JP2012023098A - プラズマ処理装置 - Google Patents

プラズマ処理装置 Download PDF

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Publication number
JP2012023098A
JP2012023098A JP2010157928A JP2010157928A JP2012023098A JP 2012023098 A JP2012023098 A JP 2012023098A JP 2010157928 A JP2010157928 A JP 2010157928A JP 2010157928 A JP2010157928 A JP 2010157928A JP 2012023098 A JP2012023098 A JP 2012023098A
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JP
Japan
Prior art keywords
plasma
vacuum processing
magnetic field
frequency
processing container
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Pending
Application number
JP2010157928A
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English (en)
Japanese (ja)
Other versions
JP2012023098A5 (enrdf_load_stackoverflow
Inventor
Masashi Mori
政士 森
Yuzo Ohirahara
勇造 大平原
Yoji Takahashi
洋二 高橋
Masaru Izawa
勝 伊澤
Koichi Yamamoto
浩一 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Corp
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Hitachi High Technologies Corp
Hitachi High Tech Corp
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Publication date
Application filed by Hitachi High Technologies Corp, Hitachi High Tech Corp filed Critical Hitachi High Technologies Corp
Priority to JP2010157928A priority Critical patent/JP2012023098A/ja
Publication of JP2012023098A publication Critical patent/JP2012023098A/ja
Publication of JP2012023098A5 publication Critical patent/JP2012023098A5/ja
Pending legal-status Critical Current

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JP2010157928A 2010-07-12 2010-07-12 プラズマ処理装置 Pending JP2012023098A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010157928A JP2012023098A (ja) 2010-07-12 2010-07-12 プラズマ処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010157928A JP2012023098A (ja) 2010-07-12 2010-07-12 プラズマ処理装置

Publications (2)

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JP2012023098A true JP2012023098A (ja) 2012-02-02
JP2012023098A5 JP2012023098A5 (enrdf_load_stackoverflow) 2013-08-08

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ID=45777145

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JP2010157928A Pending JP2012023098A (ja) 2010-07-12 2010-07-12 プラズマ処理装置

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JP (1) JP2012023098A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015088695A (ja) * 2013-11-01 2015-05-07 株式会社日立ハイテクノロジーズ 半導体製造方法
JP2017108167A (ja) * 2017-02-28 2017-06-15 株式会社日立ハイテクノロジーズ 半導体製造方法

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04131379A (ja) * 1990-09-21 1992-05-06 Hitachi Ltd プラズマ処理装置
JPH06120170A (ja) * 1992-10-08 1994-04-28 Sumitomo Metal Ind Ltd プラズマエッチング処理方法
JPH06291087A (ja) * 1993-04-01 1994-10-18 Hitachi Ltd 半導体集積回路装置の製造方法および製造装置
JPH08106995A (ja) * 1994-10-05 1996-04-23 Hitachi Ltd プラズマ処理装置
JPH09161993A (ja) * 1995-12-12 1997-06-20 Hitachi Ltd ２重コイルを用いた多段コイルを有するプラズマ処理装置及び方法
JPH09312280A (ja) * 1996-05-22 1997-12-02 Sony Corp ドライエッチング方法
JPH11251300A (ja) * 1998-03-04 1999-09-17 Hitachi Ltd プラズマ処理方法および装置
JPH11340200A (ja) * 1998-05-22 1999-12-10 Hitachi Ltd プラズマ処理装置
JP2000216138A (ja) * 1999-01-20 2000-08-04 Hitachi Ltd プラズマ処理装置
JP2000306891A (ja) * 1999-04-22 2000-11-02 Hitachi Ltd プラズマ処理装置
JP2007059696A (ja) * 2005-08-25 2007-03-08 Hitachi High-Technologies Corp エッチング方法およびエッチング装置

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04131379A (ja) * 1990-09-21 1992-05-06 Hitachi Ltd プラズマ処理装置
JPH06120170A (ja) * 1992-10-08 1994-04-28 Sumitomo Metal Ind Ltd プラズマエッチング処理方法
JPH06291087A (ja) * 1993-04-01 1994-10-18 Hitachi Ltd 半導体集積回路装置の製造方法および製造装置
JPH08106995A (ja) * 1994-10-05 1996-04-23 Hitachi Ltd プラズマ処理装置
JPH09161993A (ja) * 1995-12-12 1997-06-20 Hitachi Ltd ２重コイルを用いた多段コイルを有するプラズマ処理装置及び方法
JPH09312280A (ja) * 1996-05-22 1997-12-02 Sony Corp ドライエッチング方法
JPH11251300A (ja) * 1998-03-04 1999-09-17 Hitachi Ltd プラズマ処理方法および装置
JPH11340200A (ja) * 1998-05-22 1999-12-10 Hitachi Ltd プラズマ処理装置
JP2000216138A (ja) * 1999-01-20 2000-08-04 Hitachi Ltd プラズマ処理装置
JP2000306891A (ja) * 1999-04-22 2000-11-02 Hitachi Ltd プラズマ処理装置
JP2007059696A (ja) * 2005-08-25 2007-03-08 Hitachi High-Technologies Corp エッチング方法およびエッチング装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015088695A (ja) * 2013-11-01 2015-05-07 株式会社日立ハイテクノロジーズ 半導体製造方法
JP2017108167A (ja) * 2017-02-28 2017-06-15 株式会社日立ハイテクノロジーズ 半導体製造方法

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