JP2012022889A - Display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a display device capable of reducing mix of moisture to suppress the loss of functions such as luminescence, in a display device whose functions such as luminescence are lost due to the entry of moisture.SOLUTION: A display device including a plurality of light emitting elements includes: a passivation film formed to cover the light emitting elements; and a steam barrier film chemically bonded to at least a part of the passivation film and having a steam barrier property to block a hole included in the passivation film.

Description

  The present invention relates to a display device.

  A compound having high reactivity with water, such as an alkali metal or an alkaline earth metal, is often used for an organic compound layer of an OLED (Organic light-emitting diode). Therefore, in the structure of the OLED, in order to prevent deactivation due to the reaction with water, a sealed structure is proposed so as to prevent moisture from entering.

  Patent Document 1 discloses a sealing structure in which three layers of a passivation film, a planarizing resin film, and a passivation film are formed above an OLED as shown in FIG. 10 as a structure that is sealed to prevent moisture from entering. It is disclosed. The sealing structure in which three layers of a passivation film, a planarizing resin film, and a passivation film are formed above the OLED has the advantage that a thin film with high physical strength is formed and that construction can be performed at a relatively low cost. is there.

  Also, in the technical fields of vapor deposition and gold plating, so-called sealing treatment is performed to close pinholes (holes) generated in a thin film in order to improve corrosion resistance, and sealing agents such as trialkoxysilane are used. Used (see Patent Documents 2 and 3).

JP2007-156058 JP 2002-363539 A JP2003-253208A

  A passivation film used for a sealing structure that prevents intrusion of moisture into an organic compound layer of an OLED has a property of suppressing permeation (moisture permeability) of moisture contained in outside air. The passivation film is formed through a manufacturing process such as a plasma CVD method.

  However, it is known that pinholes are rarely formed in the passivation film. There are various causes for the occurrence of pinholes, such as foreign matter adhering to the surface to be processed of the passivation film and vapor-grown particles. Also, the size of the pinhole varies from several nanometers to several tens of micrometers.

  Through the formed pinhole, moisture contained in the outside air enters the structure, further diffuses into the planarizing resin film, and finally reaches the OLED layer. The organic compound layer contained in the OLED layer is deactivated by the moisture that has reached the OLED layer, and so-called dark spots that do not emit light in a circle around the formed pinholes are generated.

  That is, it is insufficient to prevent moisture from entering the organic compound layer of the OLED only by forming the conventional passivation film, and a structure that further reduces the moisture penetration is desired.

  An object of the present invention is to provide a display device in which functions such as light emission are lost due to intrusion of moisture, and the display device that can reduce the mixing of moisture and suppress the loss of functions such as light emission. is there. The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

The display device according to the present invention is a display device including a plurality of light emitting elements, a passivation film formed so as to cover the plurality of light emitting elements, and water vapor chemically bonded to at least a part of the passivation film. And a water vapor barrier film having a barrier property. The water vapor barrier property here is defined as an amount that blocks water vapor that permeates through a film of a certain area in a certain time. The smaller the amount of water vapor that permeates, the higher the water vapor barrier property. In general, it is known that in an organic material, a crystalline part does not pass water vapor, but water vapor easily passes through other parts.

  According to the present invention, in a display device in which a function such as light emission is lost due to intrusion of moisture, a display device capable of reducing the mixing of moisture and suppressing the loss of function such as light emission is provided.

1 is an overall perspective view of a display device according to an embodiment of the present invention. It is the whole display apparatus perspective view which concerns on other embodiment of this invention. It is a figure which shows typically a part of cross section of the organic electroluminescent board | substrate in the display apparatus which concerns on 1st embodiment of this invention. It is a figure which shows typically a part of cross section of the organic electroluminescent board | substrate in the display apparatus which concerns on 2nd embodiment of this invention. It is a figure which shows typically a part of cross section of the organic electroluminescent board | substrate in the display apparatus which concerns on 3rd embodiment of this invention. It is a figure which shows typically a part of cross section of an organic electroluminescent board | substrate in the display apparatus which concerns on 4th embodiment of this invention. It is a figure which shows typically a part of cross section of the organic electroluminescent board | substrate in the display apparatus which concerns on 5th embodiment of this invention. It is a figure which shows typically a part of cross section of an organic electroluminescent board | substrate in the display apparatus which concerns on the 6th embodiment of this invention. It is a figure which shows typically a part of cross section of the organic electroluminescent board | substrate in the display apparatus which concerns on the 7th embodiment of this invention. It is a figure which shows typically a part of cross section of the organic electroluminescent board | substrate in the display apparatus which concerns on 8th embodiment of this invention. It is a figure which shows typically a part of cross section of the organic electroluminescent board | substrate in the display apparatus which concerns on 9th embodiment of this invention. It is a figure which shows typically a part of cross section of the organic electroluminescent board | substrate in the conventional display apparatus. It is the figure which showed the state in which the dark spot defect occurred in the conventional display apparatus. It is the figure explaining the mechanism in which the dark spot defect generate | occur | produces in the conventional display apparatus.

  A display device according to the present invention is a display device including a plurality of light-emitting elements, and is chemically bonded to a passivation film formed so as to cover the plurality of light-emitting elements and at least a part of the passivation film. It is characterized by comprising a water vapor barrier film having a water vapor barrier property that closes the included holes.

  An embodiment of a display device of the present invention will be described with reference to the drawings. Moreover, the display apparatus in this invention can be used suitably for display apparatuses, such as an organic EL (Electro-Luminescence) display, for example.

  FIG. 1A is an overall perspective view of a display device 1a according to an embodiment of the present invention. As shown in FIG. 1A, the display device 1a includes an organic EL substrate SUB on which a later-described passivation film, a water vapor barrier film, and the like are disposed, and a polarizing plate PL provided on the display surface of the organic EL substrate SUB. ing.

  The organic EL substrate SUB provided in the display device 1a according to the embodiment of the present invention is configured by arranging OLEDs, which are light emitting elements, in a matrix on a glass substrate GA. On the organic EL substrate SUB, a large number of scanning signal lines GL are laid out at equal intervals, and a large number of video signal lines DL are perpendicular to the direction in which the scanning signal lines GL are laid out at equal intervals. It is laid in the direction.

  In the embodiment of the present invention, the video signal lines DL are laid from the terminal portion TE toward the display area DR, and the scanning signal lines GL are laid so as to be perpendicular to the video signal lines DL. In each pixel region partitioned by the scanning signal line GL and the video signal line DL, a TFT (Thin Film Transistor) used for switching of a MIS (Metal Insulator Semiconductor) structure and a storage capacitor are arranged. Is done.

  In each pixel region, an OLED is formed by laminating an organic material between a lower electrode (anode electrode) and an upper electrode (cathode electrode). In accordance with a signal supplied via the scanning signal line GL or the like, an OLED emits light by generating a potential difference between both electrodes and supplying electrons and holes to the organic material.

  FIG. 1B is an overall perspective view of a display device 1b according to another embodiment of the present invention. As shown in FIG. 1B, the display device 1b is further provided with a display element protection panel HU for the purpose of suppressing scratches from the outside on the surfaces of the organic EL substrate SUB and the polarizing plate PL. Next, the organic EL substrate SUB provided in the display device provided by the present invention will be described in detail.

[First embodiment]
FIG. 1C is a diagram schematically showing a part of a cross section of the organic EL substrate SUB in the display device 1a according to the first embodiment of the present invention. As shown in FIG. 1C, a TFT layer 20 in which a plurality of TFTs 2 including scanning signal lines GL and video signal lines DL are arranged is formed on a glass substrate GA in the organic EL substrate SUB. Further, an OLED layer 30 in which a plurality of OLEDs 3 are arranged is formed above the TFT layer 20.

  Each of the plurality of OLEDs 3 includes an upper electrode Ca, a lower electrode An, and an organic layer 4 interposed between the upper electrode Ca and the lower electrode An. The organic layer 4 further has a multilayer structure including a light emitting layer, an electron injection layer, and the like. Note that the OLED 3 is classified into a red light-emitting OLED 3r, a green light-emitting OLED 3g, and a blue light-emitting OLED 3b depending on the color of light emitted from the light-emitting layer. The plurality of OLEDs 3 are respectively arranged at positions corresponding to a part of the display area DR.

  By the way, the electron injection layer included in the organic layer 4 is formed of a highly reactive metal such as an alkali metal or an alkaline earth metal, and is deactivated by reacting with moisture. That is, when moisture enters the OLED 3, functions such as light emission of the OLED 3 are lost. Therefore, it is necessary to reduce the intrusion of moisture into the OLED 3 and suppress the loss of functions such as light emission.

  Here, in order to clarify the difference between the display device according to the first embodiment of the present invention and the conventional display device, the conventional display device will be briefly described.

  FIG. 10 is a diagram schematically showing a part of a cross section of an organic EL substrate SUB in a conventional display device. The organic EL substrate SUB provided in the conventional display device has a sealing structure in which three layers of a first passivation film 5a, a planarization film 7, and a second passivation film 5b are formed above the OLED layer 30. is doing.

  The passivation film 5 (first passivation film 5a and second passivation film 5b) provided in the display device and covering the plurality of OLEDs 3 is formed for the purpose of protection against various environments to which the OLED layer 30 is exposed. . Specifically, the passivation film 5 is formed for the purpose of protecting the OLED layer 30 from mechanical damage such as scratches, electrostatic damage such as adhesion of particles and dust, and chemical damage such as moisture.

  In the conventional display device, a sealing structure in which the passivation film 5 is laminated in multiple layers has been adopted in order to prevent the OLED 3 from being deactivated by reacting with moisture from the outside. However, after manufacturing the display device, a so-called dark spot, in which the light emission of some of the OLEDs 3 is lost and becomes black, may occur.

  FIG. 11 is a diagram showing a state in which a dark spot defect has occurred in a conventional display device. The dark spot DS is a state in which light emission cannot be performed while being in the display area DR, that is, an area where an image cannot be displayed.

  The occurrence of the dark spot DS is caused by moisture entering through a pinhole (hole) that is rarely formed in the manufacturing process of the passivation film 5. Also, the size of pinholes varies from several nm to several tens of μm, and it is extremely difficult to find pinholes of several nm at the manufacturing stage.

  FIG. 12 is a diagram illustrating a mechanism in which a dark spot defect occurs in a conventional display device. In FIG. 12, the pinhole 8 formed when the passivation film 5 is formed is emphasized, but it is actually very small and difficult to find. When the pinhole 8b exists in the second passivation film 5b, moisture (moisture) in the air passes through the pinhole 8b and diffuses into the resin forming the planarizing film 7 as indicated by the arrow in FIG. . In addition, since the planarizing film 7 is usually about 10 μm, the moisture diffused into the resin through the pinhole 8b diffuses throughout the planarizing film 7 over a long period of several months.

  The first passivation film 5a is formed to absorb moisture generated when the planarizing film 7 is formed, and is very thin. Moreover, since the 1st passivation film 5a is formed on the OLED layer 30 which has an unevenness | corrugation on the surface, it is easy to produce the pinhole 8a. Moisture diffused throughout the planarizing film 7 passes through the pinhole 8a included in the first passivation film 5a and finally reaches the OLED 3. Therefore, it reacts with the alkali metal or alkaline earth metal in the electron injection layer, and the function of the OLED 3 is deactivated to become a dark spot.

  The passivation film 5 provided in the display device 1a shown in FIG. 1C is made of SiN (silicon nitride). For example, the organic EL substrate SUB provided with a passivation film 5 (one of the first passivation film 5a and the second passivation film 5b) having a thickness of 3 μm and formed of SiN has a temperature of 60 ° C. and 95% RH. Dark spots hardly expand even after storage for 500 hours in an environment. That is, the passivation film 5 formed of SiN has an excellent water vapor barrier property. Therefore, the effect of the present invention is further enhanced by using SiN for the passivation film 5.

  The water vapor barrier film 6a provided in the display device 1a according to the first embodiment is formed to close the pinhole 8a formed in the passivation film 5a. In a display device in which a function such as light emission is lost due to intrusion of moisture, by including the passivation film 5 and the water vapor barrier film 6 having a water vapor barrier property that closes the pinhole 8 included in the passivation film 5, It is possible to further prevent the functions such as light emission from being lost by reducing the mixing of moisture into the OLED layer 30.

  The water vapor barrier film 6 provided in the display device 1a according to the first embodiment preferably has a water vapor barrier property comparable to that of SiN, and is preferably formed of an organometallic compound. . The effect of the present invention is further enhanced by forming the water vapor barrier film 6 using an organometallic compound.

  Examples of organometallic compounds include metal alcoholates, alkyl metals, metal complexes, and the like. The compound shown above is merely an example of a compound that can form the water vapor barrier film 6, and is not limited thereto. Further, when a metal alcoholate is used as the organometallic compound that forms the water vapor barrier film 6, the organometallic compound contains a metal oxide that is modified from the metal alcoholate, and forms the water vapor barrier film 6.

  In addition, it is preferable that the water vapor barrier film 6 provided in the display device 1a according to the first embodiment is formed of an organometallic compound containing a metal alcoholate. Examples of the metal that provides an effective alcoholate for forming the water vapor barrier film 6 that closes the pinhole 8 of the passivation film 5 include silicon, zinc, aluminum, magnesium, titanium, and zirconium.

As the metal alcoholate, for example, Zr (OR) ₄ , Ti (OR) ₄ , Al (OR) _3, etc. (where R is an alkyl group having 1 to 4 carbon atoms) is preferably used. Specifically, tetramethoxy zirconium, tetraethoxy zirconium, tetra-n-propoxy zirconium, tetra-i-propoxy zirconium, tetramethoxy titanium, tetraethoxy titanium, tetra-n-propoxy titanium, tetra-i-propoxy titanium, tri Examples thereof include methoxyaluminum, triethoxyaluminum, tri-n-propoxyaluminum, and tri-i-propoxyaluminum.

  Metal alcoholates react with moisture in the atmosphere to produce alcohol, and precipitate and harden oxides. When the metal alcoholate is cured, it is difficult for moisture in the atmosphere to enter the OLED 3 from the pinhole, and it is advantageous because it works to absorb moisture in the atmosphere even if a trace amount of unreacted metal alcoholate remains after curing. .

The metal alcoholate reacts with a functional group such as —NH ₂ , ═NH ₂ , or —OH present on the surface of the passivation film 5, is chemically bonded to the surface of the passivation film 5, and is included in the pin included in the passivation film 5. A water vapor barrier film 6 having a water vapor barrier property that closes the holes 8 is formed. The chemical bond at this time generally does not require heat or ultraviolet rays and can react at room temperature.

Among the metal alcoholates exemplified above, the water vapor barrier film 6 is formed of an organometallic compound containing one or more metal alcoholates selected from the compound group represented by the following chemical formulas (I) to (III). Is preferred.

  However, R in the chemical formulas represented by the chemical formulas (I) to (III) is an alkyl group having 1 to 4 carbon atoms. The effect of the present invention is further enhanced by forming the water vapor barrier film 6 with an organometallic compound containing one or more metal alcoholates selected from the group of compounds represented by the above (I) to (III).

Further, in order to accelerate the curing of the metal alcoholate, a small amount of one or more alkyl metals selected from the compound group represented by the following chemical formulas (IV) to (VII) may be added.

  In addition, in the organometallic compound containing one or more metal alcoholates selected from the group of compounds represented by the chemical formulas (I) to (III), it is particularly preferable to further contain an alkoxysilane compound or an arylalkoxysilane compound. .

  In addition, the water vapor barrier film 6 has some organic properties such as mixing an organometallic compound containing aluminum and an organometallic compound containing silicon in order to improve the physical properties of the water vapor barrier property and the film itself. It is preferable to form a mixture of metal compounds.

  This is because the water vapor barrier film 6 formed using a single organometallic compound may have a problem that the formed film itself tends to be finely cracked. The water vapor barrier film 6 that has been finely cracked may scatter light and appear turbid. In order to solve this problem, it is effective to use several kinds of organometallic compounds in combination in order to impart flexibility to the water vapor barrier film 6 itself.

  For example, there is a method in which a trialkoxide silane or dialkoxide silane having one or two alkyl groups or aryl groups is added to make the characteristics close to those of a silicone resin. In this case, a trialkoxide silane or dialkoxide silane whose molecular weight has been increased by condensing silane compounds in advance is mixed with a low molecular weight metal alcoholate (for example, aluminum trimethoxide), and a low molecular weight metal alcoholate is added to the pinhole. Infiltrate and block. In such a case, aluminum trimethoxide contributes to the provision of water vapor barrier properties of the water vapor barrier film 6, and trialkoxide silane and dialkoxide silane have flexibility like a silicone resin, so that the water vapor barrier film 6 is prevented from cracking. Will contribute.

The alkoxysilane compound or arylalkoxysilane compound is particularly preferably an alkoxysilane compound or arylalkoxysilane compound represented by the following chemical formulas (VIII) to (XII).

  However, R in the chemical formulas represented by the chemical formulas (VIII) to (XII) is an alkyl group having 1 to 4 carbon atoms.

  As another example of forming the water vapor barrier film 6 using an organometallic compound, there is one in which a metal hydroxide sol is applied and gelled to solidify. The organic polymer is not preferable in the formation of the water vapor barrier film 6 because it has a large moisture diffusion and does not have a sufficient barrier property. However, when the organic polymer is used in combination with an organometallic compound, the effect of the present invention is not impaired. May be used.

  In the display device 1a according to the first embodiment, the first passivation film 5a is formed on the upper surface of the OLED layer 30, and the first passivation film 5a is further formed on the upper surface of the first passivation film 5a. A first water vapor barrier film 6a having a water vapor barrier property that closes the pinhole 8a contained in is formed.

  Further, a planarizing film 7 is formed on the upper surface of the first water vapor barrier film 6a in order to planarize the display region. Above the planarizing film 7, a second passivation film 5b and a second water vapor barrier film 6a having a water vapor barrier property for closing the pinhole 8a included in the second passivation film 5b are formed. .

  Next, a manufacturing method of the display device 1a including the organic EL substrate SUB shown in FIG. 1C will be described. First, the TFT layer 20 for driving the OLED 3 is formed on the glass substrate GA. Furthermore, after forming the lower electrode An of the OLED 3 and its peripheral bank, the organic layer 4 is formed by vapor deposition, and the upper electrode Ca is formed to form the OLED layer 30.

  And the 1st passivation film formation process which forms the 1st passivation film 5a so that the OLED layer 30 may be covered, the organometallic compound application | coating process which apply | coats an organometallic compound to the 1st passivation film 5a, A first water vapor barrier film having a water vapor barrier property on the first passivation film 5a so as to block the pinhole 8 included in the first passivation film 5a by reacting the surface of the passivation film 5a with the organometallic compound. The display device 1a is manufactured by including a water vapor barrier film forming step for forming 6a.

  In addition, when apply | coating an organometallic compound in an organometallic compound application | coating process, generally, (A) The method of using an organic metal compound melt | dissolving in water, (B) The method of using it melt | dissolving in an organic solvent, (C) There is a method in which the solvent is used as it is, but the method (B) is unsuitable because water enters from the pinhole 8 formed in the passivation film 5.

  The first passivation film forming step is made of, for example, SiN (silicon nitride) formed at a low temperature by plasma CVD (Chemical Vapor Deposition), thermal decomposition CVD using a tungsten wire as a catalyst, or the like.

  In addition, in the state where the OLED layer 30 is formed, there is a place where it is difficult to cover the first passivation film 5a due to the unevenness of the surface of the OLED layer 30. Therefore, in the display device 1a according to the first embodiment, the planarizing film 7 having a role of covering and planarizing the upper surface of the first passivation film 5a with a resin or the like is formed.

  The planarizing film 7 can be formed by patterning so as to cover at least the OLED layer 30 by printing or film transfer. For example, the flattening film 7 provided in the display device 1a according to the present embodiment is cured after applying an epoxy resin, or a polyethylene terephthalate film or a polycarbonate film is used with a polyethylene-based or polypropylene-based thermoplastic adhesive. Can be formed.

  A second passivation film 5b and a second water vapor barrier film 6b are further formed on the planarizing film 7 by the same method as the first passivation film forming process and the first water vapor barrier film forming process. Since the unevenness of the surface to be applied is reduced by providing the planarizing film 7, the second passivation film 5b and the second water vapor barrier film 6b are formed with extremely few defects.

  It is to be noted that the passivation film 5 is formed into a terminal portion by masking the upper surface of the terminal portion TE when the passivation film 5 is formed, or by removing the passivation film 5 formed on the terminal portion TE after the formation of the passivation film 5. It is formed so as to cover everything except TE. As a method for removing the passivation film 5 formed on the terminal portion TE after the formation of the passivation film 5, a resist is applied, and the terminal portion is exposed and etched by a photolithography technique, and then the resist is peeled off, A part of the organic layer of the OLED may be attached to the terminal portion, and finally the passivation film may be lifted off.

[Second Embodiment]
FIG. 2 is a diagram schematically showing a part of a cross section of the organic EL substrate SUB in the display device 1a according to the second embodiment of the present invention.

The second embodiment has the same layer structure as that of the first embodiment. In forming the water vapor barrier film, the water vapor barrier film 60 may be formed by oxidizing the surface of the passivation film 5 without using an organometallic compound. In this case, the water vapor barrier film 60 is formed of SiO ₂ .

  In the case where the water vapor barrier film 60 is formed by oxidizing the surface of the passivation film 5, a passivation film forming step for forming the first passivation film 5a so as to cover the OLED layer 30, and the first passivation film 5a. The surface of the first passivation film 5a is irradiated with oxygen plasma to oxidize the surface of the first passivation film 5a, thereby blocking the pinhole 8 included in the first passivation film 5a. The display device 1a is manufactured by including a water vapor barrier film forming step of forming the first water vapor barrier film 60a having the property.

[Third embodiment]
FIG. 3 is a diagram schematically showing a part of the cross section of the organic EL substrate SUB in the display device 1a according to the third embodiment of the present invention.

  In the third embodiment, after the OLED layer 30 is formed as in the first embodiment, the first passivation film 5a is formed on the upper surface of the OLED layer 30, and the flat surface is formed on the upper surface of the first passivation film 5a. The formation film 7 is formed of an epoxy resin, and the second passivation film 5 b and the water vapor barrier film 6 are formed on the upper surface of the planarization film 7.

In the third embodiment, the water vapor barrier layer 6 is formed using an organometallic compound containing Al (OCH ₃ ) ₃ as a main component for the second passivation film 5b formed of SiN.

The thickness of the water vapor barrier film 6 may be about 1 μm for the purpose of sealing only, that is, for the purpose of protecting only from chemical damage such as moisture. In this case, the organic layer mainly contains Al (OCH ₃ ) _3. It is preferable that the metal compound (inorganic sealing agent) is applied by spray coating.

In addition to the above purpose, in consideration of protection from mechanical damage of the second passivation film 5b, the thickness of the water vapor barrier film 6 is preferably 10 to 100 μm. In this case, it is preferable that an organometallic compound (inorganic sealing agent) containing Al (OCH ₃ ) ₃ as a main component is applied using screen printing or a slot coating technique.

[Fourth embodiment]
FIG. 4 is a diagram schematically showing a part of the cross section of the organic EL substrate SUB in the display device 1a according to the fourth embodiment of the present invention.

  In the fourth embodiment, after the OLED layer 30 is formed as in the first embodiment, the first passivation film 5a is formed on the upper surface of the OLED layer 30, and the water vapor is formed on the upper surface of the first passivation film 5a. A barrier film 6 is formed, and a planarizing film 7 and a second passivation film 5 b are formed on the upper surface of the water vapor barrier film 6.

In the fourth embodiment, the water vapor barrier layer 6 is formed using an organometallic compound containing Al (OCH ₃ ) ₃ as a main component for the first passivation film 5a formed of SiN.

The thickness of the water vapor barrier film 6 may be about 1 μm for the purpose of sealing only. In this case, an organometallic compound (inorganic sealing agent) mainly composed of Al (OCH ₃ ) ₃ is spray-coated. Is preferred.

The organometallic compound containing Al (OCH ₃ ) ₃ as a main component does not need to be completely cured after coating, and if it is cured to an extent that there is no problem in strength, a resin for forming the planarizing film 7 is applied on the upper surface. It's okay. In addition, although the thickness of the planarization film | membrane 7 can be used suitably with 1-100 micrometers, it is not limited to this. Since the organometallic compound mainly composed of uncured Al (OCH ₃ ) ₃ reacts with moisture present in a small amount in the resin forming the planarizing film 7, it can also serve as a desiccant.

  In the case of the fourth embodiment, the thickness of the water vapor barrier film 6 may be about 1 μm, and a material that is easily cracked can also be used.

[Fifth embodiment]
FIG. 5 is a diagram schematically showing a part of a cross section of the organic EL substrate SUB in the display device 1a according to the fifth embodiment of the present invention.

  In the fifth embodiment, after the OLED layer 30 is formed as in the first embodiment, the first passivation film 5a is formed on the upper surface of the OLED layer 30, and the water vapor is formed on the upper surface of the first passivation film 5a. A barrier film 6 is formed, and a second passivation film 5b is further formed.

In the fifth embodiment, the water vapor barrier film 6 provided on the upper surface of the first passivation film 5a formed of SiN is composed of Al (OCH ₃ ) ₃ and an arylalkoxysilane represented by the chemical formula (XII-2). It is formed by an organometallic compound including a compound.

  The water vapor barrier film 6 formed by a treatment agent containing a large amount of trialkoxide silane or dialkoxide silane having one or two alkyl groups or aryl groups is flexible and does not crack and has a smooth surface like a planarizing film. Therefore, the planarization film can be omitted.

[Sixth embodiment]
FIG. 6 is a diagram schematically showing a part of the cross section of the organic EL substrate SUB in the display device 1b according to the sixth embodiment of the present invention.

  In the sixth embodiment, the OLED layer 30 is formed as in the first embodiment, and then the passivation film 5 and the water vapor barrier film 6 are formed on the upper surface of the OLED layer 30. That is, the second passivation film 5b in the fifth embodiment is omitted.

  In the display device 1b shown in FIG. 1B, since the display element protection panel HU is further provided on the upper surface of the organic EL substrate SUB, the second passivation film 5b can be omitted.

In the sixth embodiment, the water vapor barrier film 6 provided on the upper surface of the passivation film 5 formed of SiN contains Ti (OCH ₃ ) ₄ and an arylalkoxysilane compound represented by the chemical formula (XI-2). It is formed by an organometallic compound.

  The water vapor barrier film 6 formed by a treatment agent containing a large amount of trialkoxide silane or dialkoxide silane having one or two alkyl groups or aryl groups is flexible and does not crack and has a smooth surface like a planarizing film. Therefore, the planarization film can be omitted.

[Seventh embodiment]
FIG. 7 is a view schematically showing a part of the cross section of the organic EL substrate SUB in the display device 1b according to the seventh embodiment of the present invention.

  In the seventh embodiment, after the OLED layer 30 is formed as in the first embodiment, the passivation film 5 and the water vapor barrier film 6 are formed on the upper surface of the OLED layer 30, and only the planarizing film 7 is formed. It is a thing. That is, the second passivation film 5b of the fourth embodiment is omitted.

  In the display device 1b shown in FIG. 1B, since the display element protection panel HU is further provided on the upper surface of the water vapor barrier film 6, the second passivation film 5b can be omitted.

  Compared with the display device according to the sixth embodiment, the display device according to the seventh embodiment has increased physical strength by the amount of the resin layer formed, and moreover than the display device according to the sixth embodiment. There is an advantage that the surface is hardly scratched.

In the seventh embodiment, the water vapor barrier film 6 provided on the upper surface of the passivation film 5 formed of SiN is formed of an organometallic compound containing Ti (OCH ₃ ) ₄ . In the seventh embodiment, it can be suitably used even when it is desired to form the water vapor barrier film 6 using an organometallic compound that is particularly easily cracked.

[Eighth embodiment]
FIG. 8 is a diagram schematically showing a part of a cross section of the organic EL substrate SUB in the display device 1a according to the eighth embodiment of the present invention.

  In the eighth embodiment, after the OLED layer 30 is formed as in the first embodiment, the first passivation film 5a is formed on the upper surface of the OLED layer 30, and the first passivation film 5a is formed on the upper surface of the first passivation film 5a. One water vapor barrier film 6a is formed, and further a second passivation film 5b and a second water vapor barrier film 6b are formed on the upper surface of the first water vapor barrier film 6a.

  In the eighth embodiment, the water vapor barrier film 6 is formed on each of the two passivation films 5, but the planarizing film 7 is omitted.

In the eighth embodiment, the water vapor barrier film 6 provided on the upper surface of the passivation film 5 formed of SiN is an organic material containing Zr (OCH ₃ ) ₄ and an alkoxysilane compound represented by the chemical formula (X-2). It is formed by a metal compound.

  The water vapor barrier film 6 formed by a treatment agent containing a large amount of trialkoxide silane or dialkoxide silane having one or two alkyl groups or aryl groups is flexible and does not crack and has a smooth surface like a planarizing film. Therefore, the planarization film can be omitted.

[Ninth Embodiment]
FIG. 9 is a diagram schematically showing a part of the cross section of the organic EL substrate SUB in the display device 1a according to the ninth embodiment of the present invention.

  In the ninth embodiment, after forming the OLED layer 30 as in the first embodiment, the first passivation film 5a is formed on the upper surface of the OLED layer 30, and the first passivation film 5a is formed on the upper surface of the first passivation film 5a. One water vapor barrier film 6a is formed, a second passivation film 5b and a second water vapor barrier film 6b are formed on the upper surface of the first water vapor barrier film 6a, and a protective resin film 9 is further formed.

  In the ninth embodiment, as in the eighth embodiment, the water vapor barrier film 6 is formed on each of the two passivation films 5 formed of SiN, and the protective resin film 9 is formed. The protective resin film 9 in the ninth embodiment can be provided for the purpose of protecting the organic EL substrate SUB from mechanical damage, for example.

  1a, 1b Display device, 2 TFT, 20 TFE layer, 3 OLED, 3r Red light emitting OLED, 3g Green light emitting OLED, 3b Blue light emitting OLED, 30 OLED layer, 4 Organic layer, 5, 5a, 5b Passivation film, 6, 6a , 6b Water vapor barrier film, 7 planarization film, 8 pinhole, 9 protective resin film, Ca upper electrode, An lower electrode, SUB organic EL substrate, GA glass substrate, TE terminal, DL video signal line, GL scanning signal line , DR display area, PL polarizing plate, HU display element protection panel, DS dark spot.

Claims (9)

A display device comprising a plurality of light emitting elements,
A passivation film formed to cover the plurality of light emitting elements;
A water vapor barrier film having a water vapor barrier property chemically bonded to at least a part of the passivation film;
A display device comprising: The passivation film is formed of SiN (silicon nitride).
The display device according to claim 1. The water vapor barrier film is formed of an organometallic compound.
The display device according to claim 1, wherein the display device is a display device. The organometallic compound includes a metal oxide modified from a metal alcoholate.
The display device according to claim 3. The organometallic compound includes one or more metal alcoholates selected from the group of compounds represented by the following chemical formulas (I) to (III):

The display device according to claim 3.
(However, R in the chemical formulas represented by the chemical formulas (I) to (III) is an alkyl group having 1 to 4 carbon atoms.) The organometallic compound further includes an alkoxysilane compound or an arylalkoxysilane compound.
The display device according to claim 5. The water vapor barrier film is formed by oxidizing the surface of the passivation film.
The display device according to claim 1, wherein the display device is a display device. In a display device comprising a plurality of light emitting elements,
A passivation film forming step of forming a passivation film so as to cover the plurality of light emitting elements;
An organometallic compound coating step of coating the passivation film with an organometallic compound;
A water vapor barrier film forming step of forming a water vapor barrier film having a water vapor barrier property on the passivation film so as to cause the surface of the passivation film to react with the organometallic compound and close the pores included in the passivation film;
A method for manufacturing a display device, comprising: In a display device comprising a plurality of light emitting elements,
A passivation film forming step of forming a passivation film so as to cover the plurality of light emitting elements;
By irradiating the surface of the passivation film with oxygen plasma and oxidizing the surface of the passivation film, a water vapor barrier film having a water vapor barrier property is formed on the passivation film so as to close holes included in the passivation film. A water vapor barrier film forming step,
A method for manufacturing a display device, comprising:

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