TWM365433U - Light emitting diode (LED) illumination light source - Google Patents

Light emitting diode (LED) illumination light source Download PDF

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Publication number
TWM365433U
TWM365433U TW98202826U TW98202826U TWM365433U TW M365433 U TWM365433 U TW M365433U TW 98202826 U TW98202826 U TW 98202826U TW 98202826 U TW98202826 U TW 98202826U TW M365433 U TWM365433 U TW M365433U
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TW
Taiwan
Prior art keywords
led
illumination source
circuit board
component
electrical
Prior art date
Application number
TW98202826U
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Chinese (zh)
Inventor
Chi-To Yiu
ze-pei Zhang
gao-jin Peng
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Wai Chi Electronics Ltd
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Publication date
Application filed by Wai Chi Electronics Ltd filed Critical Wai Chi Electronics Ltd
Priority to TW98202826U priority Critical patent/TWM365433U/en
Publication of TWM365433U publication Critical patent/TWM365433U/en

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  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)

Description

M365433 五、新型說明: ' 【新型所屬之技術領域】 - 本創作涉及發光二極體(led)照明光源及其製造方法,更 具體地說,涉及-種減有膠殼的印刷電路板,在該膠殼上直接 安裝LED晶片。 ' 【先前技術】 ‘ 隨著科技的發展’發光二減(咖)_光源的使用越來 泰越廣泛,辦公室、商場、家居、路燈、交魏處可見它的身 影’但這些LED照明光源都是將LED封裝成獨立的表面黏著型 (SMD)或支_ LED封裝包,再通過_電路板將這些獨立的 LED封裝喊接起來。紐咖酬光畴在著生紅藝複雜、 生產成本n、散熱難等缺點,這些不良因素直接影響到這些哪 照明光源的應用。 上述背景技術的觀是理解糊作所公開的led照明光 # 職方法,但並不構成該咖照明統及方法的在先技術,也不 作為本創作侧要求專概的參考檔。 、 【新型内容】 冓&種照明光源’其包括一個或多個發光二極體⑽D) 曰月光、原p件’每酬述部件包括印刷電路板、膠殼和多個LED ^ ^ 卩刷電路板的—側面上設置有多對電接頭;通過注 換勝双^體成型在所述印刷電路板的所述一側面;每個咖晶 片”對%接碩電連接,且LED晶片在所述谬殼中露出。 M365433 在一實施例t,所述膠殼是覆膜面板,其具有多個小孔以定 義出多個用於谷納所述LED晶片的空穴,通過每個小孔露出一對 電接頭。使用透光密封材料填充在每個空穴中,以封裝每個空穴 中的LED晶片。每個空穴具有向外分又形成截錐形的側壁,以助 於發射LED光。在橫截面上,該向外分叉的側壁的夾角相對於所 述印刷電路板的所述一側面的表面可為〇。〜丨8〇。的任意角度。 在另一實施例中,所述膠殼為一覆膜面板,其上具有一大孔, 印刷電路板上的電接頭對通過該大孔露出。 每個LED晶#的第-和第二電卿分猶制減的電接頭 對的第-和第二電接頭。所述第—電卿通過連接幫線連接到第 -電接頭。所述第二電觸頭通過雛導電材料連制所述第二電 接頭。 所述印刷電路板上設置有多個微孔,以用於在注模過程中, 導入所述膠殼的造模材料。 所述照明光源可包括一個或多個連接器,用於當具有兩個或 多個_照明光源部件時,以尾尾相連的構造形式,將LED昭 明光源部件連接在一起。 所述3明光源可包括外殼,驗容納led照明賴、部件和一 對電極堵碩,兩個電極堵頭分·定安裝在所述外殼的兩端。 【實施方式] 下面〜?、本創作所公開的led照明光源及製造方法的一優選 實施例如下姆該實施例的例子進行了詳細描述。為了清楚起見, M365433 儘S有些特點和細節對相關領域的技術人員是顯而易見的,且 對轉該led卿光源及製造方法也不是制重要的,如下仍然 對本創作所公開的LED照明光源及製造方法的示範性實施例進行 了詳細描述。 進一步地,可以理解的本創作所公開的LED照明光源及製造 方法並不限於如下所描述的蚊實施例,本躺的技術人員可以 理解的各_化和㈣’均未赫本鑛糊要賴翻。例如 • 在不脫離本創作權利要求所公開的範圍的情況下,不同的示範性 實施例的元件和/或特定可相互組合和/或互相替換。 對於本創作的綱書和翻要求巾,當提及―個元件“連接” I另個元件’其並不是指一個元件綁定、固定或以別的方式連 接到另一個元件’而詞語“連接,,是指-個元件直接或間接地連接 J另個元件,或者機械和/或電連接到另一個元件。 圖1 (〇是根據本創作一實施例的LED照明光源部件的整體 • 結構示意圖,其中相關數位表示對應的部件。 led照明光源部件包括印刷電路板(pcB)丨、集成在 一側面的勝殼2、膠殼2上的多個小孔3、設置在每一個小孔3中 的LED晶片4,以及用於將LED晶片4電連接到PCB1上的連接 幫線5。 B1 了以疋剛性或柔性的基板或印刷板。PCB1可以是圖2 (a)所不的矩形,或者是別的形狀例如圓形或多邊形。PCB1可 以由絕緣材料製成。優選的,印刷板可以由導電金屬材料製成, M365433 其有助於散發LED晶片產生的熱量。電子線路6可設置在pcBi - 基板或印刷板的一側面。該電子線路6包括用於與LED晶片電連 - 接的多對電接頭。 如圖1 (a)所示的實施例,膠殼2可以是覆膜面板,其上設 置有多個方形小孔3。通過每一個小孔3可設置在pcB1 一側面的 ' 一對電接頭7露出。多個小孔3可以是分別用於容納多個led晶 ‘片的多個空穴。基於最終照明光源的設計形式,多個小孔3可以 _ 任意模式排列。如圖示的實施例,多個小孔3可以排列成四行五 列的陣列。 膠殼2可以由白色的可模壓的塑膠材料製成’其具有高反射 率和高熱變形溫度。通過使用通常的注模機器,可將膠殼2注模 成型在PCB1的·一側面。 圖1 (b)是圖1 (a)所示的LED照明光源部件中空穴的放 大結構示意圖。LED晶片4可以設置在空穴中,並與PCB1上的 ,一對電接頭連接。根據圖2 (b)所示的實施例,在LED晶片4底 -部的第一電觸頭可通過粘性導電材料電連接到一對電接頭7的第 _ 一電接頭並固定其上’在LED晶片4頂部的第二電觸頭可通過連 接幫線5電連接到該對電接頭的第二電接頭。連接幫線5可以由 黃金或別的合適的材料製成。因為LED晶片4是直接設置在pcBi 上,所以其產生的熱量可以很容易地通過pCB1散發。 LED晶片4可以是低功率(每晶片小於0.1W)、或中等功率 晶片(每晶片在0·1〜〇.5W之間)、或高功率晶片(每晶片大於 M365433 0.5W)。LED晶>;4可以產生不同的顏色。為了滿足視覺效果, -LED照明光源部件可包括多個相同顏色的LED晶片4,或多個不 -_色的LED晶片4。LED晶片4發光的顏色幾乎函蓋了所有可 見光’其峰值波長λρ由430nm〜7〇〇nm及混和白光。LED晶片4 的發光效率>15Lm/w,具有很廣的適用溫度_4(rc〜7〇〇c。其工作 '壽命是目前白熾燈、螢光燈的數十倍,可多達10年之久。M365433 V. New description: ' 【New technology field】 - This work involves LED light source and its manufacturing method, more specifically, it relates to a printed circuit board with a plastic shell. The LED chip is directly mounted on the plastic case. '[Previous technology] 'With the development of technology, 'lighting two minus (coffee) _ the use of light sources is more and more widely, office, shopping malls, home, street lamps, intersections can be seen in its figure 'but these LED lighting sources are The LEDs are packaged into a separate surface mount type (SMD) or branch_LED package, which is then shunted by the board. Newca's rewards are in the shortcomings of complex red production, low production cost, and difficulty in heat dissipation. These adverse factors directly affect the application of these illumination sources. The above background art is an understanding of the disclosed LED lighting method, but does not constitute the prior art of the coffee lighting system and method, nor is it a reference file for the author's request. [New content] 冓 & lighting source 'which includes one or more light-emitting diodes (10) D) 曰 Moonlight, the original p-piece 'received parts including printed circuit board, plastic shell and multiple LED ^ ^ 卩 brush a plurality of pairs of electrical connectors are disposed on the side of the circuit board; the one side of the printed circuit board is formed by the injection molding; each of the coffee chips is electrically connected to the %, and the LED chip is in the M365433 In an embodiment t, the rubber shell is a coated panel having a plurality of small holes to define a plurality of holes for the LED wafers in the valley, through each small hole A pair of electrical contacts are exposed. Each of the holes is filled with a light-transmissive sealing material to encapsulate the LED chips in each cavity. Each cavity has a side wall that is outwardly divided to form a truncated cone to facilitate emission. LED light. In the cross section, the angle of the outwardly bifurcated sidewall may be any angle with respect to the surface of the one side of the printed circuit board. In another embodiment The plastic shell is a laminated panel having a large hole thereon, on a printed circuit board The electrical connector pair is exposed through the large hole. The first and second electrical connectors of each LED crystal # are the first and second electrical connectors of the electrical connector pair. The first electrician is connected by a connecting wire. To the first electrical connector, the second electrical contact is connected to the second electrical connector by a conductive material. The printed circuit board is provided with a plurality of micro holes for being used in the injection molding process. The molding material of the plastic shell. The illumination light source may include one or more connectors for connecting the LED light source components in a tail-to-tail configuration when there are two or more light source components. The three light sources may include a casing for accommodating the LED illumination, the component and the pair of electrodes, and the two electrode plugs are fixedly mounted at both ends of the casing. [Embodiment] The following ~? A preferred embodiment of the LED illumination source and manufacturing method disclosed in the present application is described in detail in the example of the embodiment. For the sake of clarity, some features and details of the M365433 will be apparent to those skilled in the relevant art. And turn to the led The source and manufacturing method are also not important, and the exemplary embodiments of the LED illumination source and manufacturing method disclosed in the present application are still described in detail as follows. Further, the LED illumination source and manufacturing method disclosed in the present invention can be understood. It is not limited to the mosquito embodiments described below, and it will be understood by those skilled in the art that the _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The elements and/or specifics of the different exemplary embodiments may be combined with each other and/or replaced with each other. For the script of the present invention and the request for the towel, when referring to "a component" "connected" I another component 'is not A component is bound, fixed, or otherwise connected to another component' and the term "connected" means that one component is directly or indirectly connected to another component, or mechanically and/or electrically connected to another component. . 1 is a schematic view of the overall structure of an LED illumination source component according to an embodiment of the present invention, wherein related digits indicate corresponding components. The led illumination source component includes a printed circuit board (PCB), and is integrated on one side. 2. A plurality of small holes 3 in the plastic case 2, LED chips 4 disposed in each of the small holes 3, and connecting wires 5 for electrically connecting the LED chips 4 to the PCB 1. B1 is rigid or a flexible substrate or a printed board. The PCB 1 may be a rectangle as shown in Fig. 2 (a), or another shape such as a circle or a polygon. The PCB 1 may be made of an insulating material. Preferably, the printed board may be made of a conductive metal material. M365433 helps to dissipate the heat generated by the LED chip. The electronic circuit 6 can be disposed on a side of the pcBi - substrate or printed board. The electronic circuit 6 includes a plurality of pairs of electrical contacts for electrically connecting to the LED chip. As shown in Fig. 1 (a), the plastic shell 2 may be a laminated panel on which a plurality of square small holes 3 are provided. Each of the small holes 3 may be provided with a pair of electrical connectors on one side of the pcB1. 7 exposed. Multiple small holes 3 can be used separately A plurality of holes accommodating a plurality of led crystals. Based on the design form of the final illumination source, the plurality of small holes 3 may be arranged in any mode. As in the illustrated embodiment, the plurality of small holes 3 may be arranged in four rows and five Array of columns. The shell 2 can be made of a white moldable plastic material. It has high reflectivity and high heat distortion temperature. The shell 2 can be injection molded on the PCB 1 by using a conventional injection molding machine. Figure 1 (b) is an enlarged schematic view of the holes in the LED illumination source component shown in Figure 1 (a). The LED chip 4 can be placed in the cavity and connected to a pair of electrical connectors on the PCB 1. In the embodiment shown in Fig. 2(b), the first electrical contact at the bottom portion of the LED wafer 4 can be electrically connected to the first electrical connector of the pair of electrical contacts 7 via a viscous conductive material and fixed thereon. The second electrical contact on the top of the wafer 4 can be electrically connected to the second electrical connector of the pair of electrical contacts by a connecting wire 5. The connecting wire 5 can be made of gold or another suitable material because the LED chip 4 is directly Set on pcBi, so the heat it generates can easily pass pCB1 The LED chip 4 can be low power (less than 0.1W per wafer), or medium power wafer (between 0·1~〇.5W per wafer), or high power wafer (greater than M365433 0.5W per wafer). The crystals can produce different colors. In order to satisfy the visual effect, the LED illumination source component can include a plurality of LED wafers 4 of the same color, or a plurality of LED wafers 4 of non--color. The color of the LED wafer 4 is illuminated. Almost all of the visible light's peak wavelength λρ is from 430 nm to 7 〇〇 nm and the white light is mixed. The luminous efficiency of the LED chip 4 is 15 Lm/w, and has a wide application temperature of _4 (rc~7〇〇c). Its work 'life is dozens of times the current incandescent, fluorescent, up to 10 years.

' ® 1 (c)是圖1 (a)所示的led照明光源部件中空穴沿A_A 方向的&截面圖’每-個空穴具有向外分叉並大致形成截錐形的 側壁’以利於LED晶片4的光發射和反射。在橫截面上,該向外 分叉的侧壁的失角相對於PCB1的上表面可為〇。〜18〇。的任意角 度。 如下參考圖3〜5,對LED照明光源部件的製造方法進行了描 述。圖3示出膠殼2通過注模整體成型在印刷電路板!上。在pcBi 上设置有多對電接頭7。膠殼2可以是-面板並覆蓋在pCB1的一 側面。該覆膜面板具有—陣列的小孔3,W定義出一陣列的空穴。 在PCB1上,通過每個小孔3露出一對電接頭7。圖4示出咖 晶片4設置在空穴中,並通過連接幫線5連接到電接頭7。 圖5示出設置在空穴内的封膠9,其用於封裝LED晶片。封 膠9用於枯合連接幫線5,並避免LED晶片受到例如灰塵的污染。 封膠9可由可固化的環氧樹脂或任意的透光密封材料製成,以使 得LED晶片4發出的光可透射出。封膠可以是透明的或可包括黃 色的螢光顆粒,或任意顏色的螢光顆粒,以生成期望的顏色效果。 M365433 2 6是根據本創作另—實施_咖_光源部件的整體結 —構示意圖。在該實施例中,賴2,是僅具有一個大孔3,的矩縣 構通過π亥大孔3’可將pcBl’上的所有電接頭對露出。 圖7 U)〜7㈦示出LED照明光源部件的注模過程。圖7 ⑷示出將印刷板〗,,放置在下模17的空穴中的過程。圖7 •⑻示出將上模放置在下模上’並如箭頭18的方向,將造模材 •料注人模腔中的過程。圖7⑷示組模完成後,將整體成型部 件19從下模腔中移除的過程。 圖8 U)是示出LED照明光源部件的一實施例。在該實施例 中’膠殼2”為多個覆膜面板’每個覆膜面板上設置有多個小孔。 通過每個小孔3”露出PCB1,,上的一對電接頭7。多個小孔3,,定義 出多個空穴,以用於容納LED晶片。如圖7⑷〜⑷,通過注 模’可將多個膠殼2”設置在PCB1”上。如圖8㈦所示,咖晶 片4設置在空穴中並通過連接幫線5 ’與pcm,,連接。空穴中的封 膠9”用於密封LED晶》4。進-步地,可在pcm,,上設置多個微 -孔8” ’從而在注模過程中,將膠殼2”的造模材料導入,以便膠殼 .2”與PCB1”整體成型。 ” 圖9示出通過兩個連接器u將三個咖照明光源部件尾尾 相連。圖10示出使用圖9中的LED照明光源部件組裝成㈣昭 明光源。照贼源可包括—外殼12,其用於容納長條照明光源^ 和電源13。-對電極堵頭14分別固定在外殼12的兩端,接著組 裝成照明光管16。該_光管10可配合摘人哺統㈣光管支架 M365433 ㈣插座巾。與本創作所麵的LED觸絲她,傳統的螢光 S生命週触短以及產生的亮度較低,因此照明絲16可代替傳 - 統的螢光管。 本創作的LED照明光源可在戶内或戶外使用,以及可用作 LCD和廣告燈盒的背光。本創作的LED照明光源易於製造、製造 '成本低以及散熱能力強。 儘管在此公開,LED晶片4連制印刷電路板i 一側面上的 電接碩7對’但是本領域的技術人員可以理解的,LED晶片4可 以連接到印刷電路板1另一側面的電接頭對,從而印刷電路板ι 的兩側均可以發光。也可以理解的,也可以將兩塊印刷電路板i 者罪月組裝在一起以產生相同的效果。最後,可以理解的本創作 所公開的LED照明光源可以是任意的大小和形狀,並以任意可能 的方式連接在一起,從而獲得最終照明產品期望的結構、設計和 視覺效果。 儘管在此是以一些優選的實施例,對本創作所公開的led照 明光源和製造方法進行描述’在不脫離本創作的範圍内,可以進 行各種別的改變或變形。 【圖式簡單說明】 圖1 U)是根據本創作一實施例的LED照明光源部件的整體結構 示意圖; 圖1 (b)是圖1 (a)所示的LED照明光源部件中空穴的放大結 M365433 構不意圖; " 圖1 (c)是圖1 (a)所示的led昭明本、、/§加μ 1 ^ υ,、、、月先源部件中空穴沿Α-Α方 ' 向的橫戴面圖; 圖2(a)是圖1 (a)所示的led昭明忠、、j§ ait从 幻UiD照明先源部件的印刷電路板的整 體結構示意圖; .圖2⑻是圖2(a)所示的印刷電路板的電路的放大結構示意圖; .3是圖2⑷中印刷電路板上注塑膠殼的結構示意圖; •目4是印刷電路板膠殼一體化部件的空穴中裝設LED晶片的結構 示意圖; 圖5是空穴封上透光密封材料的結構示意圖; 圖6是根據本創作另一實施例的LED照明光源部件的整體結構示 意圖; 圖7⑷是將印刷電路板放置在模具下财的製造過程的示意圖; 圖7 (b)疋將上模放置在下模上麟秘材料從上觀入的製造 •過程的示意圖; 圖7 (c)是注模後將模塑產品移除的製造過程的示意圖; 圖8 (a)是製造根據本創作另一實施例的L]ED照明光源部件的示 意圖; 圖8 (b)是圖8 (a)所示的LED照明光源部件卡空穴的放大妗 構示意圖; 圖9是多個圖8 (a)所示的LED照明光源部件連接在一起的結構 示意圖; M365433 圖10是使用圖9所示的多個LED照明光源部件組裝成照明光源 的示意圖。 【主要元件符號說明】 2 :膠殼 4 : LED晶片 6:電子線路 9 :封膠 13 .電源 15 :照明光源 17 :下模 1” : PCB 3’ :大孔 8” :微孔 1 :印刷電路板(PCB) 3 :小孔 5 :連接幫線 7 :電接頭 12 :外殼 14 :電極堵頭 16 :照明光管 19 :整體成型部件 2’ :膠殼 3” :小孔 9” :封膠 11' ® 1 (c) is the & cross-section of the hole in the direction of A_A in the LED illumination source component shown in Figure 1 (a). 'Every hole has an outwardly bifurcated and generally frustoconical sidewall' It facilitates light emission and reflection of the LED wafer 4. In the cross section, the angle of deviation of the outwardly bifurcated sidewall may be 〇 relative to the upper surface of the PCB 1. ~18〇. Any angle. A method of manufacturing an LED illumination source unit will be described with reference to Figs. 3 to 5 as follows. Figure 3 shows the plastic shell 2 integrally molded on the printed circuit board by injection molding! on. A plurality of pairs of electrical connectors 7 are provided on the pcBi. The plastic shell 2 may be a panel and covered on one side of the pCB1. The laminate panel has an array of apertures 3 defining an array of voids. On the PCB 1, a pair of electrical contacts 7 are exposed through each of the small holes 3. Fig. 4 shows that the coffee wafer 4 is placed in the cavity and connected to the electrical connector 7 via the connecting wire 5. Figure 5 shows a sealant 9 disposed within a cavity for encapsulating an LED wafer. The sealant 9 is used to dry the connection wires 5 and to prevent the LED chips from being contaminated by, for example, dust. The sealant 9 may be made of a curable epoxy resin or any light transmissive sealing material to allow light emitted from the LED wafer 4 to be transmitted. The sealant can be transparent or can include yellow fluorescent particles, or fluorescent particles of any color, to produce the desired color effect. M365433 2 6 is a schematic diagram of the overall structure of the implementation of the coffee-light source component according to the present invention. In this embodiment, the Lai 2, which has only one large hole 3, exposes all of the electrical connector pairs on pcBl' through the π-large aperture 3'. Fig. 7 U) to 7 (7) show the injection molding process of the LED illumination source unit. Fig. 7 (4) shows a process of placing a printing plate in the cavity of the lower mold 17. Fig. 7 (8) shows the process of placing the upper mold on the lower mold and injecting the molding material into the mold cavity in the direction of the arrow 18. Fig. 7 (4) shows the process of removing the integrally formed member 19 from the lower mold cavity after the mold set is completed. Figure 8 U) is an embodiment showing an LED illumination source component. In this embodiment, the "rubber case 2" is a plurality of film-coated panels. Each of the film-coated panels is provided with a plurality of small holes. A pair of electrical connectors 7 are exposed through the small holes 3". A plurality of small holes 3 define a plurality of holes for accommodating the LED chips. As shown in Figs. 7(4) to (4), a plurality of plastic cases 2" can be placed on the PCB 1" by injection molding. As shown in Fig. 8 (7), the coffee wafer 4 is placed in the cavity and connected to the pcm by the bonding wire 5'. The sealant 9" in the cavity is used to seal the LED crystals. 4. Further, a plurality of micro-holes 8"' can be placed on the pcm, so that the plastic shell 2" can be made during the injection molding process. The molding material is introduced so that the plastic shell .2" is integrally formed with the PCB 1". Figure 9 shows the three coffee lighting source components being connected end to end by two connectors u. Fig. 10 shows the assembly of a (four) illumination source using the LED illumination source components of Fig. 9. The thief source may include a housing 12 for housing the elongated illumination source and the power source 13. The counter electrode plugs 14 are respectively fixed to both ends of the casing 12, and then assembled as the illumination light pipes 16. The light pipe 10 can be used with the picking system (four) light pipe bracket M365433 (four) socket towel. In contrast to the LEDs in this creation, the traditional fluorescent S life cycle is short and the resulting brightness is low, so the lighting wire 16 can replace the fluorescent tube. The LED lighting source of this creation can be used indoors or outdoors, and can be used as a backlight for LCD and advertising light boxes. The LED lighting source of the present invention is easy to manufacture and manufacture, and has low cost and high heat dissipation capability. Although disclosed herein, the LED chip 4 is connected to the electrical connection on one side of the printed circuit board i. However, as will be understood by those skilled in the art, the LED chip 4 can be connected to the electrical connector on the other side of the printed circuit board 1. Yes, so that both sides of the printed circuit board ι can emit light. It will also be appreciated that it is also possible to assemble two printed circuit boards together to produce the same effect. Finally, it is understood that the LED illumination sources disclosed herein can be of any size and shape and joined together in any way possible to achieve the desired structure, design and visual effects of the final illumination product. Although the light source and method of manufacture of the present invention disclosed herein are described in the preferred embodiments, various changes or modifications may be made without departing from the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic overall structural view of an LED illumination source component according to an embodiment of the present invention; FIG. 1(b) is an enlarged junction of holes in the LED illumination source component shown in FIG. 1(a). M365433 is not intended; " Figure 1 (c) is the led display of Figure 1 (a), /§ plus μ 1 ^ υ,,,,,,,,,,,,,,,,,,,,,, Fig. 2(a) is a schematic view showing the overall structure of a printed circuit board of the LED illuminating source device shown in Fig. 1(a); and Fig. 2(8) is Fig. 2 (a) Schematic diagram of the enlarged structure of the circuit of the printed circuit board shown; .3 is a schematic structural view of the injection molded plastic case on the printed circuit board of Fig. 2 (4); • Item 4 is a cavity in the integrated component of the printed circuit board FIG. 5 is a schematic structural view of a light-sealing sealing material sealed on a hole; FIG. 6 is a schematic structural view of an LED lighting source component according to another embodiment of the present invention; FIG. 7(4) is a view of placing a printed circuit board; Schematic diagram of the manufacturing process under the mold; Figure 7 (b) 疋 placing the upper mold on the lower mold FIG. 7(c) is a schematic view showing a manufacturing process for removing a molded product after injection molding; FIG. 8(a) is a view of manufacturing L]ED illumination according to another embodiment of the present creation. Figure 8 (b) is an enlarged schematic view of the hole of the LED illumination source component shown in Figure 8 (a); Figure 9 is a plurality of LED illumination source components shown in Figure 8 (a) Schematic diagram of the structure together; M365433 FIG. 10 is a schematic diagram of assembling an illumination source using a plurality of LED illumination source components shown in FIG. [Main component symbol description] 2: Plastic case 4: LED chip 6: Electronic circuit 9: Sealant 13. Power supply 15: Illumination light source 17: Lower die 1": PCB 3': Large hole 8": Micro hole 1: Printing Circuit board (PCB) 3: Small hole 5: Connecting wire 7: Electrical connector 12: Housing 14: Electrode plug 16: Illumination light pipe 19: Overall molded part 2': Plastic case 3": Small hole 9": Seal Glue 11

Claims (1)

M365433 ^ η i5 麵 六、申請專利範圍·· 1、一種發光二極體(LED)照明光源部件,其特徵在於,极: _電路板,在其—側面上設置有多對電接頭; 膠殼’通過注模,整體成型在所述印刷電路板的所述-側面; 多個LED “,每個LED晶片與—對電接頭電連接,且咖 晶片在所述膠殼中露出。 2、 如申請專利範圍第i項所述之部件,其中,所述膠殼是覆膜M365433 ^ η i5 face six, the scope of patent application · 1, a light-emitting diode (LED) lighting source component, characterized in that: pole: _ circuit board, on its side set of pairs of electrical connectors; 'Integral molding on the side of the printed circuit board by injection molding; a plurality of LEDs "each LED chip is electrically connected to the electrical connector, and the coffee wafer is exposed in the plastic case. The component of claim i, wherein the rubber shell is a film 面板’其具有多個小孔以定義出多_於容納所述LED晶片 的空穴,通過每個小孔露出一對電接頭。 3、 如申請專利範圍第2項所述之部件,其中,進—步包括填充 在每個空穴中的透光密封材料,以封裝每個空穴中的·晶 片0 4、如申請專利範圍第2項所述之部件,其中,每個空穴具有向 外分叉並大致形賴錐形_壁,以助於發射咖光。 • 5、如申請專利範圍第4項所述之部件,其中,在橫截面上,該 向外分叉的側壁的夾角相對於所述印刷電路板的所述一側面 - 的表面可為〇°〜180°的任意角度。 6、 如申請專利棚第1項之麟之部件,其中,所轉殼為一 覆膜面板’其上具有-大孔,通過該大孔將印刷電路板上的 電接頭對露出。 7、 如申請專利範圍第!項所述之部件,其中,每個咖晶片的 第-和第二電觸頭分別連接到相應的電接頭對的第一和第二 12 M365433 電接頭。 8、 如申μ專利細第7項所述獅件,其中,所述第一電觸頭 ' 通過連接幫線連接到第一電接頭。 9、 如申明專利圍第7項所述之部件,其中,所述第二電觸頭 通過钻性導電材料連接到所述第二電接頭。 10、 如申叫專利範圍第i項所述之部件,其中,戶斤述印刷電路板 上設置有多個微孔,以跡在注_程巾,導人所述膠殼的 造模材料。 U、-種_光源,其特徵在於,包括_個或多個發光二極體 (LED)知明光源部件,每個所述部件包括: 印刷電路板,在其-側面上設置有多對電接頭; 膠威’通過賴,整體成型在所述印刷電路板的所述一側面; 多個LED晶片’每個LED晶片與一對電接頭電連接,且LE〇 晶片在所述膠殼中露出。 • 12、如申請專利範圍第11賴述之照明光源,其巾,進一步包 括一個或多個連接器,用於當具有兩個或多個LED照明光源 部件時,以尾尾相連的構造形式,將LED照明光源部件連接 在一起。 13、 如申請專利範圍第u項所述之照明光源,其中,進一步包 括外殼,用於容納LED照明光源部件和一對電極堵頭;兩個 電極堵頭分別固定安裝在所述外殼的兩端。 14、 如申請專利範圍第11項所述之照明光源,其中,所述印刷 13 M365433 電路板上設置有多個微孔,以用於在注模過程中,導入所述 - 膠殼的造模材料。 -15、如申請專利範圍第η項所述之照明光源,其中,所述膠殼 是覆膜面板’其具有多個小孔以定義出多個用於容納所述 LED晶片的空穴,通過每個小孔露出一對電接頭。 ‘ 16、如申請專利範圍第15項所述之照明光源,其中,進一步包 . 括填充在每個空穴中的透光密封材料,以封裝每個空穴中的 LED晶片。 17、 如申請專利範圍第15項所述之照明光源,其中,每個空穴 具有向外分叉並大致形成截錐形的側壁,以助於發射LED光。 18、 如申請專利翻第15項所述之照明統,其中,在橫截面 上’該向外分叉的側壁的夾角相對於所述印刷電路板的所述 一側面的表面可為〇。〜180。的任意角度。 19、 如中請專利範圍第u項所述之照明光源,其巾,每個娜 晶片的第-和第二電觸頭分別連接到相應的電接麟的第一 和第二電接頭。 2〇、如申請專利範圍帛19項所述之照明光源,其中,所述第一 電觸頭通過連接幫線連接到第一電接頭。 2卜如申请專利範圍帛19項所述之照明光源,其中,所述第二 電觸頭通過祕導電材料連接到所述第二電接頭。The panel ' has a plurality of apertures to define a plurality of holes for receiving the LED wafer, and a pair of electrical contacts are exposed through each aperture. 3. The component of claim 2, wherein the step further comprises filling the light-transmissive sealing material in each cavity to encapsulate the wafer in each cavity, as claimed in the patent application. The component of item 2, wherein each of the cavities has an outwardly bifurcated shape and is substantially shaped like a conical wall to facilitate the emission of coffee. 5. The component of claim 4, wherein the angle of the outwardly bifurcated sidewall relative to the surface of the printed circuit board is 〇° in cross section. ~180° at any angle. 6. A component of the lining of the first item of the patent shed, wherein the shell is a laminated panel having a large hole through which the electrical connector pair on the printed circuit board is exposed. 7, such as the scope of patent application! The component of item wherein the first and second electrical contacts of each of the coffee wafers are respectively coupled to the first and second 12 M365433 electrical contacts of the respective pair of electrical contacts. 8. The lion member of claim 7, wherein the first electrical contact ' is connected to the first electrical connector by a connecting wire. 9. The component of claim 7, wherein the second electrical contact is coupled to the second electrical connector by a drill conductive material. 10. The component of claim i, wherein the printed circuit board is provided with a plurality of micro-holes for marking the mold-forming material of the plastic shell. a light source characterized by comprising one or more light emitting diode (LED) light source components, each of the components comprising: a printed circuit board having a plurality of pairs of electrical connectors disposed on a side thereof Jiaowei's integrally formed on the one side of the printed circuit board by a plurality of LED chips' each LED chip is electrically connected to a pair of electrical contacts, and the LE〇 wafer is exposed in the plastic case. 12. The illumination source of claim 11, wherein the towel further comprises one or more connectors for use in the form of a tail-to-tail configuration when having two or more LED illumination source components. Connect the LED lighting source components together. 13. The illumination source of claim 5, further comprising a housing for accommodating the LED illumination source component and a pair of electrode plugs; the two electrode plugs are respectively fixedly mounted at both ends of the housing . 14. The illumination source of claim 11, wherein the printing 13 M365433 circuit board is provided with a plurality of micro holes for introducing the mold-molding mold during the injection molding process. material. -15. The illumination source of claim n, wherein the plastic shell is a coated panel having a plurality of apertures defining a plurality of cavities for accommodating the LED wafers, Each aperture exposes a pair of electrical connectors. The illumination source of claim 15, wherein the light-transmissive sealing material filled in each cavity is further encapsulated to encapsulate the LED wafer in each cavity. 17. The illumination source of claim 15 wherein each of the cavities has a side wall that branches outwardly and generally forms a frustoconical shape to assist in emitting LED light. 18. The lighting system of claim 15, wherein the angle of the outwardly bifurcated side wall in the cross section is 〇 relative to the surface of the one side of the printed circuit board. ~180. Any angle. 19. The illumination source of claim 5, wherein the first and second electrical contacts of each of the nanochips are respectively connected to the first and second electrical contacts of the respective electrical connector. 2. The illumination source of claim 19, wherein the first electrical contact is connected to the first electrical connector by a connecting wire. An illumination source as claimed in claim 19, wherein the second electrical contact is connected to the second electrical connector by a secret conductive material.
TW98202826U 2009-02-25 2009-02-25 Light emitting diode (LED) illumination light source TWM365433U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI474083B (en) * 2010-06-25 2015-02-21 Japan Aviation Electron Backlight assembly for supplying electric power to a light-emitting element via a connector, and a backlight unit and a liquid crystal display which use the backlight assembly

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI474083B (en) * 2010-06-25 2015-02-21 Japan Aviation Electron Backlight assembly for supplying electric power to a light-emitting element via a connector, and a backlight unit and a liquid crystal display which use the backlight assembly

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