JP2011527123A5 - - Google Patents

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Publication number
JP2011527123A5
JP2011527123A5 JP2011516821A JP2011516821A JP2011527123A5 JP 2011527123 A5 JP2011527123 A5 JP 2011527123A5 JP 2011516821 A JP2011516821 A JP 2011516821A JP 2011516821 A JP2011516821 A JP 2011516821A JP 2011527123 A5 JP2011527123 A5 JP 2011527123A5
Authority
JP
Japan
Prior art keywords
extending
supply
substrate
face plate
reservoir
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011516821A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011527123A (ja
Filing date
Publication date
Priority claimed from US12/165,577 external-priority patent/US8584613B2/en
Application filed filed Critical
Publication of JP2011527123A publication Critical patent/JP2011527123A/ja
Publication of JP2011527123A5 publication Critical patent/JP2011527123A5/ja
Pending legal-status Critical Current

Links

JP2011516821A 2008-06-30 2009-06-30 低粘性流体を用いた粒子除去のための単一基板処理ヘッド Pending JP2011527123A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/165,577 US8584613B2 (en) 2008-06-30 2008-06-30 Single substrate processing head for particle removal using low viscosity fluid
US12/165,577 2008-06-30
PCT/US2009/049280 WO2010002905A1 (en) 2008-06-30 2009-06-30 Single substrate processing head for particle removal using low viscosity fluid

Publications (2)

Publication Number Publication Date
JP2011527123A JP2011527123A (ja) 2011-10-20
JP2011527123A5 true JP2011527123A5 (enExample) 2012-08-16

Family

ID=41445969

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011516821A Pending JP2011527123A (ja) 2008-06-30 2009-06-30 低粘性流体を用いた粒子除去のための単一基板処理ヘッド

Country Status (7)

Country Link
US (2) US8584613B2 (enExample)
JP (1) JP2011527123A (enExample)
KR (2) KR101632974B1 (enExample)
CN (1) CN102105967B (enExample)
SG (1) SG192443A1 (enExample)
TW (1) TWI423366B (enExample)
WO (1) WO2010002905A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7849554B2 (en) * 2009-04-28 2010-12-14 Lam Research Corporation Apparatus and system for cleaning substrate
CN106999962B (zh) * 2014-09-11 2019-11-15 亨茨曼国际有限公司 设计和制造分配棒的方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4276011A (en) * 1979-02-21 1981-06-30 American Cyanamid Company Spinnerette assembly
US5618566A (en) * 1995-04-26 1997-04-08 Exxon Chemical Patents, Inc. Modular meltblowing die
SG45121A1 (en) * 1995-10-28 1998-01-16 Inst Of Microelectronics Apparatus for dispensing fluid in an array pattern
US6220843B1 (en) * 1998-03-13 2001-04-24 Nordson Corporation Segmented die for applying hot melt adhesives or other polymer melts
US6689215B2 (en) 1998-09-17 2004-02-10 Asml Holdings, N.V. Method and apparatus for mitigating cross-contamination between liquid dispensing jets in close proximity to a surface
US7000622B2 (en) * 2002-09-30 2006-02-21 Lam Research Corporation Methods and systems for processing a bevel edge of a substrate using a dynamic liquid meniscus
JP3955197B2 (ja) * 2001-09-28 2007-08-08 アルプス電気株式会社 ウエット処理用ノズルおよびウエット処理装置
US7093375B2 (en) 2002-09-30 2006-08-22 Lam Research Corporation Apparatus and method for utilizing a meniscus in substrate processing
US20050260789A1 (en) * 2004-05-21 2005-11-24 Texas Instruments Incorporated Method and system for applying an adhesive substance on an electronic device
JP4343031B2 (ja) * 2004-05-31 2009-10-14 東京エレクトロン株式会社 基板処理方法及び基板処理装置
CA2612020A1 (en) 2005-06-23 2006-12-28 Akzo Nobel Coatings International B.V. Dispenser
JP2007158161A (ja) 2005-12-07 2007-06-21 Elpida Memory Inc ウエハ洗浄装置及びウエハ洗浄方法
US20080038448A1 (en) 2006-08-11 2008-02-14 Lam Research Corp. Chemical resistant semiconductor processing chamber bodies

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