JP2011524068A5 - - Google Patents
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- Publication number
- JP2011524068A5 JP2011524068A5 JP2011511798A JP2011511798A JP2011524068A5 JP 2011524068 A5 JP2011524068 A5 JP 2011524068A5 JP 2011511798 A JP2011511798 A JP 2011511798A JP 2011511798 A JP2011511798 A JP 2011511798A JP 2011524068 A5 JP2011524068 A5 JP 2011524068A5
- Authority
- JP
- Japan
- Prior art keywords
- composition
- submicron particles
- inorganic
- composition according
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US5659208P | 2008-05-28 | 2008-05-28 | |
| US61/056,592 | 2008-05-28 | ||
| PCT/US2009/045389 WO2009146348A1 (en) | 2008-05-28 | 2009-05-28 | Compositions containing submicron particles used in conductors for photovoltaic cells |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2011524068A JP2011524068A (ja) | 2011-08-25 |
| JP2011524068A5 true JP2011524068A5 (cg-RX-API-DMAC7.html) | 2012-07-12 |
Family
ID=40934192
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011511798A Withdrawn JP2011524068A (ja) | 2008-05-28 | 2009-05-28 | 光電池の導体に使用されるサブミクロン粒子を含む組成物 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8128846B2 (cg-RX-API-DMAC7.html) |
| EP (1) | EP2294584A1 (cg-RX-API-DMAC7.html) |
| JP (1) | JP2011524068A (cg-RX-API-DMAC7.html) |
| KR (1) | KR20110014675A (cg-RX-API-DMAC7.html) |
| CN (1) | CN102017014A (cg-RX-API-DMAC7.html) |
| TW (1) | TW201005757A (cg-RX-API-DMAC7.html) |
| WO (1) | WO2009146348A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102008032554A1 (de) * | 2008-07-10 | 2010-01-14 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Metallhaltige Zusammensetzung, Verfahren zur Herstellung von elektrischen Kontaktstrukturen auf elektronischen Bauteilen sowie elektronisches Bauteil |
| US20100301479A1 (en) * | 2009-05-28 | 2010-12-02 | E. I. Du Pont De Nemours And Company | Devices containing silver compositions deposited by micro-deposition direct writing silver conductor lines |
| SG190520A1 (en) * | 2011-11-09 | 2013-06-28 | Heraeus Precious Metals Gmbh | Thick film conductive composition and use thereof |
| KR101411012B1 (ko) * | 2011-11-25 | 2014-06-24 | 제일모직주식회사 | 태양전지 전극용 페이스트 및 이를 이용한 전극 및 태양전지 |
| CN103390444A (zh) * | 2013-07-31 | 2013-11-13 | 广东风华高新科技股份有限公司 | 片式电阻器用无铅面电极浆料 |
| EP2918371A1 (en) * | 2014-03-11 | 2015-09-16 | Heraeus Precious Metals North America Conshohocken LLC | Solderable conductive polymer thick film composition |
| GB201520060D0 (en) * | 2015-11-13 | 2015-12-30 | Johnson Matthey Plc | Conductive paste and conductive track or coating |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5403376A (en) * | 1992-03-18 | 1995-04-04 | Printron, Inc. | Particle size distribution for controlling flow of metal powders melted to form electrical conductors |
| US5378408A (en) * | 1993-07-29 | 1995-01-03 | E. I. Du Pont De Nemours And Company | Lead-free thick film paste composition |
| JP3854103B2 (ja) * | 2001-06-28 | 2006-12-06 | 住友ベークライト株式会社 | 導電性ペースト及び該ペーストを用いてなる半導体装置 |
| WO2003017745A2 (en) | 2001-08-23 | 2003-03-06 | Sciperio, Inc. | Architecture tool and methods of use |
| JP2004139838A (ja) * | 2002-10-17 | 2004-05-13 | Noritake Co Ltd | 導体ペーストおよびその利用 |
| GB0307547D0 (en) * | 2003-04-01 | 2003-05-07 | Du Pont | Conductor composition V |
| US7176152B2 (en) * | 2004-06-09 | 2007-02-13 | Ferro Corporation | Lead-free and cadmium-free conductive copper thick film pastes |
| US7462304B2 (en) | 2005-04-14 | 2008-12-09 | E.I. Du Pont De Nemours And Company | Conductive compositions used in the manufacture of semiconductor device |
| US7494607B2 (en) | 2005-04-14 | 2009-02-24 | E.I. Du Pont De Nemours And Company | Electroconductive thick film composition(s), electrode(s), and semiconductor device(s) formed therefrom |
| US7435361B2 (en) * | 2005-04-14 | 2008-10-14 | E.I. Du Pont De Nemours And Company | Conductive compositions and processes for use in the manufacture of semiconductor devices |
| US7556748B2 (en) * | 2005-04-14 | 2009-07-07 | E. I. Du Pont De Nemours And Company | Method of manufacture of semiconductor device and conductive compositions used therein |
| JP4934993B2 (ja) * | 2005-05-25 | 2012-05-23 | 住友電気工業株式会社 | 導電性ペーストおよびそれを用いた配線基板 |
| US7771623B2 (en) | 2005-06-07 | 2010-08-10 | E.I. du Pont de Nemours and Company Dupont (UK) Limited | Aluminum thick film composition(s), electrode(s), semiconductor device(s) and methods of making thereof |
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2009
- 2009-05-28 KR KR1020107029436A patent/KR20110014675A/ko not_active Ceased
- 2009-05-28 EP EP09755709A patent/EP2294584A1/en not_active Withdrawn
- 2009-05-28 US US12/473,339 patent/US8128846B2/en active Active
- 2009-05-28 CN CN2009801157411A patent/CN102017014A/zh active Pending
- 2009-05-28 WO PCT/US2009/045389 patent/WO2009146348A1/en not_active Ceased
- 2009-05-28 JP JP2011511798A patent/JP2011524068A/ja not_active Withdrawn
- 2009-06-01 TW TW098118104A patent/TW201005757A/zh unknown