JP2012004322A5 - - Google Patents

Download PDF

Info

Publication number
JP2012004322A5
JP2012004322A5 JP2010137650A JP2010137650A JP2012004322A5 JP 2012004322 A5 JP2012004322 A5 JP 2012004322A5 JP 2010137650 A JP2010137650 A JP 2010137650A JP 2010137650 A JP2010137650 A JP 2010137650A JP 2012004322 A5 JP2012004322 A5 JP 2012004322A5
Authority
JP
Japan
Prior art keywords
unit
substrates
substrate bonding
bonding apparatus
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010137650A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012004322A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2010137650A priority Critical patent/JP2012004322A/ja
Priority claimed from JP2010137650A external-priority patent/JP2012004322A/ja
Publication of JP2012004322A publication Critical patent/JP2012004322A/ja
Publication of JP2012004322A5 publication Critical patent/JP2012004322A5/ja
Pending legal-status Critical Current

Links

JP2010137650A 2010-06-16 2010-06-16 基板貼り合せ装置、積層半導体装置製造方法及び積層半導体装置 Pending JP2012004322A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010137650A JP2012004322A (ja) 2010-06-16 2010-06-16 基板貼り合せ装置、積層半導体装置製造方法及び積層半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010137650A JP2012004322A (ja) 2010-06-16 2010-06-16 基板貼り合せ装置、積層半導体装置製造方法及び積層半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014144275A Division JP2014241416A (ja) 2014-07-14 2014-07-14 基板貼り合せ装置および積層半導体装置製造方法

Publications (2)

Publication Number Publication Date
JP2012004322A JP2012004322A (ja) 2012-01-05
JP2012004322A5 true JP2012004322A5 (cg-RX-API-DMAC7.html) 2013-09-19

Family

ID=45535988

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010137650A Pending JP2012004322A (ja) 2010-06-16 2010-06-16 基板貼り合せ装置、積層半導体装置製造方法及び積層半導体装置

Country Status (1)

Country Link
JP (1) JP2012004322A (cg-RX-API-DMAC7.html)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000182915A (ja) * 1998-12-16 2000-06-30 Ricoh Co Ltd 半導体装置およびその製造方法
JP2006332563A (ja) * 2005-05-30 2006-12-07 Nikon Corp ウェハ搬送装置、ウェハ積層体搬送装置及び積層型半導体装置製造方法
JP5272348B2 (ja) * 2007-08-14 2013-08-28 株式会社ニコン ウェハ接合装置
JP5412731B2 (ja) * 2008-02-19 2014-02-12 株式会社ニコン 加熱加圧システム及び冷却装置
JP5577585B2 (ja) * 2008-11-12 2014-08-27 株式会社ニコン 基板保持部材、接合装置および接合方法

Similar Documents

Publication Publication Date Title
WO2009100698A3 (de) Verfahren zum niedertemperatur-drucksintern einer wärmesenkenplatte an das substrat einer elektronischen baugruppe
JP2010245412A5 (cg-RX-API-DMAC7.html)
JP2014063484A5 (ja) 表示装置の作製方法
JP2013120771A5 (cg-RX-API-DMAC7.html)
WO2012071487A3 (en) Integrated circuit device with die bonded to polymer substrate
EP2680330A3 (en) Encapsulating layer-covered semiconductor element, producing method thereof, and semiconductor device
WO2010102151A3 (en) Chip-scale packaging with protective heat spreader
JP2015145097A5 (cg-RX-API-DMAC7.html)
JP2014235279A5 (cg-RX-API-DMAC7.html)
JP2014022665A5 (cg-RX-API-DMAC7.html)
PH12011000403A1 (en) Semiconductor device package and method of manufacturing thereof
WO2008096605A1 (ja) 積層体の製造装置および製造方法
EP2477244A3 (en) Wafer level light-emitting device package and method of manufacturing the same
JP2010205995A5 (cg-RX-API-DMAC7.html)
JP2010527509A5 (cg-RX-API-DMAC7.html)
JP2014192386A5 (cg-RX-API-DMAC7.html)
JP2011127072A5 (cg-RX-API-DMAC7.html)
JP2010023485A5 (cg-RX-API-DMAC7.html)
JP2009016544A5 (cg-RX-API-DMAC7.html)
WO2012116157A3 (en) Chip module embedded in pcb substrate
JP2013001119A5 (cg-RX-API-DMAC7.html)
JP2011049311A5 (cg-RX-API-DMAC7.html)
JP2016510513A5 (cg-RX-API-DMAC7.html)
JP2010073838A5 (cg-RX-API-DMAC7.html)
JP2012004322A5 (cg-RX-API-DMAC7.html)