JP2012018374A - Photosensitive resin composition - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of forming such a pattern as the width of a pattern obtained even with the amount of light exposure varied is difficult to be influenced.SOLUTION: A photosensitive resin composition includes (A), (B1), (B2), (C) and (D) shown below, and the content of (B1) therein is 5-80 mass% relative to the total amount of (B1) and (B2). (A) is a resin containing a structural unit having an alicyclic hydrocarbon structure. (B1) is a polymerizable compound having a carbon-to-carbon unsaturated bond and an alicyclic hydrocarbon structure. (B2) is a polymerizable compound different from (B1). (C) is a photopolymerization initiator. (D) is a solvent.

Description

  The present invention relates to a photosensitive resin composition.

  In recent liquid crystal display panels and the like, a photosensitive resin composition is used to form photo spacers and overcoats. Examples of such a photosensitive resin composition include a copolymer of an unsaturated carboxylic acid and / or an unsaturated carboxylic acid anhydride and an aliphatic polycyclic epoxy compound, a polymerizable compound, a photopolymerization initiator, and a solvent. There is known a photosensitive resin composition containing the above (Patent Document 1).

JP 2008-181087 A

  When forming a plurality of patterns on the same substrate using the photosensitive resin composition, if the width of the pattern to be obtained varies greatly with the variation in exposure amount, the variation in the width of the pattern formed on the substrate growing. Conventionally proposed photosensitive resin compositions may not always be sufficiently satisfied with respect to the amount (exposure margin) of variation in the width of a pattern obtained with variation in exposure amount.

［式（Ｉ）及び式（ＩＩ）中、Ｒ^１及びＲ^２は、互いに独立に、水素原子、又は炭素数１〜４のアルキル基を表し、該アルキル基に含まれる水素原子はヒドロキシ基で置換されていてもよい。
Ｘ^１及びＸ^２は、互いに独立に、単結合、−Ｒ^３−、＊−Ｒ^３−Ｏ−、＊−Ｒ^３−Ｓ−、＊−Ｒ^３−ＮＨ−を表す。
Ｒ^３は、炭素数１〜６のアルカンジイル基を表す。
＊は、Ｏとの結合手を表す。］
［７］前記［１］〜［６］のいずれかに記載の感光性樹脂組成物を用いて形成されるパターン。
［８］前記［７］記載のパターンを含む表示装置。 The present invention provides the following [1] to [8].
[1] The following (A), (B1), (B2), (C) and (D) are included, and the content of (B1) is 5 with respect to the total amount of (B1) and (B2) A photosensitive resin composition in an amount of from mass% to 80 mass%.
(A): Resin containing a structural unit having an alicyclic hydrocarbon structure (B1): A polymerizable compound having a carbon-carbon unsaturated bond and an alicyclic hydrocarbon structure (B2): different from (B1) Polymerizable compound (C): Photopolymerization initiator (D): The photosensitive resin composition according to [1], wherein the solvent [2] (C) is a photopolymerization initiator containing an acetophenone compound.
[3] The photosensitive resin composition according to [1] or [2], wherein the alicyclic hydrocarbon structure is a crosslinked cyclic hydrocarbon structure.
[4] The photosensitive resin according to any one of [1] to [3], wherein (B1) is a polymerizable compound having two or more carbon-carbon unsaturated bonds and an alicyclic hydrocarbon structure. Composition.
[5] The photosensitivity according to any one of [1] to [4], wherein the alicyclic hydrocarbon structure of (A) and the alicyclic hydrocarbon structure of (B1) have the same structure. Resin composition.
[6] The above-mentioned [A], wherein (A) is an addition polymer containing a structural unit derived from at least one selected from the group consisting of a compound represented by formula (I) and a compound represented by formula (II) 1]-[5] The photosensitive resin composition in any one.

[In Formula (I) and Formula (II), R ¹ and R ² each independently represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and the hydrogen atom contained in the alkyl group is a hydroxy group. May be substituted.
X ¹ and X ² each independently represent a single bond, —R ³ —, * —R ³ —O—, * —R ³ —S—, or * —R ³ —NH—.
R ³ represents an alkanediyl group having 1 to 6 carbon atoms.
* Represents a bond with O. ]
[7] A pattern formed using the photosensitive resin composition according to any one of [1] to [6].
[8] A display device including the pattern according to [7].

  According to the photosensitive resin composition of the present invention, when forming a pattern, the width of the pattern obtained is less likely to vary even if the exposure amount varies.

Hereinafter, the present invention will be described in detail.
The photosensitive resin composition of the present invention includes a resin (A) containing a structural unit having an alicyclic hydrocarbon structure, a polymerizable compound (B1) having a carbon-carbon unsaturated bond and an alicyclic hydrocarbon structure, It comprises a polymerizable compound (B2) different from (B1), a photopolymerization initiator (C) and a solvent (D), and the content of the polymerized compound (B1) is the sum of (B1) and (B2). The amount is from 5% by weight to 80% by weight with respect to the amount.
In addition, in this specification, the compound illustrated as each component can be used individually or in combination unless there is particular notice.

The photosensitive resin composition of this invention contains resin (A) containing the structural unit which has an alicyclic hydrocarbon structure.
The resin (A) containing a structural unit having an alicyclic hydrocarbon structure used in the photosensitive resin composition of the present invention (hereinafter sometimes referred to as “resin (A)”) is an alicyclic hydrocarbon. A resin containing a structural unit derived from a monomer having a ring. Examples of the alicyclic hydrocarbon structure in the resin (A) of the present invention include a monocyclic hydrocarbon structure such as a cyclopentane structure, a cyclohexane structure, and a cycloheptane structure, a tricyclodecane structure, a trinorbornane structure, an adamantane structure, and the like. And a crosslinked cyclic hydrocarbon structure. Among these, the alicyclic hydrocarbon structure is preferably a crosslinked cyclic hydrocarbon structure, and more preferably a tricyclodecane structure. When the alicyclic hydrocarbon structure is the above structure, the storage stability is excellent, and the resulting pattern tends to be excellent in solvent resistance and heat resistance. In the present specification, the alicyclic hydrocarbon structure includes a structure having a double bond as a bond constituting the ring.

As the resin (A), preferably, for example,
Resin (A2-1): at least one selected from the group consisting of unsaturated carboxylic acids and unsaturated carboxylic anhydrides (a) (hereinafter sometimes referred to as “(a)”) and cyclic having 2 to 4 carbon atoms A copolymer obtained by polymerizing a compound (b) having ether (hereinafter sometimes referred to as “(b)”);
Resin (A2-2): Monomer (c) copolymerizable with (a) and (b) (however, it does not have a cyclic ether having 2 to 4 carbon atoms) (hereinafter referred to as “(c)”) A copolymer obtained by polymerizing (a) and (b),
Resin (A2-3): a copolymer obtained by polymerizing (a) and (c),
Resin (A2-4): The resin obtained by making (b) react with the copolymer formed by superposing | polymerizing (a) and (c) is mentioned. The alicyclic hydrocarbon structure in the resin (A) may have any monomer of (a), (b) or (c), but (b) has an alicyclic hydrocarbon structure. It is preferable to have. The resin (A) is preferably a resin (A2-1), more preferably a resin (A2-1) having an alicyclic hydrocarbon structure derived from (b), and a fat derived from (b). The resin (A2-1) in which the cyclic hydrocarbon structure is a crosslinked cyclic hydrocarbon structure is particularly preferable.

  Of all the structural units of the resin (A), the structural unit derived from the monomer having an alicyclic hydrocarbon structure is preferably 5 to 95 mol%, more preferably 30 to 95 mol%, still more preferably 50. It is preferable to contain -90 mol%, Especially preferably, it contains 60-85 mol%. When the content of the structural unit derived from the monomer having an alicyclic hydrocarbon structure is in the above range, a polymerizable compound (B1) having a carbon-carbon unsaturated bond and an alicyclic hydrocarbon structure; In the combined photosensitive resin composition, when the pattern is formed, the width of the obtained pattern tends not to fluctuate even if the exposure amount fluctuates.

Examples of (a) having an alicyclic hydrocarbon structure include 1,4-cyclohexene dicarboxylic acid;
Methyl-5-norbornene-2,3-dicarboxylic acid, 5-carboxybicyclo [2.2.1] hept-2-ene, 5,6-dicarboxybicyclo [2.2.1] hept-2-ene, 5-carboxy-5-methylbicyclo [2.2.1] hept-2-ene, 5-carboxy-5-ethylbicyclo [2.2.1] hept-2-ene, 5-carboxy-6-methylbicyclo Bicyclounsaturated compounds containing a carboxy group such as [2.2.1] hept-2-ene, 5-carboxy-6-ethylbicyclo [2.2.1] hept-2-ene;
Examples include 5,6-dicarboxybicyclo [2.2.1] hept-2-ene anhydride (hymic acid anhydride).

Furthermore, as (a), in addition to the above, unsaturated monocarboxylic acids such as acrylic acid, methacrylic acid, crotonic acid, o-vinylbenzoic acid, m-vinylbenzoic acid, p-vinylbenzoic acid;
Maleic acid, fumaric acid, citraconic acid, mesaconic acid, itaconic acid, 3-vinylphthalic acid, 4-vinylphthalic acid, 3,4,5,6-tetrahydrophthalic acid, 1,2,3,6-tetrahydrophthalic acid, dimethyl Unsaturated dicarboxylic acids such as tetrahydrophthalic acid;
Maleic anhydride, citraconic anhydride, itaconic anhydride, 3-vinylphthalic anhydride, 4-vinylphthalic anhydride, 3,4,5,6-tetrahydrophthalic anhydride, 1,2,3,6- Unsaturated dicarboxylic acid anhydrides such as tetrahydrophthalic anhydride and dimethyltetrahydrophthalic anhydride;

Unsaturated mono [(meth) acryloyloxyalkyl] esters of polyvalent carboxylic acids such as succinic acid mono [2- (meth) acryloyloxyethyl] and phthalic acid mono [2- (meth) acryloyloxyethyl] Kind;
Examples thereof include unsaturated acrylates containing a hydroxy group and a carboxy group in the same molecule, such as α- (hydroxymethyl) acrylic acid.

Among these, as (a), acrylic acid, methacrylic acid, maleic anhydride and the like are preferably used from the viewpoint of copolymerization reactivity and alkali solubility.
In this specification, “(meth) acrylic acid” represents at least one selected from the group consisting of acrylic acid and methacrylic acid. Notations such as “(meth) acryloyl” and “(meth) acrylate” have the same meaning.

  (B) refers to a polymerizable compound having, for example, a C2-C4 cyclic ether (for example, at least one selected from the group consisting of an oxirane ring, an oxetane ring and a tetrahydrofuran ring (oxolane ring)). (B) is preferably a monomer having a cyclic ether having 2 to 4 carbon atoms and an ethylenic carbon-carbon double bond, and a cyclic ether having 2 to 4 carbon atoms and a (meth) acryloyloxy group. More preferred are monomers having

  Examples of (b) include a monomer (b1) having an oxiranyl group (hereinafter sometimes referred to as “(b1)”), a monomer (b2) having an oxetanyl group (hereinafter referred to as “(b2)”) And a monomer (b3) having a tetrahydrofuryl group (hereinafter sometimes referred to as “(b3)”).

The monomer (b1) having an oxiranyl group refers to a polymerizable compound having an oxiranyl group. (B1) is, for example, a monomer (b1-1) having a structure obtained by epoxidizing an alkene and an ethylenic carbon-carbon double bond (hereinafter sometimes referred to as “(b1-1)”), cycloalkene And a monomer (b1-2) having an epoxidized structure and an ethylenic carbon-carbon double bond (hereinafter sometimes referred to as “(b1-2)”).
(B1) is preferably a monomer having an oxiranyl group and an ethylenic carbon-carbon double bond, more preferably a monomer having an oxiranyl group and a (meth) acryloyloxy group, (B1-2) having an acryloyloxy group is more preferred.

  Specific examples of (b1-1) include glycidyl (meth) acrylate, β-methylglycidyl (meth) acrylate, β-ethylglycidyl (meth) acrylate, glycidyl vinyl ether, o-vinylbenzyl glycidyl ether, m-vinyl. Benzyl glycidyl ether, p-vinylbenzyl glycidyl ether, α-methyl-o-vinylbenzyl glycidyl ether, α-methyl-m-vinylbenzyl glycidyl ether, α-methyl-p-vinylbenzyl glycidyl ether, 2,3-bis ( Glycidyloxymethyl) styrene, 2,4-bis (glycidyloxymethyl) styrene, 2,5-bis (glycidyloxymethyl) styrene, 2,6-bis (glycidyloxymethyl) styrene, 2,3,4-tris ( Glycidyl oxime Chill) styrene, 2,3,5-tris (glycidyloxymethyl) styrene, 2,3,6-tris (glycidyloxymethyl) styrene, 3,4,5-tris (glycidyloxymethyl) styrene, 2,4, Examples thereof include 6-tris (glycidyloxymethyl) styrene and compounds described in JP-A-7-248625.

Examples of (b) having an alicyclic hydrocarbon structure include compounds having a cyclic ether having 2 to 4 carbon atoms and an alicyclic hydrocarbon ring, and those used in the present invention include (b1- 2) is preferred.
Examples of (b1-2) include vinylcyclohexene monooxide, 1,2-epoxy-4-vinylcyclohexane (for example, Celoxide 2000; manufactured by Daicel Chemical Industries, Ltd.), 3,4-epoxycyclohexylmethyl acrylate (for example, cyclone). Mer A400; manufactured by Daicel Chemical Industries, Ltd.), 3,4-epoxycyclohexylmethyl methacrylate (for example, Cyclomer M100; manufactured by Daicel Chemical Industries, Ltd.), a compound represented by formula (I), formula (II) ) And the like. Among these, a compound represented by Formula (I) having a bridged cyclic hydrocarbon structure (tricyclodecane structure) and a compound represented by Formula (II) are preferable. It is preferable to use the compound represented by the formula (I) and the compound represented by the formula (II) because the resulting coating film and pattern have excellent heat resistance and solvent resistance.

[In Formula (I) and Formula (II), R ¹ and R ² each independently represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and the hydrogen atom contained in the alkyl group is a hydroxy group. May be substituted.
X ¹ and X ² each independently represent a single bond, —R ³ —, * —R ³ —O—, * —R ³ —S—, or * —R ³ —NH—.
R ³ represents an alkanediyl group having 1 to 6 carbon atoms.
* Represents a bond with O. ]

Specific examples of the alkyl group having 1 to 4 carbon atoms include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, a sec-butyl group, and a tert-butyl group.
As the hydroxyalkyl group, a hydroxymethyl group, 1-hydroxyethyl group, 2-hydroxyethyl group, 1-hydroxypropyl group, 2-hydroxypropyl group, 3-hydroxypropyl group, 1-hydroxy-1-methylethyl group, Examples include 2-hydroxy-1-methylethyl group, 1-hydroxybutyl group, 2-hydroxybutyl group, 3-hydroxybutyl group, 4-hydroxybutyl group and the like.
R ¹ and R ² are preferably a hydrogen atom, a methyl group, a hydroxymethyl group, a 1-hydroxyethyl group, and a 2-hydroxyethyl group, and more preferably a hydrogen atom and a methyl group.

Examples of the alkanediyl group include methylene group, ethylene group, propane-1,2-diyl group, propane-1,3-diyl group, butane-1,4-diyl group, pentane-1,5-diyl group, hexane- Examples include 1,6-diyl group.
X ¹ and X ² are preferably a single bond, a methylene group, an ethylene group, * —CH ₂ —O— (* represents a bond to O), or * —CH ₂ CH ₂ —O— group. More preferably, a single bond and a * —CH ₂ CH ₂ —O— group are mentioned.

  Examples of the compound represented by the formula (I) include compounds represented by the formula (I-1) to the formula (I-15). Preferably Formula (I-1), Formula (I-3), Formula (I-5), Formula (I-7), Formula (I-9), Formula (I-11) to Formula (I-15) Is mentioned. More preferably, Formula (I-1), Formula (I-7), Formula (I-9), and Formula (I-15) are mentioned.

Examples of the compound represented by the formula (II) include compounds represented by the formula (II-1) to the formula (II-15). Preferably Formula (II-1), Formula (II-3), Formula (II-5), Formula (II-7), Formula (II-9), Formula (II-11) to Formula (II-15) Is mentioned.
More preferably, Formula (II-1), Formula (II-7), Formula (II-9), and Formula (II-15) are mentioned.

  The compound represented by the formula (I) and the compound represented by the formula (II) can be used alone. They can also be mixed in any ratio. In the case of mixing, the mixing ratio is a molar ratio, preferably 5:95 to 95: 5, more preferably 10:90 to 90:10, particularly preferably 20:80 in the formula (I): formula (II). ~ 80: 20.

  The monomer (b2) having an oxetanyl group refers to a polymerizable compound having an oxetanyl group. (B2) is preferably a monomer having an oxetanyl group and an ethylenic carbon-carbon double bond, and more preferably a monomer having an oxetanyl group and a (meth) acryloyloxy group. Examples of (b2) include 3-methyl-3-methacryloyloxymethyl oxetane, 3-methyl-3-acryloyloxymethyl oxetane, 3-ethyl-3-methacryloyloxymethyl oxetane, and 3-ethyl-3-acryloyloxy. Examples include methyl oxetane, 3-methyl-3-methacryloyloxyethyl oxetane, 3-methyl-3-acryloyloxyethyl oxetane, 3-ethyl-3-methacryloyloxyethyl oxetane, and 3-ethyl-3-acryloyloxyethyl oxetane. .

The monomer (b3) having a tetrahydrofuryl group refers to a polymerizable compound having a tetrahydrofuryl group. (B3) is preferably a monomer having a tetrahydrofuryl group and an ethylenic carbon-carbon double bond, and more preferably a monomer having a tetrahydrofuryl group and a (meth) acryloyloxy group.
Specific examples of (b3) include tetrahydrofurfuryl acrylate (for example, Biscoat V # 150, manufactured by Osaka Organic Chemical Industry Co., Ltd.), tetrahydrofurfuryl methacrylate, and the like.

Examples of (c) having an alicyclic hydrocarbon structure include cyclohexyl (meth) acrylate, 2-methylcyclohexyl (meth) acrylate, and tricyclo [5.2.1.0 ^2,6 ] decan-8-yl (meth). Acrylate (referred to in the art as dicyclopentanyl (meth) acrylate as a common name), dicyclopentanyloxyethyl (meth) acrylate, tricyclo [5.2.1.0 ^2,6 ] Decane-3-enyl (meth) acrylate (in the art, it is referred to as dicyclopentenyl (meth) acrylate as a common name), isobornyl (meth) acrylate, adamantyl (meth) acrylate and other (meth) acrylic Acid cyclic alkyl esters;
Bicyclo [2.2.1] hept-2-ene, 5-methylbicyclo [2.2.1] hept-2-ene, 5-ethylbicyclo [2.2.1] hept-2-ene, 5- Hydroxybicyclo [2.2.1] hept-2-ene, 5-hydroxymethylbicyclo [2.2.1] hept-2-ene, 5- (2′-hydroxyethyl) bicyclo [2.2.1] Hept-2-ene, 5-methoxybicyclo [2.2.1] hept-2-ene, 5-ethoxybicyclo [2.2.1] hept-2-ene, 5,6-dihydroxybicyclo [2.2 .1] Hept-2-ene, 5,6-di (hydroxymethyl) bicyclo [2.2.1] hept-2-ene, 5,6-di (2′-hydroxyethyl) bicyclo [2.2. 1] hept-2-ene, 5,6-dimethoxybicyclo [2.2 1] hept-2-ene, 5,6-diethoxybicyclo [2.2.1] hept-2-ene, 5-hydroxy-5-methylbicyclo [2.2.1] hept-2-ene, 5 -Hydroxy-5-ethylbicyclo [2.2.1] hept-2-ene, 5-hydroxymethyl-5-methylbicyclo [2.2.1] hept-2-ene, 5-tert-butoxycarbonylbicyclo [ 2.2.1] Hept-2-ene, 5-cyclohexyloxycarbonylbicyclo [2.2.1] hept-2-ene, 5-phenoxycarbonylbicyclo [2.2.1] hept-2-ene, 5 , 6-bis (tert-butoxycarbonyl) bicyclo [2.2.1] hept-2-ene, 5,6-bis (cyclohexyloxycarbonyl) bicyclo [2.2.1] hept-2-ene, etc. Bicyclo unsaturated compounds; N-cyclohexylmaleimide and the like.
Among these, bicyclo [2.2.1] hept-2-ene, dicyclopentanyl (meth) acrylate, dicyclopentenyl (meth) acrylate and the like are preferable. When having a structural unit derived from these, when forming a pattern, the width of the obtained pattern is unlikely to fluctuate even if the exposure amount fluctuates.

Furthermore, as (c), in addition to the above, for example, methyl (meth) acrylate, ethyl (meth) acrylate, n-butyl (meth) acrylate, sec-butyl (meth) acrylate, tert-butyl (meth) (Meth) acrylic acid alkyl esters such as acrylate;
Aryl (meth) acrylates or aralkyl esters such as phenyl (meth) acrylate and benzyl (meth) acrylate;
Dicarboxylic acid diesters such as diethyl maleate, diethyl fumarate, diethyl itaconate;
Hydroxyalkyl esters such as 2-hydroxyethyl (meth) acrylate and 2-hydroxypropyl (meth) acrylate;
N-phenylmaleimide, N-benzylmaleimide, N-succinimidyl-3-maleimidobenzoate, N-succinimidyl-4-maleimidobutyrate, N-succinimidyl-6-maleimidocaproate, N-succinimidyl-3-maleimidopropionate , Dicarbonylimide derivatives such as N- (9-acridinyl) maleimide;
Styrene, α-methylstyrene, m-methylstyrene, p-methylstyrene, vinyl toluene, p-methoxystyrene, acrylonitrile, methacrylonitrile, vinyl chloride, vinylidene chloride, acrylamide, methacrylamide, vinyl acetate, 1,3-butadiene , Isoprene, 2,3-dimethyl-1,3-butadiene and the like.
Among these, as (c), styrene, N-phenylmaleimide, N-cyclohexylmaleimide, N-benzylmaleimide and the like are preferable from the viewpoint of copolymerization reactivity and alkali solubility.

In resin (A2-1), it is preferable that the ratio of the structural unit derived from each monomer exists in the following ranges with respect to the total number of moles of the structural unit constituting the resin (A2-1).
Structural unit derived from (a); 5 to 60 mol% (more preferably 10 to 50 mol%)
Structural unit derived from (b); 40 to 95 mol% (more preferably 50 to 90 mol%)
When the ratio of the structural unit of the resin (A2-1) is in the above range, storage stability, developability, solvent resistance, heat resistance and mechanical strength tend to be good.

  Resin (A2-1) is, for example, a method described in the document “Experimental Methods for Polymer Synthesis” (Takayuki Otsu, published by Kagaku Dojin Co., Ltd., First Edition, First Edition, issued March 1, 1972) and It can manufacture with reference to the cited reference described in the said literature.

  Specifically, a method in which a predetermined amount of (a) and (b), a polymerization initiator, a solvent, and the like are charged into a reaction vessel, and oxygen is substituted with nitrogen, thereby deoxidizing, stirring, heating, and keeping warm. Is exemplified. In addition, the polymerization initiator, the solvent, and the like used here are not particularly limited, and any of those usually used in the field can be used. For example, as polymerization initiators, azo compounds (2,2′-azobisisobutyronitrile, 2,2′-azobis (2,4-dimethylvaleronitrile), etc.) and organic peroxides (benzoyl peroxide, etc.) Any solvent may be used as long as it dissolves each monomer, and a solvent described later can be used as a solvent for the photosensitive resin composition.

  In addition, the obtained copolymer may use the solution after reaction as it is, a concentrated or diluted solution may be used, and it took out as solid (powder) by methods, such as reprecipitation. Things may be used. In particular, by using the same solvent as the solvent (D) described later as the solvent in this polymerization, the solution after the reaction can be used as it is, and the production process can be simplified.

In resin (A2-2), it is preferable that the ratio of the structural unit derived from each monomer exists in the following ranges with respect to the total number of moles of all structural units constituting the resin (A2-2).
Structural unit derived from (a); 2 to 40 mol% (more preferably 5 to 35 mol%)
Structural unit derived from (b); 2-95 mol% (more preferably 5-80 mol%)
Structural unit derived from (c): 1 to 65 mol% (more preferably 1 to 60 mol%)
When the ratio of the structural unit of the resin (A2-2) is in the above range, storage stability, developability, solvent resistance, heat resistance and mechanical strength tend to be good.
As the resin (A2-2), a resin in which (b) is (b1) is preferable, and a resin in which (b) is (b1-2) is more preferable.
Resin (A2-2) can be manufactured by the same method as resin (A2-1).

In resin (A2-3), it is preferable that the ratio of the structural unit derived from each monomer exists in the following ranges with respect to the total mole number of all the structural units which comprise resin (A2-3).
Structural unit derived from (a); 2 to 40 mol% (more preferably 5 to 35 mol%)
Structural unit derived from (c); 60 to 98 mol% (more preferably 65 to 95 mol%)
When the ratio of the structural unit of the resin (A2-3) is in the above range, storage stability, developability, and solvent resistance tend to be good.
Resin (A2-3) can be manufactured by the method similar to resin (A2-1).

Resin (A2-4) is a resin obtained by reacting (b) with a copolymer of (a) and (c).
Resin (A2-4) can be manufactured through a two-step process, for example. In this case as well, the method described in the above-mentioned document “Experimental Methods for Polymer Synthesis” (Takayuki Otsu Publishing Co., Ltd., Chemical Dojin Co., Ltd., 1st edition, 1st edition, published on March 1, 1972), JP-A-2001-2001 It can be produced with reference to the method described in JP 89533.

First, as a first step, a copolymer of (a) and (c) is obtained in the same manner as in the method for producing the resin (A2-1) described above.
In this case, in the same manner as described above, the obtained copolymer may be used as it is as the solution after the reaction, or may be a concentrated or diluted solution, or a solid ( You may use what was taken out as a powder. Moreover, it is preferable to set it as the polystyrene conversion weight average molecular weight and molecular weight distribution [weight average molecular weight (Mw) / number average molecular weight (Mn)] similar to the above.
However, it is preferable that the ratio of the structural units derived from (a) and (c) is in the following range with respect to the total number of moles of all structural units constituting the copolymer.
Structural unit derived from (a); 5-50 mol% (more preferably 10-45 mol%)
Structural unit derived from (c); 50 to 95 mol% (more preferably 55 to 90 mol%)

Next, as a second stage, the carboxylic acid (a) and a part of the carboxylic anhydride derived from the obtained copolymer are reacted with the cyclic ether (b) described above. (B) is preferably (b1) or (b2), more preferably (b1-1), since the cyclic ether has high reactivity and it is difficult for unreacted (b) to remain.
Specifically, following the above, the atmosphere in the flask was replaced from nitrogen to air, and 5 to 80 mol% (b) of a reaction catalyst of a carboxy group and a cyclic ether with respect to the number of moles of (a) ( For example, tris (dimethylaminomethyl) phenol) is 0.001 to 5% by mass with respect to the total amount of (a), (b) and (c), and a polymerization inhibitor (such as hydroquinone) is (a), 0.001-5 mass% is put in a flask with respect to the total amount of (b) and (c), and it is made to react at 60-130 degreeC for 1 to 10 hours, and resin (A2-4) is obtained. it can. In addition, like the polymerization conditions, the charging method and the reaction temperature can be appropriately adjusted in consideration of the production equipment, the amount of heat generated by the polymerization, and the like.
In this case, the number of moles of (b) is preferably 10 to 75 mole%, more preferably 15 to 70 mole%, with respect to the number of moles of (a). By setting it as this range, there exists a tendency for the balance of storage stability, developability, solvent resistance, heat resistance, mechanical strength, and sensitivity to become favorable.

  The polystyrene equivalent weight average molecular weight of the resin (A) is preferably 3,000 to 100,000, more preferably 5,000 to 50,000, and still more preferably 5,000 to 12,000. In the photosensitive resin composition combined with the polymerizable compound (B1) having a carbon-carbon unsaturated bond and an alicyclic hydrocarbon structure when the weight average molecular weight of the resin (A) is in the above range, the pattern When forming the pattern, there is a tendency that the width of the pattern to be obtained does not easily fluctuate even if the exposure amount varies. In addition, the coating property tends to be good, the film loss of the pixel portion hardly occurs at the time of development, and the non-pixel portion tends to be easily removed.

  The molecular weight distribution [weight average molecular weight (Mw) / number average molecular weight (Mn)] of the resin (A) is preferably 1.1 to 6.0, and more preferably 1.2 to 4.0. When the molecular weight distribution is in the above range, the developability tends to be excellent.

  The acid value of the resin (A) is 20 to 150, preferably 40 to 135, more preferably 50 to 135. Here, the acid value is a value measured as the amount (mg) of potassium hydroxide necessary to neutralize 1 g of the resin (A), and can be determined by titration with an aqueous potassium hydroxide solution.

  The content of the resin (A) is preferably 5 to 95% by mass, more preferably 20 to 80% by mass with respect to the total amount of the resin (A) and the polymerizable compounds (B1) and (B2). More preferably, it is 30-70 mass%, Most preferably, it is 40-60 mass%. When content of resin (A) exists in the said range, there exists a tendency for developability, adhesiveness, solvent resistance, and a mechanical characteristic to become favorable.

The photosensitive resin composition of the present invention contains a polymerizable compound (B1) having a carbon-carbon unsaturated bond and an alicyclic hydrocarbon structure (hereinafter sometimes referred to as “polymerizable compound (B1)”). .
Examples of the alicyclic hydrocarbon structure include monocyclic hydrocarbon structures such as cyclopentane structure, cyclohexane structure and cycloheptane structure, and bridged cyclic hydrocarbon structures such as tricyclodecane structure, trinorbornane structure and adamantane structure. . Among them, the alicyclic hydrocarbon structure contained in the polymerizable compound (B1) is a crosslinked cyclic hydrocarbon structure from the viewpoint of storage stability of the photosensitive resin composition, solvent resistance of the resulting pattern, and heat resistance. And is more preferably a tricyclodecane structure. Moreover, the alicyclic hydrocarbon structure contained in the polymerizable compound (B1) may be the same as or different from the alicyclic hydrocarbon structure contained in the resin (A), but may be the same. More preferred. Here, the difference between the alicyclic hydrocarbon structure contained in the polymerizable compound (B1) and the alicyclic hydrocarbon structure contained in the resin (A) is the presence or absence of a double bond constituting the ring, or two If there are only multiple bonds, they are considered the same. When the alicyclic hydrocarbon structure contained in the polymerizable compound (B1) and the alicyclic hydrocarbon structure contained in the resin (A) are the same structure, the exposure amount fluctuates when forming a pattern. In addition, since the width of the obtained pattern is hardly fluctuated and the compatibility between the polymerizable compound (B1) and the resin (A) is excellent, the resulting pattern and the coating film are excellent in transparency.

  Examples of the carbon-carbon unsaturated bond contained in the polymerizable compound (B1) include an ethylenic carbon-carbon double bond. Specifically, a (meth) acryloyloxy group is preferable, and an acryloyloxy group is more preferable. . Moreover, it is preferable that the polymerizable compound (B1) has two or more carbon-carbon unsaturated bonds in that a pattern can be obtained with high sensitivity.

  Specific examples of the polymerizable compound (B1) include cyclohexyl (meth) acrylate, 3,3,5-trimethylcyclohexyl (meth) acrylate, isobornyl (meth) acrylate, adamantyl (meth) acrylate, and tricyclodecyl. (Meth) acrylate, the compound represented by Formula (B1-1), the compound represented by Formula (B1-2), etc. are mentioned. Among these, the compound represented by the formula (B1-1) and the compound represented by the formula (B1-2) are preferable.

［式（Ｂ１−１）及び（Ｂ１−２）中、Ｒ^２０〜Ｒ^２３は、水素原子又はメチル基を表す。Ｌ^１〜Ｌ^４は、エチレン基又はプロパン−１，２−ジイル基を表す。ｐ１〜ｐ４は、０〜６の整数を表す。］

[In the formulas (B1-1) and (B1-2), R ^{20 to} R ²³ represent a hydrogen atom or a methyl group. L ^{1 to} L ^{4 each} represents an ethylene group or a propane-1,2-diyl group. p1-p4 represents the integer of 0-6. ]

Specific examples of the formula (B1-1) include compounds represented by the following formulas.

中でも、トリシクロデカンジメタノールジアクリレートが好ましい。 Specific examples of the formula (B1-2) include compounds represented by the following formulas.

Among these, tricyclodecane dimethanol diacrylate is preferable.

The photosensitive resin composition of the present invention contains a polymerizable compound (B2) different from (B1).
The polymerizable compound (B2) is a compound that can be polymerized by active radicals generated from the photopolymerization initiator (C), and is, for example, a compound having a polymerizable carbon-carbon unsaturated bond. As the carbon-carbon unsaturated bond, a (meth) acryloyloxy group is preferable, and an acryloyloxy group is more preferable. As the polymerizable compound (B2), a compound having a (meth) acryloyloxy group is preferable, a compound having 3 or more (meth) acryloyloxy groups is more preferable, and a compound having 3 or more acryloyloxy groups is more preferable.

  Examples of the photopolymerizable compound (B2) having one polymerizable carbon-carbon unsaturated bond include the compounds mentioned above as (a), (b) and (c), and among them, (meth) acrylic acid. Esters are preferred.

  Examples of the photopolymerizable compound (B2) having two polymerizable carbon-carbon unsaturated bonds include 1,3-butanediol di (meth) acrylate, 1,3-butanediol (meth) acrylate, 1,6- Hexanediol di (meth) acrylate, ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, tetraethylene glycol di (meth) acrylate, Polyethylene glycol diacrylate, bis (acryloyloxyethyl) ether of bisphenol A, ethoxylated bisphenol A di (meth) acrylate, propoxylated neopentyl glycol di (meth) acrylate, ethoxylated neopentylglycol Ruji (meth) acrylate, 3-methyl-pentanediol di (meth) acrylate.

  Examples of the polymerizable compound (B2) having three or more polymerizable carbon-carbon unsaturated bonds include trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, and tris (2-hydroxyethyl) isocyanurate tris. (Meth) acrylate, ethoxylated trimethylolpropane tri (meth) acrylate, propoxylated trimethylolpropane tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) ) Acrylate, tripentaerythritol tetra (meth) acrylate, tripentaerythritol penta (meth) acrylate, tripentaerythritol hexa (meth) acrylate, tripentaerythritol Intererythritol hepta (meth) acrylate, tripentaerythritol octa (meth) acrylate, reaction product of pentaerythritol tri (meth) acrylate and acid anhydride, reaction product of dipentaerythritol penta (meth) acrylate and acid anhydride, Tripentaerythritol hepta (meth) acrylate and acid anhydride caprolactone modified trimethylolpropane tri (meth) acrylate, caprolactone modified pentaerythritol tri (meth) acrylate, caprolactone modified tris (2-hydroxyethyl) isocyanurate tri (meth) acrylate, Caprolactone modified pentaerythritol tetra (meth) acrylate, caprolactone modified dipentaerythritol penta (meth) acrylate, caprolactone modified Dipentaerythritol hexa (meth) acrylate, caprolactone-modified tripentaerythritol tetra (meth) acrylate, caprolactone-modified tripentaerythritol penta (meth) acrylate, caprolactone-modified tripentaerythritol hexa (meth) acrylate, caprolactone-modified tripentaerythritol hepta (meta ) Acrylate, caprolactone modified tripentaerythritol octa (meth) acrylate, reaction product of caprolactone modified pentaerythritol tri (meth) acrylate and acid anhydride, reaction product of caprolactone modified dipentaerythritol penta (meth) acrylate and acid anhydride And caprolactone-modified tripentaerythritol hepta (meth) acrylate and acid anhydrides. Among these, a tri- or higher functional monomer is preferable, and dipentaerythritol hexa (meth) acrylate is more preferable.

  Content of a polymeric compound (B1) is 5 to 80 mass% with respect to the total amount of a polymeric compound (B1) and polymeric compound (B2), Preferably it is 5 to 65 mass%. % Or less. When the content of the polymerizable compound (B1) is in the above range, the sensitivity, the strength and smoothness of the cured pattern, the reliability, and the mechanical strength tend to be good.

  The total amount of the polymerizable compound (B1) and the polymerizable compound (B2) is preferably 5 to 95% by mass with respect to the total amount of the resin (A), the polymerizable compound (B1) and the polymerizable compound (B2). More preferably, it is 20-80 mass%, More preferably, it is 30-70 mass%, Most preferably, it is 40-60 mass%. When the total amount of the polymerizable compound (B1) and the polymerizable compound (B2) is in the above range, the sensitivity, the strength and smoothness of the cured pattern, the reliability, and the mechanical strength tend to be improved. .

  The photosensitive resin composition of this invention contains a photoinitiator (C).

The photosensitive resin composition of this invention contains a photoinitiator (C). The photopolymerization initiator (C) is not particularly limited as long as it is a compound that initiates polymerization by the action of light, and a known photopolymerization initiator can be used.
Examples of the photopolymerization initiator (C) include acetophenone compounds, oxime compounds, biimidazole compounds, triazine compounds, acylphosphine oxide compounds, and the like. Moreover, you may use the light and / or thermal cationic polymerization initiator (For example, what is comprised from the onium cation and the anion derived from a Lewis acid) described in Unexamined-Japanese-Patent No. 2008-181087.

  The acetophenone compound is a compound having α-hydroxyacetophenone, α-alkoxyacetophenone or α- (N-substituted amino) acetophenone as a partial structure, specifically, diethoxyacetophenone, 2-hydroxy-2-methyl -1-phenylpropan-1-one, benzyldimethyl ketal, 2-hydroxy-1- [4- (2-hydroxyethoxy) phenyl] -2-methylpropan-1-one, 2-hydroxy-1- {4- [4- (2-hydroxy-2-methyl-propionyl) -benzyl] -phenyl} -2-methyl-propan-1-one, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1- (4-methylthiophenyl) 2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino -1- (4-morpholinophenyl) butan-1-one, 2- (2-methylbenzyl) -2-dimethylamino-1- (4-morpholinophenyl) butanone, 2- (3-methylbenzyl) -2- Dimethylamino-1- (4-morpholinophenyl) butanone, 2- (4-methylbenzyl) -2-dimethylamino-1- (4-morpholinophenyl) butanone, 2- (2-ethylbenzyl) -2-dimethylamino -1- (4-morpholinophenyl) butanone, 2- (2-propylbenzyl) -2-dimethylamino-1- (4-morpholinophenyl) butanone, 2- (2-butylbenzyl) -2-dimethylamino-1 -(4-morpholinophenyl) butanone, 2- (2,3-dimethylbenzyl) -2-dimethylamino-1- (4-morpholinophenyl) Thanone, 2- (2,4-dimethylbenzyl) -2-dimethylamino-1- (4-morpholinophenyl) butanone, 2- (2-chlorobenzyl) -2-dimethylamino-1- (4-morpholinophenyl) Butanone, 2- (2-bromobenzyl) -2-dimethylamino-1- (4-morpholinophenyl) butanone, 2- (3-chlorobenzyl) -2-dimethylamino-1- (4-morpholinophenyl) butanone, 2- (4-chlorobenzyl) -2-dimethylamino-1- (4-morpholinophenyl) butanone, 2- (3-bromobenzyl) -2-dimethylamino-1- (4-morpholinophenyl) butanone, 2- (4-Bromobenzyl) -2-dimethylamino-1- (4-morpholinophenyl) butanone, 2- (2-methoxybenzyl) -2-di Methylamino-1- (4-morpholinophenyl) butanone, 2- (3-methoxybenzyl) -2-dimethylamino-1- (4-morpholinophenyl) butanone, 2- (4-methoxybenzyl) -2-dimethylamino -1- (4-morpholinophenyl) butanone, 2- (2-methyl-4-methoxybenzyl) -2-dimethylamino-1- (4-morpholinophenyl) butanone, 2- (2-methyl-4-bromobenzyl) ) -2-dimethylamino-1- (4-morpholinophenyl) butanone, 2- (2-bromo-4-methoxybenzyl) -2-dimethylamino-1- (4-morpholinophenyl) butanone, 2-hydroxy-2 -Methyl-1- [4- (1-methylvinyl) phenyl] propan-1-one oligomer, 2- (dimethylamino) -2- (4-methylphenyl) methyl] -1- [4- (4-morpholinyl) phenyl] butan-1-one, and the like.

  Examples of the oxime compound include N-benzoyloxy-1- (4-phenylsulfanylphenyl) butan-1-one-2-imine, N-ethoxycarbonyloxy-1-phenylpropane-1-one-2-imine, N-benzoyloxy-1- (4-phenylsulfanylphenyl) octane-1-one-2-imine, N-acetoxy-1- [9-ethyl-6- (2-methylbenzoyl) -9H-carbazole-3- Yl] ethane-1-imine, N-acetoxy-1- [9-ethyl-6- {2-methyl-4- (3,3-dimethyl-2,4-dioxacyclopentanylmethyloxy) benzoyl}- 9H-carbazol-3-yl] ethane-1-imine and the like. Commercial products such as Irgacure OXE-01, OXE-02 (manufactured by Ciba Japan), and N-1919 (manufactured by ADEKA) may be used.

  Examples of the biimidazole compound include 2,2′-bis (2-chlorophenyl) -4,4 ′, 5,5′-tetraphenylbiimidazole and 2,2′-bis (2,3-dichlorophenyl) -4. , 4 ′, 5,5′-tetraphenylbiimidazole (see, for example, JP-A-6-75372 and JP-A-6-75373), 2,2′-bis (2-chlorophenyl) -4, 4 ′, 5,5′-tetraphenylbiimidazole, 2,2′-bis (2-chlorophenyl) -4,4 ′, 5,5′-tetra (alkoxyphenyl) biimidazole, 2,2′-bis ( 2-chlorophenyl) -4,4 ′, 5,5′-tetra (dialkoxyphenyl) biimidazole, 2,2′-bis (2-chlorophenyl) -4,4 ′, 5,5′-tetra (trialkoxy) Phenyl) biimidazole (for example, see JP-B-48-38403, JP-A-62-174204, etc.), and the phenyl group at the 4,4′5,5′-position is substituted with a carboalkoxy group. Examples thereof include imidazole compounds (for example, see JP-A-7-10913). Preferably, 2,2′-bis (2-chlorophenyl) -4,4 ′, 5,5′-tetraphenylbiimidazole, 2,2′-bis (2,3-dichlorophenyl) -4,4 ′, 5 Examples include 5'-tetraphenylbiimidazole and 2,2'-bis (2,4-dichlorophenyl) -4,4 ', 5,5'-tetraphenylbiimidazole.

  Examples of the triazine compound include 2,4-bis (trichloromethyl) -6- (4-methoxyphenyl) -1,3,5-triazine, 2,4-bis (trichloromethyl) -6- (4-methoxy Naphthyl) -1,3,5-triazine, 2,4-bis (trichloromethyl) -6-piperonyl-1,3,5-triazine, 2,4-bis (trichloromethyl) -6- (4-methoxystyryl) ) -1,3,5-triazine, 2,4-bis (trichloromethyl) -6- [2- (5-methylfuran-2-yl) ethenyl] -1,3,5-triazine, 2,4- Bis (trichloromethyl) -6- [2- (furan-2-yl) ethenyl] -1,3,5-triazine, 2,4-bis (trichloromethyl) -6- [2- (4-diethylamino-2) -Methylphenyl) Sulfonyl] -1,3,5-triazine, 2,4-bis (trichloromethyl) -6- [2- (3,4-dimethoxyphenyl) ethenyl] -1,3,5-triazine.

  Examples of the acylphosphine oxide compound include 2,4,6-trimethylbenzoyldiphenylphosphine oxide.

  Furthermore, examples of the photopolymerization initiator (C) include benzoin compounds such as benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, and benzoin isobutyl ether; benzophenone, methyl o-benzoylbenzoate, 4-phenylbenzophenone, 4- Benzophenone compounds such as benzoyl-4′-methyldiphenyl sulfide, 3,3 ′, 4,4′-tetra (tert-butylperoxycarbonyl) benzophenone, 2,4,6-trimethylbenzophenone; 9,10-phenance Examples include quinone compounds such as lenquinone, 2-ethylanthraquinone, camphorquinone; 10-butyl-2-chloroacridone, benzyl, methyl phenylglyoxylate, and titanocene compounds. These are preferably used in combination with a photopolymerization initiation assistant (C1) described later.

Moreover, you may use the photoinitiator described in the Japanese translations of PCT publication No. 2002-544205 gazette as a photoinitiator which has the group which can raise | generate chain transfer.
As a photoinitiator which has the group which can raise | generate the said chain transfer, the photoinitiator of following formula (a)-(f) is mentioned, for example.

  The photopolymerization initiator having a group capable of causing chain transfer can also be used as the component (c) constituting the resin (A).

The photopolymerization initiator (C) contained in the photosensitive resin composition of the present invention preferably contains an acetophenone compound, and more preferably contains an oxime compound in addition to the acetophenone compound.
Furthermore, it is preferable to use a photopolymerization initiation assistant (C1) together with the above-described photopolymerization initiator (C). As the photopolymerization initiation assistant (C1), a thioxanthone compound is preferable, and it is particularly preferable to use a thioxanthone compound in combination with a photopolymerization initiator containing an acetophenone compound and an oxime compound. By using these three kinds of compounds as a photopolymerization initiator and a photopolymerization initiation assistant in combination with the above-described polymerization compound (B1), the width of the pattern obtained is less likely to vary even if the exposure dose varies. And a pattern can be obtained with high sensitivity.

  Examples of the thioxanthone compound include 2-isopropylthioxanthone, 4-isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4-dichlorothioxanthone, 1-chloro-4-propoxythioxanthone, and the like.

［式（ＩＩＩ）中、Ｗ^１で示される点線はハロゲン原子で置換されていてもよい炭素数６〜１２の芳香環を表す。
Ｙ^１は、−Ｏ−又は−Ｓ−を表す。
Ｒ^４は、炭素数１〜６の１価の飽和炭化水素基を表す。
Ｒ^５は、ハロゲン原子で置換されていてもよい炭素数１〜１２の飽和炭化水素基またはハロゲン原子で置換されていてもよい炭素数６〜１２のアリール基を表す。］ Furthermore, as the photopolymerization initiation aid (C1), a compound represented by the formula (III) can also be used.

[In the formula (III), a dotted line represented by W ¹ represents an aromatic ring having 6 to 12 carbon atoms which may be substituted with a halogen atom.
Y ¹ represents —O— or —S—.
R ⁴ represents a monovalent saturated hydrocarbon group having 1 to 6 carbon atoms.
R ⁵ represents a saturated hydrocarbon group having 1 to 12 carbon atoms which may be substituted with a halogen atom or an aryl group having 6 to 12 carbon atoms which may be substituted with a halogen atom. ]

Examples of the halogen atom include a fluorine atom, a chlorine atom, and a bromine atom.
Examples of the aromatic ring having 6 to 12 carbon atoms include a benzene ring and a naphthalene ring.

  Examples of the aromatic ring having 6 to 12 carbon atoms that may be substituted with a halogen atom include a benzene ring, a methylbenzene ring, a dimethylbenzene ring, an ethylbenzene ring, a propylbenzene ring, a butylbenzene ring, a pentylbenzene ring, and a hexylbenzene. Ring, cyclohexylbenzene ring, chlorobenzene ring, dichlorobenzene ring, bromobenzene ring, dibromobenzene ring, phenylbenzene ring, chlorophenylbenzene ring, bromophenylbenzene ring, naphthalene ring, chloronaphthalene ring, bromonaphthalene ring, and the like.

  Examples of the saturated hydrocarbon group having 1 to 6 carbon atoms include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, a 1-methylpropyl group, a 2-methylpropyl group, and a tert-butyl group. N-pentyl group, 1-methylbutyl group, 2-methylbutyl group, 3-methylbutyl group, 1,1-dimethylpropyl group, 1,2-dimethylpropyl group, 2,2-dimethylpropyl group, n-hexyl group, Examples include a cyclohexyl group.

  Examples of the saturated hydrocarbon group having 1 to 12 carbon atoms which may be substituted with a halogen atom include, in addition to the above saturated hydrocarbon group having 1 to 6 carbon atoms, a heptyl group, an octyl group, a nonyl group and a decyl group. , Undecyl group, dodecyl group, 1-chlorobutyl group, 2-chlorobutyl group, 3-chlorobutyl group and the like.

  Examples of the aryl group having 6 to 12 carbon atoms which may be substituted with a halogen atom include phenyl group, chlorophenyl group, dichlorophenyl group, bromophenyl group, dibromophenyl group, chlorobromophenyl group, biphenyl group, chlorobiphenyl group, dichloro Biphenyl group, bromophenyl group, dibromophenyl group, naphthyl group, chloronaphthyl group, dichloronaphthyl group, bromonaphthyl group, dibromonaphthyl group and the like can be mentioned.

As the compound represented by the formula (III), specifically,
2- [2-oxo-2- (2-phenyl) ethylidene] -3-methylnaphtho [2,1-d] thiazoline, 2- [2-oxo-2- (2-phenyl) ethylidene] -3-methylnaphtho [ 1,2-d] thiazoline, 2- [2-oxo-2- (2-phenyl) ethylidene] -3-methylnaphtho [2,3-d] thiazoline, 2- [2-oxo-2- (2-naphthyl) ) Ethylidene] -3-methylbenzothiazoline, 2- [2-oxo-2- (1-naphthyl) ethylidene] -3-methylbenzothiazoline, 2- [2-oxo-2- (2-naphthyl) ethylidene]- 3-methyl-5-phenylbenzothiazoline, 2- [2-oxo-2- (1-naphthyl) ethylidene] -3-methyl-5-phenylbenzothiazoline, 2- [2-oxo-2- (2-naphthyl) Ethylidene] -3-methyl-5-fluorobenzothiazoline, 2- [2-oxo-2- (1-naphthyl) ethylidene] -3-methyl-5-fluorobenzothiazoline, 2- [2-oxo-2- ( 2-naphthyl) ethylidene] -3-methyl-5-chlorobenzothiazoline, 2- [2-oxo-2- (1-naphthyl) ethylidene] -3-methyl-5-chlorobenzothiazoline, 2- [2-oxo 2- (2-naphthyl) ethylidene] -3-methyl-5-bromobenzothiazoline, 2- [2-oxo-2- (1-naphthyl) ethylidene] -3-methyl-5-bromobenzothiazoline, 2- [2-oxo-2- (4-phenylphenyl) ethylidene] -3-methylbenzothiazoline, 2- [2-oxo-2- (4-phenylphenyl) ethylidene] 3-methyl-5-phenylbenzothiazoline, 2- [2-oxo-2- (2-naphthyl) ethylidene] -3-methylnaphtho [2,1-d] thiazoline, 2- [2-oxo-2- (2 -Naphthyl) ethylidene] -3-methylnaphtho [1,2-d] thiazoline, 2- [2-oxo-2- (4-phenylphenyl) ethylidene] -3-methylnaphtho [2,1-d] thiazoline, 2- [2-oxo-2- (4-phenylphenyl) ethylidene] -3-methylnaphtho [1,2-d] thiazoline, 2- [2-oxo-2- (4-fluorophenyl) ethylidene] -3-methylnaphtho [ 2,1-d] thiazoline, 2- [2-oxo-2- (4-fluorophenyl) ethylidene] -3-methylnaphtho [1,2-d] thiazoline, 2- [2-oxo-2- (2- Phenyl) ethylidene] -3-methylnaphtho [2,1-d] oxazoline, 2- [2-oxo-2- (2-phenyl) ethylidene] -3-methylnaphtho [1,2-d] oxazoline, 2- [2 -Oxo-2- (2-phenyl) ethylidene] -3-methylnaphtho [2,3-d] oxazoline, 2- [2-oxo-2- (2-naphthyl) ethylidene] -3-methylbenzoxazoline, 2- [2-oxo-2- (1-naphthyl) ethylidene] -3-methylbenzoxazoline, 2- [2-oxo-2- (2-naphthyl) ethylidene] -3-methyl-5-phenylbenzoxazoline, 2- [2-oxo-2- (1-naphthyl) ethylidene] -3-methyl-5-phenylbenzoxazoline, 2- [2-oxo-2- (2-naphthyl) ethylidene] 3-methyl-5-fluorobenzoxazoline, 2- [2-oxo-2- (1-naphthyl) ethylidene] -3-methyl-5-fluorobenzoxazoline, 2- [2-oxo-2- (2-naphthyl) ) Ethylidene] -3-methyl-5-chlorobenzoxazoline, 2- [2-oxo-2- (1-naphthyl) ethylidene] -3-methyl-5-chlorobenzoxazoline, 2- [2-oxo-2- (2-naphthyl) ethylidene] -3-methyl-5-bromobenzoxazoline, 2- [2-oxo-2- (1-naphthyl) ethylidene] -3-methyl-5-bromobenzoxazoline, 2- [2- Oxo-2- (4-phenylphenyl) ethylidene] -3-methylbenzoxazoline, 2- [2-oxo-2- (4-phenylphenyl) ethylidene] 3-methyl-5-phenylbenzoxazoline, 2- [2-oxo-2- (1-naphthyl) ethylidene] -3-methylnaphtho [2,1-d] oxazoline, 2- [2-oxo-2- (1) -Naphthyl) ethylidene] -3-methylnaphtho [1,2-d] oxazoline, 2- [2-oxo-2- (4-phenylphenyl) ethylidene] -3-methylnaphtho [2,1-d] oxazoline, 2- [2-oxo-2- (4-phenylphenyl) ethylidene] -3-methylnaphtho [1,2-d] oxazoline, 2- [2-oxo-2- (4-fluorophenyl) ethylidene] -3-methylnaphtho [ 2,1-d] oxazoline, 2- [2-oxo-2- (4-fluorophenyl) ethylidene] -3-methylnaphtho [1,2-d] oxazoline, and the like.

  Moreover, as the photopolymerization initiation aid (C1), a compound represented by the formula (IV) or the formula (V) may be used.

[In Formula (IV) and Formula (V), Rings W ² , W ³ and Ring W ⁴ are each independently an aromatic ring having 6 to 12 carbon atoms which may be substituted with a halogen atom, or 2 to 2 carbon atoms. 10 heterocycles are represented. Y ^{2 to} Y ⁵ each independently represent —O— or —S—. R ^{6 to} R ⁹ represent a monovalent saturated hydrocarbon group having 1 to 12 carbon atoms or an aryl group having 6 to 12 carbon atoms, and the hydrogen atom contained in the saturated hydrocarbon group and the aryl group is a halogen atom. , May be substituted with a hydroxy group or an alkoxy group having 1 to 6 carbon atoms.

Examples of the aromatic ring include the same aromatic rings as those mentioned in formula (III), and the hydrogen atom contained in the aromatic ring may be optionally substituted with the halogen atoms mentioned above.
Examples of the heterocyclic ring optionally substituted with a halogen atom include a pyridine ring, a pyrimidine ring, a pyridazine ring, a pyrazine ring, and a pyran ring.

Examples of the monovalent hydroxy group-substituted saturated hydrocarbon group include a hydroxymethyl group, a hydroxyethyl group, a hydroxypropyl group, and a hydroxybutyl group.
Examples of the hydroxy group-substituted aryl group include a hydroxyphenyl group and a hydroxynaphthyl group.
Examples of the monovalent alkoxy group-substituted saturated hydrocarbon group include a methoxymethyl group, a methoxyethyl group, a methoxypropyl group, a methoxybutyl group, a butoxymethyl group, an ethoxyethyl group, an ethoxypropyl group, and a propoxybutyl group.
Examples of the alkoxy group-substituted aryl group include a methoxyphenyl group and an ethoxynaphthyl group.

Specific examples of the compounds represented by formula (IV) and formula (V) include
Dialkoxynaphthalenes such as dimethoxynaphthalene, diethoxynaphthalene, dipropoxynaphthalene, diisopropoxynaphthalene, dibutoxynaphthalene;
9,10-dimethoxyanthracene, 2-ethyl-9,10-dimethoxyanthracene, 9,10-diethoxyanthracene, 2-ethyl-9,10-diethoxyanthracene, dipropoxyanthracene, diisopropoxyanthracene, dibutoxyanthracene , Dipentyloxyanthracene, dihexyloxyanthracene, methoxyethoxyanthracene, methoxypropoxyanthracene, methoxyisopropoxyanthracene, methoxybutoxyanthracene, ethoxypropoxyanthracene, ethoxyisopropoxyanthracene, ethoxybutoxyanthracene, propoxyisopropoxyanthracene, propoxybutoxyanthracene, propoxybutoxyanthracene Dialkoxyanthracenes such as butoxyanthracene;
Dialkoxynaphthacenes such as dimethoxynaphthacene, diethoxynaphthacene, dipropoxynaphthacene, diisopropoxynaphthacene, dibutoxynaphthacene;
Etc.

Furthermore, examples of the photopolymerization initiation assistant (C1) include amine compounds and carboxylic acid compounds.
Examples of amine compounds include aliphatic amine compounds such as triethanolamine, methyldiethanolamine, triisopropanolamine, methyl 4-dimethylaminobenzoate, ethyl 4-dimethylaminobenzoate, isoamyl 4-dimethylaminobenzoate, 4-dimethylamino. Of 2-ethylhexyl benzoate, 2-dimethylaminoethyl benzoate, N, N-dimethylparatoluidine, 4,4′-bis (dimethylamino) benzophenone (common name; Michler's ketone), 4,4′-bis (diethylamino) benzophenone Such aromatic amine compounds are mentioned.

  Carboxylic acid compounds include phenylsulfanyl acetic acid, methylphenylsulfanyl acetic acid, ethylphenylsulfanyl acetic acid, methylethylphenylsulfanyl acetic acid, dimethylphenylsulfanyl acetic acid, methoxyphenylsulfanyl acetic acid, dimethoxyphenylsulfanyl acetic acid, chlorophenylsulfanyl acetic acid, dichlorophenylsulfanyl acetic acid, N -Aromatic heteroacetic acids such as phenylglycine, phenoxyacetic acid, naphthylthioacetic acid, N-naphthylglycine and naphthoxyacetic acid.

  The content of the photopolymerization initiator (C) is preferably 0.5 to 30% by mass, more preferably 1 to 20% by mass, further based on the total amount of the resin (A) and the polymerizable compound (B). Preferably it is 2-10 mass%, Most preferably, it is 3-7 mass%. It is preferable that the content of the photopolymerization initiator (C) is in the above range because a pattern can be obtained with high sensitivity.

  The amount of the photopolymerization initiation assistant (C1) used is preferably 0.1 to 10% by mass, more preferably 0.3 to 7% by mass, based on the total amount of the resin (A) and the polymerizable compound (B). %, More preferably 1 to 5% by mass. When the amount of the photopolymerization initiation assistant (C1) is in the above range, a pattern can be obtained with high sensitivity, and the resulting pattern is preferable because the shape is good.

The photosensitive resin composition of the present invention contains a solvent (D).
It does not specifically limit as a solvent (D) used for the photosensitive resin composition of this invention, The solvent normally used in the said field | area can be used. For example, ester solvents (solvents containing —COO—), ether solvents other than ester solvents (solvents containing —O—), ether ester solvents (solvents containing —COO— and —O—), ketones other than ester solvents A solvent (solvent containing —CO—), an alcohol solvent, an aromatic hydrocarbon solvent, an amide solvent, dimethyl sulfoxide, or the like can be selected and used.

  As ester solvents, methyl lactate, ethyl lactate, butyl lactate, methyl 2-hydroxyisobutanoate, ethyl acetate, n-butyl acetate, isobutyl acetate, pentyl formate, isopentyl acetate, butyl propionate, isopropyl butyrate, ethyl butyrate, butyl butyrate Methyl pyruvate, ethyl pyruvate, propyl pyruvate, methyl acetoacetate, ethyl acetoacetate, cyclohexanol acetate, γ-butyrolactone and the like.

  Ether solvents include ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether , Propylene glycol monopropyl ether, propylene glycol monobutyl ether, 3-methoxy-1-butanol, 3-methoxy-3-methylbutanol, tetrahydrofuran, tetrahydropyran, 1,4-dioxane, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethyl Glycol methyl ethyl ether, diethylene glycol dipropyl ether, diethylene glycol dibutyl ether, anisole, phenetole, and the like methyl anisole.

  Examples of ether ester solvents include methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, methyl 3-ethoxypropionate, 3-ethoxy Ethyl propionate, methyl 2-methoxypropionate, ethyl 2-methoxypropionate, propyl 2-methoxypropionate, methyl 2-ethoxypropionate, ethyl 2-ethoxypropionate, methyl 2-methoxy-2-methylpropionate, Ethyl 2-ethoxy-2-methylpropionate, 3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether Acetate, propylene glycol monopropyl ether acetate, ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, diethylene glycol monoethyl ether acetate, and the like diethylene glycol monobutyl ether acetate.

  Examples of ketone solvents include 4-hydroxy-4-methyl-2-pentanone, acetone, 2-butanone, 2-heptanone, 3-heptanone, 4-heptanone, 4-methyl-2-pentanone, cyclopentanone, cyclohexanone, and isophorone. Etc.

  Examples of the alcohol solvent include methanol, ethanol, propanol, butanol, hexanol, cyclohexanol, ethylene glycol, propylene glycol, and glycerin.

  Examples of the aromatic hydrocarbon solvent include benzene, toluene, xylene, mesitylene and the like.

Examples of the amide solvent include N, N-dimethylformamide, N, N-dimethylacetamide, N-methylpyrrolidone and the like.
These solvents may be used alone or in combination of two or more.

  Among the above-mentioned solvents, an organic solvent having a boiling point at 1 atm of 120 ° C. or higher and 180 ° C. or lower is preferable from the viewpoints of coating properties and drying properties. Of these, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, diethylene glycol methyl ethyl ether, 3-methoxybutyl acetate, 3-methoxy-1-butanol and the like are preferable.

  The content of the solvent (D) in the photosensitive resin composition is preferably 60 to 95% by mass and more preferably 70 to 90% by mass with respect to the photosensitive resin composition. In other words, the solid content of the photosensitive resin composition is preferably 5 to 40% by mass, and more preferably 10 to 30% by mass. Here, solid content means the quantity remove | excluding the solvent (D) from the photosensitive resin composition. When the content of the solvent (D) is in the above range, the flatness of the film coated with the photosensitive resin composition tends to be excellent.

  Moreover, the photosensitive resin composition of this invention may contain the polyfunctional thiol compound (T) further. The polyfunctional thiol compound (T) refers to a compound having two or more sulfanyl groups in the molecule. In particular, it is preferable to use a compound having two or more sulfanyl groups bonded to a carbon atom derived from an aliphatic hydrocarbon group because the sensitivity of the photosensitive resin composition is increased.

  Specific examples of the polyfunctional thiol compound (T) include hexanedithiol, decanedithiol, 1,4-bis (methylsulfanyl) benzene, butanediol bis (3-sulfanylpropionate), butanediol bis (3- Sulfanyl acetate), ethylene glycol bis (3-sulfanyl acetate), trimethylolpropane tris (3-sulfanyl acetate), butanediol bis (3-sulfanylpropionate), trimethylolpropane tris (3-sulfanylpropionate), Trimethylolpropane tris (3-sulfanyl acetate), pentaerythritol tetrakis (3-sulfanylpropionate), pentaerythritol tetrakis (3-sulfanyl acetate), trishydro Shiechirutorisu (3-sulfanyl propionate), pentaerythritol tetrakis (3-sulfanyl butyrate), 1,4-bis (3-sulfanyl-butyloxy) include butane and the like.

  The content of the polyfunctional thiol compound (T) is preferably 0.1 to 10% by mass, more preferably 0.5 to 7% by mass with respect to the photopolymerization initiator (C). When the content of the polyfunctional thiol compound (T) is in the above range, the sensitivity of the photosensitive resin composition is increased and the developability tends to be favorable, which is preferable.

  The photosensitive resin composition of the present invention preferably contains a surfactant (E). Examples of the surfactant include a silicone surfactant, a fluorine surfactant, a silicone surfactant having a fluorine atom, and the like.

  Examples of the silicone surfactant include surfactants having a siloxane bond. Specifically, Toray Silicone DC3PA, SH7PA, DC11PA, SH21PA, SH28PA, SH29PA, SH29PA, SH30PA, polyether-modified silicone oil SH8400 (trade name: manufactured by Toray Dow Corning Co., Ltd.), KP321, KP322 , KP323, KP324, KP326, KP340, KP341 (manufactured by Shin-Etsu Chemical Co., Ltd.), TSF400, TSF401, TSF410, TSF4300, TSF4440, TSF4445, TSF-4446, TSF4452, TSF4460 (Momentive Performance Materials Japan GK) Manufactured) and the like.

  Examples of the fluorosurfactant include surfactants having a fluorocarbon chain. Specifically, Florinart (registered trademark) FC430, FC431 (manufactured by Sumitomo 3M Co., Ltd.), MegaFac (registered trademark) F142D, F171, F172, F173, F177, F183, R183 (DIC) ), Ftop (registered trademark) EF301, EF303, EF351, EF351, EF352 (manufactured by Mitsubishi Materials Denkasei), Surflon (registered trademark) S381, S382, SC101, SC105 (Asahi Glass) And E5844 (manufactured by Daikin Fine Chemical Laboratory Co., Ltd.).

  Examples of the silicone-based surfactant having a fluorine atom include surfactants having a siloxane bond and a fluorocarbon chain. Specifically, Megafac (registered trademark) R08, BL20, F475, F477, F443 (manufactured by DIC Corporation) and the like can be mentioned. Preferably, MegaFac (registered trademark) F475 is used.

  Content of surfactant (E) is 0.001-0.2 mass% with respect to the photosensitive resin composition, Preferably it is 0.002-0.1 mass%, More preferably, it is 0.01. It is -0.05 mass%. By containing the surfactant in the above range, the flatness of the coating film can be improved.

  In the photosensitive resin composition of the present invention, various additives such as fillers, other polymer compounds, adhesion promoters, antioxidants, ultraviolet absorbers, light stabilizers, chain transfer agents, etc., are optionally added. May be used in combination.

  The photosensitive resin composition of the present invention does not substantially contain colorants such as pigments and dyes. That is, in the photosensitive resin composition of the present invention, the content of the colorant with respect to the entire composition is, for example, preferably less than 1% by mass, and more preferably less than 0.5% by mass.

  The photosensitive resin composition of the present invention preferably has an average transmittance when filling a quartz cell having an optical path length of 1 cm and measuring the transmittance under a measurement wavelength of 400 to 700 nm using a spectrophotometer. Is 70% or more, more preferably 80% or more.

  When the photosensitive resin composition of the present invention is used as a coating film, the average transmittance of the coating film is preferably 90% or more, and more preferably 95% or more. This average transmittance is measured under the conditions of a measurement wavelength of 400 to 700 nm using a spectrophotometer for a coating film having a thickness of 3 μm after heat curing (for example, 100 to 250 ° C., 5 minutes to 3 hours). It is an average value when measured by. Thereby, the coating film excellent in transparency in the visible light region can be provided.

  The photosensitive resin composition of the present invention is, for example, on a substrate such as a substrate such as glass, metal or plastic, a color filter, various insulating or conductive films, a drive circuit, etc., as described later. It can form as a coating film by apply | coating to. The coating film is preferably dried and cured. Moreover, the photosensitive resin composition of this invention can be apply | coated on a board | substrate, it can pattern to a desired shape, and can also be used as a pattern. Furthermore, these coating films or patterns may be formed and used as part of a component such as a display device.

First, the photosensitive resin composition of the present invention is applied on a substrate.
As described above, the coating can be performed using various coating apparatuses such as a spin coater, a slit & spin coater, a slit coater, an ink jet, a roll coater, and a dip coater.

Next, it is preferable to remove volatile components such as a solvent by drying under reduced pressure and / or pre-baking. Thereby, a smooth uncured coating film can be obtained.
The film thickness of the coating film in this case is not particularly limited and can be appropriately adjusted depending on the material to be used, the use, etc.

Further, the obtained uncured coating film is irradiated with light, for example, ultraviolet rays generated from a mercury lamp or a light emitting diode through a photomask for forming a target pattern. The shape and line width of the pattern formed on the photomask are not particularly limited. It can adjust suitably by using the photomask in which the pattern of the desired shape and line | wire width was formed.
The exposure is performed using a filter that cuts off light in a specific wavelength range (for example, less than 350 nm), a bandpass filter that selectively extracts light in a specific wavelength range (for example, near 436 nm, 408 nm, and 365 nm). You may go. At this time, an apparatus such as a mask aligner or a stepper may be used to accurately align the mask and the substrate.

Thereafter, an uncured coating film irradiated with light is brought into contact with a developer, and a predetermined portion, for example, an unexposed portion is dissolved and developed to obtain a desired pattern shape.
The developing method may be any of a liquid piling method, a dipping method, a spray method, and the like. Further, the substrate may be inclined at an arbitrary angle during development.

The developer used for development is preferably an aqueous solution of an alkaline compound.
The alkaline compound may be either an inorganic or organic alkaline compound.
Specific examples of the inorganic alkaline compound include sodium hydroxide, potassium hydroxide, disodium hydrogen phosphate, sodium dihydrogen phosphate, diammonium hydrogen phosphate, ammonium dihydrogen phosphate, potassium dihydrogen phosphate, sodium silicate, potassium silicate, Examples thereof include sodium carbonate, potassium carbonate, sodium hydrogen carbonate, potassium hydrogen carbonate, sodium borate, potassium borate, and ammonia.

Examples of the organic alkaline compound include tetramethylammonium hydroxide, 2-hydroxyethyltrimethylammonium hydroxide, monomethylamine, dimethylamine, trimethylamine, monoethylamine, diethylamine, triethylamine, monoisopropylamine, diisopropylamine, and ethanolamine. Is mentioned.
The density | concentration in the aqueous solution of these inorganic and organic alkaline compounds becomes like this. Preferably it is 0.01-10 mass%, More preferably, it is 0.03-5 mass%.

The aqueous solution of the alkaline compound may contain a surfactant.
The surfactant may be any of a nonionic surfactant, an anionic surfactant, or a cationic surfactant.
Nonionic surfactants include, for example, polyoxyethylene alkyl ether, polyoxyethylene aryl ether, polyoxyethylene alkyl aryl ether, other polyoxyethylene derivatives, oxyethylene / oxypropylene block copolymers, sorbitan fatty acid esters, polyoxyethylene Examples include ethylene sorbitan fatty acid ester, polyoxyethylene sorbitol fatty acid ester, glycerin fatty acid ester, polyoxyethylene fatty acid ester, and polyoxyethylene alkylamine.

  Examples of the anionic surfactant include higher alcohol sulfates such as sodium lauryl alcohol sulfate and sodium oleyl alcohol sulfate, alkyl sulfates such as sodium lauryl sulfate and ammonium lauryl sulfate, sodium dodecylbenzenesulfonate, and dodecyl sodium sulfate. And alkylaryl sulfonates such as sodium naphthalene sulfonate.

Examples of the cationic surfactant include amine salts or quaternary ammonium salts such as stearylamine hydrochloride and lauryltrimethylammonium chloride.
The concentration of the surfactant in the alkali developer is preferably in the range of 0.01 to 10% by mass, more preferably 0.05 to 8% by mass, and more preferably 0.1 to 5% by mass.

  After development, washing may be performed, and post-baking may be performed as necessary. The post-baking is preferably, for example, a temperature range of 150 to 240 ° C. and 10 to 180 minutes.

  The coating film or pattern thus obtained is useful as, for example, a photospacer used in a liquid crystal display device or a patternable overcoat. In addition, a hole can be formed by using a photomask for forming a hole when exposing an uncured coating film, which is useful as an interlayer insulating film. Furthermore, a transparent film can be formed by performing only the whole surface exposure and heat curing or heat curing without using a photomask when exposing the uncured coating film. This transparent film is useful as an overcoat. Further, it can be used as a member of a display device such as a touch panel. Thereby, it is possible to manufacture a display device having a high-quality coating film or pattern with a high yield.

  The photosensitive resin composition of the present invention includes, for example, a transparent film, a pattern, a photospacer, an overcoat, an insulating film, a liquid crystal alignment control protrusion, a microlens, and a coating layer that constitute a part of a color filter and / or an array substrate. It is suitable for forming etc. Further, a color filter, an array substrate or the like provided with these coating films and / or patterns as a part of its constituent parts, and a display device including these color filters and / or an array substrate, for example, a liquid crystal display device, organic It can be used for EL devices and the like.

  Hereinafter, the present invention will be described in more detail with reference to examples. Unless otherwise specified, “%” and “parts” in the examples are% by mass and parts by mass.

(Synthesis Example 1)
Nitrogen was flowed at 0.02 L / min into a 1 L flask equipped with a reflux condenser, a dropping funnel and a stirrer to form a nitrogen atmosphere, and 140 parts by mass of diethylene glycol ethyl methyl ether was added and heated to 70 ° C. with stirring.
Subsequently, 40 parts by mass of methacrylic acid, 3,4-epoxytricyclo [5.2.1.0 ^2.6 ] decyl acrylate (a compound represented by the formula (I-1) and a formula (II-1) A mixture was prepared by dissolving 360 parts by mass of a mixture of the compounds to be prepared (molar ratio = 50: 50) in 190 parts by mass of diethylene glycol ethyl methyl ether.
The obtained solution was dropped into a flask kept at 70 ° C. for 4 hours using a dropping pump.
On the other hand, a solution prepared by dissolving 30 parts by mass of a polymerization initiator 2,2′-azobis (2,4-dimethylvaleronitrile) in 240 parts by mass of diethylene glycol ethyl methyl ether was added to a flask over another 5 hours using another dropping pump. It was dripped in.
After dropping of the solution of the polymerization initiator was completed, the solution was kept at 70 ° C. for 4 hours, and then cooled to room temperature to obtain a copolymer (resin Aa) solution having a solid content of 42.6%. The weight average molecular weight (Mw) of the obtained resin Aa was 8.0 × 10 ³ , the molecular weight distribution (Mw / Mn) was 1.91, and the acid value in terms of solid content was 60 mg-KOH / g.

(Synthesis Example 2)
In a 1 L flask equipped with a reflux condenser, a dropping funnel and a stirrer, nitrogen was allowed to flow at 0.02 L / min to form a nitrogen atmosphere, and 200 parts by mass of 3-methoxy-1-butanol and 105 parts by mass of 3-methoxybutyl acetate were added. And heated to 70 ° C. with stirring. Next, 60 parts by mass of methacrylic acid, 3,4-epoxytricyclo [5.2.1.0 ^2.6 ] decyl acrylate (a compound represented by the formula (I-1) and a formula (II-1) The compound to be mixed is mixed at a molar ratio of 50:50.) A solution is prepared by dissolving in 240 parts by mass and 140 parts by mass of 3-methoxybutyl acetate, and the solution is added for 4 hours using a dropping funnel. And dropped in a flask kept at 70 ° C. On the other hand, a solution in which 30 parts by mass of a polymerization initiator 2,2′-azobis (2,4-dimethylvaleronitrile) was dissolved in 225 parts by mass of 3-methoxybutyl acetate was added to a flask over another 4 hours using another dropping funnel. It was dripped in. After completion of the dropwise addition of the polymerization initiator solution, the temperature was maintained at 70 ° C. for 4 hours, and then cooled to room temperature to obtain a copolymer (resin Ab) solution having a solid content of 32.6% by mass. The obtained resin Ab had a weight average molecular weight Mw of 1.3 × 10 ⁴ , a molecular weight distribution (Mw / Mn) of 2.50, and an acid value in terms of solid content of 110 mg-KOH / g.

(Synthesis Example 3)
Nitrogen was flowed at 0.02 L / min into a 1 L flask equipped with a reflux condenser, a dropping funnel and a stirrer to form a nitrogen atmosphere, and 140 parts by mass of diethylene glycol ethyl methyl ether was added and heated to 70 ° C. with stirring.
Subsequently, 40 parts by mass of methacrylic acid, 3,4-epoxytricyclo [5.2.1.0 ^2.6 ] decyl acrylate (a compound represented by the formula (I-1) and a formula (II-1) 340 parts by mass of a mixture of compounds to be prepared, molar ratio = 50: 50) and 20 parts by mass of dicyclopentenyl acrylate (compound represented by the following formula (x1)) are dissolved in 190 parts by mass of diethylene glycol ethyl methyl ether to obtain a solution. Was prepared.

The obtained solution was dropped into a flask kept at 70 ° C. for 4 hours using a dropping pump.
On the other hand, a solution prepared by dissolving 30 parts by mass of a polymerization initiator 2,2′-azobis (2,4-dimethylvaleronitrile) in 240 parts by mass of diethylene glycol ethyl methyl ether was added to a flask over another 5 hours using another dropping pump. It was dripped in.
After completion of the dropwise addition of the polymerization initiator solution, the solution was kept at 70 ° C. for 4 hours, and then cooled to room temperature to obtain a copolymer (resin Ac) solution having a solid content of 41.8%. The weight average molecular weight (Mw) of the obtained resin Ac was 9.6 × 10 ³ , the molecular weight distribution (Mw / Mn) was 2.02, and the acid value in terms of solid content was 60 mg-KOH / g.

(Synthesis Example 4)
Nitrogen was flowed at 0.02 L / min into a 1 L flask equipped with a reflux condenser, a dropping funnel and a stirrer to form a nitrogen atmosphere, and 140 parts by mass of diethylene glycol ethyl methyl ether was added and heated to 70 ° C. with stirring.
Subsequently, 40 parts by mass of methacrylic acid, 3,4-epoxytricyclo [5.2.1.0 ^2.6 ] decyl acrylate (a compound represented by the formula (I-1) and a formula (II-1) A mixture of compounds to be dissolved, 320 parts by mass of a molar ratio = 50: 50), 40 parts by mass of dicyclopentanyl acrylate (a compound represented by the following formula (x2)) are dissolved in 190 parts by mass of diethylene glycol ethyl methyl ether, A solution was prepared.

The obtained solution was dropped into a flask kept at 70 ° C. for 4 hours using a dropping pump.
On the other hand, a solution prepared by dissolving 30 parts by mass of a polymerization initiator 2,2′-azobis (2,4-dimethylvaleronitrile) in 240 parts by mass of diethylene glycol ethyl methyl ether was added to a flask over another 5 hours using another dropping pump. It was dripped in.
After dropping of the polymerization initiator solution was completed, the solution was kept at 70 ° C. for 4 hours and then cooled to room temperature to obtain a copolymer (resin Ad) solution having a solid content of 41.8%. The weight average molecular weight (Mw) of the obtained resin Ad was 7.9 × 10 ³ , the molecular weight distribution (Mw / Mn) was 1.82, and the acid value in terms of solid content was 60 mg-KOH / g.

The weight average molecular weight (Mw) and number average molecular weight (Mn) of the obtained resins Aa to Ad were measured under the following conditions using the GPC method.
Apparatus; K2479 (manufactured by Shimadzu Corporation)
Column; SHIMADZU Shim-pack GPC-80M
Column temperature: 40 ° C
Solvent; THF (tetrahydrofuran)
Flow rate: 1.0 mL / min
Detector; RI
The polystyrene-converted weight average molecular weight and number average molecular weight ratio (Mw / Mn) obtained above was defined as molecular weight distribution.

<Preparation of photosensitive resin composition>
Each component was mixed so that it might become a composition shown in Table 1, and the photosensitive resin compositions 1-11 were obtained.

光重合開始剤（Ｃ）；（Ｃａ）；２，２’−ビス（ｏ−クロロフェニル）−４，５，４’，５’−テトラフェニル−１，２’−ビイミダゾール（Ｂ−ＣＩＭ；保土谷化学工業（株）製）
光重合開始剤（Ｃ）；（Ｃｂ）；２−（ジメチルアミノ）−２−［（４−メチルフェニル）メチル］−１−［４−（４−モルホリニル）フェニル］ブタン−１−オン（ＩＲＧＡＣＵＲＥ ３７９ＥＧ；ＢＡＳＦジャパン社製）
光重合開始剤（Ｃ）；（Ｃｃ）；Ｎ−アセトキシ−１−［９−エチル−６−（２−メチルベンゾイル）−９Ｈ−カルバゾール−３−イル］エタン−１−イミン（ＩＲＧＡＣＵＲＥ ＯＸＥ ０２；ＢＡＳＦジャパン社製）
光重合開始助剤（Ｃ１）；（Ｃｄ）；２，４−ジエチルチオキサントン（ＫＡＹＡＣＵＲＥ ＤＥＴＸ−Ｓ；日本化薬（株）製）
光重合開始助剤（Ｃ１）；（Ｃｅ）；２−［２−オキソ−２−（２−ナフチル）エチリデン］−３−メチルベンゾチアゾリン（式（ＩＩＩ−１）で表される化合物）

多官能チオール化合物（Ｔ）；ペンタエリスリトールテトラキス（３−スルファニルプロピオネート）（ＰＥＭＰ；ＳＣ有機化学（株）製）
溶剤（Ｄ）；（Ｄａ）；３-メトキシブタノール
溶剤（Ｄ）；（Ｄｂ）；ジエチレングリコールエチルメチルエーテル
溶剤（Ｄ）；（Ｄｃ）；プロピレングリコールモノメチルエーテルアセテート
溶剤（Ｄ）；（Ｄｄ）；３−エトキシエチルプロピオネート
溶剤（Ｄ）；（Ｄｅ）；３−メトキシブチルアセテート
界面活性剤（Ｅ）；ポリエーテル変性シリコーンオイル（東レ・ダウコーニング（株）製；ＳＨ８４００）
溶剤（Ｄ）は、感光性樹脂組成物の固形分量が表１の「固形分量〔％〕」となるように混合し、溶剤（Ｄ）中の溶剤成分（Ｄａ）〜（Ｄｅ）の値は、溶剤（Ｄ）中での質量比を表す。
界面活性剤（Ｅ）の含有量は、感光性樹脂組成物に対する質量比（％）を表す。 In Table 1, resin (A) represents a mass part in terms of solid content.
Resin (A); (Aa); Resin Aa obtained in Synthesis Example 1
Resin (A); (Ab); Resin Ab obtained in Synthesis Example 2
Resin (A); (Ac); Resin Ac obtained in Synthesis Example 3
Resin (A); (Ad); Resin Ad obtained in Synthesis Example 4
Polymerizable compound (B2); (Ba); dipentaerythritol hexaacrylate (KAYARAD DPHA; manufactured by Nippon Kayaku Co., Ltd.)
Polymerizable compound (B1); (Bb); Tricyclodecane dimethanol diacrylate (KAYARAD R-684; manufactured by Nippon Kayaku Co., Ltd.) (compound having the following structure)

Photopolymerization initiator (C); (Ca); 2,2′-bis (o-chlorophenyl) -4,5,4 ′, 5′-tetraphenyl-1,2′-biimidazole (B-CIM; Tsuchiya Chemical Industry Co., Ltd.)
Photopolymerization initiator (C); (Cb); 2- (dimethylamino) -2-[(4-methylphenyl) methyl] -1- [4- (4-morpholinyl) phenyl] butan-1-one (IRGACURE) 379EG; manufactured by BASF Japan)
Photopolymerization initiator (C); (Cc); N-acetoxy-1- [9-ethyl-6- (2-methylbenzoyl) -9H-carbazol-3-yl] ethane-1-imine (IRGACURE OXE 02; (Made by BASF Japan)
Photopolymerization initiation assistant (C1); (Cd); 2,4-diethylthioxanthone (KAYACURE DETX-S; manufactured by Nippon Kayaku Co., Ltd.)
Photopolymerization initiation assistant (C1); (Ce); 2- [2-oxo-2- (2-naphthyl) ethylidene] -3-methylbenzothiazoline (compound represented by formula (III-1))

Polyfunctional thiol compound (T); pentaerythritol tetrakis (3-sulfanylpropionate) (PEMP; manufactured by SC Organic Chemical Co., Ltd.)
Solvent (D); (Da); 3-methoxybutanol Solvent (D); (Db); Diethylene glycol ethyl methyl ether Solvent (D); (Dc); Propylene glycol monomethyl ether acetate Solvent (D); (Dd); 3 -Ethoxyethyl propionate Solvent (D); (De); 3-methoxybutyl acetate Surfactant (E); Polyether-modified silicone oil (manufactured by Toray Dow Corning Co., Ltd .; SH8400)
The solvent (D) is mixed so that the solid content of the photosensitive resin composition is “solid content [%]” in Table 1, and the values of the solvent components (Da) to (De) in the solvent (D) are Represents a mass ratio in the solvent (D).
The content of the surfactant (E) represents a mass ratio (%) to the photosensitive resin composition.

<Average transmittance of composition>
About the obtained photosensitive resin compositions 1-11, respectively, using an ultraviolet-visible near-infrared spectrophotometer (V-650; manufactured by JASCO Corporation) (quartz cell, optical path length: 1 cm), 400- The average transmittance (%) at 700 nm was measured. The results are shown in Table 1.

<Membrane average transmittance>
Using the obtained photosensitive resin compositions 1 to 11, films were prepared under the following conditions so that the film thickness after curing was 3 μm, respectively.
A 2-inch square glass substrate (# 1737; manufactured by Corning) was sequentially washed with a neutral detergent, water and alcohol and then dried. The curable resin composition was spin-coated on this glass substrate so that the film thickness after post-baking was 3.0 μm, and then pre-baked at 100 ° C. for 3 minutes in a clean oven. Then, it heated at 220 degreeC for 20 minutes and obtained the film | membrane.
About the obtained film | membrane, the average transmittance | permeability (%) in 400-700 nm was measured using the microspectrophotometer (OSP-SP200; OLYMPUS company make). Higher transmittance means less absorption. The results are shown in Table 1.

(Examples 1 to 10 and Comparative Example 1)
<Pattern formation>
A 2-inch square glass substrate (# 1737; manufactured by Corning) was sequentially washed with a neutral detergent, water and alcohol and then dried. On this glass substrate, the photosensitive resin composition is exposed at an exposure amount of 60 mJ / cm ² (based on 365 nm), spin-coated so that the film thickness after development, water washing and post-baking is 3.0 μm, Next, it was pre-baked at 100 ° C. for 2 minutes in a clean oven. After cooling, the distance between the substrate coated with the photosensitive resin composition and the quartz glass photomask was set to 200 μm, and the exposure apparatus (TME-150RSK; manufactured by Topcon Corporation, light source: ultrahigh pressure mercury lamp) atmosphere, was irradiated with light at each exposure amount of 20 mJ / cm ² or 80mJ / cm ² (365nm reference). In addition, irradiation to the photosensitive resin composition at this time was performed by passing the radiated light from the ultrahigh pressure mercury lamp through an optical filter (UV-33; manufactured by Asahi Techno Glass Co., Ltd.). In addition, a photomask having a pattern (having a square light-transmitting portion with one side of 13 μm and a space between the squares of 100 μm) (that is, the light-transmitting portion) formed on the same plane was used as the photomask.
After the light irradiation, the coating film was immersed in an aqueous developer containing 0.12% of a nonionic surfactant and 0.04% of potassium hydroxide for 60 seconds at 25 ° C. A post bake was performed at 15 ° C. for 15 minutes to obtain a pattern.

<Measurement of pattern width>
About the obtained pattern, the pattern width | variety was measured using the three-dimensional non-contact surface shape measuring system (Micromap MM527N-PS-M100; Co., Ltd. Ryoka System company make). The value measured at a portion 5% higher than the substrate surface with respect to the height of the pattern was taken as the pattern width. The results are shown in Table 2.

<Pattern width change>
From the obtained value of the pattern width measurement, exposure 80 mJ / cm ² in forming the pattern width _{(W 80),} the difference between the width of the pattern formed by exposure _{^{20mJ / cm 2 (W 20)}} (W ₈₀ -W ₂₀₎ was calculated. If the difference (W ₈₀ −W ₂₀ ) is small, it can be said that the pattern width hardly changes even if the exposure amount changes. The results are shown in Table 2.

Since the photosensitive resin composition of the present invention has a small difference (W ₈₀ -W ₂₀ ), it was confirmed that the pattern width hardly fluctuates even if the exposure amount fluctuates.
It is possible to improve the yield by forming a pattern using such a photosensitive resin composition and manufacturing a display device using the pattern.

  According to the photosensitive resin composition of the present invention, when forming a pattern, the width of the pattern obtained is less likely to vary even if the exposure amount varies.

Claims (8)

The following (A), (B1), (B2), (C) and (D) are included, and the content of (B1) is 5% by mass or more based on the total amount of (B1) and (B2) A photosensitive resin composition having an amount of 80% by mass or less.
(A): Resin containing a structural unit having an alicyclic hydrocarbon structure (B1): A polymerizable compound having a carbon-carbon unsaturated bond and an alicyclic hydrocarbon structure (B2): different from (B1) Polymerizable compound (C): photopolymerization initiator (D): solvent   The photosensitive resin composition according to claim 1, wherein (C) is a photopolymerization initiator containing an acetophenone compound.   The photosensitive resin composition according to claim 1, wherein the alicyclic hydrocarbon structure is a crosslinked cyclic hydrocarbon structure.   4. The photosensitive resin composition according to claim 1, wherein (B1) is a polymerizable compound having two or more carbon-carbon unsaturated bonds and an alicyclic hydrocarbon structure.   The alicyclic hydrocarbon structure which (A) has and the alicyclic hydrocarbon structure which (B1) has are the same structures, The photosensitive resin composition in any one of Claims 1-4. (A) is an addition polymer containing a structural unit derived from at least one selected from the group consisting of a compound represented by formula (I) and a compound represented by formula (II). The photosensitive resin composition in any one of 1.

[In Formula (I) and Formula (II), R ¹ and R ² each independently represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and the hydrogen atom contained in the alkyl group is a hydroxy group. May be substituted.
X ¹ and X ² each independently represent a single bond, —R ³ —, * —R ³ —O—, * —R ³ —S—, or * —R ³ —NH—.
R ³ represents an alkanediyl group having 1 to 6 carbon atoms.
* Represents a bond with O. ]   The pattern formed using the photosensitive resin composition in any one of Claims 1-6.   A display device comprising the pattern according to claim 7.