JP2012015475A - Wiring board and manufacturing method thereof - Google Patents

Wiring board and manufacturing method thereof Download PDF

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Publication number
JP2012015475A
JP2012015475A JP2010232538A JP2010232538A JP2012015475A JP 2012015475 A JP2012015475 A JP 2012015475A JP 2010232538 A JP2010232538 A JP 2010232538A JP 2010232538 A JP2010232538 A JP 2010232538A JP 2012015475 A JP2012015475 A JP 2012015475A
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Prior art keywords
wiring board
connection terminal
substrate
recess
board according
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JP2010232538A
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JP5717279B2 (en
Inventor
Akira Harao
彰 原尾
Genshin Matsunaga
元辰 松永
Yasuhiro Sugiura
康広 杉浦
Minoru Kubota
実 久保田
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Yazaki Corp
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Yazaki Corp
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Priority to JP2010232538A priority Critical patent/JP5717279B2/en
Priority to CN201110149817.1A priority patent/CN102271459B/en
Priority to US13/152,419 priority patent/US9888558B2/en
Publication of JP2012015475A publication Critical patent/JP2012015475A/en
Priority to US14/289,335 priority patent/US20140268581A1/en
Priority to US14/289,401 priority patent/US9480142B2/en
Application granted granted Critical
Publication of JP5717279B2 publication Critical patent/JP5717279B2/en
Priority to US15/077,211 priority patent/US9980364B2/en
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Abstract

PROBLEM TO BE SOLVED: To provide a wiring board capable of miniaturization and thinning, and its manufacturing method.SOLUTION: The wiring board comprises: a substrate 21 at least one of whose front face or rear face is designated as a mounting surface 21a of various components; a recessed part 26 formed on at least one side edge of the substrate 21; a connection terminal 31 extended from a side surface 26a of the recessed part 26 and bent in a direction orthogonal to the surface of the substrate 21. The connection terminal 31 is a wiring board 11 positioned inside of the side surface of the substrate 21.

Description

本発明は、各種の電気・電子部品が実装される配線基板及びその製造方法に関する。   The present invention relates to a wiring board on which various electric / electronic components are mounted and a method for manufacturing the same.

従来より、各種の電気・電子部品が実装される配線基板として、基板の実装面に立設されて延びる接続端子を有し、この接続端子を、例えば、他の配線基板に接続するものが知られている。例えば、基板のスルーホールにリード端子を挿通、固定して互いの基板を接続する構造や（例えば、特許文献１参照）、配線パターン状に打ち抜かれた金属板と高熱伝導性の複合絶縁材料により少なくとも電子部品の搭載部分を露出した状態で一体成形した回路基板で金属板の一部を他の回路基板との外部接続端子として利用し、外部接続端子に設けた凸部で回路基板を容易に位置規制するようにした構造（例えば、特許文献２参照）などがある。   Conventionally, as a wiring board on which various electric / electronic components are mounted, there is a connection terminal that is erected on the mounting surface of the board and extends, and this connection terminal is connected to, for example, another wiring board. It has been. For example, a structure in which lead terminals are inserted and fixed in through-holes in a substrate to connect the substrates to each other (see, for example, Patent Document 1), a metal plate punched into a wiring pattern, and a highly heat-conductive composite insulating material A circuit board that is integrally molded with at least the electronic component mounting part exposed. Part of the metal plate can be used as an external connection terminal with other circuit boards, and the circuit board can be easily formed with the protrusions provided on the external connection terminals. There is a structure in which the position is regulated (for example, see Patent Document 2).

また、図１５に示すように、基板１の実装面１ａにコネクタ２を配置し、このコネクタ２の接続端子３を基板１の実装面１ａに立設するように接続した配線基板４も知られている（例えば、特許文献３参照）。   Further, as shown in FIG. 15, a wiring board 4 is also known in which a connector 2 is arranged on the mounting surface 1 a of the substrate 1 and the connection terminals 3 of the connector 2 are connected so as to stand on the mounting surface 1 a of the substrate 1. (For example, refer to Patent Document 3).

特開平６−２７５３２８号公報JP-A-6-275328 特開平１０−３０３５２２号公報JP-A-10-303522 特開２００６−３３３５８３号公報JP 2006-333583 A

近年では、さらなる機器の小型化に伴い、機器に搭載される配線基板の小型化及び薄型化が要求されている。   In recent years, with further downsizing of devices, there is a demand for downsizing and thinning of wiring boards mounted on the devices.

しかしながら、上記特許文献１、２の配線基板のように、電気・電子部品を実装する実装面に接続端子を立設させるように設けると、基板の実装面が占有され、必要な電気・電子部品を実装するために基板を大きくせざるを得なくなってしまう。また、特許文献３の配線基板では、実装面上にコネクタを配置させるため、高さが嵩み、基板を小型化しにくい場合がある。   However, if the connection terminals are provided upright on the mounting surface for mounting the electric / electronic component as in the wiring boards of Patent Documents 1 and 2, the mounting surface of the substrate is occupied, and the necessary electric / electronic component In order to mount the board, the board must be enlarged. Moreover, in the wiring board of patent document 3, since a connector is arrange | positioned on a mounting surface, height is bulky and a board | substrate may be difficult to reduce in size.

本発明は、上述した事情に鑑みてなされたものであり、その目的は、小型化及び薄型化を図ることが可能な配線基板及びその製造方法を提供することにある。   The present invention has been made in view of the above-described circumstances, and an object thereof is to provide a wiring board that can be reduced in size and thickness and a method for manufacturing the same.

前述した目的を達成するために、本発明に係る配線基板は、下記（１）〜（７）を特徴としている。
（１） 表面及び裏面の少なくとも一方の面が各種部品の実装面とされた基板と、前記基板の少なくとも一側縁部に形成された凹部と、前記凹部の側面部から延出し、前記基板の面に対して直交する方向へ屈曲された接続端子と、を備え、前記接続端子は、前記基板の側面の内側に位置していること。
（２） 上記（１）の構成の配線基板において、前記接続端子の屈曲部分が側面視で円弧状に湾曲した湾曲部とされていること。
（３） 上記（１）または（２）の構成の配線基板において、前記接続端子は、前記凹部の長手方向の側面部に複数個配置され、該複数の接続端子のうち、少なくとも２個の接続端子は基板内部で電気的に接続されていること。
（４） 上記（１）〜（３）のいずれかの構成の配線基板において、前記基板は内部に高熱伝導層を備え、該高熱伝導層と前記接続端子が同一層に形成されていること。
（５） 上記（１）〜（４）のいずれかの構成の配線基板において、前記接続端子は、前記基板に対して間隔をあけて並設される他の配線基板に接続されること。
（６） 上記（５）の構成の配線基板において、前記接続端子には、前記基板に対して間隔をあけた位置に前記他の配線基板を支持する支持片が側方へ突出して設けられていること。
（７） 上記（１）〜（４）のいずれかの構成の配線基板において、前記凹部には、コネクタを構成するハウジングが配置され、前記ハウジングに前記接続端子が収容されること。 In order to achieve the above-described object, a wiring board according to the present invention is characterized by the following (1) to (7).
(1) A substrate in which at least one of the front surface and the back surface is a mounting surface for various components, a recess formed in at least one side edge of the substrate, and a side surface of the recess, A connection terminal bent in a direction orthogonal to the surface, and the connection terminal is located inside the side surface of the substrate.
(2) In the wiring board configured as described in (1) above, the bent portion of the connection terminal is a curved portion that is curved in an arc shape in a side view.
(3) In the wiring board configured as described in (1) or (2) above, a plurality of the connection terminals are arranged on the side surface in the longitudinal direction of the recess, and at least two of the plurality of connection terminals are connected. Terminals must be electrically connected inside the board.
(4) In the wiring substrate having any one of the constitutions (1) to (3), the substrate includes a high heat conductive layer therein, and the high heat conductive layer and the connection terminal are formed in the same layer.
(5) In the wiring board having any one of the constitutions (1) to (4), the connection terminal is connected to another wiring board arranged in parallel with a space from the board.
(6) In the wiring board configured as described in (5) above, the connection terminal is provided with a support piece projecting laterally to support the other wiring board at a position spaced from the board. Being.
(7) In the wiring board having any one of the constitutions (1) to (4), a housing that constitutes a connector is disposed in the recess, and the connection terminal is accommodated in the housing.

上記（１）の構成の配線基板では、接続端子が、基板の少なくとも一側縁部に形成された凹部の側面部から延出するとともに、基板の面に対して直交する方向へ屈曲されているので、実装面に接続端子を設ける場合と比較して、接続端子による実装面の占有を極力抑えて小型化を図ることができる。また、接続端子を、例えば、コネクタ等の部品に収容させる場合においても、その部品を凹部に配置することができるので、実装面に部品を配置させる場合と比較して、高さ寸法を抑えることができる。つまり、さらなる小型化及び薄型化が要求されている機器に搭載する配線基板として極めて好適である。
上記（２）の構成の配線基板では、接続端子の屈曲部分が側面視で円弧状に湾曲した湾曲部とされているので、接続端子に作用する外力や応力を湾曲部によって良好に吸収させることができ、接続端子の基板との固定箇所や接続端子の他の部品や基板等との接続箇所へ無理な力が作用して損傷するような不具合をなくすことができる。
上記（３）の構成の配線基板では、複数の接続端子のうち少なくとも２個の接続端子が互いに電気的に接続されるので、この２個の接続端子を基板の表面で接続するための回路パターンを配索する必要がなく、基板上の各種部品を搭載するスペースを小さくすることができ、配線基板を小型化することができる。
上記（４）の構成の配線基板では、高熱伝導層と接続端子を同一層として形成するので、これら高熱伝導層と接続端子を同一の工程で作製することができ、配線基板の作製工程を低減することができる。
上記（５）の構成の配線基板では、接続端子が、基板の凹部の側面部から延出されているので、配線基板に並設させる他の配線基板として同等の大きさ、または小さいものを用いることができ、小型化を図ることができる。
上記（６）の構成の配線基板では、スペーサ等の部品や治具を用いることなく、他の配線基板を支持して所定の間隔をあけた位置に位置決めすることができる。これにより、配線基板に他の配線基板を並設させる場合に、配線基板に対して他の配線基板を、容易に所定の間隔をあけた位置に配置させて半田付け等によって接続端子と接続させることができる。したがって、他の配線基板の接続作業時間の短縮による製造コストの削減を図ることができる。
上記（７）の構成の配線基板では、コネクタを構成するハウジングが凹部に配置されているので、実装面にハウジングを配置させる場合と比較して、高さ寸法を抑えて薄型化を図ることができる。 In the wiring substrate having the configuration (1), the connection terminal extends from the side surface portion of the recess formed in at least one side edge portion of the substrate and is bent in a direction perpendicular to the surface of the substrate. Therefore, as compared with the case where the connection terminal is provided on the mounting surface, it is possible to reduce the size by minimizing the occupation of the mounting surface by the connection terminal. In addition, when the connection terminal is accommodated in a component such as a connector, for example, the component can be disposed in the recess, so that the height dimension is suppressed as compared with the case where the component is disposed on the mounting surface. Can do. That is, it is extremely suitable as a wiring board to be mounted on a device that is required to be further reduced in size and thickness.
In the wiring board having the configuration (2), since the bent portion of the connection terminal is a curved portion that is curved in an arc shape when viewed from the side, external force and stress acting on the connection terminal can be favorably absorbed by the curved portion. Thus, it is possible to eliminate such a problem that an excessive force is applied to the connection terminal where the connection terminal is fixed to the board or the connection terminal is connected to another part of the connection terminal or the board.
In the wiring board configured as described in (3) above, at least two of the plurality of connection terminals are electrically connected to each other, and therefore a circuit pattern for connecting the two connection terminals on the surface of the board. It is not necessary to route the wiring board, the space for mounting various components on the board can be reduced, and the wiring board can be miniaturized.
In the wiring board having the configuration (4), since the high thermal conductive layer and the connection terminal are formed as the same layer, the high thermal conductive layer and the connection terminal can be manufactured in the same process, and the manufacturing process of the wiring board is reduced. can do.
In the wiring board having the configuration (5), since the connection terminal extends from the side surface portion of the concave portion of the board, a wiring board having the same size or a smaller size is used as another wiring board arranged in parallel with the wiring board. And miniaturization can be achieved.
In the wiring board having the configuration (6), other wiring boards can be supported and positioned at predetermined intervals without using components such as spacers or jigs. As a result, when another wiring board is arranged on the wiring board, the other wiring board is easily arranged at a predetermined interval with respect to the wiring board and connected to the connection terminal by soldering or the like. be able to. Therefore, the manufacturing cost can be reduced by shortening the connection work time of other wiring boards.
In the wiring board having the configuration (7), since the housing constituting the connector is disposed in the recess, the height can be reduced and the thickness can be reduced as compared with the case where the housing is disposed on the mounting surface. it can.

また、上述した目的を達成するために、本発明に係る配線基板の製造方法は、下記（８）または（９）を特徴としている。
（８） 表面及び裏面の少なくとも一方の面が各種部品の実装面とされた基板と、前記基板の少なくとも一側縁部に形成された凹部と、前記凹部の側面部から延出し、前記基板の面に対して直交する方向へ屈曲された接続端子とを備える配線基板の製造方法であって、前記接続端子となる導電性の金属板の表裏に絶縁層を積層させて前記基板を形成する基板形成工程と、前記基板の前記凹部の形成箇所における前記絶縁層を除去して前記金属板を露出させる金属板露出工程と、露出させた前記金属板を加工して前記凹部及び前記接続端子を形成する接続端子形成工程と、を含むこと。
（９） 上記（８）の配線基板の製造方法における前記接続端子形成工程において、前記接続端子に、側方へ突出する支持片を形成すること。 In order to achieve the above-described object, the method for manufacturing a wiring board according to the present invention is characterized by the following (8) or (9).
(8) A substrate in which at least one of the front surface and the back surface is a mounting surface for various components, a recess formed in at least one side edge of the substrate, and a side surface of the recess, A method of manufacturing a wiring board comprising a connection terminal bent in a direction perpendicular to the surface, wherein the substrate is formed by laminating insulating layers on the front and back of a conductive metal plate to be the connection terminal A metal plate exposing step of exposing the metal plate by removing the insulating layer in the formation portion of the concave portion of the substrate; and processing the exposed metal plate to form the concave portion and the connection terminal. And a connecting terminal forming step.
(9) In the connection terminal forming step in the method for manufacturing a wiring board according to (8), a support piece protruding laterally is formed on the connection terminal.

上記（８）の構成の配線基板の製造方法では、基板の少なくとも一側縁部に形成された凹部の側面部から接続端子が延出された、小型化及び薄型化が可能な配線基板を容易に製造することができる。
上記（９）の構成の配線基板の製造方法では、接続端子成形工程において、支持片が両側方へ突出された接続端子を形成するので、他の配線基板を位置決めして容易に接続することが可能な配線基板を容易に製造することができる。 In the method for manufacturing a wiring board having the above configuration (8), it is possible to easily reduce the size and thickness of the wiring board by extending the connection terminal from the side surface of the recess formed in at least one side edge of the board. Can be manufactured.
In the method of manufacturing the wiring board having the configuration of (9), since the support piece forms the connection terminal protruding to both sides in the connection terminal forming step, the other wiring board can be positioned and easily connected. Possible wiring boards can be easily manufactured.

本発明によれば、小型化及び薄型化を図ることが可能な配線基板及びその製造方法を提供できる。   ADVANTAGE OF THE INVENTION According to this invention, the wiring board which can achieve size reduction and thickness reduction, and its manufacturing method can be provided.

以上、本発明について簡潔に説明した。更に、以下に説明される発明を実施するための形態を添付の図面を参照して通読することにより、本発明の詳細は更に明確化されるであろう。   The present invention has been briefly described above. Further, details of the present invention will be further clarified by reading through the modes for carrying out the invention described below with reference to the accompanying drawings.

本発明の実施形態に係る配線基板の斜視図である。1 is a perspective view of a wiring board according to an embodiment of the present invention. 本発明の実施形態に係る配線基板の一部の断面図である。It is a partial sectional view of a wiring board concerning an embodiment of the present invention. 配線基板を構成する基板の構造を示す断面図である。It is sectional drawing which shows the structure of the board | substrate which comprises a wiring board. 配線基板の一部の平面図である。It is a top view of a part of wiring board. 他の配線基板を並設させた本実施形態の配線基板の一部の断面図である。It is sectional drawing of a part of wiring board of this embodiment which arranged other wiring boards side by side. コネクタを装着した本実施形態の配線基板の斜視図である。It is a perspective view of the wiring board of this embodiment equipped with a connector. 本発明の実施形態の変形例に係る配線基板の斜視図である。It is a perspective view of the wiring board which concerns on the modification of embodiment of this invention. 本発明の実施形態の変形例に係る配線基板の一部の断面図である。It is a partial sectional view of a wiring board concerning a modification of an embodiment of the present invention. 本実施形態の変形例に係る配線基板の接続端子部分における斜視図である。It is a perspective view in the connecting terminal part of the wiring board concerning the modification of this embodiment. 本実施形態の変形例に係る配線基板に他の配線基板を並設した状態を説明する図であって、（ａ）は他の配線基板の支持箇所における下方側から視た斜視図、（ｂ）はその側面図である。It is a figure explaining the state which arranged other wiring boards in parallel with the wiring board concerning the modification of this embodiment, and (a) is a perspective view seen from the lower part side in the support part of other wiring boards, (b) ) Is a side view thereof. 他の配線基板を並設させた本実施形態の変形例に係る配線基板の一部の断面図である。It is a partial sectional view of a wiring board concerning a modification of this embodiment in which other wiring boards are arranged in parallel. 配線基板の変形例を示す一部の平面図である。It is a partial top view which shows the modification of a wiring board. 配線基板の変形例を示す一部の平面図である。It is a partial top view which shows the modification of a wiring board. 本発明の配線基板の製造工程を説明する図であって、（ａ）〜（ｆ）は、それぞれ製造途中の配線基板の平面図及び断面図である。It is a figure explaining the manufacturing process of the wiring board of this invention, Comprising: (a)-(f) is the top view and sectional drawing of a wiring board in the middle of manufacture, respectively. 従来の配線基板の実装例を示す配線基板の斜視図である。It is a perspective view of the wiring board which shows the example of mounting of the conventional wiring board.

以下、本発明に係る実施形態の例を、図面を参照して説明する。
図１は本発明の実施形態に係る配線基板の斜視図、図２は本発明の実施形態に係る配線基板の一部の断面図、図３は配線基板を構成する基板の構造を示す断面図、図４は配線基板の一部の平面図である。 Hereinafter, examples of embodiments according to the present invention will be described with reference to the drawings.
1 is a perspective view of a wiring board according to an embodiment of the present invention, FIG. 2 is a partial cross-sectional view of the wiring board according to the embodiment of the present invention, and FIG. 3 is a cross-sectional view illustrating the structure of the board constituting the wiring board. FIG. 4 is a plan view of a part of the wiring board.

図１及び図２に示したように、本実施形態の配線基板１１は、基板２１と、この基板２１に設けられた複数の接続端子３１とを備えている。   As shown in FIGS. 1 and 2, the wiring board 11 of this embodiment includes a board 21 and a plurality of connection terminals 31 provided on the board 21.

図３に示したように、基板２１は、厚さ方向の中央に、銅または銅合金などから形成された板状の金属コア（高熱伝導層）２２を有し、この金属コア２２の表裏面に、熱硬化性及び絶縁性を有する合成樹脂などからなる絶縁層２３が形成されている。そして、絶縁層２３の表面に、回路パターン２４が形成され、その表面がレジスト層２５で覆われている。つまり、この基板２１は、金属コア２２が設けられて放熱性及び均熱性に優れた金属コア基板であり、図２に示したように、その表裏面が、回路パターン２４を有する実装面２１ａとされ、この実装面２１ａに各種の電気・電子部品１２が実装される。この金属コア基板である基板２１において生じた電気・電子部品１２等の熱は、金属コア２２によって円滑に均熱されて外部に放熱される。   As shown in FIG. 3, the substrate 21 has a plate-like metal core (high thermal conductive layer) 22 formed of copper or a copper alloy at the center in the thickness direction. In addition, an insulating layer 23 made of a synthetic resin having thermosetting properties and insulating properties is formed. A circuit pattern 24 is formed on the surface of the insulating layer 23, and the surface is covered with a resist layer 25. That is, the substrate 21 is a metal core substrate that is provided with the metal core 22 and is excellent in heat dissipation and heat uniformity. As shown in FIG. 2, the front and back surfaces of the substrate 21 are the mounting surface 21a having the circuit pattern 24. Various electrical / electronic components 12 are mounted on the mounting surface 21a. The heat of the electric / electronic component 12 and the like generated on the substrate 21 which is the metal core substrate is smoothly heated by the metal core 22 and radiated to the outside.

図１および図４に示したように、本実施形態の配線基板１１は、基板２１の両側縁部にそれぞれ凹部２６が形成されており、これらの凹部２６の長手方向の側面部２６ａから複数の接続端子３１が整列状態で延出されている。これらの接続端子３１は、例えば、基板２１に形成されたスルーホール（図示略）によって回路パターン２４と導通されている。   As shown in FIG. 1 and FIG. 4, the wiring board 11 of this embodiment has recesses 26 formed on both side edges of the substrate 21, and a plurality of the side surfaces 26 a in the longitudinal direction of these recesses 26. The connection terminal 31 extends in an aligned state. These connection terminals 31 are electrically connected to the circuit pattern 24 by, for example, through holes (not shown) formed in the substrate 21.

接続端子３１は、金属コア２２と同じ銅または銅合金などの導電性を有する金属材料から形成されたもので、絶縁層２３によって挟持されて固定され、金属コア２２と同一層に形成されている。   The connection terminal 31 is formed from the same conductive metal material as the metal core 22, such as copper or copper alloy, and is sandwiched and fixed by the insulating layer 23 and formed in the same layer as the metal core 22. .

これらの接続端子３１は、図２および図４に示したように、基板２１に固定された固定部３２と、凹部２６の側面部２６ａから延出された端子部３３とを有しており、端子部３３は、基板２１の表面に対して直交する上方向へ屈曲されている。また、この接続端子３１の端子部３３の屈曲部分は、側面視で円弧状に湾曲した湾曲部３４として構成されている。本発明において、接続端子３１は、基板２１の凹部２６に設けられ、その端子部３３は基板２１の側面の内側に位置している。   As shown in FIGS. 2 and 4, these connection terminals 31 have a fixing portion 32 fixed to the substrate 21 and a terminal portion 33 extending from the side surface portion 26 a of the recess 26. The terminal portion 33 is bent in an upward direction perpendicular to the surface of the substrate 21. Further, the bent portion of the terminal portion 33 of the connection terminal 31 is configured as a curved portion 34 that is curved in an arc shape when viewed from the side. In the present invention, the connection terminal 31 is provided in the concave portion 26 of the substrate 21, and the terminal portion 33 is located inside the side surface of the substrate 21.

上記構成の配線基板１１では、例えば、接続端子３１を他の配線基板へ接続したり、あるいは、接続端子３１に、コネクタ等の部品が装着される。   In the wiring board 11 configured as described above, for example, the connection terminal 31 is connected to another wiring board, or a component such as a connector is mounted on the connection terminal 31.

この配線基板１１によれば、接続端子３１が、凹部２６の側面部２６ａから延出されているので、実装面２１ａに接続端子３１を設ける場合と比較して、接続端子３１による実装面２１ａの占有を極力抑えて小型化を図ることができる。また、接続端子３１に、例えば、コネクタ等の部品を装着させる場合においても、その部品を凹部２６に配置することができるので、実装面２１ａに部品を配置させる場合と比較して、高さ寸法を抑えることができる。つまり、機器等への収容性を高め、小型化及び薄型化が要求されている機器に搭載する配線基板として極めて好適なものとすることができる。   According to this wiring board 11, since the connection terminal 31 extends from the side surface portion 26 a of the recess 26, compared to the case where the connection terminal 31 is provided on the mounting surface 21 a, the mounting surface 21 a by the connection terminal 31 is provided. Minimization can be achieved by minimizing the occupation. Further, even when a component such as a connector is mounted on the connection terminal 31, for example, since the component can be disposed in the recess 26, the height dimension is compared with the case where the component is disposed on the mounting surface 21a. Can be suppressed. In other words, it is possible to increase the capacity to be accommodated in a device or the like and to be extremely suitable as a wiring board mounted on a device that is required to be downsized and thinned.

また、この配線基板１１によれば、接続端子３１が、凹部２６の側面部２６ａから基板２１の面に対して直交する方向へ屈曲され、その屈曲部分が側面視で円弧状に湾曲した湾曲部３４とされているので、接続端子３１に作用する外力や応力を湾曲部３４によって良好に吸収させることができる。例えば、配線基板１１を収容した機器を自動車等の車両へ搭載したとしても、走行時等における振動が湾曲部３４によって円滑に吸収され、また、接続端子３１を他の部品等に接続する際に寸法ずれがあったとしても、寸法ずれによって生じる応力が湾曲部３４によって円滑に吸収される。   Further, according to the wiring substrate 11, the connection terminal 31 is bent in a direction orthogonal to the surface of the substrate 21 from the side surface portion 26a of the recess 26, and the bent portion is curved in an arc shape in a side view. Therefore, the external force and stress acting on the connection terminal 31 can be satisfactorily absorbed by the curved portion 34. For example, even when a device containing the wiring board 11 is mounted on a vehicle such as an automobile, vibrations during running and the like are smoothly absorbed by the curved portion 34, and when the connection terminal 31 is connected to other components or the like. Even if there is a dimensional deviation, the stress caused by the dimensional deviation is smoothly absorbed by the curved portion 34.

このように、接続端子３１に湾曲部３４が形成されているので、接続端子３１の基板２１との固定箇所や接続端子３１の端子部３３の半田付け等による接続箇所へ無理な力が作用して損傷するような不具合をなくすことができる。   As described above, since the curved portion 34 is formed on the connection terminal 31, an unreasonable force acts on the connection portion 31 where the connection terminal 31 is fixed to the substrate 21 or the connection portion where the terminal portion 33 of the connection terminal 31 is soldered. Can be eliminated.

図５は、上記の配線基板１１に他の配線基板４１を並設させて接続した状態を示す図である。図５に示したように、配線基板１１の接続端子３１の端子部３３が、基板２１に対して間隔をあけて並設される他の配線基板４１に半田付け等によって接続される。   FIG. 5 is a diagram showing a state in which another wiring board 41 is juxtaposed and connected to the wiring board 11 described above. As shown in FIG. 5, the terminal portion 33 of the connection terminal 31 of the wiring board 11 is connected to another wiring board 41 arranged in parallel with a gap with respect to the board 21 by soldering or the like.

ここで、本発明の配線基板１１の接続端子３１は、基板２１の凹部２６を構成する側面部２６ａから延出し、その端子部３３は基板２１の面と直交する方向へ屈曲されることにより、接続端子３１が凹部２６に配置されることになるので、接続端子３１の他の配線基板４１との接続位置を、配線基板１１の縁部よりも内側にすることができ、よって、配線基板１１に並設させる他の配線基板４１として、配線基板１１と同等の大きさの配線基板４１、または配線基板１１よりも小さい配線基板４１を並設させることができ、小型化を図ることができる。   Here, the connection terminal 31 of the wiring substrate 11 of the present invention extends from the side surface portion 26a constituting the recess 26 of the substrate 21, and the terminal portion 33 is bent in a direction perpendicular to the surface of the substrate 21, Since the connection terminal 31 is disposed in the recess 26, the connection position of the connection terminal 31 with the other wiring board 41 can be set inside the edge of the wiring board 11. As another wiring board 41 arranged side by side, a wiring board 41 having a size equivalent to that of the wiring board 11 or a wiring board 41 smaller than the wiring board 11 can be arranged side by side, and downsizing can be achieved.

図６は、上記の配線基板１１にコネクタ４５を設けた例である。コネクタ４５は、各電子機器や電源等に設けられた相手側のコネクタに接続される。図６に示したように、この配線基板１１では、周囲の四辺の側縁部に凹部２６が形成されており、これらの凹部２６に、コネクタ４５を構成するハウジング４６が配置されている。そして、これらのハウジング４６に、凹部２６の側面部２６ａから延出された接続端子３１が収容されている。このように、凹部２６にコネクタ４５のハウジング４６が配置された配線基板１１によれば、高さ寸法を抑えて薄型化を図ることができる。例えば、実装面２１ａにハウジング４６を配置させる場合では、基板２１及びハウジング４６の厚み以上の高さ寸法となるが、本実施形態の配線基板１１では、高さ寸法をハウジング４６の厚みだけに抑えることができる。   FIG. 6 shows an example in which a connector 45 is provided on the wiring board 11. The connector 45 is connected to a mating connector provided in each electronic device or power source. As shown in FIG. 6, in this wiring board 11, recesses 26 are formed in the side edges of the four surrounding sides, and a housing 46 that constitutes a connector 45 is disposed in these recesses 26. The housing 46 accommodates the connection terminal 31 extending from the side surface portion 26 a of the recess 26. Thus, according to the wiring board 11 in which the housing 46 of the connector 45 is disposed in the recess 26, the height can be suppressed and the thickness can be reduced. For example, when the housing 46 is disposed on the mounting surface 21a, the height is equal to or greater than the thickness of the substrate 21 and the housing 46. However, in the wiring board 11 of the present embodiment, the height is limited to the thickness of the housing 46. be able to.

尚、本発明の配線基板１１によれば、基板２１の縁部に複数の凹部２６を形成し、その凹部２６に接続端子３１を設けておけば、配線基板１１に他の配線基板４１とコネクタ４５を同時に設けることができる。例えば、本発明の配線基板１１を２枚用い、これら配線基板１１の一つの凹部２６を互いに対向させて配置し、これらの凹部２６に設けられた接続端子３１に他の配線基板４１を接続させて配線基板同士を並設し、一方で、配線基板１１の残りの凹部２６にコネクタ４５を設けることができる。   According to the wiring board 11 of the present invention, if a plurality of recesses 26 are formed at the edge of the substrate 21 and the connection terminals 31 are provided in the recesses 26, other wiring boards 41 and connectors are provided on the wiring board 11. 45 can be provided simultaneously. For example, two wiring boards 11 according to the present invention are used, one recess 26 of these wiring boards 11 is arranged facing each other, and another wiring board 41 is connected to the connection terminal 31 provided in these recesses 26. The wiring boards can be arranged side by side, while the connector 45 can be provided in the remaining recess 26 of the wiring board 11.

次に、他の配線基板４１との接続作業の容易化を図ることが可能な配線基板１１の変形例を説明する。   Next, a modified example of the wiring board 11 that can facilitate connection work with another wiring board 41 will be described.

図７は本発明の実施形態の変形例に係る配線基板の斜視図、図８は本発明の実施形態の変形例に係る配線基板の一部の断面図、図９は変形例に係る配線基板の接続端子部分における斜視図、図１０は本実施形態の変形例に係る配線基板に他の配線基板を並設した状態を説明する図であって、（ａ）は他の配線基板の支持箇所における下方側から視た斜視図、（ｂ）はその側面図、図１１は他の配線基板を並設させた本実施形態の変形例に係る配線基板の一部の断面図である。   7 is a perspective view of a wiring board according to a modification of the embodiment of the present invention, FIG. 8 is a partial cross-sectional view of the wiring board according to the modification of the embodiment of the present invention, and FIG. 9 is a wiring board according to the modification. FIG. 10 is a diagram for explaining a state in which another wiring board is arranged in parallel with the wiring board according to the modification of the embodiment, and FIG. 10A is a support portion of the other wiring board. FIG. 11B is a side view thereof, and FIG. 11 is a partial cross-sectional view of a wiring board according to a modification of the present embodiment in which other wiring boards are arranged in parallel.

図７および図８に示したように、この配線基板１１においても、基板２１の両側縁部にそれぞれ凹部２６が形成されており、これらの凹部２６の長手方向の側面部２６ａから複数の接続端子３１が整列状態で延出されている。   As shown in FIGS. 7 and 8, also in this wiring board 11, recesses 26 are formed on both side edges of the substrate 21, and a plurality of connection terminals are formed from the side surface parts 26 a in the longitudinal direction of these recesses 26. 31 is extended in an aligned state.

図９に示したように、これらの接続端子３１には、その端子部３３に、支持片３５が一体的に形成されている。これらの支持片３５は、プレス加工によって接続端子３１の端子部３３に形成されたもので、端子部３３の両側部から側方へ突出されている。   As shown in FIG. 9, these connection terminals 31 are integrally formed with support pieces 35 at their terminal portions 33. These support pieces 35 are formed on the terminal portion 33 of the connection terminal 31 by press working, and protrude from the both sides of the terminal portion 33 to the side.

この支持片３５は、その上部の位置が、配線基板１１に他の配線基板４１を並設した際に、基板２１に対する他の配線基板４１の下面側が配置される位置とされている。また、図１０（ａ）に示したように、支持片３５の形成位置における端子部３３の幅寸法は、端子部３３が挿入される配線基板４１のスルーホール４１ａの径よりも大きくされている。   The upper position of the support piece 35 is a position where the lower surface side of the other wiring board 41 with respect to the board 21 is arranged when the other wiring board 41 is arranged in parallel with the wiring board 11. Further, as shown in FIG. 10A, the width dimension of the terminal portion 33 at the position where the support piece 35 is formed is larger than the diameter of the through hole 41a of the wiring board 41 into which the terminal portion 33 is inserted. .

したがって、接続端子３１の端子部３３を他の配線基板４１のスルーホール４１ａに挿し込むと、図１０（ａ）および（ｂ）に示したように、他の配線基板４１が支持片３５に係止され、その係止位置よりも端子部３３の根元側への移動が規制され、配線基板１１の基板２１に対して、他の配線基板４１が所定の間隔をあけた位置に位置決めされて配置される。   Therefore, when the terminal portion 33 of the connection terminal 31 is inserted into the through hole 41a of the other wiring board 41, the other wiring board 41 is engaged with the support piece 35 as shown in FIGS. 10 (a) and 10 (b). The movement to the base side of the terminal portion 33 is restricted from the locking position, and the other wiring board 41 is positioned and arranged at a position spaced apart from the board 21 of the wiring board 11. Is done.

ここで、配線基板１１に他の配線基板４１を並設させる場合、基板２１に対して他の配線基板４１を所定の間隔をあけた位置に位置決めした状態で半田付けして端子部３３と接続させる必要がある。したがって、支持片３５のない接続端子３１を備えた配線基板１１では、半田付けによる端子部３３と他の配線基板４１との接続工程において、スペーサ等の部品または治具を用いて基板２１に対して他の配線基板４１を所定位置に保持しておかなければならない。   Here, when another wiring board 41 is arranged side by side on the wiring board 11, the other wiring board 41 is soldered to the board 21 in a state where the wiring board 11 is positioned at a predetermined interval and connected to the terminal portion 33. It is necessary to let Therefore, in the wiring board 11 provided with the connection terminal 31 without the support piece 35, a part such as a spacer or a jig or the like is used for the board 21 in the connection process between the terminal portion 33 and the other wiring board 41 by soldering. The other wiring board 41 must be held at a predetermined position.

これに対し、上記のように、支持片３５を有する接続端子３１を備えた配線基板１１によれば、スペーサ等の部品や治具を用いることなく、他の配線基板４１を支持片３５に係止させて配線基板１１の基板２１に対して所定の間隔をあけた位置に位置決めした状態で支持することができる。これにより、図１１に示したように、配線基板１１に他の配線基板４１を並設させる場合に、配線基板１１に対して他の配線基板４１を、容易に所定の間隔をあけた位置に配置させて半田付けして接続端子３１と接続させることができる。したがって、他の配線基板４１の接続作業時間の短縮による製造コストの削減を図ることができる。   In contrast, according to the wiring board 11 including the connection terminal 31 having the support piece 35 as described above, the other wiring board 41 is engaged with the support piece 35 without using a component such as a spacer or a jig. It can be stopped and supported in a state where it is positioned at a position spaced apart from the substrate 21 of the wiring substrate 11 by a predetermined distance. As a result, as shown in FIG. 11, when another wiring board 41 is arranged side by side on the wiring board 11, the other wiring board 41 is easily placed at a predetermined interval with respect to the wiring board 11. It can be arranged and soldered to be connected to the connection terminal 31. Therefore, the manufacturing cost can be reduced by shortening the connection work time of the other wiring board 41.

また、接続端子３１に支持片３５を形成することにより、接続端子３１の外部に露出する部分の表面積が大きくされ、よって、放熱性も向上させることができる。   Further, by forming the support piece 35 on the connection terminal 31, the surface area of the portion exposed to the outside of the connection terminal 31 is increased, and thus heat dissipation can be improved.

尚、上記の配線基板１１では、金属コア２２と分離した接続端子３１を設けた場合を例にとって説明したが、図１２に示すように、接続端子３１を金属コア２２と一体に形成してもよい。金属コア２２と一体に形成された接続端子３１を有する配線基板１１では、金属コア２２の一部に接続端子３１を形成し、これらの接続端子３１を、凹部２６の側面部２６ａから側方へ延出させる。このように金属コア２２と一体に形成した接続端子３１では、例えば、金属コア２２をグランドとして用い、接続端子３１をグランド端子として容易に用いることができる。   In the wiring board 11, the case where the connection terminal 31 separated from the metal core 22 is provided has been described as an example. However, as illustrated in FIG. 12, the connection terminal 31 may be formed integrally with the metal core 22. Good. In the wiring board 11 having the connection terminal 31 formed integrally with the metal core 22, the connection terminal 31 is formed in a part of the metal core 22, and these connection terminals 31 are laterally extended from the side surface portion 26 a of the recess 26. Extend. In the connection terminal 31 formed integrally with the metal core 22 in this manner, for example, the metal core 22 can be used as a ground and the connection terminal 31 can be easily used as a ground terminal.

また、図１３に示すように、配線基板１１としては、複数の接続端子３１のうち少なくとも２個の接続端子３１ａを、基板２１の内部で電気的に接続するように一体に形成してもよい。このように接続端子３１のうちの少なくとも２個の接続端子３１ａを電気的に接続するように構成すれば、この２個の接続端子を基板の表面で接続するための回路パターンを配索する必要がなく、基板上の各種部品を搭載するスペースを小さくすることができ、配線基板を小型化することができる。   As shown in FIG. 13, as the wiring substrate 11, at least two connection terminals 31 a among the plurality of connection terminals 31 may be integrally formed so as to be electrically connected inside the substrate 21. . Thus, if at least two of the connection terminals 31 are configured to be electrically connected, it is necessary to route a circuit pattern for connecting the two connection terminals on the surface of the substrate. Therefore, the space for mounting various components on the board can be reduced, and the wiring board can be reduced in size.

次に、配線基板１１を製造する場合について、金属コア２２と分離した接続端子３１を有する構造のものを例にとって説明する。   Next, a case where the wiring board 11 is manufactured will be described by taking as an example a structure having a connection terminal 31 separated from the metal core 22.

図１４は配線基板の製造工程を説明する図であって、（ａ）〜（ｆ）は、それぞれ製造途中の配線基板の平面図及び断面図である。   FIG. 14 is a diagram for explaining a manufacturing process of a wiring board, and (a) to (f) are a plan view and a cross-sectional view of the wiring board in the middle of manufacturing.

＜金属コア加工工程＞
まず、図１４（ａ）に示したように、平板状の金属コア２２にプレス加工を施すことによって、接続端子３１の固定部３２を有する開口部５１を形成する。 <Metal core processing process>
First, as shown in FIG. 14A, the flat metal core 22 is pressed to form the opening 51 having the fixing portion 32 of the connection terminal 31.

＜マスキング工程＞
次に、図１４（ｂ）に示したように、凹部２６を形成する予定の箇所における金属コア２２の表裏に、耐熱性のマスキングテープ５２を貼り付ける。 <Masking process>
Next, as shown in FIG. 14B, heat-resistant masking tape 52 is affixed to the front and back of the metal core 22 where the recess 26 is to be formed.

＜基板形成工程＞
次に、金属コア２２の表裏面を、例えば、サンドブラストによって粗面化し、その後、図１４（ｃ）に示したように、金属コア２２の表裏面に絶縁層２３を積層させて基板２１を形成する。これにより、開口部５１が絶縁層２３によって塞がれる。このとき、凹部２６を形成する箇所は、マスキングテープ５２によって保護されているため、サンドブラストによる粗面化が防がれ、また、絶縁層２３が付着されることがない。 <Substrate formation process>
Next, the front and back surfaces of the metal core 22 are roughened by, for example, sandblasting, and then, as shown in FIG. 14C, the insulating layer 23 is laminated on the front and back surfaces of the metal core 22 to form the substrate 21. To do. Thereby, the opening 51 is closed by the insulating layer 23. At this time, since the portion where the recess 26 is formed is protected by the masking tape 52, roughening by sandblasting is prevented and the insulating layer 23 is not attached.

＜金属板（高熱伝導層）露出工程＞
図１４（ｄ）に示したように、マスキングテープ５２が貼り付けられた凹部２６の形成箇所における絶縁層２３を、ざぐり加工等によって除去し、マスキングテープ５２を剥がして金属コア２２を露出させる。 <Metal plate (high thermal conductive layer) exposure process>
As shown in FIG. 14 (d), the insulating layer 23 in the formation portion of the recess 26 where the masking tape 52 is attached is removed by spotting or the like, and the masking tape 52 is peeled off to expose the metal core 22.

＜接続端子形成工程＞
そして、図１４（ｅ）に示したように、露出させた金属コア２２を、プレス加工またはルータを用いた切削加工等によって凹部２６及び接続端子３１の端子部３３を形成する。その後、形成した接続端子３１の端子部３３には、メッキ処理を施す。 <Connecting terminal formation process>
Then, as shown in FIG. 14 (e), the recessed portion 26 and the terminal portion 33 of the connection terminal 31 are formed on the exposed metal core 22 by pressing or cutting using a router. Thereafter, the terminal portion 33 of the formed connection terminal 31 is subjected to a plating process.

＜接続端子加工工程＞
最後に、図１４（ｆ）に示したように、プレス加工等によって接続端子３１の端子部３３を所定の形状に成形する。具体的には、基板２１の一方の面側へ屈曲させるとともに、屈曲箇所を湾曲させて湾曲部３４を形成する。 <Connecting terminal machining process>
Finally, as shown in FIG. 14F, the terminal portion 33 of the connection terminal 31 is formed into a predetermined shape by pressing or the like. Specifically, the bending portion 34 is formed by bending the substrate 21 toward one surface and bending the bent portion.

上記の工程によって、表裏面が実装面２１ａとされ、縁部に凹部２６が形成され、凹部２６の側面部２６ａから接続端子３１が延出された、小型化及び薄型化が可能な配線基板１１を容易に製造することができる。   Through the above steps, the front and back surfaces are the mounting surfaces 21a, the recesses 26 are formed at the edges, and the connection terminals 31 are extended from the side surfaces 26a of the recesses 26. The wiring board 11 can be reduced in size and thickness. Can be easily manufactured.

なお、金属コア２２に接続端子３１が一体に設けられた配線基板１１（図１２参照）を製造する場合、上記の金属コア加工工程は省略となる。   In addition, when manufacturing the wiring board 11 (refer FIG. 12) by which the connection terminal 31 was integrally provided in the metal core 22, said metal core processing process is abbreviate | omitted.

また、接続端子３１に支持片３５を設ける場合は、上記の接続端子成形工程において、支持片３５が両側方へ突出された端子部３３を形成する。   Moreover, when providing the support piece 35 in the connection terminal 31, the terminal part 33 from which the support piece 35 protruded to the both sides is formed in said connection terminal shaping | molding process.

このように、端子部３３に支持片３５を形成しておくことにより、その後の接続端子加工工程で接続端子３１を基板２１の一方の面側へ屈曲するだけで、他の配線基板４１を位置決めして容易に接続することが可能な配線基板１１を容易に製造することができる。   Thus, by forming the support piece 35 in the terminal portion 33, the other wiring substrate 41 is positioned only by bending the connection terminal 31 to one surface side of the substrate 21 in the subsequent connection terminal processing step. Thus, the wiring board 11 that can be easily connected can be easily manufactured.

尚、本発明は、上述した実施形態に限定されるものではなく、適宜、変形、改良、等が可能である。その他、上述した実施形態における各構成要素の材質、形状、寸法、数、配置箇所、等は本発明を達成できるものであれば任意であり、限定されない。   In addition, this invention is not limited to embodiment mentioned above, A deformation | transformation, improvement, etc. are possible suitably. In addition, the material, shape, dimensions, number, arrangement location, and the like of each component in the above-described embodiment are arbitrary and are not limited as long as the present invention can be achieved.

１１ 配線基板
１２ 電気・電子部品（部品）
２１ 基板
２１ａ 実装面
２２ 金属コア（高熱伝導層）
２６ 凹部
２６ａ 側面部
３１ 接続端子
３４ 湾曲部
３５ 支持片
４１ 他の配線基板
４５ コネクタ
４６ ハウジング 11 Wiring board 12 Electrical / electronic components (components)
21 Substrate 21a Mounting surface 22 Metal core (high thermal conductivity layer)
26 concave portion 26a side portion 31 connection terminal 34 bending portion 35 support piece 41 other wiring board 45 connector 46 housing

Claims (9)

表面及び裏面の少なくとも一方の面が各種部品の実装面とされた基板と、
前記基板の少なくとも一側縁部に形成された凹部と、
前記凹部の側面部から延出し、前記基板の面に対して直交する方向へ屈曲された接続端子と、を備え、
前記接続端子は、前記基板の側面の内側に位置していることを特徴とする配線基板。 A substrate on which at least one of the front surface and the back surface is a mounting surface for various components;
A recess formed in at least one side edge of the substrate;
A connection terminal extending from the side surface of the recess and bent in a direction perpendicular to the surface of the substrate,
The wiring board is characterized in that the connection terminal is located inside a side surface of the board. 前記接続端子の屈曲部分が側面視で円弧状に湾曲した湾曲部とされていることを特徴とする請求項１に記載の配線基板。   The wiring board according to claim 1, wherein a bent portion of the connection terminal is a curved portion that is curved in an arc shape in a side view. 前記接続端子は、前記凹部の長手方向の側面部に複数個配置され、該複数の接続端子のうち、少なくとも２個の接続端子は基板内部で電気的に接続されていることを特徴とする請求項１または請求項２に記載の配線基板。   A plurality of the connection terminals are arranged on a side surface portion in the longitudinal direction of the recess, and at least two of the connection terminals are electrically connected inside the substrate. Item 3. The wiring board according to item 1 or 2. 前記基板は内部に高熱伝導層を備え、該高熱伝導層と前記接続端子が同一層に形成されていることを特徴とする請求項１〜請求項３のいずれか１項に記載の配線基板。   The wiring board according to any one of claims 1 to 3, wherein the substrate includes a high heat conductive layer therein, and the high heat conductive layer and the connection terminal are formed in the same layer. 前記接続端子は、前記基板に対して間隔をあけて並設される他の配線基板に接続されることを特徴とする請求項１〜請求項４のいずれか１項に記載の配線基板。   The wiring board according to any one of claims 1 to 4, wherein the connection terminal is connected to another wiring board that is arranged in parallel to the board with a space therebetween. 前記接続端子には、前記基板に対して間隔をあけた位置に前記他の配線基板を支持する支持片が側方へ突出して設けられていることを特徴とする請求項５に記載の配線基板。   The wiring board according to claim 5, wherein a support piece for supporting the other wiring board is provided on the connection terminal so as to protrude laterally at a position spaced from the board. . 前記凹部には、コネクタを構成するハウジングが配置され、前記ハウジングに前記接続端子が収容されることを特徴とする請求項１〜請求項４のいずれか１項に記載の配線基板。   The wiring board according to claim 1, wherein a housing constituting a connector is disposed in the recess, and the connection terminal is accommodated in the housing. 表面及び裏面の少なくとも一方の面が各種部品の実装面とされた基板と、前記基板の少なくとも一側縁部に形成された凹部と、前記凹部の側面部から延出し、前記基板の面に対して直交する方向へ屈曲された接続端子とを備える配線基板の製造方法であって、
前記接続端子となる導電性の金属板の表裏に絶縁層を積層させて前記基板を形成する基板形成工程と、
前記基板の前記凹部の形成箇所における前記絶縁層を除去して前記金属板を露出させる金属板露出工程と、
露出させた前記金属板を加工して前記凹部及び前記接続端子を形成する接続端子形成工程と、
を含むことを特徴とする配線基板の製造方法。 A substrate in which at least one of the front surface and the back surface is a mounting surface for various components, a recess formed in at least one side edge portion of the substrate, and a side surface portion of the recess, the surface of the substrate A wiring board comprising a connection terminal bent in a direction orthogonal to each other,
A substrate forming step of forming the substrate by laminating an insulating layer on the front and back of the conductive metal plate to be the connection terminal;
A metal plate exposing step of exposing the metal plate by removing the insulating layer in the concave portion of the substrate;
A connection terminal forming step of processing the exposed metal plate to form the recess and the connection terminal;
A method for manufacturing a wiring board, comprising: 前記接続端子形成工程において、前記接続端子に、側方へ突出する支持片を形成することを特徴する請求項８に記載の配線基板の製造方法。   The method for manufacturing a wiring board according to claim 8, wherein, in the connection terminal forming step, a support piece protruding laterally is formed on the connection terminal.
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CN201110149817.1A CN102271459B (en) 2010-06-03 2011-06-03 Wiring substrate and manufacturing method thereof
US13/152,419 US9888558B2 (en) 2010-06-03 2011-06-03 Wiring substrate and manufacturing method thereof
US14/289,335 US20140268581A1 (en) 2010-06-03 2014-05-28 Wiring substrate and manufacturing method thereof
US14/289,401 US9480142B2 (en) 2010-06-03 2014-05-28 Wiring substrate and manufacturing method thereof
US15/077,211 US9980364B2 (en) 2010-06-03 2016-03-22 Wiring substrate and manufacturing method thereof

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