JP2011503784A5 - - Google Patents
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- Publication number
- JP2011503784A5 JP2011503784A5 JP2010532120A JP2010532120A JP2011503784A5 JP 2011503784 A5 JP2011503784 A5 JP 2011503784A5 JP 2010532120 A JP2010532120 A JP 2010532120A JP 2010532120 A JP2010532120 A JP 2010532120A JP 2011503784 A5 JP2011503784 A5 JP 2011503784A5
- Authority
- JP
- Japan
- Prior art keywords
- polymer resin
- organoclay
- insulating layer
- semiconductor layer
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims 7
- 239000002952 polymeric resin Substances 0.000 claims 5
- 229920003002 synthetic resin Polymers 0.000 claims 5
- 239000004065 semiconductor Substances 0.000 claims 2
- 229920005992 thermoplastic resin Polymers 0.000 claims 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims 1
- 239000005977 Ethylene Substances 0.000 claims 1
- 239000004927 clay Substances 0.000 claims 1
- 239000011231 conductive filler Substances 0.000 claims 1
- 229920001577 copolymer Polymers 0.000 claims 1
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical class O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 claims 1
- 229920001038 ethylene copolymer Polymers 0.000 claims 1
- 229920001519 homopolymer Polymers 0.000 claims 1
- 229910052901 montmorillonite Inorganic materials 0.000 claims 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 claims 1
- 229920001384 propylene homopolymer Polymers 0.000 claims 1
- 150000003856 quaternary ammonium compounds Chemical class 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US98481307P | 2007-11-02 | 2007-11-02 | |
| US60/984,813 | 2007-11-02 | ||
| PCT/US2008/079915 WO2009058560A1 (en) | 2007-11-02 | 2008-10-15 | Reduction of dielectric losses through use organoclay in semiconductor or insulator compositions |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011503784A JP2011503784A (ja) | 2011-01-27 |
| JP2011503784A5 true JP2011503784A5 (OSRAM) | 2011-12-01 |
| JP5473926B2 JP5473926B2 (ja) | 2014-04-16 |
Family
ID=40429787
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010532120A Expired - Fee Related JP5473926B2 (ja) | 2007-11-02 | 2008-10-15 | 半導体または絶縁体組成物における有機粘土の使用による誘電損失の低減 |
Country Status (11)
| Country | Link |
|---|---|
| US (2) | US9959951B2 (OSRAM) |
| EP (1) | EP2215158B1 (OSRAM) |
| JP (1) | JP5473926B2 (OSRAM) |
| KR (1) | KR101461700B1 (OSRAM) |
| CN (1) | CN101918486B (OSRAM) |
| AT (1) | ATE541890T1 (OSRAM) |
| BR (1) | BRPI0817164A2 (OSRAM) |
| CA (1) | CA2703974C (OSRAM) |
| MX (1) | MX2010004829A (OSRAM) |
| TW (1) | TW200936665A (OSRAM) |
| WO (1) | WO2009058560A1 (OSRAM) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6104277B2 (ja) * | 2011-12-13 | 2017-03-29 | ダウ グローバル テクノロジーズ エルエルシー | エチレン−プロピレン−ジエン共重合体組成物 |
| MX2017002127A (es) | 2014-08-19 | 2017-05-23 | Borealis Ag | Una nueva composicion, cable y capa estructurado de polimero reticulado. |
| US20160104555A1 (en) * | 2014-10-10 | 2016-04-14 | General Electric Company | Method for improving the electric field distribution in a high voltage direct current cable |
| WO2016204949A1 (en) | 2015-06-17 | 2016-12-22 | Dow Global Technologies Llc | Process for making crosslinked cable insulation using high melt strength ethylene-based polymer made in a tubular reactor and optionally modified with a branching agent |
| JP7537007B2 (ja) | 2020-08-21 | 2024-08-20 | ダウ グローバル テクノロジーズ エルエルシー | 高い体積抵抗率を有するメルトブローン不織布及びその物品 |
| EP4413070A1 (en) | 2021-10-05 | 2024-08-14 | Borealis AG | Cable |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2627194B2 (ja) * | 1989-07-31 | 1997-07-02 | 株式会社豊田中央研究所 | ポリエステル複合材料及びその製造方法 |
| JPH0652728A (ja) * | 1992-07-31 | 1994-02-25 | Showa Electric Wire & Cable Co Ltd | 電力ケーブル |
| JP3349747B2 (ja) * | 1993-02-26 | 2002-11-25 | 株式会社フジクラ | 絶縁組成物および電力ケーブル |
| US5780376A (en) * | 1996-02-23 | 1998-07-14 | Southern Clay Products, Inc. | Organoclay compositions |
| US6156835A (en) * | 1996-12-31 | 2000-12-05 | The Dow Chemical Company | Polymer-organoclay-composites and their preparation |
| FR2793592B1 (fr) * | 1999-03-04 | 2001-06-08 | Cit Alcatel | Cable d'energie ayant des caracteristiques mecaniques, thermiques, electriques, et de tenue au feu sensiblement ameliorees |
| US6524702B1 (en) * | 1999-08-12 | 2003-02-25 | Dow Global Technologies Inc. | Electrical devices having polymeric members |
| US6737464B1 (en) | 2000-05-30 | 2004-05-18 | University Of South Carolina Research Foundation | Polymer nanocomposite comprising a matrix polymer and a layered clay material having a low quartz content |
| US6740396B2 (en) * | 2001-02-26 | 2004-05-25 | Pirelli Cavi E Sistemi S.P.A. | Cable with coating of a composite material |
| JP2003022710A (ja) | 2001-07-06 | 2003-01-24 | Toshiba Corp | 低誘電型絶縁材料とその製造方法 |
| US6825253B2 (en) * | 2002-07-22 | 2004-11-30 | General Cable Technologies Corporation | Insulation compositions containing metallocene polymers |
| TWI314742B (en) * | 2002-09-10 | 2009-09-11 | Union Carbide Chem Plastic | Polypropylene cable jacket compositions with enhanced melt strength and physical properties |
| US7226422B2 (en) * | 2002-10-09 | 2007-06-05 | Cardiac Pacemakers, Inc. | Detection of congestion from monitoring patient response to a recumbent position |
| US7144934B2 (en) * | 2002-10-24 | 2006-12-05 | Dow Global Technologies Inc. | Charge dissipation modifiers for olefinic interpolymer compositions |
| CN1823123B (zh) | 2003-06-09 | 2011-07-27 | 联合碳化化学及塑料技术有限责任公司 | 可剥离半导体绝缘屏蔽 |
| CA2536948C (en) * | 2003-09-25 | 2013-01-22 | Dow Global Technologies Inc. | Strippable semiconductive shield and compositions therefor |
| JP2006028208A (ja) * | 2004-07-12 | 2006-02-02 | Fujikura Ltd | 低誘電性・耐熱性樹脂組成物、これを用いた成形品及びプリント回路基板 |
-
2008
- 2008-10-15 US US12/741,116 patent/US9959951B2/en not_active Expired - Fee Related
- 2008-10-15 AT AT08843776T patent/ATE541890T1/de active
- 2008-10-15 WO PCT/US2008/079915 patent/WO2009058560A1/en not_active Ceased
- 2008-10-15 EP EP08843776A patent/EP2215158B1/en not_active Revoked
- 2008-10-15 MX MX2010004829A patent/MX2010004829A/es active IP Right Grant
- 2008-10-15 KR KR1020107012060A patent/KR101461700B1/ko not_active Expired - Fee Related
- 2008-10-15 JP JP2010532120A patent/JP5473926B2/ja not_active Expired - Fee Related
- 2008-10-15 CA CA2703974A patent/CA2703974C/en not_active Expired - Fee Related
- 2008-10-15 CN CN200880123819.XA patent/CN101918486B/zh not_active Expired - Fee Related
- 2008-10-15 BR BRPI0817164A patent/BRPI0817164A2/pt not_active IP Right Cessation
- 2008-10-24 TW TW097140958A patent/TW200936665A/zh unknown
-
2018
- 2018-03-23 US US15/933,683 patent/US10354775B2/en not_active Expired - Fee Related
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