JP2012015158A5 - - Google Patents

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Publication number
JP2012015158A5
JP2012015158A5 JP2010147420A JP2010147420A JP2012015158A5 JP 2012015158 A5 JP2012015158 A5 JP 2012015158A5 JP 2010147420 A JP2010147420 A JP 2010147420A JP 2010147420 A JP2010147420 A JP 2010147420A JP 2012015158 A5 JP2012015158 A5 JP 2012015158A5
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JP
Japan
Prior art keywords
layer
photosensitive resin
external connection
connection pads
resin layer
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JP2010147420A
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English (en)
Japanese (ja)
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JP2012015158A (ja
JP5438606B2 (ja
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Priority to JP2010147420A priority Critical patent/JP5438606B2/ja
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Publication of JP2012015158A5 publication Critical patent/JP2012015158A5/ja
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JP2010147420A 2010-06-29 2010-06-29 配線基板及びその製造方法 Active JP5438606B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010147420A JP5438606B2 (ja) 2010-06-29 2010-06-29 配線基板及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010147420A JP5438606B2 (ja) 2010-06-29 2010-06-29 配線基板及びその製造方法

Publications (3)

Publication Number Publication Date
JP2012015158A JP2012015158A (ja) 2012-01-19
JP2012015158A5 true JP2012015158A5 (enrdf_load_stackoverflow) 2013-05-30
JP5438606B2 JP5438606B2 (ja) 2014-03-12

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Family Applications (1)

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JP2010147420A Active JP5438606B2 (ja) 2010-06-29 2010-06-29 配線基板及びその製造方法

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JP (1) JP5438606B2 (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6445816B2 (ja) * 2013-09-30 2018-12-26 積水化学工業株式会社 配線板の製造方法、絶縁フィルム及び配線板用絶縁フィルム
JP7452517B2 (ja) * 2021-11-04 2024-03-19 株式会社村田製作所 インダクタ部品および実装部品

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