JP2012009781A - Light emitting module and lighting apparatus having the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light emitting module capable of preventing a wiring pattern from becoming high resistance, hardly disrupting reflection of light at a module substrate side, and improving a light extraction efficiency at low cost.SOLUTION: A wiring pattern 25 for positive electrode and a wiring pattern 26 for negative electrode of a light emitting module 21 are made principally of Ag, and are provided on a module substrate 22 as light reflecting surfaces. A plurality of semiconductor light emitting elements 45 are mounted on the substrate, and these elements and wiring patterns are electrically connected with each other via bonding wires 47 to 52. A sealing resin 57 is provided on the substrate, and seals each of the light emitting elements, each part of wiring patterns and bonding wires. A part of wiring patterns not sealed with the resin, contains a feeding pad part. A protective layer 37 is coated on the unsealed part except the pad part out of the sealing resin so as to be limited as large as a periphery of the part.

Description

  Embodiments of the present invention relate to a light-emitting module that can be suitably used for, for example, a light source, and a lighting device such as a road lamp that includes the module as a light source.

  As a COB (Chip On Board) type light emitting module, a plurality of semiconductor light emitting elements, for example, chip-shaped LEDs (light emitting diodes) are arranged between a plurality of wiring patterns provided on a module substrate, and these LEDs are connected with bonding wires. A device having a configuration in which a wiring pattern, each LED, and the like are embedded with a sealing resin mixed with a phosphor is known as a prior art.

  When white light emission is obtained with this light emitting module, an LED that emits blue light is generally used, and a yellow phosphor that emits yellow light when excited by blue light is used as the phosphor. Thereby, the surface of the sealing resin functions as a white light emitting surface.

  In such a light emitting module having a light emitting surface, the wiring pattern of the positive electrode and the negative electrode is made of Ag (silver), because the color of light reflected by the wiring pattern is similar to the color of the light emitting surface. The light color reflected by the wiring pattern or the like on the surface is less likely to be affected, and is preferable in terms of relatively low cost.

  Both of the wiring patterns have an electrode pad portion to which a power supply external electric wire or a connector to which the electric wire is connected is soldered, and the pad portion is pulled out of the sealing resin of the silver wiring pattern. It is formed at the tip of the turned part. If this part is exposed to the atmosphere, it may deteriorate due to reaction with sulfur gas in the air, and as a result, there is a risk that the part constituting the power feeding path may become highly resistive. is there.

  This inconvenience can be solved by laminating a resist layer of approximately the same size as the substrate on the module substrate to cover the portion. However, the use of such a resist layer is a factor of high cost, and improvement is desired.

  Although it is desired to increase the light extraction efficiency of the COB type light emitting module as much as possible, the light reflection performance on the module substrate is not good, or the initial light reflection performance cannot be maintained, and this performance gradually decreases. In such a case, it is difficult to satisfy the above requirements sufficiently.

  By the way, the COB type light emitting module is configured to reflect the light incident from the light emitting element at the portion of the module substrate covered with the sealing resin in the use direction. Therefore, for example, a configuration in which a part of the resist layer is covered with a sealing resin is not preferable because the reflection area is reduced. In addition, when the electrode pad portion and the portion for the energization path continuous thereto are covered with the sealing resin, the resist layer can be omitted, but the reflection is disturbed by the electrode pad portion to which the electric wire is connected. This is not preferable because the reflection area is reduced.

JP 2009-290244 A

  The embodiment provides a light emitting module capable of preventing the reflection of light on the module substrate side from being disturbed and preventing the increase in resistance of the wiring pattern at low cost, and increasing the light extraction efficiency, and the module as a light source It is going to provide the lighting fixture provided as.

  In order to solve the above problems, a light emitting module of an embodiment includes a module substrate having a light reflecting surface, a wiring pattern for a positive electrode, a wiring pattern for a negative electrode, a plurality of semiconductor light emitting elements, a bonding wire, and a translucent sealing. A member and a protective layer are provided. Both wiring patterns are mainly composed of silver and are provided on the module substrate. Each light emitting element is mounted on a module substrate, and these light emitting elements and both wiring patterns are electrically connected by bonding wires. A sealing member is provided on the module substrate to seal each light emitting element, each part of both wiring patterns, and the bonding wire. A portion outside the sealing member that is not sealed with the sealing member in the wiring pattern includes a power supply pad portion. The protective layer is characterized in that it is applied to the outer portion of the sealing member except for the power supply pad portions of both wiring patterns so as to be limited in size over the periphery of this portion.

  According to the light emitting module of the embodiment, it is possible to prevent the reflection of light on the module substrate side from being disturbed and to increase the light extraction efficiency while preventing a high resistance of the wiring pattern at low cost. The effect can be expected.

It is a perspective view which shows the road light provided with the light emitting module which concerns on Example 1. FIG. It is a perspective view which expands and shows the lamp of the road light of FIG. It is a perspective view which shows the light source device with which the lamp of FIG. 2 is provided. It is a schematic front view which shows the light source device of FIG. It is a front view which shows the light emitting module with which the light source device of FIG. 3 is provided. It is a front view which shows the light emitting module of FIG. 5 in the state which passed through the 1st manufacturing process. It is a front view which shows the light emitting module of FIG. 5 in the state which passed through the 2nd manufacturing process. It is a front view which shows the light emitting module of FIG. 5 in the state which passed through the 3rd manufacturing process. It is a front view which shows the light emitting module of FIG. 5 in the state which passed through the 4th manufacturing process. FIG. 5 is a cross-sectional view taken along line F10-F10 in FIG.

  The light emitting module according to the first embodiment includes a module substrate having a light reflecting surface; a positive electrode wiring pattern having a positive electrode power supply pad portion and having silver as a main component provided on the module substrate; A negative electrode wiring pattern having silver as a main component and provided on the module substrate with a power supply pad portion; a plurality of semiconductor light emitting elements mounted on the module substrate located between the two wiring patterns; A bonding wire provided by electrically connecting the semiconductor light emitting element and the two wiring patterns; and sealing the semiconductor light emitting element, a part of the wiring pattern, and the bonding wire on the module substrate; A translucent sealing member provided on the outer periphery of the wiring member, and an outer portion of the sealing member that is not sealed by the sealing member among the two wiring patterns includes the power supply pad portion. , The sealing member outer portion except the pad portion and the protective layer is deposited by limiting the size over the periphery of the part; is characterized by comprising a.

  In the first embodiment, the module substrate may be made of a synthetic resin such as an epoxy resin, a metal base substrate in which an insulating layer is laminated on a metal plate, or an inorganic material such as ceramics. When the module substrate is made of white ceramic, the ceramic is selected from aluminum oxide (alumina), aluminum nitride, boron nitride, silicon nitride, magnesium oxide, forsterite, steatite, and low-temperature sintered ceramics. In particular, white alumina that is inexpensive, has high light reflectivity, and is easy to process can be suitably used. In the first embodiment, that the wiring pattern is mainly composed of silver includes pure silver wiring patterns and wiring patterns formed by silver plating or the like.

  In the first embodiment, for example, various light-emitting elements in which a compound semiconductor is provided on an element substrate can be used as the semiconductor light-emitting element, and in particular, a blue LED made of a bare chip that emits blue light is used. Although it is preferable, it is also possible to use a semiconductor light emitting element that emits ultraviolet light or green light.

  In the first embodiment, the bonding wire may be a fine metal wire, such as a gold wire, an aluminum wire, a copper wire, and a platinum wire, but in particular, moisture resistance, environment resistance, adhesion, electrical conductivity, It is preferable to use a gold wire having good thermal conductivity and elongation as a bonding wire.

  In Embodiment 1, a light-transmitting resin material such as an epoxy resin, a urea resin, or a silicone resin can be used for the sealing member, and a light-transmitting glass can also be used. In the first embodiment, the phosphor may or may not be mixed in the sealing member. The phosphor mixed in the sealing member is excited by light emitted from the semiconductor light emitting element, and emits light of a color different from this light. The color of the emitted light and the emission color of the semiconductor light emitting element For example, in order to obtain white illumination light under the condition of using a blue LED as a semiconductor light emitting element, a yellow phosphor may be used. Further, in order to obtain white illumination light under the condition of using an LED that emits ultraviolet light for the semiconductor light emitting element, red, blue, and yellow phosphors may be used.

In Embodiment 1, an inorganic material having electrical insulating properties such as glass or glass mainly composed of SiO ₂ can be suitably used for the protective layer. Furthermore, the protective layer may or may not be mixed with a pigment that imparts color to this layer.

  In Embodiment 1, a part of a wiring pattern mainly composed of positive and negative silver provided on a module substrate is covered and sealed with a sealing member, and the remaining part of both wiring patterns, That is, the part outside the sealing member that is disposed outside the sealing member and is not sealed with the sealing member is sealed with the protective layer that is attached to this part. For this reason, it is possible to prevent the two wiring patterns from increasing in resistance as both of the wiring patterns that form a path for feeding power to the semiconductor light emitting element are suppressed from being sulfurized and deteriorated by sulfur components in the atmosphere. is there.

  Furthermore, since the protective layer is provided on the outside of the sealing member of the wiring pattern that is not sealed with the sealing member so as to be limited in size to the periphery of this part, the material for forming the protective layer Can reduce the amount of use.

  Moreover, since the protective layer is provided outside the sealing region of the sealing member, the light reflection area of the module substrate having a size corresponding to the sealing area of the sealing member is not reduced by the protective layer. In addition, since the power supply pad portion is disposed outside the sealing region, the power supply pad portion does not become a factor for reducing the light reflection area of the module substrate, and reflection of light on the module substrate side is disturbed by the power supply pad portion. It is never done.

  Therefore, according to the first embodiment, the reflection of light on the module substrate side is hardly disturbed and the light extraction efficiency can be improved while preventing an increase in resistance of the wiring pattern mainly composed of silver at a low cost. Is possible.

  The light emitting module of Embodiment 2 is the same as that of Embodiment 1 except that both wiring patterns have the component connection pad portions exposed to the relief portions formed in the protective layer, and are connected to these component connection pad portions. An electrical component for preventing abnormal light emission of the semiconductor light emitting element is mounted on the module substrate.

  In this second embodiment, in addition to the first embodiment, the component connecting pad portion and the electric component connected thereto are arranged outside the sealing member. The reflection of light is not disturbed, and the light reflection area on the module substrate side is not reduced. Therefore, the light extraction efficiency can be further improved by appropriately reflecting light on the module substrate side.

  In the light emitting module of Embodiment 3, in Embodiment 1 or 2, the ground surface of the module substrate forms the light reflecting surface, and the protective layer has a color different from that of the ground surface. It is characterized by.

  This Embodiment 3 is the same as in Embodiment 1 or 2, but the protective layer is provided outside the sealing region of the sealing member as described above even though the protective layer is colored. It can suppress that the light reflection performance of a module board | substrate falls by the color of a protective layer.

  The fourth embodiment is characterized in that, in the third embodiment, an identity mark made of the same material as that of the protective layer is provided on the module substrate outside the sealing member.

  In the fourth embodiment, since the protective layer and the identity mark can be provided on the module substrate simultaneously by printing or the like in the third embodiment, the cost can be reduced.

  A lighting fixture according to a fifth embodiment includes a light source device having the light emitting module according to any one of the first to fourth embodiments as a light source; and a fixture main body to which the light source device is attached. It is a feature. This Embodiment 5 can be applied to any type of lighting fixture without being restricted by the road lamp described in Example 1 described later.

  In the lighting fixture according to the fifth embodiment, since the light source device includes the light emitting module according to any one of the first to fourth embodiments as a light source, the resistance of the wiring pattern is prevented from being increased at low cost. However, the reflection of light on the module substrate side is hardly disturbed, and the light extraction efficiency can be increased.

  Hereinafter, the lighting fixture provided with the light emitting module of Example 1, for example, a road lamp, is demonstrated in detail with reference to FIGS.

  Reference numeral 1 in FIG. 1 indicates a road lamp 1 installed for road lighting. The road lamp 1 is formed by attaching a lamp 3 to the upper end of a column 2.

  The column 2 is erected on the side of the road, and its upper part is bent so as to cover the road. As shown in FIG. 2, the lamp 3 includes a fixture body connected to the column 2 as shown in FIG. 2, for example, a lamp body 4, a translucent plate 5 attached to the lamp body 4 by closing the lower surface opening of the lamp body 4 facing the road, At least one light source device 6 accommodated in the lamp body 4 is formed to face the light transmitting plate 5. The lamp body 4 is formed by combining a metal, for example, a plurality of aluminum die cast products. The translucent plate 5 is made of tempered glass.

  As shown in FIGS. 3 and 4, the light source device 6 has a plurality of heat radiation fins 14 protruding from the back surface of the device base 11, and a reflector 15 and a light emitting module 21 as a light source are attached to the front surface of the device base 11. This is a unitized configuration.

  The device base 11 is made of a metal, for example, aluminum die-cast, and is formed in a square shape. The apparatus base 11 has a module installation portion 12 (see FIGS. 4 and 10) formed of a square recess opened on the front surface thereof. The bottom surface 12a of the module installation part 12 is flat, and the four side surfaces 12b defining the module installation part 12 are continuous at right angles to each other. The heat radiating fins 14 are formed integrally with the apparatus base 11.

  The reflector 15 is formed by combining the first reflecting plate 15a to the fourth reflecting plate 15d in a trumpet shape. The first reflecting plate 15a and the second reflecting plate 15b are flat mirrors having a flat configuration, and are provided in parallel to each other. The third reflecting plate 15c and the fourth reflecting plate 15d connected to the first reflecting plate 15a and the second reflecting plate 15b are curved mirrors having a curved configuration so that the distance between them gradually increases. Is provided.

  The light source device 6 is fixed in the lamp body 4 with the exit opening of the reflector 15 facing the translucent plate 5. In this fixed state, a part of the device base 11, for example, a peripheral portion is connected to the inner surface of the lamp body 4 so as to be able to conduct heat. This thermal connection can be realized by bringing the peripheral portion into direct contact with the inner surface of the lamp body 4, and the peripheral portion is connected to the inner surface of the lamp body 4 through a heat conductive member such as a metal or a heat pipe having high heat dissipation. It can be realized by connecting to. As a result, the heat generated by the light source device 6 can be released to the outside using the metal lamp body 4 as a heat radiating surface.

  Next, the light emitting module 21 will be described. As shown in FIG. 5 and the like, the light emitting module 21 includes a module substrate 22, a positive wiring pattern 25, a negative wiring pattern 26, an alignment mark 35, a first protective layer 37, and a second protection. Layer 38, a plurality of identity marks such as a first identity mark 41 to a fourth identity mark 44, a plurality of semiconductor light emitting elements 45, bonding wires 47 to 52, a frame 55, and a sealing member such as A sealing resin 57 and electrical components such as a connector 61 and a capacitor 65 are provided.

  The module substrate 22 is made of white ceramic, for example, white aluminum oxide. The module substrate 22 may be formed of only aluminum oxide, but may contain aluminum oxide as a main component and other ceramics or the like mixed therein. The content is preferably 70% or more.

  The average reflectance with respect to the visible light region on the ground surface of the white module substrate 22 is 80% or more, and more preferably 85% or more and 99% or less. Therefore, the module substrate 22 has similar light for blue light having a specific emission wavelength of 440 nm to 460 nm emitted by a blue LED described later and yellow light having a specific emission wavelength of 470 nm to 490 nm emitted by a phosphor described later. Exhibits reflective performance.

  As shown in FIG. 4, the module substrate 22 has a substantially rectangular shape that is slightly smaller than the module installation portion 12. As shown in FIG. 5, the four corners of the module substrate 22 are rounded. The thickness of the module substrate 22 is thinner than the depth of the module installation part 12 as shown in FIG. Both surfaces of the module substrate 22 are flat surfaces made parallel to each other, and one of the surfaces is used as a component mounting surface 22a that also serves as a light reflecting surface.

  The positive electrode wiring pattern 25 and the negative electrode wiring pattern 26 are provided on the component mounting surface 22a.

  Specifically, as shown in FIG. 6 and the like, the positive electrode wiring pattern 25 has a positive electrode pattern base portion 25a and a wire connection portion 25b. The wire connecting portion 25b is formed to extend straight. The positive electrode pattern base portion 25a and the wire connection portion 25b are substantially parallel to each other and are integrally continuous via an oblique pattern portion. A positive electrode power supply pad portion such as a first positive electrode pad portion 25c and a component connection pad portion such as a second positive electrode pad portion 25d are integrally projected from the positive electrode pattern base portion 25a.

  The negative electrode wiring pattern 26 includes a negative electrode pattern base portion 26a, a first wire connection portion 26b, an intermediate pattern portion 26c, and a second wire connection portion 26d. This wiring pattern 26 is provided so as to surround the wiring pattern 25 for the positive electrode.

  That is, the negative electrode pattern base portion 26a is provided adjacent to the positive electrode pattern base portion 25a of the wiring pattern 25 with a predetermined insulation distance A (see FIG. 6). For example, a first negative electrode pad portion 26e protrudes integrally from the negative electrode pattern base portion 26a as a negative electrode power supply pad portion provided side by side with the first positive electrode pad portion 25c. The first wire connecting portion 26b is integrally continuous so as to be bent about 90 ° with respect to the negative electrode pattern base portion 26a. The first wire connection portion 26b is provided substantially parallel to the wire connection portion 25b by forming a first element disposition space S1 between the wire connection portion 25b of the wiring pattern 25. Here, “substantially parallel” includes a parallel form as shown in FIG. 6, a slightly inclined form with respect to the wire connecting portion 25 b, a slightly curved form, and the like.

  The intermediate pattern portion 26c is provided integrally and continuously so as to be bent about 90 ° with respect to the first wire connecting portion 26b. The leading end of the wire connecting portion 25b (the end opposite to the positive electrode pattern base portion 25a) is adjacent to the intermediate portion in the longitudinal direction of the intermediate pattern portion 26c. Both end portions of the intermediate pattern portion 26c are inclined in opposite directions, and the intermediate pattern portion 26c is formed in a substantially curved shape. Thereby, the intermediate portion in the longitudinal direction of the intermediate pattern portion 26c is kept away from the tip of the wire connection portion 25b.

  The second wire connecting portion 26d is provided integrally and continuously so as to be bent by approximately 90 ° with respect to the intermediate pattern portion 26c. Thereby, the second wire connecting portion 26d is provided substantially parallel to the wire connecting portion 25b by forming the second element disposition space S2 between the wire connecting portion 25b of the wiring pattern 25 and the second element connecting space 25b. Here, “substantially parallel” includes a parallel form as shown in FIG. 6, a slightly inclined form with respect to the wire connecting portion 25b, a slightly curved form, and the like.

  Therefore, the negative electrode wiring pattern 26 is provided so as to surround the positive electrode wiring pattern 25 from three directions. The first wire connecting portion 26b and the second wire of the negative wiring pattern 26 are bordered by the wire connecting portion 25b of the wiring pattern 25 disposed in the center of the region surrounded by the negative wiring pattern 26. The connecting portions 26d are arranged symmetrically.

  A component connecting pad portion, for example, a second negative electrode pad portion 26f is provided corresponding to the second positive electrode pad portion 25d continuously at the tip of the second wire connecting portion 26d. The second negative electrode pad portion 26f is separated from the second positive electrode pad portion 25d, and a component connecting pad portion, for example, an intermediate pad 27 is formed on the component mounting surface 22a so as to be positioned therebetween.

  The wiring pattern 25 may be used for the negative electrode and the wiring pattern 26 may be used for the positive electrode. In this case, “positive electrode” or “positive electrode” in the above description is read as “for negative electrode” or “negative electrode” and “negative electrode” “For” or “negative electrode” may be read as “for positive electrode” or “positive electrode”.

  Further, lighting inspection pads 28 and 29 for lighting confirmation test, temperature inspection pad 31 for temperature measurement, and mounting pad 33 for fixing components are provided on the component mounting surface 22a.

  That is, the lighting inspection pad 28 is connected to the wiring pattern 25 for the positive electrode. Specifically, a lighting inspection pad 28 is provided through a pattern portion 28a branched from the positive electrode pattern base portion 25a and integrally protruding. Similarly, the lighting inspection pad 29 is connected to the wiring pattern 26 for the negative electrode. Specifically, a lighting inspection pad 29 is provided through a pattern portion 29a branched from the negative electrode pattern base portion 26a and integrally protruding.

  The temperature inspection pad 31 is provided in the vicinity of the lighting inspection pad 29 and the negative wiring pattern 26 independently of each other without having an electrical connection relationship therewith. A thermocouple is connected to the temperature inspection pad 31 so that the temperature of the light emitting module 21 can be measured.

  A pair of mounting pads 33 are formed, and these are provided between the lighting inspection pads 28 and 29.

  The alignment mark 35 includes a wire connecting portion 25b, a first element disposing space S1 and a second element disposing space S2 on both sides thereof, a first wire connecting portion 26b adjacent to the first element disposing space S1, and a second A plurality of second wire connecting portions 26d adjacent to the element arrangement space S2 are provided on both sides of the second wire connecting portion 26d. Therefore, a part of the alignment mark 35 is provided in a line along the longitudinal direction of the first wire connection part 26b at a predetermined interval, and the other alignment marks 35 are similarly connected to the second wire at a predetermined interval. It is provided in a line along the longitudinal direction of the portion 26d.

  The wiring patterns 25 and 26, the intermediate pad 27, the lighting inspection pads 28 and 29, the mounting pad 33, and the alignment mark 35 are formed of, for example, a single layer mainly composed of silver, and are printed, for example, on a screen. It is provided by printing on the component mounting surface 22a by printing (first manufacturing process). In addition, it can replace with printing and can also provide by plating.

The first protective layer 37 and the second protective layer 38 are electrically insulating, for example, made of glass, and have a color that is distinct from the background color of the module substrate 22, for example, white, and is clearly black. Therefore, a material in which a black pigment is mixed with SiO ₂ which is a main component of these protective layers is used. The first protective layer 37 and the second protective layer 38 are provided on the component mounting surface 22a by printing, for example, screen printing (second manufacturing process).

  As a result of this printing, the first protective layer 37 has a portion excluding the wire connection portion 25b of the wiring pattern 25 and the first wire connection portion 26b and the second wire connection portion 26d of the wiring pattern 26 as shown in FIG. It is attached to the removed part.

  Specifically, the first protective layer 37 includes the first positive electrode pad portion 25c and the second positive electrode pad portion 25c included in the portion of the wiring pattern 25 that is not sealed with the sealing resin 57 described later. It is attached to the positive electrode pattern base 25a except for the positive electrode pad portion 25d, and is also applied to the pattern portion 28a except for the lighting inspection pad 28.

  Further, the first protective layer 37 is a negative electrode pattern base portion excluding the first negative electrode pad portion 26e included in the portion of the wiring pattern 26 that is not sealed with the sealing resin 57 described later. 26a. In addition, the first protective layer 37 is also applied to the gap portion that secures the insulation distance A between the positive electrode pattern base 25a and the negative electrode pattern base 26a, and the pattern portion except for the lighting inspection pad 29. It is also attached to 29a. In addition, the first protective layer 37 is a second negative electrode of the second wire connecting portion 26d included in the portion outside the sealing member of the wiring pattern 26 that is not sealed with the sealing resin 57 described later. It is attached to the end portion on the pad portion 26f side except for the second negative electrode pad portion 26f, and is also attached to the intermediate pad 27 except for both end portions of the intermediate pad 27.

  For the above-described deposition, as shown in FIG. 7 and the like, the first protective layer 37 has a first escape portion 37 a that exposes the second positive electrode pad portion 25 d and one end portion of the intermediate pad 27. In addition, the second negative electrode pad portion 26 f and the second relief portion 37 b that exposes the other end portion of the intermediate pad 27 are provided. The first protective layer 37 is applied to the outer portion of the sealing member as described above, with the size of the first protective layer 37 limited to the size of the periphery of this portion.

  As shown in FIG. 7, the second protective layer 38 is attached to substantially the entire intermediate pattern portion 26 c included in the outer portion of the sealing member that is not sealed with the sealing resin 57 described later of the wiring pattern 26. This second protective layer 38 is also applied to the outer portion of the sealing member as described above, with the size of the second protective layer 38 limited to the size of the periphery of this portion.

  The first identity mark 41 to the fourth identity mark 44 are arranged around the outside of a sealing resin 57 to be described later and are printed on the component mounting surface 22a of the module substrate 22 by, for example, screen printing. (Third manufacturing process). Further, by this printing, polarity indications such as “+” and “−” are also provided on the component mounting surface 22a. The first identity mark 41 is a company name indicating the manufacturer, the second identity mark 42 is a product name, the third identity mark 43 is a product number, and the fourth identity mark 44 is It is a two-dimensional barcode (QR code) showing information about the light emitting module 21.

  The first identity mark 41 to the fourth identity mark 44 are printed in a color different from that of the module substrate 22, for example, from the same printing material as the first protective layer 37 and the second protective layer 38. Therefore, it is black and is provided on the peripheral portion of the module substrate 22 by printing simultaneously with the first protective layer 37 and the second protective layer 38.

  Since the first identity mark 41 to the fourth identity mark 44 made of the same material as the first protection layer 37 and the second protection layer 38 are provided on the module substrate 22 in this way, the first protection layer 37 and the second protective layer 38 and the first identity mark 41 to the fourth identity mark 44 can be simultaneously provided on the module substrate 22 by printing. Therefore, in the manufacture of the light emitting module 21, there is no need to separate the process of providing the first protective layer 37 and the second protective layer 38 and the process of providing the first identity mark 41 to the fourth identity mark 44. It is possible to reduce the cost.

  For each of the plurality of semiconductor light emitting elements 45, a light emitting element that generates heat in a light emitting state, for example, a chip-like blue LED that emits blue light is used. These semiconductor light emitting elements 45 are preferably formed of a bare chip having a configuration in which a semiconductor light emitting layer is provided on a light-transmitting element substrate made of sapphire glass and a pair of element electrodes is provided on the light emitting layer.

  Since light emission of an LED is realized by passing a forward current through a pn junction of a semiconductor, the LED is a solid element that directly converts electric energy into light. A semiconductor light emitting element that emits light based on such a light emission principle has an energy saving effect as compared with an incandescent bulb that inclines a filament to a high temperature by energization and emits visible light by its thermal radiation.

  Half of the semiconductor light emitting elements 45 are directly mounted on the module substrate 22 in the first element disposition space S1. This mounting is realized by bonding the element substrate to the component mounting surface 22a using a transparent die bond material, and the plurality of semiconductor light emitting elements 45 mounted in the first element disposition space S1 are aligned vertically and horizontally. Arranged in a matrix. Similarly, the remaining semiconductor light emitting elements 45 are mounted directly on the module substrate 22 in the second element arrangement space S2. This mounting is also realized by adhering the element substrate to the component mounting surface 22a using a transparent die bond material, and the plurality of semiconductor light emitting elements 45 mounted in the second element arrangement space S2 are also aligned vertically and horizontally. Arranged in a matrix.

  The plurality of semiconductor light emitting elements 45 disposed in the first element disposition space S1 and the plurality of semiconductor light emitting elements 45 disposed in the second element disposition space S2 are provided symmetrically with respect to the wire connection portion 25b. It has been.

  The semiconductor light emitting elements 45 arranged in a line in the direction in which the wire connection part 25 b of the wiring pattern 25 and the first wire connection part 26 b of the wiring pattern 26 are arranged are connected in series by a bonding wire 47. The semiconductor light emitting elements 45 arranged at one end of the element rows connected in series in this way are connected to the wire connecting portion 25b by the bonding wires 48. At the same time, the semiconductor light emitting element 45 disposed at the other end of the element row is connected to the first wire connecting portion 26b by a bonding wire 49.

  Similarly, the semiconductor light emitting elements 45 arranged in a row in the direction in which the wire connection portion 25 b of the wiring pattern 25 and the second wire connection portion 26 d of the wiring pattern 26 are arranged are connected in series by a bonding wire 50. . The semiconductor light emitting element 45 arranged at one end of the element rows thus connected in series is connected to the wire connecting portion 25b by the bonding wire 51. At the same time, the semiconductor light emitting element 45 disposed at the other end of the element row is connected to the second wire connecting portion 26d by the bonding wire 52 (fourth manufacturing process). The bonding wires 47 to 52 are all made of fine metal wires, preferably gold wires, and are provided by wire bonding.

  By electrically connecting a plurality of semiconductor light emitting elements 45 mounted on the module substrate 22 as described above, a COB (Chip On Board) type light emitting module 21 is configured. Due to the electrical connection, the plurality of semiconductor light emitting elements 45 provided in the element disposition spaces S1 and S2 are electrically connected to, for example, 12 element rows formed by connecting 7 semiconductor light emitting elements 45 in series. Is an array connected in parallel.

  The alignment marks 35 are respectively disposed on the extended lines of the element rows in series. Then, with reference to the left and right (in the drawing) alignment marks 35 positioned on the extension line, the semiconductor light emitting element 45 is mounted by a mounting machine on a straight line passing therethrough.

  As shown in FIG. 9, the frame 55 has, for example, a square ring shape, and each of the wire connecting portions 25b, 26b, and 26d, the plurality of semiconductor light emitting elements 45, and the bonding wires 47 to 52 are housed inside the frame. Mounted on the surface 22a. The frame 55 is preferably made of a white synthetic resin. The frame 55 is attached to part of the first protective layer 37 and part of the second protective layer 38.

  The sealing resin 57 is filled in the frame 55 and seals the wire connecting portions 25b, 26b, and 26d, the plurality of semiconductor light emitting elements 45, and the bonding wires 47 to 52 in an embedded state. Are provided on the module substrate 22 (fifth manufacturing step). A region covered with the sealing resin 57 in the component mounting surface 22a is used as a light reflecting surface. The sealing resin 57 is made of a transparent silicone resin or the like mixed with a phosphor (not shown), and is translucent and gas permeable. A yellow phosphor that emits yellow light when excited by blue light emitted from the semiconductor light emitting element 45 is used as the phosphor.

  White light is formed by mixing the blue light and yellow light having a complementary color to the blue light, and the white light is emitted from the surface of the sealing resin 57 in the light use direction. Therefore, the light emitting surface 57 a of the light emitting module 21 is formed by the surface of the sealing resin 57, that is, the light emitting surface. The size of the light emitting surface 57 a is defined by the frame 55.

  When the area of the silver portion covered with the sealing resin 57 is C and the area of the light emitting surface 57a is D, the occupation ratio of the area C to the area D is set to 5% or more and 40% or less. . The portions covered with the sealing resin 57 of the wiring patterns 25 and 26 are the wire connection portions 25b, 26b, and 26d.

  Alternatively, the sealing resin 57 may be provided by providing a mold member corresponding to the frame 55 and providing the sealing resin 57 therein, and then removing the mold member from the module substrate 22.

  As shown in FIG. 5, on the component mounting surface 22a, one connector 61 and two capacitors 65 made of electrical components such as surface mounting components are mounted (sixth manufacturing process).

  That is, the connector 61 has a two-pin type configuration having a first terminal pin 61a and a second terminal pin 61b protruding from one side surface thereof. The connector 61 is soldered to the mounting pad 33, thereby being disposed between the lighting inspection pads 28 and 29. At the same time, the first terminal pin 61a is attached to the first positive electrode pad portion 25c, and the second terminal pin 61b is attached to the first negative electrode pad portion 26e. The connector 61 is connected with an insulation coated electric wire for direct current power supply connected to a power supply device (not shown). As a result, power can be supplied to the light emitting module 21 via the connector 61.

  One of the two capacitors 65 is soldered to one end portion of the second positive electrode pad portion 25 d of the wiring pattern 25 and the intermediate pad 27 in the first relief portion 37 a of the first protective layer 37. It is arranged over. Similarly, the other of the two capacitors 65 is soldered to the second negative electrode pad portion 26 f of the wiring pattern 26 and the other end portion of the intermediate pad 27 in the second relief portion 37 b of the first protective layer 37. And disposed over these. In a normal lighting state in which direct current is supplied to each semiconductor light emitting element 45, no current flows through the capacitor 65. However, for example, when an alternating current flows due to noise such as a surge voltage superimposed, a current flows through the capacitor 65, the wiring patterns 25 and 26 are short-circuited, and an alternating current is supplied to each semiconductor light emitting element 45. As a result, each semiconductor light emitting element 45 is prevented from abnormally emitting light.

  As shown in FIG. 10, the light emitting module 21 having the above-described configuration is attached to the apparatus base 11 by bringing the back surface of the module substrate 22, that is, the surface opposite to the component mounting surface 22 a into close contact with the bottom surface 12 a of the module installation portion 12. It is supported. Thereby, the light emitting module 21 is supported by the apparatus base 11 so that heat can be radiated from the module substrate 22 to the module installation unit 12. In a state where the light emitting module 21 supported in this manner is attached to the lamp body 4, the light emitting surface 57 a faces the light transmitting plate 5.

  In order to support the module, a plurality of, for example, two metal pressing plates 71 are screwed to the apparatus base 11 as shown in FIGS. The front ends of these presser plates 71 are opposed to the peripheral portion of the module substrate 22, and a metal spring 72 that presses the peripheral portion of the module substrate 22 is attached to the front end portion. The state in which the back surface of the module substrate 22 is in close contact with the bottom surface 12a is maintained by the spring force of the springs 72. Such holding can prevent the module substrate 22 from being damaged even if stress is applied to the ceramic module substrate 22 in the heat cycle caused by the temperature increase accompanying the lighting of the light emitting module 21 and the temperature decrease accompanying the extinction of light. It is configured.

  When power is supplied to the road light 1 having the above-described configuration, the plurality of semiconductor light emitting elements 45 included in the light emitting module 21 emit light at the same time, so that white light emitted from the light emitting surface 57a is transmitted through the light transmitting plate 5. Directly transmitted or reflected by the inner surface of the reflector 15 and then transmitted through the light-transmitting plate 5 to illuminate a road having illumination symmetry. With this illumination, the light reflected by the first reflecting plate 15a and the second reflecting plate 15b made of a plane mirror is irradiated mainly in the longitudinal direction of the road without substantially spreading. At the same time, the light reflected by the third reflecting plate 15c and the fourth reflecting plate 15d made of a curved mirror is mainly irradiated in the width direction of the road with the irradiation angle with respect to the width direction of the road being controlled.

  In such illumination, light emitted in the light extraction direction from the light emitting surface 57a is directly transmitted through the sealing resin 57 from the semiconductor light emitting element 45, and is emitted from the phosphor in the sealing resin 57 to pass through the sealing resin 57. In addition to the directly transmitted light, the light is incident on the component mounting surface 22a through the element substrate and the die bonding material of the semiconductor light emitting element 45, and is reflected by the component mounting surface 22a and transmitted through the sealing resin 57, and Light emitted from the phosphor and incident on the component mounting surface 22 a through the sealing resin 57 and reflected by the component mounting surface 22 a and transmitted again through the sealing resin 57 and sealed with the sealing resin 57 Is incident on a part of the wiring patterns 25 and 26 mainly containing silver (that is, the wire connecting portion 25b, the first wire connecting portion 26b, and the second wire connecting portion 26d). Contains the light transmitted through the sealing resin 57 is again reflected by the portion.

  In this way, the light reflection area of the module substrate covered with the sealing resin 57 that reflects the incident light in the light extraction direction, and each of the wiring patterns 25 and 26 disposed in this area are sealed resin. 57 is covered and sealed. At the same time, the remaining portions of the wiring patterns 25, 26, that is, the outer portion of the sealing member provided outside the sealing resin 57 without being sealed with the sealing resin 57, are attached to the first protection. The layer 37 or the second protective layer 38 is sealed.

  Thereby, since both the wiring patterns 25 and 26 containing silver as a main component are suppressed from being sulfurized by sulfur components in the atmosphere, both the wiring patterns 25 and 26 forming paths for supplying power to the respective semiconductor light emitting elements 45 are formed. However, deterioration and high resistance can be suppressed.

  In this case, the size of the first protective layer 37 and the second protective layer 38 is limited to the size around the periphery of this portion of the wiring patterns 25 and 26 that are not sealed with the sealing resin 57. Therefore, the size of the module substrate 22 is much smaller than that of the module substrate 22, and the module substrate 22 is limited to a part of the module substrate 22. Therefore, the amount of the material used for forming the first protective layer 37 and the second protective layer 38 can be reduced to a necessary minimum, and the wiring pattern mainly composed of silver can be obtained at low cost. It is possible to prevent the resistance of 25 and 26 from increasing.

  Moreover, the first protective layer 37 and the second protective layer 38 are provided outside the region sealed with the sealing resin 57. Therefore, the first protective layer 37 and the second protective layer 38 do not enter the sealing region, and the light reflection area of the module substrate 22 having a size corresponding to the area of the sealing resin 57 is not reduced. At the same time, although the first protective layer 37 and the second protective layer 38 are black different from the background color forming the light reflection surface of the module substrate 22, the first protective layer 37 and the second protective layer 38 The light reflection performance on the module substrate 22 side does not deteriorate due to light absorption by the protective layer 38.

  Further, since the first positive electrode pad portion 25c and the first negative electrode pad portion 26e to which the power supply connector 61 is connected by solder are provided outside the sealing region of the sealing resin 57, these power supply pad portions are sealed. The light reflection area of the module substrate 22 is not reduced unlike the case where it is provided in the sealing region of the stop resin 57. At the same time, the first positive electrode pad portion 25c and the first negative electrode pad portion 26e do not become a factor that disturbs light reflection on the module substrate 22 side. In addition to this, the module substrate 22 side does not become uneven in the sealing region due to the connector 61 attached over the first positive electrode pad portion 25c and the first negative electrode pad portion 26e. The reflection is not disturbed.

  Similarly, a second positive electrode pad portion 25d and a second negative electrode pad portion 26f, which are component connection pad portions, are provided on the first relief portion 37a and the second relief portion 37b of the first protective layer 37 located outside the sealing region. And the intermediate pad 27 is exposed, and a capacitor 65 is soldered to these portions. That is, since the capacitor 65 for preventing abnormal light emission of the semiconductor light emitting element 45 is attached outside the sealing region, the component connecting pad portion is provided in the sealing region of the sealing resin 57. As described above, the light reflection area of the module substrate 22 is not reduced by the component connection pad portion, and the light reflection surface on the module substrate 22 side is not easily disturbed. Due to the capacitor 65 thus formed, the module substrate 22 side does not become uneven in the sealing region. Therefore, the reflection of light on the module substrate 22 side is not disturbed. It should be noted that a zener diode can be used instead of a capacitor as an electrical component for preventing the above-described problem.

  As described above, according to the light emitting module 21 having the above configuration, each protective layer and each pad portion formed on the module substrate 22 and the electrical components mounted on the module substrate 22 are sealed with the sealing resin 57. The area of light reflection on the module substrate 22 side of the region does not decrease, and the reflection of light is not easily disturbed, and light can be appropriately reflected on the module substrate 22 side. Therefore, it is possible to increase the light extraction efficiency.

  In the light emitting module 21 according to the first embodiment, as described above, the module substrate 22 having the component mounting surface 22a is made of white ceramics, and its average reflectance is 80% or more. The incident light, that is, the blue light emitted from the blue LED that forms the semiconductor light emitting element 45, and the yellow light emitted from the fluorescent material emitted from the phosphor of 470 nm to 490 nm, are converted into light in the road direction, in other words, light. Can be efficiently reflected in the direction of taking out. In particular, when the average reflectance of the component mounting surface 22a of the module substrate 22 is 85% or more and 99% or less, the light incident on the component mounting surface 22a is more efficiently reflected in the light extraction direction. Can do.

  Since the module substrate 22 having the component mounting surface 22a that reflects light is made of white ceramics and uses the ground surface as the component mounting surface 22a, the reflection performance of the module substrate 22 is as follows. Regardless of the elapsed time from the start of use of the light emitting module 21, it is maintained constant.

  Furthermore, the reflection of light on the module substrate 22 side is not limited to the component mounting surface 22a, but the wire connection portion 25b of the wiring pattern 25 sealed with the sealing resin 57 and the first wire connection portion of the wiring pattern 26. 26b and the second wire connection portion 26d, the wire connection portions 25b, 26b, and 26d are darkened as the elapsed time from when the road lamp 1 is installed becomes longer, and the light reflection thereof The performance gradually decreases.

  However, in the light emitting module 21 configured as described above, the area occupancy ratio of the wire connection portions 25b, 26b, and 26d mainly composed of silver with respect to the area of the light emitting surface 57a is specified to be 40% or less. In other words, the reflection area on the component mounting surface 22a is ensured to exceed 60% of the area of the light emitting surface 57a. In this case, the positive electrode pattern base portion 25a of the wiring pattern 25 containing silver as a main component and the intermediate pattern portion 26c of the wiring pattern 26 are not sealed with the sealing resin 57 and are outside the light emitting surface 57a. Therefore, it is preferable for making the area occupancy 40% or less.

  By defining the area occupancy rate, it is possible to limit the influence of the decrease in the light reflection performance accompanying the progress of the blackening of the wire connection portions 25b, 26b, and 26d on the light reflection performance of the entire light emitting module 21. Therefore, according to the light emitting module of Example 1, it is possible to moderate the decrease in the luminous flux maintenance factor of the light emitting module 21. In other words, the deterioration of the light reflection performance in the reflection region covered with the light emitting surface 57a is slow. As a result, the light extraction efficiency is maintained at a high level, so that the energy saving effect can be promoted.

  As the decrease in the luminous flux maintenance factor is slow as described above, it is possible to provide the road lamp 1 that takes a long time for the light emitting module 21 as the light source to reach a specified life, for example, the luminous flux maintenance factor reaches 70%. Is possible. In other words, when the area occupancy of the sealed silver portion with respect to the light emitting surface 57a is 40% or less, even when the road lamp (lighting fixture) 1 is used beyond the recommended life, Regardless of the blackening of the portion, the luminous flux maintenance factor of the light emitting module 21 can be maintained at 70% or more. Note that the recommended life as a guide for replacement of the road lamp 1 is defined when the luminous flux maintenance factor reaches 70%.

  In addition, when the area occupation ratio with respect to the light emitting surface 57a of the sealed silver portion exceeds 40%, the influence on the light reflecting performance of the entire light emitting module 21 due to the progress of blackening of the silver portion becomes too large. Accordingly, the decrease in the luminous flux maintenance factor of the light emitting module 21 is accelerated, and the time required for the luminous flux maintenance factor to reach 70% is shortened. Therefore, the problem of the present embodiment cannot be solved, which is inappropriate.

  Further, the area occupation ratio of the wire connection portions 25b, 26b, and 26d of the wiring patterns 25 and 26 sealed with the sealing resin 57 to the light emitting surface 57a is 5% or more. Thereby, the width of the wire connecting portions 25b, 26b, and 26d can be formed to be wide to some extent so as not to hinder the wire bonding of the bonding wires 48, 49, 51, and 52 to these portions. Accordingly, it is possible to prevent manufacturing problems.

  DESCRIPTION OF SYMBOLS 1 ... Road light (lighting fixture), 4 ... Lamp body (equipment main body), 6 ... Light source device, 21 ... Light emission module, 22 ... Module board | substrate, 22a ... Component mounting surface (light reflection surface), 25 ... Positive electrode wiring pattern , 25c... 1st positive electrode pad portion (power supply pad portion), 25d... 2nd positive electrode pad portion (component connection pad portion), 26... Negative electrode wiring pattern, 26e. 2nd negative electrode pad part (part connecting pad part), 27 intermediate pad part (part connecting pad part), 37 first protective layer, 37A, 37b escape part, 41 to 43 identity mark, 45... Semiconductor light emitting device, 47 to 52. Bonding wire, 57... Sealing resin (sealing member)

Claims (5)

A module substrate having a light reflecting surface;
A positive electrode wiring pattern mainly comprising silver and provided on the module substrate with a positive electrode power supply pad portion;
A negative electrode wiring pattern comprising silver as a main component and provided on the module substrate with a negative electrode power supply pad portion;
A plurality of semiconductor light emitting elements mounted on the module substrate located between the wiring patterns;
A bonding wire provided by electrically connecting the semiconductor light emitting element and the wiring patterns;
A translucent sealing member provided on the module substrate by sealing the semiconductor light emitting element, a part of the wiring pattern, and the bonding wire;
Of the two wiring patterns, the outer portion of the sealing member that is not sealed by the sealing member includes the power supply pad portion. Except for the pad portion, the outer portion of the sealing member has a size covering the periphery of the portion. A protective layer applied in a restricted manner;
A light emitting module comprising:   Both wiring patterns have component connection pad portions exposed to relief portions formed in the protective layer, and are connected to these component connection pad portions to prevent abnormal light emission of the semiconductor light emitting element. The light emitting module according to claim 1, wherein a component is mounted on the module substrate.   The light emitting module according to claim 1, wherein the ground surface of the module substrate forms a light reflecting surface, and the protective layer has a color different from that of the ground surface.   The light emitting module according to claim 3, wherein an identity mark made of the same material as that of the protective layer is provided on the module substrate outside the sealing member. A light source device having the light emitting module according to any one of claims 1 to 4 as a light source;
An instrument body to which the light source device is attached;
The lighting fixture characterized by comprising.

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