JP2012014900A - Lighting device - Google Patents

Lighting device Download PDF

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JP2012014900A
JP2012014900A JP2010148700A JP2010148700A JP2012014900A JP 2012014900 A JP2012014900 A JP 2012014900A JP 2010148700 A JP2010148700 A JP 2010148700A JP 2010148700 A JP2010148700 A JP 2010148700A JP 2012014900 A JP2012014900 A JP 2012014900A
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led lamp
type led
lighting fixture
hid
hid type
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Teiichiro Takano
貞一郎 高野
Hiroki Yokoyama
浩樹 横山
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Stanley Electric Co Ltd
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Stanley Electric Co Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide a lighting device which can efficiently radiate heat generated from an HID type LED lamp when setting the HID type LED lamp to a lighting fixture.SOLUTION: In the lighting device including the lighting fixture 11 having a lighting fixture cover 12 and a base socket 13 which have designated thermal conductivity, and an LED lamp 1 having a case 2 and a base 3 which have designated thermal conductivity, wherein the base 3 is mounted on the base socket 13 of the lighting fixture 11, a support member 21 with designated thermal conductivity is arranged between the LED lamp 1 and the lighting fixture cover 12. The support member 21 has a circular shape, and comes in contact with the case 2 of the LED lamp 1 at an inner part of the circular shape, and comes in contact with the lighting fixture cover 12 at an outer part of the circular shape.

Description

本発明は、照明装置に関する。   The present invention relates to a lighting device.

図1は既存のHID(High Intensity Discharge :高輝度放電)ランプと同じ外観形状に設計されているHIDタイプのLEDランプの一例を示す斜視図、図2は図1のA方向から見た平面図、図3は図1のB−B線における一部切欠断面図である。図1、図2、図3を参照すると、このHIDタイプのLEDランプ1は、所定の熱伝導率を持つ筐体2と、電源と接続するための口金3と、複数個(この例では、5個)のLED5(図3では、その内の1個のLED5が図示されている)と、複数個のLED5からの光がそれぞれ出射される出射窓6とを有している。ここで、1個のLED5は例えば4W(ワット)のものであり、従って、5個のLED5が用いられる場合には、20W(ワット)のものとなる。このため、このHIDタイプのLEDランプ1の筐体2には、既存のHIDランプと同等の性能を発揮するためにヒートシンク放熱構造(具体的にはフィン構造7)が設けられている。また、筐体2は、熱伝導率の高い材料(例えば、アルミニウムやマグネシュームなどの金属、あるいは、樹脂中に例えばカーボンなどを含有する熱伝導樹脂など)で形成されている。   FIG. 1 is a perspective view showing an example of an HID type LED lamp designed to have the same external shape as an existing HID (High Intensity Discharge) lamp, and FIG. 2 is a plan view seen from the direction A in FIG. FIG. 3 is a partially cutaway cross-sectional view taken along line BB in FIG. 1, 2, and 3, this HID type LED lamp 1 includes a housing 2 having a predetermined thermal conductivity, a base 3 for connecting to a power source, and a plurality (in this example, 5 LEDs 5 (one LED 5 is shown in FIG. 3) and an emission window 6 through which light from the plurality of LEDs 5 is emitted. Here, one LED 5 is, for example, 4 W (watts), and therefore, when five LEDs 5 are used, it is 20 W (watts). For this reason, the housing 2 of the HID type LED lamp 1 is provided with a heat sink heat dissipation structure (specifically, a fin structure 7) in order to exhibit performance equivalent to that of an existing HID lamp. The housing 2 is made of a material having high thermal conductivity (for example, a metal such as aluminum or magnesium, or a heat conductive resin containing carbon or the like in the resin).

このようなHIDタイプのLEDランプ1は、図4に断面図で示すように、所定の熱伝導率を持つ(熱伝導率の高い)照明器具カバー12と口金ソケット13とを有する照明器具11の口金ソケット13に口金3が装着されて用いられるようになっている。なお、図4において、HIDタイプのLEDランプ1は、図3と同様に、一部が切欠かれて図示されている。   Such an HID type LED lamp 1 includes a lighting fixture cover 12 having a predetermined thermal conductivity (high thermal conductivity) and a base socket 13 as shown in a sectional view in FIG. The base 3 is attached to the base socket 13 for use. In FIG. 4, the HID type LED lamp 1 is shown with a part cut away as in FIG. 3.

ここで、照明器具11としては、既存のHIDランプ用の照明器具を用いることができる。すなわち、HIDタイプのLEDランプ1は、既存のHIDランプと同じ外観形状に設計されているため、既存のHIDランプ用の照明器具11の口金ソケット13に口金3を挿入して、既存のHIDランプと置き換えて使用することができる(すなわち、既存のHIDランプと互換性がある)。   Here, as the lighting fixture 11, the existing lighting fixture for HID lamps can be used. That is, since the HID type LED lamp 1 is designed to have the same external shape as the existing HID lamp, the base 3 is inserted into the base socket 13 of the lighting fixture 11 for the existing HID lamp, and the existing HID lamp Can be used (ie, compatible with existing HID lamps).

ところで、従来では、照明器具11にHIDタイプのLEDランプ1をセットし、HIDタイプのLEDランプ1に通電してHIDタイプのLEDランプ1を点灯するとき、照明器具11は一般に通気孔がなく、照明器具11とHIDタイプのLEDランプ1との間の空気は外気との入れ替えができにくいため、HIDタイプのLEDランプ1から放出された放射熱が照明器具11内(照明器具11とHIDタイプのLEDランプ1との間)にこもってしまうという問題があった。   By the way, conventionally, when the HID type LED lamp 1 is set in the lighting fixture 11 and the HID type LED lamp 1 is turned on by energizing the HID type LED lamp 1, the lighting fixture 11 generally has no vent hole. Since the air between the luminaire 11 and the HID type LED lamp 1 is difficult to exchange with the outside air, the radiant heat emitted from the HID type LED lamp 1 is generated in the luminaire 11 (the luminaire 11 and the HID type LED lamp 1). There was a problem of being trapped in the LED lamp 1).

図5には、照明器具11にHIDタイプのLEDランプ1がセットされる前の状態(器具使用なしの状態)においてHIDタイプのLEDランプ1を点灯したときのHIDタイプのLEDランプ1の各部分の温度測定結果と、照明器具11にHIDタイプのLEDランプ1をセットした後の状態(器具使用ありの状態)においてHIDタイプのLEDランプ1を点灯したときのHIDタイプのLEDランプ1の各部分の温度測定結果とが示されている。なお、図5において、測定ポイント1はHIDタイプのLEDランプ1のLED5のジャンクション(p−nジャンクション)、測定ポイント2はHIDタイプのLEDランプ1の筐体2、測定ポイント3は照明器具11にHIDタイプのLEDランプ1をセットした後の状態において照明器具11とHIDタイプのLEDランプ1との間の空間(空気層)、測定ポイント4は外気である。   FIG. 5 shows each part of the HID type LED lamp 1 when the HID type LED lamp 1 is turned on in a state before the HID type LED lamp 1 is set in the lighting fixture 11 (a state in which no fixture is used). Of the HID type LED lamp 1 when the HID type LED lamp 1 is turned on in the state after setting the HID type LED lamp 1 in the lighting fixture 11 (the state in which the fixture is used) The temperature measurement results are shown. In FIG. 5, the measurement point 1 is the junction (pn junction) of the LED 5 of the HID type LED lamp 1, the measurement point 2 is the housing 2 of the HID type LED lamp 1, and the measurement point 3 is the lighting fixture 11. In a state after the HID type LED lamp 1 is set, the space (air layer) between the lighting fixture 11 and the HID type LED lamp 1 and the measurement point 4 are outside air.

図5から、照明器具11にHIDタイプのLEDランプ1をセットした後の状態(器具使用ありの状態)にすると、照明器具11にHIDタイプのLEDランプ1がセットされる前の状態(器具使用なしの状態)に比べて、例えば測定ポイント1の温度(すなわち、HIDタイプのLEDランプ1のLED5のジャンクション(p−nジャンクション)の温度)が15℃上昇してしまうことがわかった。この原因は、照明器具11にHIDタイプのLEDランプ1をセットした後の状態(器具使用ありの状態)では、図6に示すように、HIDタイプのLEDランプ1のLED5からの熱は、HIDタイプのLEDランプ1の筐体2(R1)、空気層31(R2)、照明器具カバー12(R3)、空気層(外気)32(R4)の順序で、熱伝導の悪い空気層31(R2)を経由して照明器具カバー12に熱伝導するので、効率良く放熱を行うことができないためと考えられる。なお、R1、R2、R3、R4は熱の経路である。   From FIG. 5, when the HID type LED lamp 1 is set in the lighting fixture 11 (when the appliance is used), the state before the HID type LED lamp 1 is set in the lighting fixture 11 (use of the appliance). For example, it was found that the temperature at the measurement point 1 (that is, the junction temperature (pn junction) of the LED 5 of the HID type LED lamp 1) increased by 15 ° C. This is because the heat from the LED 5 of the HID type LED lamp 1 is HID in the state after the HID type LED lamp 1 is set in the lighting device 11 (the state in which the device is used) as shown in FIG. In the order of the housing 2 (R1), the air layer 31 (R2), the luminaire cover 12 (R3), and the air layer (outside air) 32 (R4) of the LED lamp 1 of the type, the air layer 31 (R2) having poor heat conduction ) Is conducted to the luminaire cover 12, and it is considered that heat cannot be efficiently radiated. R1, R2, R3, and R4 are heat paths.

このように、従来では、照明器具11にHIDタイプのLEDランプ1をセットしたときに、HIDタイプのLEDランプ1のLED5からの熱を効率良く放熱を行うことができず、これにより、HIDタイプのLEDランプ1の寿命が短くなったり、HIDタイプのLEDランプ1のLED5のジャンクション(p−nジャンクション)の温度の上昇によってLED5の発光効率が低下するなどの問題があった。   Thus, conventionally, when the HID type LED lamp 1 is set in the luminaire 11, the heat from the LED 5 of the HID type LED lamp 1 cannot be efficiently radiated. There is a problem that the lifetime of the LED lamp 1 is shortened, and the luminous efficiency of the LED 5 is lowered due to the increase in the temperature of the junction (pn junction) of the LED 5 of the HID type LED lamp 1.

また、上述したようなHIDタイプのLEDランプ1は、筐体2にヒートシンク放熱構造(具体的にはフィン構造7)が採用されているので、既存のHIDランプよりも重さが5割程、重くなってしまう。具体的には、既存のHIDランプの重さが220gであるのに対し、HIDタイプのLEDランプ1は重さが340gとなってしまう。このため、照明器具11にHIDタイプのLEDランプ1をセットし、重力の作用する方向Gに対して、例えば図7のように傾けて使用する場合に、既存のHIDランプに比べてHIDタイプのLEDランプ1は重いために、図7に示すようにHIDタイプのLEDランプ1が照明器具11の中心から重力の作用する方向Gにずれた装着状態となりやすく、目的の方向に対して正しい照射ができなくなるなどの問題もあった。   Moreover, since the HID type LED lamp 1 as described above employs a heat sink heat dissipation structure (specifically, fin structure 7) in the housing 2, the weight is about 50% that of an existing HID lamp. It will be heavy. Specifically, the weight of the existing HID lamp is 220 g, whereas the weight of the HID type LED lamp 1 is 340 g. For this reason, when the HID type LED lamp 1 is set in the luminaire 11 and is used with an inclination as shown in FIG. 7, for example, with respect to the direction G in which gravity acts, the HID type lamp is compared with the existing HID lamp. Since the LED lamp 1 is heavy, as shown in FIG. 7, the HID type LED lamp 1 is likely to be in a mounted state shifted from the center of the luminaire 11 in the direction G of gravity, and correct irradiation in the target direction is achieved. There were also problems such as being unable to do so.

本発明は、照明器具にHIDタイプのLEDランプをセットしたときに、HIDタイプのLEDランプからの熱を効率良く放熱することの可能な照明装置を提供することを目的としている。   An object of the present invention is to provide an illumination device capable of efficiently dissipating heat from an HID type LED lamp when an HID type LED lamp is set in a lighting fixture.

また、本発明は、さらに、照明器具にHIDタイプのLEDランプをセットしたときに、HIDタイプのLEDランプが照明器具の中心から重力の作用する方向にずれるのを有効に防止することをも可能な照明装置を提供することを目的としている。   In addition, the present invention can also effectively prevent the HID type LED lamp from being displaced from the center of the lighting fixture in the direction of gravity when the HID type LED lamp is set in the lighting fixture. It aims to provide a simple lighting device.

上記目的を達成するために、請求項1記載の発明は、所定の熱伝導率を持つ照明器具カバーと口金ソケットとを有する照明器具と、所定の熱伝導率を持つ筐体と口金とを有し、前記照明器具の口金ソケットに口金が装着されるLEDランプとを備えた照明装置であって、前記LEDランプと前記照明器具カバーとの間には、所定の熱伝導率を持つ支持部材が設けられ、該支持部材は、環状形状のものであって、環状形状の内側部分で前記LEDランプの前記筐体と当接し、環状形状の外側部分で前記照明器具カバーと当接していることを特徴としている。   In order to achieve the above object, an invention according to claim 1 includes a lighting fixture having a lighting fixture cover and a base socket having a predetermined thermal conductivity, a housing having a predetermined thermal conductivity, and a base. And a lighting device including an LED lamp mounted on a base socket of the lighting fixture, wherein a support member having a predetermined thermal conductivity is provided between the LED lamp and the lighting fixture cover. The support member is annular, and is in contact with the housing of the LED lamp at an inner portion of the annular shape, and is in contact with the luminaire cover at an outer portion of the annular shape. It is a feature.

また、請求項2記載の発明は、請求項1記載の照明装置において、前記支持部材は、照明器具カバーと当接する環状形状の外側部分に弾性構造を有していることを特徴としている。   According to a second aspect of the present invention, in the illuminating device according to the first aspect, the support member has an elastic structure in an annular outer portion that abuts the luminaire cover.

請求項1記載の発明によれば、所定の熱伝導率を持つ照明器具カバーと口金ソケットとを有する照明器具と、所定の熱伝導率を持つ筐体と口金とを有し、前記照明器具の口金ソケットに口金が装着されるLEDランプとを備えた照明装置であって、前記LEDランプと前記照明器具カバーとの間には、所定の熱伝導率を持つ支持部材が設けられ、該支持部材は、環状形状のものであって、環状形状の内側部分で前記LEDランプの前記筐体と当接し、環状形状の外側部分で前記照明器具カバーと当接しているので、照明器具にLEDランプをセットしたときに、LEDランプからの熱を効率良く放熱することができる。   According to the first aspect of the present invention, the lighting device includes a lighting device cover having a predetermined thermal conductivity and a base socket, a housing having a predetermined thermal conductivity, and a base. A lighting device including an LED lamp having a base mounted on a base socket, wherein a support member having a predetermined thermal conductivity is provided between the LED lamp and the lighting fixture cover, and the support member Is in an annular shape and is in contact with the housing of the LED lamp at the inner portion of the annular shape and is in contact with the luminaire cover at the outer portion of the annular shape. When set, the heat from the LED lamp can be efficiently radiated.

また、請求項2記載の発明によれば、請求項1記載の照明装置において、前記支持部材は、照明器具カバーと当接する環状形状の外側部分に弾性構造を有しているので、照明器具にLEDランプをセットしたときに、LEDランプからの熱を効率良く放熱することができるとともに、LEDランプが照明器具の中心から重力の作用する方向にずれるのを有効に防止することができる。   According to a second aspect of the present invention, in the illuminating device according to the first aspect, the support member has an elastic structure in an annular outer portion that abuts the luminaire cover. When the LED lamp is set, the heat from the LED lamp can be efficiently radiated, and the LED lamp can be effectively prevented from shifting in the direction in which gravity acts from the center of the lighting fixture.

既存のHIDランプと同じ外観形状に設計されているHIDタイプのLEDランプの一例を示す斜視図である。It is a perspective view which shows an example of the HID type LED lamp designed to the same external shape as the existing HID lamp. 図1のA方向から見た平面図である。It is the top view seen from the A direction of FIG. 図2のB−B線における一部切欠断面図である。FIG. 3 is a partially cutaway sectional view taken along line BB in FIG. 2. 所定の熱伝導率を持つ照明器具カバーと口金ソケットとを有する照明器具の口金ソケットにHIDタイプのLEDランプの口金が装着された状態を示す図である。It is a figure which shows the state by which the nozzle | cap | die of the HID type LED lamp was mounted | worn with the nozzle | cap | die socket of the luminaire | luminum which has a lamp | ramp fixture cover with a predetermined | prescribed thermal conductivity, and a nozzle | cap | die socket. 照明器具にHIDタイプのLEDランプがセットされる前の状態(器具使用なしの状態)においてHIDタイプのLEDランプを点灯したときのHIDタイプのLEDランプの各部分の温度測定結果と、照明器具にHIDタイプのLEDランプをセットした後の状態(器具使用ありの状態)においてHIDタイプのLEDランプを点灯したときのHIDタイプのLEDランプの各部分の温度測定結果とを示す図である。The temperature measurement result of each part of the HID type LED lamp when the HID type LED lamp is lit in the state before the HID type LED lamp is set in the lighting fixture (the state in which the fixture is not used), and the lighting fixture It is a figure which shows the temperature measurement result of each part of a HID type LED lamp when a HID type LED lamp is lighted in the state (state with instrument use) after setting an HID type LED lamp. 図4の構成において、HIDタイプのLEDランプのLEDからの熱の熱伝導を示す図である。In the structure of FIG. 4, it is a figure which shows the heat conduction of the heat | fever from LED of a HID type LED lamp. 照明器具にHIDタイプのLEDランプをセットし、重力の作用する方向に対して、傾けて使用する場合を示す図である。It is a figure which shows the case where an HID type LED lamp is set to a lighting fixture, and it inclines and uses with respect to the direction where gravity acts. 本発明の照明装置に用いられる支持部材(放熱ステー)の構成例を示す図である。It is a figure which shows the structural example of the supporting member (heat dissipation stay) used for the illuminating device of this invention. HIDタイプのLEDランプの筐体(フィン構造を有する筐体)に支持部材(放熱ステー)の円環状の本体部が嵌められた(当接した)状態を示す図である。It is a figure which shows the state by which the annular | circular shaped main-body part of the supporting member (heat dissipation stay) was fitted by the housing | casing (housing | casing which has a fin structure) of a HID type LED lamp. HIDタイプのLEDランプが照明器具にセットされた状態を示す図である。It is a figure which shows the state by which the HID type LED lamp was set to the lighting fixture. HIDタイプのLEDランプに熱伝導率の高い支持部材(放熱ステー)を装着せずに照明器具にセットした状態においてHIDタイプのLEDランプを点灯したときのHIDタイプのLEDランプの各部分の温度測定結果と、HIDタイプのLEDランプに熱伝導率の高い支持部材(放熱ステー)を装着して照明器具にセットした状態においてHIDタイプのLEDランプを点灯したときのHIDタイプのLEDランプの各部分の温度測定結果とを示す図である。Temperature measurement of each part of the HID type LED lamp when the HID type LED lamp is turned on in a state where the HID type LED lamp is mounted on a lighting fixture without attaching a support member (heat dissipating stay) having high thermal conductivity to the HID type LED lamp. The result and each part of the HID type LED lamp when the HID type LED lamp is turned on in a state where the HID type LED lamp is mounted on a lighting fixture with a support member (heat dissipating stay) having a high thermal conductivity. It is a figure which shows a temperature measurement result. HIDタイプのLEDランプに熱伝導率の高い支持部材(放熱ステー)を装着した状態にしたときの、HIDタイプのLEDランプのLEDからの熱の熱伝導を示す図である。It is a figure which shows the heat conduction of the heat | fever from LED of a HID type LED lamp when it is set as the state which mounted | wore with the support member (heat dissipation stay) with high heat conductivity to the HID type LED lamp. 支持部材(放熱ステー)の他の例を示す図である。It is a figure which shows the other example of a supporting member (heat dissipation stay).

以下、本発明の実施形態を図面に基づいて説明する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings.

本発明の照明装置においても、基本的には、図1、図2、図3に示したと同様のHIDタイプのLEDランプ1と、図4に示したような、所定の熱伝導率を持つ照明器具カバー12と口金ソケット13とを有する照明器具11とが用いられ、HIDタイプのLEDランプ1は、照明器具11の口金ソケット13に口金3が装着されて使用されるようになっている。なお、以下では、HIDタイプのLEDランプ1、および、照明器具11の構成および材料などは、前述の背景技術において説明したものと同じであるとする。   Also in the illuminating device of the present invention, basically, an HID type LED lamp 1 similar to that shown in FIGS. 1, 2, and 3 and an illumination having a predetermined thermal conductivity as shown in FIG. A lighting fixture 11 having a fixture cover 12 and a base socket 13 is used, and the HID type LED lamp 1 is used with the base 3 attached to the base socket 13 of the lighting fixture 11. In the following, it is assumed that the configurations and materials of the HID type LED lamp 1 and the lighting fixture 11 are the same as those described in the background art.

すなわち、このHIDタイプのLEDランプ1も、図1、図2、図3に示したと同様に、所定の熱伝導率を持つ筐体2と、電源と接続するための口金3と、複数個(いま例では、5個)のLED5と、複数個のLED5からの光がそれぞれ出射される出射窓6とを有している。ここで、1個のLED5は例えば4W(ワット)のものであり、従って、5個のLED5が用いられる場合には、20W(ワット)のものとなる。このため、このHIDタイプのLEDランプ1の筐体2には、既存のHIDランプと同等の性能を発揮するためにヒートシンク放熱構造(具体的にはフィン構造7)が設けられている。また、筐体2は、熱伝導率の高い材料(例えば、アルミニウムやマグネシュームなどの金属、あるいは、樹脂中に例えばカーボンなどを含有する熱伝導樹脂など)で形成されている。   That is, this HID type LED lamp 1 also includes a housing 2 having a predetermined thermal conductivity, a base 3 for connecting to a power source, and a plurality of (as shown in FIGS. In this example, there are 5) LEDs 5 and an exit window 6 through which light from the plurality of LEDs 5 is emitted. Here, one LED 5 is, for example, 4 W (watts), and therefore, when five LEDs 5 are used, it is 20 W (watts). For this reason, the housing 2 of the HID type LED lamp 1 is provided with a heat sink heat dissipation structure (specifically, a fin structure 7) in order to exhibit performance equivalent to that of an existing HID lamp. The housing 2 is made of a material having high thermal conductivity (for example, a metal such as aluminum or magnesium, or a heat conductive resin containing carbon or the like in the resin).

また、照明器具カバー12は、熱伝導率の高い金属(例えばアルミニウム等)などで形成されている。   The luminaire cover 12 is formed of a metal having a high thermal conductivity (for example, aluminum).

ところで、本発明では、HIDタイプのLEDランプ1の筐体2と照明器具11の照明器具カバー12との間に、所定の熱伝導率を持つ環状の支持部材(放熱ステー)が設けられるようになっている。図8(a),(b)は本発明の照明装置に用いられる支持部材(放熱ステー)の構成例を示す図である。なお、図8(a)は斜視図、図8(b)は図8(a)の矢印Cの方向から見た平面図である。   By the way, in the present invention, an annular support member (heat dissipating stay) having a predetermined thermal conductivity is provided between the housing 2 of the HID type LED lamp 1 and the luminaire cover 12 of the luminaire 11. It has become. FIGS. 8A and 8B are diagrams showing a configuration example of a support member (heat dissipating stay) used in the lighting device of the present invention. 8A is a perspective view, and FIG. 8B is a plan view seen from the direction of arrow C in FIG. 8A.

図8(a),(b)を参照すると、この支持部材(放熱ステー)21は、所定の熱伝導率を持つ材料(例えば、金属製の導電性材料や、樹脂中に例えばカーボンなどを含有する熱伝導樹脂などの、熱伝導率の高い材料)で形成されている。   Referring to FIGS. 8A and 8B, the support member (heat dissipating stay) 21 includes a material having a predetermined thermal conductivity (for example, a metal conductive material, or carbon in the resin, for example). A material having high thermal conductivity, such as a thermal conductive resin.

そして、図8(a),(b)の例では、支持部材(放熱ステー)21は、円環状の本体部22と、円環状の本体部22の円環に沿って、外側にU字形状に曲げられた複数のU字形状部23とを有している。なお、円環状の本体部22は、HIDタイプのLEDランプ1の筐体2自体に接する部分25と、筐体2のフィン構造7に嵌る(接する)部分26とを有している。   8A and 8B, the support member (heat dissipating stay) 21 is formed in a U-shape on the outside along the annular main body 22 and the annular ring of the annular main body 22. And a plurality of U-shaped portions 23 bent in a straight line. The annular main body 22 includes a portion 25 that contacts the housing 2 of the HID type LED lamp 1 and a portion 26 that fits (contacts) the fin structure 7 of the housing 2.

このような構成により、支持部材(放熱ステー)21の内側部分は、HIDタイプのLEDランプ1の筐体2(フィン構造7を有する筐体2)に嵌る(当接する)ようになっている。すなわち、図8(a),(b)の例では、支持部材(放熱ステー)21の円環状の本体部22の内側部分が、HIDタイプのLEDランプ1の筐体2(フィン構造7を有する筐体2)に嵌る(当接する)ようになっている。図9(a),(b)には、HIDタイプのLEDランプ1の筐体2(フィン構造7を有する筐体2)に支持部材(放熱ステー)21が嵌められた(当接した)状態が示されている。なお、図9(a)は斜視図、図9(b)は図9(a)の矢印Cの方向から見た平面図である。ここで、支持部材(放熱ステー)21の円環状の本体部22の内側部分は、HIDタイプのLEDランプ1の筐体2(フィン構造7を有する筐体2)にできる限り広い接触面積で接するのが良く、図8(a),(b)、図9(a),(b)の例では、支持部材(放熱ステー)21の円環状の本体部22の内側部分は、HIDタイプのLEDランプ1の筐体2のフィン構造7の側面と、隣接するフィン構造7間の筐体2表面とにも接するようになっている。   With such a configuration, the inner part of the support member (heat dissipating stay) 21 is fitted (abuts) on the housing 2 of the HID type LED lamp 1 (the housing 2 having the fin structure 7). That is, in the example of FIGS. 8A and 8B, the inner portion of the annular main body 22 of the support member (heat dissipating stay) 21 has the housing 2 (fin structure 7) of the HID type LED lamp 1. It fits (contacts) the housing 2). 9A and 9B show a state in which a support member (heat dissipating stay) 21 is fitted (contacted) to the housing 2 of the HID type LED lamp 1 (the housing 2 having the fin structure 7). It is shown. 9A is a perspective view, and FIG. 9B is a plan view seen from the direction of arrow C in FIG. 9A. Here, the inner portion of the annular main body 22 of the support member (heat dissipating stay) 21 is in contact with the housing 2 of the HID type LED lamp 1 (the housing 2 having the fin structure 7) with as wide a contact area as possible. 8A, 8B, 9A, and 9B, the inner portion of the annular main body 22 of the support member (heat dissipating stay) 21 is an HID type LED. The side surface of the fin structure 7 of the housing 2 of the lamp 1 is also in contact with the surface of the housing 2 between the adjacent fin structures 7.

また、HIDタイプのLEDランプ1が照明器具11にセットされたとき(すなわち、HIDタイプのLEDランプ1の口金3が照明器具11の口金ソケット13に装着されたとき)、支持部材(放熱ステー)21の外側部分は、照明器具11の照明器具カバー12に当接するようになっている。すなわち、図8(a),(b)、図9(a),(b)の例では、支持部材(放熱ステー)21の複数のU字形状部23が、照明器具11の照明器具カバー12に当接するようになっている。図10(a),(b)には、HIDタイプのLEDランプ1が照明器具11にセットされたときの状態が示されている。なお、図10(a)は斜視図、図10(b)は図10(a)のB−B線における一部切欠断面図である。ここで、支持部材(放熱ステー)21の外側部分は、照明器具11の照明器具カバー12にできる限り広い接触面積で接するのが良い。具体的に、図8(a),(b)、図9(a),(b)、図10(a),(b)の例では、支持部材(放熱ステー)21の複数のU字形状部23は、できる限り多く分割されているのが良く、また、支持部材(放熱ステー)21の複数のU字形状部23の全てが、照明器具11の照明器具カバー12に当接するようになっているのが良い。   Further, when the HID type LED lamp 1 is set on the lighting fixture 11 (that is, when the base 3 of the HID type LED lamp 1 is mounted on the base socket 13 of the lighting fixture 11), a support member (heat dissipating stay) The outer portion 21 is in contact with the luminaire cover 12 of the luminaire 11. That is, in the examples of FIGS. 8A, 8 </ b> B, 9 </ b> A, and 9 </ b> B, the plurality of U-shaped portions 23 of the support member (heat dissipating stay) 21 are provided with the luminaire cover 12 of the luminaire 11. It comes to contact with. FIGS. 10A and 10B show a state when the HID type LED lamp 1 is set on the lighting fixture 11. 10A is a perspective view, and FIG. 10B is a partially cutaway cross-sectional view taken along line BB in FIG. 10A. Here, the outer portion of the support member (heat dissipating stay) 21 is preferably in contact with the luminaire cover 12 of the luminaire 11 with a contact area as wide as possible. Specifically, in the examples of FIGS. 8A, 8 </ b> B, 9 </ b> A, 9 </ b> B, 10 </ b> A, 10 </ b> B, a plurality of U-shaped support members (heat dissipating stays) 21 are formed. The part 23 is preferably divided as many as possible, and all of the plurality of U-shaped parts 23 of the support member (heat dissipating stay) 21 come into contact with the luminaire cover 12 of the luminaire 11. It is good to have.

図10(b)からわかるように(後述の図12に詳細に示すように)、HIDタイプのLEDランプ1のLED5からの熱は、HIDタイプのLEDランプ1の筐体2(T1)、熱伝導率の高い支持部材(放熱ステー)21(T2)、照明器具カバー12(T3)、空気層(外気)32(T4)の順序で、熱伝導率の高い支持部材(放熱ステー)21(T2)を経由して照明器具カバー12に熱伝導するので、非常に効率良く放熱を行うことが可能となる。なお、T1、T2、T3、T4は熱の経路である。   As can be seen from FIG. 10B (as shown in detail in FIG. 12 to be described later), the heat from the LED 5 of the HID type LED lamp 1 is the heat of the housing 2 (T1) of the HID type LED lamp 1 and the heat. Support member (heat dissipating stay) 21 (T2) having high thermal conductivity in the order of support member (heat dissipating stay) 21 (T2) having high conductivity, lighting fixture cover 12 (T3), and air layer (outside air) 32 (T4). ) Is conducted to the luminaire cover 12, so that heat can be radiated very efficiently. T1, T2, T3, and T4 are heat paths.

図11には、HIDタイプのLEDランプ1に熱伝導率の高い支持部材(放熱ステー)21を装着せずに照明器具11にセットした状態においてHIDタイプのLEDランプ1を点灯したときのHIDタイプのLEDランプ1の各部分の温度測定結果と、HIDタイプのLEDランプ1に熱伝導率の高い支持部材(放熱ステー)21を装着して照明器具11にセットした状態においてHIDタイプのLEDランプ1を点灯したときのHIDタイプのLEDランプ1の各部分の温度測定結果とが示されている。なお、図11において、測定ポイント1はHIDタイプのLEDランプ1のLED5のジャンクション(p−nジャンクション)、測定ポイント2はHIDタイプのLEDランプ1の筐体2、測定ポイント3は照明器具11にHIDタイプのLEDランプ1をセットした後の状態において照明器具11とHIDタイプのLEDランプ1との間の空間(空気層)、測定ポイント4は外気である。   FIG. 11 shows the HID type when the HID type LED lamp 1 is turned on in a state where the HID type LED lamp 1 is set on the lighting fixture 11 without mounting the support member (heat radiating stay) 21 having a high thermal conductivity. The temperature measurement result of each part of the LED lamp 1 and the HID type LED lamp 1 in the state where the HID type LED lamp 1 is mounted on the lighting fixture 11 with the support member (heat dissipating stay) 21 having a high thermal conductivity attached. The temperature measurement result of each part of the HID type LED lamp 1 when is turned on is shown. In FIG. 11, the measurement point 1 is the junction (pn junction) of the LED 5 of the HID type LED lamp 1, the measurement point 2 is the housing 2 of the HID type LED lamp 1, and the measurement point 3 is the lighting fixture 11. In a state after the HID type LED lamp 1 is set, the space (air layer) between the lighting fixture 11 and the HID type LED lamp 1 and the measurement point 4 are outside air.

図11から、HIDタイプのLEDランプ1に熱伝導率の高い支持部材(放熱ステー)21を装着した状態にすると、HIDタイプのLEDランプ1に熱伝導率の高い支持部材(放熱ステー)21を装着しない場合に比べて、例えば測定ポイント1の温度(すなわち、HIDタイプのLEDランプ1のLED5のジャンクション(p−nジャンクション)の温度)を15℃と大幅に低下させることができることがわかった。これは、HIDタイプのLEDランプ1に熱伝導率の高い支持部材(放熱ステー)21を装着した状態にすると、図12に示すように、HIDタイプのLEDランプ1のLED5からの熱は、HIDタイプのLEDランプ1の筐体2、熱伝導率の高い支持部材(放熱ステー)21、照明器具カバー12、空気層(外気)32の順序で、熱伝導率の高い支持部材(放熱ステー)21を経由して照明器具カバー12に直接的に熱伝導するので、効率良く放熱を行うことができるためである。   From FIG. 11, when a support member (heat dissipation stay) 21 with high thermal conductivity is attached to the HID type LED lamp 1, the support member (heat dissipation stay) 21 with high thermal conductivity is attached to the HID type LED lamp 1. It has been found that, for example, the temperature at the measurement point 1 (that is, the temperature of the junction (pn junction) of the LED 5 of the HID type LED lamp 1) can be significantly reduced to 15 ° C., compared with the case where it is not mounted. This is because when the HID type LED lamp 1 is mounted with a support member (heat dissipating stay) 21 having high thermal conductivity, the heat from the LED 5 of the HID type LED lamp 1 is HID as shown in FIG. Type LED lamp 1 housing 2, support member (heat dissipation stay) 21 with high thermal conductivity, lighting fixture cover 12, air layer (outside air) 32 in this order, support member (heat dissipation stay) 21 with high thermal conductivity This is because heat is directly conducted to the luminaire cover 12 via, so that heat can be efficiently radiated.

このように、本発明によれば、HIDタイプのLEDランプ1と照明器具カバー12との間には、所定の熱伝導率を持つ支持部材21が設けられ、該支持部材21は、環状形状のものであって、環状形状の内側部分でHIDタイプのLEDランプ1の筐体2と当接し、環状形状の外側部分で照明器具カバー12と当接しているので、照明器具11にHIDタイプのLEDランプ1をセットしたときに、HIDタイプのLEDランプ1からの熱を効率良く放熱することができる。これによって、HIDタイプのLEDランプ1の寿命を長くすることができ、また、LED5の発光効率の低下を防止することができる。   Thus, according to the present invention, the support member 21 having a predetermined thermal conductivity is provided between the HID type LED lamp 1 and the luminaire cover 12, and the support member 21 has an annular shape. Since the ring-shaped inner portion is in contact with the housing 2 of the HID type LED lamp 1 and the ring-shaped outer portion is in contact with the lighting fixture cover 12, the HID type LED is attached to the lighting fixture 11. When the lamp 1 is set, the heat from the HID type LED lamp 1 can be efficiently radiated. Thereby, the lifetime of the HID type LED lamp 1 can be extended, and the decrease in the light emission efficiency of the LED 5 can be prevented.

また、図9(a),(b)、図10において、照明器具11は、照明器具カバー12の開口径(もしくは開口幅)が口金ソケット13の方向に向かって狭くなっている。ここで、支持部材(放熱ステー)21の複数のU字形状部23が口金ソケット13の方向に向くように支持部材(放熱ステー)21の円環状の本体部22がHIDタイプのLEDランプ1に装着され、このとき、複数のU字形状部22は、照明器具カバー12に当接し、照明器具カバー12を外側方向(図10の矢印Hの方向)に押圧する弾性部材(バネ部材)として働く。このように、弾性部材(バネ部材)としての複数のU字形状部22が設けられていることにより、HIDタイプのLEDランプ1を中心方向に向けさせる(セルフアライメント)効果が働き、図7のように傾けて使用する場合にも、HIDタイプのLEDランプ1が照明器具11の中心から重力の作用する方向Gにずれるのを有効に防止することができる。   9A, 9 </ b> B, and 10, in the luminaire 11, the opening diameter (or opening width) of the luminaire cover 12 is narrowed toward the cap socket 13. Here, the annular main body 22 of the support member (heat dissipating stay) 21 becomes the HID type LED lamp 1 so that the plurality of U-shaped portions 23 of the support member (heat dissipating stay) 21 face the cap socket 13. At this time, the plurality of U-shaped portions 22 abut on the luminaire cover 12 and act as elastic members (spring members) that press the luminaire cover 12 outward (in the direction of arrow H in FIG. 10). . As described above, the provision of the plurality of U-shaped portions 22 as the elastic members (spring members) has an effect of directing the HID type LED lamp 1 toward the center (self-alignment), and FIG. Even when tilted and used, the HID type LED lamp 1 can be effectively prevented from shifting from the center of the luminaire 11 in the direction G in which gravity acts.

なお、上述の例では、支持部材(放熱ステー)21は、円環状の本体部22と、円環状の本体部22の円環に沿って、外側にU字形状に曲げられた複数のU字形状部23とを有しているとしたが(また、照明器具カバー12も円環状のものとして図示されているが)、支持部材(放熱ステー)21および照明器具カバー12は、円環状のものに限らず、四角、五角、六角などの角環状のものであってもよい。すなわち、支持部材(放熱ステー)21および照明器具カバー12は、環状形状のものであればよい。ここで、本発明において、環状形状とは、完全に環状につながった形状のみならず、例えば図13(a),(b)に示すように、環状の一部が途切れたもの(図13(a),(b)には、途切れた箇所が符号40で図示されている)をも含むものとする。なお、図13(a)は斜視図、図13(b)は図13(a)の矢印Cの方向から見た平面図である。   In the above-described example, the support member (heat dissipating stay) 21 includes an annular main body 22 and a plurality of U-shaped bent outwardly along the annular ring of the annular main body 22. Although the shape portion 23 is included (the luminaire cover 12 is also illustrated as an annular shape), the support member (heat dissipating stay) 21 and the luminaire cover 12 are annular shapes. It is not limited to this, and it may be an annular shape such as a square, a pentagon, or a hexagon. That is, the support member (heat dissipating stay) 21 and the luminaire cover 12 may be annular. Here, in the present invention, the annular shape is not limited to a shape that is completely connected in an annular shape, but is a shape in which a portion of the annular shape is interrupted as shown in FIGS. 13 (a) and 13 (b) (FIG. 13 ( It is assumed that a) and (b) also include an interrupted portion indicated by reference numeral 40. 13A is a perspective view, and FIG. 13B is a plan view seen from the direction of arrow C in FIG.

換言すれば、本発明は、HIDタイプのLEDランプ1の筐体2と照明器具11の照明器具カバー12との間に、所定の熱伝導率を持つ(熱伝導率の高い)支持部材21が設けられ、該支持部材21は、環状形状のものであって、環状形状の内側部分でHIDタイプのLEDランプ1の筐体2と当接し、環状形状の外側部分で照明器具11の照明器具カバー12と当接している構成であればよく、これによって、照明器具11にHIDタイプのLEDランプ1をセットしたときに、HIDタイプのLEDランプ1からの熱を効率良く放熱することができるという効果が得られる。   In other words, according to the present invention, the support member 21 having a predetermined thermal conductivity (high thermal conductivity) is provided between the housing 2 of the HID type LED lamp 1 and the lighting fixture cover 12 of the lighting fixture 11. The support member 21 is provided in an annular shape, and is in contact with the housing 2 of the HID type LED lamp 1 at the inner portion of the annular shape, and the luminaire cover of the luminaire 11 at the outer portion of the annular shape. As long as the HID type LED lamp 1 is set in the lighting fixture 11, the heat from the HID type LED lamp 1 can be efficiently radiated. Is obtained.

また、上述の例では、弾性部材(バネ部材)を複数のU字形状部22として構成したが、支持部材21は、照明器具カバー12と当接する環状形状の外側部分に弾性構造を有していればよく、弾性構造としては、複数のU字形状部22に限らず、照明器具カバー12を外側方向(図10の矢印Hの方向)に押圧するものであれば、任意の弾性構造体を使用することができる。   In the above-described example, the elastic member (spring member) is configured as a plurality of U-shaped portions 22, but the support member 21 has an elastic structure in an annular outer portion that contacts the lighting fixture cover 12. The elastic structure is not limited to the plurality of U-shaped portions 22, and any elastic structure may be used as long as it presses the lighting fixture cover 12 in the outer direction (the direction of the arrow H in FIG. 10). Can be used.

換言すれば、本発明は、支持部材21が、照明器具カバー12と当接する環状形状の外側部分に弾性構造を有していることにより、照明器具11にHIDタイプのLEDランプ1をセットしたときに、HIDタイプのLEDランプ1からの熱を効率良く放熱することができるとともに、HIDタイプのLEDランプ1が照明器具11の中心から重力の作用する方向にずれるのを有効に防止することができる。   In other words, according to the present invention, when the support member 21 has an elastic structure in the outer portion of the annular shape that comes into contact with the luminaire cover 12, the HID type LED lamp 1 is set in the luminaire 11. In addition, the heat from the HID type LED lamp 1 can be efficiently radiated, and the HID type LED lamp 1 can be effectively prevented from being displaced from the center of the lighting fixture 11 in the direction in which gravity acts. .

また、上述した本発明の照明装置は、例えばスポットライトやダウンライトなどに使用できる。   Moreover, the illuminating device of this invention mentioned above can be used for a spotlight, a downlight, etc., for example.

本発明は、スポットライトやダウンライトなどの照明一般に利用可能である。   The present invention can be used for general illumination such as spotlights and downlights.

1 HIDタイプのLEDランプ
2 筐体
3 口金
5 LED
6 出射窓
7 フィン構造
11 照明器具
12 照明器具カバー
13 口金ソケット
21 支持部材(放熱ステー)
22 円環状の本体部
23 複数のU字形状部
1 LED lamp of HID type 2 Housing 3 Base 5 LED
6 Outgoing window 7 Fin structure 11 Lighting fixture 12 Lighting fixture cover 13 Base socket 21 Support member (heat dissipating stay)
22 annular body 23 multiple U-shaped parts

Claims (2)

所定の熱伝導率を持つ照明器具カバーと口金ソケットとを有する照明器具と、所定の熱伝導率を持つ筐体と口金とを有し、前記照明器具の口金ソケットに口金が装着されるLEDランプとを備えた照明装置であって、前記LEDランプと前記照明器具カバーとの間には、所定の熱伝導率を持つ支持部材が設けられ、該支持部材は、環状形状のものであって、環状形状の内側部分で前記LEDランプの前記筐体と当接し、環状形状の外側部分で前記照明器具カバーと当接していることを特徴とする照明装置。 An LED lamp having a lighting fixture cover and a base socket having a predetermined thermal conductivity, a casing and a base having a predetermined thermal conductivity, and the base is mounted on the base socket of the lighting fixture A support member having a predetermined thermal conductivity is provided between the LED lamp and the luminaire cover, and the support member has an annular shape, An illuminating device, wherein the inner portion of the annular shape contacts the casing of the LED lamp, and the outer portion of the annular shape contacts the luminaire cover. 請求項1記載の照明装置において、前記支持部材は、照明器具カバーと当接する環状形状の外側部分に弾性構造を有していることを特徴とする照明装置。 The lighting device according to claim 1, wherein the support member has an elastic structure in an outer portion of an annular shape that contacts the lighting fixture cover.
JP2010148700A 2010-06-30 2010-06-30 Lighting device Pending JP2012014900A (en)

Priority Applications (1)

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Cited By (1)

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Publication number Priority date Publication date Assignee Title
JP5379335B1 (en) * 2012-07-05 2013-12-25 パナソニック株式会社 Lamp and lighting device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3125836U (en) * 2006-07-21 2006-10-05 李 家茂 Light source heat conduction structure
WO2008036596A1 (en) * 2006-09-18 2008-03-27 Cree Led Lighting Solutions, Inc. Lighting devices, lighting assemblies, fixtures and methods using same
JP2011065795A (en) * 2009-09-16 2011-03-31 Toshiba Lighting & Technology Corp Heat radiation adapter, lamp device, and lighting fixture

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3125836U (en) * 2006-07-21 2006-10-05 李 家茂 Light source heat conduction structure
WO2008036596A1 (en) * 2006-09-18 2008-03-27 Cree Led Lighting Solutions, Inc. Lighting devices, lighting assemblies, fixtures and methods using same
JP2011065795A (en) * 2009-09-16 2011-03-31 Toshiba Lighting & Technology Corp Heat radiation adapter, lamp device, and lighting fixture

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5379335B1 (en) * 2012-07-05 2013-12-25 パナソニック株式会社 Lamp and lighting device
WO2014006794A1 (en) * 2012-07-05 2014-01-09 パナソニック株式会社 Lamp and lighting apparatus
JP2014029866A (en) * 2012-07-05 2014-02-13 Panasonic Corp Lamp and luminaire

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