JP2012009504A - Light-emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a thin side-view type light emitting device of which directional characteristics are not shifted to an upper side.SOLUTION: A light-emitting element is mounted on a lower surface of a substrate 1, and spacers 4 and 5 are fixed to both sides. The area where the spacers on the lower surface of the substrate 1 are not disposed is sealed with a sealing material 11. External electrode layers 6 and 7 are disposed on the lower surface of the spacers 4 and 5. A light reflection layer to reflect the light of the light-emitting element is disposed on the lower surface of the sealing material 11. When the lower surface of the sealing material 11 is disposed on the same plane as the lower surface of the spacers 4 and 5, a light-emitting device can be made thinner by at least the thickness of the external electrode layers 5 and 6. When the lower surface of the sealing material 11 is protruded to the lower side than the lower surface of the spacers 4 and 5, the light-emitting device can be made more thinner, because a light reflection layer 8 can be inserted into a space between mounting electrodes 30.

Description

  The present invention relates to an LED package that emits light in a lateral direction from a light emitting element (LED) mounted on a substrate, and a light emitting device on which the LED package is mounted.

  A so-called side-view type LED package that emits light in a lateral direction (a direction parallel to the substrate) from a light-emitting element mounted on the substrate has an LED chip mounted on the substrate as described in Patent Document 1, for example. Then, the LED chip is covered with a transparent resin, and the side surface and the upper surface excluding one side surface of the transparent resin are surrounded by a reflective layer. The light emitted from the LED chip is reflected by the reflective layer through the transparent resin and is emitted from one side surface that is not surrounded by the reflective layer. In Patent Document 1, a multi-color side-view type LED package with a low height can be realized with a simple configuration by arranging three light emitting LED chips in a triangular or linear shape on a substrate main plane. It is disclosed.

JP 2002-344025 A

  It is known as a general application that a side view type LED package is used as a light source such as a liquid crystal display device in combination with a light guide plate. In this case, the light of the side-view type LED package needs to be efficiently incident on the end face of the light guide plate. However, the side-view type LED package tends to have a directional characteristic inclined upward, which hinders improvement in the incidence efficiency on the light guide plate. become. The reason why the directivity characteristic is inclined upward is that the LED chip has high intensity of outgoing light.

  Further, the conventional side view type LED package has a limit in reducing the height. Specifically, the thickness of the base material of the substrate on which the LED chip is mounted is about several tens μm, for example, about 50 μm, for a glass epoxy or epoxy base material suitable for thinning at a practical level. Copper foil (about 5 to 20 μm) is pasted as an electrode on both surfaces of the base material of the substrate. When a through hole is formed in a base material and copper is filled in the through hole by copper plating, a copper plating layer of about 20 μm is formed also on the surface of the copper foil. Furthermore, nickel plating or gold (silver) plating is performed on the copper plating layer to enhance wire bonding. For this reason, the thickness of the electrode (copper foil and plating layer) on one side is about 40 to 50 μm. When the thickness of the substrate is 50 μm, the thickness of the substrate becomes 130 μm or more when both electrodes are included. FIG. 6 is a drawing of a conventional side-view type LED package manufactured using this substrate 401. The LED chip 402 is mounted on the substrate 401, and the spacer 403 is disposed so as to sandwich the LED chip. The upper surface of the substrate 401 other than the region where the spacers 403 are disposed is covered with a transparent resin 404 and the LED chip 402 is embedded. A light reflection layer 405 is disposed on the upper surfaces of the spacer 403 and the transparent resin 404. In the case of such a configuration, the thickness of the LED chip is 50 μm, and the limit of reducing the product thickness is about 200 μm.

  An object of the present invention is to provide a side-view type light-emitting device that is thin and has a directional characteristic that is not biased upward.

  In order to achieve the above object, a side-view light-emitting device of the present invention includes a substrate, a light-emitting element mounted on the lower surface of the substrate, an internal electrode electrically connected to the light-emitting element, and at least a lower surface of the substrate. It has the spacer arrange | positioned at a both-side area | region, and the sealing material which seals the area | region where the spacer of the lower surface of a board | substrate is not arrange | positioned. The lower surface of the substrate and the surface of the spacer facing the light emitting element have a property of reflecting the light of the light emitting element, and the sealing material is transparent to the light of the light emitting element. The lower surface of the sealing material and the boundary between the lower surface of the sealing material and the lower surface of the spacer are covered with a light reflecting layer that reflects light from the light emitting element. An external electrode layer is disposed in a region where the light reflecting layer is not disposed on the lower surface of the spacer.

  For example, the lower surface of the sealing material is positioned on the same plane as the lower surface of the spacer, and the light reflecting layer and the external electrode layer are arranged side by side on the same plane.

  For example, the lower surface of the sealing material protrudes below the lower surface of the spacer, and the light reflecting layer is in a position protruding downward from the external electrode layer.

  A light-emitting device according to another aspect of the present invention includes a mounting substrate, a pair of mounting electrodes disposed on the mounting substrate, and a side-view light-emitting device mounted on the mounting electrode. The apparatus includes a substrate, a light emitting element mounted on the lower surface of the substrate, an internal electrode electrically connected to the light emitting element, a spacer disposed on at least both sides of the lower surface of the substrate, and a spacer on the lower surface of the substrate. It is set as the structure which has the sealing material which seals the area | region which is not arrange | positioned. The lower surface of the substrate and the surface of the spacer facing the light emitting element have a property of reflecting the light of the light emitting element, and the sealing material is transparent to the light of the light emitting element. The lower surface of the sealing material and the boundary between the lower surface of the sealing material and the lower surface of the spacer are covered with a light reflecting layer that reflects light from the light emitting element. An external electrode layer is disposed in a region where the light reflecting layer is not disposed on the lower surface of the spacer.

  For example, the lower surface of the sealing material protrudes below the lower surface of the spacer, and the light reflecting layer is in a position protruding downward from the external electrode layer, and is inserted into the space between the pair of mounting electrodes. The configuration is as follows.

  In the light-emitting device of the present invention, the substrate is arranged on the upper side, the spacer is mounted on at least both sides of the lower surface of the substrate, and the light-emitting element is mounted on the central region, and sealed with a sealing material. The lower surface of the sealing material and the boundary between the lower surface of the sealing material and the lower surface of the spacer are covered with the light reflecting layer, and the external electrode layer is arranged on the lower surface of the spacer not covered with the light reflecting layer. Therefore, a side-view type light emitting device that is as thin as at least the thickness of the external electrode layer existing on the lower surface of the substrate of the conventional light emitting device can be obtained. Further, when the lower surface of the sealing material protrudes below the lower surface of the spacer, the light reflecting layer protrudes below the external electrode layer and is inserted into the space between the mounting electrodes on the mounting substrate. Therefore, the thickness can be further reduced. Further, by mounting the light emitting element on the lower surface of the substrate, the directivity of the emitted light can be prevented from being upward.

BRIEF DESCRIPTION OF THE DRAWINGS (a) Top view of the side view type LED package 100 of 1st Embodiment, (b) Front view, (c) Side view, (d) Bottom view, (e) Perspective view. The front view of the light-emitting device which mounted the side view type LED package 100 of Fig.1 (a)-(e) on the mounting board | substrate. (A) Top view, (b) Front view, (c) Side view, (d) Bottom view, (e) Perspective view of a side view type LED package 200 of the second embodiment. The front view of the light-emitting device which mounted the side view type LED package 200 of Fig.3 (a)-(e) on the mounting board | substrate. The side view type LED package 300 of 3rd Embodiment (a) Top view, (b) Front view, (c) Side view, (d) Bottom view, (e) Perspective view. Sectional drawing of the conventional side view type LED package.

  An LED package and a light emitting device according to an embodiment of the present invention will be described with reference to the drawings. The LED package will be described with the side mounted on the mounting board as the lower side.

(First embodiment)
In the present invention, the substrate on which the LED chip is mounted is configured to be positioned above the LED package, and the external electrode layer and the reflective resin layer positioned on the lower surface of the LED package are arranged side by side on the same plane. Thus, the thickness of the entire LED package is reduced, and the directivity characteristics of the semiconductor package are made downward by utilizing the reflection characteristics of the substrate.

  Hereinafter, the structure of the LED package of 1st Embodiment and a light-emitting device using the same is demonstrated concretely. 1A to 1E are a top view, a front view, a side view, a bottom view, and a perspective view of an LED package 100 according to the first embodiment. In FIG. 2, the front view of the light-emitting device which mounted the LED package 100 on the mounting board | substrate is shown. As shown in FIGS. 1A to 1E, the LED package 100 includes a substrate 1 having a pair of internal electrodes 2 and 3 formed on the lower surface side, and an LED chip 10 die-bonded to the internal electrode 3. ing. The upper surface side electrode in the LED chip 10 is electrically connected to the internal electrode 3 by die bonding, and the lower surface side electrode in the LED chip 10 is electrically connected to the internal electrode 2 by a bonding wire 9. The lower surface of the substrate 1 preferably has high light reflectivity. For example, a white glass epoxy substrate is used. The LED chip 10 has a desired emission wavelength. A plurality of LED chips 10 can be mounted on the substrate 1. The internal electrodes 2 and 3 preferably have a structure suitable for die bonding and wire bonding and have high light reflectivity. For example, the internal electrodes 2 and 3 have a structure in which the surface includes an Ag plating layer.

  Spacers 4 and 5 are fixed to both sides of the lower surface of the substrate 1. Since the surface facing the LED chip 10 is a reflective surface, the spacers 4 and 5 are preferably made of a highly light-reflective material such as a white glass epoxy substrate (a substrate in which a white glass nonwoven fabric is woven into an epoxy resin). ) Is used. The spacers 4 and 5 are formed with through holes 4a and 5a each having a half cylinder.

  The space between the spacers 4 and 5 is filled with a resin 11 that is transparent to the light emitted from the LED chip 10 and seals the LED chip 10. The lower surface of the transparent resin 11 coincides with the lower surfaces of the spacers 4 and 5. That is, the lower surface of the transparent resin 11 and the lower surfaces of the spacers 4 and 5 form a plane having the same height. As the transparent resin 11, for example, an epoxy resin, a hybrid resin, or a phenyl silicone resin is used.

  The lower surfaces of the spacers 4 and 5, the inner walls of the through holes 4 a and 5 a, and the lower surface of the substrate 1 exposed from the through holes 4 a and 5 a are covered with external electrode layers 6 and 7. The external electrode layers 6 and 7 covering the lower surface of the substrate 1 exposed from the through holes 4a and 5a are electrically connected by being in contact with the internal electrodes 2 and 3.

  The lower surface of the transparent resin 11 is covered with the light reflecting layer 8. The light reflecting layer 8 covers the boundary between the lower surface of the transparent resin 11 and the lower surfaces of the spacers 4 and 5 and a partial region adjacent to the transparent resin 11 on the lower surfaces of the spacers 4 and 5 so that no light leaks. . The external electrode layers 6 and 7 cover the area where the light reflecting layer 8 is not disposed on the lower surface of the spacers 4 and 5. Therefore, the end portions of the light reflecting layer 8 are abutted with the end portions of the external electrode layers 6 and 7. As the material of the light reflecting layer 8, a material having high light reflectivity, for example, a resin in which light reflective particles (titanium oxide particles or the like) are dispersed is used.

  Although not shown, the light reflecting layer 8 also covers the side surface of the transparent resin 11 on the back side of the LED package 100. As a result, the transparent resin 11 of the LED package 100 has a configuration in which the upper surface and both side surfaces are covered with the substrate 1 and the spacer 4, respectively, and the lower surface and the back surface are covered with the light reflecting layer 8. The side surface of the transparent resin 11 on the side becomes an opening for emitting light.

  Further, in FIG. 1, a pair of spacers 4 and 5 are arranged on both sides of the substrate. However, the shape of the spacer in this embodiment is not limited to this structure, and the spacers 4 and 5 are formed on the substrate. Any structure may be used as long as it is fixed to at least both side regions of 1 and emits light from at least one side surface. For example, the spacer may have a shape arranged not only on both sides of the LED package 100 but also on the back surface. Specifically, for example, the spacers 4 and 5 may be a single member having a semicircular recess when viewed from above. In this case, the internal space of the recess corresponds to a space sandwiched between the spacers 4 and 5, and the LED chip 10 is disposed in this internal space and filled with the transparent resin 11. The straight portion of the semicircular concave portion is an opening, and the arc-shaped portion is a reflecting surface (back surface) facing the opening. When the spacer having such a shape is used, it is not necessary to provide the light reflecting layer 8 on the back surface. It is desirable that the lower surface of the transparent resin 11 and the peripheral portion of the recess on the lower surface of the spacer (the boundary between the transparent resin 11 and the spacer) are also covered with the light reflecting layer 8. The end of the light reflecting layer 8 on the lower surface of the spacer is abutted with the end of the external electrode layers 6 and 7 on the lower surface of the spacer.

  The light emitting device in which the LED package 100 is mounted on the mounting substrate 20 has a structure as shown in FIG. The electrodes 6 and 7 on the lower surface of the LED package 100 are aligned and mounted on a pair of solder lands 30 and 31 provided in advance on the mounting substrate 20, and the solder lands 30 and 31 and the electrodes 6 and 7 are solder layers. 40 and 41 are joined.

  In the light emitting device having such a structure, when a current is supplied from the mounting substrate 20, the current is supplied to the external electrode layer 6 via the solder lands 30 and 31 and the solder layers 40 and 41, and the external electrode layers 6 and 7. To the LED chip 10 through the internal electrodes 2 and 3 and the bonding wire 10. Thereby, the LED chip 10 emits light of a predetermined wavelength. The light emitted from the LED chip 10 passes through the transparent resin 11 and is reflected by the substrate 1, the spacer 4, and the light reflecting layer 8 that cover the upper surface, the side surface, the lower surface, and the back surface of the transparent resin. It is emitted from the side. In this way, a side view type LED package 100 having a side surface as an emission opening is provided.

  In the LED package 100 of this embodiment, the substrate 1 is positioned on the upper surface side and the light reflecting layer 8 is positioned on the lower surface side, so that the light reflecting layer 8 and the external electrode layers 6 and 7 are on the same surface (bottom surface). Can be arranged side by side. For this reason, as compared with the structure in which the external electrode layer is arranged on the lower surface of the substrate and the entire upper surface is covered with the light reflecting layer as shown in FIG. Can be reduced, and the thin LED package 100 can be provided.

  In addition, by arranging the substrate 1 on the upper surface side and mounting the LED chip 10 downward on the lower surface, the amount of light emitted downward from the LED chip 10 increases, and white resin is used as the reflective layer 8. In some cases, part of the light that is transmitted without being reflected can also be reflected and used by the mounting substrate 20. It is also possible to further provide a reflective layer such as providing a metal layer so as not to be electrically connected to the solder land 30 immediately below the reflective layer 8 of the mounting substrate 20. As described above, in this embodiment, the directivity of the emitted light of the LED package 100 is downward, and the transmitted light of the reflective layer 8 that has not been conventionally used can also be used, so that light is incident from the end face of the light guide plate. When used as a light source, incident efficiency can be improved.

  Next, a method for manufacturing the LED package 100 will be described. In the following manufacturing process, the LED package is manufactured upside down. Below, it demonstrates using upper and lower in a manufacturing process. First, a large-sized substrate having a size in which a plurality of substrates 1 are connected vertically and horizontally is prepared. The large-sized substrate is cut into a plurality of LED packages 100 by cutting out at the connection position of the substrate 1 in the final process.

  A large-sized substrate is placed with the surface on which the copper plating pattern to be the internal electrodes 2 and 3 is formed facing upward, and the substrate to be the spacers 4 and 5 in which the through holes 4a and 5a are formed is overlaid thereon. At this time, the through holes 4a and 5a are overlaid so as to straddle the boundaries of the plurality of substrates 1 on the large substrate. Copper plating is performed in the through holes 4a and 5a and on the spacers 4 and 5 in part.

  A space for mounting the LED chip 10 is provided by a drill or the like up to the pattern on the large substrate, and the pattern is exposed. When the space for mounting the LED chip is formed in a substantially circular hole shape by a drill or the like, the center of the circular hole is set as the boundary position of the division when the substrate is cut out in the final process. Accordingly, the LED packages 100 having a semicircular space are arranged to face each other and can be manufactured at a time. The portions of the substrate remaining around the space for mounting the LED chip on the large substrate become the spacers 4 and 5. The space for mounting the LED chip may be provided in advance before being overlapped with the large substrate.

  Further, nickel and silver plating are formed on the copper plating of the pattern on the upper surface of the spacers 4 and 5, the inner walls of the through holes 4a and 5a, the substrate 1 exposed at the bottom of the through holes 4a and 5a, and the large format substrate. Thus, the external electrodes 6 and 7 and the internal electrodes 2 and 3 are provided. Thereafter, the LED chip 10 is die-bonded on the internal electrodes 2 and 3, and the upper electrode of the LED chip 10 is connected to the internal electrode 2 by wire bonding 9.

  The space between the spacers 4 and 5 is filled with an uncured transparent resin 11 and cured to form the transparent resin 11 having the same height as the spacer 4. On the transparent resin, the resin material of the light reflecting layer 8 is further poured and cured to form the light reflecting layer 8 having a predetermined thickness. The resin material of the light reflecting layer 8 is covered with electrodes on the upper surface of the transparent resin 11 and the upper surfaces of the spacers 4 and 5 using a mold so as not to cover the external electrode layers 6 and 7 on the spacers 4 and 5. Pour only into undisclosed areas. At this time, it is desirable that the mold has a shape that allows the resin to flow in a row beyond the boundary position when dividing the large substrate so that the light reflecting layers 8 of the plurality of LED packages 100 can be provided at one time.

  The large substrate is taken out from the mold, and the large substrate is cut out at a predetermined boundary position and divided into individual substrates 1. Thus, the spacers 4 and 5 are divided at positions where the cylindrical through holes 4a and 5a are halved. Thus, the LED package 100 of FIGS. 1A to 1E is manufactured.

  As described above, in the first embodiment, by arranging the substrate 1 on the upper surface side, the electrodes 6 and 7 and the light reflecting layer 8 are arranged side by side on the lower surface, and the light emitting device is manufactured with a simple configuration. Can do.

(Second Embodiment)
In the second embodiment, the space for the height of the solder lands generated between the solder lands 30 and 31 is used, and the transparent resin 11 has a downwardly convex shape, so that the opening diameter necessary for maintaining the brightness is obtained. The spacers 4 and 5 are made thin while securing the above.

  3A to 3E are a top view, a front view, a side view, a bottom view, and a perspective view of the LED package 200 of the second embodiment. FIG. 4 shows a front view of a light emitting device in which the LED package 200 is mounted on a mounting substrate. As shown in FIGS. 1A to 1E, in the LED package 200, the bottom surface of the transparent resin 11 protrudes below the bottom surfaces of the spacers 4 and 5. Thereby, even if the height of the spacers 4 and 5 is reduced as compared with the LED package 100 of the first embodiment, the emission opening diameter of the LED package 200, that is, the side area of the transparent resin 11 can be maintained.

  Since the light reflection layer 8 is disposed so as to cover the bottom surface of the protruding transparent resin 11, the bottom surface of the light reflection layer 8 protrudes below the bottom surfaces of the external electrode layers 6 and 7. When mounted on the mounting substrate 20, the protruding light reflecting layer 8 and transparent resin 11 are generated between the pair of solder lands 30 and 31 and the pair of solder layers 40 and 41 as shown in FIG. Inserted into the minute space. Thereby, the space between the solder lands 30 and 31 can be effectively utilized to reduce the thickness of the LED package 200 and the light emitting device on which the LED package 200 is mounted. Other configurations are the same as those of the first embodiment, and thus description thereof is omitted.

  In general, since the thickness of the solder lands 30 and 31 and the thickness of the solder layers 40 and 41 are 100 μm or more in total, the transparent resin 11 and the light reflecting layer 8 are protruded by 100 μm or more from the upper surfaces of the external electrode layers 6 and 7. be able to. That is, it is possible to provide a thin LED package 200 in which the thickness of the spacers 4 and 5 is reduced by about 100 μm and a light emitting device on which the LED package 200 is mounted. In addition, it is also possible to form a recessed part in the area | region between the solder lands of the mounting board | substrate 20, In this case, the protrusion amount of an LED package can be set, without being restrict | limited to the thickness of a solder land and a solder layer. Therefore, a thinner light emitting device can be provided.

  Moreover, in this embodiment, since the board | substrate 1 was arrange | positioned on the upper side, although it is the LED package 200 of convex shape downward, the shape of the board | substrate 1 remains a plane. For this reason, compared with the case where the board | substrate 1 is processed into convex shape downward, the reliability of the internal electrodes 2 and 3 formed on the board | substrate 1 can be improved.

  Moreover, the LED package 200 of 2nd Embodiment arrange | positions the board | substrate 1 on the upper surface side similarly to 1st Embodiment, and has mounted LED chip 10 downward on the lower surface, and it is downward from LED chip 10 below. When the amount of emitted light increases and white resin is used as the reflective layer 8, a part of light that is not reflected and transmitted can be reflected and used by the mounting substrate 20. It is also possible to further provide a reflective layer such as providing a metal layer so as not to be electrically connected to the solder land 30 immediately below the reflective layer 8 of the mounting substrate 20. As described above, in this embodiment, the directivity of the emitted light of the LED package 100 is downward, and the transmitted light of the reflective layer 8 that has not been conventionally used can also be used, so that light is incident from the end face of the light guide plate. When used as a light source, incident efficiency can be improved.

  Since the LED package 200 of the present invention has a structure in which the substrate 1 is disposed on the upper surface side, there is an advantage that a convex shape can be easily manufactured downward. Hereinafter, the manufacturing method of the LED package 200 of 2nd Embodiment is demonstrated. In the following manufacturing process, the LED package is manufactured upside down. Below, it demonstrates using upper and lower in a manufacturing process.

  A large-sized substrate in which a plurality of substrates 1 are connected vertically and horizontally is prepared. A large-sized substrate is placed with the surface on which the copper plating pattern to be the internal electrodes 2 and 3 is formed facing upward, and the substrate to be the spacers 4 and 5 in which the through holes 4a and 5a are formed is overlaid thereon. At this time, the through holes 4a and 5a are overlaid so as to straddle the boundaries of the plurality of substrates 1 on the large substrate. Copper plating is performed in the through holes 4a and 5a and on the spacers 4 and 5 in part.

  A space for mounting the LED chip 10 is provided by a drill or the like up to the pattern on the large substrate, and the pattern is exposed. When the LED chip mounting space is formed into a substantially circular hole shape by a drill or the like, when the substrate is cut out in the final process, the center of the circular hole is set as the boundary position of the division, so that the semicircular space is formed. The LED packages 100 are arranged face to face so that they can be manufactured at a time. The portions of the substrate remaining around the space for mounting the LED chip on the large substrate become the spacers 4 and 5. The space for mounting the LED chip may be provided in advance before being overlapped with the large substrate.

  Further, nickel and silver plating are formed on the copper plating of the pattern on the upper surface of the spacers 4 and 5, the inner walls of the through holes 4a and 5a, the substrate 1 exposed at the bottom of the through holes 4a and 5a, and the large format substrate. Thus, the external electrodes 6 and 7 and the internal electrodes 2 and 3 are provided. Thereafter, the LED chip 10 is die-bonded on the internal electrodes 2 and 3, and the upper electrode of the LED chip 10 is connected to the internal electrode 2 by wire bonding 9.

  The uncured transparent resin 11 is filled in the space between the spacers 4 and 5 so as to rise by a predetermined height from the upper surfaces of the spacers 4 and 5. Thereafter, curing is performed to form a transparent resin 11 protruding from the spacers 4 and 5. Thereafter, a metal mask covering the through-holes 4a and 5a and the external electrode layers 6 and 7 and having an opening surrounding the transparent resin 11 is disposed, and the resin material of the light reflecting layer 8 is poured and cured to be a light reflecting layer. 8 is formed. Thereafter, the large substrate is cut out and divided into individual substrates 1. Thus, the spacers 4 and 5 are divided at positions where the cylindrical through holes 4a and 5a are halved. Thus, the LED package 200 of the second embodiment is manufactured.

  In the manufacturing method using a mold as in the first embodiment, the light reflecting layer 8 is formed on a large substrate before division so as to be connected to a plurality of light emitting devices. For this reason, the light reflection layer 8 before division may cause warping of the large-sized substrate due to shrinkage of the resin. However, when a metal mask is used as in the second embodiment, it is possible to form the light reflecting layer 8 from the beginning in a state where the divided LED packages are separated, and warp due to resin shrinkage. Can be prevented.

  3 and 4 show an example in which the lower surface of the transparent resin 11 protrudes in a smooth curved surface shape, the present invention is not limited to the curved surface shape of the lower surface shape of the transparent resin 11, It is also possible to have a shape protruding in a rectangular shape.

(Third embodiment)
As a third embodiment, a side view type LED package 300 having a plurality of light exit openings will be described with reference to FIGS.

  In the LED package 300 of the third embodiment, the substrate 1 has a substantially square shape as shown in FIGS. 5A to 5E, and emits light from the four directions of the front surface, the left and right side surfaces, and the back surface. That is, each of the four side surfaces of the transparent resin 11 becomes a light emission opening.

  The spacers are disposed at the four corners of the substrate 1 as shown in FIG. Here, four spacers 4, 4 ′, 5, 5 ′ having a shape obtained by dividing the cylinder into ¼ are arranged at four corners of the substrate 1.

  The transparent resin 11 is filled in the entire lower surface region of the substrate 1 where the spacers 4, 4 ', 5 and 5' are not disposed. Further, the lower surface of the transparent resin 11 protrudes downward from the lower surfaces of the spacers 4, 4 ′, 5, 5 ′ as in the second embodiment. The light reflecting layer 8 is disposed so as to cover the bottom surface of the protruding transparent resin 11.

  Since the LED package 300 of the present embodiment has a shape in which the transparent resin 11 and the light reflecting layer 8 protrude downward, the spacers 4, 4 ′, 5 and 5 ′ are made of solder lands as in the second embodiment. A thin light-emitting device can be provided.

  The LED package 300 according to the third embodiment has a configuration in which the emission openings are provided in four directions. However, some of the four emission openings or a part of the emission openings are covered with a light reflection layer, and the emission openings are formed. A configuration in which the number and size are limited is also possible. Further, the number of emission ports is not limited to four, and for example, two emission ports may be arranged at opposing positions.

  It is of course possible to make the LED package 300 of the third embodiment have the structure of the first embodiment in which the transparent resin 11 and the light reflecting layer 8 do not protrude downward.

  The LED package and the light emitting device of the present invention can be suitably used as a light source for a liquid crystal display device or a general illumination light source in combination with a general use in which a side view type LED package is used, for example, a light guide plate.

DESCRIPTION OF SYMBOLS 1 ... Board | substrate, 2, 3 ... Internal electrode, 4, 4 ', 5, 5' ... Spacer, 4a, 5a ... Through hole, 6, 7 ... External electrode layer, 8 ... Light reflection layer, 9 ... Bonding wire, 10 ... LED chip, 11 ... transparent resin, 20 ... mounting substrate, 30, 31 ... solder land, 40, 41 ... solder layer, 100, 200, 300 ... LED package

Claims (5)

A substrate, a light emitting element mounted on the lower surface of the substrate, an internal electrode electrically connected to the light emitting element, a spacer disposed at least on both sides of the lower surface of the substrate, and a lower surface of the substrate A sealing material for sealing a region where the spacer is not disposed;
The lower surface of the substrate and the surface of the spacer facing the light emitting element have a property of reflecting the light of the light emitting element, and the sealing material is transparent to the light of the light emitting element,
The lower surface of the sealing material, and the boundary between the lower surface of the sealing material and the lower surface of the spacer are covered with a light reflecting layer that reflects light of the light emitting element,
A side view type light emitting device, wherein an external electrode layer is disposed in a region of the lower surface of the spacer where the light reflecting layer is not disposed.   2. The side-view type light emitting device according to claim 1, wherein a lower surface of the sealing material is positioned on the same plane as a lower surface of the spacer, and the light reflection layer and the external electrode layer are arranged on the same plane. A side view type light emitting device characterized by being arranged.   2. The side-view light-emitting device according to claim 1, wherein a lower surface of the sealing material protrudes below a lower surface of the spacer, and the light reflection layer is in a position protruding below the external electrode layer. A side-view type light emitting device characterized by that. A mounting substrate, a pair of mounting electrodes disposed on the mounting substrate, and a side-view light-emitting device mounted on the mounting electrode;
The side view type light emitting device includes a substrate, a light emitting element mounted on the lower surface of the substrate, an internal electrode electrically connected to the light emitting element, and a spacer disposed on at least both sides of the lower surface of the substrate. And a sealing material that seals a region of the lower surface of the substrate where the spacer is not disposed,
The lower surface of the substrate and the surface of the spacer facing the light emitting element have a property of reflecting the light of the light emitting element, and the sealing material is transparent to the light of the light emitting element,
The lower surface of the sealing material, and the boundary between the lower surface of the sealing material and the lower surface of the spacer are covered with a light reflecting layer that reflects light of the light emitting element,
An external electrode layer is disposed in a region where the light reflection layer is not disposed on the lower surface of the spacer.   5. The light-emitting device according to claim 4, wherein a lower surface of the sealing material protrudes below a lower surface of the spacer, and the light reflecting layer is located at a position protruding downward from the external electrode layer. The light emitting device is inserted into a space between the mounting electrodes.

Images