KR20060022174A - Display device - Google Patents

Abstract

Disclosed is a display device that shields noise and EMI through contact between a ground of a driving circuit and a top chassis. The display panel displays an image, the first storage container accommodates the display panel, and the second storage container accommodates the display panel through fastening with the first storage container. The FPCB has a conductive path for transmitting a drive signal and a control signal for displaying an image, and a conductive layer exposed on one surface for ground, and the conductive elastic member is interposed between the second storage container and the FPCB. This makes it possible to easily shield the EMI by grounding the gap between the FPCB of the two-layer structure in which the conductive layer is exposed and the storage container via a gasket.

Ground, gasket, conductive elastic member, EMI

Description

Display {DISPLAY DEVICE}

1 is an exploded perspective view of a liquid crystal display according to an exemplary embodiment of the present invention.

2A and 2B are diagrams for describing the FPCB of FIG. 1.

FIG. 3 is a rear perspective view of a portion of the liquid crystal display shown in FIG. 1.

4 is a cross-sectional view of the liquid crystal display shown in FIG. 1.

<Description of the symbols for the main parts of the drawings>

100: display unit 110: liquid crystal panel

120, 130: Drive PCB 140, 150: TCP

200: backlight assembly 210: lamp

220: lamp reflector 230: diffuser plate

240: low mold frame 250: bottom chassis

260: FPCB 270: Integrated PCB

280: shield case 290: conductive elastic member

300: upper mold frame 605: base film

610, 640: conductive layer 620D: data wiring

620G: Ground wiring 630: Solder resin layer

The present invention relates to a display device, and more particularly, to a display device that shields noise and EMI through contact between a ground of a driving circuit and a top chassis.

In general, TFT-LCD module mounting methods are classified into TAB mounting and COG mounting. These methods are rapidly developing in accordance with the expansion of the use of LCD panels, and in particular, the TAB method is being activated in the COG method according to the trend of reducing the mounting area and lowering the cost.

The TAB mounting method refers to a process of connecting a driving TAB IC to an LCD panel and a process of connecting the TAB IC to a printed circuit board. The former process uses an anisotropic conductive film (ACF) instead of lead according to the specificity of the glass and metal material and the fixation of the pitch. The latter is connected using lead. However, even in the latter case, the use of anisotropic conductive films is expected in accordance with the trend of fine pitch in the future.

On the other hand, the ground terminal and the chassis of the printed circuit board is grounded to each other to prevent the generation of noise and the generation of electromagnetic waves (EMI) by the stability of the circuit formed on the printed circuit board during the LCD operation. Specifically, due to the electrical connection structure between the ground of the driving circuit unit and the chassis of the backlight assembly, the high voltage component generated when driving the lamp of the backlight assembly is coupled to the chassis. Although the ground potential of the chassis is shaken by the coupling, it can be stabilized by electrically connecting the ground of the driving circuit unit.

In addition, by connecting the ground with the drive circuit portion of the notebook computer body through the above structure, there is a significant effect as a countermeasure against noise and EMI. The above effects are achieved by connecting the clips to the left and right sides of the backlight assembly to connect the chassis and screwing the clips to the ground of the driving circuit portion to form electrical contacts. However, there is a problem that the clip or screw is accompanied by a separate assembly process.

As a method for removing the screw, a structure is formed in which a conductive tape is attached to the PCB cover to electrically connect the ground and the chassis of the driving circuit unit. When attaching the PCB cover, a conductive tape such as aluminum tape should be firmly attached to the ground of the driving circuit unit and the chassis, and there is a problem in that structurally unstable contact or falling of the conductive tape may exist.

Accordingly, the technical problem of the present invention is to solve such a conventional problem, and an object of the present invention is to provide a display device for shielding noise and EMI through contact between the ground and the chassis of a driving circuit using a gasket.

According to an aspect of the present invention, there is provided a display device including: a display panel displaying an image; A first storage container accommodating the display panel; A second accommodating container accommodating the display panel through fastening with the first accommodating container; An FPCB having a conductive path transferring a driving signal and a control signal for displaying the image, and a conductive layer exposed on one surface for ground; And a conductive elastic member interposed between the second storage container and the FPCB.

The display device may further include a PCB, one side of which is connected to the FPCB and the other side of which is connected to the display panel, the PCB providing the drive signal and the control signal to the display panel via the FPCB. And a side wall of the first storage container and a side wall of the second storage container. The conductive elastic member is inserted into a gap formed between the side wall of the second container and the conductive layer of the FPCB. Here, the FPCB is a base film; A first conductive layer formed on one surface of the base film; A first conductive path formed in a first region of the other surface of the base film to transmit the driving signal and the control signal; A second conductive path formed in a second region of the other surface of the base film for ground; A solder resin layer covering the base film, the first conductive path and the second conductive path; And a second conductive layer formed on the solder resin layer, the second conductive layer being connected to the first conductive layer via a hole formed in the solder resin layer, a hole formed in a second conductive path, and a hole formed in the base film. .

According to such a display device, EMI can be easily shielded by ground-processing via a gasket in the space | gap between the FPCB of a two-layer structure and the storage container which exposed the conductive layer through a gasket.

Hereinafter, with reference to the accompanying drawings, it will be described in detail the present invention.

1 is an exploded perspective view of a liquid crystal display according to an exemplary embodiment of the present invention.                     

Referring to FIG. 1, a liquid crystal display device displays a display unit 100 for displaying a video signal having an electrical shape by visually adjusting the amount of light transmitted through a liquid crystal, and provides light to the display unit 100. It consists of a backlight assembly 200 for.

The display unit 100 includes a liquid crystal panel 110 for displaying an image using liquid crystal, driving PCBs 120 and 130 for applying a driving signal to the liquid crystal panel 110, and the liquid crystal panel 110. ) And the driving PCBs 120 and 130 are electrically connected to each other, as well as TCP 140 and 150 for reducing the planar area of the liquid crystal display.

Specifically, the driving PCB (120, 130) is composed of a data PCB 120 attached to the data line side of the liquid crystal panel 110, and a gate PCB 130 attached to the gate line side, TCP diagram data Side TCP 140 and gate side TCP 150. The data PCB 120 includes a first PCB 121 and a second PCB 122 extending perpendicularly from the first PCB 121.

The liquid crystal panel 110 implements a screen, and includes a thin film transistor (TFT) substrate 111, a color filter substrate 113 facing the TFT substrate 111, and the TFT substrate ( And liquid crystal (not shown) injected between the color filter substrate 113 and the color filter substrate 113.

Here, the TFT substrate 111 is a transparent glass substrate in which a TFT (not shown), which is a switching element, is formed in a matrix form. Data and gate lines are respectively connected to the source and gate terminals of the TFTs, and a pixel electrode made of indium tin oxide (ITO), which is a transparent conductive material, is formed at the drain terminal. The color filter substrate 113 is a substrate formed by a thin film process by forming a black matrix layer formed between a RGB pixel, which is a color pixel that is expressed in a predetermined color by light passing through, and each pixel of RGB, to increase contrast. . The common electrode made of ITO is coated on the front surface of the color filter substrate 113.

The data line formed on the liquid crystal panel 110 is electrically connected to the data PCB 120 through the data side TCP 140, and the gate line is connected to the gate PCB 130 through the gate side TCP 150. Is electrically connected to the Accordingly, the data and gate PCBs 120 and 130 that receive an electrical signal from the outside transmit a drive signal and a control signal for controlling the driving and driving timing of the display unit 100. The transmission lines 150 are transferred to the gate line and the data line provided in the TFT substrate 111 of the liquid crystal panel 110 through the 150.

Meanwhile, the backlight assembly 200 emits one or more lamps 210 generating first light and second light having a uniform luminance distribution by diffusing the first light disposed on the lamp 210. And a diffuser plate 230 and a lamp reflector 220 disposed under the lamp 210 to reflect the first light to provide the diffuser plate 230.

The lamp 210, the lamp reflector 220, and the diffuser 230 are housed in a storage container to be protected and fixed from an external impact. The storage container includes a low mold frame 240 having insulation and a bottom chassis 250 having conductivity. The low mold frame 240 accommodates the lamps 210 and fixes the lamps 210 at a designated position. The diffusion plate 230 is seated on the stepped portion 241 formed at the top of the low mold frame 240.

The bottom chassis 250 includes a bottom surface 251 and sidewalls 252 and 253 extending from the bottom surface 251 to have an accommodation space 255. The lamp reflector 220 is accommodated in the storage space 255, and the low mold frame 240 is stored thereon.

An integrated PCB 270 connected to the data PCB 120 through the FPCB 260 is disposed on the bottom of the bottom chassis 250, and is coupled to the bottom chassis 250 while covering the integrated PCB 270. Shield case 280 is disposed.

The FPCB 260 has a conductive path transmitting a driving signal and a control signal for displaying the image, and a conductive layer exposed on one surface for ground processing.

Between the conductive top chassis 400 and the FPCB 260, a conductive elastic member 290, such as a gasket having a sponge property coated with a conductive material, is interposed to form a conductive layer and the top chassis 400 of the FPCB 260. Ground process.

Meanwhile, an upper mold frame 300 is provided on the diffusion plate 230. The upper mold frame 400 is in surface contact with the diffusion plate 230 to press and fix the diffusion plate 230 toward the low mold frame 240. In addition, the liquid crystal panel 110 is seated on the upper mold frame 300. In this case, the data PCB 120 connected to the liquid crystal panel 110 may have a first sidewall 252 and a first sidewall 252 of the bottom chassis 250 to prevent an increase in the planar area of the liquid crystal display. It is seated on the back 254 of the bottom chassis 250 adjacent to and respectively.                     

In detail, the data PCB 120 includes a first PCB 121 and a second PCB 122. In this case, the first PCB 121 is disposed on the first sidewall 252 of the bottom chassis 250. The data side TCP 140 attached to the data portion of the liquid crystal panel 110 is bent approximately 90 ° and coupled to the first PCB 121 on the first sidewall 252 of the bottom chassis 250. On the other hand, the second PCB 122 is disposed on the rear surface 254 of the bottom chassis 250.

The gate PCB 130 may be disposed on the second sidewall 253 of the bottom chassis 250 or may be simply mounted on the upper mold frame 300. The second sidewall 253 is a sidewall adjacent to the first sidewall 252.

Subsequently, in order to prevent the display unit 100, which is simply seated on the diffusion plate 230, is separated from the outside, a top chassis 400 having a cramped shape having an upper and a lower surface open on the upper portion of the liquid crystal panel 110. ) Is provided. The top chassis 400 pressurizes a peripheral portion of the liquid crystal panel 110 and is coupled to the bottom chassis 250 to fix the liquid crystal panel 110 to the bottom chassis 250.

2A and 2B are diagrams for describing the FPCB of FIG. 1. In particular, FIG. 2A is a plan view of the FPCB, and FIG. 2B is a cross-sectional view taken along the line II ′ of FIG. 2A.

As shown in FIGS. 2A and 2B, the FPCB 260 for shielding electromagnetic waves includes a base film 605, a first conductive layer 610, a data line 620D that is a conductive path for data signal transmission, and ground. And a ground wiring 620G, a solder resin layer 630, and a second conductive layer 640, which are conductive paths. Although not shown, typically, one side of the FPCB is provided with a PCB coupling unit for coupling with the PCB, and the other side opposite to the one side is provided with a liquid crystal panel coupling unit for coupling with the liquid crystal panel.

The first conductive layer 610 is formed under the base film 605 made of a material such as poly-imide film, and the data line 620D is formed on the base film 605 to transmit a data signal. The ground line 620G is formed on the base film 605 to transmit a signal for ground.

The solder resin layer 630 covers one surface of the data line 620D, the ground line 620G, and the base film 605. The second conductive layer 640 is formed on the solder resin layer 630, and preferably, the solder resin layer 630, the ground wiring 620G, and the base corresponding to a portion of the ground wiring 620G. The hole is formed in the film 605 and is electrically connected to the first conductive layer 610.

Although two conductive layers are formed on the bottom and top of the base film 605 in the drawings, separate conductive layers may be further formed on the leftmost and rightmost portions of the base film 605.

In operation, electromagnetic waves may be induced by signals transmitted through the data line 620D, but the electromagnetic wave flowing out to the upper side by the first conductive layer 610 provided at the lowermost portion is shielded, and is provided at the uppermost portion. The electromagnetic wave flowing out to the lower side by the second conductive layer 640 is shielded.

FIG. 3 is a rear perspective view of a portion of the liquid crystal display shown in FIG. 1, and FIG. 4 is a cross-sectional view of the liquid crystal display shown in FIG. 1.

Referring to FIG. 3, a PCB 120 is provided between a sidewall of a conductive bottom chassis 250 and a sidewall of a conductive top chassis 400 to provide a driving signal and a control signal for displaying an image on a display panel. A FPCB 260 having a conductive layer exposed is interposed between the PCB 120 and the side wall of the top chassis 400. A gasket is inserted between the exposed conductive layer of the FPCB 260 and the side wall of the top chassis 400. The conductive layer of the FPCB 260 is grounded to the side wall of the top chassis 400.

In addition, a conductive PCB cover 280 is disposed on the bottom of the bottom chassis 250 and fastened to a screw 282, wherein an edge of the PCB cover 280 has a predetermined gap with the side wall of the top chassis 400. It is placed with. The PCB cover 280 is connected to the FPCB 260 to cover an integrated PCB that provides the drive signal and the control signal to the FPCB 260. In this case, the gasket is inserted into a predetermined gap between the PCB cover 280 and the top chassis 400 to ground the PCB cover 280 and the top chassis 400.

As shown in FIG. 4, the storage container includes a low mold frame 240 and a bottom chassis 250. In detail, the row mold frame 240 accommodates the lamp 210 and fixes the lamp 210 at a designated position. The diffusion plate 230 is seated on the stepped portion 241 formed at the top of the low mold frame 240.

The bottom chassis 250 includes a bottom surface 251 and sidewalls 252 extending from the bottom surface 251 to have a storage space 255. The lamp reflector 220 is accommodated in the storage space 255, and the low mold frame 240 is stored thereon.

Meanwhile, an upper mold frame 300 is provided on the diffusion plate 230 to press the diffusion plate 230 toward the low mold frame 240. In addition, the liquid crystal panel 110 is seated on the upper mold frame 300. In this case, the data PCB 160 connected to the liquid crystal panel 110 is mounted on the first sidewall 252 of the bottom chassis 250 and the rear surface 254 of the bottom chassis 250 adjacent to the first sidewall 252. do. Specifically, the first PCB 120 is coupled on the first sidewall 252 of the bottom chassis 250 with the data side TCP 140 attached to the data portion of the liquid crystal panel 110. Is placed on.

In addition, the integrated PCB 270 is disposed on the back 254 of the bottom chassis 250. Here, the first PCB 261 and the second PCB 262 are electrically connected by the flexible connection member 263. That is, one end of the flexible connecting member 263 is electrically connected to the first PCB 261 on the first sidewall 252 of the bottom chassis 250, and the other end is formed on the rear surface 254 of the bottom chassis 250. It is electrically connected to the second PCB 262.

Therefore, the flexible connection member 263 is not only electrically connected to the first and second PCBs 261 and 262, but also preferably made of a flexible and easily bent material. In an embodiment of the present invention, the flexible connection member 263 may be made of a flexible printed circuit (FPC) or a rigid flexible (RF) -PCB.

On the other hand, the liquid crystal display device has a second PCB 262 disposed on the rear surface 254 because the data PCB 260 is dividedly disposed on the first sidewall 252 and the rear surface 254 of the bottom chassis 250. ), A shield case (not shown) is required. The shield case is made of a metallic material to cover the second PCB 262 and is electrically connected to the second PCB 262 to prevent harmful electromagnetic waves or leakage current generated from the second PCB 262 when the LCD is driven. It serves to remove.

Subsequently, a top chassis 400 having a cramped shape having an open top and bottom surfaces is provided on the liquid crystal panel 110. The top chassis 400 presses the periphery of the liquid crystal panel 110 and fixes the liquid crystal panel 110 through coupling with the bottom chassis 250.

In the drawing, the gasket 290 is interposed in a predetermined gap formed between the side wall of the top chassis 400 and the FPCB 260 connected to the PCB 120, but the ground process is performed. 280, and a ground process may be performed by interposing a gasket in a predetermined gap formed between an inner wall surface of the top chassis 400 and an edge of the shield case 280.

As described above, according to the present invention by interposing a sponge gasket coated with a conductive material in the air gap between the inner surface of the top chassis and the exposed conductive layer of the FPCB, and the top chassis through the gasket without any additional process It can be grounded by being electrically connected to the ground of an FPCB that employs a tab mounting structure.

In addition, by interposing a sponge-coated gasket coated with a conductive material in the air gap between the top chassis and the shield case, it is electrically connected to the ground of the FPCB adopting the top chassis and the tab mounting structure through the gasket without any additional process. Can be grounded.

In addition, since the gasket is used to process the ground of the liquid crystal display, a separate screw fastening process or an aluminum tape attaching process may be omitted.                     

Although described above with reference to the embodiments, those skilled in the art can be variously modified and changed within the scope of the invention without departing from the spirit and scope of the invention described in the claims below. I can understand.

Claims (6)

A display panel displaying an image; A first storage container accommodating the display panel; A second accommodating container accommodating the display panel through fastening with the first accommodating container; An FPCB having a conductive path transferring a driving signal and a control signal for displaying the image and a conductive layer exposed on one surface thereof for ground; And And a conductive elastic member interposed between the second storage container and the FPCB. The display device of claim 1, further comprising a PCB connected to one side of the FPCB and the other side of the display panel to provide the driving and control signals to the display panel via the FPCB. And a sidewall of the first storage container and a sidewall of the second storage container. The display device of claim 1, wherein the conductive elastic member is fitted into a gap formed between the sidewall of the second storage container and the conductive layer of the FPCB. 2. The tabulated value of claim 1, wherein the conductive elastic member is a gasket. The method of claim 1, wherein the FPCB, Base film; A first conductive layer formed on one surface of the base film; A first conductive path formed in a first region of the other surface of the base film to transmit the driving signal and the control signal; A second conductive path formed in a second region of the other surface of the base film for ground; A solder resin layer covering the base film, the first conductive path and the second conductive path; And A display formed on the solder resin layer, the display including a hole formed in the solder resin layer, a hole formed in a second conductive path, and a second conductive layer connected to the first conductive layer via a hole formed in the base film. Device. The method of claim 1, An integrated PCB coupled to the FPCB for providing the drive signal and the control signal to the FPCB; And And a PCB cover which is screwed to the first receiving container while covering the integrated PCB.

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