04-18 2012-11-15 Minebea Co Ltd Spread illumination apparatus

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101842248B1 (en) * 2011-08-08 2018-03-27 삼성디스플레이 주식회사 Display device and led bar connection method thereof
US20150103258A1 (en) * 2012-07-03 2015-04-16 Sharp Kabushiki Kaisha Lighting device, display device and television device
CN104061492A (en) * 2014-05-23 2014-09-24 京东方科技集团股份有限公司 Light bar, backlight and display device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61171177A (en) * 1985-01-25 1986-08-01 Stanley Electric Co Ltd Led light source
JP2002216874A (en) * 2001-01-18 2002-08-02 Japan Aviation Electronics Industry Ltd Connector
JP2006227076A (en) * 2005-02-15 2006-08-31 Denso Corp Display device
JP2009037922A (en) * 2007-08-02 2009-02-19 Jst Mfg Co Ltd Backlight device and its manufacturing method
JP2009210848A (en) * 2008-03-05 2009-09-17 Mitsubishi Electric Corp Lcd module, liquid crystal display, and manufacturing method of liquid crystal display

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI292961B (en) 2002-09-05 2008-01-21 Nichia Corp Semiconductor device and an optical device using the semiconductor device
JP2006038988A (en) 2004-07-23 2006-02-09 Seiko Epson Corp Electrooptical apparatus, electronic device and mounting structural body
KR20060131148A (en) * 2005-06-15 2006-12-20 박영철 Manufacturing method of suit
KR20080012693A (en) 2006-08-04 2008-02-12 삼성전자주식회사 Backlight assembly comprising integrated lamp socket
KR101410496B1 (en) * 2007-11-08 2014-06-20 삼성디스플레이 주식회사 Light source module, back light assembly having the light source module and display apparatus having the back light assembly
KR101519331B1 (en) 2008-02-18 2015-05-13 삼성디스플레이 주식회사 Backlight assembly and display device having same
KR101442006B1 (en) 2008-06-05 2014-09-19 삼성디스플레이 주식회사 Back light assembly and display apparatus having the back light assembly
TWM365433U (en) * 2009-02-25 2009-09-21 Wai Chi Electronics Ltd Light emitting diode (LED) illumination light source
TWM372021U (en) * 2009-07-13 2010-01-01 P Two Ind Inc The conductive terminal
CN101640338B (en) 2009-08-28 2011-06-15 友达光电(苏州)有限公司 Connector as well as backlight source and display device comprising same
KR101612469B1 (en) * 2009-09-23 2016-04-15 삼성디스플레이 주식회사 Method for driving light source and display apparatus for performing the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61171177A (en) * 1985-01-25 1986-08-01 Stanley Electric Co Ltd Led light source
JP2002216874A (en) * 2001-01-18 2002-08-02 Japan Aviation Electronics Industry Ltd Connector
JP2006227076A (en) * 2005-02-15 2006-08-31 Denso Corp Display device
JP2009037922A (en) * 2007-08-02 2009-02-19 Jst Mfg Co Ltd Backlight device and its manufacturing method
JP2009210848A (en) * 2008-03-05 2009-09-17 Mitsubishi Electric Corp Lcd module, liquid crystal display, and manufacturing method of liquid crystal display

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012226901A (en) * 2011-04-18 2012-11-15 Minebea Co Ltd Spread illumination apparatus

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