JP2011501819A - Display device and method for reducing electromagnetic wave thereof - Google Patents

Display device and method for reducing electromagnetic wave thereof Download PDF

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JP2011501819A
JP2011501819A JP2010527870A JP2010527870A JP2011501819A JP 2011501819 A JP2011501819 A JP 2011501819A JP 2010527870 A JP2010527870 A JP 2010527870A JP 2010527870 A JP2010527870 A JP 2010527870A JP 2011501819 A JP2011501819 A JP 2011501819A
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circuit board
connector
display device
grounding
region
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キム，ジュ−ヨン
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Samsung Electronics Co Ltd
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Samsung Electronics Co Ltd
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00—Details of television systems
    • H04N5/64—Constructional details of receivers, e.g. cabinets or dust covers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00—Details of television systems
    • H04N5/44—Receiver circuitry for the reception of television signals according to analogue transmission standards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0054—Casings specially adapted for display applications
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components

Abstract

ディスプレイ装置及びその電磁波の低減方法が開示される。本ディスプレイ装置は、信号を受信する信号受信部、信号受信部で受信された信号を信号処理する信号処理部と、信号処理された信号を出力するディスプレイ部と、信号受信部及び信号処理部が設けられた回路基板、回路基板と信号受信部の面接触を通じて発生する電磁波を減少させる面接地部を含む。これにより、回路基板に設けられた接地領域を拡張することにより回路基板で発生する電磁波を減少させることができる。  A display device and a method for reducing electromagnetic waves are disclosed. The display device includes a signal receiving unit that receives a signal, a signal processing unit that processes a signal received by the signal receiving unit, a display unit that outputs a signal processed signal, a signal receiving unit, and a signal processing unit. A circuit board provided, and a surface grounding unit that reduces electromagnetic waves generated through surface contact between the circuit board and the signal receiving unit are included. Thereby, the electromagnetic waves generated on the circuit board can be reduced by extending the grounding area provided on the circuit board.

Description

本発明は、ディスプレイ装置およびその電磁波の低減方法に関し、より詳細には、回路基板に設けられた接地領域を拡張して電磁波を減少させるディスプレイ装置およびその電磁波の低減方法に関する。   The present invention relates to a display device and a method for reducing electromagnetic waves, and more particularly to a display device for reducing electromagnetic waves by expanding a ground region provided on a circuit board and a method for reducing the electromagnetic waves.

ＬＣＤ（Ｌｉｑｕｉｄ Ｃｒｙｓｔａｌ Ｄｉｓｐｌａｙ）のようなディスプレイ装置は、ＴＶやノートＰＣ、デスクトップコンピュータ等に映像をディスプレイするために使われる。こういったＬＣＤのようなディスプレイ装置の大体は、外部機器と無線または有線で接続される。   A display device such as an LCD (Liquid Crystal Display) is used to display an image on a TV, a notebook PC, a desktop computer, or the like. Most of display devices such as LCDs are connected to external devices wirelessly or by wire.

このようなディスプレイ装置は回路基板（ＰＣＢ）を含むが、回路基板上に信号処理素子、保存素子、及び制御のためのマイコンなどの複数の素子が位置し、回路基板には各構成要素間で信号が送受信される通路の役割をするパターンが形成される。   Such a display device includes a circuit board (PCB), and a plurality of elements such as a signal processing element, a storage element, and a microcomputer for control are located on the circuit board. A pattern is formed that serves as a path through which signals are transmitted and received.

特に、回路基板はその自体のノイズ、他部品によって発生する電磁波などの影響を受けてディスプレイ装置の誤動作を招く。すなわち、回路基板に設けられたコネクタを介して有線で外部機器と接続されたりコネクタが回路基板に接触される場合に、電磁波として知られたＥＭＩ（Ｅｌｅｃｔｒｏｍａｇｎｅｔｅｃ Ｉｎｔｅｒｆｅｒｅｎｃｅ）ノイズが発生することになり、ディスプレイ装置の表示画面にノイズが発生したり雑音が出力されるといった誤動作を招く。   In particular, the circuit board is affected by its own noise, electromagnetic waves generated by other components, and the like, causing a malfunction of the display device. That is, EMI (Electromagnetec Interference) noise, known as electromagnetic waves, is generated when a cable is connected to an external device via a connector provided on the circuit board or when the connector is in contact with the circuit board. This may cause a malfunction such as generation of noise on the display screen of the apparatus or output of noise.

ところが、ＥＭＩノイズはパーソナルコンピュータ等のような外部装置と接続されるケーブルに形成されたコネクタに結合されるケーブルコネクタで更に多く発生することになるが、従来のディスプレイ装置ではＥＭＩノイズを減少させるために、ガスケット（Ｇａｓｋｅｔ）またはシールドカーバ（Ｓｈｉｅｌｄ ｃｏｖｅｒ）等の補助機構を用いることにより、ディスプレイ装置の製品単価を上昇させた。   However, more EMI noise is generated in a cable connector coupled to a connector formed in a cable connected to an external device such as a personal computer. However, in the conventional display device, EMI noise is reduced. Further, by using an auxiliary mechanism such as a gasket or a shield cover, the unit price of the display device is increased.

これにより、ＥＭＩノイズを減少させることができるだけでなく、ディスプレイ装置の製品単価を削減することができる方案が望まれている。   Accordingly, there is a demand for a method that not only can reduce EMI noise but also can reduce the unit price of the display device.

ＫＲ２００５−００３６２６７ＡKR2005-0036267A ＫＲ２００６−００２２１７４ＡKR2006-0022174A ＫＲ２００５−００５０８３６ＡKR2005-0050836A ＵＳ２００５−０１１０４０７Ａ１US2005-0110407A1

そこで、本発明は、上記問題に鑑みてなされたものであり、本発明の目的とするところは、接地領域を拡張することによりＥＭＩノイズを減少させることができるだけでなく、ディスプレイ装置の製品単価を削減することができるディスプレイ装置及びその電磁波の低減方法を提供することにある。   Accordingly, the present invention has been made in view of the above problems, and an object of the present invention is not only to reduce EMI noise by expanding the grounding region, but also to reduce the product unit price of the display device. It is an object of the present invention to provide a display device that can be reduced and a method for reducing electromagnetic waves.

前記目的を達成するための本発明の一実施形態に係るディスプレイ装置は、回路基板と、前記回路基板の終端部に設けられ、導電層で構成された面接地部と、を含む。   In order to achieve the above object, a display device according to an embodiment of the present invention includes a circuit board and a surface grounding part provided at a terminal part of the circuit board and configured by a conductive layer.

そして、前記回路基板上に配置され、信号を受信する信号受信部を更に含み、前記信号受信部は、前記信号受信部が前記回路基板と接触する領域に配置された面接地領域を含み、前記面接地領域は導電体からなることができる。   The signal receiving unit further includes a signal receiving unit that is disposed on the circuit board and receives a signal, and the signal receiving unit includes a surface ground region that is disposed in a region where the signal receiving unit is in contact with the circuit board, The surface ground region can be made of a conductor.

また、前記面接地部は、前記面接地部と前記面接地領域とが互いに接触されるようにするため、前記回路基板の終端部に設けられることができる。   The surface grounding portion may be provided at a terminal portion of the circuit board so that the surface grounding portion and the surface grounding region are in contact with each other.

そして、前記回路基板上に設けられ、前記回路基板上に前記信号受信部を固定するためのホールを備えるホール接地領域を更に含むことができる。   In addition, it may further include a hole grounding area provided on the circuit board and provided with a hole for fixing the signal receiving unit on the circuit board.

また、前記面接地部は、前記回路基板で前記ホール接地領域が位置した領域を除いた領域の終端部に配置されることもできる。   The surface grounding portion may be disposed at a terminal portion of a region excluding a region where the hole grounding region is located on the circuit board.

そして、前記面接地部は、前記回路基板上に複数個が形成されることもできる。   A plurality of the ground contact portions may be formed on the circuit board.

また、前記信号受信部は、外部から伝送される信号を受信するためのケーブルコネクタであることもできる。   The signal receiving unit may be a cable connector for receiving a signal transmitted from the outside.

そして、前記ケーブルコネクタは、ＤＶＩ（Ｄｉｇｉｔａｌ Ｖｉｄｅｏ Ｉｎｔｅｒａｃｔｉｖｅ）、ＨＤＭＩ（Ｈｉｇｈ−Ｄｅｆｉｎｉｔｉｏｎ Ｍｕｌｔｉｍｅｄｉａ Ｉｎｔｅｒｆａｃｅ）、及びＤｉｓｐｌａｙ Ｐｏｒｔのうち少なくとも一つであることができる。   The cable connector may be at least one of DVI (Digital Video Interactive), HDMI (High-Definition Multimedia Interface), and Display Port.

一方、本発明の一実施形態に係る回路基板は、回路基板上に形成されたホールを介して前記回路基板にネジで結合される信号受信部と、前記回路基板の前記ホールの周辺に配置されたホール接地部と、前記ホール接地部を除いた前記回路基板の終端部に配置された面接地部と、を含む。   Meanwhile, a circuit board according to an embodiment of the present invention is disposed around the hole of the circuit board and a signal receiving unit coupled to the circuit board with a screw through a hole formed on the circuit board. And a surface ground portion disposed at a terminal portion of the circuit board excluding the hole ground portion.

そして、前記面接地部は、前記回路基板上に複数個が形成されることもできる。   A plurality of the ground contact portions may be formed on the circuit board.

また、前記映像受信部は、外部から伝送されるビデオ信号を受信するためのビデオケーブルコネクタであることもできる。   The video receiver may be a video cable connector for receiving a video signal transmitted from the outside.

そして、前記ビデオケーブルコネクタは、ＤＶＩ（Ｄｉｇｉｔａｌ Ｖｉｄｅｏ Ｉｎｔｅｒａｃｔｉｖｅ）であることもできる。   The video cable connector may be a DVI (Digital Video Interactive).

一方、本発明の一実施形態に係るディスプレイ装置は、外部ソースからデータを送受信するコネクタと、前記受信されたデータを処理する処理部と、前記処理された前記データを出力するディスプレイ部と、回路基板と、を含み、前記回路基板は、前記コネクタに接触された複数個の接触部分を含む第１領域と、前記回路基板上の一終端部に配置され、前記終端部に沿って長軸方向に形成され、前記複数個の接触部分に対して平行に配置された少なくとも一つの接地部を含む第２領域と、を含むことができる。   Meanwhile, a display device according to an embodiment of the present invention includes a connector that transmits and receives data from an external source, a processing unit that processes the received data, a display unit that outputs the processed data, and a circuit. A circuit board, wherein the circuit board is arranged at a first end portion on the circuit board, the first region including a plurality of contact portions that are in contact with the connector, and a long axis direction along the end portion And a second region including at least one grounding portion disposed in parallel to the plurality of contact portions.

そして、前記コネクタは、前記回路基板の少なくとも一つの接地部と連結される前記少なくとも一つの接地された領域を含むこともできる。   The connector may include the at least one grounded region connected to at least one ground part of the circuit board.

また、前記少なくとも一つの接地部は、円形であり、前記コネクタの少なくとも一つの位置レバーを固定するための少なくとも一つの固定ホールの周囲に配置されることもできる。   The at least one grounding portion may be circular and may be disposed around at least one fixing hole for fixing at least one position lever of the connector.

そして、前記コネクタは、ＤＶＩ（Ｄｉｇｉｔａｌ Ｖｉｄｅｏ Ｉｎｔｅｒａｃｔｉｖｅ）、ＨＤＭＩ（Ｈｉｇｈ−Ｄｅｆｉｎｉｔｉｏｎ Ｍｕｌｔｉｍｅｄｉａ Ｉｎｔｅｒｆａｃｅ）、及びディスプレイポート（ｄｉｓｐｌａｙ Ｐｏｒｔ）のうち少なくとも一つであることもできる。   The connector may be at least one of DVI (Digital Video Interactive), HDMI (High-Definition Multimedia Interface), and a display port (display port).

一方、本発明の一実施形態に係るイメージ形成装置に配置された回路基板は、外部機器にデータを送受信するコネクタの位置レバーを固定するための固定ホールを含む第１領域と、前記回路基板の一終端部に沿って長軸方向に形成され、複数個の接触部分に対して平行に配置された少なくとも一つの接地部を含む第２領域と、を含み、前記少なくとも一つの接地部は導電体で形成される。   Meanwhile, a circuit board disposed in an image forming apparatus according to an embodiment of the present invention includes a first region including a fixing hole for fixing a position lever of a connector that transmits and receives data to an external device, and the circuit board. A second region including at least one grounding portion formed in a longitudinal direction along one terminal portion and disposed in parallel to the plurality of contact portions, wherein the at least one grounding portion is a conductor. Formed with.

また、前記少なくとも一つの接地部は、前記コネクタの少なくとも一つの接地された領域に対応されて連結されたこともできる。   The at least one grounding unit may be connected to correspond to at least one grounded region of the connector.

以上説明したように本発明によれば、回路基板に設けられたコネクタの接続部分に接地領域を拡張することにより、補助機構を用いることなく回路基板で発生する電磁波を減少させることができる。   As described above, according to the present invention, it is possible to reduce electromagnetic waves generated on the circuit board without using an auxiliary mechanism by extending the grounding region to the connection portion of the connector provided on the circuit board.

本発明の一実施形態にかかるディスプレイ装置の構成を示すブロック図である。It is a block diagram which shows the structure of the display apparatus concerning one Embodiment of this invention. 本発明に係る回路基板上に映像受信部が接触される連結部３０の一例を示す図である。It is a figure which shows an example of the connection part 30 with which a video receiver is contacted on the circuit board which concerns on this invention. 本発明に係る回路基板上に映像受信部が接触される連結部３０の別の一例を示す図である。It is a figure which shows another example of the connection part 30 with which a video receiver is contacted on the circuit board which concerns on this invention. 本発明に係るコネクタの一例を示す図である。It is a figure which shows an example of the connector which concerns on this invention. 本発明に係るコネクタの別の一例を示す図である。It is a figure which shows another example of the connector which concerns on this invention.

以下に添付図面を参照しながら、本発明の好適な実施の形態について詳細に説明する。但し、本発明を説明するにあって、関連する公知機能若しくは構成に対する具体的な説明が本発明の要旨を不明にすると判断される場合、それに対する詳細な説明は縮約または省略する。   Exemplary embodiments of the present invention will be described below in detail with reference to the accompanying drawings. However, in the description of the present invention, if it is determined that a specific description of a related known function or configuration makes the gist of the present invention unclear, detailed description thereof will be reduced or omitted.

図１は、本発明の一実施形態に係るディスプレイ装置の構成を示すブロック図である。本実施形態において、外部から映像信号を受信する点及び受信された映像信号の信号処理は説明の便宜のために説明することにする。従って、本実施形態の映像受信部１０及び映像処理部５０は本発明の信号受信部及び信号処理部に対応される。   FIG. 1 is a block diagram showing a configuration of a display device according to an embodiment of the present invention. In this embodiment, the point of receiving a video signal from the outside and the signal processing of the received video signal will be described for convenience of description. Therefore, the video receiving unit 10 and the video processing unit 50 of the present embodiment correspond to the signal receiving unit and the signal processing unit of the present invention.

図１を参照すると、本発明のディスプレイ装置は、ディスプレイ部１３０、回路基板１１０、回路基板１１０に設けられた映像受信部１０及び映像処理部５０を含む。   Referring to FIG. 1, the display apparatus of the present invention includes a display unit 130, a circuit board 110, a video receiving unit 10 and a video processing unit 50 provided on the circuit board 110.

回路基板１１０は、ディスプレイ装置１００の内部に備えられたもので、回路基板１１０は、回路基板１１０の上に設けられた各構成要素を支持するだけでなく、各構成要素間の映像信号、及び制御信号を相互伝送する通路が形成される。ここで、回路基板１１０の一例としては、印刷回路基板（Ｐｒｉｎｔｅｄ Ｃｉｒｃｕｉｔ Ｂｏａｒｄ：ＰＣＢ）が挙げられる。   The circuit board 110 is provided inside the display device 100. The circuit board 110 not only supports each component provided on the circuit board 110, but also a video signal between the components, and A path for mutually transmitting control signals is formed. Here, an example of the circuit board 110 is a printed circuit board (PCB).

映像受信部１０は回路基板１１０に接触され、外部から受信される信号を回路基板１１０に形成されたパターンを介して映像処理部５０に伝送する。ここで、映像受信部１０の一例としてはディスプレイ装置１００と外部機器（図示せず）とを接続するコネクタが挙げられる。このとき、コネクタの一例としては、デジタル信号を送受信するＤＶＩ（Ｄｉｇｉｔａｌ Ｖｉｄｅｏ Ｉｎｔｅｒｆａｃｅ）、Ｄｉｇｉｔａｌ Ｐｏｒｔ等のデジタルコネクタが挙げられるが、必ずしもこれに限定されるのではなく、コネクタはアナログ信号を送受信するＤ−ＳＵＢなどのアナログコネクタ、若しくは映像と音声を同時に受信するＨＤＭＩ（Ｈｉｇｈ−Ｄｅｆｉｎｉｔｉｏｎ Ｍｕｌｔｉｍｅｄｉａ Ｉｎｔｅｒｆａｃｅ）であってもよい。   The video receiving unit 10 is in contact with the circuit board 110 and transmits a signal received from the outside to the video processing unit 50 through a pattern formed on the circuit board 110. Here, an example of the video receiving unit 10 is a connector that connects the display device 100 and an external device (not shown). At this time, examples of the connector include digital connectors such as DVI (Digital Video Interface) and Digital Port that transmit and receive digital signals, but the connector is not necessarily limited to this, and the connector is D that transmits and receives analog signals. -It may be an analog connector such as SUB, or HDMI (High-Definition Multimedia Interface) that receives video and audio simultaneously.

映像処理部５０は、映像受信部１０から入力された映像信号をスケーリングし、スケーリングされた映像信号をディスプレイ部１３０に出力する。   The video processing unit 50 scales the video signal input from the video receiving unit 10 and outputs the scaled video signal to the display unit 130.

図２は、本発明に係る回路基板上に映像受信部が接触される連結部３０の一例を示す図である。ここで、図２は回路基板の一部で、回路基板上の連結部に該当する部分を示す図である。   FIG. 2 is a diagram illustrating an example of the connecting unit 30 in which the video receiving unit is brought into contact with the circuit board according to the present invention. Here, FIG. 2 is a diagram showing a part corresponding to the connecting portion on the circuit board, which is a part of the circuit board.

図２を参照すると、本発明の連結部３０は、回路基板１１０上に設けられ映像受信部１０が回路基板１１０上に接触されるようにし、コネクタホルダー３１、第１接地部３３、及び第２接地部３５を含む。   Referring to FIG. 2, the connecting unit 30 of the present invention is provided on the circuit board 110 so that the image receiving unit 10 is brought into contact with the circuit board 110, the connector holder 31, the first grounding unit 33, and the second. A grounding unit 35 is included.

コネクタホルダー３１は、複数個のホルダーから構成されており、映像受信部１０（以下では「コネクタ」と称する）に設けられた複数個のコネクタホルダーピン１１に対応されるように回路基板に形成される。コネクタホルダー３１に、コネクタ１０に設けられたコネクタホルダーピン１１が接触されることにより、コネクタ１０は回路基板１１０に接触され外部から受信された映像信号を回路基板１１０に出力する。すなわち、コネクタホルダー３１とコネクタホルダーピン１１とが接触されることにより、外部から受信された映像信号は回路基板１１０に形成されたパターンを介して回路基板１１０上に設けられた各構成要素に伝送される。   The connector holder 31 includes a plurality of holders, and is formed on the circuit board so as to correspond to the plurality of connector holder pins 11 provided in the video receiver 10 (hereinafter referred to as “connector”). The When the connector holder pin 11 provided on the connector 10 is brought into contact with the connector holder 31, the connector 10 comes into contact with the circuit board 110 and outputs a video signal received from the outside to the circuit board 110. That is, when the connector holder 31 and the connector holder pin 11 are brought into contact with each other, the video signal received from the outside is transmitted to each component provided on the circuit board 110 via the pattern formed on the circuit board 110. Is done.

第１接地部３３は、ＥＭＩ（Ｅｌｅｃｔｒｏｍａｇｎｅｔｉｃ Ｉｎｔｅｒｆｅｒｅｎｃｅ）の規格に従って連結部３０に設けられ、回路基板１１０上にコネクタ１０が接触されたりコネクタ１０にケーブル（図示せず）または外部機器（図示せず）が接続される場合に発生する電磁波を減少させる。このとき、第１接地部３３はコネクタ１０を回路基板１１０に固定するためにＥＭＩの規格に従って第１接地部の真中に固定ネジホールを備える。   The first grounding portion 33 is provided in the connecting portion 30 in accordance with the EMI (Electromagnetic Interference) standard, and the connector 10 is brought into contact with the circuit board 110 or a cable (not shown) or an external device (not shown) is connected to the connector 10. Reduces electromagnetic waves generated when is connected. At this time, the first ground portion 33 includes a fixing screw hole in the middle of the first ground portion in accordance with the EMI standard in order to fix the connector 10 to the circuit board 110.

第２接地部３５は導電性物質で構成され、第１接地部３３で減少された電磁波をもう一度減少させる。このとき、第２接地部３５は連結部３０上の第１接地部３３が設けられた領域の下に配置されるように形成され、第２接地部３５は第１接地部３３の面積より大きく予め設定された基準面積より小さく形成される。第２接地部３５は長軸方向に形成されており、コネクタホルダー３１と平行に配置されている。   The second ground part 35 is made of a conductive material, and reduces the electromagnetic wave reduced by the first ground part 33 once more. At this time, the second grounding portion 35 is formed to be disposed below the region where the first grounding portion 33 is provided on the connecting portion 30, and the second grounding portion 35 is larger than the area of the first grounding portion 33. It is formed smaller than a preset reference area. The second grounding portion 35 is formed in the long axis direction and is disposed in parallel with the connector holder 31.

具体的に、第２接地部３５は、回路基板１１０上の領域の終端部（Ａ）に設けられ、映像受信部１０で回路基板１１０との面接触を通じて発生された電磁波を接地させることにより、電磁波をＥＭＩ（Ｅｌｅｃｔｒｏｍａｇｎｅｔｉｃ Ｉｎｔｅｒｆａｃｅ）の規格の以下に減少させる。ここで、回路基板１１０上の領域の終端部（Ａ）は、図２に示すように、回路基板１１０の端を示す。   Specifically, the second grounding unit 35 is provided at the terminal end (A) of the region on the circuit board 110 and grounds the electromagnetic wave generated through the surface contact with the circuit board 110 by the video receiving unit 10. Electromagnetic waves are reduced below the standard of EMI (Electromagnetic Interface). Here, the terminal portion (A) of the region on the circuit board 110 indicates the end of the circuit board 110 as shown in FIG.

このとき、第２接地部３５形成の一例としては、回路基板１１０上に非導電性物質から構成された連結部３０を被せて、連結部３０にパターンを形成した後、非導電性物質の連結部３０から第２接地部３５の領域を除去することにより導電層の第２接地部３５を形成することができる。   At this time, as an example of the formation of the second grounding part 35, the connection part 30 made of a nonconductive material is placed on the circuit board 110, a pattern is formed on the connection part 30, and then the connection of the nonconductive substance is made. By removing the region of the second ground portion 35 from the portion 30, the second ground portion 35 of the conductive layer can be formed.

また、第２接地部３５形成の別の実施例として、回路基板１１０上に非導電性物質から構成された連結部３０を被せるとき、第２接地部３５に該当する領域を除いた領域に非導電性物質を被せて、その上にパターンを形成することにより第２接地部３５を形成することができる。このとき、回路基板１１０上の連結部３０において第２接地部３５に該当する領域を導電性物質で被せることにより導電層の第２接地部３５を形成することができる。   Further, as another example of forming the second grounding portion 35, when the connection portion 30 made of a non-conductive material is put on the circuit board 110, the second grounding portion 35 is not covered in a region other than the region corresponding to the second grounding portion 35. The second ground portion 35 can be formed by covering the conductive material and forming a pattern thereon. At this time, the second grounding portion 35 of the conductive layer can be formed by covering a region corresponding to the second grounding portion 35 in the connecting portion 30 on the circuit board 110 with a conductive material.

また、第２接地部３５は、図３に示されているように回路基板１１０の領域の終端部（Ａ’）に設けられ、回路基板１１０上に複数個が形成されてもよい。このとき、複数個の第２接地部３５のそれぞれの面積は互いに異なってもよく、全て同じであってもよい。第２接地部３５が複数個形成される場合には、複数個の第２接地部３５の間に回路基板１１０上にコネクタ１０を固定する固定ホール３７を位置させることができる。ここで、図３は回路基板の一部で、回路基板上の連結部に該当する部分を示す図である。   Further, the second grounding part 35 may be provided at the terminal end (A ′) of the area of the circuit board 110 as shown in FIG. 3, and a plurality of the second grounding parts 35 may be formed on the circuit board 110. At this time, the areas of the plurality of second grounding portions 35 may be different from each other, or may all be the same. When a plurality of second grounding portions 35 are formed, a fixing hole 37 for fixing the connector 10 on the circuit board 110 can be positioned between the plurality of second grounding portions 35. Here, FIG. 3 is a diagram showing a part corresponding to the connecting portion on the circuit board, which is a part of the circuit board.

図４は、本発明に係るコネクタの一例を示す図である。図４を参照すると、本発明のコネクタ１０は、コネクタホルダーピン１１、固定ネジ１３、及び接地部１５を含む。   FIG. 4 is a view showing an example of a connector according to the present invention. Referring to FIG. 4, the connector 10 of the present invention includes a connector holder pin 11, a fixing screw 13, and a grounding part 15.

コネクタホルダーピン１１はコネクタに設けられ、コネクタ１０が回路基板１１０に接触されるとき、回路基板１１０に設けられたコネクタホルダー３１に接触される。このとき、コネクタホルダーピン１１は回路基板１１０にコネクタ１０が接触されるようにコネクタホルダー３１に対応されるように形成される。   The connector holder pin 11 is provided on the connector. When the connector 10 is brought into contact with the circuit board 110, the connector holder pin 11 is brought into contact with the connector holder 31 provided on the circuit board 110. At this time, the connector holder pin 11 is formed to correspond to the connector holder 31 so that the connector 10 contacts the circuit board 110.

固定ネジ１３は、ＥＭＩ（Ｅｌｅｃｔｒｏｍａｇｎｅｔｉｃ Ｉｎｔｅｒｆｅｒｅｎｃｅ）の規格に従ってコネクタ１０に設けられ、回路基板１１０上にコネクタ１０を接触する場合に回路基板１１０上にコネクタ１０を固定させる。このとき、固定ネジ１３は回路基板１１０上に設けられた第１接地部３３の固定ネジホールを通じてコネクタ１０を回路基板１１０に固定させる。   The fixing screw 13 is provided in the connector 10 in accordance with the EMI (Electromagnetic Interference) standard, and fixes the connector 10 on the circuit board 110 when contacting the connector 10 on the circuit board 110. At this time, the fixing screw 13 fixes the connector 10 to the circuit board 110 through the fixing screw hole of the first ground portion 33 provided on the circuit board 110.

接地部１５は導電層で形成され、回路基板１１０に設けられた第２接地部３５に対応されるようにコネクタ１０に形成される。すなわち、接地部１５は回路基板１１０上にコネクタ１０が接触される場合に、回路基板１１０に設けられた第２接地部３５に対応する位置に該当するコネクタ１０の領域に形成される。接地部１５は長軸方向に形成されており、コネクタホルダーピン１１と平行に配置されている。   The ground portion 15 is formed of a conductive layer, and is formed on the connector 10 so as to correspond to the second ground portion 35 provided on the circuit board 110. That is, when the connector 10 is brought into contact with the circuit board 110, the grounding part 15 is formed in the region of the connector 10 corresponding to the position corresponding to the second grounding part 35 provided on the circuit board 110. The grounding portion 15 is formed in the major axis direction and is disposed in parallel with the connector holder pin 11.

このとき、接地部１５は、コネクタ１０において第２接地部３５に対応する位置に該当する領域に導電性物質を被せることで形成され、第２接地部３５と同様に回路基板１１０及びコネクタ１０で発生する電磁波を接地させて減少させる。   At this time, the grounding portion 15 is formed by covering the region corresponding to the position corresponding to the second grounding portion 35 in the connector 10 with a conductive material, and like the second grounding portion 35, the circuit board 110 and the connector 10. Reduce the generated electromagnetic wave by grounding.

また、接地部１５は、図５に示すように、コネクタ１０上に複数個を形成することができる。このとき、複数個の接地部１５のそれぞれの面積は互いに異なってもよく、全て同じであってもよい。このとき、コネクタ１０に形成される複数個の接地部１５は回路基板１１０上に設けられた複数の第２接地部３５に対応されるように形成される。   Further, a plurality of grounding portions 15 can be formed on the connector 10 as shown in FIG. At this time, the areas of the plurality of grounding portions 15 may be different from each other, or may all be the same. At this time, the plurality of ground portions 15 formed on the connector 10 are formed so as to correspond to the plurality of second ground portions 35 provided on the circuit board 110.

そして、接地部１５が複数個で形成される場合、複数個の接地部１５の間に固定突起１７が位置し、回路基板１１０上にコネクタ１０を固定することができる。このとき、コネクタの固定突起１７は回路基板１１０の固定ホール３７に対応されるようにコネクタ１０に形成される。ここで、固定突起１７はネジと類似した形態でコネクタ１０に固定されて付着される。   When a plurality of grounding portions 15 are formed, the fixing protrusion 17 is positioned between the plurality of grounding portions 15, and the connector 10 can be fixed on the circuit board 110. At this time, the fixing protrusion 17 of the connector is formed on the connector 10 so as to correspond to the fixing hole 37 of the circuit board 110. Here, the fixing protrusion 17 is fixed and attached to the connector 10 in a form similar to a screw.

一方、第２接地部３５の面積が広ければ広いほど回路基板１１０に映像受信部１０が面接触を通じて発生される電磁波を減少させる量を増加させることができるので、第２接地部３５は必ず基準面積の以下に形成されるのではなく、第２接地部３５は連結部３０の長軸長さを超えるように形成されてもよい。   On the other hand, the larger the area of the second ground part 35 is, the larger the amount of the electromagnetic wave generated by the image receiving part 10 through surface contact on the circuit board 110 can be increased. Instead of being formed below the area, the second grounding portion 35 may be formed so as to exceed the major axis length of the connecting portion 30.

一方、本発明に係るディスプレイ装置において、回路基板１１０及びコネクタ１０にそれぞれ設けられる第２接地部３５及び接地部１５は、相互対応するように形成される。すなわち、回路基板１１０にコネクタ１０を接触する際に、回路基板上に設けられた第２接地部３５とコネクタ１０に設けられた接地部１５とが相接するように第２接地部３５及び接地部１５がそれぞれ回路基板１１０及びコネクタ１０に形成される。   On the other hand, in the display device according to the present invention, the second ground part 35 and the ground part 15 provided on the circuit board 110 and the connector 10 are formed to correspond to each other. That is, when the connector 10 is brought into contact with the circuit board 110, the second grounding part 35 and the grounding are arranged so that the second grounding part 35 provided on the circuit board and the grounding part 15 provided on the connector 10 are in contact with each other. Portions 15 are formed on the circuit board 110 and the connector 10, respectively.

一方、本発明の一実施形態に係るコネクタにおいて、固定ネジはコネクタ上のモールディング部を介して回路基板に接触され、コネクタ上のモールディング部内に回路基板のホール接地領域に対応される接地領域が設けられ、回路基板で発生する電磁波を減少させることができる。すなわち、コネクタ上の固定ネジの周辺に接地領域が存在し、固定ネジの周辺の接地領域の上にモールディングがなされ、固定ネジの周辺の接地領域は回路基板のホール接地領域と直接的に相接はしない。   On the other hand, in the connector according to one embodiment of the present invention, the fixing screw is brought into contact with the circuit board via the molding part on the connector, and a grounding area corresponding to the hole grounding area of the circuit board is provided in the molding part on the connector. Therefore, electromagnetic waves generated on the circuit board can be reduced. That is, there is a grounding area around the fixing screw on the connector, molding is performed on the grounding area around the fixing screw, and the grounding area around the fixing screw is in direct contact with the hole grounding area on the circuit board. I do not.

一方、本発明に係るディスプレイ装置及び電磁波の低減方法において、第１接地部の一例としては接地領域内にホールの備えられたホール接地領域、第２接地部の一例としてはホールの備えられていない接地領域のみに構成された面接地領域が挙げられるが、必ずこれに限定されるのではなく、第２接地部は、円形、三角形、四角形、および多角形の形を有する接地領域、または点、線などの形を有する接地領域に形成されてもよい。   On the other hand, in the display device and the electromagnetic wave reduction method according to the present invention, as an example of the first grounding part, a hole grounding area in which a hole is provided in the grounding area, and as an example of the second grounding part, no hole is provided. Although the surface ground area | region comprised only in the ground area | region is mentioned, it is not necessarily limited to this, A 2nd ground part is a ground area | region or a point which has the shape of a circle, a triangle, a rectangle, and a polygon, It may be formed in a ground region having a shape such as a line.

一方、本発明に係るＥＭＩノイズの減少をディスプレイ装置に限定して説明したが、必ずこれに限定されるのではなく、デジタルコネクタを備える映像機器においてもＥＭＩノイズを減少させることができる。すなわち、映像機器としては、ＤＶＤ（Ｄｉｇｉｔａｌ Ｖｉｄｅｏ Ｄｉｓｋ）プレーヤ、パーソナルコンピュータ（ＰＣ）、ＬＣＤ（ｌｉｑｕｉｄ ｃｒｙｓｔａｌ ｄｉｓｐｌａｙ）モニター、プロジェクタ、デジタルカメラ、デジタルビデオカメラ、セットップボックス（ＳＴＢ）、デジタルテレビ及びＨＤＭＩコネクタを用いる電子装置が挙げられる。   On the other hand, the reduction of the EMI noise according to the present invention has been described by limiting it to the display device. However, the present invention is not necessarily limited to this, and the EMI noise can also be reduced in video equipment including a digital connector. That is, as a video device, a DVD (Digital Video Disk) player, a personal computer (PC), an LCD (liquid crystal display) monitor, a projector, a digital camera, a digital video camera, a set-up box (STB), a digital television, and an HDMI connector And an electronic device using

以上、添付図面を参照しながら本発明の好適な実施形態について詳細に説明したが、本発明はかかる例に限定されない。本発明の属する技術の分野における通常の知識を有する者であれば、特許請求の範囲に記載された技術的思想の範疇内において、各種の変更例または修正例に想到し得ることは明らかであり、これらについても、当然に本発明の技術的範囲に属するものと了解される。   The preferred embodiments of the present invention have been described in detail above with reference to the accompanying drawings, but the present invention is not limited to such examples. It is obvious that a person having ordinary knowledge in the technical field to which the present invention pertains can come up with various changes or modifications within the scope of the technical idea described in the claims. Of course, it is understood that these also belong to the technical scope of the present invention.

Claims (18)

回路基板と、
前記回路基板の終端部に設けられ、導電層で構成された面接地部と、
を含むことを特徴とするディスプレイ装置。 A circuit board;
A surface grounding portion provided at a terminal portion of the circuit board and formed of a conductive layer;
A display device comprising: 前記回路基板上に配置され、信号を受信する信号受信部を更に含み、
前記信号受信部は、前記信号受信部が前記回路基板と接触する領域に配置された面接地領域を含み、前記面接地領域は導電体からなることを特徴とする請求項１に記載のディスプレイ装置。 A signal receiving unit disposed on the circuit board for receiving signals;
The display device according to claim 1, wherein the signal receiving unit includes a surface grounding region disposed in a region where the signal receiving unit is in contact with the circuit board, and the surface grounding region is made of a conductor. . 前記面接地部は、
前記面接地部と前記面接地領域とが互いに接触されるようにするため、前記回路基板の終端部に設けられることを特徴とする請求項２に記載のディスプレイ装置。 The surface contact portion is
The display device according to claim 2, wherein the display device is provided at a terminal portion of the circuit board so that the surface contact portion and the surface contact region are in contact with each other. 前記回路基板上に設けられ、前記回路基板上に前記信号受信部を固定するためのホールを備えるホール接地領域を更に含むことを特徴とする請求項２に記載のディスプレイ装置。   The display apparatus according to claim 2, further comprising a hole grounding area provided on the circuit board and provided with a hole for fixing the signal receiving unit on the circuit board. 前記面接地部は、
前記回路基板で前記ホール接地領域が位置した領域を除いた領域の終端部に配置されることを特徴とする請求項４に記載のディスプレイ装置。 The surface contact portion is
The display device according to claim 4, wherein the display device is disposed at a terminal portion of a region excluding a region where the hole grounding region is located on the circuit board. 前記面接地部は、
前記回路基板上に複数個が形成されることを特徴とする請求項１に記載のディスプレイ装置。 The surface contact portion is
The display apparatus according to claim 1, wherein a plurality of the circuit boards are formed on the circuit board. 前記信号受信部は、
外部から伝送される信号を受信するためのケーブルコネクタであることを特徴とする請求項２に記載のディスプレイ装置。 The signal receiver is
The display device according to claim 2, wherein the display device is a cable connector for receiving a signal transmitted from the outside. 前記ケーブルコネクタは、ＤＶＩ（Ｄｉｇｉｔａｌ Ｖｉｄｅｏ Ｉｎｔｅｒａｃｔｉｖｅ）、ＨＤＭＩ（Ｈｉｇｈ−Ｄｅｆｉｎｉｔｉｏｎ Ｍｕｌｔｉｍｅｄｉａ Ｉｎｔｅｒｆａｃｅ）、及びＤｉｓｐｌａｙ Ｐｏｒｔのうち少なくとも一つであることを特徴とする請求項７に記載のディスプレイ装置。   8. The display device according to claim 7, wherein the cable connector is at least one of DVI (Digital Video Interactive), HDMI (High-Definition Multimedia Interface), and Display Port. 回路基板上に形成されたホールを介して前記回路基板にネジで結合される信号受信部と、
前記回路基板の前記ホールの周辺に配置されたホール接地部と、
前記ホール接地部を除いた前記回路基板の終端部に配置された面接地部と、
を含むことを特徴とする回路基板。 A signal receiving unit coupled to the circuit board with a screw through a hole formed on the circuit board;
A hole grounding portion disposed around the hole of the circuit board;
A surface ground portion disposed at a terminal portion of the circuit board excluding the hole ground portion;
A circuit board comprising: 前記面接地部は、
前記回路基板上に複数個が形成されることを特徴とする請求項９に記載の回路基板。 The surface contact portion is
The circuit board according to claim 9, wherein a plurality of the circuit boards are formed on the circuit board. 前記映像受信部は、
外部から伝送されるビデオ信号を受信するためのビデオケーブルコネクタであることを特徴とする請求項９に記載の回路基板。 The video receiver is
The circuit board according to claim 9, wherein the circuit board is a video cable connector for receiving a video signal transmitted from the outside. 前記ビデオケーブルコネクタは、ＤＶＩ（Ｄｉｇｉｔａｌ Ｖｉｄｅｏ Ｉｎｔｅｒａｃｔｉｖｅ）であることを特徴とする請求項１１に記載の回路基板。   The circuit board according to claim 11, wherein the video cable connector is DVI (Digital Video Interactive). 外部ソースからデータを送受信するコネクタと、
前記受信されたデータを処理する処理部と、
前記処理された前記データを出力するディスプレイ部と、
回路基板と、を含み、
前記回路基板は、
前記コネクタに接触された複数個の接触部分を含む第１領域と、
前記回路基板上の一終端部に配置され、前記終端部に沿って長軸方向に形成され、前記複数個の接触部分に対して平行に配置された少なくとも一つの接地部を含む第２領域と、
を含むことを特徴とするディスプレイ装置。 A connector to send and receive data from an external source;
A processing unit for processing the received data;
A display unit for outputting the processed data;
A circuit board, and
The circuit board is
A first region including a plurality of contact portions in contact with the connector;
A second region including at least one grounding portion disposed at one end portion on the circuit board, formed in a major axis direction along the end portion, and disposed in parallel to the plurality of contact portions; ,
A display device comprising: 前記コネクタは、
前記回路基板の少なくとも一つの接地部と連結される前記少なくとも一つの接地された領域を含むことを特徴とする請求項１３に記載のディスプレイ装置。 The connector is
The display apparatus of claim 13, further comprising the at least one grounded region connected to at least one grounding part of the circuit board. 前記少なくとも一つの接地部は、
円形であり、前記コネクタの少なくとも一つの位置レバーを固定するための少なくとも一つの固定ホールの周囲に配置されたことを特徴とする請求項１３に記載のディスプレイ装置。 The at least one grounding part is
The display device of claim 13, wherein the display device is circular and is disposed around at least one fixing hole for fixing at least one position lever of the connector. 前記コネクタは、ＤＶＩ（Ｄｉｇｉｔａｌ Ｖｉｄｅｏ Ｉｎｔｅｒａｃｔｉｖｅ）、ＨＤＭＩ（Ｈｉｇｈ−Ｄｅｆｉｎｉｔｉｏｎ Ｍｕｌｔｉｍｅｄｉａ Ｉｎｔｅｒｆａｃｅ）、及びディスプレイポート（ｄｉｓｐｌａｙ Ｐｏｒｔ）のうち少なくとも一つであることを特徴とする請求項１５に記載のディスプレイ装置。   16. The display device according to claim 15, wherein the connector is at least one of DVI (Digital Video Interactive), HDMI (High-Definition Multimedia Interface), and a display port. イメージ形成装置に配置された回路基板において、
外部機器にデータを送受信するコネクタの位置レバーを固定するための固定ホールを含む第１領域と、
前記回路基板の一終端部に沿って長軸方向に形成され、複数個の接触部分に対して平行に配置された少なくとも一つの接地部を含む第２領域と、を含み、
前記少なくとも一つの接地部は導電体で形成されたことを特徴とする回路基板。 In the circuit board arranged in the image forming apparatus,
A first region including a fixing hole for fixing a position lever of a connector for transmitting / receiving data to / from an external device;
A second region including at least one grounding portion formed in a major axis direction along one terminal portion of the circuit board and disposed in parallel to a plurality of contact portions;
The circuit board according to claim 1, wherein the at least one ground portion is formed of a conductor. 前記少なくとも一つの接地部は、
前記コネクタの少なくとも一つの接地された領域に対応されて連結されたことを特徴とする請求項１７に記載の回路基板。 The at least one grounding part is
The circuit board according to claim 17, wherein the circuit board is connected corresponding to at least one grounded region of the connector.
JP2010527870A 2007-10-04 2008-04-21 Display device and method for reducing electromagnetic wave thereof Pending JP2011501819A (en)

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