JP2011525437A - 分離されたヒータを有するプリントヘッド - Google Patents
分離されたヒータを有するプリントヘッド Download PDFInfo
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- JP2011525437A JP2011525437A JP2011514607A JP2011514607A JP2011525437A JP 2011525437 A JP2011525437 A JP 2011525437A JP 2011514607 A JP2011514607 A JP 2011514607A JP 2011514607 A JP2011514607 A JP 2011514607A JP 2011525437 A JP2011525437 A JP 2011525437A
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- 238000010438 heat treatment Methods 0.000 claims abstract description 47
- 239000007788 liquid Substances 0.000 claims abstract description 44
- 239000000758 substrate Substances 0.000 claims abstract description 44
- 238000000034 method Methods 0.000 claims description 45
- 239000000463 material Substances 0.000 claims description 28
- 238000000059 patterning Methods 0.000 claims description 12
- 230000008569 process Effects 0.000 claims description 12
- 238000000151 deposition Methods 0.000 claims description 10
- BLIQUJLAJXRXSG-UHFFFAOYSA-N 1-benzyl-3-(trifluoromethyl)pyrrolidin-1-ium-3-carboxylate Chemical compound C1C(C(=O)O)(C(F)(F)F)CCN1CC1=CC=CC=C1 BLIQUJLAJXRXSG-UHFFFAOYSA-N 0.000 claims description 6
- 238000001312 dry etching Methods 0.000 claims description 5
- 229910018503 SF6 Inorganic materials 0.000 claims description 2
- SFZCNBIFKDRMGX-UHFFFAOYSA-N sulfur hexafluoride Chemical compound FS(F)(F)(F)(F)F SFZCNBIFKDRMGX-UHFFFAOYSA-N 0.000 claims description 2
- 229960000909 sulfur hexafluoride Drugs 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 131
- 239000000976 ink Substances 0.000 description 56
- 239000011241 protective layer Substances 0.000 description 17
- 238000000926 separation method Methods 0.000 description 16
- 238000010586 diagram Methods 0.000 description 13
- 230000006911 nucleation Effects 0.000 description 12
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- 238000004519 manufacturing process Methods 0.000 description 10
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- 230000015572 biosynthetic process Effects 0.000 description 8
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- 229910052581 Si3N4 Inorganic materials 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 229920002120 photoresistant polymer Polymers 0.000 description 7
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 230000004907 flux Effects 0.000 description 6
- 238000007639 printing Methods 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 230000008021 deposition Effects 0.000 description 5
- 239000011229 interlayer Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- 238000007667 floating Methods 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000007641 inkjet printing Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000002955 isolation Methods 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- 229910052715 tantalum Inorganic materials 0.000 description 3
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 238000009834 vaporization Methods 0.000 description 3
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- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
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- 238000011049 filling Methods 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229910002058 ternary alloy Inorganic materials 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
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- 230000001186 cumulative effect Effects 0.000 description 1
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- 238000006731 degradation reaction Methods 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 238000004146 energy storage Methods 0.000 description 1
- 230000003090 exacerbative effect Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910002059 quaternary alloy Inorganic materials 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14088—Structure of heating means
- B41J2/14112—Resistive element
- B41J2/14129—Layer structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14088—Structure of heating means
- B41J2/14112—Resistive element
- B41J2/1412—Shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
- B41J2/1603—Production of bubble jet print heads of the front shooter type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1628—Manufacturing processes etching dry etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1637—Manufacturing processes molding
- B41J2/1639—Manufacturing processes molding sacrificial molding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
Abstract
Description
4 シリコン基板
6 従来のヒータスタック
8 電気抵抗ヒータ層
10 誘電体断熱(熱障壁)層
12 導電層
14 ヒータ領域
16 絶縁性パッシベーション層
18 保護層
20 インクチャンバ
22 ノズルプレート
24 ノズル
26 矢印
30 本発明に係るシングルインクジェットイジェクタ
32 本発明に係る分離されたヒートスタック
34 本発明に係る分離されたヒータ領域
36 分離用キャビティ
38 下部誘電体保護層
40 矢印
42 横方向の矢印
44a、b 金属リード
46 犠牲層
48 突起
50a、b ビア
51 フォトレジスト層
52 開口部
54 絶縁性封止層
55 ヒートスプレッディング層
56 孔
58 支持体
60 ヒータに沿うストリップ
62 電流の矢印
64 熱流の矢印
66 反動の矢印
68 熱流の矢印
80 インク
Claims (22)
- 第1の表面を含む基板;
前記基板の前記第1の表面の上方に配置された加熱素子であり、当該加熱素子と前記基板の前記第1の表面との間にキャビティが存在する、加熱素子;
前記加熱素子と前記キャビティとの間に配置された誘電体層であり、前記キャビティが横方向で当該誘電体層によって境界される、誘電体層;及び
前記加熱素子の上方に配置されたノズルを含むチャンバであり、当該チャンバが液体を受け入れる形状にされ、前記キャビティが前記液体から隔離される、チャンバ;
を有する液体イジェクタ。 - 前記基板の前記第1の表面に配置された電子回路であり、前記加熱素子と電気的に通信する電子回路、
を更に有する請求項1に記載のイジェクタ。 - 前記キャビティは1000Å以下の断面厚さを有する、請求項1に記載のイジェクタ。
- 前記加熱素子は断面で見たときに実質的に均一な厚さを有する、請求項1に記載のイジェクタ。
- 前記キャビティと前記基板の前記第1の表面との間に配置された誘電体層、
を更に有する請求項1に記載のイジェクタ。 - 前記キャビティの圧力は大気圧より低い、請求項1に記載のイジェクタ。
- 前記加熱素子の、前記基板の前記第1の表面から見た幅は、30μm以下である、請求項1に記載のイジェクタ。
- 前記加熱素子は複数の加熱素子のうちの1つであり、隣接し合う加熱素子の中心間で見た間隔は45μm未満である、請求項1に記載のイジェクタ。
- 前記誘電体層は第1の誘電体層であり、当該イジェクタは更に、前記加熱素子と前記チャンバとの間に配置された第2の誘電体層を有する、請求項1に記載のイジェクタ。
- 前記第1の誘電体層、前記第2の誘電体層、及び前記加熱素子の、断面で見たときの合計厚さは、5000Å以下である、請求項9に記載のイジェクタ。
- 前記加熱素子及び前記誘電体層は前記キャビティ内へ変形可能である、請求項1に記載のイジェクタ。
- 前記誘電体層は、前記キャビティの当該誘電体層とは反対側の表面と接触可能である、請求項11に記載のイジェクタ。
- 前記誘電体層は、前記キャビティ内に延在する支持構造を含んでいる、請求項1に記載のイジェクタ。
- 前記加熱素子と電気的に連通した導電層であり、前記キャビティと重なり合わない導電層、
を更に有する請求項1に記載のイジェクタ。 - 液体イジェクタを作動させる方法であって:
第1の表面を含む基板;
前記基板の前記第1の表面の上方に配置された加熱素子であり、当該加熱素子と前記基板の前記第1の表面との間にキャビティが存在する、加熱素子;
前記加熱素子と前記キャビティとの間に配置された誘電体層であり、前記キャビティが横方向で当該誘電体層によって境界される、誘電体層;及び
前記加熱素子の上方に配置されたノズルを含むチャンバであり、当該チャンバが液体を受け入れる形状にされ、前記キャビティが前記液体から隔離される、チャンバ;
を含む液体イジェクタを用意するステップ;
前記液体イジェクタの前記チャンバ内に液体を導入するステップ;並びに
前記加熱素子上に蒸気泡を形成することによって、前記加熱素子及び前記誘電体層を前記キャビティ内に変形させるステップ;
を有する方法。 - 液体イジェクタ用の熱的に分離された加熱素子を形成する方法であって:
第1の表面を含む基板を用意する工程;
前記第1の表面上に犠牲材料層を堆積する工程;
前記犠牲材料層をパターニングする工程;
パターニングされた犠牲材料層上に誘電体層を堆積する工程;
前記誘電体層上に加熱素子を形成する工程;及び
前記パターニングされた犠牲材料層を除去し、前記誘電体層と前記基板の前記第1の表面との間にキャビティを作り出す工程;
を有する方法。 - 前記加熱素子を形成する工程は、前記パターニングされた犠牲材料層を除去する工程に先立って行われる、請求項16に記載の方法。
- 前記パターニングされた犠牲材料層を除去する工程は、ドライエッチングプロセスを用いて、前記パターニングされた犠牲材料層を除去することを含む、請求項16に記載の方法。
- 前記ドライエッチングプロセスは、二フッ化キセノンガス及び六フッ化硫黄プラズマのうちの一方を用いることを含む、請求項16に記載の方法。
- 前記パターニングされた犠牲材料層を除去する工程に先立って、前記基板の前記第1の表面に電子回路を形成する工程、
を更に有する請求項16に記載の方法。 - 前記犠牲材料層をパターニングする工程は、前記パターニングされた犠牲材料層上に前記誘電体層を堆積するときに支持構造を形成するための開口部を設けるように、前記犠牲材料層の一部を除去することを含む、請求項16に記載の方法。
- 前記犠牲材料層をパターニングする工程は、後に形成される前記加熱素子の幅を超えて延在する前記犠牲材料層内の突起を形成することを含む、請求項16に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/143,880 | 2008-06-23 | ||
US12/143,880 US8540349B2 (en) | 2008-06-23 | 2008-06-23 | Printhead having isolated heater |
PCT/US2009/003625 WO2010011250A2 (en) | 2008-06-23 | 2009-06-17 | Printhead having isolated heater |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2011525437A true JP2011525437A (ja) | 2011-09-22 |
JP2011525437A5 JP2011525437A5 (ja) | 2012-05-24 |
JP5525519B2 JP5525519B2 (ja) | 2014-06-18 |
Family
ID=41430793
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011514607A Expired - Fee Related JP5525519B2 (ja) | 2008-06-23 | 2009-06-17 | 分離されたヒータを有するプリントヘッド |
Country Status (4)
Country | Link |
---|---|
US (1) | US8540349B2 (ja) |
EP (1) | EP2313276B1 (ja) |
JP (1) | JP5525519B2 (ja) |
WO (1) | WO2010011250A2 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015223814A (ja) * | 2014-05-29 | 2015-12-14 | キヤノン株式会社 | 液体吐出ヘッド |
CN107073960A (zh) * | 2014-10-30 | 2017-08-18 | 惠普发展公司,有限责任合伙企业 | 喷墨打印头 |
JP2017533129A (ja) * | 2014-10-30 | 2017-11-09 | ヒューレット−パッカード デベロップメント カンパニー エル.ピー.Hewlett‐Packard Development Company, L.P. | インクジェットプリントヘッド |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8414786B2 (en) * | 2008-11-05 | 2013-04-09 | Lexmark International, Inc. | Planar heater stack and method for making planar heater stack with cavity within planar heater substrata above substrate |
US8079672B2 (en) * | 2008-11-05 | 2011-12-20 | Lexmark International, Inc. | Heater stack and method for making heater stack with cavity between heater element and substrate |
US8172370B2 (en) * | 2008-12-30 | 2012-05-08 | Lexmark International, Inc. | Planar heater stack and method for making planar heater stack |
US20120091121A1 (en) * | 2010-10-19 | 2012-04-19 | Zachary Justin Reitmeier | Heater stack for inkjet printheads |
CN107531053B (zh) * | 2015-07-15 | 2019-10-18 | 惠普发展公司有限责任合伙企业 | 粘附和绝缘层 |
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JPH0848038A (ja) * | 1994-08-08 | 1996-02-20 | Canon Inc | 液体噴射記録ヘッド用基体及びその製造方法及び液体噴射記録装置 |
JP2001096749A (ja) * | 1999-09-29 | 2001-04-10 | Sharp Corp | インクジェットヘッド及びその製造方法 |
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US6164759A (en) * | 1990-09-21 | 2000-12-26 | Seiko Epson Corporation | Method for producing an electrostatic actuator and an inkjet head using it |
JPH07227968A (ja) | 1994-02-21 | 1995-08-29 | Canon Inc | インクジェット記録ヘッド及びその製造方法 |
US5706041A (en) | 1996-03-04 | 1998-01-06 | Xerox Corporation | Thermal ink-jet printhead with a suspended heating element in each ejector |
US5751315A (en) | 1996-04-16 | 1998-05-12 | Xerox Corporation | Thermal ink-jet printhead with a thermally isolated heating element in each ejector |
US5861902A (en) * | 1996-04-24 | 1999-01-19 | Hewlett-Packard Company | Thermal tailoring for ink jet printheads |
US6340223B1 (en) * | 1999-06-28 | 2002-01-22 | Sharp Kabushiki Kaisha | Ink-jet head and fabrication method of the same |
US6273555B1 (en) | 1999-08-16 | 2001-08-14 | Hewlett-Packard Company | High efficiency ink delivery printhead having improved thermal characteristics |
US6755509B2 (en) | 2002-11-23 | 2004-06-29 | Silverbrook Research Pty Ltd | Thermal ink jet printhead with suspended beam heater |
US6692108B1 (en) | 2002-11-23 | 2004-02-17 | Silverbrook Research Pty Ltd. | High efficiency thermal ink jet printhead |
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2008
- 2008-06-23 US US12/143,880 patent/US8540349B2/en not_active Expired - Fee Related
-
2009
- 2009-06-17 WO PCT/US2009/003625 patent/WO2010011250A2/en active Application Filing
- 2009-06-17 JP JP2011514607A patent/JP5525519B2/ja not_active Expired - Fee Related
- 2009-06-17 EP EP09745142A patent/EP2313276B1/en not_active Not-in-force
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JPH0848038A (ja) * | 1994-08-08 | 1996-02-20 | Canon Inc | 液体噴射記録ヘッド用基体及びその製造方法及び液体噴射記録装置 |
JP2001096749A (ja) * | 1999-09-29 | 2001-04-10 | Sharp Corp | インクジェットヘッド及びその製造方法 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015223814A (ja) * | 2014-05-29 | 2015-12-14 | キヤノン株式会社 | 液体吐出ヘッド |
CN107073960A (zh) * | 2014-10-30 | 2017-08-18 | 惠普发展公司,有限责任合伙企业 | 喷墨打印头 |
JP2017533128A (ja) * | 2014-10-30 | 2017-11-09 | ヒューレット−パッカード デベロップメント カンパニー エル.ピー.Hewlett‐Packard Development Company, L.P. | インクジェットプリントヘッド |
JP2017533129A (ja) * | 2014-10-30 | 2017-11-09 | ヒューレット−パッカード デベロップメント カンパニー エル.ピー.Hewlett‐Packard Development Company, L.P. | インクジェットプリントヘッド |
US10457048B2 (en) | 2014-10-30 | 2019-10-29 | Hewlett-Packard Development Company, L.P. | Ink jet printhead |
US10493757B2 (en) | 2014-10-30 | 2019-12-03 | Hewlett-Packard Development Company, L.P. | Ink jet printhead |
US11186089B2 (en) | 2014-10-30 | 2021-11-30 | Hewlett-Packard Development Company, L.P. | Ink jet prinithead |
Also Published As
Publication number | Publication date |
---|---|
WO2010011250A2 (en) | 2010-01-28 |
US8540349B2 (en) | 2013-09-24 |
US20090315951A1 (en) | 2009-12-24 |
EP2313276A2 (en) | 2011-04-27 |
JP5525519B2 (ja) | 2014-06-18 |
WO2010011250A3 (en) | 2010-04-15 |
EP2313276B1 (en) | 2012-10-03 |
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