JP2011517730A - Manufacturing method of target for sputtering composite and target manufactured by the manufacturing method - Google Patents

Abstract

The composite sputtering target can be a used sputtering target of the same or different materials, or is manufactured by heat-pressing metal or metal-containing powder in a back plate made of different materials with depressions formed on the surface. The indentation corresponds to an erosion pattern of a target having the same geometry. The depression can be formed by machining, for example. The back plate is mounted in a graphite mold and covered with sputtering material to form an assembly. The assembly to which the stuffer has been added is heated and pressed by appropriate pressure and heating under vacuum to form a composite sputtering target having a dense sputtering zone of sputtering material.
[Selection] Figure 1

Description

  The present invention relates to a target member for composite sputtering produced by heat-pressure molded metal or metal-containing powder placed in a metal back plate. More particularly, the present invention reduces the amount of relatively expensive materials such as noble metal-containing materials required to provide a targate comprising the above materials for the area of the target utilized in the sputtering process. The present invention relates to a method for producing a target member for sputtering a heated pressure composite. The present invention further relates to a target produced by the above method.

  Presumably, thin films of various materials are deposited on the substrate by a film forming process known as DC magnetron sputtering. The surface sputtering apparatus includes means for generating a high energy plasma that moves material deposited from the surface of the source to generate vapors of material that is condensed onto the surface of the desired substrate.

  In such an apparatus, the source of material deposited on the substrate is referred to as a sputtering target. Sputtering targets can be formed in an object called a sputtering target tile and bonded to a different material called a sputtering target backplate in the case where the deposition material is a single or mixed material, and is generally sputtered. It is called a target.

  The sputtering target is selected depending on the sputtering equipment used, the physical and electrical properties of the deposited material, and the cost of the deposited material. In the sputtering process, the high energy plasma continuously erodes the surface of the sputtering target material, forming depressions known as “erosion grooves” in the surface of the sputtering target.

  This erosion groove is usually called a “race track” in the thin film industry due to its unique shape. Eventually, when further sputtering of the target material results in a sufficient depth of the erosion groove, the practical ability of the target is lost and the sputtering target is considered “used”.

  In a typical sputtering process, 20-40% of the target material is utilized. The remaining target material is then either reused by dissolution or purification or discarded.

  Conventionally, noble metal targets are reused because they are sufficiently used in view of the cost of the sputtering target material. The recycling process increases the total amount of noble metal required to be performed in the sputtering process. In the past, spent targets are not freely available due to restrictions on re-dissolution and / or purification when attempting to utilize for the production of new targets. For a long time, given the remaining materials of the used target available, these are significant material losses in the reuse process.

  In addition, most materials used in sputtering process reuse can perform cost reductions. This is limited to cases of relatively expensive materials including noble metals such as Pt, Ru, Pd1, Os1, Tr1, Rh and Re, or expensive metal combinations, and other metals or metal oxides Is not to be done. In such an example, the cost and the amount of material lost from the recycling process ensures that the noble metal contained in the sputtering target produces a significant improvement over manufacturing.

US Pat. No. 5,397,050 US Pat. No. 5,963,778 US Pat. No. 7,175,802

  In accordance with the present invention, a method for reducing the amount of noble metal, including materials used for noble metals included in a sputtering target manufacturing process, limits the noble metals contained relative to the actual area where the sputtering erosion grooves are used up. It is. It is conceivable that the amount of noble metal contained in the material from which the target was manufactured is reduced by making it larger than 40% due to the limitation of the noble metal contained in the erosion groove material of the sputtering target.

  Furthermore, similarly, the present invention does not require a used target that has undergone a refining process and results in a significant reduction in the inventory of precious metals used for sputtering (especially no supply is required in production capacity). The amount of material that is bound to a used target and cannot be used freely is reduced.)

  The prior art has been a composite sputtering target member that can be advantageously combined and manufactured by a powder metallurgy process. As an example of such a process, Patent Document 1 discloses a method of manufacturing a composite sputtering target member having a structure of a tungsten-titanium alloy target and a titanium back plate. The titanium backplate is placed in a metal can and then tungsten-titanium powder is placed on the surface of the titanium backplate in the metal can. The metal tube contains a powder material which is a composite sputtering target formed by hot isostatic pressing (HIP) and a back plate.

However, since the processes related to HIP powder are housed in metal cans, expensive canned members and devices are used, and as a result of the HIP technique and equipment that are costly to manufacture, it is relatively expensive. .
In addition, the expensive target material does not limit the sputtering area of the target. Thus, the amount of expensive target material used in this type of sputtering target cannot be significantly reduced.

  As another method, Patent Document 2 discloses a mixed target that is manufactured using a powder metallurgy process and attempts to limit the cost of a sputtering material in the sputtering region of the target. However, as in the previous invention, the process used to manufacture the mixed target is such a HIS technique, and similar costs and close relationships will be described for application.

  Patent Document 3 discloses a method for renewing a used sputtering target by filling a sputter erosion groove with a new material by a new sputtering material. This process has also been achieved using the HIP approach. Although this invention cannot limit expensive sputtering material for the sputtering area of the target, it can recycle the used target for recycling. However, for the relatively high cost of ownership, there is a substantial amount of expensive material that has not been used in the main sputtering process. In addition, a process is disclosed that requires a used target so as to thoroughly attach a high-priced material that needs to be removed or reused after pressing.

  The present invention provides a method for efficiently and relatively inexpensively manufacturing a composite sputtering target member made of a sputtering material containing a noble metal in which the sputtering region of the target member is limited. This is realized by creating a cavity by machining from the sputtering erosion groove or the surface of the back plate member made of a sufficiently low cost material of the used targate and embedding a noble metal including the sputtering member. This process of the present invention is very suitable for buried target erosion grooves. In this embodiment, the used target is utilized as a backplate and no additional mechanism is required to form the shape in order to newly embed the noble metal material.

  Furthermore, the mixed target of the present invention is manufactured by assembling and manufacturing using vacuum heating and pressure molding using an unused graphite die instead of a single metal can, and the amount of noble metal contained in the material powder used in the manufacturing process Is greatly reduced. The result is a composite sputtering target that requires at least 50% or less of a material more expensive than a target purely manufactured with a noble metal containing material. This process significantly reduces the amount of noble metal that needs to be contributed to the sputtering process from the removed backing material of the used target material during the recycling portion of the expensive material manufacturing cycle used in the sputtering target. . This advantage results in a wonderful and unexpected increase in the efficiency of noble metals that contribute to the sputtering process.

  In accordance with the present invention, a sputtering target member that limits expensive materials, including sputtering target material relative to the sputtering area of the target, by reducing the amount of noble metal including sputtering material required to produce the sputtering target member. A method of manufacturing is provided. Furthermore, the efficiency of the materials that contribute to the sputtering process is increased.

  Thus, as well as the resource investment required for the sputtering process, the cost of the sputtering target member owner is reduced. The method of the present invention relates to the provision of a relatively inexpensive material backplate. It is chemically and mechanically mixed with noble metals including sputtering material, along with surface depressions (possible in the first embodiment machined on the backplate) corresponding to the sputtering erosion pattern found on the used sputtering target. Is possible.

  The back plate disposed in the graphite mold is processed so as to adapt to the geometry (size, shape, etc.). Fill the back plate cavity with a precious metal powder containing sputtering material. At that time, the upper surface of the powder layer is filled with graphite. The mold including the back plate powder assembly member is then set in vacuum heating and pressure molding so as to be hardened in the recess of the back plate and to increase the density (or concentration).

  In addition to vacuum heat and pressure molding to harden the noble metal containing the sputtering target material powder and increase the density, heat and pressure molding is also the same as the electrophilic and thermal conduction path between the noble metal containing the sputtering material and the back plate. In addition, it facilitates strong metal bonding between noble metals and backplates including sputtering materials that create strong mechanical attachments. The minimum mechanical amount after hot pressing may need to be obtained in advance for the sputtering target design.

In a preferred embodiment of the present invention, a method for producing a noble metal including a sputtering target member has the following configuration.
1) Provide a backplate that includes a surface having a depression.
2) The back plate is placed in the cavity of the graphite mold set so that the geometric back plate is received and prepared.
3) For a preset depth, the cavity is embedded with sputtering material in contact with the recess to completely cover the surface of the back plate to form the mold assembly.
4) A graphite ram is installed in the mold assembly to contact the top surface of the sputtering material.

  5) In order to increase and strengthen the density of the sputtering material in the recess of the back plate so that the stuffing tool and the mold assembly are arranged in the chamber of the vacuum heating and pressure molding furnace and form a shape to serve as the sputtering target Is applied with sufficient pressure and sufficient heating temperature for a sufficient period of time in a vacuum. Subsequently, the pressure on the graphite stuffing tool is lowered to 0, and the chamber of the heating and pressing molding furnace is cooled or left to cool to the ambient temperature. Then, once the heating and pressing molding furnace is cooled, the vacuum pressure is increased or left to reach the ambient pressure.

  6) Remove and pre-form the sputtering target from time to time to obtain an alloy sputtering target. Furthermore, in an advantageous embodiment of the invention, the backplate is composed of a material different from the sputtering target material and composed of one or more materials of molybdenum, niobium, tantalum or other refractory metals or alloys. Is done.

  The dent corresponds to at least a sputtering erosion pattern of a used sputtering target. More preferably, the depression corresponds to the erosion pattern of the used target (that is, a target at a stage where the range of the usage amount is not large for reuse). Furthermore, the sputtering material is a powder made of noble metal or a mixture of noble metals, or a mixture of noble metal powders, and is suitable for non-noble metal powders, non-noble metal mixture powders or metal oxide powders. In addition, as a preferred feature of the present invention, the graphite mold is a geometry that is determined in order to create a unique sputtering target member design.

  Suitable target materials are Ru, Rh, Pd, Re, Os, Ir, Pt or a mixture of Ru, Rh, Pd, Re, Os, Ir, Pt, or Ru, Rh, Pd, Re, Os, Ir, It is a mixture of Pt and transition metals such as Co, Cr, Ni, Fe, or Ru, Rh, Pd, Re, Os, Ir, Pt and transition metals such as Co, Cr, Ni, Fe. It is a mixture and a mixture with Ru, Rh, Pd, Re, Os, Ir, Pt with an oxide such as Ti [θ] 2 or an oxide such as TiO 2.

  In the preferred embodiment provided, pure Ru powder is used as the sputtering material and pure Mo is used for the backplate. In other embodiments, the backplate is composed of pure Nb metal. In yet another embodiment, the back plate is made of pure Ta.

  The present invention results in a saving of at least 25%, preferably 35%, and most preferably 45% of the sputtering material required for the sputtering target member as compared to the prior art of certain sputtering targets. It is done. For example, a noble metal contained in a rectangular geometry sputtering target may be used in the present invention if the noble metal material required for the noble metal contained in the sputtering target prepared to simply use the noble metal contained in the material is only 50%. Ready.

FIG. 1 is a diagram representing a cross-sectional configuration of a noble metal contained in a sputtering target having a rectangular or circular geometry. FIG. 2 is a top view representing a noble metal contained in a sputtering target having a rectangular geometry. FIG. 3 is a top view representing a noble metal contained in a sputtering target having a circular geometry. FIG. 4 is a diagram representative of a cross-sectional configuration of a backplate including depressions corresponding to the sputtering erosion pattern of a target of either rectangular or circular geometry. FIG. 5 is a diagram representing a cross-sectional configuration of a noble metal embedded in a sputtering gate of a target of either rectangular or circular geometry according to the first embodiment of the present invention. FIG. 6 is a view representative of a conventional heat and pressure mold member that heat-presses a sputtering material collected in a recess on the surface of the back plate. FIG. 7 is a view representative of the heat and pressure mold member after the heat and pressure treatment shown in FIG.

  The present invention relates to a method for manufacturing an alloy sputtering target in which a sputtering zone is formed by combining a sputtering target member that provides substantially the only sputtering material used in the sputtering process in a recess in the back plate and the back plate. About.

  In the first embodiment, the backplate is a spent target of similar material added as a sputtering material. In this embodiment, the used target has a surface with dents eroded during the sputtering process. This indentation is uniaxially pressurized under vacuum at the proper time and temperature to allow the spent material to blend into the used target so that it can be used in the process to replace the original target. Filled with new sputtering materials.

  In a second embodiment, the backplate provides scientific, thermal and electrical characteristics that are adapted to be used in place of a mixed turgate for a tergate made exclusively from sputtering material. A different material, such as a less expensive material that is joined with a sputtering material. In this embodiment, the backplate includes the appearance of the spent precious metal contained in the rectangular or circular geometry sputtering target described in FIGS.

  FIG. 1 depicts a cross-sectional configuration of a used or used precious metal contained in a sputtering target 10 and shows the depth and shape of the sputtering erosion groove 12. As represented in FIG. 1, the erosion groove 12 includes an erosion groove shaped into a noble metal contained in a sputtering target having either a rectangular or circular geometry. FIG. 2 shows a top view of the noble metal contained in the sputtering target 20 having a rectangular geometry, and shows the shape of the sputtering erosion groove 22. FIG. 3 shows a top view of the noble metal contained in the sputtering target 30 having a circular geometry, and shows the shape of the sputtering erosion groove 32.

From the investigation of these figures, a considerable amount of noble metal sputtering material remains if the target actually used in the sputtering process is only 25%.
The present invention reduces the amount of noble metal added to the sputtering target by addressing the noble metal containing material only to the areas consumed in the sputtering process.

  The present invention is composed of different materials from sputtering target materials, and by using a back plate as an embodiment, with relatively inexpensive metals such as Mo, Ta, Nb or other refractory metals and their alloys. Even if there is, the purpose is achieved. The metal is a material that can include a noble metal and can be mixed mechanically and chemically.

  FIG. 4 shows a cross-sectional configuration of a back plate 40 having a recess 42, in this example a top surface 41 with a groove. The depression is a wear path or erosion groove of used or used target on the back plate. In another embodiment, the recess 42 is a groove formed in the upper surface of the back plate by machining. The grooves shown in FIG. 1 are close to or correspond to the geometry of sputtering erosion grooves. The geometry of the erosion groove can be determined by the shape of the recess.

  Preferably, this information reduces the volume of sputtering material so that it can be used while a target configured to maximize the product life of the target is allowed, and Make the most of the shape of the dent for balance.

  FIG. 5 shows the noble metal contained in the sputtering material 51 which forms the maximum capacity of the noble metal contained in the sputtering target composed of the back plate material 53 and the majority of the sputtering zone limited to the sputtering region of the composite sputtering target. The cross-sectional block diagram of the composite sputtering target 50 is shown. A saving of more than 50% in the amount of noble metal is included in the material essential for realizing the noble metal contained in the sputtering target that can be achieved according to the present invention.

  An example of the manufacturing method of the present invention is shown in FIGS. As shown in FIG. 6, the refractory metal or alloy back plate 60 includes a machined groove 62 disposed on the surface of the groove on the graphite heating and pressing mold (hereinafter referred to as a graphite mold) 64 side. It has a surface. At that time, a predetermined amount of sputtering material 66 is placed in the mold on top of the backplate 60 and the assembly 65 vibrates for a predetermined time to settle flat on the surface of the backplate. Be made.

  After the assembly 65 is vibrated, a graphite mold stuffer (hereinafter referred to as a ram) 67 is placed in the graphite mold cavity to abut the surface of the sputtering material. The assembly 65 is placed in a hydraulic press and a predetermined pressure is applied for a specified time to solidify the powder on the surface of the backplate. After compression, the assembly is placed on the chamber side of the furnace for vacuum heating and pressurization (not shown). .

  The stuffing tool pressed by the hydraulic press through the furnace chamber is lowered until it abuts the upper surface of the graphite mold. The furnace chamber is then sealed and evacuated between 50 mTorr and 200 mTorr. The assembly is heated in the furnace chamber at a temperature range of 800 to 1000 degrees, and the pressure at that time is applied to the stuffer via a contacting hydraulic press. The initial pressure applied is between 5 to 20 tons.

  Similarly, the assembly is heated in the range of 1400 degrees to 1900 degrees, preferably between 1500 degrees and 1550 degrees, and the pressure on the stuffing tool is slowly between 10 tons and 200 tons. Added. The pressure value due to the stuffing tool depends on the geometry and size of the noble metal contained in the manufactured sputtering target. The assembly 65 is maintained at a temperature and pressure on the stuffer for 15 to 240 minutes, preferably between 20 and 60 minutes.

After this time has elapsed, the temperature and pressurization on the stuffing device both decrease until assembly 65 reaches ambient temperature and pressure, and the degree of vacuum once the furnace is cooled to ambient temperature, Increase to ambient pressure.
FIG. 7 is a diagram showing a cross-sectional configuration of the assembly 70 shown in FIG. 6 after the heating and pressurization is completed. As shown in the drawings, the sputtering material 74 has a density greater than 95% of the theoretical density (or concentration) of the material and is in a machined groove of the backplate 73 formed in the sputtering zone. Fixed to. The noble metal and the back plate contained in the sputtering target made of the fixed preform of the sputtering material are taken out of the graphite mold 75, and the stuffing tool 77 is removed. The preformed sputtering material is processed to final dimensions using CNC machining, diamond polisher or electrical discharge machine (EDM).

  In some applications, the carbon content of the precious metal, including the material, must be maintained at a very low level. The inner surface of the graphite mold and the bottom surface of the stuffer can be lined with Mo or other refractory metal film to prevent carbon diffusion from the graphite mold part into the precious metal contained in the material. .

  Another advantage used in the present invention is that the sputtering target has been used. The used target may be used to manufacture a new sputtering target using the above-described process on a used target substituted for a refractory metal or an alloy back plate included in a machined groove in the process. By doing so, the amount of noble metal contained in the sputtering material using this process can be further reduced, and the cost of refractory metals or alloy backplates containing machined grooves can be subtracted. The process of reusing a used composite sputtering target can be performed repeatedly.

  Furthermore, another advantage used in the present invention over the production of the noble metal contained in the sputtering target is to realize an oxygen content in the noble metal contained in the material that must be kept very low. During the heat and pressure treatment, the graphite mold is exposed to a vacuum that provides a very depressurized atmosphere within the graphite mold, even when the mold surface is lined with Mo or other refractory metal. Therefore, the oxygen contained in the precious metal is extracted.

In this reduced state, it is possible to reduce the oxygen content of the noble metal from the oxygen content of the noble metal contained in the material at the start so as to be uniformly below the specified level, exceeding the specified value described above. This reduction is not feasible for other processes such as heated isostatic pressing (HIP'ing) where the precious metal containing material is treated in a sealed metal can. Provided to adopt a precious metal with a high degree of oxygen capacity at the beginning, providing a great degree of freedom among the precious metal sources.
The following examples illustrate specific embodiments of the present invention and do not limit the idea of the invention including several methods.

Embodiment 1
First, a circular Ru composite sputtering target having a diameter of 2.03 inches (where 1 inch is about 2.54 [cm]) and a thickness of 0.31 inches is applied to a Mo back plate using the above-described present invention. Produced. Using a lathe, a Mo piece with a diameter of 2.03 inches and a thickness of 0.25 inches has a depth of 0.115 inches, a top diameter of 1.84 inches, and a bottom diameter of 1.55 (formed in a truncated cone shape). It is machined so that a concentric cavity is made in the center at the diameter of the Mo piece. The machined Mo piece is placed in a graphite mold, and 100 g of Ru powder is poured into the graphite mold cavity so as to fill the cavity of the Mo piece and cover the upper surface. The stuffing tool is placed in the graphite mold cavity to lower the upper surface of the Ru powder.

  A mold assembly (graphite mold and stuffing tool) is placed in a hydraulic press, and the Ru powder is pre-pressurized with a load of several hundred pounds. At that time, the mold assembly is placed in a vacuum heating and pressing machine and is subjected to a process of 0.5 hours at 1525 degrees at 500 psi at a vacuum degree of 200 mTorr. Thereafter, the heat-pressurized Ru / Mo mixed piece is taken out from the heat-pressing machine and subjected to a simple visual inspection on the machined surface.

  Visual inspection confirms Ru and Mo bonded together during the heat and pressure treatment, suggesting chemical compatibility with each other and without a clear reaction. Furthermore, the mechanical fit is confirmed by the absence of cracks in either material. Also, the mixed portion is cut and set in an EDM apparatus to inspect the mixed cross-sectional portion. Visual inspection and microscopic inspection provide confirmation of chemical and mechanical compatibility between the two materials, with no significant occurrence of reactions and no cracks and tears.

To check the density of the Ru part of the mix, the part of the mix piece is set in an EDM apparatus, and the Ru piece is cut into a dimension of 0.701 inch x 0.537 inch x 0.185 inch. At the same time, it is separated from Mo. Its density is determined using the weight and physical dimensions of the piece. It was found that the density in the Ru piece cut out from this Ru / Mo mixed part was 98.9% of the theoretical density of Ru.
The density of Ru used for the production of this composite sputtering target was 100 g, which is 50% or less of the density required for producing 202 g of pure Ru sputtering target having the same geometry.

Embodiment 2
A circular Ru composite sputtering target having a diameter of 2.03 inches and a thickness of 0.31 inches is assembled with the Nb backplate used in the disclosed invention. Using a lathe, an Nb piece with a thickness of 0.25 inches and a diameter of 2.03 inches has a depth of 0.115 inches, a top diameter of 1.84 inches, and a bottom diameter of 1.55 (formed in a truncated cone shape). It is machined so that a concentric cavity is made in the center at the diameter of the Mo piece. The machined Nb piece is placed in a graphite mold, and 100 g of Ru powder is poured into the graphite mold cavity so as to fill the cavity of the Nb piece and cover the upper surface. The stuffing tool is placed in the graphite mold cavity to lower the upper surface of the Ru powder.

  The mold assembly is subsequently placed in a hydraulic press and pressurizes Ru powder with a pre-pressurization at a load of several hundred pounds. At that time, the mold assembly is placed in a vacuum heating and pressing machine and is subjected to a 0.5 hour process at 1525 degrees at 500 psi at a vacuum of 200 mTorr. Thereafter, the heat-pressurized Ru / Nb mixed piece is taken out from the heat-pressing machine and subjected to a simple visual inspection on the machined surface.

  Visual inspection confirms Ru and Nb bonded together during the heat and pressure treatment, suggesting chemical compatibility with each other and without a clear reaction. Furthermore, the mechanical fit is confirmed by the absence of cracks in either material. Also, the mixed portion is cut and set in an EDM apparatus to inspect the mixed cross-sectional portion. Visual inspection and microscopic inspection provide confirmation of chemical and mechanical compatibility between the two materials, with no significant occurrence of reactions and no cracks and tears.

  The density of Ru used for the production of this composite sputtering target was 100 g, which is 50% or less of the density required for producing 202 g of pure Ru sputtering target having the same geometry.

Embodiment 3
A circular Ru composite sputtering target having a diameter of 2.03 inches and a thickness of 0.31 inches is assembled with the Ta back plate used in the disclosed invention. Using a lathe, a Ta piece with a thickness of 0.25 inches and a diameter of 2.03 inches has a depth of 0.115 inches, a top surface diameter of 1.84 inches, and a bottom surface diameter of 1.55 (formed in a truncated cone shape). It is machined to have a concentric cavity in the center with the diameter of the Ta piece. The machined Ta piece is placed in a graphite mold, and 100 g of Ru powder is poured into the mold cavity so as to fill the cavity of the Ta piece and cover the upper surface. The stuffing tool is placed in the graphite mold cavity to lower the upper surface of the Ru powder.

  The mold assembly is then placed in a hydraulic press and presses Ru powder with a pre-pressurization at a load of several hundred pounds. At that time, the mold assembly is placed in a vacuum heating and pressing machine and is subjected to a process of 0.5 hours at 1525 degrees at 500 psi at a vacuum of 200 mTorr. Thereafter, the heat-pressurized Ru / Ta mixed piece is taken out from the heat-pressing machine and subjected to a simple visual inspection on the machined surface.

Visual inspection confirms Ru and Ta that are bonded together during the heat and pressure treatment, suggesting chemical compatibility with each other and without a clear reaction. Furthermore, the mechanical fit is confirmed by the absence of cracks in either material. Also, the mixed portion is cut and set in an EDM apparatus to inspect the mixed cross-sectional portion. Visual inspection and microscopic inspection provide confirmation of chemical and mechanical compatibility between the two materials, with no significant occurrence of reactions and no cracks and tears.
The density of Ru used for the production of this composite sputtering target was 100 g, which is 50% or less of the density required for producing 202 g of pure Ru sputtering target having the same geometry.

Embodiment 4
A circular Ru composite sputtering target having a diameter of 2.03 inches and a thickness of 0.31 inches is assembled with the Ti backplate used in the disclosed invention. Using a lathe, a Ti piece with a thickness of 0.25 inches and a diameter of 2.03 inches has a depth of 0.115 inches, a top diameter of 1.84 inches, and a bottom diameter of 1.55 (formed in a truncated cone shape). Machined to have a concentric cavity in the center with the diameter of the Ti piece. The machined Nb piece is placed in a graphite mold, and 100 g of Ru powder is poured into the graphite mold cavity so as to fill the cavity of the Ti piece and cover the upper surface. The stuffing tool is placed in the graphite mold cavity to lower the upper surface of the Ru powder.

  The mold assembly is then placed in a hydraulic press and presses Ru powder with a pre-pressurization at a load of several hundred pounds. At that time, the mold assembly is placed in a vacuum heating and pressing machine and is subjected to a process of 0.5 hours at 1525 degrees at 500 psi at a vacuum degree of 200 mTorr. Thereafter, the heat-pressurized Ru / Ti mixed piece is taken out from the heat-pressing machine and subjected to a simple visual inspection on the machined surface.

  In the visual inspection, Ru and Ta bonded together during the heating and pressurizing process are confirmed. However, there was evidence of a reaction between the two materials, with a slight erosion of Ti along the edge of the piece suggesting a possible chemical mismatch. It is recorded that there is no crack in either material, and mechanical fit is confirmed. The mixing part is cut and inspected in the EDM apparatus to inspect the mixing cross section. Visual inspection and microscopy reveal the important reactions that have occurred between the two materials left in the gap between the Ru and Ti pieces. Furthermore, a chemical incompatibility is suggested between the two materials under the conditions used in the mixing process.

  If Ti is used as the backplate, both Ru and Ti that can be inserted between the Ti backplate and the Ru powder load are chemically and mechanically mixable Mo, Nb, Ta or others As a metal, it can be used as a barrier material. The barrier material can be in the form of a foil and the powder layer or coating can be applied to methods such as sputtering, flame spraying, plasma spraying, or other coating techniques.

Embodiment 5
The Lithium (Ru) / Niobium (Nb) mixed portion has a length of 7.07 including a groove with a top width of 1.77 inches, a bottom width of 1.05 inches and a depth of 0.233 inches along the length of the backplate. Fabricate a pressured Lithium Bower 7.07 inches long, 2.3 inches wide and 0.5 inches thick in an Nb back plate that is 2.30 inches wide and 0.400 inches thick. . The plate is filled back with 715 g of Lithium powder to fill the groove and cover the back plate and returned to the graphite mold.

  The stuffing tool is placed in the graphite mold so that it is pre-pressurized and brought into contact with the lithium powder before being placed in a vacuum heating / pressing machine larger than the vacuum heating / pressing machine used in Embodiments 1-4 above. Be placed. The mold in the vacuum heating and pressurizing machine is heated by 1600 degrees and a pressure of 26 tons from the filling tool. The mold and its contents are held in this state for 4 hours before being cooled to room temperature. High density can be achieved for this embodiment and subsequent embodiments over Embodiments 1-4 above by holding that portion at temperature for a long time.

  Evaluation of lithium in the groove of the mixed portion suggests a relative density of lithium that is 99% of the theoretical density of 12.41 g / cc of lithium. The rough erosion groove is then machined along the length into the surface of the lithenium portion of the mixing portion to a maximum depth of 0.200 inches. The mixed portion is filled back with 400 g of lithium powder to fill the groove and cover the mixed portion and returned to the graphite mold.

  The mold stuffing tool is placed in the graphite mold so that it is in contact with the lithium bower. The mold is pre-pressurized before being placed in the vacuum heating and pressing machine. The mold in the vacuum heating and pressurizing machine is heated at 1600 degrees and pressure of 26 tons from the mold filling tool. The mold and its contents are held in this state for 4 hours before being cooled to room temperature. Evaluation of pressurized lithium in the mimetic erosion groove of the mixed portion suggests a relative density of lithium that is 99% of the theoretical density of 12.41 g / cc of lithium. These results suggest the possibility of reusing the used tenium / niobium composite sputtering target to produce a new lithium / niobium composite sputtering target.

Embodiment 6
Each measuring dimension of 7.07 x 1.09 x 0.25 (inches) with a roughly triangular target erosion groove approximately 0.24 inches deep eroded along the length of each strip. Two used lithium target pieces are placed in a graphite heating and pressing mold.

Lithium powder 500 g is poured into a graphite mold so as to fill the erosion groove and completely cover the strip.

The mold stuffing tool is placed in the graphite mold so that it is in contact with the lithium bower. The mold is pre-pressurized before being placed in the vacuum heating and pressurizing machine. The mold in the vacuum heating and pressurizing machine is heated to 1600 degrees and a pressure of 20 tons is applied from the filling tool of the mold.
The mold and its contents are held in this state for 4 hours before being cooled to room temperature. It has been found that after heating and pressing, there is a characteristic for the resulting piece density, which is 98% at a density proportional to the Lithium X-ray density of 12.41 g / cc.

  For microscopy, the interface between the used target and the new material cannot be reliably recognized without extensive chemical etching. These results indicate that the used lithium sputtering target can be refilled with new lithium and used for the sputtering operation.

  The best mode and preferred embodiments are described within the scope of the patent law, and are not intended to be further limited within the scope of the invention. However, it is limited by the scope of the claims to which it belongs. EPO will not accept any debt due to the accuracy of information and data generated from other authorities than EPO. In particular, EPO does not guarantee completeness, but meets the latest or clear purpose. WO2009117043 claim tree, translation of this text.

  DESCRIPTION OF SYMBOLS 10,20 ... Sputtering target, 12, 22, 32 ... (sputtering) erosion groove | channel, 40, 73 ... Backplate, 41 ... Upper surface, 42 ... Depression, 50 ... Composite sputtering target, 51 ... Sputtering material, 53 ... Backplate material , 60 ... Alloy back plate, 60 ... Groove, 64, 75 ... Graphite heating and pressing mold (graphite mold), 65, 70 ... Assembly, 66, 74 ... Sputtering material, 67, 77 ... Stuffing tool.

The best mode and preferred embodiments are described within the scope of the patent law, and are not intended to be further limited within the scope of the invention. However, it is limited by the scope of the claims to which it belongs. EPO will not accept any debt due to the accuracy of information and data generated from other authorities than EPO. In particular, EPO does not guarantee completeness, but meets the latest or clear purpose. WO2009117043 claim tree, translation of this text.
The above-described embodiments include the following inventions.
1. (A) providing a backplate having a surface including geometry and depressions;
(B) placing the back plate in a graphite mold designed to accommodate the geometry of the back plate;
(C) adding a sputtering material from a mold assembly to the graphite mold on the top of the pack plate;
(D) placing the stuffer in the mold assembly such that the stuffer abuts the sputtering material;
(E) placing the mold assembly and the graphite mold in a hydraulic press and pressurizing a predetermined pressure value to the stuffing tool in the graphite mold;
(F) The compressed mold assembly and the graphite stuffing tool are arranged in a vacuum heating and pressurizing furnace chamber, and the graphite mold stuffing tool together with the graphite stuffing tool subjected to the vacuum heating and pressurizing water pressure. The step of contacting,
(G) hermetically sealing the vacuum heating and pressurizing furnace chamber and evacuating to a vacuum degree in a range of 200 mTorr to 50 mTorr;
(H) heating the vacuum heating and pressurizing furnace chamber and its storage member to a predetermined temperature, applying pressure to the graphite stuffing tool via the stuffing tool of the hydraulic press,
(I) reducing the pressure applied to the stuffing tool, cooling, and increasing the vacuum degree of the vacuum heating and pressurizing furnace chamber;
(J) a step of removing the graphite mold and the stuffing tool from the vacuum heating and pressurizing furnace chamber;
The manufacturing method of the composite sputtering target characterized by comprising.
2. The method for producing a composite sputtering target according to (1), wherein the removing step includes a step of removing a composite sputtering target pre-formed from the graphite mold.
3. The method for producing a composite sputtering target according to (2), further comprising a step of machining a surface of the composite sputtering target that has been pre-formed.
4). The method of manufacturing a composite sputtering target according to (3), wherein the machining step includes one or more diamond polishing and electric discharge machining.
5. The method for producing a composite sputtering target according to (2) above, wherein the back plate is made of a material that is a refractory metal that can be mechanically and chemically mixed with the sputtering material and an alloy thereof. .
6). 6. The method for producing a composite sputtering target as described in (5) above, wherein the material of the back plate is Mo, Ta or Nb. The target material is
Ru, Rh, Pd, Re, Os, Ir, Pt pure alone or a mixture of Ru, Rh, Pd, Re, Os, Ir, Pt,
Or a mixture of Ru, Rh, Pd, Re, Os, Ir, Pt and a transition metal,
Or a mixture of Ru, Rh, Pd, Re, Os, Ir, Pt and a transition metal and an oxide,
Or the manufacturing method of the composite sputtering target as described in said (1) item | term characterized by being comprised with the mixture and oxide of Ru, Rh, Pd, Re, Os, Ir, and Pt.
8). The said sputtering material is comprised with a noble metal, a noble metal alloy, the mixture with another metal, the mixture with an alloy, or an oxide and a mixture, The manufacturing method of the composite sputtering target as described in said (1) characterized by the above-mentioned. .
9. The method of manufacturing a composite sputtering target according to (1), wherein the composite sputtering target geometry is any one of a circle, a rectangle, a triangle, and an ellipse.
10. The method of manufacturing a composite sputtering target according to (1), wherein the composite sputtering target is configured with more than one section that requires a multi-tile sputtering target design.
11. In the manufacturing method,
The method for producing a composite sputtering target as described in (1) above, comprising a step of forming a recess in the back plate.
12 Using an erosion pattern to predict the optimal shape for the depression, the erosion pattern of the used sputtering target having a geometry corresponding to the geometry of the composite sputtering target is calculated on the back plate. The method for manufacturing a composite sputtering target according to (11), wherein the recess corresponding to an optimum shape is formed on the surface of the back plate by machining.
13. The said back plate is a thing of the used sputtering target, The manufacturing method of the composite sputtering target as described in said (1) characterized by the above-mentioned.
14 The method of manufacturing a composite sputtering target according to (1), wherein the back plate is made of a material different from the sputtering material.
15. In order to prevent an adverse reaction between the precious metal-containing material and the machined back plate member, a barrier member made of a barrier material added between the sputtering material and the back plate is used. The method for producing a composite sputtering target according to item (1), wherein:
16. The method for producing a composite sputtering target according to (15), wherein the barrier member is made of one of Nb, Ta, and Mo that forms foil, powder, or coating.
17. (A) selecting a backplate material that is chemically and mechanically compatible with the sputtering material;
(B) forming a groove in the backplate material approximating an erosion groove of a used sputtering target to form a backplate having a geometry including an upper surface;
(C) placing the back plate in a graphite mold designed to accommodate the geometry of the back plate;
(D) adding a predetermined amount of powder of sputtering material onto the top surface of the back plate so as to fill the groove and cover the top surface of the back plate to form a graphite mold back plate;
(E) vibrating the assembly including the graphite mold backplate to level the sputtering material powder covering the top surface of the back plate when forming the top surface of the sputtering material powder;
(F) In order to form an assembly including the graphite mold back plate and an assembly member of the graphite mold, the upper surface of the powder of the sputtering material and the graphite mold are in contact with each other. Placing a graphite mold stuffing tool having a top surface and a bottom surface on;
(G) The assembly is placed in a hydraulic press, and the graphite mold is packed at a predetermined pressure for a predetermined time in order to concentrate the powder of the sputtering material in the back plate groove. Applying pressure to the tool;
(H) Placing the compacted assembly in a vacuum heating and pressurizing furnace chamber, wherein the assembly is in contact with an upper surface of the graphite mold stuffing tool. A process of processing a stuffing tool of a hot-pressed hydraulic press machine on the top;
(I) a step of sealing and evacuating the vacuum heating and pressurizing furnace chamber to a degree of vacuum in a range of about 200 mTorr to about 50 mTorr;
(J) heating the chamber and the contents of the vacuum heating and pressurizing furnace at a predetermined temperature suitable for increasing the density of the sputtering material powder by changing into a solid body and a dense shape;
(K) pressurizing the graphite mold through a hydraulic press to a predetermined pressure suitable for increasing the density of the sputtering material powder by changing to a solid body and a dense shape;
(I) Heating and heating the assembly for a predetermined time suitable for densification of the sputtering material powder by changing to a solid and dense shape to form a preform of the sputtering target. Maintaining the pressure;
(M) releasing the pressure applied to the stuffing tool of the hydraulic press machine, releasing the vacuum degree of the vacuum heating and pressurizing chamber, and cooling;
(N) removing the assembly from the vacuum heat and pressure furnace chamber and removing a preform of the composite sputtering target from the graphite mold;
(O) a final step of removing the composite sputtering target from the composite sputtering target preform;
The manufacturing method of the composite sputtering target characterized by comprising.
18. The method for producing a composite sputtering target according to (17), wherein the back plate is made of a material that is a refractory metal or an alloy thereof made of a sputtering material that is mechanically and chemically matched.
19. The method of manufacturing a composite sputtering target according to (13), wherein the back plate material is Mo, Ta, or Nb.
20. The sputtering material may be a pure simple substance of Ru, Rh, Pd, Re, Os, Ir or Pt, or a mixture of Ru, Rh, Pd, Re, Os, Ir and Pt, or Ru, Rh, Pd with a transition metal. , Re, Os, Ir or Pt, or Ru, Rh, Pd, Re, Os, Ir or Pt with transition metal and oxide, or Ru, Rh with oxide containing Ti [θ] 2 , Pd, Re, Os, Ir, or Pt. The method of manufacturing a composite sputtering target as described in (17) above.
21. The said sputtering material is comprised with a noble metal or a noble metal alloy, The manufacturing method of the composite sputtering target as described in said (17) characterized by the above-mentioned.
22. The method of manufacturing a composite sputtering target according to (21), wherein the sputtering material is composed of Ag or Au, or another metal, an alloy, or an alloy of Ag or Au with a metal oxide.
23. The method of manufacturing a composite sputtering target according to (17), wherein the composite sputtering target is circular, rectangular, or triangular.
24. The method of manufacturing a composite sputtering target according to (17), wherein the composite sputtering target is configured with more than one section requiring a multi-tile sputtering target design.
25. In order to manufacture the composite sputtering target, a used composite sputtering target is used as the back plate. The method for manufacturing a composite sputtering target according to (17), wherein the composite sputtering target is used.
26. The method for producing a composite sputtering target according to (17), wherein a used composite sputtering target is used as the back plate a plurality of times in order to produce the composite sputtering target.
27. A barrier material or other material that is chemically and mechanically compatible with the backplate material and the sputtering material is interposed between the noble metal containing the sputtering material and the machined backplate. The manufacturing method of the composite sputtering target as described in said (17) term.
28. The production of the composite sputtering target according to (27), wherein the barrier material interposed between the sputtering material and the back plate by the used foil is composed of a powder material or a coating material. Method.
29. (A) providing a backplate having a geometry including a surface with a depression;
(B) placing the back plate in a graphite mold designed to accommodate the geometry of the back plate;
(C) adding a sputtering material from a mold assembly to the graphite mold on the top of the pack plate;
(D) placing the stuffer in the mold assembly such that the stuffer abuts the sputtering material;
(E) The mold assembly and the graphite mold are arranged in a hydraulic press, and a predetermined pressure value is set in the graphite mold to form a miniaturized mold assembly. A step of being pressurized by a stuffing tool;
(F) The compressed mold assembly and the graphite stuffing tool are arranged in a vacuum heating and pressurizing furnace chamber, and the graphite mold stuffing tool together with the graphite stuffing tool subjected to the vacuum heating and pressurizing water pressure. The step of contacting,
(G) hermetically sealing the vacuum heating and pressurizing furnace chamber and evacuating to a vacuum degree in a range of 200 mTorr to 50 mTorr;
(H) heating the vacuum heating and pressurizing furnace chamber and its storage member to a predetermined temperature, applying pressure to the graphite stuffing tool via the stuffing tool of the hydraulic press,
(I) lowering and cooling the pressure applied to the stuffing tool of the hydraulic press and increasing the vacuum degree of the vacuum heating and pressurizing furnace chamber;
(J) removing the miniaturized mold assembly from the vacuum heating and pressurizing furnace chamber;
(K) removing a new composite sputtering target formed using the composite sputtering target used in the sputtering process as a back plate from the graphite stuffing tool;
A sputtering target is manufactured by increasing the manufacturing efficiency of the sputtering material.
30. The composite of item (29), further comprising the step of machining on a surface of the pre-formed composite sputtering target to obtain a specified physical dimension of the composite sputtering target. A method for producing a sputtering target.
31. The method of manufacturing a composite sputtering target according to (30), wherein the machining step includes one or more diamond grinders and electrical machining.
32. The said back plate is comprised with the said sputtering material or the material which is Mo, Ta, or Nb, The manufacturing method of the composite sputtering target as described in the said (30) term | claim characterized by the above-mentioned.
33. The sputtering material is a pure simple substance of Ru, Rh, Pd1, Re, Os, Ir, or Pt, or a mixture of Ru, Rh, Pd, Re1, Os, Ir, or Pt, or Ru, Rh, Pd with a transition metal. , Re, Os1, Ir, or Pt, or Ru, Rh, Pd, a mixture of transition metals, oxides containing TiO2, or Ru, Rh, Pd with oxides, The method for producing a composite sputtering target as described in (30) above, comprising Re, Os, Ir, or Pt.
34. The back plate is made of a material that is Mo, Ta, or Nb, and the sputtering zone is made of Ru, Rh, Pd, Re, Os, Ir, or Pt pure or Ru, Rh, Pd, Re, Os, It is composed of a mixture of Ir or Pt or a mixture of Ru, Rh, Pd, Re, Os, Ir or Pt with a transition metal, or a mixture of Ru, Rh, Pd, Re, Os, Ir or Pt with a transition metal. ,
The sputtering zone is a dense area of chemically, thermally and electrically solidified sputtering material on the back plate, and the sputtering get is suitable for use in a sputtering process. A method for producing a composite sputtering target, comprising:
35. In order to prevent a mechanical reaction between the noble metal containing the sputtering material and the machined back plate, a barrier material made of Nb, Ta or Mo is interposed between the sputtering material and the back plate. A method for producing a composite sputtering target as described in (34) above, wherein
36. The shape of the sputtering zone is formed by calculating an erosion pattern of a used sputtering target having a geometry corresponding to the geometry of the composite sputtering target. Item (34) A method for producing a composite sputtering target.

Claims (36)

(A) providing a backplate having a surface including geometry and depressions;
(B) placing the back plate in a graphite mold designed to accommodate the geometry of the back plate;
(C) adding a sputtering material from a mold assembly to the graphite mold on the top of the pack plate;
(D) placing the stuffer in the mold assembly such that the stuffer abuts the sputtering material;
(E) placing the mold assembly and the graphite mold in a hydraulic press and pressurizing a predetermined pressure value to the stuffing tool in the graphite mold;
(F) The compressed mold assembly and the graphite stuffing tool are arranged in a vacuum heating and pressurizing furnace chamber, and the graphite mold stuffing tool together with the graphite stuffing tool subjected to the vacuum heating and pressurizing water pressure. The step of contacting,
(G) hermetically sealing the vacuum heating and pressurizing furnace chamber and evacuating to a vacuum degree in a range of 200 mTorr to 50 mTorr;
(H) heating the vacuum heating and pressurizing furnace chamber and its storage member to a predetermined temperature, applying pressure to the graphite stuffing tool via the stuffing tool of the hydraulic press,
(I) reducing the pressure applied to the stuffing tool, cooling, and increasing the vacuum degree of the vacuum heating and pressurizing furnace chamber;
(J) a step of removing the graphite mold and the stuffing tool from the vacuum heating and pressurizing furnace chamber;
The manufacturing method of the composite sputtering target characterized by comprising. The method of manufacturing a composite sputtering target according to claim 1, wherein the removing step includes a step of removing the composite sputtering target pre-formed from the graphite mold. The method of manufacturing a composite sputtering target according to claim 2, further comprising a step of machining a surface of the composite sputtering target that has been pre-formed. The method of manufacturing a composite sputtering target according to claim 3, wherein the machining step includes one or more diamond polishing and electric discharge machining. 3. The method of manufacturing a composite sputtering target according to claim 2, wherein the back plate is made of a material that is a refractory metal that can be mechanically and chemically mixed with the sputtering material and an alloy thereof. 6. The method of manufacturing a composite sputtering target according to claim 5, wherein the material of the back plate is Mo, Ta, or Nb. The target material is
Ru, Rh, Pd, Re, Os, Ir, Pt pure alone or a mixture of Ru, Rh, Pd, Re, Os, Ir, Pt,
Or a mixture of Ru, Rh, Pd, Re, Os, Ir, Pt and a transition metal,
Or a mixture of Ru, Rh, Pd, Re, Os, Ir, Pt and a transition metal and an oxide,
Or it is comprised with the mixture and oxide of Ru, Rh, Pd, Re, Os, Ir, and Pt, The manufacturing method of the composite sputtering target of Claim 1 characterized by the above-mentioned. 2. The method of manufacturing a composite sputtering target according to claim 1, wherein the sputtering material is composed of a noble metal, a noble metal alloy, a mixture with another metal, a mixture with an alloy, or an oxide and a mixture. The method of manufacturing a composite sputtering target according to claim 1, wherein the composite sputtering target geometry is any one of a circle, a rectangle, a triangle, and an ellipse. The method of manufacturing a composite sputtering target according to claim 1, wherein the composite sputtering target is configured with more than one section requiring a multi-tile sputtering target design. In the manufacturing method,
The method of manufacturing a composite sputtering target according to claim 1, comprising a step of forming a recess in the back plate. Using an erosion pattern to predict the optimal shape for the depression, the erosion pattern of the used sputtering target having a geometry corresponding to the geometry of the composite sputtering target is calculated on the back plate. The method of manufacturing a composite sputtering target according to claim 11, wherein the recess corresponding to an optimum shape is formed on a surface of the back plate by machining. The method of manufacturing a composite sputtering target according to claim 1, wherein the back plate is of a used sputtering target. The method of manufacturing a composite sputtering target according to claim 1, wherein the back plate is made of a material different from the sputtering material. In order to prevent an adverse reaction between the precious metal-containing material and the machined back plate member, a barrier member made of a barrier material added between the sputtering material and the back plate is used. The manufacturing method of the composite sputtering target of Claim 1 characterized by these. The method of manufacturing a composite sputtering target according to claim 15, wherein the barrier member is made of one of Nb, Ta, and Mo forming foil, powder, or coating. (A) selecting a backplate material that is chemically and mechanically compatible with the sputtering material;
(B) forming a groove in the backplate material approximating an erosion groove of a used sputtering target to form a backplate having a geometry including an upper surface;
(C) placing the back plate in a graphite mold designed to accommodate the geometry of the back plate;
(D) adding a predetermined amount of powder of sputtering material onto the top surface of the back plate so as to fill the groove and cover the top surface of the back plate to form a graphite mold back plate;
(E) vibrating the assembly including the graphite mold backplate to level the sputtering material powder covering the top surface of the back plate when forming the top surface of the sputtering material powder;
(F) In order to form an assembly including the graphite mold back plate and an assembly member of the graphite mold, the upper surface of the powder of the sputtering material and the graphite mold are in contact with each other. Placing a graphite mold stuffing tool having a top surface and a bottom surface on;
(G) The assembly is placed in a hydraulic press, and the graphite mold is packed at a predetermined pressure for a predetermined time in order to concentrate the powder of the sputtering material in the back plate groove. Applying pressure to the tool;
(H) Placing the compacted assembly in a vacuum heating and pressurizing furnace chamber, wherein the assembly is in contact with an upper surface of the graphite mold stuffing tool. A process of processing a stuffing tool of a hot-pressed hydraulic press machine on the top;
(I) a step of sealing and evacuating the vacuum heating and pressurizing furnace chamber to a degree of vacuum in a range of about 200 mTorr to about 50 mTorr;
(J) heating the chamber and the contents of the vacuum heating and pressurizing furnace at a predetermined temperature suitable for increasing the density of the sputtering material powder by changing into a solid body and a dense shape;
(K) pressurizing the graphite mold through a hydraulic press to a predetermined pressure suitable for increasing the density of the sputtering material powder by changing to a solid body and a dense shape;
(I) Heating and heating the assembly for a predetermined time suitable for densification of the sputtering material powder by changing to a solid and dense shape to form a preform of the sputtering target. Maintaining the pressure;
(M) releasing the pressure applied to the stuffing tool of the hydraulic press machine, releasing the vacuum degree of the vacuum heating and pressurizing chamber, and cooling;
(N) removing the assembly from the vacuum heat and pressure furnace chamber and removing a preform of the composite sputtering target from the graphite mold;
(O) a final step of removing the composite sputtering target from the composite sputtering target preform;
The manufacturing method of the composite sputtering target characterized by comprising. 18. The method of manufacturing a composite sputtering target according to claim 17, wherein the back plate is made of a material that is a refractory metal or an alloy thereof by a sputtering material that is mechanically and chemically matched. The method of manufacturing a composite sputtering target according to claim 18, wherein the back plate material is Mo, Ta, or Nb. The sputtering material may be a pure simple substance of Ru, Rh, Pd, Re, Os, Ir or Pt, or a mixture of Ru, Rh, Pd, Re, Os, Ir and Pt, or Ru, Rh, Pd with a transition metal. , Re, Os, Ir or Pt, or Ru, Rh, Pd, Re, Os, Ir or Pt with transition metal and oxide, or Ru, Rh with oxide containing Ti [θ] 2 The method of manufacturing a composite sputtering target according to claim 17, comprising Pd, Re, Os, Ir, or Pt. The said sputtering material is comprised with a noble metal or a noble metal alloy, The manufacturing method of the composite sputtering target of Claim 17 characterized by the above-mentioned. The method of manufacturing a composite sputtering target according to claim 21, wherein the sputtering material is composed of Ag or Au, or another metal, an alloy, or an alloy of Ag or Au with a metal oxide. The method of manufacturing a composite sputtering target according to claim 17, wherein the composite sputtering target has a circular shape, a rectangular shape, or a triangular shape. The method of manufacturing a composite sputtering target according to claim 17, wherein the composite sputtering target is configured with more than one section requiring a multi-tile sputtering target design. The method of manufacturing a composite sputtering target according to claim 17, wherein a used composite sputtering target is used as the back plate in order to manufacture the composite sputtering target. The method of manufacturing a composite sputtering target according to claim 17, wherein a used composite sputtering target is used a plurality of times as the back plate in order to manufacture the composite sputtering target. A barrier material or other material that is chemically and mechanically compatible with the backplate material and the sputtering material is interposed between the noble metal containing the sputtering material and the machined backplate. The method for producing a composite sputtering target according to claim 17. 28. The method of manufacturing a composite sputtering target according to claim 27, wherein the barrier material interposed between the sputtering material and the back plate by the used foil is composed of a powder material or a coating material. (A) providing a backplate having a geometry including a surface with a depression;
(B) placing the back plate in a graphite mold designed to accommodate the geometry of the back plate;
(C) adding a sputtering material from a mold assembly to the graphite mold on the top of the pack plate;
(D) placing the stuffer in the mold assembly such that the stuffer abuts the sputtering material;
(E) The mold assembly and the graphite mold are arranged in a hydraulic press, and a predetermined pressure value is set in the graphite mold to form a miniaturized mold assembly. A step of being pressurized by a stuffing tool;
(F) The compressed mold assembly and the graphite stuffing tool are arranged in a vacuum heating and pressurizing furnace chamber, and the graphite mold stuffing tool together with the graphite stuffing tool subjected to the vacuum heating and pressurizing water pressure. The step of contacting,
(G) hermetically sealing the vacuum heating and pressurizing furnace chamber and evacuating to a vacuum degree in a range of 200 mTorr to 50 mTorr;
(H) heating the vacuum heating and pressurizing furnace chamber and its storage member to a predetermined temperature, applying pressure to the graphite stuffing tool via the stuffing tool of the hydraulic press,
(I) lowering and cooling the pressure applied to the stuffing tool of the hydraulic press and increasing the vacuum degree of the vacuum heating and pressurizing furnace chamber;
(J) removing the miniaturized mold assembly from the vacuum heating and pressurizing furnace chamber;
(K) removing a new composite sputtering target formed using the composite sputtering target used in the sputtering process as a back plate from the graphite stuffing tool;
A sputtering target is manufactured by increasing the manufacturing efficiency of the sputtering material. 30. The composite sputtering target of claim 29, further comprising machining on a surface of the pre-formed composite sputtering target to obtain a specified physical dimension of the composite sputtering target. Manufacturing method. The method of manufacturing a composite sputtering target according to claim 30, wherein the machining step includes one or more diamond grinders and electrical machining. The said back plate is comprised with the said sputtering material or the material which is Mo, Ta, or Nb, The manufacturing method of the composite sputtering target of Claim 30 characterized by the above-mentioned. The sputtering material is a pure simple substance of Ru, Rh, Pd1, Re, Os, Ir or Pt, or a mixture of Ru, Rh, Pd, Re1, Os, Ir or Pt, or Ru, Rh, Pd with a transition metal. , Re, Os1, Ir, or Pt, or Ru, Rh, Pd, a mixture of transition metals, oxides containing TiO2, or Ru, Rh, Pd with oxides, 31. The method of manufacturing a composite sputtering target according to claim 30, comprising Re, Os, Ir, or Pt. The back plate is made of a material that is Mo, Ta, or Nb, and the sputtering zone is made of Ru, Rh, Pd, Re, Os, Ir, or Pt pure or Ru, Rh, Pd, Re, Os, It is composed of a mixture of Ir or Pt or a mixture of Ru, Rh, Pd, Re, Os, Ir or Pt with a transition metal, or a mixture of Ru, Rh, Pd, Re, Os, Ir or Pt with a transition metal. ,
The sputtering zone is a dense area of chemically, thermally and electrically solidified sputtering material on the back plate, and the sputtering get is suitable for use in a sputtering process. A method for producing a composite sputtering target, comprising: In order to prevent a mechanical reaction between the noble metal containing the sputtering material and the machined back plate, a barrier material made of Nb, Ta or Mo is interposed between the sputtering material and the back plate. The method for producing a composite sputtering target according to claim 34, wherein: The composite according to claim 34, wherein the shape of the sputtering zone is formed by calculating an erosion pattern of a used sputtering target having a geometry corresponding to the geometry of the composite sputtering target. A method for producing a sputtering target.

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