JP2011524068A5 - - Google Patents

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Publication number
JP2011524068A5
JP2011524068A5 JP2011511798A JP2011511798A JP2011524068A5 JP 2011524068 A5 JP2011524068 A5 JP 2011524068A5 JP 2011511798 A JP2011511798 A JP 2011511798A JP 2011511798 A JP2011511798 A JP 2011511798A JP 2011524068 A5 JP2011524068 A5 JP 2011524068A5
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JP
Japan
Prior art keywords
composition
submicron particles
inorganic
composition according
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2011511798A
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English (en)
Japanese (ja)
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JP2011524068A (ja
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Publication date
Application filed filed Critical
Priority claimed from PCT/US2009/045389 external-priority patent/WO2009146348A1/en
Publication of JP2011524068A publication Critical patent/JP2011524068A/ja
Publication of JP2011524068A5 publication Critical patent/JP2011524068A5/ja
Withdrawn legal-status Critical Current

Links

JP2011511798A 2008-05-28 2009-05-28 光電池の導体に使用されるサブミクロン粒子を含む組成物 Withdrawn JP2011524068A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US5659208P 2008-05-28 2008-05-28
US61/056,592 2008-05-28
PCT/US2009/045389 WO2009146348A1 (en) 2008-05-28 2009-05-28 Compositions containing submicron particles used in conductors for photovoltaic cells

Publications (2)

Publication Number Publication Date
JP2011524068A JP2011524068A (ja) 2011-08-25
JP2011524068A5 true JP2011524068A5 (enExample) 2012-07-12

Family

ID=40934192

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011511798A Withdrawn JP2011524068A (ja) 2008-05-28 2009-05-28 光電池の導体に使用されるサブミクロン粒子を含む組成物

Country Status (7)

Country Link
US (1) US8128846B2 (enExample)
EP (1) EP2294584A1 (enExample)
JP (1) JP2011524068A (enExample)
KR (1) KR20110014675A (enExample)
CN (1) CN102017014A (enExample)
TW (1) TW201005757A (enExample)
WO (1) WO2009146348A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008032554A1 (de) * 2008-07-10 2010-01-14 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Metallhaltige Zusammensetzung, Verfahren zur Herstellung von elektrischen Kontaktstrukturen auf elektronischen Bauteilen sowie elektronisches Bauteil
US20100301479A1 (en) * 2009-05-28 2010-12-02 E. I. Du Pont De Nemours And Company Devices containing silver compositions deposited by micro-deposition direct writing silver conductor lines
ZA201208302B (en) * 2011-11-09 2014-10-29 Heraeus Precious Metals Gmbh Thick film conductive composition and use thereof
KR101411012B1 (ko) * 2011-11-25 2014-06-24 제일모직주식회사 태양전지 전극용 페이스트 및 이를 이용한 전극 및 태양전지
CN103390444A (zh) * 2013-07-31 2013-11-13 广东风华高新科技股份有限公司 片式电阻器用无铅面电极浆料
EP2918371A1 (en) * 2014-03-11 2015-09-16 Heraeus Precious Metals North America Conshohocken LLC Solderable conductive polymer thick film composition
GB201520060D0 (en) * 2015-11-13 2015-12-30 Johnson Matthey Plc Conductive paste and conductive track or coating

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5403376A (en) * 1992-03-18 1995-04-04 Printron, Inc. Particle size distribution for controlling flow of metal powders melted to form electrical conductors
US5378408A (en) * 1993-07-29 1995-01-03 E. I. Du Pont De Nemours And Company Lead-free thick film paste composition
JP3854103B2 (ja) * 2001-06-28 2006-12-06 住友ベークライト株式会社 導電性ペースト及び該ペーストを用いてなる半導体装置
AU2002324775A1 (en) 2001-08-23 2003-03-10 Sciperio, Inc. Architecture tool and methods of use
JP2004139838A (ja) * 2002-10-17 2004-05-13 Noritake Co Ltd 導体ペーストおよびその利用
GB0307547D0 (en) * 2003-04-01 2003-05-07 Du Pont Conductor composition V
US7176152B2 (en) * 2004-06-09 2007-02-13 Ferro Corporation Lead-free and cadmium-free conductive copper thick film pastes
US7494607B2 (en) 2005-04-14 2009-02-24 E.I. Du Pont De Nemours And Company Electroconductive thick film composition(s), electrode(s), and semiconductor device(s) formed therefrom
US7556748B2 (en) * 2005-04-14 2009-07-07 E. I. Du Pont De Nemours And Company Method of manufacture of semiconductor device and conductive compositions used therein
US7435361B2 (en) 2005-04-14 2008-10-14 E.I. Du Pont De Nemours And Company Conductive compositions and processes for use in the manufacture of semiconductor devices
US7462304B2 (en) 2005-04-14 2008-12-09 E.I. Du Pont De Nemours And Company Conductive compositions used in the manufacture of semiconductor device
JP4934993B2 (ja) * 2005-05-25 2012-05-23 住友電気工業株式会社 導電性ペーストおよびそれを用いた配線基板
US7771623B2 (en) 2005-06-07 2010-08-10 E.I. du Pont de Nemours and Company Dupont (UK) Limited Aluminum thick film composition(s), electrode(s), semiconductor device(s) and methods of making thereof

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